KR102147422B1 - 실록산 수지 조성물 - Google Patents

실록산 수지 조성물 Download PDF

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Publication number
KR102147422B1
KR102147422B1 KR1020187020355A KR20187020355A KR102147422B1 KR 102147422 B1 KR102147422 B1 KR 102147422B1 KR 1020187020355 A KR1020187020355 A KR 1020187020355A KR 20187020355 A KR20187020355 A KR 20187020355A KR 102147422 B1 KR102147422 B1 KR 102147422B1
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KR
South Korea
Prior art keywords
formula
sio
optionally
siloxane
unit
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KR1020187020355A
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English (en)
Korean (ko)
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KR20180095021A (ko
Inventor
아르비드 쿤
영혁 주
프랭크 잔트마이어
현관 양
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와커 헤미 아게
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • H01L33/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
KR1020187020355A 2015-12-18 2016-12-07 실록산 수지 조성물 Expired - Fee Related KR102147422B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015225921.8A DE102015225921A1 (de) 2015-12-18 2015-12-18 Siloxanharzzusammensetzungen
DE102015225921.8 2015-12-18
PCT/EP2016/080087 WO2017102502A1 (de) 2015-12-18 2016-12-07 Siloxanharzzusammensetzungen

Publications (2)

Publication Number Publication Date
KR20180095021A KR20180095021A (ko) 2018-08-24
KR102147422B1 true KR102147422B1 (ko) 2020-08-25

Family

ID=57485516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187020355A Expired - Fee Related KR102147422B1 (ko) 2015-12-18 2016-12-07 실록산 수지 조성물

Country Status (8)

Country Link
US (1) US10655014B2 (https=)
EP (1) EP3341441B1 (https=)
JP (1) JP2019506465A (https=)
KR (1) KR102147422B1 (https=)
CN (1) CN108368340A (https=)
DE (1) DE102015225921A1 (https=)
TW (1) TWI623589B (https=)
WO (1) WO2017102502A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676851B (zh) * 2018-08-22 2019-11-11 隆達電子股份有限公司 畫素陣列封裝結構及顯示面板
WO2020093258A1 (en) * 2018-11-07 2020-05-14 Dow Global Technologies Llc Thermally conductive composition and methods and devices in which said composition is used
JP7321969B2 (ja) * 2020-05-07 2023-08-07 信越化学工業株式会社 熱硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
KR102390970B1 (ko) * 2022-02-22 2022-04-26 주식회사 선한바이오 내열성 및 보존성이 우수한 락토바실러스 플란타럼 sw004 균주 및 이를 이용한 사료첨가제 및 탈취제
CN119522259A (zh) * 2022-08-05 2025-02-25 瓦克化学股份公司 有机硅组合物作为类oca有机硅ocr及使用其粘接显示面板的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155482A1 (ja) * 2010-06-08 2011-12-15 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置

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US5162480A (en) * 1990-12-14 1992-11-10 Union Carbide Chemicals & Plastics Technology Corporation Self-curing ceramicizable polysiloxanes
US5753751A (en) * 1996-10-24 1998-05-19 General Electric Company Process for preparing self-curable alkenyl hydride siloxane copolymers and coating composition
JP4908736B2 (ja) 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
DE102006030003A1 (de) 2006-05-11 2007-11-15 Wacker Chemie Ag Siliconharzbeschichtung für elektronische Bauteile
WO2011162294A1 (ja) 2010-06-24 2011-12-29 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
TWI435914B (zh) 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
JP2012188627A (ja) 2011-03-14 2012-10-04 Sekisui Chem Co Ltd 光半導体装置用レンズ材料、光半導体装置及び光半導体装置の製造方法
JP2012193235A (ja) 2011-03-15 2012-10-11 Sekisui Chem Co Ltd 光半導体装置用コーティング材料及びそれを用いた光半導体装置
KR20140072018A (ko) * 2011-07-07 2014-06-12 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그 경화물, 및 광반도체 장치
DE102011080900A1 (de) * 2011-08-12 2013-02-14 Wacker Chemie Ag Verfahren zur Herstellung von (Hydroxymethyl)polysiloxanen
DE102011081264A1 (de) * 2011-08-19 2013-02-21 Wacker Chemie Ag Vernetzbare Massen auf Basis von organyloxysilanterminierten Polymeren
US8933187B2 (en) * 2011-12-08 2015-01-13 Momentive Performance Material Inc. Self-crosslinking silicone pressure sensitive adhesive compositions, process for making and articles made thereof
DE102012202523A1 (de) * 2012-02-20 2013-08-22 Evonik Industries Ag Verwendung von selbstvernetzten Siloxanen zum Entschäumen von flüssigen Kohlenwasserstoffen
DE102013215102A1 (de) 2013-08-01 2015-02-05 Wacker Chemie Ag Siliconharzzusammensetzung für optische Halbleiter

Patent Citations (1)

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WO2011155482A1 (ja) * 2010-06-08 2011-12-15 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置

Also Published As

Publication number Publication date
WO2017102502A1 (de) 2017-06-22
TWI623589B (zh) 2018-05-11
CN108368340A (zh) 2018-08-03
US10655014B2 (en) 2020-05-19
EP3341441B1 (de) 2019-02-06
EP3341441A1 (de) 2018-07-04
US20180371246A1 (en) 2018-12-27
DE102015225921A1 (de) 2017-06-22
TW201723090A (zh) 2017-07-01
KR20180095021A (ko) 2018-08-24
JP2019506465A (ja) 2019-03-07

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