KR102214326B1 - Apparatus and method for aligning package - Google Patents

Abstract

An embodiment of the present invention relates to a package alignment device for aligning a plurality of packages disposed in one direction. The package alignment device comprises: a body; a support plate disposed on the body; an alignment assembly disposed to be spaced apart from the support plate so that a plurality of packages are disposed in one direction; and a driving unit moving the alignment assembly toward the package. Accordingly, pins of the alignment assembly can be coupled to grooves formed in the package to space the packages apart from each other by a predetermined distance (D).

Description

Package alignment device and package alignment method {APPARATUS AND METHOD FOR ALIGNING PACKAGE}

The embodiment relates to a package alignment apparatus and a package alignment method for aligning at least two packages. In detail, the present invention relates to a package alignment device and a package alignment method for arranging a plurality of power packages disposed along one direction to be spaced apart from each other at predetermined intervals.

The power module used for supplying power to various electronic/electric devices can be used after being combined with a printed circuit board (PCB), etc., and then sealed in a power module case and packaged. Accordingly, the power module to which the case is combined may be referred to as a power package.

The conventional power package manufacturing apparatus has a high degree of dependence on manual labor due to infrequent work. However, according to the trend of mass production in which the production amount of the package is increased, more automated equipment is required.

However, since the conventional power package manufacturing apparatus was mainly manufactured with a dedicated work concept for each package according to a work unit, there is no apparatus for accommodating and manufacturing a plurality of packages. Accordingly, by relying on manual work for each work unit, productivity is not only lowered, but also a large number of manpower is required, which leads to inequality.

For example, in the related art, since the process of applying an insulator for each package is individually performed, there is a problem of lowering productivity. In addition, since the coating process is performed by hand, there is a problem that productivity decreases further and defectivity increases.

Accordingly, in order to automate the coating process and mass-produce packages, there is a demand for a semiconductor packaging dispenser that applies an insulator to a plurality of packages and inspects for defects.

The embodiment provides a package alignment device and a package alignment method capable of improving productivity by automating the process of aligning and fixing a plurality of packages.

In addition, a package alignment device and a package alignment method are provided for aligning and fixing a plurality of packages to be spaced apart from each other at predetermined intervals for individual application of an insulator per package during a coating process for a plurality of packages.

In addition, since each of the plurality of packages may have different thicknesses, a package alignment device and a package alignment method for aligning and fixing packages in consideration of the thicknesses are provided.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems that are not mentioned herein will be clearly understood by those skilled in the art from the following description.

The object is a package alignment apparatus for aligning a plurality of packages arranged in one direction, comprising: a body; A support plate disposed on the body; An alignment assembly spaced apart from the support plate so that a plurality of the packages are disposed in one direction; And a driving unit for moving the alignment assembly toward the package, wherein the pins of the alignment assembly are achieved by a package alignment device that couples to a groove formed in the package to separate the packages from each other at a predetermined distance D. .

Here, the alignment assembly includes a base moved by the driving unit; A pin portion including the pin; And a support portion disposed between the base and the pin portion so that the pin portion interlocks with the movement of the base, wherein the pin portion includes a plate-shaped alignment plate and the pin protruding from the alignment plate toward the support plate, the The pin may include an inclined surface formed to have a predetermined inclination angle θ with respect to the alignment plate.

And, the pin may be disposed detachably to the alignment plate.

In addition, the package includes two grooves formed to be spaced apart in a longitudinal direction, and a groove formed on one side of one of the plurality of packages may be disposed to face the groove of another package disposed adjacent to each other. Here, the number of alignment plates may be the same as the number of packages.

In addition, the support portion may include an elastic member for elastically supporting the pin portion.

In addition, the support portion may further include two guides, and the elastic member may be disposed between the guides.

In addition, the thickness of any one of the plurality of packages may be different from the thickness of the other.

Meanwhile, the package may be a power package.

In the package alignment apparatus and package alignment method according to the embodiment, a plurality of packages may be aligned to be spaced apart from each other at predetermined intervals using tapered pins.

In this case, two pins are disposed on the alignment plate on which the pins are disposed, and the pins may be inserted into a groove formed in the package. Accordingly, the package can be fixed.

In addition, since the package alignment device and the package alignment method use an elastic member that elastically supports one side of the package, even if a plurality of packages having different thicknesses are inserted, each of the packages may be aligned and fixed to have the gap. .

In addition, productivity can be improved by automating the process of aligning and fixing a plurality of packages.

The various and beneficial advantages and effects of the embodiments are not limited to the above description, and may be more easily understood in the course of describing specific embodiments of the embodiments.

1 and 2 are views showing a semiconductor package dispenser according to an embodiment,
3 is a diagram illustrating a power package manufactured by a semiconductor package dispenser according to an embodiment,
4 is a perspective view showing a package alignment device according to an embodiment,
5 is a plan view showing a package alignment device according to an embodiment,
6 is a perspective view showing a pin portion of the package alignment device according to the embodiment
7 is a plan view showing a pin portion of the package alignment device according to the embodiment,
8 is a diagram illustrating a plurality of packages arranged in an alignment zone of a package alignment apparatus according to an embodiment;
9 is a view showing a plurality of packages arranged to have a predetermined interval by the package alignment apparatus according to the embodiment,
10 is a diagram illustrating a package alignment apparatus according to an embodiment of aligning a plurality of packages having different thicknesses,
11 is a view showing a bracket disposed in the package alignment device according to the embodiment,
12 is a block diagram illustrating a package alignment method according to an embodiment.

The present invention is intended to illustrate and describe specific embodiments in the drawings, as various changes may be made and various embodiments may be provided. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as first and second, may be used to describe various elements, but the elements are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a second component may be referred to as a first component, and similarly, a first component may be referred to as a second component. The term and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being "connected" or "connected" to another component, it is understood that it may be directly connected or connected to the other component, but other components may exist in the middle. Should be. On the other hand, when a component is referred to as being "directly connected" or "directly connected" to another component, it should be understood that there is no other component in the middle.

In the description of the embodiment, in the case where one component is described as being formed in "on or under" of another component, the top (top) or bottom (bottom) (on or under) includes both of the two components being in direct contact with each other or one or more other components being indirectly formed between the two components. In addition, when expressed as'on or under', it may include not only an upward direction but also a downward direction based on one component.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, but the same reference numerals are assigned to the same or corresponding components regardless of the reference numerals, and redundant descriptions thereof will be omitted.

The semiconductor package dispensing system according to an embodiment of the present invention may perform an operation of applying an insulator to a plurality of power packages.

When performing a coating process on a plurality of semiconductor packages, the semiconductor package dispensing system can improve productivity of the semiconductor package by automating a process and a transfer process for each unit operation. Here, the process for each unit operation may include an alignment process, an application process, a curing process, and an inspection process. In addition, the semiconductor package may be a power package.

1 and 2 are diagrams illustrating a semiconductor package dispensing system according to an embodiment.

1 and 2, the semiconductor package dispensing system 1 includes a package alignment device 2 according to an embodiment of aligning and fixing a plurality of packages, and a plurality of packages in the package alignment device 2 A loader (3) that transfers the loader (3), a dispenser (4) that applies an insulator to each of a plurality of aligned packages, a first inspector (5) that inspects the insulator applied to the package, and a cure that cures the insulator applied to the package ( 6), a second inspector 7 for inspecting the cured insulator, and an unloader 8 for classifying and discharging the package according to whether or not the package is defective by using the second inspector 7. have. In addition, the semiconductor package dispensing system 1 includes a shuttle for moving the package alignment device 2 to inspect the coated and applied insulator and a shuttle for transferring the cured insulator to the second inspector 7. I can.

In addition, the semiconductor package dispensing system 1 may include a control unit (not shown) for controlling each component and a power unit (not shown) for supplying power to each component.

At this time, the alignment device 2, the dispenser 4, the first inspector 5, and the second inspector 7 are movably disposed in the semiconductor package dispensing system 1, thereby implementing automation. . In addition, since the alignment device 2, the dispenser 4, and the cure 6 may be disposed in pairs in the semiconductor package dispensing system 1, productivity of the semiconductor package can be improved.

3 is a diagram illustrating a power package manufactured by a semiconductor package dispenser according to an embodiment. In detail, the power package of FIG. 3 may represent before the insulator is applied. In addition, in FIGS. 1 to 3, based on the shape and movement of the package 10 formed in a hexahedral shape, the length direction is the X direction, the thickness direction is the Y direction, and the vertical direction is perpendicular to the X and Y directions. The width direction can be defined as the Z direction.

Here, in consideration of the movement in the working process of the package 10 of the semiconductor package dispensing system 1, the longitudinal direction may be called a transfer direction, the thickness direction may be called a front-rear direction, and the width direction It can be called the vertical direction. Accordingly,'a' in FIG. 3 may indicate length,'b' may indicate width, and't' may indicate thickness.

Referring to FIG. 3, the power package 10 may include a package body 11, a first lead 12 and a second lead 13. In addition, the power package 10 may include two grooves 14 formed in the package body 11 to be spaced apart from each other in the longitudinal direction. Here, the groove 14 may be formed to be concave in the longitudinal direction from the edge of the package body 11. In this case, the semiconductor package dispensing system 1 may apply an insulator to cover the first lead 12. In this case, the insulator may be made of a synthetic resin material such as epoxy.

Conventionally, since the insulator is applied to only one package 10, the insulator is applied to a plurality of packages 10, thereby causing a problem that the plurality of packages 10 are connected to each other by the insulator. I never do that.

However, when performing the coating process by arranging a plurality of packages 10 side by side in one direction, the spacing between the packages 10 is very important in order to solve the problem.

Accordingly, the package alignment apparatus 2 according to the embodiment arranges the plurality of packages 10 transferred to the standby position, which is a preset position by the loader 3, to be spaced apart so as to have a predetermined distance D. It is possible to prevent the plurality of packages 10 arranged side by side along the length direction from being connected by the insulator. In detail, a plurality of packages 10 by the loader 3 may be disposed in the package alignment device 2 in a longitudinal direction in one direction.

In addition, the package alignment device 2 uses a pin 322 inserted into the groove 14 to move two packages 10 adjacent to each other in one direction (X direction) at a predetermined distance D. They can be arranged spaced apart. In this case, the groove 14 formed on one side of the package 10 among the plurality of packages 10 may be disposed to face the groove 14 of the other package 10 disposed adjacent thereto.

Furthermore, the package alignment device 2 may fix a plurality of aligned packages 10. Accordingly, when the semiconductor package dispensing system 1 applies the insulator to the first lead 12 using the dispenser 4, the package alignment device 2 is By making it possible to maintain the gap regardless of the tolerance, it is possible to prevent the insulator from being applied out of a preset position.

4 is a perspective view showing a package alignment device according to an embodiment, FIG. 5 is a plan view showing a package alignment device according to the embodiment, FIG. 6 is a perspective view showing a pin portion of the package alignment device according to the embodiment, and FIG. 7 is A plan view showing a pin portion of a package alignment device according to an embodiment, FIG. 8 is a view showing a plurality of packages arranged in an alignment zone of the package alignment device according to the embodiment, and FIG. 9 is a diagram illustrating a package alignment device according to an embodiment. It is a diagram showing a plurality of packages arranged to have a predetermined interval.

4 to 9, the package alignment apparatus 2 according to the embodiment includes a body 100, a support plate 200 disposed on the body 100, and a plurality of packages 10 in one direction. A plurality of alignment assemblies 300 arranged to be spaced apart from the support plate 200 and a driving unit 400 for moving the alignment assembly 300 toward the package 10 may be included. Accordingly, an alignment zone A may be formed between the support plate 200 and the alignment assembly 300 so that a plurality of packages 10 may be disposed along one direction.

In addition, the package alignment device 2 may further include a stopper 500 so that a plurality of packages 10 transferred by the loader 3 may be disposed in the alignment zone A.

Referring to FIG. 8, a plurality of packages 10 may be put into the alignment zone A by the loader 3. In this case, the stopper 500 may block the progress of the package 10 so that the plurality of packages 10 do not leave the alignment zone A. Accordingly, as illustrated in FIG. 8, packages 10 disposed adjacent to each other in one direction may be disposed to be in contact with each other in the alignment zone A. Here, the loader 3 may include a pusher that pushes the plurality of packages 10 in one direction to be disposed in the alignment zone A.

The body 100 may support the support plate 200, the alignment assembly 300, and the driving unit 400. In addition, a sensor, an electronic component, etc., not shown, may be installed in the body 100. In this case, the body 100 may be formed in various shapes and strength capable of supporting each component.

In addition, a shuttle provided as a moving part (not shown) may be further disposed on the body 100 so that the package alignment device 2 can move in three directions (X direction, Y direction, and Z direction). Here, the moving part may be composed of an actuator such as a motor or an air cylinder, and a linear guide. Accordingly, the position of the package alignment device 2 may be changed by the moving part during a dispensing process.

The support plate 200 may be disposed above the body 100 to support one side of the package 10. Here, the package 10 may be formed to include the package body 11 in a plate shape or a hexahedral shape. Accordingly, when the package 10 is aligned by the alignment assembly 300, the support plate 200 may be formed in a shape having a plane to support one surface of the package 10. That is, the support plate 200 may be formed in a plate shape to support the package 10 face-to-face. In this case, the plane formed on one side of the support plate 200 may form one side of the alignment zone A. Here, the plane formed on one side of the support plate 200 may be referred to as a support surface.

The alignment assembly 300 may be moved by the driving unit 400 to adjust a spaced distance between the plurality of packages 10. For example, as shown in FIG. 9, the alignment assembly 300 inserts a plurality of pins 322 disposed to be spaced apart from each other at a predetermined interval along the X direction, which is one direction, into the groove 14 of the package 10 By doing so, the distance D between the packages 10 disposed adjacent to each other in one direction can be adjusted.

Referring to FIGS. 4 to 7, the alignment assembly 300 includes a base 310 moved by the driving unit 400 and a pin 322 coupled to the groove 14 of the package 10 ( 320) and a support part 330 disposed between the base 310 and the pin part 320 so that the pin part 320 interlocks with the movement of the base 310. In this case, the support part 330 may elastically support the pin part 320.

The base 310 may be moved toward the package 10 by the driving unit 400.

In addition, the base 310 may be disposed above the body 100 to support one side of the support part 330. Here, the other side of the support part 330 may be supported by the pin part 320. Accordingly, the pin 320 may be moved in conjunction with the movement of the base 310 by the support part 330.

A plurality of pin units 320 may be provided in a number corresponding to the number of packages 10. In detail, the number of alignment plates 321 of the pins 320 may be the same as the number of packages 10, and a plurality of alignment plates 321 may be spaced apart from each other at a predetermined interval so as to be disposed in one direction. have. In this case, the number of pins 322 disposed on each of the alignment plates 321 may be the same as the number of grooves 14 formed in the package 10.

6 and 7, the pin part 320 may include an alignment plate 321 and the pin 322 protruding from the alignment plate 321 toward the support plate 200.

The alignment plate 321 may be formed in a plate shape, and may be disposed to face the support plate 200. In addition, a plane formed on one side of the alignment plate 321 may form one side of the alignment zone A. At this time, the pin 1322 should be located in the alignment zone A so as not to interfere with the entry of the package 10. Accordingly, the alignment plate 321 may be disposed to be spaced apart from the support plate 200 to have a predetermined distance based on the Y direction.

The pin 322 may be inserted into the groove 14 of the package 10. In this case, two pins 322 may be disposed to correspond to the groove 14 of the package 10. Here, the two pins 322 may be disposed on the alignment plate 321 to be spaced apart in the X direction. In addition, as shown in FIG. 5, the pins 322 disposed on the alignment plate 321 may be disposed to be spaced apart from the pins 322 of the other alignment plates 321 disposed adjacent to each other at a predetermined interval.

The cross-sectional shape of the pin 322 may be formed in a shape corresponding to the cross-sectional shape of the groove 14.

For example, the cross-sectional shape of the pin 322 may be the same as the cross-sectional shape of the groove 14. However, the area of the cross-section of the pin 322 may increase toward the alignment plate 321. 6 and 7, the area of the end-side cross-section of the pin 322 may be smaller than the area of the groove 14. In addition, the cross-sectional area of the pin 322 on the alignment plate 321 side may be the same as the cross-sectional area of the groove 14.

Therefore, as the pin 322 moves in contact with the groove 14 of the package 10, the package 10 is more easily said than the pin 322 without the difference in area due to the difference in the area of the cross section of the pin 322. It may be arranged to be spaced apart from each other by the interval (D).

The pin 322 may include an inclined surface 322a formed to have a predetermined inclination angle θ with respect to a side surface of the alignment plate 321 in the X direction. Here, the pin 322 may be a tapered pin. Accordingly, the distance to the inclined surface 322a based on the center of the pin 322 in the protruding direction may increase toward the alignment plate 321.

As shown in FIG. 7, the inclined surface 322a may form a part of the side surface of the fin 322 based on the protruding direction of the fin 322. Here, the inclined surfaces 322a formed on each of the two pins 322 may be disposed to face each other.

Therefore, as the inclined surface 322a of the pin 322 moves in the Y direction while in contact with the groove 14 of the package 10, the two packages 10 are spaced apart by the gap D. do.

On the other hand, the pin 322 may be disposed detachably to the alignment plate 321. Accordingly, by replacing the pins 322 with different inclination angles (θ) and placing them on the alignment plate 321, the package alignment device 2 facilitates the distance D between the packages 10 set by the user's request. Can be adjusted.

For example, the inclination angle θ of the pin 322 before replacement may be different from the inclination angle θ of the pin 322 after replacement. In this case, the protruding length of the pin 322 may be the same. Accordingly, even if the spacing (D) required when the insulator is applied is changed, the package alignment device (2) replaces the pins 322 in response to the spacing (D), so that the changed spacing (D) is easily achieved. Can respond well.

Here, the pin 322 is arranged detachably to the alignment plate 321 as an example, but is not limited thereto. For example, the pin portion 320 in which the pin 322 is integrally formed with the alignment plate 321 may be configured to be detachable from the support portion 330.

The support part 330 may support the pin part 320 so as to be linearly moved in connection with the movement of the base 310.

In this case, the support part 330 may elastically support the pin part 320. Accordingly, the support part 330 may include an elastic member 331 that elastically supports the pin part 320. In addition, the support part 330 may further include a guide 332 for guiding the pin part 320 so as to be linearly moved in connection with the movement of the base 310.

4 and 5, one side of the elastic member 331 may be coupled to the base 310 and the other side may be coupled to the alignment plate 321. Accordingly, the pin part 320 may support one side of the package 10 by the elastic force of the elastic member 331. Here, a spring may be provided as the elastic member 331.

Accordingly, as the pin 322 is inserted into the groove 14 of the package 10, the elastic member 331 may allow the pin portion 320 to be in close contact with one side of the package 10. Accordingly, the package 10 may be fixed by the support plate 200 and the pin part 320. For example, by combining the groove 14 of the package 10 with the pin 322 and the elastic member 331 in close contact with the pin portion 320 to the package 10, the flow of the package 10 can be prevented. .

Here, it is assumed that the package 10 is fixed by the close contact, but is not limited thereto. For example, it is also possible to improve the fixing force of the package 10 by using a separate clamp unit (not shown).

The guide 332 may transmit the movement of the base 310 together with the elastic member 331 to the pin 320.

The guide 332 may be coupled to one side of the alignment plate 321. In this case, the end of the guide 332 may be disposed to be movable inside the groove formed in the alignment plate 321.

As shown in FIGS. 4 and 5, two guides 332 may be coupled to one alignment plate 321. In this case, an elastic member 331 may be disposed between the guides 332.

The driving part 400 may align and fix the plurality of packages 10 by moving the alignment assembly 300. Here, the driving unit 400 may be an actuator such as a motor and a gear device or an air cylinder.

The stopper 500 may be disposed on one side of the alignment zone A based on the X direction. That is, the stopper 500 may be disposed on the moving direction of the plurality of packages 10 to limit the movement of the package 10.

Referring to FIG. 4, the stopper 500 may include an air cylinder 510 and a stopper member 520 moving by the air cylinder.

The stopper member 520 may move in the Y direction by the air cylinder 510. For example, when the plurality of packages 10 enter the alignment zone A, the air cylinder 510 may move the stopper member 520 to block the package 10 from continuing to progress in one direction. . In addition, when the application process of the dispenser 4 and the inspection process of the first inspector 5 are completed and the package 10, which has been determined to be normal, is transferred to the cure 6, the air cylinder 510 is a stopper member. By moving 520, the package 10 can be transported in one direction.

10 is a diagram illustrating a package alignment apparatus according to an exemplary embodiment in which a plurality of packages having different thicknesses are aligned.

Even if the thickness of one of the plurality of packages 10 is different from the thickness of the other, the package alignment device 2 may align the plurality of packages 10 to be spaced apart at a predetermined distance D.

Referring to FIG. 10, packages 10 having different thicknesses may be disposed in the alignment zone A of the package alignment device 2. Here, the plurality of packages 10 may be represented as a first package 10a, a second package 10b, a third package 10c.... an Nth package 10n.

As shown in FIG. 10, the thickness t1 of the first package 10a may be formed to have a thickness different from the thickness t2 of the second package 10b, and the first package 10a by the pusher May be disposed in the alignment zone A while in contact with the second package 10b. However, the package alignment device 2 may align and fix a plurality of packages 10 having different thicknesses using the elastic member 331.

11 is a diagram illustrating a bracket disposed in a package alignment device according to an embodiment.

The package alignment device 2 may further include a bracket 600 to prevent separation of the elastic member 331 due to damage or pressure of the support part 330. Accordingly, the bracket 600 may protect the support part 330.

Here, a plurality of holes may be formed in the bracket 600 so that the elastic member 331 and the guide 332 may be disposed.

12 is a block diagram illustrating a package alignment method according to an embodiment.

Hereinafter, a package alignment method according to an exemplary embodiment will be described through an operation process of the package alignment device 2 with reference to FIGS. 1 to 12.

The package alignment method (S1) according to the embodiment includes a step of arranging a plurality of packages in an alignment zone (S100, an arrangement step) and a step of aligning a plurality of packages spaced apart at a predetermined interval (S200, an alignment step). I can.

In the arrangement step (S100), the plurality of packages 10 are pushed in one direction using the pusher and disposed in the alignment zone A. In this case, the plurality of packages 10 disposed along one direction may be disposed in the alignment zone A while being in contact with each other by the stopper 500.

In the alignment step (S200), the plurality of packages 10 disposed in the alignment zone A are arranged to be spaced apart from each other to have a predetermined distance D.

As shown in FIG. 9, by inserting the pin 322 into the groove 14 of the package 10, the distance D between the packages 10 disposed adjacent to each other in one direction can be adjusted. At this time, the package 10 may be fixed by the elastic member 331 in close contact with the pin 320 to the package 10 together with the coupling of the groove 14 and the pin 322 of the package 10.

Although the above has been described with reference to the embodiments of the present invention, those skilled in the art can variously modify and modify the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. You will understand that you can change it. And, the differences related to such modifications and changes should be construed as being included in the scope of the present invention defined in the appended claims.

1: package alignment device
100: body
200: support plate
300: alignment assembly
310: base 320: pin
321: alignment plate 322: pin
322a: slope 330: support
331: elastic member 332: guide
400: drive unit
500: stopper
600: bracket

Claims (9)

In the package alignment device for aligning a plurality of packages arranged in one direction,
body;
A support plate disposed on the body;
An alignment assembly spaced apart from the support plate so that a plurality of the packages are disposed in one direction; And
And a driving unit for moving the alignment assembly toward the package,
The alignment assembly
A base moved by the driving unit;
A pin portion including a pin; And
And a support portion disposed between the base and the pin portion so that the pin portion interlocks with the movement of the base,
The pin portion includes a plate-shaped alignment plate and the pin protruding from the alignment plate toward the support plate,
The package includes two grooves formed to be spaced apart in a longitudinal direction,
The groove formed on one side of any one of the plurality of packages is disposed to face the groove of another package disposed adjacently,
A package alignment device for coupling the pins of the alignment assembly to a groove formed in the package to separate the packages from each other at a predetermined distance (D). The method of claim 1,
The pin is a package alignment apparatus including an inclined surface formed to have a predetermined inclination angle (θ) with respect to the alignment plate. The method of claim 2,
The pin is a package alignment device that is detachably disposed on the alignment plate. delete The method of claim 1,
A package alignment device in which the number of alignment plates is the same as the number of packages. In the package alignment device for aligning a plurality of packages arranged in one direction,
body;
A support plate disposed on the body;
An alignment assembly spaced apart from the support plate so that a plurality of the packages are disposed in one direction; And
And a driving unit for moving the alignment assembly toward the package,
The alignment assembly
A base moved by the driving unit;
A pin portion including a pin; And
And a support portion disposed between the base and the pin portion so that the pin portion interlocks with the movement of the base,
The pin portion includes a plate-shaped alignment plate and the pin protruding from the alignment plate toward the support plate,
Package alignment device including an elastic member for elastically supporting the pin portion of the support portion. The method of claim 6,
The support unit further includes two guides, and the elastic member is disposed between the guides. The method of claim 7,
A package alignment device in which the thickness of one of the plurality of packages is different from the thickness of the other. The method of claim 1,
The package alignment device wherein the package is a power package.

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