KR102171283B1 - 밀봉재 조성물 - Google Patents

밀봉재 조성물 Download PDF

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Publication number
KR102171283B1
KR102171283B1 KR1020180049597A KR20180049597A KR102171283B1 KR 102171283 B1 KR102171283 B1 KR 102171283B1 KR 1020180049597 A KR1020180049597 A KR 1020180049597A KR 20180049597 A KR20180049597 A KR 20180049597A KR 102171283 B1 KR102171283 B1 KR 102171283B1
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KR
South Korea
Prior art keywords
sealing material
electronic device
material composition
weight
organic electronic
Prior art date
Application number
KR1020180049597A
Other languages
English (en)
Korean (ko)
Other versions
KR20180121423A (ko
Inventor
최국현
김준형
우유진
유미림
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Publication of KR20180121423A publication Critical patent/KR20180121423A/ko
Application granted granted Critical
Publication of KR102171283B1 publication Critical patent/KR102171283B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H01L51/5246—
    • H01L51/5253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Sealing Material Composition (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
KR1020180049597A 2017-04-28 2018-04-30 밀봉재 조성물 KR102171283B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170055101 2017-04-28
KR1020170055101 2017-04-28

Publications (2)

Publication Number Publication Date
KR20180121423A KR20180121423A (ko) 2018-11-07
KR102171283B1 true KR102171283B1 (ko) 2020-10-28

Family

ID=63918545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180049597A KR102171283B1 (ko) 2017-04-28 2018-04-30 밀봉재 조성물

Country Status (5)

Country Link
JP (1) JP7020495B2 (zh)
KR (1) KR102171283B1 (zh)
CN (1) CN110573565B (zh)
TW (2) TWI817317B (zh)
WO (1) WO2018199705A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102507270B1 (ko) * 2018-12-07 2023-03-07 주식회사 엘지화학 밀봉재 조성물
KR102504355B1 (ko) * 2019-10-11 2023-02-28 주식회사 엘지화학 유기전자소자 봉지용 조성물
CN111574715A (zh) * 2020-05-22 2020-08-25 中国乐凯集团有限公司 组合物及含有其的封装薄膜和制备方法以及电子器件
CN114874159B (zh) * 2022-04-15 2023-09-29 西安瑞联新材料股份有限公司 脂肪族环氧化合物及其组合物与应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014225380A (ja) * 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2466378B1 (en) * 2002-05-03 2014-01-08 DSM IP Assets B.V. Radiation curable resin composition and rapid prototyping process using the same
TWI340763B (en) * 2003-02-20 2011-04-21 Nippon Kayaku Kk Seal agent for photoelectric conversion elements and photoelectric conversion elements using such seal agent
JP4452683B2 (ja) * 2005-01-26 2010-04-21 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
US20070092733A1 (en) * 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
JP5179839B2 (ja) * 2007-11-08 2013-04-10 株式会社ダイセル エポキシ樹脂組成物、及びその硬化物
JP2011184506A (ja) * 2010-03-05 2011-09-22 Shin-Etsu Chemical Co Ltd 放射線硬化性シリコーン組成物
TWI504681B (zh) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
KR101948028B1 (ko) * 2011-03-29 2019-02-14 가부시키가이샤 가네카 활성 에너지선 경화성 코팅용 수지 조성물
KR102091871B1 (ko) * 2012-07-26 2020-03-20 덴카 주식회사 수지 조성물
KR20160048795A (ko) * 2013-08-27 2016-05-04 헨켈 아게 운트 코. 카게아아 경화성 조성물 및 전자 소자에서의 용도
JP5981577B2 (ja) * 2014-12-08 2016-08-31 古河電気工業株式会社 電子デバイス封止用樹脂組成物および電子デバイス
JP6879903B2 (ja) * 2015-03-27 2021-06-02 株式会社Adeka 組成物
KR20170037086A (ko) * 2015-09-25 2017-04-04 주식회사 엘지화학 점착제 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014225380A (ja) * 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法

Also Published As

Publication number Publication date
JP2020518952A (ja) 2020-06-25
TWI817317B (zh) 2023-10-01
WO2018199705A1 (ko) 2018-11-01
CN110573565A (zh) 2019-12-13
TW202233715A (zh) 2022-09-01
CN110573565B (zh) 2022-02-11
JP7020495B2 (ja) 2022-02-16
KR20180121423A (ko) 2018-11-07
TWI760487B (zh) 2022-04-11
TW201841969A (zh) 2018-12-01

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