KR102156786B1 - 전기-도금 프로세서의 자동 인­시츄 제어 - Google Patents

전기-도금 프로세서의 자동 인­시츄 제어 Download PDF

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Publication number
KR102156786B1
KR102156786B1 KR1020140073535A KR20140073535A KR102156786B1 KR 102156786 B1 KR102156786 B1 KR 102156786B1 KR 1020140073535 A KR1020140073535 A KR 1020140073535A KR 20140073535 A KR20140073535 A KR 20140073535A KR 102156786 B1 KR102156786 B1 KR 102156786B1
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KR
South Korea
Prior art keywords
wafer
electrode
current flow
current
anode
Prior art date
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KR1020140073535A
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English (en)
Korean (ko)
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KR20140147044A (ko
Inventor
그레고리 제이. 윌슨
폴 알. 맥휴
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20140147044A publication Critical patent/KR20140147044A/ko
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Publication of KR102156786B1 publication Critical patent/KR102156786B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020140073535A 2013-06-18 2014-06-17 전기-도금 프로세서의 자동 인­시츄 제어 KR102156786B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/920,709 US20140367264A1 (en) 2013-06-18 2013-06-18 Automatic in-situ control of an electro-plating processor
US13/920,709 2013-06-18

Publications (2)

Publication Number Publication Date
KR20140147044A KR20140147044A (ko) 2014-12-29
KR102156786B1 true KR102156786B1 (ko) 2020-09-16

Family

ID=52018290

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140073535A KR102156786B1 (ko) 2013-06-18 2014-06-17 전기-도금 프로세서의 자동 인­시츄 제어

Country Status (4)

Country Link
US (1) US20140367264A1 (zh)
KR (1) KR102156786B1 (zh)
CN (1) CN104233423A (zh)
TW (1) TW201504480A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9758897B2 (en) 2015-01-27 2017-09-12 Applied Materials, Inc. Electroplating apparatus with notch adapted contact ring seal and thief electrode
US9765443B2 (en) * 2015-09-02 2017-09-19 Applied Materials, Inc. Electroplating processor with current thief electrode
US10023969B2 (en) * 2016-05-24 2018-07-17 Applied Materials, Inc. Plating power supply with headroom control and ethercat interface
US10494731B2 (en) * 2017-12-11 2019-12-03 Applied Materials, Inc. Electroplating dynamic edge control
KR102619843B1 (ko) * 2018-12-28 2024-01-02 에이씨엠 리서치 (상하이), 인코포레이티드 도금 장치 및 도금 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040007467A1 (en) * 2002-05-29 2004-01-15 Mchugh Paul R. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US6231743B1 (en) * 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
DE10232612B4 (de) * 2002-07-12 2006-05-18 Atotech Deutschland Gmbh Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses
US7645364B2 (en) * 2004-06-30 2010-01-12 Lam Research Corporation Apparatus and method for plating semiconductor wafers
US7837851B2 (en) * 2005-05-25 2010-11-23 Applied Materials, Inc. In-situ profile measurement in an electroplating process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040007467A1 (en) * 2002-05-29 2004-01-15 Mchugh Paul R. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces

Also Published As

Publication number Publication date
KR20140147044A (ko) 2014-12-29
CN104233423A (zh) 2014-12-24
US20140367264A1 (en) 2014-12-18
TW201504480A (zh) 2015-02-01

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