KR20160011753A - Led assembly and backlight unit - Google Patents

Abstract

An LED assembly according to the present invention includes a printed circuit board (PCB) which includes a wiring layer, an insulating layer, and a base substrate which are sequentially stacked, and has at least one heat radiation groove; and a light emitting diode (LED) which includes a lead part connected to the wiring layer, a heat radiation part inserted into the heat radiation groove, and a case which accommodates the lead part and the heat radiation part and includes a light exiting surface. The heat radiation part includes an LED chip mounting region and a heat radiation groove insertion region. The heat radiation groove insertion region is drawn from a lateral surface of the case to be inserted into the heat radiation groove.

Description

LED assembly and a backlight unit having the LED assembly

The present invention relates to an LED assembly and a backlight unit having the LED assembly.

A liquid crystal display device (LCD), which is advantageous for moving picture display and has a large contrast ratio and is actively used in TVs and monitors, exhibits optical anisotropy and polarization properties of a liquid crystal, And the like.

Such a liquid crystal display device has a liquid crystal panel in which a liquid crystal panel is interposed between two adjacent substrates through a liquid crystal layer as an essential component and changes the alignment direction of the liquid crystal molecules in an electric field in the liquid crystal panel to realize a difference in transmittance do. However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. To this end, a backlight unit having a light source is disposed on the back of the liquid crystal panel.

Here, as a light source of the backlight unit, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, a light emitting diode (LED) .

In particular, LEDs are widely used as light sources for displays, having characteristics such as small size, low power consumption, and high reliability.

The LED is a light emitting device, and the temperature is rapidly increased according to the use time, and such a temperature rise has a characteristic accompanied by a luminance change. Therefore, one of the most important issues when using the LED as a light source of the backlight unit is the heat radiation design according to the temperature rise of the LED. However, since the conventional liquid crystal display device does not have a specific way of rapidly discharging the high-temperature heat generated from the LED to the outside, the temperature of the LED gradually increases during use, and accordingly, Which causes degradation. Further, the lifetime of the LED is shortened.

Recently, side view type LEDs have been applied in accordance with the demand for slimming down the backlight unit, and side view type LEDs have a longer heat path than the top view type LED, There was a low problem.

The embodiment according to the present invention can provide a backlight unit in which the width of the opening of the bottom cover is minimized.

The embodiment according to the present invention may provide a backlight unit capable of stably fixing the LED assemble.

Embodiments according to the present invention can provide an LED assembly maximizing the heat dissipation effect.

Embodiments according to the present invention may provide an LED assembly with minimized thickness.

The LED assembly according to the present invention includes: a printed circuit board (PCB) including a sequentially stacked wiring layer, an insulating layer, and a base substrate and including at least one heat dissipating groove; And a LED (Light Emitting Diode) having a lead portion connected to the wiring layer, a heat dissipation portion inserted into the heat dissipation groove, and a case accommodating the lead portion and the heat dissipation portion and including a light output surface, An LED chip mounting region and a heat dissipating groove inserting region, and the heat dissipating groove inserting region is drawn out from the side of the case and inserted into the heat dissipating groove.

In the LED assembly according to the present invention, the LED chip mounting area and the heat dissipation groove inserting area are flush with each other.

In the LED assembly according to the present invention, the LED is a side view type LED assembly.

In the LED assembly according to the present invention, the heat dissipation unit may contact the base substrate through the heat dissipation groove.

In the LED assembly according to the present invention, the PCB includes first and second lead portion contacts (352, 353) formed on left and right sides of the heat dissipation groove.

In the LED assembly according to the present invention, the lead portion includes first and second lead portions drawn from the side surface of the case, the first lead portion is connected to the first lead portion contact portion, 2 LED assembly connected to the lid contact.

A backlight unit according to the present invention includes: a light guide plate; And an LED assembly disposed on one side of the light guide plate, wherein the LED assembly includes: a printed circuit board (PCB) including an LED mounting area; And an LED (Light Emitting Diode) disposed in the LED mounting area, wherein the LED has first and second lead portions, a heat dissipating portion separated from the first and second lead portions and disposed with LED chips, Wherein the LED mounting region includes first and second lead contact portions that are in contact with the first and second lead portions, respectively, and a heat dissipation groove that receives a region of the heat dissipation portion.

In the backlight unit according to the present invention, the heat dissipating unit includes an LED chip mounting area in which the LED chip is disposed, and a heat dissipation groove storing area accommodated in the heat dissipation groove and flush with the LED chip mounting area.

In the backlight unit according to the present invention, the PCB includes a base substrate, an insulating layer formed on the base substrate, and a wiring layer formed on the insulating layer, wherein the heat dissipation groove contacts the base substrate via the receiving groove, Backlight unit.

The embodiment according to the present invention can provide an LED assembly that minimizes the width of the opening of the bottom cover, can stably fix the LED assembly, maximizes the heat dissipation effect, and minimizes the thickness of the LED assembly .

1 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.
Figures 2 and 3 are perspective views of an LED according to an embodiment of the present invention.
4 to 7 are views of the lid part and the heat radiating part according to the embodiment of the present invention, viewed from various angles.
8 is a perspective view of a PCB according to an embodiment of the present invention.
Fig. 9 is an enlarged view of an enlarged view of the LED mounting area in which the dotted line portion A in Fig. 8 is enlarged.
10 is a diagram showing an LED mounted in an LED mounting region.

Hereinafter, an LED assembly according to an embodiment of the present invention and a backlight unit having the same will be described in detail with reference to the drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of an apparatus may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification. The dimensions and relative sizes of the layers and regions in the figures may be exaggerated for clarity of illustration.

It will be understood that when an element or layer is referred to as being another element or "on" or "on ", it includes both intervening layers or other elements in the middle, do. On the other hand, when a device is referred to as "directly on" or "directly above ", it does not intervene another device or layer in the middle.

The terms spatially relative, "below," "lower," "above," "upper," and the like, And may be used to easily describe the correlation with other elements or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions.

The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprise "and / or" comprising ", as used in the specification, means that the presence of stated elements, Or additions.

1 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.

1, the liquid crystal display device includes a liquid crystal panel 110, a backlight unit 120, a support main 130, a bottom cover 150, and a top cover 140.

The liquid crystal panel 110 includes a color filter array substrate 112 and a TFT array substrate 114 and a liquid crystal layer (not shown) interposed therebetween. The color filter array substrate 112 and the TFT array substrate And a polarizing plate (not shown) is attached to the outer surface of the light guide plate 114

In this liquid crystal panel 110, liquid crystal cells constituting pixel units are arranged in a matrix form, and liquid crystal cells adjust image transmittance according to image signal information transmitted from a driver driving circuit to form an image.

Specifically, on the inner surface of the TFT array substrate 114, a plurality of gate lines and data lines intersect to define pixels, and thin film transistors (TFTs) are provided at each of the intersections, One-to-one correspondence with the transparent pixel electrodes.

The inner surface of the color filter array substrate 112 is provided with color filters of red (R), green (G), and blue (B) A data line, and a black matrix covering a non-display element such as a thin film transistor. In addition, a transparent common electrode covering these elements is provided.

A gate and a data printed circuit board 117 are connected to each other via a connection member 116 such as a flexible printed circuit board along at least one edge of the liquid crystal panel 110 to support the side of the support main 130, (150).

Although not clearly shown in the drawing, an alignment film for determining the initial alignment direction of the liquid crystal is interposed at the boundary between the color filter array substrate 112 and the TFT array substrate 114 and the liquid crystal layer of the liquid crystal panel 110 A seal pattern is formed along the edges of the color filter array substrate 112 and the TFT array substrate 114 to prevent leakage of the liquid crystal layer filled therebetween.

A backlight unit 120 for supplying light is provided on a back surface of the liquid crystal panel 110 so that a difference in transmittance represented by the liquid crystal panel 110 is externally expressed.

The backlight unit 120 includes an LED assembly 20 arranged along the longitudinal direction of at least one edge of the support main 130, a white or silver reflective plate 125, and a light guide plate 123 And an optical sheet 121 interposed therebetween.

The LED assembly 20 is a light source of the backlight unit 120 and is disposed at one side of the light guide plate 123 so as to face the light incident surface of the light guide plate 123. The LED assembly 20 includes a plurality of LEDs 200, And a PCB 300 on which a plurality of LEDs 200 are mounted at predetermined intervals.

The light guide plate 123 through which the light emitted from the plurality of LEDs 200 is incident is formed so that the light incident from the LED 200 travels through the light guide plate 123 by total reflection several times, And provides a surface light source to the liquid crystal panel 110.

The light guide plate 123 may include a pattern of a specific pattern on the back surface to supply a uniform surface light source.

Here, the pattern may be formed in various shapes such as an elliptical pattern, a polygon pattern, a hologram pattern, and the like in order to guide light incident into the light guide plate 123. The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

The light guide plate 123 may be made of PMMA (polymethyl methacrylate), which has a high strength and is not easily deformed or broken, and has a high transmittance. Here, the light guide plate 123 may be a wedge having a lower surface inclined and a flat upper surface, or a plate type having a lower surface and an upper surface all in parallel. In addition, the thickness of the light guide plate 123 may be relatively larger.

The optical sheet 121 may include a diffusion sheet, a prism sheet, a protective sheet, and a reflective sheet. In some cases, it may be provided with two diffusion sheets, two prism sheets and a reflective sheet. At this time, the diffusion sheet may include a base plate and a bead coating layer formed on the base plate.

The reflection plate 125 is disposed on the back surface of the light guide plate 123 and reflects light passing through the back surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the brightness of light.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140, the support main 130 and the bottom cover 150. The top cover 140 is disposed on the top edge of the liquid crystal panel 110, So as to cover the side surface.

The top cover 140 has a rectangular frame shape bent in a cross section so as to cover the upper and side edges of the liquid crystal panel 110. The top cover 140 is opened at the front of the liquid crystal panel 110 And displays an image to be implemented.

In addition, the bottom cover 150, on which the liquid crystal panel 110 and the backlight unit 120 are mounted and is a basis for assembling the entire structure of the liquid crystal display device, includes a bottom portion and side walls whose edges are vertically bent. A square main support main body 130 having a rectangular opening on the bottom cover 150 and covering the edges of the liquid crystal panel 110 and the backlight unit 120 is disposed between the top cover 140 and the bottom cover 140. [ And is coupled to the cover 150.

In this case, the top cover 140 may be referred to as a case top or a top case, and the support main 130 may be referred to as a guide panel, a main support, or a mold frame, and the bottom cover 150 may be referred to as a bottom cover.

Figures 2 and 3 are perspective views of an LED according to an embodiment of the present invention. 4 to 7 are views of the lid part and the heat radiating part according to the embodiment of the present invention viewed from various angles.

The directional symbol shown in Fig. 2 is a directional symbol indicating a direction in a three-dimensional space. The directional symbol is a c-direction having an angle of 90 degrees with the direction a, a direction b having an angle of 90 degrees with the direction c, b direction and a d direction having an angle of 90 degrees, and an e direction perpendicular to the upper direction with respect to a and b directions in the three-dimensional space and an f direction perpendicular to the down direction with respect to the a and b directions Is defined.

In the following description of the present invention, a description will be given on the basis of a case where each constituent of the present invention is arranged as shown in FIG. 2.

2 to 7, the LED 200 according to the embodiment of the present invention may include a case 201, a heat dissipation unit 230, a lead unit 240, and an LED chip 250.

The heat dissipation unit 230 and the lead unit 240 may be coupled to the case 201 and the LED chip 250 may be mounted on the heat dissipation unit 230.

The heat dissipation unit 230 and the lead unit 240 may be manufactured separately from each other.

The case 201 can receive the heat dissipation unit 230, the lead unit 240 and the LED chip 250 and can serve as a housing.

The case 201 may include first to fourth side walls 202, 203, 204, The heat dissipating unit 230 and the lead unit 240 can be drawn out from the second side wall 203.

The case 201 may include an emission surface 206 through which light is emitted and a reflection surface 207 which is a back surface of the case 201 and faces the emission surface 206.

Since the LED assembly 20 is a side view type, when the LED assembly 20 is fastened to the bottom cover 150, the semi-emitting surface 207 faces the side wall of the bottom cover 150, The exit surface 206 may face the light entering portion of the light guide plate 123.

The side view type LED assembly 20 is advantageous for slimming down the backlight unit. The first to fourth sidewalls 202, 203, 204, and 205 may be integrally formed with each other and may have a rectangular frame shape .

When the case 201 formed by the first to fourth sidewalls 202, 203, 204 and 205 has a rectangular shape, the areas of the first and second sidewalls 202 and 203 are the same as the third and fourth May be greater than the area of the side walls 204, 205. That is, the lateral width (the length in the cd direction) of the first and second sidewalls 202 and 203 may be longer than the lateral width (the length in the ab direction) of the third and fourth sidewalls 204 and 205, The height can be the same.

Each of the first to fourth sidewalls 202, 203, 204, and 205 may include an outer surface 210 and an inner surface 220.

The outer surface 210 may include first through fourth outer surfaces 211, 212, 213, 214.

The first outer surface 211 and the second outer surface 212 may face each other and the third outer surface 213 and the fourth outer surface 214 may face each other.

Wherein the first outer surface 211 is a surface facing the a direction, the second outer surface 212 is a surface facing the b direction, the third outer surface 213 is a surface facing the d direction, 4 The outer surface 214 is the surface facing the c direction.

The inner surface 220 may include first to fourth inner surfaces 221, 222, 223, and 224.

The first to fourth inner surfaces 221, 222, 223, and 224 may be inclined surfaces.

Wherein the first inner surface (221) is an inclined surface such that the inclined surface faces the eb direction, and the second inner surface (222) is a surface inclined so that the inclined surface faces the ea direction, and the third inner surface 223 may be an inclined surface whose inclined surface faces the ec direction, and the fourth inner surface 224 may be an inclined surface whose inclined surface faces the ed direction.

The first to fourth sidewalls 202, 203, 204, and 205 may block the light emitted from the LED chip 250 from leaking in directions a, b, c, and d.

Also, the first to fourth inner surfaces 221, 222, 223, and 224 may form a reflective surface. Therefore, a reflective material such as a transparent resin may be applied to the first to fourth inner surfaces 221, 222, 223, and 224. Thus, the angle formed by the first to fourth inner surfaces 221, 222, 223, and 224 can be controlled by filling the transparent resin with the space formed by the first to fourth inner surfaces 221, 222, 223, and 224.

In addition, the case 201 has a function of reflecting the first to fourth inner surfaces 221, 222, 223, and 224 in a forward direction, that is, an e direction from the LED chip 250 can do.

The transparent resin may include a phosphor and may be mixed with an epoxy resin or a silicone resin containing the phosphor at a certain ratio.

4 to 7, the heat dissipation unit 230 may be made of a metallic material as a part for conducting and discharging heat of high temperature accompanied with the light emission of the LED chip 250 to the outside.

The heat dissipation unit 230 may include an LED chip mounting region 237 and a heat dissipation groove insertion region 238.

The LED chip mounting area 237 may be an area corresponding to the inside of the case 201 and the LED chip 250 may be disposed on the LED chip mounting area 237. Specifically, the LED chip mounting area 237 may be disposed in a central region of the case 201. [ Also, the first to fourth inner surfaces 221, 222, 223, and 224 of the case 201 may be disposed in a space surrounding the case 201.

The heat dissipation groove insertion region 238 may be a region where the heat dissipation unit 230 is exposed to the outside from the second side 203 of the case 201, that is, a region drawn out from the case 201. Specifically, the heat dissipation groove insertion region 238 may be a region of the heat dissipation unit 230 drawn out from the case 201 in the direction b.

The heat dissipation unit 230 may have a plate shape, and a bending area may not be formed. Therefore, the LED chip mounting area 237 and the heat dissipation groove insertion area 238 may be flush with each other.

The lead portion 240 may include a first lead portion 240a disposed on the right side of the heat dissipating portion 230 and a second lead portion 240b disposed on the left side of the heat dissipating portion 230. [

The first lead portion 240a may be one of an anode and a cathode, and the second lead portion 240b may be a remaining one.

Since the first and second lead portions 240a and 240b have shapes corresponding to each other, their shapes will be described with respect to any one of them.

The lead portion 240 may include first to fourth portions 241, 242, 243, and 244. The first part 241 is inserted into the case 201 and may be flush with the heat dissipating part 230 and electrically connected to the LED chip 250 disposed on the heat dissipating part 230 through a wire, .

The second portion 242 may extend perpendicularly to the first portion 241 from one side of the corner of the first portion 241.

The third portion 243 may extend vertically from the second portion 242. The fourth portion 244 may extend vertically from the third portion 243.

5, the second portion 242 is formed to extend in the Y direction from one side edge of the first portion 241, and the third portion 243 is formed to extend in the Y direction from the one side edge of the first portion 241, From part 2 242? And the fourth portion 244 may extend from the third portion 243 in the Z direction.

6, the heat dissipation unit 230 includes a top surface 231, a back surface 232, first to fourth side surfaces 233, 234, 235, and 235 surrounding the top surface 231 and the back surface 232, 236).

The LED chip 250 may be mounted on the upper surface 231 of the heat dissipation unit. The first side surface 233 of the heat dissipation unit may correspond to the second lead portion 240b and the second side surface 234 may correspond to the first lead portion 240a.

The first portion 241 of the second lead portion 240b may include an upper surface 241a and a side surface 241b and a rear surface 241c, And the side surface 241b of the first portion may face the first side surface 233 of the heat dissipation portion. The rear surface 241c of the first portion 241 may be flush with the rear surface 232 of the heat dissipating portion 230. [

7, the length L1 of the long axis of the side part 241b of the first part may be smaller than the length L2 of the long axis of the first and second sides 233 and 234 of the heat radiating part. The length L2 of the longitudinal axis of the first and second side surfaces 233 and 234 of the heat dissipating unit is greater than the length L2 of the longitudinal axis L1 of the side surface 241b of the first unit. The heat dissipation groove-inserting region 238 of the heat dissipating member 230 may be a heat dissipation-groove inserting region 238 of FIG.

Each of the first and second lead portions 240a and 240b of the lead portion 240 may be electrically connected to the LED chip 250 through a wire.

The heat dissipation unit 230 and the lead unit 240 may be formed of the same metal and may be made of any one of copper, silver, aluminum, iron, nickel, and tungsten, or an alloy material containing at least one of them. .

The outer surface of the heat dissipation unit 230 and the lead unit 240 may be plated with one of metal materials such as nickel, silver, and gold or an alloy material containing at least one of them.

When the positive power supply (+) and the negative power supply (-) are supplied through the first and second lead portions 240a and 240b, the LED chip 250 mounted on the heating unit 230 emits light And some of the light emitted from the LED chip 250 excites the phosphor in the transparent resin so as to be mixed with the light emitted by the phosphor to emit white light.

The heat dissipation unit 230 dissipates the heat of the high temperature generated from the LED 200 more effectively, thereby preventing the lifetime and the brightness of the LED 200 from changing.

8 is a perspective view of a PCB according to an embodiment of the present invention. 9 is an enlarged view of an enlarged view of the LED mounting area in which the dotted line portion A in Fig. 8 is enlarged. And FIG. 10 is a view showing an LED mounted on the LED mounting region.

Referring to FIGS. 8 to 10, the PCB 300 may include a plurality of LED mounting regions 350, and LEDs 200 may be mounted on each of the plurality of LED mounting regions 350. The plurality of LEDs 200 may be mounted on the PCB 300 by a surface mount technology (SMT) at regular intervals.

The plurality of LEDs 200 are side view LEDs and the emitting surface 206 of the LEDs 200 is directed to a light incoming portion provided on a side surface of the light guide plate 123.

The plurality of LEDs 200 may be supplied with power through a power supply line formed in the wiring layer 330 on the PCB 300.

The plurality of LEDs 200 emit light having colors of red (R), green (G), and blue (B), and the plurality of RGB LEDs 200 are turned on at once to realize white light by color mixing It is possible.

Meanwhile, the LED 200 implementing white light may be composed of the blue LED chip 250 and the yellow phosphor, and the LED chip 250 may be a UVLED chip. When the UV LED chip is used, (G), and blue (B), and the luminescent color can be selected by controlling the compounding ratio of the red (R), green (G), and blue (B) phosphors.

The PCB 300 may include a base substrate 310, an insulating layer 320 formed on a top surface of the base substrate 310, and a wiring layer 330.

The base substrate 310 supports the wiring layer 330 and the insulating layer 320 and other components in an upper layer thereof and discharges the heat generated from the plurality of LEDs 200 to the bottom surface.

An adhesive layer 340 may be formed on the back surface of the base substrate 310 of the PCB 300 and the adhesive layer 340 may serve to fix the base substrate 310 to the bottom cover 150 .

The base substrate 310 may be formed of a metal having a high thermal conductivity such as aluminum (Al) or copper (Cu), or may be coated with a heat transfer material to improve a heat dissipation function.

Alternatively, a heat sink (not shown) such as a heat sink may be provided on the back surface of the base substrate 310 to receive heat from the respective LEDs 200 and to emit the heat efficiently.

A wiring layer 330 including a plurality of metal wirings (not shown) formed by patterning a conductive material is formed on the base substrate 310. An insulating layer (not shown) is formed between the base substrate 310 and the wiring layer 330 320 may be positioned to electrically isolate the base substrate 310 from a plurality of metal interconnects (not shown).

Referring to FIG. 9, a heat dissipation groove 351 and first and second lead portion contacts 352 and 353 may be formed in the LED mounting region 350.

The heat dissipation groove 351 may be a groove having a shape corresponding to the heat dissipation groove insertion region 383 of the heat dissipation unit 230. The first and second sides 233 and 234 of the heat dissipation unit in FIG. (L2-L1), which is the difference between the length (L2) of the long axis of the first part (241a) and the length (L1) of the long axis of the side part (241b) of the first part.

The heat dissipation unit 230 may be inserted into the heat dissipation groove 351 and the heat dissipation unit 230 may be fixed to the base substrate 310 in the heat dissipation groove 351 through a shoulder ring 370.

The heat dissipation unit 230 is inserted into the heat dissipation groove 351 to rapidly transfer heat generated from the LED chip 250 onto the PCB 300.

In addition, when the heat dissipation unit 230 and the base substrate 310 are formed of the same metal material, heat dissipation can be maximized by metal alloying.

Particularly, the depth of the heat dissipation groove 351 can be set to the upper region of the base substrate 310, so that the heat dissipation unit 230 can be brought into direct contact with the base substrate 310. In order to maximize the heat dissipation effect, the heat dissipation unit 230 is brought into direct contact with the base substrate 310 having high thermal conductivity in consideration of the low thermal conductivity of the insulation layer 320.

On the other hand, first and second lead portion contact portions 352 and 353 may be formed on the left and right sides of the heat dissipation groove 351.

The first lead portion 240a may contact the first lead portion contact portion 352 and the second lead portion 240b may contact the second lead portion contact portion 353. [

The electrodes on the wiring layer 330 may be exposed to the first and second lead portion contacting portions 352 and 353 and the lead portions 240 and the first and second lead portion contacting portions may be exposed through a process of a shoulder ring 370. [ And the two lead portion contacting portions 352 and 353 can be electrically connected.

Also, the second and third portions 242 and 243 of the lead portion 240 may contact the first and second lead portion contacting portions 352 and 353.

The first and second lead portions 240a and 240b are separated from each other so that the heat dissipating portion 230 and the lead portion 240 are both drawn out from the second side surface 203 of the case 201, The first and second lead portions 240a and 240b and the heat dissipating portion 230 separated from the first and second lead portions 240a and 240b may be inserted into the heat dissipating groove 351. [ The heat dissipation path is formed not only as a base substrate 310 but also as the base substrate 310 through the heat dissipation unit 230 via the lead unit 240 and the heat dissipation unit 230, it is possible to reduce the length of the path and thus to enable the rapid release of heat.

Also, the LED 200 may be fixed on the PCB 300 by inserting the heat dissipating unit 230 into the heat dissipating groove 351. Accordingly, it is possible to obtain a tilt improvement effect by preventing the LED 200 from flowing in the LED mounting region 350.

In addition, the distance L3 between the first and second side surfaces 202 and 203 in the case 201 of the LED 200 can be minimized, thereby achieving a slimming effect of the backlight unit.

Specifically, if the thickness L3 of the case 201 is reduced to reduce the size of the backlight unit, the size of the heat dissipating unit 230 may be reduced.

In this case, since the heat dissipation unit 230 has a planar shape without the bent region, it is possible to secure an area where the LED chip 250 can be disposed in the heat dissipation unit 230 and to secure an area for heat conduction It is possible to overcome the difficulties.

If the heat dissipating unit 230 is bent, it is difficult to secure a region for the LED chip 250 or to secure a heat conduction region, There may be technical difficulties in bending itself. However, as in the embodiment of the present invention, it is possible to maximize the effect of heat dissipation and stable mounting of the LED chip 250 by using the side view type LED 200 having the heat dissipating unit 230 having no bending area, The tilt prevention of the light source unit 200 and the slimming effect of the backlight unit can be achieved at the same time.

Furthermore, in the case of a product in which the slimness of the backlight unit is very important, such as a small display device such as a mobile device, the effect of the embodiment of the present invention can be maximized.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

29 LED assembly
110 liquid crystal panel
112 color filter array substrate
114 TFT array substrate
116 connecting member
117 printed circuit board
120 Backlight Unit
121 Optical sheet
123 light guide plate
125 reflector
130 Support Main
140 Top cover
150 bottom cover
151 side wall
200 LED
201 case
202 first side wall
203 second side wall
203a heat radiating portion storage portion
204 third side wall
205 fourth side wall
206 exit surface
207 reflective surface
210 outer surface
211 first outer surface
212 second outer surface
213 Third outer surface
214 fourth outer surface
220 inner surface
221 First inner surface
222 second inner surface
223 third inner surface
224 fourth inner surface
230 heat sink
231 Top surface of the heat-
232 Rear of the heat sink
233 First side of the heat sink
234 Second side of the heat sink
235 Third side of heat sink
236 fourth side of heat sink
237 LED chip mounting area
238 Heat sink groove insertion area
240 lead portion
240a,
240b,
241 Part 1
241a Top surface of the first part
241b Side of Part 1
241c Rear of the first part
242 Part 2
243 Part 3
244 Part 4
250 LED chips
300 PCB
310 base substrate
311 wiring layer unformed region
312 wiring layer formation region
313 Bottom Cover Insertion Area
320 insulation layer
330 wiring layer
340 adhesive layer
350 LED mounting area
351 heat sink groove
352 First lead portion contact portion
353 Second lead portion contact portion
370 Shoulder ring

Claims (9)

A printed circuit board (PCB) including a sequentially stacked wiring layer, an insulating layer, and a base substrate and including at least one heat dissipating groove; And
And a LED (Light Emitting Diode) having a lead portion connected to the wiring layer, a heat dissipation portion inserted into the heat dissipation groove, and a case accommodating the lead portion and the heat dissipation portion and including a light exit surface,
Wherein the heat dissipation unit includes an LED chip mounting area and a heat dissipation groove insertion area,
And the heat dissipation groove insertion region is drawn out from a side surface of the case and inserted into the heat dissipation groove. The method according to claim 1,
Wherein the LED chip mounting region and the heat dissipation groove inserting region are flush with each other. The method according to claim 1,
Wherein the LED is a side view type LED assembly. The method according to claim 1,
And the heat dissipation unit contacts the base substrate through the heat dissipation groove. The method according to claim 1,
And the PCB includes first and second lead contact portions (352, 353) formed on left and right sides of the heat dissipation groove. 6. The method of claim 5,
Wherein the lead portion includes first and second lead portions drawn from a side surface of the case,
Wherein the first lead portion is connected to the first lead portion contact portion, and the second lead portion is connected to the second lead portion contact portion. A light guide plate; And
And an LED assembly disposed on one side of the light guide plate,
The LED assembly includes:
A PCB (printed circuit board) including an LED mounting area; And
And an LED (Light Emitting Diode) disposed in the LED mounting region,
Wherein the LED includes first and second lead portions and a heat dissipating portion which is separated from the first and second lead portions and in which the LED chip is disposed,
Wherein the LED mounting region includes first and second lead contact portions that are in contact with the first and second lead portions, respectively, and a heat dissipation groove that receives one region of the heat dissipation portion. 8. The method of claim 7,
Wherein the heat dissipating unit includes an LED chip mounting area in which the LED chip is disposed, and a heat dissipating groove storing area accommodated in the heat dissipation groove and flush with the LED chip mounting area. 9. The method of claim 8,
The PCB,
A semiconductor device comprising: a base substrate; an insulating layer formed on the base substrate; and a wiring layer formed on the insulating layer,
Wherein the heat dissipation groove is in contact with the base substrate through the receiving groove.

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