KR102139758B1 - Multi-layered ceramic electronic component and board having the same mounted thereon - Google Patents

Abstract

In the present invention, first and second metal frames are formed to be connected to first and second external electrodes, respectively, which provide voltages of different polarities on mounting surfaces of the ceramic body, and the first and second metal frames are the First and second upper body parts respectively bonded to the first and second external electrodes, and first and second lower body parts disposed to face the first and second upper body parts, respectively, and the first and second It includes first and second support portions connecting one end of the second upper body portion and one end of the first and second lower body portions to each other, and the first and second support portions include the ceramic rather than the first and second external electrodes. Provided is a multilayer ceramic electronic component disposed on a central side of the main body.

Description

Multilayer ceramic electronic component and its mounting board{MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON}

The present invention relates to a multilayer ceramic electronic component and its mounting substrate.

Electronic components using ceramic materials include capacitors, inductors, piezoelectric elements, varistors or thermistors.

Among these ceramic electronic components, a multilayer ceramic capacitor (MLCC) can be used in various electronic devices due to its small size, high volume, and easy mounting.

The multilayer ceramic capacitor is mounted on a substrate of various electronic products such as a computer, personal digital assistants (PDA), or a mobile phone to charge or discharge electricity.

The multilayer ceramic capacitor has a structure in which a plurality of dielectric layers and internal electrodes of different polarities are alternately stacked between the dielectric layers.

Since the dielectric layer has piezoelectricity and total distortion, when a DC or AC voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes and vibration may occur.

The vibration is transmitted to the substrate on which the multilayer ceramic capacitor is mounted through the external electrode of the multilayer ceramic capacitor, thereby generating a vibrating noise that becomes a noise while the entire substrate becomes an acoustic reflective surface.

The vibrating sound may correspond to an audible frequency in the range of 20 to 20,000 Hz that gives discomfort to a person, and the vibrating sound that gives discomfort to a person is called acoustic noise.

Domestic Publication Patent No. 2010-0087622

An object of the present invention is to provide a multilayer ceramic electronic component with reduced acoustic noise and a mounting substrate thereof.

In one aspect of the present invention, first and second metal frames are formed so as to be connected to first and second external electrodes respectively providing voltages having different polarities on mounting surfaces of the ceramic body, and the first and second metals are formed. The frame includes first and second upper body parts respectively bonded to the first and second external electrodes, first and second lower body parts disposed to face the first and second upper body parts, respectively, and It includes first and second support parts connecting one end of the first and second upper body parts and one end of the first and second lower body parts, and the first and second support parts are the first and second external electrodes. More provided is a multilayer ceramic electronic component disposed on the center side of the ceramic body.

According to an embodiment of the present invention, according to an embodiment of the present invention, the upper and lower body parts and the upper and lower body parts are connected to the mounting surface of the external electrode, but the metal has a support part disposed on the center side of the ceramic body than the external electrode. It is possible to reduce acoustic noise of a multilayer ceramic electronic component by forming a frame.

1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line A-A' in FIG. 1 showing a horizontal stacked structure of a multilayer ceramic electronic component according to one embodiment of the present invention.
3 is a cross-sectional view taken along line A-A' in FIG. 1 showing a vertical stacked structure of a multilayer ceramic electronic component according to an embodiment of the present invention.
4 and 5 are perspective views showing another embodiment of a metal frame in the multilayer ceramic electronic component of the present invention.
6 is a cross-sectional view showing a state in which a multilayer ceramic electronic component according to an embodiment of the present invention is mounted on a substrate.
7 is an enlarged cross-sectional view of part D of FIG. 6.
8 is a cross-sectional view showing a state in which a multilayer ceramic electronic component according to another embodiment of the present invention is mounted on a substrate.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below.

In addition, the embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art.

The shape and size of elements in the drawings may be exaggerated for a more clear description.

In addition, components having the same functions within the scope of the same idea shown in the drawings of the respective embodiments will be described using the same reference numerals.

In addition,'comprising' certain components throughout the specification means that other components may be further included instead of excluding other components, unless otherwise stated.

Multilayer ceramic electronic components

1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A' in FIG. 1.

1 and 2, the multilayer ceramic electronic component 100 according to the present embodiment includes a ceramic body 110, first and second external electrodes 131 and 132, and first and second internal electrodes ( 121, 122), and first and second metal frames 141, 142.

The ceramic body 110 is formed by stacking a plurality of dielectric layers 111 in the thickness direction T and then firing them.

At this time, each of the dielectric layers 111 adjacent to each other of the ceramic body 110 may be integrated so that it is difficult to identify a boundary.

In addition, the ceramic body 110 may have a hexahedral shape, but is not limited thereto.

In the present embodiment, for convenience of description, the faces facing each other in the thickness direction T in which the dielectric layers 111 of the ceramic body 110 are stacked are the top and bottom surfaces 2 and 1, and the top and bottom surfaces 2 and 1, respectively. ) In the longitudinal direction (L) of the ceramic body 110 to the first and second side (3, 4), the first and second side (3, 4) perpendicular to the cross and facing each other The surface of the width direction W will be defined as the third and fourth side surfaces 5 and 6 in the width direction.

Meanwhile, the ceramic body 110 may have an upper dielectric cover layer 112 of a predetermined thickness formed on the upper portion of the inner electrode, and a lower dielectric cover layer 113 may be formed on the lower portion of the inner electrode.

At this time, the dielectric cover layers 112 and 113 may be formed of the same composition as the dielectric layer 111, and are formed by stacking at least one dielectric layer that does not include an internal electrode on the upper and lower surfaces of the ceramic body 110.

The dielectric layer 111 may include a high dielectric constant ceramic material, for example, BaTiO ₃ based ceramic powder, and the like, but the present invention is not limited thereto.

In the BaTiO ₃ based ceramic powder, for example, (Ba _{1 -x} Ca _x )TiO ₃ , Ba(Ti _{1 - y} Ca _y )O ₃ , (Ba _{1 - x} ) in which Ca, Zr, etc. are partially dissolved in BaTiO ₃ . Ca _x )(Ti _{1 - y} Zr _y )O ₃ or Ba(Ti _{1 - y} Zr _y )O ₃ , and the like, but the present invention is not limited thereto.

Further, the dielectric layer 111 may further include at least one of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant.

As the ceramic additive, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg) or aluminum (Al) may be used.

The first and second external electrodes 131 and 132 are disposed at both ends of the ceramic body 110, respectively, and if necessary, the ceramic body 110 at the first and second sides 3 and 4 of the ceramic body 110. ) May be formed to extend to a portion of the upper and lower surfaces 2 and 1 or a portion of the third and fourth sides 5 and 6, respectively.

At this time, the first and second external electrodes 131 and 132 may be formed by applying and firing conductive pastes containing conductive metal on both ends of the ceramic body 110.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), or alloys thereof.

On the other hand, the first and second external electrodes 131 and 132 may be plated to form a plating layer by plating the surface if necessary.

The plating layer may include a nickel plating layer formed by plating nickel (Ni) on the first and second external electrodes 131 and 132, and a tin plating layer formed by plating tin (Sn) on the nickel plating layer.

The first and second internal electrodes 121 and 122 are disposed one by one along the thickness direction of the ceramic body 110 with each dielectric layer 111 interposed therebetween.

At this time, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed in the middle.

At this time, the first and second internal electrodes 121 and 122 are first conductive conductive pastes containing conductive metal by using a screen printing method or a gravure printing method on each ceramic green sheet forming the dielectric layer 111. And after printing the second internal electrode pattern, the ceramic green sheets on which the first and second internal electrode patterns are printed have the first and second internal electrode patterns sandwiching the respective dielectric layers 111 therebetween in the thickness direction ( It can be formed by laminating so as to be alternately disposed along T) and then firing.

The conductive metal may be, for example, nickel (Ni), copper (Cu), palladium (Pd), or alloys thereof, and the present invention is not limited thereto.

In addition, the first and second internal electrodes 121 and 122 are exposed through the first and second side surfaces 3 and 4 of the ceramic body 110, respectively, and the first and second voltages of different polarities are applied. It is configured to be connected to the external electrodes 131 and 132, respectively.

According to the above configuration, when voltage is applied to the first and second external electrodes 131 and 132, electric charges are accumulated between the first and second internal electrodes 121 and 122 facing each other.

At this time, the capacitance of the multilayer ceramic electronic component 100 is proportional to the area overlapped with each other along the stacking direction T of the first and second internal electrodes 121 and 122.

Meanwhile, the multilayer ceramic capacitor of the present embodiment may be configured as a vertical stacked type as shown in FIG. 3 in addition to the horizontal stacked type shown in FIG. 2.

Referring to FIG. 3, in the vertically stacked type multilayer ceramic capacitor of the present embodiment, a plurality of dielectric layers are stacked in the width direction of the ceramic body 110, and the first and second internal electrodes 121' and 122' are It is a structure in which a plurality of layers are stacked in the width direction along the stacking direction of the dielectric layer, and the mounting surface of the substrate and the internal electrode of the multilayer ceramic capacitor face vertically when mounted on the substrate.

Since the vertically stacked type multilayer ceramic capacitor has relatively less vibration in the vertical direction (T) and the mounting surface of the substrate than the horizontally stacked type multilayer ceramic capacitor illustrated in FIG. 2, acoustic noise can be further reduced by 3 to 5 dB. Can.

The first and second metal frames 141 and 142 are disposed to be connected to the first and second external electrodes 131 and 132, respectively, on the lower surface 1 which is the mounting surface of the ceramic body 110.

The first and second metal frames 141 and 142 allow the predetermined distance between the multilayer ceramic electronic component 100 and the substrate to be secured when the multilayer ceramic electronic component 100 is mounted on a substrate, etc. The electrode 131 and 132 do not directly contact the solder, but also through a function of directly blocking some of the vibrations transmitted through the first and second external electrodes 131 and 132 of the multilayer ceramic electronic component 100 Reduce acoustic noise.

The first and second metal frames 141 and 142 include first and second upper body parts 141a and 142a, first and second lower body parts 141b and 142b, and first and second support parts ( 141c, 142c).

The first and second upper body parts 141a and 142a are joined to the mounting surfaces of the first and second external electrodes 131 and 132, respectively.

At this time, the maximum width of each of the first and second upper body parts 141a and 142a may be less than 1/2 of the length of the ceramic body 110.

The first and second lower body portions 141b and 142b are disposed to face the first and second upper body portions 141a and 142a and the thickness direction T, respectively, and are joined to the electrode pads of the substrate described later. to be.

At this time, the maximum width of each of the first and second lower body parts 141b and 142b may be less than 1/2 of the length of the ceramic body 110.

The first and second support portions 141c and 142c connect one end of the first and second upper body portions 141a and 142a and one end of the first and second lower body portions 141b and 142b to each other. And it is disposed on the central side of the ceramic body 110 than the second external electrode (131, 132).

According to this configuration, the first and second metal frames 141 and 142 may have shapes of'⊃' or']' and'⊂' or'[', respectively, and the first and second space parts therein (151, 152) may be provided respectively.

Therefore, when the multilayer ceramic electronic component 100 is mounted on a substrate, solder bonds the first and second metal frames 141 and 142 to the substrate, wherein the first and second support portions 141c and 142c are the multilayer ceramic electronics. In addition to spacing the component 100 from the substrate at a predetermined height, the solder is accommodated in the first and second space portions 151 and 152 so that the solder directly contacts the first and second external electrodes 121 and 122. Do not.

The first and second metal frames 141 and 142 may be used as a conductive material, for example, a metal having conductivity, a conductive resin such as conductive epoxy, or a substrate coated with a metal, and the metal frame according to the present invention The material of is not limited to a specific material.

Hereinafter, the relationship between dimensions and acoustic noise of components included in the multilayer ceramic electronic component according to the present embodiment will be described.

Here, the length of the ceramic body 100 is L, the height of the first or second support portions 141c, 142c is A, the width of the first or second lower body portions 141b, 142b is B, and The length of the first or second lower body parts 141b and 142b is defined as C.

At this time, the height A of the first or second support portions 141c and 142c is from the lower end of the first or second support portions 141c and 142c to the lower surface of the first or second upper body portions 141a and 142a. Mean distance.

The polarities of the first and second external electrodes 131 and 132 formed on the first and second side surfaces 3 and 4 of the multilayer ceramic electronic component 100 while the multilayer ceramic electronic component 100 is mounted on a substrate When a different voltage is applied, the ceramic body 110 expands and contracts in the thickness direction by the inverse piezoelectric effect of the dielectric layer 111, and the first and second external electrodes 131 and 132 The first and second side surfaces 3 and 4 of the formed ceramic body 110 undergo contraction and expansion as opposed to expansion and contraction in the thickness direction of the ceramic body 110 by the Poisson effect.

The first and second metal frames 141 and 142 of the present embodiment are configured to secure a predetermined distance between the multilayer ceramic capacitor and the substrate when the multilayer ceramic electronic component 100 is mounted on the substrate. Acoustic noise can be reduced by preventing direct contact between the electrodes 131 and 132 and solder, and by partially relaxing the vibration of the multilayer ceramic capacitor to the substrate through the first and second external electrodes 131 and 132. have.

Further, in the first and second metal frames 141 and 142 of the present embodiment, the solder is accommodated in the first and second space portions 151 and 152, so that the solder is the first and second external electrodes 131 and 132. The effect of preventing direct contact with may be improved.

At this time, the ratio of the area (A×B) of the length-thickness direction (LT) of the first and second space parts 151 and 152 to the area of the length-width direction (LW) of the ceramic body 110 (A ×B)/(C×L) may satisfy the range of 0.0115≦(A×B)/(C×L)≦0.4100.

In addition, the ratio A/C between the height A of the first or second support portions 141c and 142c and the length C of the first or second lower body portions 141b and 142b is 0.079≤A/C≤ The range of 2.748 can be satisfied.

In addition, the ratio (B/L) of the length L of the ceramic body 110 and the width B of the first or second lower body parts 141b and 142b satisfies the range of 0.050≤B/L≤0.471. Can.

When the A or B is too small, when the multilayer ceramic electronic component 100 is mounted on a substrate, the solder rises on the first or second metal frames 141 and 142, and the first or second external electrode of the multilayer ceramic capacitor ( 131, 132) or the elastic force of the first and second metal frames 141, 142 is too large to reduce vibration, and thus the effect of reducing acoustic noise may be reduced.

Meanwhile, as illustrated in FIG. 4, the first and second metal frames 1410 and 1420 of the present invention include first and second external electrodes (at the other ends of the first and second upper body parts 141a and 142a). The first and second guide parts 141d and 142d may be formed to extend upward so as to be joined to a part of the body parts of the 131 and 132, respectively.

In addition, the first and second guide parts 141d and 142d are for improving the bonding strength of the first and second external electrodes 131 and 132 and the first and second metal frames 141 and 142, The first and second guide portions 141d and 142d are formed to extend vertically from the other ends of the first and second upper body portions 141a and 142a.

At this time, the maximum heights of the first and second guide parts 141d and 142d may be formed to be less than 1/3 of the height of the ceramic body 110.

Meanwhile, as illustrated in FIG. 5, the first and second guide parts 141e and 142e of the first and second metal frames 141 ′ and 142 ′ may include first and second upper body parts 141a and 142a. ) May be formed to be inclined at a predetermined angle from the other end.

Experimental example

A multilayer ceramic electronic component according to an embodiment and a comparative example of the present invention was manufactured as follows.

A plurality of ceramic green sheets prepared to a thickness of 1.8 μm is prepared by applying and drying a slurry formed of a powder such as barium titanate (BaTiO ₃ ) on a carrier film.

Next, a conductive paste for a nickel inner electrode is applied to the ceramic green sheet by using a screen to form first and second inner electrodes so that they are alternately exposed through both ends of the ceramic green sheet.

The ceramic green sheets are stacked, for example, by about 370 layers to form a laminate, and the ceramic green sheets on which the first and second internal electrodes are not formed are formed on the first and second internal electrodes 121 and 122. It is placed on the top and bottom of the sheet.

The thus formed laminate was subjected to isostatic pressing at a pressure condition of about 85? To about 1,000 kgf/cm ² .

Subsequently, the laminated body in which the pressing was completed was cut in the form of individual chips, and the cut chips were maintained in the atmosphere for about 230? And about 60 hours to proceed with binder removal.

Next, the ceramic body was prepared by firing in a reducing atmosphere under an oxygen partial pressure of 10 ^-11 to 10 ^-10 atm lower than the Ni/NiO equilibrium oxygen partial pressure so that the first and second internal electrodes were not oxidized at about 1,200 ?.

The size of the ceramic body after firing was about 1.64 mm×0.88 mm (L×W, 1608 size) in length×width (L×W).

Next, the first and second external electrodes are formed at both ends of the ceramic body, respectively.

Next, first and second metal frames are disposed on the lower surface of the ceramic body to be connected to the first and second external electrodes, respectively.

At this time, the first and second metal frames allow the first and second support portions to be disposed on the center side of the ceramic body rather than the first and second external electrodes.

Here, the manufacturing tolerance was set to a range within ±0.1 mm in length×width (L×W), and when this was satisfied, an acoustic noise measurement was performed by experiment.

Sample A (um) B (um) C (um) L (um) A/C B/L (A*B)
/(C*L) Acoustic
Noise (dBA) Implementation
NG One* 57.8 294.5 1252.4 2012.3 0.046 0.146 0.0068 47.4 OK 2* 82.2 294.6 1253.0 2011.6 0.066 0.146 0.0096 45.2 OK 3 98.5 295.1 1252.3 2014.2 0.079 0.147 0.0115 28.7 OK 4 154.3 295.5 1255.3 2015.8 0.123 0.147 0.0180 26.4 OK 5 204.5 296.7 1256.3 2011.5 0.163 0.148 0.0240 26.1 OK 6 311.4 297.6 1253.3 2011.3 0.248 0.148 0.0368 25.2 OK 7 521.8 299.5 1251.6 2015.0 0.417 0.149 0.0620 23.2 OK 8 1047.2 298.7 1254.9 2014.3 0.835 0.148 0.1237 21.3 OK 9 2147.0 299.9 1252.0 2013.6 1.715 0.149 0.2554 19.4 OK 10 3448.7 300.2 1255.1 2012.2 2.748 0.149 0.4100 19.3 OK 11* 4574.1 301.8 1255.4 2011.8 3.643 0.150 0.5466 19.2 NG 12* 310.4 58.3 1256.0 2013.5 0.247 0.029 0.0072 42.5 OK 13* 311.1 81.4 1254.0 2014.7 0.248 0.040 0.0100 41.9 OK 14 312.0 101.5 1255.4 2013.2 0.249 0.050 0.0125 22.7 OK 15 312.3 151.3 1253.8 2015.6 0.249 0.075 0.0187 21.9 OK 16 311.7 204.3 1256.3 2015.1 0.248 0.101 0.0252 20.4 OK 17 310.6 296.6 1252.7 2011.9 0.248 0.147 0.0366 19.5 OK 18 312.1 498.7 1256.4 2013.3 0.248 0.248 0.0615 18.9 OK 19 312.0 948.5 1254.4 2012.1 0.249 0.471 0.1172 18.4 OK

Here, * is a comparative example

In the data of Table 1, the dimensions of the respective parts were measured in the outer shape of the multilayer ceramic electronic component 100 manufactured as shown in FIG. 1.

Here, A, B, C and L, as described above, the length of the ceramic body 100 to L, the height of the first or second support (141c, 142c) to A, the first or second lower body The widths of the portions 141b and 142b were defined as B, and the lengths of the first or second lower body portions 141b and 142b were defined as C.

In order to measure acoustic noise, one sample (a multilayer ceramic electronic component) per substrate for acoustic noise measurement was divided in the vertical direction and mounted on the substrate, and the substrate was mounted on a measuring jig.

Then, DC voltage and voltage fluctuation were applied to both terminals of the sample mounted on the measurement jig using a DC power supply and a function generator.

Then, acoustic noise was measured through a microphone installed directly on the substrate.

Referring to Table 1 above, the area of the length-thickness direction LT of the first and second space portions 151 and 152 relative to the area of the length-width direction LW of the ceramic body 110 (A×B Acoustic noise in samples 3 to 10 and samples 14 to 19, which are examples in which the ratio (A×B)/(C×L) satisfies the range of 0.0115≦(A×B)/(C×L)≦0.4100 It can be seen that is reduced to less than 30 dBA.

In addition, in the case of samples 1, 2, 12, and 13 in which (A×B)/(C×L) is less than 0.0115, the acoustic noise is 40 dBA or more, indicating that there is no acoustic noise reduction effect compared to the embodiment according to the present invention. Can be.

In addition, in the case of Sample 11 in which (A×B)/(C×L) exceeded 0.4100, acoustic noise was found to be less than 20 dBA, but mounting failure occurred.

In Table 1, when the mounting NG is indicated as "NG", it means that the height of the sample is too large, and the chip collapses during the mounting process.

In addition, the ratio A/C between the height A of the first or second support portions 141c and 142c and the length C of the first or second lower body portions 141b and 142b is 0.079≤A/C≤ 2.748, and the ratio (B/L) of the length (L) of the ceramic body 110 and the width (B) of the first or second lower body parts 141b and 142b at the same time is 0.050 ≤ B/L It can be seen that acoustic noise is reduced when the range of ≤0.471 is satisfied.

Multilayer ceramic electronic component mounting board

6 and 7, the mounting substrate 200 of the multilayer ceramic electronic component 100 according to the present embodiment includes a substrate 210 on which a multilayer ceramic capacitor is mounted horizontally, and an upper surface of the substrate 210. It includes spaced apart first and second electrode pads 221 and 222.

At this time, the multilayer ceramic electronic component 100 includes first and second lower body parts 141b and 142b of the first and second metal frames 141 and 142, respectively, and first and second electrode pads 221 and 222, respectively. It may be electrically connected to the substrate 210 by solders 231 and 232 in a state in contact with the top.

When the voltage is applied while the multilayer ceramic electronic component 100 is mounted on the substrate 210 as described above, acoustic noise may occur.

At this time, the sizes of the first and second electrode pads 221 and 222 are the first and second external electrodes 131 and 132 and the first and second electrode pads 221 and 222 of the multilayer ceramic electronic component 100. It can be an index for determining the amount of the solder (231, 232) connecting, and the size of the acoustic noise can be adjusted according to the amount of the solder (231, 232).

Meanwhile, as illustrated in FIG. 6, when the width B of the first or second lower body portions 141b and 142b of the first and second metal frames 141 and 142 is increased, the multilayer ceramic electronic component When (100) is mounted on the substrate 210, the cross-sectional area of the current path (CP) decreases, so that the increase in ESL can be suppressed.

Although the embodiments of the present invention have been described in detail above, the scope of rights of the present invention is not limited thereto, and it is possible that various modifications and variations are possible without departing from the technical details of the present invention as set forth in the claims. It will be apparent to those skilled in the art.

100; Multilayer ceramic electronic components
111; Dielectric layer
110; Ceramic body
112, 113; Cover layer
121, 122; First and second internal electrodes
131, 132; First and second external electrodes
141, 142; First and second metal frames
151, 152; 1st and 2nd space part
200; Mounting board
210; Board
221, 222; First and second electrode pads
231, 232; Solder

Claims (16)

First and second metal frames are formed to be connected to the first and second external electrodes, respectively, which provide voltages of different polarities on the mounting surface of the ceramic body,
The first and second metal frames include first and second upper body parts that are bonded to the first and second external electrodes, respectively, and first and second opposing first and second upper body parts, respectively. 2 lower body parts, and the first and second upper body parts, and the first and second lower body parts, the first and second support parts connecting to each other,
The first and second support portions are disposed at the center side of the ceramic body in the longitudinal direction of the ceramic body, and are disposed at the center side of the ceramic body, and the first and second external electrodes in the thickness direction of the ceramic body. And multilayer ceramic electronic components that do not overlap.
According to claim 1,
Define the length of the ceramic body as L, the height of the first or second support portion as A, the width of the first or second lower body portion as B, and the length of the first or second lower body portion as C when doing,
A multilayer ceramic electronic component satisfying the range of 0.0115≤(A×B)/(C×L)≤0.4100.
According to claim 1,
Define the length of the ceramic body as L, the height of the first or second support portion as A, the width of the first or second lower body portion as B, and the length of the first or second lower body portion as C when doing,
A multilayer ceramic electronic component that satisfies the range of 0.079≤A/C≤2.748 and satisfies the range of 0.050≤B/L≤0.471.
According to claim 1,
The maximum width of each of the first and second lower body portions is less than 1/2 of the length of the ceramic body.
A ceramic body including a plurality of dielectric layers and the dielectric layers interposed therebetween and including a plurality of first and second internal electrodes alternately exposed in a longitudinal direction of the ceramic body;
First and second external electrodes disposed on both ends of the ceramic body and connected to the first and second internal electrodes, respectively; And
First and second metal frames disposed on the mounting surface of the ceramic body to be connected to the first and second external electrodes, respectively; It includes,
The first and second metal frames may include first and second upper body parts that are respectively bonded to mounting surfaces of the first and second external electrodes, and first and second upper body parts that face each other. The first and second lower body parts, and the first and second support parts connecting the ends of the first and second upper body parts and the ends of the first and second lower body parts to each other,
The first and second support portions are disposed at the center side of the ceramic body in the longitudinal direction of the ceramic body, and are disposed at the center side of the ceramic body, and the first and second external electrodes in the thickness direction of the ceramic body. And multilayer ceramic electronic components that do not overlap.
The method of claim 5,
The ceramic body is a multilayer ceramic electronic component in which a dielectric layer and first and second internal electrodes are horizontally stacked with respect to a mounting surface.
The method of claim 5,
The ceramic body is a multilayer ceramic electronic component in which a dielectric layer and first and second internal electrodes are vertically stacked with respect to a mounting surface.
The method of claim 5,
Define the length of the ceramic body as L, the height of the first or second support portion as A, the width of the first or second lower body portion as B, and the length of the first or second lower body portion as C when doing,
A multilayer ceramic electronic component satisfying the range of 0.0115≤(A×B)/(C×L)≤0.4100.
The method of claim 5,
Define the length of the ceramic body as L, the height of the first or second support portion as A, the width of the first or second lower body portion as B, and the length of the first or second lower body portion as C when doing,
A multilayer ceramic electronic component that satisfies the range of 0.079≤A/C≤2.748 and satisfies the range of 0.050≤B/L≤0.471.
The method of claim 5,
The maximum width of each of the first and second lower body portions is less than 1/2 of the length of the ceramic body.
The method of claim 5,
A multilayer ceramic electronic component in which first and second guide portions are formed to extend upward so as to be joined to a portion of the body portion of the first and second external electrodes, respectively, at the other ends of the first and second upper body portions.
The method of claim 11,
The first and second guide parts are multilayer ceramic electronic components formed to extend vertically from the other ends of the first and second upper body parts.
The method of claim 12,
The maximum height of the first and second guide portions is less than 1/3 of the height of the ceramic body.
The method of claim 11,
The first and second guide parts are multilayer ceramic electronic components formed to extend obliquely from the other ends of the first and second upper body parts.
The method of claim 5,
The ceramic body is a multilayer ceramic electronic component in which a dielectric cover layer is disposed on top of a top internal electrode and below a bottom inner electrode.
A substrate having a plurality of electrode pads thereon; And
The multilayer ceramic electronic component of any one of claims 1 to 15 disposed on the substrate; A mounting substrate for a multilayer ceramic electronic component comprising a.

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