KR102169566B1 - 유기 증기 제트 프린팅용 노즐 구성 - Google Patents

유기 증기 제트 프린팅용 노즐 구성 Download PDF

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Publication number
KR102169566B1
KR102169566B1 KR1020130025499A KR20130025499A KR102169566B1 KR 102169566 B1 KR102169566 B1 KR 102169566B1 KR 1020130025499 A KR1020130025499 A KR 1020130025499A KR 20130025499 A KR20130025499 A KR 20130025499A KR 102169566 B1 KR102169566 B1 KR 102169566B1
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KR
South Korea
Prior art keywords
nozzle
outlet
organic material
vapor
organic
Prior art date
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KR1020130025499A
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English (en)
Korean (ko)
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KR20130105409A (ko
Inventor
모한 싯다르트 하리크리쉬나
폴 이 버로우즈
Original Assignee
유니버셜 디스플레이 코포레이션
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Application filed by 유니버셜 디스플레이 코포레이션 filed Critical 유니버셜 디스플레이 코포레이션
Publication of KR20130105409A publication Critical patent/KR20130105409A/ko
Application granted granted Critical
Publication of KR102169566B1 publication Critical patent/KR102169566B1/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
    • B05B1/3402—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl to avoid or to reduce turbulencies, e.g. comprising fluid flow straightening means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020130025499A 2012-03-13 2013-03-11 유기 증기 제트 프린팅용 노즐 구성 KR102169566B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261610056P 2012-03-13 2012-03-13
US61/610,056 2012-03-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190089751A Division KR20190089819A (ko) 2012-03-13 2019-07-24 유기 증기 제트 프린팅용 노즐 구성

Publications (2)

Publication Number Publication Date
KR20130105409A KR20130105409A (ko) 2013-09-25
KR102169566B1 true KR102169566B1 (ko) 2020-10-26

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130025499A KR102169566B1 (ko) 2012-03-13 2013-03-11 유기 증기 제트 프린팅용 노즐 구성
KR1020190089751A KR20190089819A (ko) 2012-03-13 2019-07-24 유기 증기 제트 프린팅용 노즐 구성

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020190089751A KR20190089819A (ko) 2012-03-13 2019-07-24 유기 증기 제트 프린팅용 노즐 구성

Country Status (4)

Country Link
US (2) US20130273239A1 (zh)
KR (2) KR102169566B1 (zh)
CN (2) CN103303016B (zh)
TW (1) TWI579403B (zh)

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KR102233750B1 (ko) * 2014-02-12 2021-04-01 한국전자통신연구원 금속 산화물 박막의 형성 방법 및 금속 산화물 박막 프린팅 장치
CN104228314B (zh) * 2014-09-20 2016-09-07 福州大学 一种新型网版曝光晒图方法
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Also Published As

Publication number Publication date
TW201343956A (zh) 2013-11-01
US20180029050A1 (en) 2018-02-01
CN106784310A (zh) 2017-05-31
US11205751B2 (en) 2021-12-21
CN103303016B (zh) 2017-01-18
KR20130105409A (ko) 2013-09-25
CN106784310B (zh) 2020-10-23
CN103303016A (zh) 2013-09-18
TWI579403B (zh) 2017-04-21
US20130273239A1 (en) 2013-10-17
KR20190089819A (ko) 2019-07-31

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