KR102136128B1 - Apparatus for treating substrate and nozzle unit - Google Patents

Abstract

The present invention provides an apparatus for liquid processing a substrate. An apparatus for processing a substrate includes a processing container that provides a processing space therein; A substrate support unit for supporting and rotating the substrate in the processing container; And a nozzle unit that supplies a processing liquid on the substrate; The nozzle unit includes a nozzle that discharges a processing liquid; And it may include a UV supply for irradiating ultraviolet rays to activate the radicals of the treatment liquid supplied to the substrate.

Description

Apparatus for treating substrate and nozzle unit

The present invention relates to an apparatus for liquid processing a substrate.

In order to manufacture a semiconductor device, various processes such as photo, deposition, ashing, etching, ion implantation, and cleaning are performed. Among these processes, photography, ashing, etching, and cleaning processes are processes for processing a substrate, and various types of solutions are supplied onto the substrate.

In general, a liquid processing process of a substrate supplies a processing liquid on the substrate to process the substrate. As an ashing step of removing the photosensitive film from the thin film on the substrate during the liquid treatment process, the photosensitive film is removed by activating radicals of the treatment liquid. As a method of activating the radicals of the treatment liquid, a method of treating a photosensitive film using a strong acid or a strong base chemical is included.

However, when the photosensitive film is treated with a chemical of strong acid or strong base, it is difficult to clean carbon contamination and impurities in the air, and it causes process defects such as changing the distance between the pattern (CD:Critical Dimension).

In order to solve this, a method of treating a photosensitive film using ozone water has been proposed, and ozone water is activated with radicals by ultraviolet light. The radical-activated ozone water is discharged from the nozzle to treat the substrate.

However, in the process of being discharged from the nozzle and supplied to the substrate, as the discharge distance and discharge time become longer, radicals decrease. To solve this problem, a method of treating the substrate by increasing the concentration of ozone water has been proposed, but this is a factor of environmental pollution.

In addition, the ultraviolet rays are irradiated by the light irradiation member, and the light irradiation member is installed inside the nozzle 2 or in the liquid supply line 6 as shown in FIG. 1. The light irradiation member 4 includes a lamp, and the lamp may end of life or be damaged. Due to this, ozone water in which radicals are deactivated is supplied to the substrate W and may cause a defect in the liquid treatment process.

The present invention is to provide an apparatus and a nozzle unit capable of minimizing contamination and damage of a light irradiation member due to scattering and contact of a treatment liquid supplied to a substrate.

The present invention is to provide a device and a nozzle unit capable of supplying a large amount of radical activated liquid on a substrate.

In addition, the present invention is to provide an apparatus and a nozzle unit capable of supplying a large amount of radicals to a substrate without increasing the concentration of ozone water.

The problem to be solved by the present invention is not limited to this, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, a processing container providing a processing space therein; A substrate support unit for supporting and rotating the substrate in the processing container; And a nozzle unit that supplies a processing liquid on the substrate; The nozzle unit includes a nozzle that discharges a processing liquid; And it may be provided with a substrate processing apparatus including a UV supply for irradiating ultraviolet rays to activate the radicals of the treatment liquid supplied to the substrate.

In addition, the nozzle unit is an arm that is provided with the nozzle and the ultraviolet supply; And it may include an arm drive for moving the arm.

In addition, the UV supply unit is a lamp tube with both ends sealed to form a discharge space therein; And a pair of connector parts installed at both ends of the lamp tube and having a filament; The lamp tube may be formed in a U shape having a horizontal portion provided parallel to the substrate and a vertical portion extending vertically from both ends of the horizontal portion and having the connector portion installed.

In addition, the arm includes a lamp mounting portion having a space in which the ultraviolet supply portion is accommodated; In the storage space, a bottom surface facing the substrate is opened, and a horizontal portion of the lamp tube may be positioned on the opened bottom surface.

In addition, the lamp tube may be provided with a material that transmits ultraviolet rays emitted from the lamp.

In addition, the lamp tube may be provided with a material including quartz glass.

In addition, the ultraviolet light supply unit may further include a reflector to direct the ultraviolet light emitted from the lamp tube toward the substrate.

In addition, the reflector may include a reflective surface formed of a flat or curved surface.

In addition, the ultraviolet light supply unit may further include a lamp protection tube installed on the outside of the lamp tube so as to surround and protect the lamp tube.

In addition, the treatment liquid may include ozone water or pure water.

According to another aspect of the invention, the arm; A nozzle that is coupled to the arm and discharges the processing liquid to the substrate; And an ultraviolet lamp which is coupled to the arm and irradiates ultraviolet rays to activate radicals of the treatment liquid supplied on the substrate; The ultraviolet lamp may include a lamp tube provided to be exposed toward the substrate and a connector part installed at both ends of the lamp tube, and the connector part may be provided with a nozzle unit positioned in a closed space from the outside.

In addition, the lamp tube may be formed in a U-shape including a vertical portion connected to the connector portion and a horizontal portion extending from the vertical portion and provided horizontally with the substrate surface.

In addition, the connector portion may be accommodated in the storage space of the lamp mounting portion formed on the arm so as to be protected from the processing liquid supplied to the substrate.

In addition, the storage space includes a first space in which the lamp tube is located and a second space in which the connector portion is located, wherein the first space and the second space are partitioned by partition walls, and the first space is a substrate. One side facing toward can be opened.

In addition, the horizontal portion may be exposed through an open surface of the first space.

Further, the nozzle may be positioned adjacent to the center of the horizontal portion.

In addition, the treatment liquid may include ozone water or pure water.

In addition, the ultraviolet lamp may further include a reflector that has a reflective surface formed of a flat or curved surface and directs ultraviolet light emitted from the lamp tube toward the substrate.

In addition, the UV lamp may further include a lamp protection tube installed outside the lamp tube so as to wrap and protect the lamp tube.

According to the embodiment of the present invention, the irradiation member that irradiates ultraviolet rays is positioned close to the liquid supplied on the substrate. Due to this, it is possible to supply a large amount of activated radicals from a low-concentration treatment liquid on the substrate.

According to the embodiment of the present invention, the irradiation member that irradiates ultraviolet rays has a special effect of improving durability and stability by preventing the connector portion from contacting the treatment liquid in advance.

According to the embodiment of the present invention, the lamp is made of a U-shape and can be positioned close to the substrate, thereby increasing the radical activation of the treatment liquid and improving the process performance.

The effects of the present invention are not limited to the above-described effects, and the effects not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a cross-sectional view showing a typical liquid supply unit.
2 is a front view schematically showing a mask cleaning facility according to an embodiment of the present invention.
3 is a plan view showing an index module, a lower buffer, and a lower processing module.
4 is a plan view showing a transfer frame, an upper buffer, and an upper processing module.
5 is a plan view of the mask cleaning apparatus illustrated in FIG. 3.
6 is a side view of the mask cleaning apparatus of FIG. 5.
7 is a perspective view showing the arm.
8 to 9 are views for explaining the UV supply installed in the arm in FIG.
10 and 11 are views for explaining the lamp mounting portion of the arm.
12 is a view showing a first modification of the ultraviolet light supply unit
13 is a cross-sectional view taken along line AA shown in FIG. 12.
14 is a view showing a second modification of the ultraviolet light supply unit.
15 is a view for explaining a problem that occurs when using a straight UV lamp.

The present invention can be applied to a variety of transformations and may have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all conversions, equivalents, and substitutes included in the spirit and scope of the present invention. In the description of the present invention, when it is determined that a detailed description of known technologies related to the present invention may obscure the subject matter of the present invention, the detailed description will be omitted.

The terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “include” or “have” are intended to indicate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, and that one or more other features are present. It should be understood that the existence or addition possibilities of fields or numbers, steps, operations, components, parts or combinations thereof are not excluded in advance.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from other components.

Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are assigned the same reference numbers regardless of reference numerals, and duplicated thereof. The description will be omitted.

2 is a front view schematically showing a mask cleaning facility 1 according to an embodiment. 3 is a plan view showing the index module 10, the lower buffer 60, and the lower processing module 30. 4 is a plan view showing the transfer frame 140, the upper buffer 70, and the upper processing module 40.

2 to 4, the mask cleaning facility 1 has an index module 10 and a process processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process processing module 20 are sequentially arranged in series. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process processing module 20 are arranged is referred to as an X direction 12. And when viewed from the top, the direction perpendicular to the X direction 12 is called the Y direction 14, and the direction perpendicular to the plane including the X direction 12 and the Y direction 14 is called the Z direction 16. .

The carrier 18 in which the mask is accommodated is mounted on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the Y direction 14. The number of load ports 120 may increase or decrease depending on process efficiency and footprint conditions of the process processing module 20. A slot (not shown) is formed in the carrier 18 to support the edge of the mask. A plurality of slots are provided in the Z direction 16, and the masks are positioned in the carrier such that they are stacked apart from each other along the Z direction 16.

The process processing module 20 has an upper processing module 40 and a lower processing module 30. The upper processing module 40 and the lower processing module 30 each have a transport housing 240, a buffer unit 220, and a process housing 260.

The transfer housing 240 is arranged in the longitudinal direction parallel to the X direction (12). Process housings 260 are disposed on one side and the other side of the transfer housing 240 along the Y direction 14, respectively. The process housings 260 on one side and the other side of the transfer housing 240 are provided to be symmetrical to each other with respect to the transfer housing 240. A plurality of process housings 260 are provided on one side of the transport housing 240. Some of the process housings 260 are disposed along the longitudinal direction of the transport housing 240. In addition, some of the process housings 260 are arranged to be stacked with each other. That is, process housings 260 may be disposed on one side of the transfer housing 240 in an A X B arrangement.

Where A is the number of process housings 260 provided in a line along the X direction 12 and B is the number of process housings 260 provided in a line along the Y direction 14. When four or six process housings 260 are provided on one side of the transport housing 240, the process housings 260 may be arranged in an arrangement of 2 X 2 or 3 X 2. The number of process housings 260 can be increased or decreased. Unlike the above, the process housing 260 may be provided only on one side of the transport housing 240. In addition, unlike the above, the process housing 260 may be provided as a single layer on one side and both sides of the transport housing 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer housing 240. The buffer unit 220 provides a space between the process housing 260 and the carrier 18 before the mask is transported. The buffer unit 220 has an upper buffer 70 and a lower buffer 60. The upper buffer 70 is positioned above the lower buffer 60. The upper buffer 70 is disposed at a height corresponding to the upper processing module 40. The lower buffer 60 is disposed at a height corresponding to the lower processing module 30. Each of the upper buffer 70 and the lower buffer 60 is provided with a slot in which a mask is placed, and a plurality of slots are spaced apart from each other along the Z direction 16. The buffer unit 220 has a surface facing the transfer frame 140 and a surface facing the transfer housing 240 open.

The transfer frame 140 carries a mask between the carrier 18 seated on the load port 120 and the buffer unit 220. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided with its longitudinal direction parallel to the Y direction 14. The index robot 144 is installed on the index rail 142, and is linearly moved in the Y direction 14 along the index rail 142.

The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the Z direction 16 on the base 144a. Further, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b, which is provided to move forward and backward relative to the body 144b. A plurality of index arms 144c are provided to be individually driven. The index arms 144c are arranged to be stacked in a state spaced apart from each other along the Z direction 16. Some of the index arms 144c are used when conveying the mask from the process processing module 20 to the carrier 18, and another part of it is transporting the mask 500 from the carrier 18 to the process processing module 20 Can be used when This can prevent particles generated from the mask 500 before the process processing from being attached to the mask after the process processing in the process of the index robot 144 importing and exporting the mask.

The transfer housing 240 conveys the mask between the buffer unit 220 and the process housing 260 and between the process housings 260. The transfer housing 240 is provided with a guide rail 242 and a main robot 244. The guide rail 242 is arranged such that its longitudinal direction is parallel to the X-direction 12. The main robot 244 is installed on the guide rail 242, which is linearly moved along the X direction 12 on the guide rail 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the Z direction 16 on the base 244a. Further, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, which is provided to move forward and backward relative to the body 244b. A plurality of main arms 244c are provided to be individually driven. The main arms 244c are arranged to be stacked in a state spaced apart from each other along the Z direction 16.

A mask cleaning apparatus is provided in the process housing 260 to perform a cleaning process on the mask. The mask cleaning device may have a different structure depending on the type of cleaning process to be performed. Alternatively, the mask cleaning device in each process housing 260 may have the same structure. According to an example, the lower processing module 40 may include a chamber performing a wet cleaning process and a chamber performing a cooling process. The upper treatment module 30 may include a chamber performing a dry and functional water cleaning process and a chamber performing a heating process.

Hereinafter, the mask cleaning apparatus may be a chamber that performs the wet cleaning process described above. An example of a mask cleaning apparatus for cleaning a mask and removing organic substances using ultraviolet rays and chemicals will be described. The present invention is applicable to cleaning various substrates such as semiconductor wafers and liquid crystal substrates in addition to masks.

5 is a plan view showing the mask cleaning apparatus 1000 illustrated in FIG. 3. 6 is a side view showing the mask cleaning apparatus 1000 of FIG. 5.

The mask cleaning apparatus 1000 removes organic substances on the mask surface.

5 and 6, the mask cleaning apparatus 1000 includes a housing 1100, a container 1200, a support member 1300, and a nozzle unit 1400.

The housing 1100 provides a closed interior space. A fan filter unit (not shown) may be installed on the upper wall of the housing 1100. The fan filter unit generates vertical airflow downward in the space inside the housing 1100.

The container 1200 is disposed within the housing 1100. The container 1200 prevents chemicals (treatment liquid) used in the process and fumes generated during the process from being splashed or leaked to the outside. The container 1200 has a space in which the upper portion is opened and the mask 500 is processed.

The support member 1300 is located in the container 1200. The support member 1300 supports the mask 500 during processing. The support member 1300 includes a support plate 1320, a chucking pin 1340, a support shaft 1360, and a support plate driver 1380.

The support plate 1320 is generally provided in a circular shape. The support plate 1320 has a larger diameter than the mask 500. The support plate 1320 supports the mask 500. While the chemical is being supplied, the mask 500 is supported on the support plate 1320 facing upward. Chucking pins 1340 are provided on the upper surface of the support plate 1320. The chucking pins 1340 protrude upward from the upper surface of the support plate 1320. The chucking pins 1340 prevent the mask 500 from laterally disengaging from the support plate 1320 by centrifugal force when the support plate 1320 is rotated. When the mask 500 is placed in place on the support plate 1320, two chucking pins 1340 are provided at each corner of the mask 500. Therefore, eight chucking pins 1340 are provided as a whole. During the process, the chucking pins 1340 support the four corners of the mask 500 to prevent the mask 500 from deviating from its original position. The support shaft 1360 is connected to the lower center of the support plate 1320. The support shaft 1360 supports the support plate 1320. The support shaft 1360 is provided to correspond to the central axis of the support plate 1320. A support plate driver 1380 is connected to a lower end of the support shaft 1360. The support plate driver 1380 rotates the support plate 1320. The support shaft 1360 transmits the rotational force of the support plate driver 1380 to the support plate 1320. The support plate driver 1380 is controlled by a controller. The support plate driver 1380 may include a motor.

The lifting unit (not shown) moves the container 1200 in the vertical direction so that the relative height of the support plate 1320 relative to the container 1200 is adjusted. The lifting unit lowers the container 1200 so that the support plate 1320 protrudes above the container 1200 when the mask 500 is loaded on the support plate 1320 or unloaded from the support plate 1320.

The nozzle unit 1400 is disposed on one side of the container 1200. The nozzle unit 1400 removes organic substances from the mask 500 by providing treatment liquid and ultraviolet light to the top surface of the mask 500. The nozzle unit 1400 includes a nozzle 1410, an arm 1420, an arm support shaft 1430, an arm driving unit 1440, and an ultraviolet light supply unit 1460.

The arm 1420 is provided in a rod shape, and supports the nozzle 1410 and the UV supply 1460. The arm 1420 may be disposed in a lengthwise direction parallel to the support plate 1320. The nozzle 1410 is coupled to one end of the arm 1420, and the other end of the arm 1420 is coupled to the arm support shaft 1430. The arm support shaft 1430 supports the arm 1420. The arm 1420 is provided in its longitudinal direction in the vertical direction. The arm 1420 may be rotated and elevated about the arm support shaft 1430 by the arm driver 1440 as a central axis. An arm driver 1440 is provided at a lower end of the arm support shaft 1430.

The arm driver 1440 moves the nozzle 1410 between the standby position and the process position. The standby position is the side position of the housing 1100. The process position is the vertical upper position of the support plate 1320. The process location may include a first processing location and a second processing location.

The processing liquid supply unit 1450 includes a processing liquid supply source 1452 and a processing liquid supply line 1454. The treatment liquid supply line 1454 connects the treatment liquid supply source 1452 and the nozzle 1410. The treatment liquid stored in the treatment liquid supply source 1452 is supplied to the nozzle 1410 through the treatment liquid supply line 1454. A valve for opening and closing the processing liquid supply line 1454 may be installed on the processing liquid supply line 1454. For reference, the treatment liquid may include O3DIW, DIW.

7 is a perspective view showing an arm, FIGS. 8 to 9 are views for explaining a UV supply installed in the arm in FIG. 7, and FIGS. 10 and 11 are views for explaining a lamp mounting part of the arm.

Referring to FIGS. 7 to 11, the ultraviolet light supply unit 1460 (hereinafter referred to as an ultraviolet lamp) provides ultraviolet light for activating radicals of the processing liquid supplied on the substrate.

The ultraviolet lamp 1460 may include a lamp tube 1462 and a connector portion 1466. For example, the ultraviolet rays of the ultraviolet lamp 1460 may have a wavelength range of 185 to 254 nm. The lamp tube 1462 may be provided with an ultraviolet transmittance of 90% or more. For example, the lamp tube 1462 may be made of a material including quartz glass.

Both ends of the lamp tube 1462 may be sealed to form a discharge space therein. The lamp tube 1462 may be provided in a U-shape having a horizontal portion 1462a provided parallel to the substrate and a vertical portion 1462b extending vertically upward from both ends of the horizontal portion 1462a. The lamp tube 1462 having such a unique shape has an advantage that the horizontal portion 1462a can be super close to the processing liquid discharged to the substrate.

The connector portions 1466 may be respectively installed at both ends of the lamp tube 1462. The connector portion 1466 may include a filament 1467 positioned inside the vertical portion 1462b of the lamp tube 1460. In general, the filament 1467 may be composed of a double coil and a triple coil made of a tungsten coil, and the tungsten coil may be coated with barium oxide, strontium oxide, and calcium oxide, which are materials that easily emit hot electrons. The connector portion 1466 may include terminals 1468 protruding to receive external power. The connector portion 1466 may be connected to a connection socket 1469 fixedly installed on the arm 1420.

In the present invention, the connector portion 1466 and the connection socket 1469 are located in a closed area (corresponding to the second space) in the storage space 1422 of the arm 1420 so that the connector portion 1466 and the connection socket 1469 The problem that the processing liquid is in contact with the connection portion can be prevented in advance.

Meanwhile, the arm 1420 may provide a lamp mounting unit 1422 having a space in which the ultraviolet light supply unit 1460 is accommodated. In the storage space 1424, a bottom surface facing the substrate is opened, and a horizontal portion 1462a of the lamp tube 1462 is positioned on the opened bottom surface.

More specifically, the storage space 1424 of the lamp mounting portion 1422 includes a first space 1424a and a second space 1424b, and the first space 1424a and the second space 1424b are partition walls ( 1424c).

The first space 1424a may be provided with one surface facing the substrate open. A lamp tube 1462 is positioned in the first space 1424a, and a connector portion 1466 can be positioned in the second space 1424b. The second space 1424b may be isolated from the external environment. The first space may be provided with one surface facing the substrate open.

As described above, the nozzle 1410 and the ultraviolet light supply unit 1460 are installed on the arm 1420, so that the nozzle 1410 and the ultraviolet light supply unit 1460 swing together to activate radicals of the processing liquid discharged to the substrate. .

Referring to FIG. 15, the UV lamp 1460 has a U-shaped lamp tube 1462 so that the horizontal portion of the lamp tube 1462 can be positioned closer to the substrate. If the lamp tube of the ultraviolet lamp has a straight shape, there is a limit in narrowing the gap between the substrate and the lamp tube due to the connector portions installed at both ends of the lamp tube.

However, the U-shaped lamp tube 1462 can be positioned closer to the substrate 500 than the straight-type lamp tube by providing the connector portion in the vertical portion, thereby maximizing the intensity of ultraviolet rays reaching the substrate to maximize the processing liquid. It is possible to increase the efficiency of OH radical activation.

In addition, it is possible to prevent the connector portion 1466 from being contaminated with scattering and contact with the treatment liquid, thereby improving the durability and safety of the cable connected to the connector portion 1466.

In the present invention, it has been described that the lamp tube irradiates ultraviolet light at a position spaced apart from the treatment solution, but if necessary, the lamp tube may be contacted with the treatment solution to irradiate ultraviolet light. This is possible because the connector part is completely protected from the processing liquid.

12 is a view showing a first modification of the ultraviolet light supply unit, and FIG. 13 is a cross-sectional view taken along line A-A shown in FIG. 12.

12 and 13, the ultraviolet light supply unit 1460a includes a lamp tube 1462a and a connector part 1466a, which include a lamp tube 1462 and a connector part of the ultraviolet light supply part 1460 shown in FIG. Since it is generally provided with a similar configuration and function as (1466), the following description will focus on the differences from the present embodiment.

In this modified example, the ultraviolet supply unit 1460a further includes a reflector 1470, which is different. The reflector 1470 may direct ultraviolet rays emitted from the lamp tube 1462 toward the substrate to maximize the intensity of the ultraviolet rays that hit the substrate. The reflector 1470 may include a reflective surface 1472 formed as a curved surface. However, the reflective surface 1472 is not limited thereto, and may be formed in a flat or other shape.

14 is a view showing a second modification of the ultraviolet light supply unit.

Referring to FIG. 14, the ultraviolet light supply part 1460b includes a lamp tube 1462b and a connector part 1466b, which are lamp tube 1462 and connector part 1466 of the ultraviolet light supply part 1460 shown in FIG. 10. Since it is provided in a substantially similar configuration and function, the following will describe a modified example mainly based on the difference from the present embodiment.

In this modification, the UV supply unit 1460b further includes a lamp protection tube 1474. The lamp protection tube 1474 may be installed outside the lamp tube 1462b to prevent the lamp tube 1462b from being damaged from external impact.

The above detailed description is to illustrate the present invention. In addition, the above-described content is to describe and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, it is possible to change or modify the scope of the concept of the invention disclosed in the present specification, the scope equivalent to the disclosed contents, and/or the scope of technology or knowledge in the art. The embodiments described describe the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Therefore, the detailed description of the above invention is not intended to limit the present invention to the disclosed embodiments. In addition, the appended claims should be construed to include other embodiments.

1000: mask cleaning device 1200: container
1300: support member 1320: support plate
1400: nozzle unit 1410: nozzle
1420: Arm 1460: UV supply

Claims (19)

In the apparatus for processing a substrate,
A processing container providing a processing space therein;
A substrate support unit for supporting and rotating the substrate in the processing container; And
A nozzle unit for supplying a processing liquid on the substrate;
The nozzle unit
A nozzle for discharging the treatment liquid; And
In order to activate the radicals of the treatment liquid supplied to the substrate includes an ultraviolet supply unit for irradiating ultraviolet rays,
The ultraviolet supply unit
A lamp tube having both ends sealed to form a discharge space therein; And
It is installed on both ends of the lamp tube, and includes a pair of connector parts provided with a filament;
The lamp tube
A substrate processing apparatus having a horizontal portion provided parallel to a substrate and a vertical portion formed vertically upward from both ends of the horizontal portion and provided with the connector portion. According to claim 1,
The nozzle unit
An arm in which the nozzle and the ultraviolet light supply unit are installed; And
A substrate processing apparatus including an arm driver for moving the arm. delete According to claim 2,
The arm
A lamp mounting part having a space in which the ultraviolet light supply part is accommodated;
In the storage space, a bottom surface facing the substrate is opened, and a horizontal portion of the lamp tube is located on the opened bottom surface. According to claim 1,
The lamp tube
A substrate processing apparatus provided with a material that transmits ultraviolet rays emitted from the lamp. According to claim 1,
The lamp tube is a substrate processing apparatus made of a material containing quartz glass (Quartz glass). According to claim 1,
The ultraviolet supply unit
A substrate processing apparatus further comprising a reflector to direct ultraviolet rays emitted from the lamp tube toward the substrate. The method of claim 7,
The reflector shade is a substrate processing apparatus including a reflective surface formed in a flat or curved surface. According to claim 1,
The ultraviolet supply unit
A substrate processing apparatus further comprising a lamp protection tube installed outside the lamp tube so as to wrap and protect the lamp tube. According to claim 1,
The processing liquid is a substrate processing apparatus containing ozone water or pure water. Arm;
A nozzle that is coupled to the arm and discharges the processing liquid to the substrate; And
A UV lamp coupled to the arm and irradiating ultraviolet rays to activate radicals of the treatment liquid supplied on the substrate;
The ultraviolet lamp
It includes a lamp tube provided to be exposed toward the substrate and a connector part installed at both ends of the lamp tube, the connector part is located in a closed space from the outside,
The lamp tube is a nozzle unit comprising a vertical portion connected to the connector portion and provided perpendicular to the substrate surface, and a horizontal portion extending from the vertical portion and provided horizontally with the substrate surface. delete The method of claim 11,
The connector portion
The nozzle unit accommodated in the storage space of the lamp mounting part formed in the arm so as to be protected from the processing liquid supplied to the substrate. The method of claim 13,
The storage space includes a first space in which the lamp tube is located and a second space in which the connector portion is located,
The first space and the second space are partitioned by partition walls,
The first space is a nozzle unit with one surface open toward the substrate. The method of claim 14,
The horizontal portion is a nozzle unit exposed through an open surface of the first space. The method of claim 11,
The nozzle is a nozzle unit positioned adjacent to the center of the horizontal portion. The method of claim 11,
The treatment liquid is a nozzle unit containing ozone water or pure water. The method of claim 11,
The ultraviolet lamp
Nozzle unit having a reflective surface formed of a flat or curved surface, and further comprising a reflector to direct the ultraviolet light emitted from the lamp tube toward the substrate. The method of claim 11,
The ultraviolet lamp
A nozzle unit further comprising a lamp protection tube installed outside the lamp tube so as to wrap and protect the lamp tube.

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