KR102177238B1 - Led assembly and backlight unit - Google Patents

Abstract

The LED assembly according to the present invention includes a printed circuit board (PCB) including a wiring layer, an insulating layer, and a base substrate sequentially stacked and including at least one heat dissipation groove; And a lead part connected to the wiring layer, a heat dissipation part inserted into the heat dissipation groove, and an LED (Light Emitting Diode) having a case including a light exit surface and accommodates the lead part and the heat dissipation part, wherein the heat dissipation part An LED assembly comprising an LED chip mounting region and a heat radiation groove insertion region, wherein the heat radiation groove insertion region is drawn out from a side surface of the case and inserted into the heat radiation groove.

Description

LED assembly and backlight unit having the same {LED ASSEMBLY AND BACKLIGHT UNIT}

The present invention relates to an LED assembly and a backlight unit having the same.

The liquid crystal display device (LCD), which is advantageous for displaying moving images and has a large contrast ratio, is actively used in TVs and monitors. The optical anisotropy and polarization of liquid crystals The principle of image implementation is shown.

Such a liquid crystal display device uses a liquid crystal panel bonded by interposing a liquid crystal layer between two parallel substrates as an essential component, and a difference in transmittance is realized by changing the alignment direction of liquid crystal molecules by an electric field in the liquid crystal panel. do. However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. To this end, a backlight unit having a light source is disposed on the back of the liquid crystal panel.

Here, as a light source of the backlight unit, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, and a light emitting diode (LED, hereinafter referred to as LED) are used. .

Among them, LEDs, in particular, have features such as small size, low power consumption, and high reliability, and are being widely used as a display light source.

The LED is a light-emitting device, and the temperature rises rapidly according to the usage time, and the temperature rise is accompanied by a change in luminance. Therefore, when using the LED as a light source of the backlight unit, one of the most important matters is the heat dissipation design according to the temperature rise of the LED. However, in general liquid crystal display devices, the temperature of the LED gradually rises during use, as a specific method to quickly release the high-temperature heat generated from the LED to the outside is not provided, and the luminance change accordingly eventually reduces the image quality. It acts as a cause of deterioration. In addition, it causes a problem of shortening the life of the LED.

In addition, in response to the recent demand for slimmer backlight units, side view type LEDs are being applied, but side view type LEDs have a longer heat dissipation path than top view type LEDs, and reliability is increased due to increased driving current. There was a low problem.

An embodiment according to the present invention can provide a backlight unit in which the width of the opening of the bottom cover is minimized.

The embodiment according to the present invention may provide a backlight unit capable of stably fixing the LED assembly.

An embodiment according to the present invention can provide an LED assembly maximizing the heat dissipation effect.

An embodiment according to the present invention may provide an LED assembly with a minimized thickness.

The LED assembly according to the present invention includes a printed circuit board (PCB) including a wiring layer, an insulating layer, and a base substrate sequentially stacked and including at least one heat dissipation groove; And a lead part connected to the wiring layer, a heat dissipation part inserted into the heat dissipation groove, and an LED (Light Emitting Diode) having a case including a light exit surface and accommodates the lead part and the heat dissipation part, wherein the heat dissipation part An LED assembly comprising an LED chip mounting region and a heat radiation groove insertion region, wherein the heat radiation groove insertion region is drawn out from a side surface of the case and inserted into the heat radiation groove.

In the LED assembly according to the present invention, the LED chip mounting area and the heat dissipation groove insertion area is an LED assembly forming the same plane.

In the LED assembly according to the present invention, the LED is a side view type LED assembly.

In the LED assembly according to the present invention, the heat dissipation unit LED assembly in contact with the base substrate through the heat dissipation groove.

In the LED assembly according to the present invention, the PCB is an LED assembly comprising first and second lead contact portions (352, 353) formed in each of the left and right side of the heat dissipation groove.

In the LED assembly according to the present invention, the lead portion includes first and second lead portions drawn out from the side surface of the case, the first lead portion is connected to the first lead portion contact portion, and the second lead portion 2 LED assembly connected to the lead part contact part.

The backlight unit according to the present invention includes a light guide plate; And an LED assembly disposed on one side of the light guide plate, wherein the LED assembly includes: a printed circuit board (PCB) including an LED mounting area; And an LED (Light Emitting Diode) disposed in the LED mounting area, wherein the LED includes first and second lead units; and a heat dissipation unit separated from the first and second lead units and on which an LED chip is disposed; Including, wherein the LED mounting area is a backlight unit including first and second lead portion contacting portions contacting each of the first and second lead portions; and a heat dissipating groove for accommodating one region of the radiating portion.

In the backlight unit according to the present invention, the heat dissipation unit includes an LED chip mounting area in which the LED chip is disposed; and a heat dissipation groove receiving area accommodated in the heat dissipation groove and forming the same plane as the LED chip mounting area.

In the backlight unit according to the present invention, the PCB includes: a base substrate; and an insulating layer formed on the base substrate; a wiring layer formed on the insulating layer, wherein the heat dissipation groove contacts the base substrate through the receiving groove Backlight unit.

The embodiment according to the present invention can minimize the width of the opening of the bottom cover, can stably fix the LED assembly, can provide an LED assembly maximizing the heat dissipation effect, and provide an LED assembly with a minimum thickness. You may.

1 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.
2 and 3 are perspective views of an LED according to an embodiment of the present invention.
4 to 7 are views as viewed from various angles of a lead part and a heat dissipation part according to an embodiment of the present invention.
8 is a perspective view of a PCB according to an embodiment of the present invention.
9 is an enlarged view of an LED mounting area in which the dotted line A of FIG. 8 is enlarged.
10 is a view showing an LED mounted in the LED mounting area.

Hereinafter, with reference to the drawings of the LED assembly and the backlight unit having the same according to an embodiment of the present invention will be described in detail. The following embodiments are provided as examples in order to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In addition, in the drawings, the size and thickness of the device may be exaggerated for convenience. Throughout the specification, the same reference numbers indicate the same elements.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same elements throughout the specification. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity of description.

When an element or layer is another element or referred to as “on” or “on”, it includes both the case where another layer or other element is interposed in the middle as well as directly above the other element or layer. do. On the other hand, when a device is referred to as "directly on" or "directly on", it indicates that there is no intervening other device or layer in between.

Spatially relative terms "below, beneath", "lower", "above", "upper", etc. are used as one element or component as shown in the drawing. It can be used to easily describe the correlation between the and other devices or components. Spatially relative terms should be understood as terms including different directions of the device during use or operation in addition to the directions shown in the drawings. For example, if an element shown in the figure is turned over, an element described as “below” or “beneath” of another element may be placed “above” another element. Accordingly, the exemplary term “below” may include both directions below and above.

The terms used in the present specification are for describing exemplary embodiments, and therefore, are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated in the phrase. As used in the specification, "comprise" and/or "comprising" refers to the presence of one or more other components, steps, actions and/or elements, and/or elements, steps, actions and/or elements mentioned. Or does not exclude additions.

1 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

As shown in FIG. 1, the liquid crystal display device includes a liquid crystal panel 110, a backlight unit 120, a support main 130, a bottom cover 150, and a top cover 140.

The liquid crystal panel 110 is composed of a color filter array substrate 112, a TFT array substrate 114, and a liquid crystal layer (not shown) interposed therebetween, and the color filter array substrate 112 and the TFT array substrate ( A polarizing plate (not shown) is attached to the outer surface of 114).

In the liquid crystal panel 110, liquid crystal cells constituting a pixel unit are arranged in a matrix form, and the liquid crystal cells form an image by adjusting light transmittance according to image signal information transmitted from a driver driving circuit.

Specifically, a pixel is defined by crossing a plurality of gate lines and data lines on the inner surface of the TFT array substrate 114, and a thin film transistor (TFT) is provided at each intersection point to be formed in each pixel. It is connected to the transparent pixel electrode in a one-to-one correspondence.

In addition, as an example corresponding to each pixel on the inner surface of the color filter array substrate 112, color filters of red (R), green (G), and blue (B) colors and each of them are covered, And a black matrix to cover non-display elements such as data lines and thin film transistors. In addition, a transparent common electrode covering them is provided.

Along at least one edge of the liquid crystal panel 110, the gate and the data printed circuit board 117 are connected via a connection member 116 such as a flexible circuit board, so that the side or the bottom cover of the support main 130 in the modularization process It is in close contact with the back of 150.

In addition, although not clearly shown in the drawing, an alignment layer for determining the initial molecular arrangement direction of the liquid crystal is interposed at the boundary between the color filter array substrate 112 and the TFT array substrate 114 and the liquid crystal layer of the liquid crystal panel 110. In order to prevent leakage of the liquid crystal layer filled therebetween, a seal pattern is formed along the edges of the color filter array substrate 112 and the TFT array substrate 114.

A backlight unit 120 that supplies light is provided on the rear surface of the liquid crystal panel 110 so that the difference in transmittance indicated by the liquid crystal panel 110 is expressed to the outside.

The backlight unit 120 includes an LED assembly 20 arranged along at least one edge length direction of the support main 130, a white or silver reflector 125, and a light guide plate 123 mounted on the reflector 125. ) And an optical sheet 121 interposed thereon.

The LED assembly 20 is a light source of the backlight unit 120 and is located on one side of the light guide plate 123 so as to face the light incident surface of the light guide plate 123, and the LED assembly 20 includes a plurality of LEDs 200 and , A plurality of LEDs 200 include a PCB 300 mounted at a predetermined interval.

The light guide plate 123 into which the light emitted from the plurality of LEDs 200 is incident is evenly distributed over a wide area of the light guide plate 123 while the light incident from the LED 200 travels through the light guide plate 123 by several total reflections. Spread to provide a surface light source to the liquid crystal panel 110.

The light guide plate 123 may include a pattern having a specific shape on its rear surface to supply a uniform surface light source.

Here, the pattern may be configured in various ways, such as an elliptical pattern, a polygon pattern, and a hologram pattern, in order to guide the light incident into the light guide plate 123. The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

In addition, as the material of the light guide plate 123, polymethy-methacrylate (PMMA) having high strength and not easily deformed or broken and having good transmittance may be used. Here, the light guide plate 123 may be of a wedge type having an inclined lower surface and a flat upper surface, or a plate type in which both the lower surface and the upper surface are parallel. In addition, the light guide plate 123 may have a relatively larger thickness on the side of the light incident part.

The optical sheet 121 may be composed of a diffusion sheet, a prism sheet, a protective sheet, and a reflective sheet. In some cases, it may be provided with two diffusion sheets, two prism sheets, and reflection sheets. In this case, the diffusion sheet may be formed of a base plate and a bead-shaped coating layer formed on the base plate.

The reflector 125 is located on the rear surface of the light guide plate 123 and reflects the light that has passed through the rear surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the luminance of light.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140, the support main 130, and the bottom cover 150, and the top cover 140 includes the upper edge of the liquid crystal panel 110 and the Organize to cover the side.

Here, the top cover 140 has a rectangular frame shape in which the cross section is bent in a “b” shape so as to cover the upper and side edges of the liquid crystal panel 110, and the front cover of the top cover 140 is opened to cover the liquid crystal panel 110. It is configured to display an image implemented in.

In addition, the bottom cover 150, which is the basis for assembling the entire liquid crystal display device by mounting the liquid crystal panel 110 and the backlight unit 120, includes a bottom portion and a side wall whose edges are vertically bent. In addition, a support main 130 in the shape of a square frame, which is seated on the bottom cover 150 and has an open edge around the edge of the liquid crystal panel 110 and the backlight unit 120, is provided with the top cover 140 and the bottom. It is combined with the cover 150.

In this case, the top cover 140 may be referred to as a case top or a top case, the support main 130 may be referred to as a guide panel, a main support, or a mold frame, and the bottom cover 150 may be referred to as a lower cover.

2 and 3 are perspective views of an LED according to an embodiment of the present invention. And Figures 4 to 7 are views viewed from various angles of the lead portion and the heat dissipation portion according to an embodiment of the present invention.

The direction symbols shown in Fig. 2 are direction symbols indicating a direction in a three-dimensional space, in a direction c having an angle of 90 degrees to the a-direction on a secondary plane, a direction b having an angle of 90 degrees to the c-direction, and the It is defined as the d direction having an angle of 90 degrees to the b direction, and the e direction perpendicular to the upper direction based on the a and b directions in the three-dimensional space and the f direction perpendicular to the lower direction based on the a and b directions Is defined.

In the following description of the present invention, the expression indicating the direction will be described based on a case where each component constituting the present invention is arranged as shown in FIG. 2.

2 to 7, the LED 200 according to the embodiment of the present invention may include a case 201, a heat dissipation part 230, a lead part 240, and an LED chip 250.

The heat dissipation part 230 and the lead part 240 may be coupled to the case 201, and the LED chip 250 may be mounted on the heat dissipation part 230.

The heat dissipation part 230 and the lead part 240 may be manufactured separately from each other.

The case 201 may accommodate the heat dissipation unit 230, the lead unit 240, and the LED chip 250, and may serve as a housing.

The case 201 may include first to fourth sidewalls 202, 203, 204, and 205. The heat dissipation part 230 and the lead part 240 may be drawn out from the second sidewall 203.

In addition, the case 201 may include an emission surface 206 from which light is emitted, and a reflection surface 207 that faces the emission surface 206 and is a rear surface of the case 201.

Since the LED assembly 20 is a side view type, when the LED assembly 20 is fastened with the bottom cover 150, the light emitting surface 207 faces the sidewall of the bottom cover 150, and the The exit surface 206 may face the light incident portion of the light guide plate 123.

The side-view type LED assembly 20 is advantageous for slimming the backlight unit. The first to fourth side walls 202, 203, 204, and 205 may be integrally formed with each other, and may have a rectangular frame shape. .

When the case 201 formed by the first to fourth sidewalls 202, 203, 204, and 205 has a rectangular shape, the areas of the first and second sidewalls 202 and 203 are the third and fourth It may be larger than the area of the sidewalls 204 and 205. That is, the left and right widths (length in the cd direction) of the first and second side walls 202 and 203 may be longer than the left and right widths (length in the ab direction) of the third and fourth side walls 204 and 205, The height can be the same.

Each of the first to fourth sidewalls 202, 203, 204, and 205 may include an outer surface 210 and an inner surface 220.

The outer surface 210 may include first to fourth outer surfaces 211, 212, 213 and 214.

The first outer surface 211 and the second outer surface 212 may face each other, and the third outer surface 213 and the fourth outer surface 214 may face each other.

The first outer surface 211 is a surface facing the a direction, the second outer surface 212 is a surface facing the b direction, the third outer surface 213 is a surface facing the d direction, and 4 The outer surface 214 is a surface facing the c direction.

The inner surface 220 may include first to fourth inner surfaces 221, 222, 223, and 224.

The first to fourth inner surfaces 221, 222, 223, and 224 may be inclined surfaces.

The first inner surface 221 is a surface inclined so that the inclined surface faces eb direction, the second inner surface 222 is a surface and a surface inclined so that the inclined surface faces ea direction, and the third inner surface ( Reference numeral 223 denotes an inclined surface with an inclined surface facing the ec direction, and the fourth inner surface 224 may be an inclined surface with an inclined surface facing the ed direction.

The first to fourth sidewalls 202, 203, 204, and 205 may block the light emitted from the LED chip 250 from leaking in the a, b, c, and d directions.

In addition, the first to fourth inner surfaces 221, 222, 223, and 224 may form a reflective surface. Accordingly, a reflective material such as a transparent resin may be applied to the first to fourth inner surfaces 221, 222, 223, and 224. Thus, the transparent resin is filled in the space formed by the first to fourth inner surfaces 221, 222, 223, and 224, so that the angle of the main emission light of the LED 200 can be controlled.

In addition, by having a function of reflecting the first to fourth inner surfaces 221, 222, 223, 224, the case 201 serves to reflect in the front, that is, the e direction emitted from the LED chip 250 can do.

The transparent resin may include a phosphor, and a mixture of an epoxy resin or a silicone resin including the phosphor may be used.

4 to 7, the heat dissipation unit 230 is a part that conducts and discharges high-temperature heat accompanying the LED chip 250 when light is emitted, and may be made of a metal material.

The heat dissipation unit 230 may include an LED chip mounting region 237 and a heat dissipation groove insertion region 238.

The LED chip mounting area 237 is an area corresponding to the inside of the case 201, and the LED chip 250 may be disposed on the LED chip mounting area 237. Specifically, the LED chip mounting area 237 may be disposed in the center area of the case 201. In addition, the first to fourth inner surfaces 221, 222, 223, and 224 of the case 201 may be disposed in a space surrounding them.

The heat dissipation groove insertion region 238 may be an area in which the heat dissipation part 230 is exposed to the outside from the second side surface 203 of the case 201, that is, an area drawn out from the case 201. Specifically, the heat dissipation groove insertion region 238 may be an area of the heat dissipation part 230 drawn out from the case 201 in the b direction.

The heat dissipation part 230 may have a plate shape, and a bending region may not be formed. Accordingly, the LED chip mounting region 237 and the heat dissipation groove insertion region 238 may form the same plane with each other.

The lead part 240 may include a first lead part 240a disposed on the right side of the heat dissipating part 230 and a second lead part 240b disposed on the left side of the radiating part 230.

The first lead part 240a may be one of an anode and a cathode, and the second lead part 240b may be the other.

Since the first and second lead portions 240a and 240b have shapes corresponding to each other, the shape will be described centering on any one of them.

The lead part 240 may include first to fourth parts 241, 242, 243 and 244. The first part 241 is a configuration inserted into the case 201 and may have the same plane as the heat dissipation part 230, and the LED chip 250 disposed on the heat dissipation part 230 through a wire is electrically Can be connected to.

The second part 242 may be formed to extend perpendicularly to the first part 241 from one edge of the first part 241.

The third part 243 may be formed to extend vertically from the second part 242. In addition, the fourth portion 244 may be formed to extend vertically from the third portion 243.

When this is described again with reference to the direction chart of FIG. 5, the second part 242 is formed extending from one edge of the first part 241 in the Y direction, and the third part 243 is The second part 242 may be formed to extend in the -X direction, and the fourth part 244 may be formed to extend from the third part 243 in the Z direction.

Referring to FIG. 6, the heat dissipation part 230 includes an upper surface 231, a rear surface 232, and first to fourth side surfaces 233, 234, and 235 surrounding the upper surface 231 and the rear surface 232, 236) may be included.

The upper surface 231 of the heat dissipation part may be an area in which the LED chip 250 is mounted. In addition, the first side surface 233 of the heat dissipation part may be a surface corresponding to the second lead part 240b, and the second side surface 234 may be a surface corresponding to the first lead part 240a.

Specifically, in the second lead part 240b, the first part 241 may include an upper surface 241a, a side surface 241b, and a rear surface 241c, and the first part 241 is an upper surface of the radiating part The same plane as 231 may be formed, and the side surface 241b of the first part may face the first side surface 233 of the heat dissipation part. In addition, the rear surface 241c of the first portion 241 may form the same plane as the rear surface 232 of the radiating portion 230.

Also, referring to FIG. 7, the length L1 of the long axis of the side surface 241b of the first part may be smaller than the length L2 of the long axis of the first and second side surfaces 233 and 234 of the heat dissipation part. And the heat dissipation part (L2-L1) which is the difference between the long axis length L2 of the first and second side surfaces 233 and 234 of the heat dissipation part and the long axis length L1 of the side surface 241b of the first part ( It may be the heat dissipation groove insertion area 238 of the 230).

Meanwhile, each of the first and second lead portions 240a and 240b of the lead portion 240 may be electrically connected to the LED chip 250 through a wire.

The heat dissipation part 230 and the lead part 240 may be formed of the same metal, and consist of any one metal material of copper, silver, aluminum, iron, nickel, and tungsten, or an alloy material including at least one of them. Can be.

In addition, the outer surfaces of the heat dissipation part 230 and the lead part 240 may be plated with any one of nickel, silver, and gold, or an alloy material containing at least one of them.

When positive power (+) and negative power (-) are respectively supplied through the first and second lead parts 240a and 240b, the LED chip 250 mounted on the heating part 230 emits light. In addition, some of the light emitted from the LED chip 250 excites a phosphor in a transparent resin, and is mixed with the light emitted by the phosphor to emit white light.

The heat dissipation unit 230 more effectively dissipates the high-temperature heat generated from the LED 200, and thus it is possible to prevent changes in life span and luminance of the LED 200 due to an increase in temperature.

8 is a perspective view of a PCB according to an embodiment of the present invention. And FIG. 9 is an enlarged view of the LED mounting area in which the dotted line portion A of FIG. 8 is enlarged. And Figure 10 is a diagram showing the LED mounted in the LED mounting area.

Referring to FIGS. 8 to 10, the PCB 300 may include a plurality of LED mounting regions 350, and an LED 200 may be mounted on each of the plurality of LED mounting regions 350. The plurality of LEDs 200 may be mounted on the PCB 300 at regular intervals by surface mount technology (SMT).

The plurality of LEDs 200 are side view LEDs, and the emission surface 206 of the LEDs 200 faces a light incident portion provided on the side of the light guide plate 123.

Each of the plurality of LEDs 200 may receive power through power wiring formed on the wiring layer 330 on the PCB 300.

Here, the plurality of LEDs 200 emit light having colors of red (R), green (G), and blue (B), and by turning on such a plurality of RGB LEDs 200 at once, white light by color mixing can be realized. May be.

Meanwhile, the LED 200 implementing white light may be made of a blue LED chip 250 and a yellow phosphor, and a UVLED chip may be used for the LED chip 250. When using a UVLED chip, the phosphor is red (R), It is made of three-color phosphors of green (G) and blue (B), and the luminous color can be selected by adjusting the mixing ratio of the phosphors of red (R), green (G), and blue (B).

The PCB 300 may include a base substrate 310, an insulating layer 320 formed on an upper surface of the base substrate 310, and a wiring layer 330.

The base substrate 310 serves to support the wiring layer 330 and the insulating layer 320 and other components by mounting them as an upper layer, and to dissipate heat generated from the plurality of LEDs 200 to the bottom side.

An adhesive layer 340 may be formed on the rear surface of the base substrate 310 of the PCB 300, and the adhesive layer 340 may serve to fix the base substrate 310 to the bottom cover 150. .

The base substrate 310 may be formed of a metal having high thermal conductivity, such as aluminum (Al) or copper (Cu), or a heat transfer material may be applied to improve a heat dissipation function.

Alternatively, a heat sink (not shown) such as a heat sink may be provided on the rear surface of the base substrate 310 to receive heat from each of the LEDs 200 and radiate it to the outside more efficiently.

A wiring layer 330 including a plurality of metal wirings (not shown) formed by patterning a conductive material on the base substrate 310 is formed, and an insulating layer 330 is formed between the base substrate 310 and the wiring layer 330. 320 may be positioned to electrically insulate between the base substrate 310 and a plurality of metal wires (not shown).

Referring to FIG. 9, a heat dissipation groove 351 and first and second lead contact portions 352 and 353 may be formed in the LED mounting area 350.

The heat dissipation groove 351 may be a groove having a shape corresponding to the heat dissipation groove insertion region 383 of the heat dissipation part 230, and the first and second side surfaces 233 and 234 of the heat dissipation part in FIG. 7 described above. A groove may be formed to a depth equal to L2-L1, which is a difference between the length L1 of the long axis of the side surface 241b of the first part from the length L2 of the long axis of ).

The radiating part 230 may be inserted into the radiating groove 351, and the radiating part 230 may be fixed to the base substrate 310 inside the radiating groove 351 through a shoulder ring 370.

The heat dissipation unit 230 is inserted into the heat dissipation groove 351 so that heat generated from the LED chip 250 may be rapidly transferred onto the PCB 300.

In addition, when the heat dissipation part 230 and the base substrate 310 are formed of the same metal material, heat dissipation may be maximized through metal homo-junction.

In particular, the depth of the heat dissipation groove 351 becomes a depth that can be formed up to the upper region of the base substrate 310, so that the heat dissipation part 230 may directly contact the base substrate 310. This is to maximize the heat dissipation effect by allowing the heat dissipation unit 230 to directly contact the base substrate 310 having high thermal conductivity in consideration of the low thermal conductivity of the insulating layer 320.

Meanwhile, first and second lead contact portions 352 and 353 may be formed on the left and right sides of the heat dissipation groove 351.

The first lead part 240a may contact the first lead part contact part 352, and the second lead part 240b may contact the second lead part contact part 353.

The first and second lead portion contact portions 352 and 353 may be a region where the electrode on the wiring layer 330 is exposed, and the lead portion 240 and the first and second lead portions are exposed through a shouldering 370 process. 2 The lead contact portions 352 and 353 may be electrically connected.

In addition, among the lead portions 240, second and third portions 242 and 243 may contact the first and second lead portion contact portions 352 and 353.

In this way, both the heat dissipation unit 230 and the lead unit 240 are drawn out from the second side surface 203 of the case 201, and the first and second lead portions 240a and 240b separated from each other are first And the second lead part contact parts 352 and 353, and the heat dissipation part 230 separated from the first and second lead parts 240a and 240b may be inserted into the heat dissipation groove 351. Accordingly, the heat dissipation path is formed as the base substrate 310 directly from the heat dissipation part 230 rather than passing through the base substrate 310 through the lid part 240 and the heat dissipation part 230. The length of (path) can be shortened, and accordingly, it has the effect of enabling rapid release of heat.

In addition, since the heat dissipation part 230 is inserted into the heat dissipation groove 351, the LED 200 may be fixed on the PCB 300. Accordingly, by preventing the LED 200 from flowing in the LED mounting area 350, a tilt improvement effect may be obtained.

In addition, it is possible to achieve a slimming effect of the backlight unit by minimizing the distance L3 between the first and second side surfaces 202 and 203 of the case 201 of the LED 200.

Specifically, when the thickness L3 of the case 201 is reduced to make the backlight unit slimmer, the size of the heat dissipation unit 230 may be reduced accordingly.

In this case, since the heat dissipation part 230 has a planar shape without a bent area, an area in which the LED chip 250 can be disposed within the heat dissipation part 230 must be secured, and an area for heat conduction must also be secured. You can overcome the difficulties that you do.

If one area of the heat dissipation unit 230 is bent, the area in which the LED chip 250 is disposed cannot be secured, or it is difficult to secure an area for heat conduction, and the size of the heat dissipation unit 230 is greatly reduced. There may be technical difficulties in bending itself. However, as in the embodiment of the present invention, by using the side-view type LED 200 having the heat dissipation unit 230 that does not have a bending area, the LED chip 250 is stably mounted and the effect of heat dissipation is maximized. The tilt prevention of 200 and the slimming effect of the backlight unit can be achieved at the same time.

Moreover, in a product where slimming of a backlight unit is very important, such as a small display device such as a mobile, the embodiment according to the present invention can maximize the effect.

In the detailed description of the present invention described above, it has been described with reference to preferred embodiments of the present invention, but those skilled in the art or those of ordinary skill in the relevant technical field of the present invention described in the claims to be described later It will be understood that various modifications and changes can be made to the present invention without departing from the spirit and technical scope. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

29 LED assembly
110 LCD panel
112 color filter array board
114 TFT array substrate
116 Connecting member
117 printed circuit board
120 backlight units
121 Optical Sheet
123 light guide plate
125 reflector
130 Support main
140 Top Cover
150 bottom cover
151 side wall
200 LED
201 case
202 first side wall
203 second side wall
203a radiator compartment
204 third side wall
205 fourth side wall
206 exit plane
207 half exit surface
210 outer surface
211 first outer surface
212 second outer surface
213 3rd outer surface
214 fourth outer surface
220 inner surface
221 first inner surface
222 second inner surface
223 third inner surface
224 fourth inner surface
230 radiator
231 Top surface of heat sink
232 rear side of heat sink
233 first side of heat sink
234 second side of heat sink
235 third side of heat sink
236 4th side of heat sink
237 LED chip mounting area
238 Radiation groove insertion area
240 lead
240a first lead part
240b second lead part
241 Part 1
241a the top of part 1
Aspects of Part 1 241b
241c The back of part 1
242 Part 2
243 Part 3
244 Part 4
250 LED chip
300 PCB
310 Base substrate
311 No wiring layer formed area
312 wiring layer formation area
313 bottom cover insertion area
320 insulation layer
330 wiring layer
340 adhesive layer
350 LED mounting area
351 Radiation groove
352 1st lead part contact part
353 2nd lead part contact part
370 shouldering

Claims (9)

A printed circuit board (PCB) including a base substrate, an insulating layer and a wiring layer stacked on the base substrate, and at least one heat dissipation groove penetrating the insulating layer and the wiring layer; And
Including at least one LED (Light Emitting Diode) mounted on the PCB,
Each of the at least one LED includes an LED chip, a heat dissipation part on which the LED chip is seated, a lead part separated from the heat dissipation part and connected to the LED chip, and a light exit surface receiving the lead part and the heat dissipation part. Equipped with a case,
The radiating part
An LED chip mounting area disposed in the case and on which the LED chip is mounted, and
LED assembly including a heat dissipation groove insertion region which is drawn out to the side of the case, is inserted into the heat dissipation groove, and contacts the base substrate through the heat dissipation groove. The method of claim 1,
The LED assembly in which the LED chip mounting region and the heat dissipation groove insertion region form the same plane with each other. The method of claim 1,
The LED is a side view type LED assembly. delete The method of claim 1,
The PCB further includes first and second lead contact portions formed on both sides of the heat dissipation groove. The method of claim 5,
The lead portion includes first and second lead portions drawn out to both sides of the case,
The first lead part is connected to the first lead part contact part, and the second lead part is connected to the second lead part contact part. Light guide plate; And
Including an LED assembly disposed on one side of the light guide plate,
The LED assembly,
A printed circuit board (PCB) including an LED mounting area; And
Including an LED (Light Emitting Diode) disposed in the LED mounting area,
The LED includes an LED chip, a heat dissipation unit on which the LED chip is mounted, first and second lead units separated from the heat dissipation unit and connected to the LED chip, and a partial region on which the LED chip is mounted among the heat dissipation unit It includes a case for accommodating the first and second lead portions,
The PCB includes a base substrate and an insulating layer and a wiring layer stacked on the base substrate,
The LED mounting area of the PCB passes through the first and second lead contact portions and the insulating layer and the wiring layer in contact with each of the first and second lead portions, and other partial areas of the heat dissipation portion drawn out from the case It includes a heat dissipation groove for receiving,
The other partial area of the radiating part is in contact with the base substrate through the radiating groove. The method of claim 7,
The heat dissipation unit is a backlight unit formed in a single plane shape. delete

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