KR101990528B1 - LED assembly and liquid crystal display device using the same - Google Patents

Abstract

The present invention relates to a liquid crystal display device, and more particularly to an LED assembly used as a light source of a liquid crystal display device.
A feature of the present invention is that the PCB of the LED assembly is formed such that the power wiring layer and the insulating layer are formed only on one edge side in the longitudinal direction of the PCB and the PCB base is exposed on the other edge side, The lead is formed to be in direct contact with the PCB base of the PCB.
Accordingly, the heat of the high temperature generated by the use of the LED can be more effectively discharged to the outside of the liquid crystal display device, thereby preventing the lifetime and the luminance of the LED from being changed as the temperature rises.
Therefore, it is possible to prevent the display quality of the liquid crystal display device from deteriorating due to unevenness in luminance.

Description

[0001] The present invention relates to an LED assembly and a liquid crystal display (LCD)

The present invention relates to a liquid crystal display device, and more particularly to an LED assembly used as a light source of a liquid crystal display device.

A liquid crystal display device (LCD), which is advantageous for moving picture display and has a large contrast ratio and is actively used in TVs and monitors, exhibits optical anisotropy and polarization properties of a liquid crystal, And the like.

Such a liquid crystal display device has a liquid crystal panel in which a liquid crystal panel is interposed between two adjacent substrates through a liquid crystal layer as an essential component and changes the alignment direction of the liquid crystal molecules in an electric field in the liquid crystal panel to realize a difference in transmittance do.

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. To this end, a backlight unit having a light source is disposed on the back of the liquid crystal panel.

Here, as a light source of the backlight unit, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, a light emitting diode (LED) .

In particular, LEDs are widely used as light sources for displays, having characteristics such as small size, low power consumption, and high reliability.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.

As shown, a typical liquid crystal display device includes a liquid crystal panel 10, a backlight unit 20, a support main 30, a cover bottom 50, and a top cover 40.

The liquid crystal panel 10 is constituted by first and second substrates 12 and 14 which are in contact with each other with a liquid crystal layer interposed therebetween, which plays a key role in image display.

A backlight unit 20 is provided behind the liquid crystal panel 10.

The backlight unit 20 includes an LED assembly 29 composed of an LED arranged along the longitudinal direction of at least one edge of the support main body 30 and an LED PCB (printed circuit board) 29b A reflective plate 25 of white or silver color resting on the cover bottom 50 and a light guide plate 23 resting on the reflective plate 25 and a plurality of optical sheets 21 interposed therebetween.

The liquid crystal panel 10 and the backlight unit 20 are covered with a top cover 40 covering the upper edge of the liquid crystal panel 10 in a state where the edge is surrounded by the support main 30 having a rectangular frame shape, And the cover bottoms 50 are integrally joined to each other through the support main body 30.

And reference numerals 19a and 19b denote polarizing plates attached to the front and back surfaces of the liquid crystal panel 10 to control the polarization direction of light, respectively.

Here, the LED 29a is a light emitting device, and the temperature is rapidly raised according to the use time, and such a temperature rise has a characteristic accompanied by a luminance change. Therefore, one of the most important matters when the LED 29a is used as the light source of the backlight unit 20 is the heat radiation design according to the temperature rise of the LED 29a.

However, since the conventional liquid crystal display device does not have a specific way of rapidly discharging the high-temperature heat generated from the LED 29a to the outside, the temperature of the LED 29a gradually increases during use, The change in the luminance eventually causes the image quality to deteriorate.

Further, the life of the LED 29a is shortened.

SUMMARY OF THE INVENTION It is a first object of the present invention to provide a liquid crystal display device capable of effectively dissipating heat generated from an LED by heat.

It is a second object of the present invention to prevent the lifetime of the LED from being shortened or the image quality of the liquid crystal display device being deteriorated due to a change in luminance.

In order to achieve the above object, the present invention provides a printed circuit board comprising a PCB base, an insulating layer sequentially formed on the other edge side of the PCB base so as to expose one edge side of the PCB base, ; And an LED including a heat dissipating metal plate mounted on the PCB and in contact with the exposed PCB base and having an LED chip mounted thereon.

The heat dissipation metal plate may include a heat dissipation unit for mounting the LED chip and a pair of heat dissipation leads extending from the heat dissipation unit, a pair of positive electrode and negative electrode leads are formed on both sides of the heat dissipation unit, And is connected to the metal wiring formed on the power wiring layer.

A cover layer is formed on the power wiring layer or the upper portion of the PCB base except a region where the anode and the cathode lead are connected to the metal wiring and a region where the heat radiation lead and the PCB base are in contact, The thickness of the base is different between the one edge side and the other edge side in the longitudinal direction of the PCB so that the PCB base surface and the surface of the power wiring layer are flush with each other.

The LED includes a case having upwardly protruding sidewalls which surrounds the edge of the LED chip mounted on the heat dissipating metal plate and is filled in the sidewall above the LED chip and includes a transparent resin including a phosphor do.

According to another aspect of the present invention, there is provided a PCB comprising: a PCB base; an insulating layer sequentially formed on the other edge side of the PCB base so as to expose one edge side of the PCB base; An LED assembly mounted on the PCB, the LED assembly including an LED including a heat dissipating metal plate in contact with the exposed PCB base and having an LED chip mounted thereon; A backlight unit including the LED assembly and an optical sheet seated on the LED assembly; A liquid crystal panel mounted on the backlight unit; A backlight unit and a support main body surrounding an edge of the liquid crystal panel; A cover bottom formed in close contact with the support main back surface; And a top cover which rims the edge of the liquid crystal panel and is assembled with the support main and cover bottoms.

At this time, the LED assembly is located on the same plane as the LED assembly, and a light guide plate is disposed under the optical sheet.

As described above, according to the present invention, the PCB of the LED assembly is formed such that the power wiring layer and the insulating layer are formed only on one edge side in the longitudinal direction of the PCB and the PCB base is exposed on the other edge side, The heat dissipation lead of the heat dissipation metal plate is directly brought into contact with the PCB base of the PCB so that the heat of high temperature generated by the use of the LED can be more effectively discharged to the outside of the liquid crystal display device, There is an effect that it is possible to prevent a change from occurring.

Therefore, it is possible to prevent the display quality of the liquid crystal display device from deteriorating due to uneven brightness.

1 is a sectional view of a liquid crystal display module using a general LED as a light source.
2 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.
Figure 3a is a perspective view of the LED of Figure 2;
Figure 3b is a plan view of Figure 3a.
4A is a perspective view schematically illustrating an LED assembly according to an embodiment of the present invention.
4B is an enlarged perspective view of a portion of FIG. 4A; FIG.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

2 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.

1, the liquid crystal display device includes a liquid crystal panel 110, a backlight unit 120, a support main 130, a cover bottom 150, and a top cover 140.

First, the liquid crystal panel 110 plays a key role in image display and includes first and second substrates 112 and 114 which are bonded to each other with a liquid crystal layer interposed therebetween.

At this time, a plurality of gate lines and data lines intersect with each other on the inner surface of the first substrate 112, which is usually referred to as a lower substrate or an array substrate, although not clearly shown in the figure, And a thin film transistor (TFT) is provided at each of the intersections, and is connected in a one-to-one correspondence with the transparent pixel electrodes formed in the respective pixels.

On the inner surface of the second substrate 114 called an upper substrate or a color filter substrate, color filters of red (R), green (G), and blue (B) And a black matrix for covering non-display elements such as a gate line, a data line, and a thin film transistor. In addition, a transparent common electrode covering these elements is provided.

A gate and a data printed circuit board 117 are connected to each other via a connection member 116 such as a flexible circuit board along at least one edge of the liquid crystal panel 110 so that the support main 130 side, (150).

Although not clearly shown in the drawing, an alignment film for determining the initial alignment direction of the liquid crystal is interposed at the boundary between the two substrates 112 and 114 of the liquid crystal panel 110 and the liquid crystal layer, and a liquid crystal layer A seal pattern is formed along edges of both the substrates 112 and 114 to prevent leakage of the substrate.

At this time, polarizers (not shown) are attached to the outer surfaces of the first and second substrates 112 and 114, respectively.

A backlight unit 120 for supplying light is provided on a back surface of the liquid crystal panel 110 so that a difference in transmittance represented by the liquid crystal panel 110 is externally expressed.

The backlight unit 120 includes an LED assembly 200 arranged along the longitudinal direction of at least one edge of the support main body 130, a white or silver reflective plate 125, and a light guide plate 123 And an optical sheet 121 interposed therebetween.

The LED assembly 200 described above is a light source of the backlight unit 120 and is disposed at one side of the light guide plate 123 so as to face the light incident side of the light guide plate 123. The LED assembly 200 includes a plurality of LEDs 210, And a PCB 220 on which a plurality of LEDs 210 are mounted with a predetermined distance therebetween.

4A) and the power application unit B (see FIG. 4A), and the LED 210 is divided into the LED chip 211, (See FIG. 3A) is placed on the heat dissipating metal plate 213 (see FIG. 3A) directly connected to the heat dissipating portion A (see FIG. 4A) of the PCB 220, So that it is effectively discharged outside the liquid crystal display device.

As a result, it is possible to prevent the lifetime and the luminance change of the LED 210 from occurring due to the temperature rise. Let's take a closer look at this later.

The light guide plate 123 on which the light emitted from the plurality of LEDs 210 is incident is formed so that the light incident from the LED 210 travels through the light guide plate 123 by total reflection several times and spreads evenly over a wide area of the light guide plate 123 And provides a surface light source to the liquid crystal panel 110.

The light guide plate 123 may include a pattern of a specific pattern on the back surface to supply a uniform surface light source.

Here, the pattern may be formed in various shapes such as an elliptical pattern, a polygon pattern, a hologram pattern, and the like in order to guide light incident into the light guide plate 123. The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

The reflection plate 125 is disposed on the back surface of the light guide plate 123 and reflects light passing through the back surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the brightness of light.

The plurality of optical sheets 121 on the light guide plate 123 include a diffusion sheet and at least one light condensing sheet and diffuse or condense light passing through the light guide plate 123 to form a more uniform surface Allow the light source to enter.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140, the support main body 130 and the cover bottom 150. The top cover 140 is disposed on the upper surface of the liquid crystal panel 110, So as to cover the side surface.

Here, the top cover 140 has a rectangular frame shape bent in a "? &Quot; shape so as to cover the top and side edges of the liquid crystal panel 110, As shown in Fig.

In addition, the cover bottom 150, on which the liquid crystal panel 110 and the backlight unit 120 are mounted and which is the basis for assembling the entire apparatus of the liquid crystal display apparatus, is composed of a horizontal plane and an edge portion whose edge is vertically bent.

The support main body 130 having a square shape and having one opened edge which is placed on the cover bottom 150 and covers the edges of the liquid crystal panel 110 and the backlight unit 120 is supported by the top cover 140, Is combined with the bottoms (150).

The cover main body 130 may be referred to as a guide panel or a main support or a mold frame. The cover main body 130 may be referred to as a bottom cover or a bottom cover, I will.

4A) and the power application unit B (see FIG. 4A), and the LED 210 is divided into the LED chip 211 (see FIG. 4A) and the LED chip 210 3A) is placed on the heat dissipating metal plate 213 (213 in FIG. 3A) directly connected to the heat dissipating portion A (see FIG. 4A) of the PCB 220, Thereby efficiently discharging the heat of high temperature from the outside.

As a result, it is possible to prevent the lifetime and the luminance change of the LED 210 from occurring due to the temperature rise.

FIG. 3A is a perspective view of the LED of FIG. 2, and FIG. 3B is a plan view of FIG. 3A.

As shown in the drawing, the LED 210 is mounted on the heat-dissipating metal plate 213 to emit light. The heat-dissipating metal plate 213 radiates high-temperature heat accompanying the light emission of the LED chip 211 And is made of metal as a part for conducting and discharging to the outside.

The heat dissipating metal plate 213 includes a heat dissipating plate 213a on which the LED chip 211 is mounted and a pair of heat dissipating leads 213b extending from the heat dissipating plate 213a and exposed to the outside of the case 215, A pair of anode and cathode leads 217 which are exposed to the outside of the case 215 and are electrically connected to each other through the LED chip 211 and the wire 214 are located on both sides of the cathode 213a.

The heat dissipating metal plate 213 and the anode and cathode leads 217 are located on the case 215 serving as a housing and are formed as metal patterns separated from each other on the case 215.

The heat dissipating metal plate 213 and the anode and the anode lead 217 may be formed of the same metal such as copper (Cu), silver (Ag), aluminum (Al), iron (Fe), nickel (Ni), and tungsten ), Or an alloy material containing at least one of them, and the outer surface of the metal material may be any one of nickel (Ni), silver (Ag) and gold (Au) It may be plated with an alloy material.

The case 215 is configured to have a side wall 215a projecting upwardly and upwardly along the side surface of the LED chip 211, and the inner surface of the side wall 215a forms a reflecting surface.

The side walls 215a serve to block or forwardly reflect the light emitted laterally from the LED chip 211 and form a region filled with the transparent resin 212 therein.

That is, a storage space is defined above the LED chip 211 by a side wall 215a formed to surround the LED chip 211, and the transparent resin 212 is filled in the storage space, Thereby controlling the angle of light.

At this time, the transparent resin 212 includes a phosphor (not shown), and a phosphor (not shown) may be mixed with a transparent epoxy resin (not shown) or a silicone resin (not shown) at a certain ratio.

When the power supply (+) and the ground power supply (-) are supplied to the LED chip 211 through a pair of anode and cathode leads 217, the LED chip 211 emits light. A part of the emitted light is excited by the fluorescent material (not shown) of the transparent resin 212, mixed with the light emitted by the fluorescent material (not shown) to emit white light, and the white light is emitted to the outside of the LED 210 .

The LED 210 according to the embodiment of the present invention is configured such that the heat dissipating lead 213b exposed to the outside of the case 215 is in direct contact with the PCB base 221 (see FIG. 4A) of the PCB 220 .

Accordingly, the heat of the high temperature generated from the LED 210 is more effectively transmitted to the PCB 220 (FIG. 2), and the heat of the high temperature generated from the LED 210 is more effectively discharged to the outside of the LCD So that it is possible to prevent the lifetime and the luminance change of the LED 210 from being generated as the temperature rises.

4A is a perspective view schematically showing an LED assembly according to an embodiment of the present invention, and FIG. 4B is a perspective view enlarging a part of FIG. 4A.

As shown in the figure, the LED assembly 200 includes a plurality of LEDs 210 and a PCB 220 having a plurality of LEDs 210 spaced apart from each other by a surface mount technology (SMT) do.

A plurality of LEDs 210 are connected in series through power supply lines (not shown) formed on the PCB 220 to receive power.

Here, the plurality of LEDs 210 emit light having colors of red (R), green (G), and blue (B), respectively, and by turning on the plurality of RGB LEDs 210 at once, Can be implemented.

Meanwhile, the LED 210 that emits white light may be formed of a blue LED chip 211 and a yellow phosphor, and the LED chip 211 may be a UVLED chip. When a UVLED chip is used, a phosphor (not shown) (R), green (G) and blue (B) phosphors, and the luminescent color can be selected by controlling the compounding ratio of red (R), green (G) and blue have.

Alternatively, the LEDs 210a and 210b constituted by the LED chips (211 in FIG. 3) emitting all the RGB colors may be used so that the white light is realized in each of the LEDs 210a and 210b, LEDs 210a and 210b emitting full white including LEDs 210a and 210b may be used.

The PCB 220 includes a power wiring layer 225 formed with metal wiring lines (not shown), an insulating layer 223 and a PCB base 221. The PCB base 221 includes a power wiring layer 225, The light emitting diode 223 and other components are mounted on and supported on the upper layer, and the heat generated from the plurality of LEDs 210 is discharged to the bottom surface side.

The PCB base 221 may be formed of a metal having a high thermal conductivity such as aluminum (Al) or copper (Cu), or may be coated with a heat transfer material to improve the heat radiation function.

Alternatively, a heat sink (not shown) such as a heat sink may be provided on the back surface of the PCB base 221 to receive heat from the respective LEDs 210 and to discharge the heat efficiently.

A power supply wiring layer 225 including a plurality of metal wirings (not shown) formed by patterning a conductive material is formed on the PCB base 221. The power supply wiring layer 225 is formed between the PCB base 221 and the power supply wiring layer 225, Layer 223 is positioned to electrically isolate the PCB base 221 from a number of metal interconnects (not shown).

A plurality of LEDs 210 are arranged in series on the PCB 220 so as to be spaced apart from each other by a predetermined distance and electrically connected to a metal wiring (not shown) of the power wiring layer 225 on the PCB 220, And the leads 217 are electrically connected.

At this time, each pair of anode and cathode leads 217 of the neighboring LEDs 210 are formed so as not to contact each other, and each LED 210 is connected to the power source (+) through the anode and cathode leads 217 A ground power source (-) is supplied, and each of the LEDs 210 emits light.

Here, the LED assembly 200 of the present invention is configured such that the metal wiring (not shown) of the PCB 220 that supplies power to the plurality of LEDs 210 is formed only on one edge side in the longitudinal direction of the PCB 220, The PCB 220 may be divided into a power applying portion B in which the power wiring layer 225 and the insulating layer 223 are formed and a heat dissipating portion A in which only the PCB base 221 is formed.

That is, since the metal wiring (not shown) is formed only on the one edge side in the longitudinal direction of the PCB 220, the power wiring layer 225 is formed only on the one edge side in the longitudinal direction of the PCB 220, The insulating layer 223 interposed between the power supply wiring layer 221 and the power supply wiring layer 225 is formed only on the one edge side in the longitudinal direction of the PCB 220.

Accordingly, the PCB base 221 is exposed to the outside on the other edge side of the PCB 220.

The LED 210 mounted on the PCB 220 is electrically connected to the metal wiring (not shown) of the power supply wiring layer 225 of the PCB 220 by connecting the positive electrode lead 217 and the negative electrode lead 217, 213b are positioned so as to be connected to the exposed PCB base 221.

Accordingly, when high-temperature heat is generated from the LED chip 211 mounted on the heat-radiating metal plate 213 of the LED 210, the high-temperature heat generated from the LED chip 211 flows through the heat- 213b to the PCB base 221 of the PCB 220 so that the heat of the high temperature generated from the LED 210 can be more effectively discharged to the outside of the LCD.

Therefore, it is possible to prevent the lifetime and the luminance change of the LED 210 from occurring due to the temperature rise.

When the heat dissipating unit A is not separately formed on the PCB 220, the high-temperature heat of the heat dissipating metal plate 213 on which the LED chip 211 is mounted passes through the heat dissipating reed 213b, And the high temperature heat transferred to the power supply wiring layer 225 is transferred to the PCB base 221 through the insulating layer 223.

Since the thermal conductivity of the insulating layer 223 is extremely low, 0.2 to 20 W / mk, the heat of the high temperature transferred from the heat dissipating metal plate 213 passes through the insulating layer 223, It is difficult to radiate heat generated at high temperature to the outside.

On the other hand, the thermal conductivity of the PCB base 221 formed of a metal having high thermal conductivity such as aluminum (Al) or copper (Cu) is 170 to 380 W / mk, The heat radiation portion 213b of the heat dissipation metal plate 213 on which the LED chip 211 is mounted is in direct contact with the PCB base 221 by forming the heat dissipation portion A without the heat dissipation portion 223.

Therefore, the heat of the heat radiating metal plate 213 can be more efficiently transferred to the PCB base 221.

Accordingly, the heat of the high temperature generated from the LED 210 can be more effectively discharged to the outside of the liquid crystal display device.

The LED assembly 200 of the present invention is formed such that the heat dissipation lead 213b of the heat dissipation metal plate 213 on which the LED chip 211 is mounted is in direct contact with the PCB base 221 of the PCB 220 , The heat of the high temperature generated according to the use of the LED 210 can be more effectively discharged to the outside of the liquid crystal display device.

As a result, it is possible to prevent the lifetime and the luminance change of the LED 210 from occurring due to the temperature rise.

In order to prevent the PCB 220 from generating a step between the heat dissipating unit A formed only of the PCB base 221 and the power applying unit B formed with the power wiring layer 225 and the insulating layer 223, The PCB base 221 of the PCB 220 is formed to have a step.

That is, the thickness d2 of the PCB base 221 of the power applying unit B where the power wiring layer 225 and the insulating layer 223 of the PCB 220 are formed is smaller than the thickness d2 of the heat dissipating unit A And the surfaces of the power applying section B and the heat dissipating section A are formed to be flush with each other.

A cover layer 227 may be formed on the power wiring layer 225 as an organic or inorganic insulating material for protecting the power wiring layer 225. The cover layer 227 may include a positive electrode and a negative electrode lead 217, The anode lead 217 of the LED 210 and the anode lead 217 of the power wiring layer 225 are formed so as to be in contact with the wiring layer 225 and the region where the heat radiation lead 213b and the PCB base 211 are in contact, It is preferable that the cover layer 227 is not disturbed in receiving a signal from a metal wiring (not shown) or transferring heat of high temperature to the PCB base 211 through the heat dissipating lead 213b.

At this time, the cover layer 227 is made of a white material capable of reflecting light, and may include a reflection function as well as an insulation function.

That is, the cover layer 227 reflects light emitted from the plurality of LEDs 210 to the side of the LED 210 by using a white material having a high light reflectivity, Thereby increasing the amount of light incident into the light guide plate (123 in FIG. 2), thereby improving the light efficiency.

The following table (1) is simulation data measuring the heat radiation effect of the LED assembly 200 according to the embodiment of the present invention.

Sample 1 Sample 2 LED chip 92 ° C 85 ℃ Anode and cathode leads 85 ℃ 79 ℃ Heat-conducting lead 80 ℃ PCB 84 ℃ 78 ℃

Sample 2 is a structure of an LED assembly 200 according to an embodiment of the present invention. Sample 2 includes a power supply unit B and a PCB 220 on a PCB 220, The heat dissipating metal plate 213 having the heat dissipating unit A to which the base 221 is exposed and in which the LED chip 211 is mounted is in direct contact with the PCB base 221.

 Referring to Table 1, it can be seen that the temperature of the LED chip 211, the anode lead 211, and the PCB 220 were both lower than Sample 1.

This shows that Sample 2 implements a more effective heat dissipation design than Sample 1.

That is, the sample 2 exposes the PCB base 221 of the PCB 220, and the heat dissipating metal plate 213 on which the LED chip 211 is mounted comes into direct contact with the PCB base 221, The heat generated by the high temperature is more effectively transmitted to the PCB 220, so that the heat of the high temperature generated from the LED 210 is more effectively emitted to the outside.

Therefore, even if the temperature of the LED 210 increases according to the use time of the LED 210, the heat of the high temperature generated from the LED 210 can be effectively dissipated to the outside, It is possible to prevent a change in life and luminance from occurring.

In addition, it is possible to prevent the lifetime of the LED 210 from being shortened or the image quality of the liquid crystal display device to be deteriorated due to the luminance change, thereby improving the reliability of the product.

The LED assembly 200 of the present invention is formed such that the heat dissipation lead 213b of the heat dissipation metal plate 213 on which the LED chip 211 is mounted is in direct contact with the PCB base 221 of the PCB 220 , The heat of the high temperature generated according to the use of the LED 210 can be more effectively discharged to the outside of the liquid crystal display device.

As a result, it is possible to prevent the lifetime and the luminance change of the LED 210 from occurring due to the temperature rise.

In the above description, the sidelight method is exemplified as a liquid crystal display device in which the LED assembly 200 according to the present invention can be utilized for convenience. However, in the case of the direct light type, And a plurality of LED assemblies 200 according to an embodiment of the present invention may be provided on the reflector 125 (FIG. 2).

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

200: LED assembly
210: LED, 211: LED chip, 212: transparent resin
213: heat dissipating metal plate (213a: heat dissipating lead)
214: wire, 215: case, 217: anode and cathode lead
220: PCB
221: PCB base, 223: insulating layer, 225: power wiring layer
227: cover layer
A: Heat dissipating part, B: Power applying part

Claims (10)

A PCB including first and second PCB bases, an insulating layer sequentially formed on the second PCB base to expose the first PCB base, and a power wiring layer;
And a heat dissipation metal plate mounted on the PCB, the heat dissipation metal plate being in contact with the second PCB base through the first PCB base and the heat radiation reed,
.
The method according to claim 1,
Wherein the heat dissipation metal plate comprises a heat dissipation plate on which the LED chip is mounted and a pair of the heat dissipation leads extending from the heat dissipation plate.
3. The method of claim 2,
Wherein a pair of the anode and the cathode leads are formed on both sides of the heat sink, and the anode and the cathode leads are connected to the metal wiring formed on the power wiring layer.
The method of claim 3,
The power wiring layer or an upper portion of the first and second PCB bases may include a region where the anode and the cathode leads are connected to the metal wiring and a region where the heat radiation lead contacts the first and second PCB bases An LED assembly in which a cover layer is formed.
The method according to claim 1,
Wherein the first PCB base is flush with the power wiring layer located above the second PCB base, and the first PCB base is thicker than the second PCB base.
The method according to claim 1,
Wherein the LED includes a case having upwardly protruding sidewalls which surrounds the edge of the LED chip mounted on the heat dissipating metal plate and is filled in the sidewall above the LED chip and includes a transparent resin including a phosphor, LED assembly.
A PCB including first and second PCB bases, an insulating layer sequentially formed on the second PCB base to expose the first PCB base, and a power wiring layer;
And a heat dissipating metal plate mounted on the PCB, the heat dissipating metal plate being in contact with the first PCB base through the heat dissipating lead, and the LED chip being in contact with the second PCB base through the positive and negative leads, Assembly;
A backlight unit including the LED assembly and an optical sheet seated on the LED assembly;
A liquid crystal panel mounted on the backlight unit;
A backlight unit and a support main body surrounding an edge of the liquid crystal panel;
A cover bottom formed in close contact with the support main back surface;
A cover main body and a cover bottom,
And the liquid crystal display device.
8. The method of claim 7,
Wherein the light guide plate is disposed on the same plane as the LED assembly, and the light guide plate is disposed under the optical sheet. 5. The method of claim 4,
Wherein the cover layer is made of a white material capable of reflecting light.
8. The method of claim 7,
The power wiring layer or the first and second PCB bases,
A cover layer is disposed except for a region where the anode and the cathode lead are connected to the power wiring layer and a region where the heat radiation lead and the first PCB base are in contact,
Wherein the cover layer is made of a white material capable of reflecting light.

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