KR102143763B1 - Polyamide film prevents particle generation in mold - Google Patents

Abstract

The present invention relates to a polyamide film attached among molds to an upper part of a lower mold or a lower part of an upper mold that are used in various processes to prevent particles from generating due to friction between metal surfaces, and configured to exhaust gas generated in the mold to the outside thereby preventing product quality deteoration. In the polyamide film used in the supercritical drying process according to the present invention, a circular through-hole penetrating the top and bottom is formed in the center, and a connection path connected to the through-hole is formed in a form of penetrating the top and bottom from one side, a corrosion surface is formed by corrosion processing on the front of the top, and an adhesive groove into which an adhesive is introduced is formed along the edge of bottom, and the polyamide film is adhered among the molds to each of the upper corners of the lower mold or to the lower corners of the upper mold used in various processes through the adhesive intrduced in the adhesion groove.

Description

Polyamide film prevents particle generation in mold

The present invention relates to a polyamide film that is attached to a mold and prevents the generation of particles due to friction between metal surfaces. More specifically, it is attached to the top of the lower mold or the lower of the upper mold among the molds used in various processes. The present invention relates to a polyamide film that can prevent the generation of particles due to friction between surfaces, and is configured to exhaust gas generated in the mold to the outside, thereby preventing product quality degradation.

In general, in the manufacturing process of semiconductors, a washing process to remove various kinds of foreign substances generated in the process of manufacturing semiconductors and a drying process to dry the washed semiconductors are indispensable, reflecting the reality that semiconductors are becoming larger in recent years. Therefore, the frequency of use of the supercritical drying process, which is a kind of drying process, is increasing.

However, this supercritical drying process uses a supercritical fluid in which liquid and gas cannot be distinguished by reaching a state beyond the limits of a certain high temperature and high pressure, so that metal surfaces that are in contact with each other during the process of opening or closing the mold are used. Particles generated due to friction may be sucked in by the pressure of the supercritical fluid and contaminate the semiconductor substrate.

In addition to the supercritical drying process as described above, in various processes using molds, particles generated due to friction between metal surfaces during opening or closing of the mold may cause a problem of deteriorating product quality, solving such problems. As conventional inventions for the purpose of, inventions such as “a particle removal device for a hemming mold” of Korean Patent Publication No. 10-1046172 and a “particle removal device for a press mold” of Korean Patent Publication No. 10-1139241 have been proposed and disclosed. .

In the “Particle Removal Device for Hemming Mold” of Korean Patent Publication No. 10-1046172, a main brush housing and two auxiliary brush housings are mounted on a suction housing mounted at the tip of the arm of the robot, and particles on the mold according to the shape of the hemming mold The invention is proposed for a device that can guarantee the quality of a hemming molded product by dropping it with each brush and removing it at a time by inhaling it. In the “Particle Removal Device for Press Molds” of the Korean Patent Publication No. 10-1139241, a robot An invention has been proposed for an apparatus capable of increasing the cleanliness of the press process by being configured to immediately suck and remove particles on the mold by dropping particles on the mold by friction by vibration using a brushing unit mounted at the tip of the arm of the machine.

However, the conventional inventions as described above only propose a method for removing particles that have already occurred, but do not propose a method for preventing the generation of particles at the source. As the device becomes complicated, the cost burden is caused accordingly. Occurs.

In addition, in various processes, such as adsorption or scattering of gas remaining on the surface of a semiconductor wafer being dried, there may be a problem that the gas generated and remaining inside the mold degrades the quality of the product inside the mold. As a conventional invention, inventions such as “an injection molding apparatus having a gas exhaust means” of Korean Patent Publication No. 10-1373447 have been proposed and disclosed.

In the “injection molding apparatus having a gas exhaust means” of Korean Patent Publication No. 10-1373447, there is an exhaust runner for discharging residual air remaining in the molding space to the outside during injection molding by injecting the melt into the molding space. As provided, an invention has been proposed for a device capable of preventing defect phenomena such as burn phenomenon, black streak phenomenon, unmolding, blistering phenomenon, etc. However, in this method, a passage for exhausting gas is additionally formed in the mold, The device becomes complicated, such as having to additionally provide a compressor, and there arises a problem in that the cost burden occurs accordingly.

Therefore, by solving all the above problems, it is possible to prevent the generation of particles due to friction between metal surfaces in contact with each other during use of the mold in various processes, and effectively discharge the gas generated inside the mold, Invention of a method to minimize the complexity and cost burden of the device is required.

Korean Registered Patent Publication No. 10-1046172 (2011. 06. 28) Republic of Korea Patent Publication No. 10-1139241 (2012. 04. 17) Republic of Korea Patent Publication No. 10-1373447 (2014. 03. 05)

The polyamide film for preventing the generation of particles in the mold according to the present invention is a technology proposed to solve the above problems,

In the process of opening or closing the mold, there is a problem that particles generated due to friction between metal surfaces in contact with each other degrade the quality of the product.

Since there is a problem that the gas generated inside the mold and the residual gas deteriorates the quality of the product inside the mold, the aim is to present a solution to this, but to present a solution to minimize the complexity of the device and the cost burden. .

The present invention aims to achieve the above object,

A circular through-hole penetrating the top and bottom is formed in the center, the connection path connected to the through hole is formed from one side to the top and bottom, and the corrosion surface by corrosion processing is formed on the front of the top. And the adhesive groove into which the adhesive is inserted is formed along the edge of the lower end, and among the molds used for various processes through the adhesive embedded in the adhesive groove, the upper corners of the lower mold or the lower corners of the upper mold It presents a polyamide film, characterized in that it is configured to adhere to.

In this case, the corrosion surface is subjected to corrosion processing, so that a plurality of upper end portions protruding upward are formed in a round shape, and discharge grooves connected to each other are formed in an irregular shape at the lower portion.

In addition, at the lower end of the polyamide film, an exhaust groove that diffuses from the semiconductor wafer and exhausts the gas remaining in the connection path to the outside of the mold is connected to the connection path through one or more communication paths, and surrounds the adhesive groove. It characterized in that it is formed along the.

The polyamide film for preventing the generation of particles in the mold according to the present invention,

Among the molds used in various processes, it is attached to each upper edge of the lower mold or at each lower edge of the upper mold to prevent direct contact between the lower mold and the upper mold, thus preventing the generation of particles due to friction between metal surfaces. An inhibitory effect occurs,

Since it is configured to exhaust the gas remaining in the mold through the exhaust groove formed in the lower part of the lower mold, the effect of preventing product quality deterioration due to residual gas and minimizing the complexity and cost burden of the device. Occurs.

1 is an external perspective view showing a state of use of a polyamide film for preventing the generation of particles in a mold according to the present invention.
2A to 2E are flow charts showing a process of drying a semiconductor wafer using a polyamide film for preventing particle generation in a mold according to the present invention.
3A and 3B are exemplary views showing various types of connection paths formed in a polyamide film for preventing the generation of particles in a mold according to the present invention.
4 is an exemplary view showing a corrosion surface and an adhesive groove formed on a polyamide film for preventing the generation of particles in a mold according to the present invention.
5 is an exemplary view showing a state in which adhesive grooves and exhaust grooves are formed in a polyamide film for preventing particle generation in a mold according to the present invention.
6A and 6B are exemplary views showing a state in which an auxiliary polyamide film is attached to a through hole and a connection path of a polyamide film for preventing particle generation in a mold according to the present invention.

The present invention is attached to the upper end of the lower mold 10 or the lower end of the upper mold 20 among molds used in various processes to prevent the generation of particles due to friction between metal surfaces, and prevents gas generated in the mold from external It relates to a polyamide film that is configured to be exhausted to prevent product quality degradation,

A circular through-hole 110 penetrating the top and bottom is formed in the center, and the connection path 120 connected to the through-hole 110 is formed to penetrate the top and bottom from one side, and corrosion processing The corrosion surface 130 is formed on the front side of the upper end, and the adhesive groove 140 into which the adhesive 200 is inserted is formed along the edge of the lower end, so that the adhesive 200 inserted into the adhesive groove 140 is It relates to a polyamide film for preventing the generation of particles in the mold, characterized in that it is configured to adhere to each of the upper corners of the lower mold 10 or the lower corners of the upper mold 20 as a medium.

The mold referred to in the present invention is a generic term for various types of molds, vessels, molds, etc. used in various processes such as injection process, compression process, blow molding process, supercritical drying process, etc. Only the supercritical drying process of drying the semiconductor wafer during the process will be described as an example.

Hereinafter, embodiments of a supercritical drying process for drying a semiconductor wafer among various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, as shown in FIG. 1, it is used in a supercritical drying process, which is a process of drying a semiconductor wafer using a supercritical fluid in which a liquid and a gas cannot be distinguished by reaching a state beyond the limit of a certain high temperature and high pressure. The mold is a lower mold 10 in which an internal groove 11 into which a semiconductor wafer is inserted is formed in the center of the upper end, and a column 12 having a predetermined length protrudes from each corner side of the upper end, and the column 12 The insertion hole to be inserted may be composed of an upper mold 20 coupled to the lower mold 10 in a state formed at each corner side of the lower end, and may be configured in a form opposite to this.

At this time, the polyamide film 100 according to the present invention is formed at the upper edge of the lower mold 10 or at the lower end of the upper mold 20 by the process shown in FIGS. 2(a) to 2(e). It is attached to each corner side and can be used to prevent direct friction between the upper metal surface of the lower mold 10 and the lower metal surface of the upper mold 20. For this reason, the polyamide film 100 includes a lower mold ( A through hole 110 for avoiding interference with a pillar 12 protruding upward from 10) or a pillar protruding downward from the upper mold 20 penetrates the upper and lower ends as shown in FIG. 2B. It can be formed in the center of the shape.

Therefore, the through hole 110 is preferably configured in a circular shape in consideration of the shape of the pillar 12 configured in a circular shape, and at the same time, it should be configured in an area capable of inserting the pillar 12, but the polyamide film ( 100) and for minimizing the possibility of flow of the polyamide film 100, which is attached to the top of the lower mold 10 or attached to the lower end of the upper mold 20, the area is the column 12 ) Is preferably formed at a level equal to or close to the same cross-sectional area.

In this case, the correct attachment of the polyamide film 100 means that each of the four polyamide films 100 is at the upper edge of the lower mold 10 or of the upper mold 20 as shown in FIG. 2C. It means that the whole of the lower end is adhered flatly to each corner side of the lower end, and adhered to the other polyamide film 100 in a symmetrical manner.

However, if the area of the through hole 110 and the cross-sectional area of the pillar 12 are formed to be the same or close to the same level, it may be inconvenient to insert the polyamide film 100 into the pillar 12, and through Since damage due to friction with the pillar 12 may occur on the inner wall side of the hole 110, the present invention includes a through hole 110 and a part of the polyamide film 100 as shown in FIG. 2B. By forming a connecting path 120 to be connected, the above problems can be solved.

That is, the connection path 120 is configured to penetrate from one side of the polyamide film 100 to the top and bottom and extend to the through hole 110 to form a free space, and the polyamide film 100 By having flexibility, each polyamide film 100 can be easily adhered to each of the upper corners of the lower mold 10 or to the lower corners of the upper mold 20.

The shape may be formed in a straight line shape, but as shown in FIGS. 3A and 3B, it may be formed in a'C'-shaped or'S'-shaped curved shape.

Meanwhile, as shown in FIG. 4, the polyamide film 100 has a front surface of the polyamide film 100 on the lower end of the upper mold 20 or at the upper end of the lower mold 10. It is characterized in that it is formed in.

In addition, as shown in Figure 5, the upper end of the lower mold 10 or the lower end contacting the lower end of the upper mold 20, the adhesive groove 140 into which the adhesive 200 is inserted is formed along the edge. It features.

Specifically, the polyamide film 100 has one or more corners formed to be rounded according to the shape of the lower mold 10 or the upper mold 20, and the through hole 110 is formed in the center thereof, One side may be configured in a shape in which the connection path 120 is formed.

According to this shape, the adhesive groove 140 may be formed in a shape having the same curvature as that of the polyamide film 100 in a state spaced apart from the edge of the polyamide film 100 by a predetermined distance.

At this time, the width of the adhesive groove 140 may be variously formed depending on the area of the polyamide film 100, but the polyamide having a depth of 0.05 to 1 mm, more preferably 0.18 to 0.2 mm In consideration of the thickness of the film 100, it is characterized in that it is formed to be 0.025 to 0.1 mm, and the adhesive 200 for adhesion to the bottom of the lower mold 10 is inserted therein.

In addition, the adhesive 200 is characterized in that it is composed of a solid adhesive such as a double-sided adhesive or an adhesive having a viscosity of 50% or less compared to a conventional liquid adhesive, which is characterized in that the adhesive groove 140 is the polyamide film It is according to the structural features formed at the bottom of (100).

In addition, the present invention is based on the width (A) and depth (B) of the adhesive groove 140, the width (C) and the thickness (D) of the adhesive 200 inserted into the adhesive groove 140 It is characterized by limiting.

That is, as shown in Figure 4, the present invention is characterized in that the width (C) of the adhesive 200 is formed in a ratio of 14 to 50% based on the width (A) of the adhesive groove 140 And, the thickness (D) of the adhesive 200 is characterized in that it is formed in a ratio of 120 to 200% based on the depth (B) of the adhesive groove 140, which is simply A: B = 1: It can be expressed in terms of 2 to 7 and C: D = 1: 1.2 to 2.

Therefore, since the adhesive 200 has a thickness of 120 to 200% longer than the depth of the adhesive groove 140, a part of the adhesive 200 protrudes higher than the adhesive groove 140 in the state of being inserted into the adhesive groove 140, Since the width is formed to be 14 to 50% shorter than the width of the adhesive groove 140, a space is formed on both sides of the adhesive groove 140 in a state of being inserted therein.

This is, when pressure is applied to the polyamide film 100 to be bonded to the upper end of the lower mold 10 or the lower end of the upper mold 20, the upper area of the adhesive 200 is expanded by the pressure, and the lower mold ( 10) The contact area with the top or the contact area with the top of the upper mold 20 can be expanded, and the expansion to the outside of the adhesive groove 140 is prevented.

According to this configuration, the polyamide film 100 changes or corrects a poorly contacted state in a state in which the lower end is in contact with the upper end of the lower mold 10 or the lower end of the upper mold 20 or is not subjected to pressure. A possible effect is generated, and an effect of preventing a lifting phenomenon that occurs as a part of the adhesive 200 is pushed out of the adhesive groove 140 by pressure is generated.

In addition, since the adhesive 200 is inserted into the adhesive groove 140 formed at the lower end of the polyamide film 100, the flow is limited and should not flow down, but the polyamide film 100 When pressing the upper end, an appropriate viscosity that can be expanded to the entire interior of the adhesive groove 140 is required.

In order to satisfy these conditions, the adhesive 200 includes 20 to 40 parts by weight of a chlorinated polyolefin emulsion resin, 30 to 50 parts by weight of a crosslinked acrylic resin having a butyl acrylate content of 80% by weight or more, and 1 to 5 parts by weight of a solvent. It is preferable to use an adhesive.

In addition, the corrosion surface 130 formed on the top of the polyamide film 100 is at the lower end of the upper mold 20 or the upper end of the lower mold 10 when the lower mold 10 and the upper mold 20 are combined. It is characterized in that it is subjected to corrosion processing, and a plurality of ends protruding upwardly are formed in a round shape at the top, and discharge grooves 131 connected to each other are formed in a regular or irregular shape at the bottom.

Therefore, when the lower mold 10 and the upper mold 20 are combined, a discharge path by the discharge groove 131 is formed between the polyamide film 100 and the upper mold 20, and thus The formed discharge path promotes the discharge of gas scattered toward the polyamide film 100 among gases generated inside the mold, thereby preventing contamination and corrosion of the polyamide film 100 due to adsorption of the gas.

In addition, as described above, since the corrosion surface 130 is a part that comes into contact with the lower end of the upper mold 20 or the upper end of the lower mold 10, the combination of the lower mold 10 and the upper mold 20 A strong frictional force may be generated at the same time as the impact is directly transmitted. However, the present invention forms a plurality of end portions constituting the upper portion of the corrosion surface 130 in a round shape, thereby combining the lower mold 10 and the upper mold 20. The impact can be buffered, and at the same time, generation of particles due to breakage of the distal end can be suppressed.

In addition, at the lower end of the polyamide film 100, an exhaust groove 150 for exhausting gas scattered from the semiconductor wafer and remaining in the connection path 120 to the outside of the mold is provided through one or more communication paths 121 It is connected to the connection path 120 and is characterized in that it is formed along the edge of the lower end in a form surrounding the adhesive groove 140.

That is, the gas scattered from the semiconductor wafer in the state of being inserted into the adhesive groove 140 may be discharged to the outside of the mold through the space formed between the respective polyamide films 100, and a part of it may be discharged through the discharge groove. Although it may be discharged to the outside of the mold, there is a high possibility that a significant amount of gas flows into the connection path 120 and remains.

Therefore, in the present invention, the shape of the connection path 120 can be formed in a'C' shape or a'S'-shaped curved shape to make gas entry into the connection path 120 cost-effective, and the introduced gas is It can be discharged through the discharge groove, and by forming an exhaust groove 150 to exhaust gas by reflecting the volume difference between the connection path 120 and the discharge groove, the gas introduced into the connection path 120 is Allow it to be exhausted to the outside.

At this time, the communication path 121 is preferably formed at least one side of the connection path 120, but in case the area of the through hole 110 is larger than the cross-sectional area of the pillar 12 One or more may be formed on the side of the hole 110, and in this case, it is obvious that the connection path 120 should also be extended to surround the through hole 110.

In addition, the present invention is configured to include a shape corresponding to each of the through hole 110 and the connection path 120, the corrosion surface by the corrosion processing is formed on the front of the top, the adhesive 200 is inserted It may be configured to include an auxiliary polyamide film 300 formed at the bottom of the adhesive groove, the auxiliary polyamide film 300, as shown in Figure 6 (a) and Figure 6 (b), By being attached to the upper end of the absent lower mold 10 or the lower end of the upper mold 20, gas inflow to the through hole 110 and the connection path 120 can be prevented from being introduced.

The embodiments introduced above are provided by way of example in order to sufficiently convey the technical idea of the present invention to those of ordinary skill in the technical field to which the present invention pertains, and the present invention is based on the above-described embodiments. It is not limited and may be embodied in other forms.

In order to clearly describe the present invention, parts irrelevant to the description are omitted from the drawings, and in the drawings, the width, length, thickness, etc. of components may be exaggerated or reduced for convenience.

In addition, the same reference numbers throughout the specification indicate the same elements.

10: lower mold
11: internal groove 12: column
20: upper mold
30: semiconductor wafer
100: polyamide film
110: through hole 120: connection path
121: communication path 130: corrosion surface
131: discharge groove 140: adhesive groove
150: exhaust groove
200: adhesive
300: auxiliary polyamide film

Claims (5)

In the polyamide film 100 attached to the upper end of the lower mold 10 or the lower end of the upper mold 20 among molds used in various processes,
The polyamide film 100,
A circular through hole 110 penetrating the top and bottom is formed in the center,
The connection path 120 connected to the through hole 110 is formed to penetrate the top and bottom from one side,
A corrosion surface 130 by corrosion processing is formed on the front of the top,
The adhesive groove 140 into which the adhesive 200 is inserted is formed along the edge of the bottom,
Of the mold, characterized in that it is configured to be bonded to each of the upper corners of the lower mold 10 or to the lower corners of the upper mold 20 through the adhesive 200 inserted into the adhesive groove 140 Polyamide film to prevent particle generation.
The method of claim 1,
The connection path 120,
A polyamide film that prevents the generation of particles in a mold, characterized in that it is formed in a curved shape of a'C'or'S' shape.
The method of claim 1,
The corrosion surface 130,
Corrosion-processed,
A plurality of ends protruding upwardly are formed in a round shape at the top,
Polyamide film for preventing the generation of particles in the mold, characterized in that the discharge groove 131 is formed in the lower portion to be connected to each other.
The method of claim 1,
The polyamide film 100,
It characterized in that the width of the adhesive 200 is formed in a ratio of 14 to 50% based on the width of the adhesive groove 140,
The thickness of the adhesive 200 is a polyamide film for preventing the generation of particles in the mold, characterized in that formed in a ratio of 120 to 200% based on the depth of the adhesive groove (140).
The method of claim 1,
At the bottom of the polyamide film 100,
An exhaust groove 150 for exhausting gas scattered from the semiconductor wafer and remaining in the connection path 120 to the outside of the mold is connected to the connection path 120 through one or more communication paths 121, and the adhesive groove 140 ), a polyamide film that prevents the generation of particles in a mold, characterized in that it is formed along the edge of the bottom in a form that surrounds.

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