KR102146288B1 - Led assembly and backlight unit - Google Patents

Abstract

An LED assembly according to an embodiment of the present invention includes: a base substrate including an area where a wiring layer is not formed and an area where a wiring layer is formed; An insulating layer and a wiring layer sequentially stacked in the wiring layer formation region; And an LED (Light Emitting Diode) in which a lead portion is disposed on the wiring layer and a radiator portion is disposed on the base substrate, wherein the LED is a side view type LED assembly.

Description

LED assembly and backlight unit having the same {LED ASSEMBLY AND BACKLIGHT UNIT}

The present invention relates to an LED assembly and a backlight unit having the same.

The liquid crystal display device (LCD), which is advantageous for displaying moving images and has a large contrast ratio, is actively used in TVs and monitors. The optical anisotropy and polarization of liquid crystals The principle of image implementation is shown.

Such a liquid crystal display device uses a liquid crystal panel bonded by interposing a liquid crystal layer between two parallel substrates as an essential component, and a difference in transmittance is realized by changing the alignment direction of liquid crystal molecules by an electric field in the liquid crystal panel. do. However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. To this end, a backlight unit having a light source is disposed on the back of the liquid crystal panel.

Here, as a light source of the backlight unit, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, and a light emitting diode (LED, hereinafter referred to as LED) are used. .

Among them, LEDs, in particular, have features such as small size, low power consumption, and high reliability, and are being widely used as a display light source.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.

As shown, a general liquid crystal display device includes a liquid crystal panel 10, a backlight unit 60, a support main 30, a bottom cover 50, and a top cover 40.

The liquid crystal panel 10 is a part that plays a key role in image expression and is composed of first and second substrates 12 and 14 bonded to each other with a liquid crystal layer therebetween.

A backlight unit 60 is provided behind the liquid crystal panel 10. The backlight unit 60 includes an LED assembly 29 consisting of LEDs arranged along the longitudinal direction of at least one edge of the support main 30 and an LED PCB (printed circuit board 29b, hereinafter referred to as PCB) on which the LEDs are mounted. , A white or silver reflective plate 25 seated on the bottom cover 50, a light guide plate 23 seated on the reflective plate 25, and a plurality of optical sheets 21 interposed thereon.

The liquid crystal panel 10 and the backlight unit 60 have a top cover 40 surrounding the upper surface of the liquid crystal panel 10 and the back of the backlight unit 60 with their edges surrounded by a support main 30 having a rectangular frame shape. The bottom cover 50 covering the is combined in each of the front and rear rooms and integrated through the support main 30 as a medium. Further, reference numerals 19a and 19b denote polarizing plates that are attached to the front and rear surfaces of the liquid crystal panel 10 and control the polarization direction of light, respectively. Here, the LED (29a) is a light emitting device, the temperature rises rapidly according to the usage time, and this temperature rise has a characteristic that accompanies a change in luminance. Accordingly, when using the LED 29a as a light source of the backlight unit 60, one of the most important matters is the heat dissipation design according to the temperature increase of the LED 29a. However, in general liquid crystal display devices, the temperature of the LED 29a gradually rises during use because a specific method for rapidly discharging the high temperature heat generated from the LED 29a to the outside is not provided. The change in luminance eventually acts as a cause of lowering the image quality. In addition, it causes a problem that the life of the LED (29a) is shortened.

An embodiment according to the present invention can provide a backlight unit in which the width of the opening of the bottom cover is minimized.

An embodiment according to the present invention may provide a backlight unit capable of stably fixing an LED assembly.

An embodiment according to the present invention can provide an LED assembly maximizing the heat dissipation effect.

An embodiment according to the present invention may provide an LED assembly with a minimized thickness.

An LED assembly according to an embodiment of the present invention includes: a base substrate including an area where a wiring layer is not formed and an area where a wiring layer is formed; An insulating layer and a wiring layer sequentially stacked in the wiring layer formation region; And an LED (Light Emitting Diode) in which a lead portion is disposed on the wiring layer and a radiator portion is disposed on the base substrate, wherein the LED is a side view type LED assembly.

In the LED assembly according to the embodiment according to the present invention, the LED assembly in which the LED is disposed corresponding to a step formed by the insulating layer, the wiring layer, and the base substrate.

In the LED assembly according to the embodiment according to the present invention, the LED is a case including first to fourth sidewalls, an exit surface, and a transfer surface facing the exit surface, and is accommodated in the case and serves as the transfer surface. An LED assembly comprising an exposed lead part and a heat dissipation part received in the case and exposed through a heat dissipation part receiving part which is a hole formed in any one of the first to fourth side walls.

In the LED assembly according to the embodiment of the present invention, the heat dissipation part exposed through the heat dissipation part accommodating part is in contact with the wiring layer non-formation area.

In the LED assembly according to the embodiment of the present invention, the heat dissipation part includes a first heat dissipation part on which an LED chip is mounted and a second heat dissipation part accommodated in the heat dissipation part receiving part, and the second heat dissipation part is the first heat dissipation part LED assembly extending from and bent.

In the LED assembly according to the embodiment of the present invention, the wiring layer forming area and the wiring layer forming area adjacent to the wiring layer non-forming area are formed on an upper surface of the base substrate.

In the LED assembly according to the embodiment of the present invention, the base substrate further includes a bottom cover insertion region formed on an upper surface, and the wiring layer formation region is the non-wiring layer region and the bottom of the upper surface of the base substrate. LED assembly formed in the area between the cover insertion areas.

The backlight unit according to an embodiment of the present invention includes: a base substrate including a wiring layer formation region in a region between a region where a wiring layer is not formed and a bottom cover insertion region; An insulating layer and a wiring layer sequentially stacked in the wiring layer formation region; And a LED assembly including a light emitting diode (LED) having a lead portion disposed on the wiring layer and a heat dissipating portion disposed on the base substrate, and a bottom cover accommodating the LED assembly, wherein the bottom cover includes a bottom portion and the bottom The backlight unit includes a sidewall extending from an edge region of the negative, wherein the sidewall includes first to third bent regions forming grooves in an edge region of the bottom cover.

In the backlight unit according to the embodiment of the present invention, the LED is a side view type backlight unit.

In the backlight unit according to an embodiment of the present invention, the first bent region extends in a vertical direction from the bottom, and the second bent region extends from the first bent region in an inner direction of the bottom cover, The third bent area is a backlight unit extending from the second bent area to an upper direction of the bottom cover.

In the backlight unit according to an embodiment of the present invention, the bottom cover insertion area corresponds to the groove formed in the edge area of the bottom cover.

The embodiment according to the present invention can minimize the width of the opening of the bottom cover, can stably fix the LED assembly, can provide an LED assembly maximizing the heat dissipation effect, and can provide an LED assembly with a minimum thickness. You can also provide.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.
2 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.
3 and 4 are the same views and are perspective views of LEDs.
5 is a cross-sectional view taken along the dotted line AB of FIG. 4.
6 is a perspective view of a radiating part and a lid part.
7 is a cross-sectional view taken along the dotted line CD in FIG. 6.
8 is a top view of a radiating portion and a lid portion.
9 is a side view of a radiating portion and a lid portion.
10 is a perspective view of a PCB according to a first embodiment of the present invention.
11 is a perspective view of a base substrate according to a first embodiment of the present invention.
12 is a perspective view of the LED assembly.
13 is a view showing an LED assembly disposed on the bottom cover according to the first embodiment of the present invention.
14 is a perspective view of a base substrate according to a second embodiment of the present invention.
15 and 16 are views showing the LED assembly disposed on the bottom cover according to the second embodiment of the present invention.
17 to 20 are diagrams for explaining the effect of an embodiment of the present invention.
21 is a view for explaining the effect of the backlight unit 120 according to the second embodiment of the present invention.
22 is an experimental result showing a thermal path showing the effect of the heat dissipation characteristic according to the LED assembly 20 of the present invention.

Hereinafter, with reference to the drawings of the LED assembly and the backlight unit having the same according to an embodiment of the present invention will be described in detail. The following embodiments are provided as examples in order to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In addition, in the drawings, the size and thickness of the device may be exaggerated for convenience. Throughout the specification, the same reference numbers indicate the same elements.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same elements throughout the specification. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity of description.

When an element or layer is another element or referred to as “on” or “on”, it includes both the case where another layer or other element is interposed in the middle as well as directly above the other element or layer. do. On the other hand, when a device is referred to as "directly on" or "directly on", it indicates that there is no intervening other device or layer in between.

Spatially relative terms "below, beneath", "lower", "above", "upper", etc. are used as one element or component as shown in the drawing. It can be used to easily describe the correlation between the and other devices or components. Spatially relative terms should be understood as terms including different directions of the device during use or operation in addition to the directions shown in the drawings. For example, when an element shown in the figure is turned over, an element described as “below” or “beneath” of another element may be placed “above” another element. Accordingly, the exemplary term “below” may include both directions below and above.

The terms used in the present specification are for describing exemplary embodiments, and therefore, are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated in the phrase. As used in the specification, "comprise" and/or "comprising" refers to the presence of one or more other components, steps, actions and/or elements, and/or elements, steps, actions and/or elements mentioned. Or does not exclude additions.

2 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

As shown, the liquid crystal display includes a liquid crystal panel 110, a backlight unit 120, a support main 130, a bottom cover 150, and a top cover 140.

The liquid crystal panel 110 is composed of a color filter array substrate 112, a TFT array substrate 114, and a liquid crystal layer (not shown) interposed therebetween, and the color filter array substrate 112 and the TFT array substrate ( A polarizing plate (not shown) is attached to the outer surface of 114).

In the liquid crystal panel 110, liquid crystal cells constituting a pixel unit are arranged in a matrix form, and the liquid crystal cells form an image by adjusting light transmittance according to image signal information transmitted from a driver driving circuit.

Specifically, a pixel is defined by crossing a plurality of gate lines and data lines on the inner surface of the TFT array substrate 114, and a thin film transistor (TFT) is provided at each intersection point to be formed in each pixel. It is connected to the transparent pixel electrode in a one-to-one correspondence.

In addition, as an example corresponding to each pixel on the inner surface of the color filter array substrate 112, color filters of red (R), green (G), and blue (B) colors and each of them are covered, And a black matrix to cover non-display elements such as data lines and thin film transistors. In addition, a transparent common electrode covering them is provided.

Along at least one edge of the liquid crystal panel 110, the gate and the data printed circuit board 117 are connected via a connection member 116 such as a flexible circuit board, so that the side or the bottom cover of the support main 130 in the modularization process It is in close contact with the back of 150.

In addition, although not clearly shown in the drawing, an alignment layer for determining the initial molecular arrangement direction of the liquid crystal is interposed at the boundary between the color filter array substrate 112 and the TFT array substrate 114 and the liquid crystal layer of the liquid crystal panel 110. In order to prevent leakage of the liquid crystal layer filled therebetween, a seal pattern is formed along the edges of the color filter array substrate 112 and the TFT array substrate 114.

A backlight unit 120 that supplies light is provided on the rear surface of the liquid crystal panel 110 so that the difference in transmittance indicated by the liquid crystal panel 110 is expressed to the outside.

The backlight unit 120 includes an LED assembly 20 arranged along at least one edge length direction of the support main 130, a white or silver reflector 125, and a light guide plate 123 mounted on the reflector 125. ) And an optical sheet 121 interposed thereon.

The LED assembly 20 is a light source of the backlight unit 120 and is located on one side of the light guide plate 123 so as to face the light incident surface of the light guide plate 123, and the LED assembly 20 includes a plurality of LEDs 200 and , A plurality of LEDs 200 include a PCB 300 mounted at a predetermined interval.

The light guide plate 123 into which the light emitted from the plurality of LEDs 200 is incident is evenly distributed over a wide area of the light guide plate 123 while the light incident from the LED 200 travels through the light guide plate 123 by several total reflections. Spread to provide a surface light source to the liquid crystal panel 110.

The light guide plate 123 may include a pattern having a specific shape on its rear surface to supply a uniform surface light source.

Here, the pattern may be configured in various ways such as an elliptical pattern, a polygon pattern, and a hologram pattern to guide the light incident into the light guide plate 123. The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

In addition, as the material of the light guide plate 123, polymethy-methacrylate (PMMA) having high strength and not easily deformed or broken and having good transmittance may be used. Here, the light guide plate 123 may be of a wedge type having an inclined lower surface and a flat upper surface, or a plate type in which both the lower surface and the upper surface are parallel. In addition, the light guide plate 123 may have a relatively larger thickness on the side of the light incident part.

The optical sheet 121 may be composed of a diffusion sheet, a prism sheet, a protective sheet, and a reflective sheet. In some cases, it may be provided with two diffusion sheets, two prism sheets, and reflection sheets. In this case, the diffusion sheet may be formed of a base plate and a bead-shaped coating layer formed on the base plate.

The reflector 125 is located on the rear surface of the light guide plate 123 and reflects the light that has passed through the rear surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the luminance of light.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140, the support main 130, and the bottom cover 150, and the top cover 140 includes the upper edge of the liquid crystal panel 110 and the Organize to cover the side.

Here, the top cover 140 has a rectangular frame shape in which the cross section is bent in a “b” shape so as to cover the upper and side edges of the liquid crystal panel 110, and the front cover of the top cover 140 is opened to cover the liquid crystal panel 110. It is configured to display an image implemented in.

In addition, the bottom cover 150, which is the basis for assembling the entire liquid crystal display device by mounting the liquid crystal panel 110 and the backlight unit 120, includes a bottom portion and a side wall whose edges are vertically bent. In addition, a support main 130 in the shape of a square frame, which is seated on the bottom cover 150 and has an open edge around the edge of the liquid crystal panel 110 and the backlight unit 120, is provided with the top cover 140 and the bottom. It is combined with the cover 150.

In this case, the top cover 140 may be referred to as a case top or a top case, the support main 130 may be referred to as a guide panel, a main support, or a mold frame, and the bottom cover 150 may be referred to as a lower cover.

<First Example>

3 and 4 are a perspective view of an LED as the same view, FIG. 5 is a cross-sectional view taken along the dotted line AB of FIG. 4, FIG. 6 is a perspective view of a radiating part and a lead part, and FIG. 7 is It is a cross-sectional view. And FIG. 8 is a top view of the heat dissipation part and the lead part, and FIG. 9 is a side view of the heat dissipation part and the lead part.

The direction symbols shown in Fig. 4 are direction symbols indicating a direction in a three-dimensional space, in a direction c having an angle of 90 degrees to the a direction on a secondary plane, a direction b having an angle of 90 degrees to the c direction, the It is defined as the d direction having an angle of 90 degrees to the b direction, and the e direction perpendicular to the upper direction based on the a and b directions in the three-dimensional space, and the f direction perpendicular to the lower direction based on the a and b directions. Is defined.

In the following description of the present invention, the expression indicating the direction will be described based on when each component constituting the present invention is arranged as shown in FIG. 4.

3 to 5, the LED 200 according to an embodiment of the present invention may include a case 201, a heat dissipation unit 230, a lead unit 240, and an LED chip 250.

The heat dissipation part 230 and the lead part 240 may be coupled to the case 201, and the LED chip 250 may be mounted on the heat dissipation part 230.

The heat dissipation part 230 and the lead part 240 may be manufactured separately from each other.

The case 201 may accommodate the heat dissipation unit 230, the lead unit 240, and the LED chip 250, and may serve as a housing.

The case 201 may include first to fourth sidewalls 202, 203, 204, and 205. In addition, the case 201 faces the exit surface 206 and the exit surface 206 from which light is emitted, is a rear surface of the case 201, and a carry-out surface 207 to which the lid part 240 is exposed. ) Can be included.

Since the LED assembly 20 is a side view type, when the LED assembly 20 is fastened to the bottom cover 150, the light emitting surface 207 faces the side wall 151 of the bottom cover 150. And, the exit surface 206 may face the light incident portion of the light guide plate 123.

The first to fourth sidewalls 202, 203, 204, and 205 may be integrally formed with each other, and may have a rectangular frame shape.

When the case 201 formed by the first to fourth sidewalls 202, 203, 204, and 205 has a rectangular shape, the areas of the first and second sidewalls 202 and 203 are the third and fourth It may be larger than the area of the sidewalls 204 and 205. That is, the left and right widths (length in the cd direction) of the first and second side walls 202 and 203 may be longer than the left and right widths (length in the ab direction) of the third and fourth side walls 204 and 205, The height can be the same.

Each of the first to fourth sidewalls 202, 203, 204, and 205 may include an outer surface 210 and an inner surface 220.

The outer surface 210 may include first to fourth outer surfaces 211, 212, 213 and 214.

The first outer surface 211 and the second outer surface 212 may face each other, and the third outer surface 213 and the fourth outer surface 214 may face each other.

The first outer surface 211 is a surface facing the a direction, the second outer surface 212 is a surface facing the b direction, the third outer surface 213 is a surface facing the d direction, and 4 The outer surface 214 is a surface facing the c direction.

The inner surface 220 may include first to fourth inner surfaces 221, 222, 223, and 224.

The first to fourth inner surfaces 221, 222, 223, and 224 may be inclined surfaces.

The first inner surface 221 is a surface inclined so that the inclined surface faces eb direction, the second inner surface 222 is a surface and a surface inclined so that the inclined surface faces ea direction, and the third inner surface ( Reference numeral 223 denotes an inclined surface with an inclined surface facing the ec direction, and the fourth inner surface 224 may be an inclined surface with an inclined surface facing the ed direction.

The first to fourth sidewalls 202, 203, 204, and 205 may block the light emitted from the LED chip 250 from leaking in the a, b, c, and d directions.

In addition, the first to fourth inner surfaces 221, 222, 223, and 224 may form a reflective surface. Accordingly, a reflective material such as a transparent resin may be applied to the first to fourth inner surfaces 221, 222, 223, and 224. Thus, the transparent resin is filled in the space formed by the first to fourth inner surfaces 221, 222, 223, and 224, so that the angle of the main emission light of the LED 200 can be controlled.

In addition, by having a function of reflecting the first to fourth inner surfaces 221, 222, 223, 224, the case 201 serves to reflect in the front, that is, the e direction emitted from the LED chip 250 can do.

The transparent resin may include a phosphor, and a mixture of an epoxy resin or a silicone resin including the phosphor may be used.

6 to 9, the radiating part 230 may include a first radiating part 231 and a second radiating part 232 extending from and bent from the first radiating part 231.

The first and second heat dissipation parts 231 and 232 may have a shape perpendicular to each other, but are not limited thereto.

An LED chip 250 may be mounted on an upper surface (outer surface) of the first radiating part 231. In addition, an upper surface (outer surface) of the first radiating part 231 may face the e direction.

The second heat dissipation part 231 may be inserted into the case 201, and an outer surface thereof may face a direction b.

The heat dissipation part 230 is a part that conducts and discharges high-temperature heat accompanying the LED chip 250 when emitting light, and may be made of a metal material.

The first radiating part 231 may be disposed in a central region of the case 201. In addition, the first heat radiating part 231 may be disposed in a space surrounding the first to fourth inner surfaces 221, 222, 223, and 224 of the case 201.

The second heat dissipation part 232 is an area corresponding to the second side wall 203 of the case 210 and may be disposed in the heat dissipation part receiving part 203a formed in the center area of the second side wall 203. .

The radiating part receiving part 203a may be formed on the second sidewall 203 in a shape corresponding to the shape of the second radiating part 232. That is, by forming a hole in the second sidewall 203 so that the second heat dissipation part 232 can be exposed to the outside, the heat dissipation part receiving part 203a may be formed.

The heat dissipation effect by conducting the high-temperature heat generated from the LED chip 250 disposed on the first radiating part 231 to the second radiating part 232 directly connected to the first radiating part 231 Can increase.

The lead part 240 may include a first lead part 241 disposed on the right side of the radiating part 230 and a second lead part 247 disposed on the left side of the radiating part 230.

The first lead part 241 may be one of an anode and a cathode, and the second lead part 247 may be the other.

The first lead part 241 may include a first LED chip connection part 242 and a first substrate connection part 243 extending from and bent from the first LED chip connection part 242. In addition, the second lead part 247 may include a second LED chip connection part 245 and a second substrate connection part 246 extending from and bent from the second LED chip connection part 245.

The first LED chip connection part 242 and the first substrate connection part 243 may be perpendicular to each other, but are not limited thereto. In addition, the second LED chip connection part 245 and the second substrate connection part 246 may be perpendicular to each other, but are not limited thereto.

9, the width L1 of the first heat dissipation part 231 of the heat dissipation part 230 in the ab direction is the width L2 of the first and second LED chip connection parts 242 and 245 in the ab direction. ) Can be greater than. This is to accommodate the second heat dissipation part 232 of the heat dissipation part 230 in the heat dissipation part receiving part 203a of the case 201.

In addition, the height h2 of the first and second LED chip connection portions 242 and 245 in the e-f direction may be higher than the height h1 of the second radiating portion 232. This is because, when the heat dissipation part 230 is accommodated in the case 201, a region protruding outside the case 201 is not formed, and the first and second lead parts 241 and 247 When accommodated in the case 201, the end regions of the first and second substrate connection portions 243 and 246 of the first and second lead portions 241 and 247 protrude to the outside of the case 201 so that the substrate It is to connect with.

Each of the first and second lead portions 241 and 247 of the lead portion 240 may be electrically connected to the LED chip 250 through a wire.

The heat dissipation part 230 and the lead part 240 may be formed of the same metal, and consist of any one metal material of copper, silver, aluminum, iron, nickel, and tungsten, or an alloy material including at least one or more thereof. Can be. In addition, the outer surfaces of the heat dissipation part 230 and the lead part 240 may be plated with any one of nickel, silver, and gold, or an alloy material containing at least one of them.

When positive power (+) and negative power (-) are respectively supplied through the first and second lead parts 241 and 247, the LED chip 250 mounted on the heating part 230 emit light. In addition, some of the light emitted from the LED chip 250 excites a phosphor in a transparent resin and is mixed with the light emitted by the phosphor to emit white light.

The heat dissipation unit 230 more effectively dissipates the high-temperature heat generated from the LED 200, and thus it is possible to prevent changes in life span and luminance of the LED 200 due to an increase in temperature.

Meanwhile, referring to FIG. 9, the first substrate connection part 243 includes a first unexposed area 243a disposed inside the case 201 and a first exposed area 243b exposed to the outside of the case 201. Can include. In addition, the second substrate connection part 246 may include a second unexposed area 246a disposed inside the case 201 and a second exposed area 246b exposed to the outside of the case 201.

10 is a perspective view of a PCB according to a first embodiment of the present invention, and FIG. 11 is a perspective view of a base substrate according to the first embodiment of the present invention.

Referring to FIG. 10, a plurality of LEDs 200 may be mounted on the PCB 300. The plurality of LEDs 200 may be mounted on the PCB 300 at regular intervals by surface mount technology (SMT).

The plurality of LEDs 200 are side view LEDs, and the emission surface 206 of the LEDs 200 faces a light incident portion provided on the side of the light guide plate 123.

Each of the plurality of LEDs 200 may receive power through power wiring formed on the PCB 300.

Here, the plurality of LEDs 200 emit light having colors of red (R), green (G), and blue (B), and by turning on such a plurality of RGB LEDs 200 at once, white light by color mixing can be realized. May be.

Meanwhile, the LED 200 implementing white light may be made of a blue LED chip 250 and a yellow phosphor, and a UVLED chip may be used for the LED chip 250. When using a UVLED chip, the phosphor is red (R), It is made of three-color phosphors of green (G) and blue (B), and the luminous color can be selected by adjusting the mixing ratio of the phosphors of red (R), green (G), and blue (B).

The PCB 300 may include a base substrate 310, an insulating layer 320 and a wiring layer 330 formed in one region of an upper surface of the base substrate 310.

The base substrate 310 serves to support the wiring layer 330 and the insulating layer 320 and other components by mounting them as an upper layer, and to dissipate heat generated from the plurality of LEDs 200 to the bottom side.

An adhesive layer 340 may be formed on the rear surface of the base substrate 310 of the PCB 300, and the adhesive layer 340 may serve to fix the base substrate 310 to the bottom cover 150. .

The base substrate 310 may be formed of a metal having high thermal conductivity, such as aluminum (Al) or copper (Cu), or a heat transfer material may be applied to improve a heat dissipation function.

Alternatively, a heat sink (not shown) such as a heat sink may be provided on the rear surface of the base substrate 310 to receive heat from each of the LEDs 200 and emit heat to the outside more efficiently.

A wiring layer 330 including a plurality of metal wirings (not shown) formed by patterning a conductive material on the base substrate 310 is formed, and an insulating layer 330 is formed between the base substrate 310 and the wiring layer 330. 320 may be positioned to electrically insulate between the base substrate 310 and a plurality of metal wires (not shown).

Referring to FIG. 11, the base substrate 310 may include a first region 311 and a second region 312 adjacent to the first region 311.

The first region 311 may be defined as a region in which the insulating layer 320 and the wiring layer 330 are not formed and a wiring layer is not formed, and the second region 312 is the insulating layer 320 and the wiring layer. It can be defined as an area where the wiring layer 330 is formed.

When the wiring layer 330 is formed on the base substrate 310 in this way, the insulating layer 320 is stacked together, and the heat conduction property of the insulating layer 320 may be low, so the base substrate 310 ) By providing a first region 311 in which the wiring layer 330 is not formed, and not stacking the insulating layer 320 on the first region 311, the heat transferred from the LED 200 is It may be delivered directly on the base substrate 310.

12 is a perspective view of the LED assembly.

Referring to FIG. 12, the LED assembly 20 according to the embodiment of the present invention may include a PCB 300 and a plurality of LEDs 200 mounted on the PCB 300.

The first and second substrate connection portions 243 and 246 exposed from the LED 200 to the outside of the case 201 correspond to the wiring layer formation region 312, and the case 201 is the non-wiring layer region 311 Corresponding to, the LED 200 may be disposed on the PCB (300).

The first and second exposed regions 243b and 246b of the first and second substrate connection portions 243 and 246 of the LED 200 may contact the wiring layer 330, and the second sidewall of the case 201 At 203, the second outer surface 212 may contact on the area 311 where the wiring layer is not formed of the base substrate 310.

13 is a view showing an LED assembly disposed on the bottom cover according to the first embodiment of the present invention.

Referring to FIG. 13, the LED assembly 20 according to the embodiment of the present invention may be disposed on one side of the bottom cover 150.

The bottom cover 150 may include a bottom portion 152 and a sidewall 151 of the bottom cover formed at an edge of the bottom portion 152.

The rear surface of the LED assembly 20 is disposed on the bottom part 152 of the bottom cover through an adhesive part 340, and the side surface of the LED assembly 20 is attached to the inner surface of the side wall 151 of the bottom cover. Can be.

<Second Example>

14 is a perspective view of a base substrate according to a second embodiment of the present invention.

Referring to FIG. 14, a base substrate 310 includes a first area 311, a second area 312 adjacent to the first area 311, and a third area 313 adjacent to the second area 312. It may include.

The second region 312 may be formed between the first region 311 and the third region 313.

The first region 311 may be defined as a region in which the insulating layer 320 and the wiring layer 330 are not formed and a wiring layer is not formed, and the second region 312 is the insulating layer 320 and the wiring layer. It can be defined as an area where the wiring layer 330 is formed. In addition, the third region 313 is a region where the insulating layer 320 and the wiring layer 330 are not formed and is inserted into the bottom cover, and may be defined as a bottom cover insertion region.

15 and 16 are views showing the LED assembly disposed on the bottom cover according to the second embodiment of the present invention.

15 and 16, the bottom cover according to the exemplary embodiment of the present invention may include a bottom portion 152 and a bottom cover sidewall 151 formed in an edge region of the bottom portion 152.

The sidewall 151 may include first to third bent regions 151a, 151b, and 151c.

The first to third bent regions 151a, 151b, and 151c may have grooves 151d to correspond to the bottom cover insertion regions of the LED assembly at the edges of the bottom cover.

The first bent region 151a may be formed to extend in a vertical direction from the bottom portion 152 of the bottom cover.

The second bent area 151b may be formed to extend in a vertical direction from the first bent area 151a. That is, the second bent region 151b may extend from the first bent region 151a in the inner direction of the bottom cover 150. Thus, the second bent region 151b and the bottom portion 152 of the bottom cover may be parallel to each other.

The third bent region 151c may be formed to extend in a vertical direction from the second bent region 151c. Thus, the third bent region 151c may be parallel to the first bent region 151a and may be perpendicular to the bottom portion 152 of the bottom cover.

The edge region of the bottom part 152 and the first and second bent regions 151a and 151b may form a storage space 151d in which one side of the LED assembly 20 may be accommodated.

In the base substrate 310, the case 201 of the LED 200 is disposed in the area 311 where the wiring layer is not formed, and the first and second substrate connection portions 243 of the LED 200 are arranged in the wiring layer forming area 312. The first and second exposed areas 243b and 246b of 246 may be disposed, and the bottom cover insertion area 313 may be disposed in the storage space 151d of the bottom cover 150.

17 to 20 are diagrams for explaining the effect of an embodiment of the present invention.

Referring to FIG. 17, since the insulating layer 320 and the wiring layer 330 are formed on one area of the upper surface of the base substrate 310, the PCB 300 is formed with the insulating layer 320 and the wiring layer 330 and the base. A step difference may be formed between the substrates 310. However, by arranging the LEDs 200 according to the first and second embodiments as illustrated as shown in FIG. 18, the overall thickness of the LED assembly 20 may be reduced.

That is, the emission surface 206, which is the upper surface of the case 201 of the LED 200, can be flush with the side surface of the base substrate 310, and the exit surface 207 that is the rear surface of the case 201 ) Is disposed so as to correspond to the side surfaces of the insulating layer 320 and the wiring layer 330, so that the LED 200 is formed in a step formed between the insulating layer 320 and the wiring layer 330 and the base substrate 310. By being disposed, it is possible to reduce the overall thickness (height with respect to the horizontal plane) of the LED assembly 20.

Specifically, when there is a thickness t1 of the base substrate 310, a thickness t2 according to the insulating layer 320 and the wiring layer 330, and a thickness t3 according to the LED 200 , The first sidewall 202 or the second sidewall 203 of the LED 200 is disposed to correspond to the base substrate 310, and the first and second lead portions 241 and 247 are formed in the wiring layer 330 ), the total thickness of the LED assembly 20 becomes t1+t3. That is, the sum of the thickness t1 of the base substrate 310 and the distance t3 between the first sidewall 202 and the second sidewall 203 of the LED 200 becomes the total thickness of the LED assembly 20. , It is possible to reduce the overall thickness of the LED assembly 20.

In addition, the second heat dissipation part 232 of the heat dissipation part 230 is exposed to the outside of the case 201, and the second heat dissipation part 232 is an area 311 where no wiring layer is formed among the upper surface of the base substrate 310 By contacting the LED chip 250 has the effect of inducing to directly transfer the high-temperature heat generated from the base substrate 310.

In the case of the top view type LED 410 whose emission surface faces upward as shown in FIG. 19, not the side view type LED as in the embodiment, the thickness t1 of the base substrate 310 and the insulating layer ( 320) and the thickness of the wiring layer 330 (t2), the thickness of the case of the LED 410 (t5) and the thickness of the lead portion 420 of the LED 410 (t4) is the thickness of the LED assembly Therefore, the LED assembly illustrated in FIG. 19 may have a thickness greater than that of the LED assembly 20 according to an embodiment of the present invention.

Moreover, a separate wiring 400 is formed on the base substrate 310 for electrical connection with the lead portion 420 corresponding to the base substrate 310 of the lead portion 420, or an additional shouldering process Should proceed.

In addition, even when the lead portion 420 corresponding to the base substrate 310 among the lead portions 420 is a heat sink rather than a lead portion, the size of the heat sink is the insulating layer 320 and the wiring layer 330 and the base substrate. As a result, the LED assembly according to FIG. 19 has a thickness greater than that of the LED assembly 20 according to the embodiment of the present invention, since it must have a size corresponding to the step difference formed between 310.

In addition, even if the lead portion protruding from the middle region of the case of the top view type LED 410 is bent and contacts the wiring layer 330 and the base substrate 310 as shown in FIG. 20, the insulating layer Due to the thickness t2 according to the 320 and the wiring layer 330, the thickness is increased than that of the LED assembly 20 according to the embodiment of the present invention.

As described above, the LED assembly 20 according to the present invention has a remarkable reduction in thickness, thereby producing an effect of manufacturing the thin backlight unit 120. In addition, in consideration of the low thermal conductivity characteristic of the insulating layer 320, the heat dissipation unit 230 may directly contact the base substrate 310 to maximize a heat dissipation effect.

21 is a view for explaining the effect of the backlight unit 120 according to the second embodiment of the present invention.

Referring to FIG. 21, as in the second embodiment, by forming a groove 151d in which the LED assembly 20 can be accommodated in the edge region of the bottom cover 150, the LED inserted into the concave groove 151d The assembly 20 can be stably fixed.

In addition, since the width L3 of the opening of the bottom cover 150 can be reduced, a narrow bezel can be realized while securing a storage space for the LED assembly 20.

22 is an experimental result showing a thermal path showing the effect of the heat dissipation characteristic according to the LED assembly 20 of the present invention.

As can be seen from the experimental results, it can be seen that the high-temperature heat generated from the LED chip 250 can be easily discharged through the heat dissipation unit 230 and the base substrate 310 as shown in the arrow direction.

In addition, when the heat dissipation part 230 and the base substrate 310 are formed of the same metal material, heat dissipation may be maximized through metal homo-junction.

In the detailed description of the present invention described above, it has been described with reference to preferred embodiments of the present invention, but those skilled in the art or those of ordinary skill in the relevant technical field of the present invention described in the claims to be described later It will be understood that various modifications and changes can be made to the present invention without departing from the spirit and technical scope. Therefore, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be determined by the claims.

10 LCD panel
19a, 19b polarizer
21 optical sheet
25 reflector
29 LED assembly
29a LED
29b LED PCB
30 Support main
40 Top Cover
50 bottom cover
60 backlight units
20 LED assembly
110 LCD panel
112 color filter array board
114 TFT array substrate
116 Connecting member
117 printed circuit board
120 backlight units
121 Optical Sheet
123 light guide plate
125 reflector
130 Support main
140 Top Cover
150 bottom cover
151 side wall
151a first bend
151b second bend
151c third bend
151d storage space
152 bottom
200 LED
201 case
202 first side wall
203 second side wall
203a radiator compartment
204 third side wall
205 fourth side wall
206 exit plane
207 half exit surface
210 outer surface
211 first outer surface
212 second outer surface
213 3rd outer surface
214 fourth outer surface
220 inner surface
221 first inner surface
222 second inner surface
223 third inner surface
224 fourth inner surface
230 radiator
231 first radiator
232 second radiator
240 lead
241 first lead part
242 1st LED chip connection part
243 first board connection
243a first unexposed area
243b first exposed area
242 1st LED chip connection part
245 second board connection
246 2nd LED chip connection part
246a second unexposed area
246b second exposed area
247 second lead part
250 LED chip
300 PCB
310 Base substrate
311 No wiring layer formed area
312 wiring layer formation area
313 bottom cover insertion area
320 insulation layer
330 wiring layer
340 adhesive layer
400 wiring or shouldering
410 LED
420 lead

Claims (11)

A base substrate including a region where a wiring layer is not formed and a region where a wiring layer is formed;
An insulating layer and a wiring layer sequentially stacked in the wiring layer formation region; And
Including an LED (Light Emitting Diode) disposed on the area where the wiring layer is not formed,
The LED,
A case accommodating the LED chip, and wherein one of the plurality of outer surfaces is in contact with the upper surface of the base substrate;
A radiating part including a first radiating part on which the LED chip is seated and a second radiating part extending from the first radiating part and disposed in a radiating part receiving part of the one outer surface; And
A lead portion extending from the inside of the case toward the wiring layer formation region and in contact with the wiring layer,
One surface of the second heat dissipation part is exposed from the case by the heat dissipation part accommodating part and contacts the upper surface of the base substrate together with the one outer surface,
The LED is a side view type LED assembly. The method of claim 1,
The LED assembly in which the LED is disposed corresponding to a step formed by the insulating layer, the wiring layer, and the base substrate. The method of claim 2,
The case of the LED includes an exit surface and a transfer surface facing the exit surface,
The LED assembly exposed to the lead portion to the light exit surface. The method of claim 3,
The heat dissipation part exposed through the heat dissipation part accommodating part is in contact with an upper surface of the base substrate overlapping the area where the wiring layer is not formed. The method of claim 4,
The second heat dissipation part extends from the first heat dissipation part and is bent LED assembly. The method of claim 1,
The LED assembly in which the wiring layer non-formation region and the wiring layer formation region are adjacent to each other. The method of claim 1,
The base substrate further includes a bottom cover insertion region formed on the upper surface,
The wiring layer formation region is an LED assembly formed in a region between the non-wiring layer region and the bottom cover insertion region of the upper surface of the base substrate. A base substrate including a wiring layer formation region in a region between the non-wiring layer formation region and the bottom cover insertion region;
An insulating layer and a wiring layer sequentially stacked in the wiring layer formation region; And
Including an LED assembly including an LED (Light Emitting Diode) disposed on the area where the wiring layer is not formed and a bottom cover accommodating the LED assembly,
The LED,
A case accommodating the LED chip, and wherein one of the plurality of outer surfaces is in contact with the upper surface of the base substrate;
A radiating part including a first radiating part on which the LED chip is seated and a second radiating part extending from the first radiating part and disposed in a radiating part receiving part of the one outer surface; And
A lead portion extending from the inside of the case toward the wiring layer formation region and in contact with the wiring layer,
One surface of the second heat dissipation part is exposed from the case by the heat dissipation part accommodating part and contacts the upper surface of the base substrate together with the one outer surface,
The bottom cover includes a bottom portion and a sidewall extending from an edge region of the bottom portion,
The sidewall is a backlight unit including first to third bent regions forming grooves in an edge region of the bottom cover. The method of claim 8,
The LED is a side view type backlight unit. The method of claim 9,
The first bent region extends in a vertical direction from the bottom,
The second bent region extends in the inner direction of the bottom cover from the first bent region,
The third bent area is a backlight unit extending from the second bent area to an upper direction of the bottom cover. The method of claim 10,
The backlight unit in which the bottom cover insertion area corresponds to the groove formed in the edge area of the bottom cover.

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