KR102248769B1 - 중첩 레이저 용접 장치 및 방법 - Google Patents

중첩 레이저 용접 장치 및 방법 Download PDF

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Publication number
KR102248769B1
KR102248769B1 KR1020177025371A KR20177025371A KR102248769B1 KR 102248769 B1 KR102248769 B1 KR 102248769B1 KR 1020177025371 A KR1020177025371 A KR 1020177025371A KR 20177025371 A KR20177025371 A KR 20177025371A KR 102248769 B1 KR102248769 B1 KR 102248769B1
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Prior art keywords
laser
metal
metal part
pulse
weld
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Korean (ko)
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KR20170116118A (ko
Inventor
다니엘 앤써니 캐포스타그노
야체크 타데우스 가브즈딜
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에스피아이 레이저스 유케이 리미티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020177025371A 2015-02-09 2016-02-08 중첩 레이저 용접 장치 및 방법 Active KR102248769B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1502149.6A GB201502149D0 (en) 2015-02-09 2015-02-09 Apparatus and method for laser welding
GB1502149.6 2015-02-09
PCT/GB2016/000029 WO2016128705A1 (en) 2015-02-09 2016-02-08 Apparatus and method for overlap laser welding

Publications (2)

Publication Number Publication Date
KR20170116118A KR20170116118A (ko) 2017-10-18
KR102248769B1 true KR102248769B1 (ko) 2021-05-04

Family

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KR1020177025371A Active KR102248769B1 (ko) 2015-02-09 2016-02-08 중첩 레이저 용접 장치 및 방법

Country Status (7)

Country Link
US (1) US10668565B2 (enExample)
EP (1) EP3256284B1 (enExample)
JP (1) JP6993879B2 (enExample)
KR (1) KR102248769B1 (enExample)
CN (2) CN209754269U (enExample)
GB (1) GB201502149D0 (enExample)
WO (1) WO2016128705A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016212057A1 (de) * 2016-07-01 2018-01-04 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Verschweißen von Bauteilen
CN106346135A (zh) * 2016-11-04 2017-01-25 广东国玉科技有限公司 异性材料激光焊接方法
WO2018144524A1 (en) * 2017-01-31 2018-08-09 Nuburu Inc. Methods and systems for welding copper using blue laser
JP6484272B2 (ja) * 2017-03-17 2019-03-13 株式会社フジクラ レーザ加工装置およびレーザ加工方法
US11597038B2 (en) 2017-12-28 2023-03-07 Fujikura Ltd. Welding structure, wiring board with metal piece, and welding method
DE102018102523B4 (de) * 2018-02-05 2019-10-10 Scansonic Mi Gmbh Schweißverfahren und Laserschweißvorrichtung zum Verbinden von folienartigen Werkstücken
US11504801B2 (en) * 2018-08-24 2022-11-22 Phoenix Laser Solutions Bimetallic joining with powdered metal fillers
DE102018215069A1 (de) * 2018-09-05 2020-03-05 Robert Bosch Gmbh Verfahren zum Verbinden einzelner filmförmiger Folien eines Batteriefolienstapels
JP7192363B2 (ja) * 2018-09-28 2022-12-20 マツダ株式会社 レーザ溶接方法及びレーザ溶接装置
JP7110907B2 (ja) * 2018-10-26 2022-08-02 トヨタ自動車株式会社 異種金属部材の重ね溶接方法
JP6989549B2 (ja) * 2019-03-13 2022-01-05 フタバ産業株式会社 接合体の製造方法
US10926347B2 (en) * 2019-03-25 2021-02-23 Packless Industries Autogenous submerged liquid diffusion welding of titanium
DE102019211581A1 (de) * 2019-08-01 2021-02-04 Trumpf Laser Gmbh Verfahren zum Schweißen einer Kupfer-Aluminium-Verbindung
JP7305502B2 (ja) * 2019-09-26 2023-07-10 株式会社ダイヘン レーザ・アークハイブリッド溶接装置
CN111230298B (zh) * 2020-01-21 2023-03-21 中国科学院物理研究所 纳秒激光的应用以及非晶合金材料的焊接方法
JP7269443B2 (ja) * 2020-06-04 2023-05-08 古河電気工業株式会社 溶接方法および溶接装置
DE102020214505A1 (de) 2020-11-18 2022-05-19 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Verbinden von Bauteilen
CN113199147A (zh) * 2021-04-21 2021-08-03 上海工程技术大学 一种用于铝/钢异种金属的激光深熔点焊工艺
CN113290315A (zh) * 2021-05-12 2021-08-24 深圳市艾雷激光科技有限公司 电池电极的焊接方法、设备、控制器及可读存储介质
TWI834045B (zh) * 2021-06-25 2024-03-01 台達電子工業股份有限公司 採用動態光斑的雷射焊接系統及其方法
CN114054957B (zh) * 2021-07-06 2025-03-11 武汉帝尔激光科技股份有限公司 一种异种金属薄膜的激光焊接方法及系统
KR20230058754A (ko) * 2021-10-25 2023-05-03 주식회사 엘지에너지솔루션 나선형 용접부가 형성된 원통형 전지셀 및 이를 포함하는 전지모듈
CN114346429A (zh) * 2021-12-27 2022-04-15 深圳泰德激光技术股份有限公司 薄材激光焊接方法
CN114406469B (zh) * 2022-03-03 2024-09-24 吉林大学 采用镍基高熵合金中间层的钢-铝合金激光焊接方法
CN114985924A (zh) * 2022-05-19 2022-09-02 深圳泰德激光技术股份有限公司 一种薄材件激光焊接方法及构件
CN115476056A (zh) * 2022-10-14 2022-12-16 北京慧骨医学科技有限公司 激光光束的光斑确定方法、装置、电子设备及存储介质
GB202312217D0 (en) * 2023-08-09 2023-09-20 Trumpf Laser Uk Ltd A weld
CN117564468B (zh) * 2023-11-13 2024-07-05 东北电力大学 靶向协同预热的金属材料薄板脉冲激光焊接方法
DE102023004942A1 (de) * 2023-11-30 2025-06-05 Mercedes-Benz Group AG Verfahren zum Laserstrahlschweißen von Bauteilen
CN119897596B (zh) * 2025-04-01 2025-08-05 浙江摩克激光智能装备有限公司 一种异种金属焊接方法、焊接系统及铜基材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006525659A (ja) * 2003-04-29 2006-11-09 エスピーアイ レーザーズ ユーケー リミテッド 材料加工用のレーザ装置
JP2014140890A (ja) * 2012-12-27 2014-08-07 Amada Miyachi Co Ltd 金属箔の重ね接合方法及び接合構造体

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873415A (en) * 1988-02-02 1989-10-10 Raycon Corporation Method for welding galvanized material
US5502292A (en) * 1994-08-04 1996-03-26 Midwest Research Institute Method for laser welding ultra-thin metal foils
US6285002B1 (en) 1999-05-10 2001-09-04 Bryan Kok Ann Ngoi Three dimensional micro machining with a modulated ultra-short laser pulse
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
TW516981B (en) * 2000-12-22 2003-01-11 Koninkl Philips Electronics Nv Method of laser welding
JP2002316282A (ja) * 2001-04-18 2002-10-29 Matsushita Electric Ind Co Ltd レーザ加工方法及び装置
US7385157B2 (en) * 2001-04-27 2008-06-10 Honda Giken Kogyo Kabushiki Kaisha Laser beam welding method and apparatus
FR2830477B1 (fr) * 2001-10-09 2004-02-06 Usinor Procede et dispositif de soudage par recouvrement a l'aide d'un faisceau a haute densite d'energie de deux toles revetues
US20050155956A1 (en) 2002-08-30 2005-07-21 Sumitomo Heavy Industries, Ltd. Laser processing method and processing device
JP2004255435A (ja) * 2003-02-27 2004-09-16 Suzuki Motor Corp レーザ溶接装置及び方法
US6906281B2 (en) * 2003-03-03 2005-06-14 Dana Corporation Method for laser welding of metal
US7154064B2 (en) * 2003-12-08 2006-12-26 General Motors Corporation Method of improving weld quality
EP1547719A3 (en) 2003-12-26 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing crystalline semiconductor film
DE102004005358B4 (de) * 2004-02-03 2007-03-22 Daimlerchrysler Ag Verfahren zur Laserbearbeitung beschichteter Bleche und beschichtetes Blech
CN101434010B (zh) * 2004-08-06 2011-04-13 浜松光子学株式会社 激光加工方法及半导体装置
US20090223940A1 (en) * 2004-08-09 2009-09-10 Nec Corporation Different metallic thin plates welding method, bimetallic thin plates jointing element, electric device, and electric device assembly
US20090283505A1 (en) * 2005-07-13 2009-11-19 Dr Industries Interface suspension for alloy based laser welding
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8106329B2 (en) * 2007-05-18 2012-01-31 Gsi Group Corporation Laser processing of conductive links
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
JP5391077B2 (ja) * 2007-11-19 2014-01-15 ミヤチテクノス株式会社 レーザ光照射装置
EP2394775B1 (en) * 2009-02-09 2019-04-03 Hamamatsu Photonics K.K. Workpiece cutting method
US9701581B2 (en) * 2009-06-04 2017-07-11 Corelase Oy Method and apparatus for processing substrates using a laser
KR101770836B1 (ko) * 2009-08-11 2017-08-23 하마마츠 포토닉스 가부시키가이샤 레이저 가공장치 및 레이저 가공방법
CN102596482B (zh) * 2009-09-24 2015-05-27 Esi-热光电子激光有限公司 使用具有有益的脉冲波形的激光脉冲群在薄膜材料中划线的方法及装置
KR101116638B1 (ko) * 2009-12-15 2012-03-07 주식회사 성우하이텍 강판의 레이저 용접방법
FI123860B (fi) * 2010-05-18 2013-11-29 Corelase Oy Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli
JP5578935B2 (ja) * 2010-05-20 2014-08-27 株式会社アマダミヤチ ファイバレーザ加工装置
CA2802611C (en) * 2010-07-01 2018-08-07 Magna International Inc. Method of laser welding
DE102010039893A1 (de) * 2010-08-27 2012-03-01 Robert Bosch Gmbh Fügekörper und Verfahren zur Herstellung eines Fügekörpers
KR101240980B1 (ko) * 2010-11-18 2013-03-11 기아자동차주식회사 레이저 용접 품질 검사 방법 및 장치
US9688533B2 (en) * 2011-01-31 2017-06-27 The Regents Of The University Of California Using millisecond pulsed laser welding in MEMS packaging
JP2012170989A (ja) * 2011-02-22 2012-09-10 Suzuki Motor Corp レーザ重ね溶接方法
JP5902400B2 (ja) * 2011-04-26 2016-04-13 トヨタ自動車株式会社 レーザ溶接装置、レーザ溶接方法、鋼板積層体の製造方法及び積層体のレーザ溶接による溶接構造
US9821408B2 (en) * 2011-09-16 2017-11-21 Hamamatsu Photonics K.K. Laser machining method and laser machining device
KR101272050B1 (ko) * 2011-11-11 2013-06-07 주식회사 성우하이텍 레이저 용접방법
DE102012008940B4 (de) * 2012-05-08 2022-03-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Fügen von mindestens zwei Werkstücken
JP2014041927A (ja) * 2012-08-22 2014-03-06 Hamamatsu Photonics Kk 加工対象物切断方法
WO2014138939A1 (en) * 2013-03-13 2014-09-18 Queen's University At Kingston Methods and systems for characterizing laser machining properties by measuring keyhole dynamics using interferometry
US9067278B2 (en) * 2013-03-29 2015-06-30 Photon Automation, Inc. Pulse spread laser
US20160016261A1 (en) * 2013-03-29 2016-01-21 Photon Automation, Inc. Laser welding system and method
DE102013104548B3 (de) 2013-05-03 2014-03-20 Scansonic Mi Gmbh Fügevorrichtung und Fügeverfahren zum thermischen Fügen
DE102013015710A1 (de) * 2013-09-20 2014-07-24 Daimler Ag Verfahren zur Herstellung einer flächigen Schweißverbindung und Anordnung mit einer flächigen Schweißverbindung
US9463992B2 (en) * 2013-11-06 2016-10-11 Advalue Photonics, Inc. Laser processing system using broad band pulsed lasers
US9815730B2 (en) * 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9701563B2 (en) * 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
JP5982652B2 (ja) * 2014-04-15 2016-08-31 パナソニックＩｐマネジメント株式会社 異材金属接合体
CN108406112B (zh) 2015-02-09 2021-07-27 通快激光英国有限公司 激光焊缝
WO2016129255A1 (ja) * 2015-02-13 2016-08-18 日本板硝子株式会社 レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法
US9889526B2 (en) * 2015-07-03 2018-02-13 Sungwoo Hitech Co., Ltd. Laser welding method for welding dissimilar metal plates
US10471538B2 (en) * 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
CN107949454B (zh) * 2015-09-15 2020-04-28 松下知识产权经营株式会社 金属构件的焊接构造以及焊接方法
JP6605277B2 (ja) * 2015-09-29 2019-11-13 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006525659A (ja) * 2003-04-29 2006-11-09 エスピーアイ レーザーズ ユーケー リミテッド 材料加工用のレーザ装置
JP2014140890A (ja) * 2012-12-27 2014-08-07 Amada Miyachi Co Ltd 金属箔の重ね接合方法及び接合構造体

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Publication number Publication date
JP6993879B2 (ja) 2022-01-14
WO2016128705A1 (en) 2016-08-18
CN209754269U (zh) 2019-12-10
JP2018505059A (ja) 2018-02-22
GB201502149D0 (en) 2015-03-25
EP3256284C0 (en) 2025-04-02
US10668565B2 (en) 2020-06-02
EP3256284A1 (en) 2017-12-20
US20180029163A1 (en) 2018-02-01
KR20170116118A (ko) 2017-10-18
EP3256284B1 (en) 2025-04-02
CN208342006U (zh) 2019-01-08

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