KR102239998B1 - Compressor for semiconductor test - Google Patents

Abstract

The present invention relates to an indentation apparatus for a semiconductor test. A socket guide part having an insertion hole formed in the center of the indentation apparatus is provided. On one side of the socket guide part, a support frame having a lifting guide hole formed in an upper surface thereof is rotatably installed. Inside the support frame, a lifting block that is raised and lowered is installed. On the bottom of the lifting block, a pressing block is installed to press a semiconductor on the socket guide part. A rotary lever is installed in the lifting guide hole of the support frame to press the lifting block while being rotated, raised, and lowered. On the bottom of the support frame, a guide cover having a separation guide protrusion is installed. When the rotary lever is released, a semiconductor rim attached to the pressing block that is raised and lowered is automatically separated from the pressing block while being held on the separation guide protrusion of the guide cover. The semiconductor is pressed by the pressing block so that the semiconductor makes close contact with the pin set of a tester, and thus the contact state between the semiconductor and the tester is uniform. When the pressing block that presses the semiconductor provided in the socket guide part is separated from the socket guide part, the rim of the semiconductor attached to the bottom surface of the pressing block is held on the separation guide protrusion of the guide cover by static electricity and is automatically separated from the pressing block. The semiconductor stays in the socket guide part, and as the semiconductor is separated from the pin set of the tester, sparks due to the static electricity between the semiconductor and the pin set can be prevented, and thus the circuit of the semiconductor can be prevented from being damaged.

Description

Press-fitting device for semiconductor test {Compressor for semiconductor test}

The present invention relates to a press-fitting device for semiconductor testing, and more particularly, a socket guide portion inserted into an insertion hole with a semiconductor in close contact with a tester, pressing the semiconductor with a pressing block, and testing whether the semiconductor is normal or not, and then pressurizing. A semiconductor test press-in device that automatically separates and detaches the semiconductor attached to the bottom of the press block from the press block by lifting and moving the pressurizing block so that the block is separated from the socket guide part, and the semiconductor edge is caught on the detachment guide protrusion of the guide cover. About.

In general, a semiconductor package is formed by integrating fine electronic circuits at a high density, and a test process is performed to determine whether each electronic circuit is normal during a manufacturing process.

In this case, the test process is a process of selecting good and defective products by testing whether the semiconductor package is operating normally, and a test device that electrically connects the terminal of the semiconductor package to the tester that applies the test signal is used for testing the semiconductor package. .

In particular, the test device has various structures depending on the type of semiconductor package to be tested. The test device and the semiconductor package are not directly connected to each other, but are indirectly connected through a test socket.

Patent Document 1 shows a conventional test socket, and referring to this, a tester in the shape of a plate, a test socket seated on the tester, enters the alignment groove of the test socket on the bottom edge, and prevents the test socket from twisting. It is composed of a guide housing, a pressing part that passes through the opening of the guide housing, is installed on the upper part of the test socket, and presses and presses the semiconductor in the direction of the test socket.

Here, a buffer portion and a pusher are provided at the upper end of the pressing portion, and by pressing and pressing the buffer portion with the pusher, the pressing portion moves downward so that the semiconductor is in close contact with the upper surface of the test socket.

At this time, the lower part of the conductive part of the test socket is in close contact with the electrode of the tester, and the upper part of the conductive part of the test socket is in close contact with the terminal of the device to be tested, and it is determined whether the test socket is defective through the terminal of the device under test.

However, Patent Document 1 as described above is maintained in a state where the test socket is attached to the guide housing due to static electricity generated during the test of the test socket, and the test socket attached to the guide housing is attached to the guide housing that moves up and down. As it is lifted upward in a state, it is inconvenient to separate and detach the test socket from the guide housing.In addition, the conductive part of the test socket that moves up and down while attached to the guide housing is momentarily separated from the electrode of the tester, and therebetween. There is a risk of damage to the circuit of the test socket due to sparks caused by static electricity generated in the test socket, and defects may occur due to damage to the circuit of the test socket.In particular, the defect rate of the product increases and the reliability of the product is increased at the same time due to the damaged test socket. There is a problem of deterioration.

KR 10-2179457 B1

The present invention is to solve the above-described problems, and an object of the present invention is to rotate a support frame having a socket guide portion having an insertion hole formed in the center, and a lifting guide hole formed on the upper surface at one side of the socket guide portion. It is installed as possible, and a lifting block for lifting and lowering is installed inside the support frame, and a pressurizing block is installed to press the semiconductor of the socket guide part on the bottom of the lifting block. A rotating lever to pressurize is installed, and a guide cover formed with a release guide projection is installed on the bottom of the support frame. Pressing the semiconductor in the direction of the tester with the pressurizing block and testing whether the semiconductor is normal or not.When the rotation lever is released, the edge of the semiconductor attached to the pressurizing block that is moved up and down is caught by the detachment inducing protrusion of the guide cover so that it is automatically separated from the pressurizing block. Thus, it is to provide a semiconductor test press-fitting device that prevents the semiconductor from being separated from within the socket guide portion.

In order to achieve the object of the present invention as described above, the press-fitting device for a semiconductor test according to the present invention is in close contact with the upper surface of the tester, and an insertion hole is formed in the center portion of the semiconductor so that the lower end of the semiconductor is exposed in the direction of the tester. A socket guide portion; A support frame having a hollow shape, rotatably installed on one side of the socket guide portion, and having an elevating guide hole formed through the upper surface; A lifting block installed to be movable up and down in the space inside the support frame and operated up and down; Pressurized to press and press the semiconductor inserted into the insertion hole of the socket guide part in the direction of the tester while being connected and installed to the bottom of the lifting block, the lower end of which is exposed to the lower part of the support frame, and pressurized by the lifting block to move up and down. block; A rotation lever that is inserted into the lifting guide hole of the support frame, and pressurizes the lifting block while rotating upward and downward along the lifting guide hole; It is installed in close contact with the bottom of the support frame so as to be positioned on the edge of the pressure block exposed under the support frame, and is formed in at least two symmetrical to each other toward the semiconductor direction on the edge, and attached to the pressure block that moves up and down. It characterized in that it consists of; a guide cover formed with a release inducing protrusion for separating the semiconductor from the pressing block.

In the press-fitting device for semiconductor testing according to the present invention, the socket guide portion is formed in an upper optical narrow structure on the inner circumferential surface of the insertion hole, and further forms an inclined surface portion to guide the semiconductor inserted into the insertion hole to move to the central portion of the insertion hole. It is characterized by one.

In the press-fitting device for semiconductor testing according to the present invention, the socket guide portion forms a locking protrusion protruding from the other side, and the support frame is rotatably installed on one side corresponding to the locking protrusion, and the lower end thereof is It characterized in that the locking tab is further formed to be caught in the locking protrusion.

In the press-fitting apparatus for a semiconductor test according to the present invention, the support frame includes a thread formed on an inner circumferential surface of the lifting guide hole, and the rotation lever comprises: a handle exposed above the lifting guide hole of the support frame; It characterized in that it further formed a lifting member connected to the lower part of the handle and forming the screw thread on the outer circumferential surface thereof, and spirally coupled to the inner circumferential surface of the lifting guide hole to rotate upward and downward along the lifting guide hole. .

In the press-fitting apparatus for semiconductor testing according to the present invention, the lifting block includes: an upper block pressed by the rotation lever; A lower block installed at the lower end of the upper block and configured to press the pressurizing block downward by pressing the upper block; It is installed between the upper block and the lower block, and transmits the pressing pressure of the upper block to the lower block, or pushes the upper and lower blocks in opposite directions facing each other by an elastic force to move the upper and lower blocks to their original positions. It characterized in that it consists of; an elastic spring to let.

In the press-fitting apparatus for a semiconductor test according to the present invention, the pressing block comprises: a lifting plate formed in a plate shape so as to correspond to the lifting block, and fixedly installed on a bottom surface of the lifting block; A press-fit protrusion formed to be exposed from the bottom of the elevator plate to the lower portion of the support frame and the guide cover, and inserted into the insertion hole of the socket guide portion to press and press the semiconductor; It characterized in that it consists of.

In the press-fitting device for semiconductor testing according to the present invention, the release inducing protrusion of the guide cover is positioned relatively higher than the lower end of the press-in protrusion moved downward by pressing and pressing by the lifting block, and It is positioned relatively lower than the height of the lower end of the press-in protrusion moved upward when the press-in protrusion is released, and allows the edge of the semiconductor attached to the press-in protrusion to be caught when the press-in protrusion moves upward and downward, so that the semiconductor is removed from the press-in protrusion. It is characterized by separation and separation.

According to the present invention, by pressing and pressing the semiconductor with a pressing block so that the semiconductor is in close contact with the tweezers of the tester, the contact state between the semiconductor and the tester period is uniform, and the state of the semiconductor that maintains the state in contact with the tester is checked through the tester. It is possible to easily determine whether the semiconductor is normal or not, and when the pressing block for pressing and pressing the semiconductor provided in the socket guide part is separated from the socket guide part, the edge of the semiconductor attached to the bottom of the pressing block by static electricity induces the separation of the guide cover. It is caught on the protrusion and is automatically forcibly separated from the pressure block, and the semiconductor stays in the socket guide as the semiconductor is forcibly removed from the pressure block, and the semiconductor is separated from the tweezers of the tester, preventing the occurrence of sparks due to static electricity. Due to this spark occurrence, there is no fear of damaging the circuit of the semiconductor, and thus, there is an advantage in that the product reliability is improved while the product defect rate is reduced.

1 is a perspective view showing a semiconductor test press-fitting device according to the present invention.
2 is an exploded perspective view of a press-fitting device for semiconductor testing according to the present invention.
Figure 3 is a bottom perspective view of Figure 2;
Figure 4 is an exploded perspective view of the lifting block of the semiconductor test press-fit device according to the present invention.
5 is a perspective view showing a state in which the socket guide portion is opened by rotating the support frame of the semiconductor test press-fitting device according to the present invention.
6 is a side cross-sectional view of a press-fitting device for semiconductor testing according to the present invention.
7 is a use state diagram showing that the semiconductor is caught and released from the release inducing protrusion of the semiconductor test press-fitting device according to the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 to 7, the socket guide part 100 is in close contact with the upper surface of the tester 10, and an insertion hole allowing insertion of the lower end of the semiconductor 11 in the center thereof to be exposed in the direction of the tester 10 Form 101.

The socket guide part 100 is installed in close contact with a predetermined upper surface of the tester 10 so that the semiconductor 11 inserted into the insertion hole 101 is in close contact with the tweezers 10a of the tester 10. .

The socket guide part 100 guides the support frame 200 to be rotated in an upwardly inclined direction in a state in close contact with the upper surface of the tester 10.

The socket guide part 100 is hinge-coupled with the support frame 200 to support rotation of the support frame 200.

The socket guide part 100 is formed in an upper and lower narrow structure on the inner circumferential surface of the insertion hole 101 and guides the semiconductor 11 inserted into the insertion hole 101 to move to the center of the insertion hole 101 A portion 101a is further formed.

The inclined surface portion 101a guides the edge of the semiconductor 11 to slide down, and guides the semiconductor 11 to move to the center portion of the insertion hole 101.

The socket guide part 100 forms a locking protrusion 100a protruding from the other side.

The locking protrusion 100a allows the lock 200a of the support frame 200 to be engaged, so that the support frame 200 maintains a state in close contact with the locking protrusion 100a.

The support frame 200 has a hollow shape, is rotatably installed on one side of the socket guide unit 100, and forms an elevating guide hole 201 formed through the upper surface.

The support frame 200 is rotated in an upwardly inclined direction with respect to the socket guide part 100 so that the insertion hole 101 of the socket guide part 100 is opened.

The support frame 200 couples an elevating block 300, a pressing block 400, and a rotation lever 500 therein.

The support frame 200 is rotated in a downwardly inclined direction with respect to the socket guide part 100, so that the pressure block 400 is positioned directly above the insertion hole 101 of the socket guide part 100. do.

The support frame 200 supports the lifting and lowering of the lifting block 300 and the pressing block 400 by the rotation lever 500.

The support frame 200 is rotatably installed on one side corresponding to the locking protrusion 100a, and a lower end of the support frame 200 further forms a lock 200a that is engaged with the locking protrusion 100a.

The locking clasp 200a has its lower end rotated in the direction of the locking protrusion 100a, is caught by the locking protrusion 100a, or is rotated in a direction opposite to the locking protrusion 100a, so that the locking protrusion 100a ).

The clamp 200a allows the support frame 200 to remain in close contact with the upper portion of the socket guide part 100.

The support frame 200 forms a thread on the inner circumferential surface of the lifting guide hole 201.

The elevating guide hole 201 allows the elevating member 502 of the rotating lever 500 to be fastened in a helical manner, and guides the elevating member 502 to rotate upward and downward.

The lifting block 300 is installed so as to be movable up and down in the space inside the support frame 200 and is operated up and down.

The lifting block 300 is pressed by the rotation lever 500 to move downward, and presses the pressing block 400 downward.

It is preferable that the lifting block 300 is formed in a plate shape so as to be operated up and down.

The lifting block 300 is installed at a lower end of the upper block 301 and the upper block 301 pressed by the rotation lever 500, and pressed by the upper block 301 to pressurize the pressure block 400. It is installed between the lower block 302 for pressing downward and between the upper block 301 and the lower block 302, and transmits the pressing pressure of the upper block 301 to the lower block 302 or to the elastic force. By pushing the upper and lower blocks (301, 302) in opposite directions facing each other, the upper and lower blocks (301, 302) are composed of an elastic spring 303 to return to the original position.

The upper block 301 and the lower block 302 form fixing grooves 301a and 302a in which the upper and lower ends of the elastic spring 303 are inserted and fixed on the upper and lower surfaces facing each other.

The upper surface of the upper block 301 is in close contact with the lower surface of the pressing protrusion 402 of the pressing block 400.

The upper block 301 moves downward by being pressed by the press-in protrusion 402 that rotates along the elevating guide hole 201 of the support frame 200 and moves downward, or when the pressing force of the press-in protrusion 402 is released, the elasticity It is pressed by the spring 303 and returns to its original position upward.

The lower block 302 is preferably fastened and fixed to the bottom surface of the lifting plate 401 of the pressing block 400 with a fastening member (not shown).

The area of the lower block 302 is proportional to the area of the upper block 301.

The lower block 302 is pressed downward by the pressing force of the elastic spring 303 and presses the elevator plate 401 of the pressing block 400 downward.

The elastic spring 303 keeps the upper and lower blocks 301 and 302 spaced apart at a predetermined interval.

The pressure block 400 is connected to the bottom of the lifting block 300 so that its lower end is exposed to the lower part of the support frame 200, and the socket guide part is pressurized by the lifting block 300 to move up and down. The semiconductor 11 inserted into the insertion hole 101 of the 100 is pressed and pressed in the direction of the tester 10.

The pressing block 400 presses and presses the semiconductor 11 in the insertion hole 101 in the direction of the tester 10, so that the semiconductor 11 comes into close contact with the tweezers 10a of the tester 10. .

The pressing block 400 is pressed downward by the lifting block 300 to press and press the semiconductor 11.

The pressure block 400 is formed in a plate shape to correspond to the lifting block 300, the lifting plate 401 fixedly installed on the bottom of the lifting block 300, and the support from the bottom of the lifting plate 401 The frame 200 and the guide cover 600 is formed to be exposed to the lower portion, and is inserted into the insertion hole 101 of the socket guide portion 100, composed of a press-in protrusion 402 for pressing and pressing the semiconductor 11 do.

The lifting plate 401 is formed to be proportional to the area of the lower block 302 of the lifting block 300 and is pressed downward by the lower block 302.

The lifting plate 401 inserts the press-fit protrusion 402 into the insertion hole 101 of the socket guide part 100 while lifting up and down.

The press-fit protrusion 402 is formed to have a size proportional to the area of the semiconductor 11 entering the insertion hole 101, and it is preferable to press and press the semiconductor 11.

The press-in protrusion 402 presses and presses the entire upper surface of the semiconductor 11 so that the semiconductor 11 is uniformly adhered to the tweezers 10a of the tester 10.

The press-in protrusion 402 is pressed against the lifting plate 401 and exposed downward of the release inducing protrusion 601 of the guide cover 600, or when the lifting plate 401 is released, the guide cover 600 It enters the departure induction protrusion 601 upward.

The press-in protrusion 402 is preferably operated up and down between the release induction protrusions 601 so as to prevent interference with the release induction protrusion 601.

The rotation lever 500 is inserted into and coupled to the lifting guide hole 201 of the support frame 200, and pressurizes the lifting block 300 while rotating upward and downward along the lifting guide hole 201.

The rotation lever 500 has an upper end exposed to the upper part of the lifting guide hole 201, and a lower end thereof is coupled to be able to move up and down in the lifting guide hole 201.

The rotation lever 500 is connected to the handle 501 exposed to the upper part of the lifting guide hole 201 of the support frame 200 and the lower end of the handle 501, and forms the screw thread on the outer circumferential surface thereof, The elevating guide hole 201 is spirally coupled to the inner circumferential surface of the elevating guide hole 201 to further form an elevating member 502 that rotates up and down along the elevating guide hole 201.

The handle 501 is gripped by a user and rotated.

The handle 501 is rotated at a predetermined angle in a predetermined direction based on the center of the lifting guide hole 201.

The elevating member 502 is fastened to the elevating guide hole 201 in a spiral manner, and while rotating and elevating along the elevating guide hole 201, the upper block 301 of the elevating block 300 is pressed and pressed, or Alternatively, the pressurization of the upper block 301 is released.

The elevating member 502 is rotated up and down along the elevating guide hole 201 to correspond to the rotation angle of the handle 501.

The guide cover 600 is installed in close contact with the bottom of the support frame 200 so as to be positioned on the edge of the pressing block 400 exposed below the support frame 200, At least two are formed symmetrically to form a separation inducing protrusion 601 for separating the semiconductor 11 attached to the pressing block 400 to move up and down from the pressing block 400.

The guide cover 600 is formed in a "ㅁ" shape through which the central part is penetrated, and is preferably installed in close contact with the bottom of the support frame 200 so as to correspond to the edge of the press-in protrusion 402 of the pressure block 400. .

The guide cover 600 is fastened and fixed to the bottom of the support frame 200 by a fastening member (not shown).

The release induction protrusion 601 is formed protruding from both ends of the guide cover 600 in a direction orthogonal to the fastener 200a and from the side of the guide cover 600 opposite to the fastener 200a, It is preferable that the edge of the semiconductor 11 is caught.

The release inducing protrusion 601 is attached to the bottom surface of the press-in protrusion 402 of the pressing block 400 and is hooked to the edge of the semiconductor 11 that is moved up and down, so that the semiconductor 11 is the press-in protrusion. It should be separated from 402.

The separation inducing protrusion 601 separates and separates the semiconductor 11 so that the semiconductor 11 is located in the insertion hole 101 of the socket guide part 100.

The release inducing protrusion 601 of the guide cover 600 is positioned relatively higher than the lower end of the press-in protrusion 402 moved downward by pressing and pressing by the lifting block 300, and the lifting block 300 ) Is positioned relatively lower than the height of the lower end of the press-in protrusion 402 moved upward when the press-in protrusion 402 is released, and the semiconductor 11 attached to the press-in protrusion 402 when the press-in protrusion 402 moves upward and downward. By allowing the edge to be caught, the semiconductor 11 is separated and separated from the indentation protrusion 402.

The press-fitting apparatus for semiconductor testing according to the present invention configured as described above is used as follows.

First, the socket guide part 100 is mounted on the tester 10 so that the insertion hole 101 of the socket guide part 100 is positioned at a predetermined position of the tester 10. Adjust.

And, by entering the semiconductor (for example, DRAM) 11 into the insertion hole 101 of the socket guide portion 100, the edge of the semiconductor 11 slides on the inclined surface of the insertion hole 101, the As it moves to the center of the insertion hole 101, it is inserted into the insertion hole 101.

Then, the semiconductor 11 is positioned below the center portion of the insertion hole 101, and at this time, the semiconductor 11 is positioned to correspond to the tweezers 10a of the tester 10.

Thereafter, by rotating the support frame 200 rotatably installed on one side of the socket guide part 100 in a downwardly inclined direction, press-fitting of the pressure block 400 exposed to the lower portion of the support frame 200 The protrusion 402 is positioned above the insertion hole 101 of the socket guide part 100.

At this time, when the pressing protrusion 402 of the pressing block 400 is positioned directly above the insertion hole 101 of the socket guide part 100, the supporting frame ( The lower end of the lock 200a of 200) is rotated in the direction of the locking protrusion 100a of the socket guide part 100, so that the lower end of the lock 200a is locked to the locking protrusion 100a.

Then, while the lock 200a is locked to the locking protrusion 100a, the support frame 200 is kept in close contact with the upper surface of the socket guide 100, and at this time, the pressing block 400 The indentation protrusion 402 of is maintained at a predetermined distance from the upper surface of the semiconductor 11.

Here, it is preferable that the distance between the pressing protrusion 402 of the pressing block 400 and the upper surface of the semiconductor 11 is 1 mm.

Subsequently, when the handle 501 of the rotation lever 500 is gripped, and the handle 501 is rotated in a forward direction (eg, clockwise), an elevating member 502 extending from the lower end of the handle 501 ) Pushes and presses the lifting block 300 while rotating downward along the lifting guide hole 201 of the support frame 200, and accordingly, the lifting block 300 by the lifting member 502 It is pressed and moved downwards.

At this time, the upper block 301 of the elevating block 300 is pressed by the elevating block 300 in a state in close contact with the bottom of the elevating member 502 to press and press the elastic spring 303, accordingly, As the elastic spring 303 is compressed, the lower block 302 is pressed downward.

And, while the lifting plate 401 of the pressing block 400 connected to the lower block 302 is pressed downward by the lower block 302, the press-in protrusion 402 is moved downward, and at this time, , The press-in protrusion 402 is close to the upper surface of the semiconductor 11 inserted into the insertion hole 101 of the socket guide part 100, and presses the semiconductor 11 downwardly to the tester 10. will be.

Then, the semiconductor 11 provided in the socket guide part 100 is connected to the tester 10 while contacting the tweezers 10a of the tester 10, and at this time, a signal is transmitted through the tester 10. While inputting or receiving input, it is determined whether or not the semiconductor 11 is normal.

Thereafter, when the tester 10 completes the determination of normality, the handle 501 of the rotation lever 500 is gripped, but the handle 501 is rotated in a reverse direction (eg, counterclockwise) opposite to the above. So that the elevating member 502 rotates upwardly along the elevating guide hole 201.

At this time, as the elevating member 502 moves upward, the pressing force applied to the upper block 301 of the elevating block 300 is released, and at the same time, the elastic spring 303 is restored to its original state. By pressing the block 301 upward, the upper block is returned to its original position.

In addition, as the pressing force of the elastic spring 303 is released, the pressing force applied to the lower block 302 is simultaneously released, so that the lifting plate 401 of the pressing block 400 is removed from the lower block 302 It is integrally moved upward and downward to move the press-fit protrusion 402 formed on the bottom surface of the lifting plate 401 upward and downward.

Here, the upper block 301 and the lower block 302 maintain a state spaced apart from each other by a predetermined distance by the elastic spring 303.

At this time, the semiconductor 11 is kept attached to the bottom surface of the press-in protrusion 402 by static electricity, but is moved upward by the press-in protrusion 402 at the same time, and the rim is separated from the guide cover 600 It is caught by the guide protrusion 601 and is restricted from moving upward.

And, the moment the press-in protrusion 402 is moved upward and enters the release-inducing protrusion 601, the semiconductor 11 caught by the release-inducing protrusion 601 is forcibly separated from the press-in protrusion 402 Thus, it is to stay in the insertion groove 101 of the socket guide portion 100.

Thereafter, by rotating the lower end of the lock 200a of the support frame 200 in a direction opposite to the stopping protrusion 100a of the socket guide part 100, the lock 200a from the stopping protrusion 100a In this state, the support frame 200 is rotated in an upwardly inclined direction with respect to the socket guide part 100 to open the insertion hole 101 of the socket guide part 100.

Then, the semiconductor 11 is maintained in a state inserted into the insertion hole 101 of the socket guide part 100, and at this time, the semiconductor 11 is separated from the insertion hole 101, so that the semiconductor 11 ) Is to be recovered.

Then, insert the semiconductor 11 into the insertion hole 101 of the socket guide portion 100 in the same manner as described above, and in that state, the insertion hole of the socket guide portion 100 into the support frame 200 By closing 101, it is to test whether the semiconductor 11 is normal or not.

While pressing and pressing the semiconductor 11 inserted into the insertion hole 101 of the socket guide part 100 as described above with the pressing block 400 exposed to the bottom of the support frame 200, the semiconductor 11 ) Is normal or not, but when the pressure block 400 is returned to its original position after testing the semiconductor 11, the edge of the semiconductor 11 attached to the pressure block 400 is the guide cover 600's detachment inducing protrusion. The structure to be caught by 601 and automatically detached is to press and press the semiconductor 11 with the pressing block 400 so that the semiconductor 11 is in close contact with the tweezers 10a of the tester 10, and the semiconductor 11 It is possible to easily determine whether the semiconductor 11 is normal or not by checking the state of the semiconductor 11 that maintains the uniform contact state and the state of contact between the tester 10 and the tester 10 through the tester 10. When the pressing block 400 for pressing and pressing the semiconductor 11 provided in the guide unit 100 is separated from the socket guide unit 100, the edge of the semiconductor 11 attached to the bottom surface of the pressing block 400 by static electricity The guide cover 600 is caught by the detachment inducing protrusion 601 and is automatically forcibly separated from the pressurizing block 400, and the semiconductor 11 is forcibly separated from the pressurizing block 400, and the socket guide unit 100 is inserted. It stays in the hole 101.

The press-fitting apparatus for semiconductor testing according to the present invention described above is not limited to the above-described embodiment, and those of ordinary skill in the field to which the present invention pertains without departing from the gist of the present invention claimed in the following claims. It has its technical spirit to the extent that anyone can change it in various ways.

10: tester 11: semiconductor
100: socket guide part 100a: stopping protrusion part
101: insertion hole 101a: inclined surface portion
200: support frame 200a: stop tab
201: elevating guide hole 300: elevating block
301: upper block 301a, 302a: fixing groove
302: lower block 303: elastic spring
400: pressure block 401: lifting plate
402: press-fit projection 500: rotary lever
501: handle 502: elevating member
600: guide cover 601: departure guide protrusion

Claims (7)

A socket guide part 100 which is in close contact with the upper surface of the tester 10 and has an insertion hole 101 in the central portion thereof to allow insertion of the semiconductor 11 to be exposed in the direction of the tester 10;
A support frame 200 having a hollow shape, rotatably installed on one side of the socket guide part 100, and having an elevating guide hole 201 formed through the upper surface thereof;
An elevating block 300 that is installed to be elevating and movable in the inner space of the support frame 200 to elevate and descend upwards and downwards;
It is installed connected to the bottom of the lifting block 300 so that its lower end is exposed to the lower part of the support frame 200, and is pressurized by the lifting block 300 to move up and down while an insertion hole of the socket guide part 100 A pressing block 400 for pressing and pressing the semiconductor 11 inserted into the 101 in the direction of the tester 10;
A rotation lever 500 that is inserted into and coupled to the lifting guide hole 201 of the support frame 200 and presses and presses the lifting block 300 while rotating upward and downward along the lifting guide hole 201;
At least two or more are installed in close contact with the bottom of the support frame 200 so as to be positioned on the edge of the pressure block 400 exposed below the support frame 200, and symmetrically to each other toward the semiconductor 11 direction at the edge of the support frame 200 A guide cover 600 formed with a release inducing protrusion 601 for separating the semiconductor 11 attached to the pressing block 400 to move up and down from the pressing block 400;
A semiconductor test press-fitting device, characterized in that consisting of. The method of claim 1,
The socket guide part 100,
The insertion hole 101 is formed in an upper and lower narrow structure on the inner circumferential surface of the insertion hole 101, further forming an inclined surface portion 101a for guiding the semiconductor 11 inserted into the insertion hole 101 to move to the central portion of the insertion hole 101. A press-fitting device for semiconductor testing, characterized in that. The method of claim 1,
The socket guide part 100,
To form a protruding protrusion portion (100a) on the other side,
The support frame 200,
A press-fitting device for semiconductor testing, characterized in that it is rotatably installed on one side corresponding to the locking projection (100a), the lower end of which is further formed with a locking pawl (200a) engaging the locking projection (100a). The method of claim 1,
The support frame 200,
Forming a thread on the inner circumferential surface of the lifting guide hole 201,
The rotation lever 500,
A handle 501 exposed above the lifting guide hole 201 of the support frame 200;
An elevating member connected to the lower end of the handle 501 and forming the screw thread on its outer circumferential surface, and is helically coupled to the inner circumferential surface of the elevating guide hole 201 to rotate up and down along the elevating guide hole 201 (502);
Semiconductor test press-fitting device, characterized in that further formed. The method of claim 1,
The lifting block 300,
An upper block 301 pressed by the rotation lever 500;
A lower block 302 installed at a lower end of the upper block 301 and pressed by the upper block 301 to press the pressurizing block 400 downward;
It is installed between the upper block 301 and the lower block 302 and transmits the pressing pressure of the upper block 301 to the lower block 302 or the upper and lower blocks 301 and 302 by elastic force An elastic spring 303 for pushing the upper and lower blocks 301 and 302 in opposite directions facing each other;
A semiconductor test press-fitting device, characterized in that consisting of. The method of claim 1,
The pressure block 400,
A lifting plate 401 formed in a plate shape to correspond to the lifting block 300 and fixedly installed on the bottom of the lifting block 300;
It is formed so as to be exposed from the bottom of the elevator plate 401 to the bottom of the support frame 200 and the guide cover 600, and is inserted into the insertion hole 101 of the socket guide part 100 to insert the semiconductor 11 A press-fit protrusion 402 for pressing and pressing;
A semiconductor test press-fitting device, characterized in that consisting of. The method of claim 6,
The guide cover 600 has a release inducing protrusion 601,
The press-in protrusion 402 is positioned higher than the lower end of the press-in protrusion 402 that is pressed and pressed by the lifting block 300 and moved downward, and is moved upward when the lifting block 300 is depressed. ) Is located relatively lower than the height of the lower end, and allows the edge of the semiconductor 11 attached to the press-in protrusion 402 to be caught when the press-in protrusion 402 is moved up and down, and in the press-in protrusion 402 A semiconductor test press-fitting device, characterized in that the semiconductor (11) is separated and separated.

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