KR102238617B1 - 전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판 - Google Patents

전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판 Download PDF

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Publication number
KR102238617B1
KR102238617B1 KR1020200090876A KR20200090876A KR102238617B1 KR 102238617 B1 KR102238617 B1 KR 102238617B1 KR 1020200090876 A KR1020200090876 A KR 1020200090876A KR 20200090876 A KR20200090876 A KR 20200090876A KR 102238617 B1 KR102238617 B1 KR 102238617B1
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KR
South Korea
Prior art keywords
electromagnetic wave
wave shielding
layer
conductive adhesive
adhesive layer
Prior art date
Application number
KR1020200090876A
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English (en)
Korean (ko)
Other versions
KR20210015660A (ko
Inventor
다이스케 키시
쇼타 모리
Original Assignee
토요잉크Sc홀딩스주식회사
토요켐주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 토요잉크Sc홀딩스주식회사, 토요켐주식회사 filed Critical 토요잉크Sc홀딩스주식회사
Publication of KR20210015660A publication Critical patent/KR20210015660A/ko
Application granted granted Critical
Publication of KR102238617B1 publication Critical patent/KR102238617B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
KR1020200090876A 2019-08-01 2020-07-22 전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판 KR102238617B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-142447 2019-08-01
JP2019142447A JP6645610B1 (ja) 2019-08-01 2019-08-01 電磁波シールドシート、および電磁波シールド性配線回路基板

Publications (2)

Publication Number Publication Date
KR20210015660A KR20210015660A (ko) 2021-02-10
KR102238617B1 true KR102238617B1 (ko) 2021-04-09

Family

ID=69568012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200090876A KR102238617B1 (ko) 2019-08-01 2020-07-22 전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판

Country Status (4)

Country Link
JP (1) JP6645610B1 (zh)
KR (1) KR102238617B1 (zh)
CN (1) CN111818723B (zh)
TW (1) TWI734574B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202313327A (zh) * 2021-09-29 2023-04-01 日商拓自達電線股份有限公司 電磁波屏蔽膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007332418A (ja) * 2006-06-15 2007-12-27 Fukuda Metal Foil & Powder Co Ltd 表面処理銅箔
JP2016009269A (ja) * 2014-06-23 2016-01-18 大日本印刷株式会社 積層材、タッチパネルセンサ、電磁波遮蔽材、及び、画像表示装置
WO2018147298A1 (ja) * 2017-02-08 2018-08-16 タツタ電線株式会社 電磁波シールドフィルム、シールドプリント配線板及び電子機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101288884B1 (ko) 2011-12-29 2013-08-07 (주)덕산코트랜 히트펌프식 냉ㆍ온수 공급장치
WO2013108849A1 (ja) 2012-01-17 2013-07-25 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
JP5861790B1 (ja) * 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
JP6202177B1 (ja) * 2016-01-21 2017-09-27 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2017147276A (ja) * 2016-02-15 2017-08-24 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
CN110235538B (zh) * 2017-02-08 2020-12-22 拓自达电线株式会社 电磁波屏蔽膜、屏蔽印制线路板及电子设备
CN207219296U (zh) * 2017-10-16 2018-04-10 昆山市旺祥泰电子科技有限公司 一种电磁屏蔽复合材料
JP6970025B2 (ja) * 2018-01-10 2021-11-24 タツタ電線株式会社 電磁波シールドフィルム
CN109413980A (zh) * 2018-11-15 2019-03-01 深圳市西陆光电技术有限公司 一种不含化学电镀工艺及不含导电颗粒的超高频电磁波屏蔽膜及含该膜的线路板的制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007332418A (ja) * 2006-06-15 2007-12-27 Fukuda Metal Foil & Powder Co Ltd 表面処理銅箔
JP2016009269A (ja) * 2014-06-23 2016-01-18 大日本印刷株式会社 積層材、タッチパネルセンサ、電磁波遮蔽材、及び、画像表示装置
WO2018147298A1 (ja) * 2017-02-08 2018-08-16 タツタ電線株式会社 電磁波シールドフィルム、シールドプリント配線板及び電子機器

Also Published As

Publication number Publication date
KR20210015660A (ko) 2021-02-10
JP6645610B1 (ja) 2020-02-14
TW202110318A (zh) 2021-03-01
JP2021027101A (ja) 2021-02-22
TWI734574B (zh) 2021-07-21
CN111818723B (zh) 2021-05-04
CN111818723A (zh) 2020-10-23

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