KR101871849B1 - liquid crystal display device - Google Patents

Abstract

The present invention relates to a liquid crystal display device, comprising: a liquid crystal panel; A backlight unit disposed at a lower portion of the liquid crystal panel, the backlight unit including a reflective plate, a light guide plate, and an LED assembly; A first portion formed with an LED adhering portion on an edge of the liquid crystal panel and the backlight unit and having an LED adhered to an outer side of the LED assembly and a panel guide portion A support main body including two parts; And a cover bottom which is assembled with the support main body. The first portion further has a fastening portion which is further extended from the LED fastening portion and is assembled with the cover bottom, And an LED light-incident portion for guiding the incident light to the light guide plate.

Description

[0001] The present invention relates to a liquid crystal display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device using an LED as a light source, and more particularly to a liquid crystal display device capable of not only preventing light loss but also improving heat transfer of an LED.

A liquid crystal display device (LCD), which is advantageous for moving picture display and has a large contrast ratio and is actively used in TVs and monitors, exhibits optical anisotropy and polarization properties of a liquid crystal, And the like.

Such a liquid crystal display device has a liquid crystal panel in which a liquid crystal panel is interposed between two adjacent substrates through a liquid crystal layer as an essential component and changes the alignment direction of the liquid crystal molecules in an electric field in the liquid crystal panel to realize a difference in transmittance do.

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. To this end, a backlight having a light source is disposed on the back surface of the liquid crystal panel.

Here, as a light source of the backlight unit, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, a light emitting diode (LED) .

In particular, LEDs are widely used as light sources for displays, having characteristics such as small size, low power consumption, and high reliability.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.

As shown in the figure, a general liquid crystal display module includes a liquid crystal panel 10, a backlight unit 20, a support main body 30, a cover bottom 50, and a top cover 40.

The liquid crystal panel 10 is constituted by first and second substrates 12 and 14 which are in contact with each other with a liquid crystal layer interposed therebetween as a part which plays a key role in image display.

A backlight unit 20 is provided behind the liquid crystal panel 10.

The backlight unit 20 includes an LED assembly 29 arranged along the height direction of at least one edge of the support main body 30, a white or silver reflective plate 25 seated on the cover bottom 50, 25, and a plurality of optical sheets 21 interposed therebetween. The LED housing 60 is further formed at a lower portion of the reflector 25 to discharge heat generated from the LED 29a to the outside.

The LED assembly 29 is formed on one side of the light guide plate 23 and includes a plurality of LEDs 29a emitting white light and an LED PCB 29b mounted on the LEDs 29a ).

The liquid crystal panel 10 and the backlight unit 20 are covered with a top cover 40 covering the upper edge of the liquid crystal panel 10 in a state where the edge is surrounded by the support main 30 having a rectangular frame shape, And the cover bottoms 50 are integrally joined to each other through the support main body 30.

And reference numerals 19a and 19b denote polarizing plates attached to the front and back surfaces of the liquid crystal panel 10 to control the polarization direction of light, respectively.

As a part of such a liquid crystal display device module, the portion will be described in more detail with reference to FIG. 2, which is a cross-sectional view showing an enlarged view of region A in FIG.

As shown in the drawing, an LED 29a is arranged along one side of the light guide plate 23 of the modularized liquid crystal display module, and the LED 29a is mounted on the PCB 29b to form the LED assembly 29 do. Here, as the PCB 29b, a metal core printed circuit board (MCPCB) formed of a metal may be used to discharge heat generated from the LED 29a to the outside.

The LED assembly 29 is fixed in position by a method of adhesion or the like so that the light emitted from the plurality of LEDs 29a faces the light incident surface of the light guide plate 23. For this purpose, So as to form a side surface.

At this time, in order to discharge heat generated from the LED 29a to the outside, the lower surface of the PCB 29b and the LED housing 60 formed of a metal material are in contact with each other. That is, heat generated from the LED 29a is emitted to the outside through the PCB 29b and the LED housing 60. [

Such conventional liquid crystal display devices have the following problems.

First, the support main 30 is formed in direct contact with the upper surface of the PCB 29b. At this time, the support main 30 is made of resin, which is a weak material of heat. Accordingly, the heat generated from the LED 29a is transferred to the PCB 29b, and then transferred to the support main body 30, thereby deforming the shape of the support main body 30 formed of resin.

Such deformation of the support main body 30 causes a gap between the light guide plate 23 and the support main body 30 and causes the light emitted from the LED 29a to pass through the clearance between the light guide plate 23 and the support main body 30, There is a problem of light leakage which is not incident and is emitted to the outside.

The LED 29a and the light guide plate 23 are spaced apart from each other by a predetermined distance in order to efficiently introduce light emitted from the LED 29a into the light guide plate 23, . As a result, there is a problem that the narrow bezel can not be efficiently implemented.

In addition, the heat transmitted to the PCB 29b is discharged to the outside through the LED housing 60 and the cover bottom 50, so that the heat of the LED 29a can not be efficiently discharged to the outside .

See FIG. FIG. 3 shows the temperature distribution of the PCB 29b when the PCB 29b is not directly bonded to the cover bottom 50. FIG.

As shown in Figure 3, the temperature of the MPCB 29b when the PCB 29b is not directly bonded to the cover bottom 50 reaches about 102 degrees. That is, there is a problem that the heat can not be efficiently discharged to the outside.

The present invention provides a liquid crystal display device that efficiently discharges high-temperature heat generated from an LED to the outside, thereby prolonging the lifetime of the LED.

In addition, by using the housing-integrated support main body made of a metal material, it is possible to prevent the main distortion of the support due to the high-temperature heat of the LED and to prevent the loss of light emitted from the LED, thereby providing a liquid crystal display device that can be efficiently incident on the light guide plate do.

In order to achieve the above-described object, the present invention provides a liquid crystal display comprising: a liquid crystal panel; A backlight unit disposed at a lower portion of the liquid crystal panel, the backlight unit including a reflective plate, a light guide plate, and an LED assembly; A first portion formed with an LED adhering portion on an edge of the liquid crystal panel and the backlight unit and having an LED adhered to an outer side of the LED assembly and a panel guide portion A support main body including two parts; And a cover bottom which is assembled with the support main body. The first portion further has a fastening portion which is further extended from the LED fastening portion and is assembled with the cover bottom, And an LED light-incident portion for guiding the incident light to the light guide plate.

The LED light-incident portion is formed at a distance from the LED light-emitting portion by a first distance, and the panel guide portion is formed at an end portion of the LED light-incident portion of the second portion.

The panel guide portion is formed to have a first width that covers the edge portion of the light guide plate.

The end of the panel guide part is formed in a quadrangular shape with the first width becoming smaller toward the light guide plate side.

The upper surface of the panel guide part is provided with an anti-shock pad bonded to an inner surface of the panel guide part and having a second width, and a heat insulating pad having a width larger than the second width and smaller than the thickness of the anti- do.

The LED light-incident portion includes a reflection portion formed with a reflection film, and a light-shielding portion having a height larger than the height of the reflection portion and having a light-shielding pad attached thereto.

The lower surface of the reflective portion is flat or formed in a quadrangular shape.

The cover bottom is formed with an insertion groove portion having a concave shape to be engaged with the coupling portion.

The cover bottom and the support main are further assembled through a screw after the insertion groove portion and the coupling portion are assembled together.

The support main body is made of a metal material.

The integrated support main formed of a metal material according to the present invention provides an efficient effect of releasing heat generated from an LED to the outside.

In addition, it is possible to prevent deformation of the support main body due to the high temperature heat of the LED, to allow the light emitted from the LED to be incident on the light guide plate without loss, and to improve the brightness and image quality of the liquid crystal display device.

In addition, it is possible to secure the space by removing the separate LED housing by the housing-integrated support main body made of a metal material, and to achieve the narrow bezel efficiently by the LED light-

1 is a sectional view of a liquid crystal display device using a general LED as a light source.
2 is an enlarged cross-sectional view of a region A in Fig.
3 is a simulation showing a temperature distribution of a PCB when a conventional LED is used as a light source.
4 is an exploded perspective view of a liquid crystal display device according to a first embodiment of the present invention.
5A and 5B are sectional views schematically showing a support main and cover bottoms according to a first embodiment of the present invention;
6 is a cross-sectional view of a liquid crystal display device according to a second embodiment of the present invention.
7 is a simulation showing the temperature distribution of the PCB according to the first and second embodiments of the present invention.

≪ Embodiment 1 >

Hereinafter, a first embodiment according to the present invention will be described in detail with reference to the drawings.

4 is an exploded perspective view of a liquid crystal display module according to a first embodiment of the present invention.

The liquid crystal display module may include a liquid crystal panel 110, a backlight unit 120, a support main body 200, a cover bottom 150, and a top cover 140.

First, the liquid crystal panel 110 plays a key role in image display and includes a first substrate 112 and a second substrate 114 which are bonded to each other with a liquid crystal layer interposed therebetween.

At this time, although not shown, a plurality of gate lines and data lines intersect to define pixels on the inner surface of the first substrate 112 called a lower substrate or an array substrate. Thin film transistors (TFTs) are formed at the intersections of the gate lines and the data lines, respectively, and are connected to the corresponding pixel electrodes.

On the inner surface of the second substrate 114 called an upper substrate or a color filter substrate, a color filter of red, green, and blue is formed as an example corresponding to each pixel. In addition, a black matrix for covering the non-display elements of the first substrate 112, such as the gate lines, the data lines, and the thin film transistors, is provided. Here, when the liquid crystal display device is driven in the vertical electric field mode, a common electrode covering the color filter and the black matrix may be further formed on the second substrate 114.

A polarizing plate (not shown) for selectively transmitting only specific light is attached to the outer surfaces of the first and second substrates 112 and 114, respectively.

The printed circuit board 117 is connected to at least one edge of the liquid crystal panel 110 via a connection member 116 such as a flexible circuit board or a tape carrier package (TCP). At this time, the printed circuit board 117 is brought into close contact with the side of the support main 200 or the backside of the cover bottom 150, for example, during the modularization process.

The backlight unit 120 is disposed, for example, on the back surface of the liquid crystal panel 110 and serves to supply light to the liquid crystal panel 110.

For this, the backlight unit 120 includes an LED assembly 129, a white or silver reflective plate 125, a light guide plate 123 seated on the reflective plate 125, and a plurality of optical sheets 121 ).

The LED assembly 129 is disposed on one side of the light guide plate 123 so as to face the light incident surface of the light guide plate 123. The LED assembly 129 includes a plurality of LEDs 129a, And a PCB 129b mounted at a spacing distance.

At this time, the plurality of LEDs 129a emit light having red, green, and blue colors respectively forward toward the light incoming surface of the light guide plate 123, and by turning on the plurality of RGB LEDs 129a at once, Can be implemented.

On the other hand, by using the LED 129a constituted by an LED chip (not shown) that emits all the colors of RGB, the white light can be realized in each of the LEDs 129a, or a complete white color including a white- Emitting LED 129a may be used.

A plurality of LEDs 129a emitting RGB light may be bundled into one cluster and a plurality of LEDs 129a mounted on the PCB 129b may be arrayed on a PCB 129b It is also possible to arrange them in parallel or in a plurality of rows.

The PCB 129b may be a metal core printed circuit board (MCPCB) having a heat dissipating function. That is, by using the metal PCB 129b having a high thermal conductivity, the heat of high temperature generated from the LED 129a can be rapidly discharged to the outside. At this time, when the PCB 129b is formed of MCPCB, an insulating layer (not shown) such as a polyimide resin material for electrical insulation between a core made of a metal and a wiring pattern (not shown) .

The light guide plate 123 disperses the light emitted from the LED 129a to provide a surface light source to the liquid crystal panel 110. [ Specifically, the light emitted from the LED 129a is totally reflected several times in the light guide plate 123. Accordingly, the light is uniformly spread over a wide area of the light guide plate 123, and is incident on the liquid crystal panel 110 as a surface light source.

At this time, the light guide plate 123 may include a pattern of, for example, a specific pattern on the back surface to supply a uniform surface light source to the liquid crystal panel 110. [ The pattern may be formed in various shapes such as an elliptical pattern, a polygon pattern, a hologram pattern, and the like in order to guide light incident into the light guide plate 123 . Such a pattern is formed on the back surface of the light guide plate 123 by a printing method or an injection method.

The reflection plate 125 is disposed on the back surface of the light guide plate 123 and reflects light passing through the back surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the brightness of light.

The plurality of optical sheets 121 on the light guide plate 123 includes a diffusion sheet and at least one light condensing sheet and diffuses or condenses light passing through the light guide plate 123 to form a more uniform The surface light source is made incident.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140, the support main body 200, and the cover bottom 150.

Specifically, the top cover 140 is formed as a rectangular frame whose cross section is bent in the shape of " a " so as to cover the four edges and side surfaces of the upper surface of the liquid crystal panel 110. [ Further, the top cover 140 is opened so as to display an image to be displayed on the liquid crystal panel 110.

The cover bottom 150 on which the liquid crystal panel 110 and the backlight unit 120 are mounted and which is the basis for assembling the entire structure of the liquid crystal display device module is formed into a single flat plate-like horizontal surface.

At this time, at least one edge of the cover bottom 150 is formed at a lower height than the other portions of the cover bottom 150. In addition, a groove (concave and long depressed portion, hereinafter referred to as an insertion groove) 151 for inserting a downward protruding portion 230 (hereinafter referred to as a coupling portion) of one edge of the support main body 200 is formed. That is, the support main body 200 and the cover bottom 150 are assembled together by the fastening part 230 and the fastening groove part 151.

The support main 200 includes a rectangular frame shape having a panel guide 220 in which the liquid crystal panel 110 and the backlight unit 120 are positioned and a panel guide 220 on which the liquid crystal panel 110 is mounted, And the edge of the liquid crystal panel 110 and the backlight unit 120 are disposed.

At least one edge of the support main body 200 is formed with an area (210 in FIGS. 5A and 5B, hereinafter referred to as an LED attachment portion) in which the position of the LED assembly 129 is fixed by a method such as adhesion. The light emitted from the plurality of LEDs 129a of the LED assembly 129 is confronted with the light incidence surface of the light guide plate 123.

5A and 5B) 240 are formed apart from the LED adhering portion 210 so that the light emitted from the LED 129a can be efficiently incident on the light guide plate 123 without leaking. Here, the spacing distance D1 may be a space occupied by the attachment of the LED assembly 129 to the LED adhering portion 210, that is, the width occupied by the LED assembly 129. For example, Accordingly, light emitted from the LED assembly 129 can be concentrated in the direction of the light guide plate 123, thereby preventing light loss.

The coupling part 230 protruding downward is formed at the lower end of the LED adhering part 210 at one edge of the support main 200 to be assembled with the insertion groove part 151 of the cover bottom 150, Same as.

In this case, the top cover 140 may be referred to as a case top or a top case, and the support main 200 may be referred to as a guide panel or a main support or a mold frame. The cover bottom 150 may be referred to as a bottom cover or a bottom cover I will.

The backlight unit 120 having the above-described structure is generally called a side light type, and a plurality of LEDs 129a may be arranged in multiple layers on the PCB 129b according to the purpose. Further, it is apparent to those skilled in the art that it is also possible to provide a plurality of LED assemblies 129 each in correspondence with each other along opposite edges of the cover bottoms 150 facing each other.

Hereinafter, the support main and cover bottom according to the first embodiment of the present invention will be described in more detail with reference to FIGS. 5A and 5B. FIG.

Figs. 5A and 5B are cross-sectional views schematically showing a part of the support main and cover bottoms after the LED array is adhered to the support main, Fig. 5A being a cross-sectional view before the support main and cover bottoms are assembled, Sectional view after the support main and cover bottoms are assembled together.

5A, the support main body 200 is formed of an LED adhering portion 210, a fastening portion 230, a panel guide portion 220, and an LED light-incident portion 240.

The LED bonding portion 210, the fastening portion 230, the panel guide portion 220, and the LED light-incident portion 240 are integrally formed as a metal material.

First, the support main body 200 is formed into a frame shape that surrounds the edges of the backlight unit (120 in FIG. 4) and the liquid crystal panel (110 in FIG. 4).

One edge of the support main 200 can be roughly divided into two parts. Specifically, the first portion 1P extends in the first direction and the second portion 2P extends in the direction perpendicular to the first direction, for example, in the horizontal direction.

The first part 1P and the second part 2P are connected to each other to form a "read" shape. Here, for convenience of explanation, a portion where the first portion 1P and the second portion 2P are connected to each other, that is, a crossed portion is called a third portion 3P.

First, the first portion 1P excluding the third portion 3P is composed of the LED adhering portion 210 and the fastening portion 230.

The LED adhering portion 210 is a portion to which the LED assembly 129 is adhered, and is formed on the upper side of the inner surface of the first portion 1P. 5B) of the first part 1P except for the third part 3P and the back surface of the PCB 129b (the side on which the LED 129a is adhered) And the opposite surface) are adhered. At this time, the side surface of the PCB 129a of the LED assembly 129 may be adhered to the lower surface of the second portion 2P. Here, the width of the LED adhering portion 210 may be the first width W1. The first height H1 of the outer surface of the LED adhering portion 210 may be smaller than the second height H2 of the PCB 129b of the LED assembly 129, for example.

The fastening part 230 is a part to be assembled with the insertion groove part 151 of the cover bottom 150. For this purpose, the fastening portion 230 is formed to further extend in the vertical direction from the LED adhering portion 210 with the second width W2. At this time, the second width W2 has a value smaller than the first width W1, and has a value of the second width W2 from the inner side of the first portion 1P. In other words, the connection portion between the LED adhering portion 210 and the fastening portion 230 is flatly connected along the inner surface of the first portion 1P, and the ' Shape. Accordingly, the fastening portion 230 has a shape protruding from the LED bonding portion 210.

Hereinafter, the second portion 2P will be described.

The second portion 2P except for the third portion 3P is composed of the panel guide portion 220 and the LED light-incident portion 240.

The light incident portion 240 prevents loss of light emitted from the LED 129a and guides the light emitted from the LED 129a to be efficiently incident into the light guide plate 123 of FIG.

The LED light incident portion 240 has a third height H3 and a third width W3 on the bottom surface of the second portion 2P and a shape protruding vertically from the second portion 2P . At this time, the protruded lower surface of the LED light-incident portion 240 may be formed, for example, with two flat surfaces having a step. And is formed at a position spaced apart from the inner surface of the LED adhering portion 210 by the first distance D1.

Specifically, the third height H3 of the LED light-incident portion 240 is adjusted corresponding to the position of the LED 129a of the LED assembly 129. The LED 129a of the LED assembly 129 is mounted on the PCB 129b at which the second height H2 of the PCB 129b is greater than the height of the LED 129a. Accordingly, the PCB 129b is further extended on both the upper and lower sides of the LED 129a, and a portion where light is not emitted is formed.

At this time, the upper side of both upper and lower side surfaces where light is not emitted is covered by the LED light-incident portion 240. That is, the third height H3 of the LED light-incident portion 240 is adjusted in correspondence with the height of the upper surface on which no light is emitted.

The first distance D1 is adjusted corresponding to the width of the LED assembly 129 as described above.

A reflective portion 241 and a light-shielding portion 242 are formed on the lower surface of the LED light-incident portion 240. The reflective portion 241 is formed at a portion of the lower surface of the LED light-incident portion 240 that is close to the LED bonding portion 210 and the light-preventing portion 242 is formed on the LED bonding portion 210 210).

Specifically, the reflective portion 241 of the LED light-incident portion 240 reflects the light emitted from the LED 129a and enters the light guide plate 123 (FIG. 5B). For this, the reflective portion 241 is formed in a portion of the lower surface of the LED light-incident portion 240 that is close to the LED bonding portion 210.

A reflective film RP having high light reflection efficiency is formed on the reflective portion 241 of the LED light-incident portion 240. At this time, the reflection film RP may be formed, for example, by bonding a material used for a reflection plate (125 in FIG. 4) or by coating a synthetic resin having high reflection efficiency or the like.

The light-shielding portion 242 is formed at a portion of the lower surface of the LED light-incident portion 240 remote from the LED bonding portion 210. That is, the bottom surface of the LED light-incident portion 240 is formed at a portion where the reflection portion 241 is not formed.

Shielding tape CT is attached to the light-preventing portion 242 to prevent light emitted from the LED 129a from being emitted to the outside, for example, by attaching a pad or double- can do.

The height of the light-shielding portion 242 may be greater than the height of the reflective portion 241. This is because the light-shielding tape CT attached to the light- So that gaps between the light guide plate 123 and the support main body 200 can be prevented. Accordingly, the light emitted from the LED 129a is prevented from being lost to the outside.

The height of the light shielding portion 242 is adjusted so as to contact the upper surface of the light guide plate 123 (see FIG. 5B) when the support main body 200 and the cover bottom 150 are assembled together (see FIG. Accordingly, the light emitted from the LED 129a can be incident on the light guide plate 123 without loss by blocking the gaps between the support main body 200 and the light guide plate 123. At this time, the width of each of the reflective portion 241 and the light-shielding portion 242 may have a value of, for example, about 1/2 of the third width W3 of the LED light-

Accordingly, the LED light-incident portion 240 efficiently reflects the light emitted from the LED 129a through the reflection portion 241 to the light-incoming surface of the light guide plate 123, and transmits the light through the light-leakage preventing portion 242 to the LED 129a The light guide plate 123 guides the light emitted from the light guide plate 123 to be incident on the light entrance surface of the light guide plate 123 without loss.

The panel guide portion 220 is a portion where the liquid crystal panel (110 of FIG. 4) is seated.

To this end, the panel guide portion 220 is formed at the end portion in the inward direction of the second portion 2P. Specifically, the panel guide 220 is formed at the end of the second portion 2P where the LED light-incident portion 240 is not formed, so that the liquid crystal panel (110 of FIG. 4) is seated.

The panel guide portion 220 is formed to have a fourth width W4 that can cover a portion of the edge of the light guide plate (123 in Fig. 5B).

At this time, the end of the panel guide 220 may be formed in a quadrangular shape having a smaller width as it goes to the lower surface.

Through this, light passing through the light guide plate 123 (FIG. 5B) is efficiently incident on the liquid crystal panel 110 (FIG. 4). 5B) of the LED light-incident portion 240 or the panel guide portion 220 of the light passing through the light guide plate 123 (see FIG. 5B) (110 of FIG. 4) without blocking the light passing through the liquid crystal panel.

In addition, on the upper surface of the panel guide part 220, a heat insulating pad 221 for preventing heat transmission to the liquid crystal panel 110 (FIG. 4) and an impact preventing pad 222 for preventing the shock are formed.

The upper surface of the panel guide part 220 is formed with a second part formed with the LED light-incident part 240 and a second part formed with the light- 2P). That is, the upper surface of the second part 2P has a shape of '┗', and the panel guide part 220 has a shape protruding inward.

Here, the impact-proof pad 222 is formed to adhere to the inner surface of the upper surface of the panel guide portion 220. At this time, the width of the impact-proof pad 222 is formed to be smaller than the width of the heat-insulating pad 221, and is formed to have a narrow width so that a part of the top surface of the panel-guiding part 220, . The height of the impact-proof pad 222 may be formed to have the same value as the height of the panel guide 220, for example, so that the upper surface of the second portion 2P can be formed flat Do.

The heat insulating pad 221 is formed to have a width smaller than that of the impact preventing pad 222 so as to cover the entire upper surface of the panel guide portion 220 where the shock preventing pad 222 is not formed.

At this time, the heat-insulating pad 221 and the shock-preventing pad 222 may be formed of a pad or a double-sided tape having elastic and heat insulating properties. Specifically, it can be composed of, for example, a pad made of rubber or a silicone material or a double-sided tape. Alternatively, it may be formed of a poam pad.

The heat generated from the LED 129a is transmitted through the PCB 129b formed of a metal through the impact preventing pad 222 and the heat insulating pad 221 formed on the upper surface of the panel guide unit 220 to the support main It is possible to prevent the heat transferred to the liquid crystal panel 200 from being transmitted to the liquid crystal panel 110 (FIG. 4).

In addition, the heat-insulating pad 221 and the shock-preventing pad 222 are formed of a material having elasticity to prevent the liquid crystal panel 110 (FIG. 4) from flowing due to the impact applied to the support main 220. Thus, collision between the liquid crystal panel 110 (FIG. 4) and the support main 220 formed of metal is prevented, thereby preventing the liquid crystal panel 110 (FIG. 4) from being broken.

As described above, the support main body 200 according to the first embodiment of the present invention is integrally formed using a metal material. Accordingly, heat of high temperature generated from the LED 129a is transmitted to the support main body 200 through the MPCB 129b. In addition, the row of heat transferred to the support main 200 is transmitted to the cover bottom 150 contacting the support main 200 and is discharged to the outside. As a result, the heat of the high temperature generated from the LED 129a can be quickly and efficiently discharged to the outside.

Hereinafter, the cover bottom 150 according to the first embodiment of the present invention will be described.

First, the coupling part 230 of the support main 200 and the cover bottom 150 are assembled together.

For this purpose, an insertion groove 151 is formed at the edge of the cover bottom 150, for example, at a position corresponding to the coupling part 230 of the support main 200.

The depth of the insertion groove portion 151 allows the end surface of the fastening portion 230 of the support main 200 to have a value capable of fully contacting the cover bottom 150.

The width of the insertion groove 151 is such that both side surfaces of the fastening portion 230 of the support main 200 have a value capable of fully contacting the cover bottom 150.

The height of both edges of the insertion groove 151 is smaller than the height of the other cover bottoms 150. This allows the bottom surface of the PCB 129b after the LED assembly 129 is attached to the outer side of the support main 200 and the support main 200 to be completely in contact with the cover bottom 150 Reference).

That is, in the first embodiment of the present invention, after the LED assembly 129 is attached to the support main body 200 integrally formed, the integrated support main body 200 to which the LED assembly 129 is adhered is attached to the cover bottom 150 Assembled.

After the fastening portion 230 of the support main body 200 and the insertion groove portion 151 of the cover bottom 150 are fastened together, the fastening structure is further fastened with screws 152 to further strengthen the fastening structure. For this purpose, for example, a screw hole (not shown) may be further formed in the fastening part 230 and the cover bottom 150.

Referring to FIG. 5B, the fastening portion 230 of the support main 200 and the insertion groove 151 of the cover bottom 150 are completely adhered to each other, as described above.

The lower surface of the outer side of the support main body 200 and the lower surface of the PCB 129b of the LED assembly 129 are completely adhered to the cover bottom 150 completely. The PCB 129b has a larger width than the LED 129a and the first and second grooves are provided in the second portion of the support main 200 and the cover bottom 150, And the second grooves. Therefore, an increase in thickness of the liquid crystal display device due to the PCB 129b is prevented.

At this time, the fastening part 230 of the support main 200 and the insertion groove part 151 of the cover bottom 150 are fully assembled and fastened through the screw 151.

It is possible to prevent separation of the support main body 200 and the cover bottom 150 from an external impact.

Also, heat of high temperature generated from the LED 129a is transmitted to the photo main 200 through the MPCB 129b. In addition, the row of heat transferred to the support main 200 is transmitted to the cover bottom 150 contacting the support main 200 and is discharged to the outside. In addition, the cover bottom 150 directly contacts the PCB 129b made of the metal of the LED assembly 129, so that the heat transfer can be more efficiently performed. As a result, the heat of the high temperature generated from the LED 129a can be quickly and efficiently discharged to the outside.

The light shielding portion 242 of the LED light incident portion 240 of the support main body 200 is brought into contact with the light guide plate 123 so that light emitted from the LED 129a is incident on the light guide plate 123 Is as described above.

That is, the support main body 200 and the cover bottom 150 according to the first embodiment of the present invention efficiently concentrate the light emitted from the LED 129a to the light incidence surface of the light guide plate 123 without loss. Thus, the luminance and image quality of the liquid crystal panel (110 in Fig. 4) are improved.

The high temperature heat emitted from the LED 129a is efficiently discharged to the outside by connecting the integrated support main body 200 formed of a metal and the cover bottom 150. [

≪ Embodiment 2 >

Hereinafter, a support main according to a second embodiment of the present invention will be described with reference to FIG.

6 is a cross-sectional view schematically showing a support main according to a second embodiment of the present invention.

First, description of the same or similar parts to those of the first embodiment will be omitted.

As shown in FIG. 6, in the second embodiment of the present invention, the reflection portion 1241 of the LED light-incident portion 1240 is formed in a quadrangular shape.

More specifically, the height of the reflective portion 1241 of the LED light-incident portion 1240 is formed in a serpentine shape so as to gradually increase toward the side of the light guide plate (123 in FIG. 5B) from the LED 129a side.

With this configuration, the light emitted from the LED 129a can be more efficiently incident on the light incidence surface of the light guide plate (123 in Fig. 5B). The light emitted from the end of the LED 129a is reflected by the reflecting portion 1241 so as to be incident on the light guide plate 1241. In this case, (123 in FIG. 5B).

That is, the reflective portion 1241 of the LED light-incident portion 1240 is formed in a linear shape, and the light emitted from the LED 129a is more efficiently incident on the light guide plate 123 (FIG.

Hereinafter, effects according to the first and second embodiments of the present invention will be described in more detail with reference to FIG.

7 shows the temperature distribution of the MPCB 129b when the MPCB 129b is closely adhered to the cover bottom 150. As shown in Fig.

7, when the MPCB 129b is closely adhered to the cover bottom 150, the high-temperature heat generated by the LED 129a is directly transmitted to the outside through the MPCB 129b and the cover bottom 150 It can be seen that the temperature of the MPCB 129b is reduced by 10 degrees or more compared to the conventional case (see FIG. 3).

That is, the heat of the high temperature generated by the LED 129a is emitted to the outside more efficiently.

In addition, the support main according to the first and second embodiments of the present invention is formed of a metal resistant to heat, and is not deformed by heat of high temperature generated from the LED 129a. Thus, the side light leakage caused by the deformation of the conventional support main can be prevented.

In addition, since a separate LED housing for emitting heat of the LED 129a is not needed, the space occupied by the LED housing can be utilized, thereby realizing the narrow bezel more efficiently.

Specifically, by omitting the LED housing and designing the LED light-incident portion, the light emitted from the LED 129a can be efficiently guided to the light guide plate. Thus, the narrow bezel can be achieved more efficiently.

Further, the light emitted from the LED is incident on the light guide plate without loss, thereby providing an effect of improving the hot spot phenomenon.

In addition, there is no need to form an LED housing, which increases the productivity and reduces the production cost.

The first embodiment of the present invention described above is an example of the present invention and can be freely modified within the scope of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and equivalents thereof.

123: light guide plate 150: cover bottom 151:
152: screw 200: support main 210: LED adhesive
220: panel guide part 221: heat insulating pad 222: shockproof pad
230: fastening part 240: LED light-incident part 241:
242:

Claims (11)

A liquid crystal panel;
A backlight unit disposed at a lower portion of the liquid crystal panel, the backlight unit including a reflective plate, a light guide plate, and an LED assembly;
A first portion formed with an LED adhering portion on an edge of the liquid crystal panel and the backlight unit and having an LED adhered to an outer side of the LED assembly and a panel guide portion A support main body including two parts;
The cover main body
/ RTI >
Wherein the first portion further includes a fastening portion extending from the LED adhering portion to be assembled with the cover bottom,
And an LED light-emitting part for guiding light emitted from the LED assembly to be incident on the light guide plate is further formed on the lower surface of the second part,
The upper surface of the panel guide part is provided with an anti-shock pad bonded to an inner surface of the panel guide part and having a second width, and a heat insulating pad having a width larger than the second width and smaller than the thickness of the anti- .
The method according to claim 1,
Wherein the LED light-incident portion is spaced apart from the LED light-emitting portion by a first distance,
The panel guide portion may be formed at an end portion of the LED light-
Liquid crystal display device.
The method according to claim 1,
The panel guide part may have a first width that covers the edge of the light guide plate
Liquid crystal display device.
The method of claim 3,
The end of the panel guide part is formed in a quadrangular shape with the first width becoming smaller toward the light guide plate side
Liquid crystal display device.
delete A liquid crystal panel;
A backlight unit disposed at a lower portion of the liquid crystal panel, the backlight unit including a reflective plate, a light guide plate, and an LED assembly;
A first portion formed with an LED adhering portion on an edge of the liquid crystal panel and the backlight unit and having an LED adhered to an outer side of the LED assembly and a panel guide portion A support main body including two parts;
The cover main body
/ RTI >
Wherein the first portion further includes a fastening portion extending from the LED adhering portion to be assembled with the cover bottom,
And an LED light-emitting part for guiding light emitted from the LED assembly to be incident on the light guide plate is further formed on the lower surface of the second part,
The LED light-incident portion includes a reflection portion having a reflection film formed thereon, and a light leakage preventing portion having a height smaller than a height of the reflection portion from the cover bottom and having a light-shielding pad attached thereto.
The method according to claim 6,
The lower surface of the reflective portion may be formed flat,
Liquid crystal display device.
The method according to claim 1,
The cover bottom is formed with a recessed insertion groove portion which is engaged with the coupling portion
Liquid crystal display device.
9. The method of claim 8,
The cover bottom and the support main are further assembled and fastened through a screw after the insertion groove portion and the fastening portion are assembled together
Liquid crystal display device.
The method according to claim 1,
The support main body is made of a metal material
Liquid crystal display device. A liquid crystal panel;
A backlight unit disposed at a lower portion of the liquid crystal panel, the backlight unit including a reflective plate, a light guide plate, and an LED assembly including an LED and a PCB;
A first portion formed with an LED adhering portion which surrounds the edge of the liquid crystal panel and the backlight unit and has an LED adhering portion to which an outer side of the LED assembly is adhered, and a panel guide portion which is perpendicular to the first portion, A support main body including two parts;
And a cover bottom which is assembled with the support main body,
Wherein the first portion further includes a fastening portion extending from the LED adhering portion to be assembled with the cover bottom,
The PCB has a width larger than that of the LED, a first groove is formed in the support main, a second groove is formed in the cover bottom,
Both ends of the PCB are inserted into the first and second grooves, respectively,
Wherein the cover bottom has an insertion groove communicating with the second groove and adapted to receive one end of the support main,
Wherein the cover bottom has a first thickness at a portion overlapped with the light guide plate and a second thickness at a portion where the second groove and the insertion groove are formed, the second thickness being smaller than the first thickness.

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