KR102125124B1 - 제품의 제조 장치 및 제조 방법 - Google Patents

제품의 제조 장치 및 제조 방법 Download PDF

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Publication number
KR102125124B1
KR102125124B1 KR1020180021772A KR20180021772A KR102125124B1 KR 102125124 B1 KR102125124 B1 KR 102125124B1 KR 1020180021772 A KR1020180021772 A KR 1020180021772A KR 20180021772 A KR20180021772 A KR 20180021772A KR 102125124 B1 KR102125124 B1 KR 102125124B1
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KR
South Korea
Prior art keywords
light
rotating grindstone
rotating
image
detection mechanism
Prior art date
Application number
KR1020180021772A
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English (en)
Korean (ko)
Other versions
KR20180120070A (ko
Inventor
쇼이치 가타오카
히로토 모치즈키
Original Assignee
토와 가부시기가이샤
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Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20180120070A publication Critical patent/KR20180120070A/ko
Application granted granted Critical
Publication of KR102125124B1 publication Critical patent/KR102125124B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020180021772A 2017-04-26 2018-02-23 제품의 제조 장치 및 제조 방법 KR102125124B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017087010A JP6462761B2 (ja) 2017-04-26 2017-04-26 製品の製造装置及び製造方法
JPJP-P-2017-087010 2017-04-26

Publications (2)

Publication Number Publication Date
KR20180120070A KR20180120070A (ko) 2018-11-05
KR102125124B1 true KR102125124B1 (ko) 2020-06-19

Family

ID=64095041

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180021772A KR102125124B1 (ko) 2017-04-26 2018-02-23 제품의 제조 장치 및 제조 방법

Country Status (4)

Country Link
JP (1) JP6462761B2 (zh)
KR (1) KR102125124B1 (zh)
CN (1) CN108789104B (zh)
TW (1) TWI672739B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6661109B1 (ja) * 2018-12-05 2020-03-11 株式会社テクノホロン 破損検出機構
CN110170908B (zh) * 2019-03-28 2024-03-22 北京百慕合金有限责任公司 砂轮切割设备及切割方法
JP7366493B2 (ja) * 2019-08-02 2023-10-23 株式会社ディスコ 切削装置、及び切削ブレードの監視方法
JP6886506B1 (ja) * 2019-11-29 2021-06-16 Dmg森精機株式会社 表示装置、画像処理装置、工作機械および液体の放出方法
CN112846967A (zh) * 2021-01-05 2021-05-28 宁波舜邦模具科技有限公司 一种模具导柱孔加工装置及其加工工艺
JP7394799B2 (ja) * 2021-02-10 2023-12-08 Ｔｏｗａ株式会社 検査装置、樹脂成形装置、切断装置、樹脂成形品の製造方法、及び、切断品の製造方法
CN114972227B (zh) * 2022-05-17 2024-04-16 大连交通大学 一种砂轮气孔率识别方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217135A (ja) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd 切削装置
JP2015198191A (ja) * 2014-04-02 2015-11-09 株式会社ディスコ 切削装置
JP2016221629A (ja) 2015-05-29 2016-12-28 Ｔｏｗａ株式会社 製造装置及び製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980073100A (ko) * 1997-03-12 1998-11-05 윤종용 절단 날의 깨짐을 감지하는 센서를 갖는 반도체 웨이퍼 절단 장치
TW527260B (en) * 2001-11-05 2003-04-11 Topoint Technology Co Ltd System and method for inspecting emery wheel profile
JP5172383B2 (ja) * 2008-02-25 2013-03-27 株式会社ディスコ 切削ブレード検出機構
JP2011110631A (ja) * 2009-11-25 2011-06-09 Disco Abrasive Syst Ltd 切削装置
JP5421763B2 (ja) * 2009-12-24 2014-02-19 ヤマハ発動機株式会社 検査装置および検査方法
JP5546292B2 (ja) * 2010-03-04 2014-07-09 ヤマハ発動機株式会社 検査装置および検査方法
JP5668416B2 (ja) * 2010-11-05 2015-02-12 セイコーエプソン株式会社 光学式検出装置、電子機器及び光学式検出方法
JP5712746B2 (ja) * 2011-04-06 2015-05-07 セイコーエプソン株式会社 センシング装置および電子機器
JP2016007673A (ja) 2014-06-25 2016-01-18 株式会社ディスコ 切削装置
JP2017024093A (ja) * 2015-07-17 2017-02-02 Ｔｏｗａ株式会社 切断装置及び切断方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217135A (ja) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd 切削装置
JP2015198191A (ja) * 2014-04-02 2015-11-09 株式会社ディスコ 切削装置
JP2016221629A (ja) 2015-05-29 2016-12-28 Ｔｏｗａ株式会社 製造装置及び製造方法

Also Published As

Publication number Publication date
CN108789104A (zh) 2018-11-13
JP2018186190A (ja) 2018-11-22
JP6462761B2 (ja) 2019-01-30
CN108789104B (zh) 2020-09-25
KR20180120070A (ko) 2018-11-05
TW201839839A (zh) 2018-11-01
TWI672739B (zh) 2019-09-21

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