KR102118133B1 - 레이저 처리 장치 및 방법 - Google Patents

레이저 처리 장치 및 방법 Download PDF

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Publication number
KR102118133B1
KR102118133B1 KR1020180000330A KR20180000330A KR102118133B1 KR 102118133 B1 KR102118133 B1 KR 102118133B1 KR 1020180000330 A KR1020180000330 A KR 1020180000330A KR 20180000330 A KR20180000330 A KR 20180000330A KR 102118133 B1 KR102118133 B1 KR 102118133B1
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KR
South Korea
Prior art keywords
substrate
height
detection
detection unit
region
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KR1020180000330A
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English (en)
Korean (ko)
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KR20190082568A (ko
Inventor
김민수
박세영
송현석
Original Assignee
에이피시스템 주식회사
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Priority to KR1020180000330A priority Critical patent/KR102118133B1/ko
Priority to TW107144413A priority patent/TW201937778A/zh
Priority to CN201811609820.5A priority patent/CN109994395A/zh
Publication of KR20190082568A publication Critical patent/KR20190082568A/ko
Application granted granted Critical
Publication of KR102118133B1 publication Critical patent/KR102118133B1/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H01L51/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L51/0027—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Recrystallisation Techniques (AREA)
KR1020180000330A 2018-01-02 2018-01-02 레이저 처리 장치 및 방법 KR102118133B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180000330A KR102118133B1 (ko) 2018-01-02 2018-01-02 레이저 처리 장치 및 방법
TW107144413A TW201937778A (zh) 2018-01-02 2018-12-11 雷射處理裝置及雷射處理方法
CN201811609820.5A CN109994395A (zh) 2018-01-02 2018-12-27 激光处理设备及激光处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180000330A KR102118133B1 (ko) 2018-01-02 2018-01-02 레이저 처리 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20190082568A KR20190082568A (ko) 2019-07-10
KR102118133B1 true KR102118133B1 (ko) 2020-06-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180000330A KR102118133B1 (ko) 2018-01-02 2018-01-02 레이저 처리 장치 및 방법

Country Status (3)

Country Link
KR (1) KR102118133B1 (zh)
CN (1) CN109994395A (zh)
TW (1) TW201937778A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110277327B (zh) * 2019-07-22 2024-03-22 深圳市艾特自动化有限公司 一种在线式石墨舟中硅片的检测系统及检测方法
CN113182957A (zh) * 2021-05-13 2021-07-30 安徽力幕新材料科技有限公司 一种覆膜铝箔生产加工的废料收集装置及废料再处理方法
US20240038557A1 (en) * 2022-07-28 2024-02-01 Applied Materials, Inc. Methods and apparatus for processing a substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021941A (ja) * 1998-07-06 2000-01-21 Toshiba Corp ウェーハストレス測定装置及びウェーハ状態測定装置
JP2016025242A (ja) * 2014-07-22 2016-02-08 住友電気工業株式会社 半導体ウエハの反り測定装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3346214B2 (ja) * 1997-03-26 2002-11-18 セイコーエプソン株式会社 結晶性半導体膜の製造方法、およびアニール装置および薄膜トランジスタの製造方法および液晶表示装置用アクティブマトリクス基板
KR101164524B1 (ko) 2009-12-21 2012-07-10 에이피시스템 주식회사 레이저 빔의 라인 길이 조절이 가능한 레이저 가공 장치
KR101777688B1 (ko) 2013-10-21 2017-09-27 에이피시스템 주식회사 가스 분사 유닛 및 이를 포함하는 열처리 장치
JP6272743B2 (ja) * 2014-09-24 2018-01-31 株式会社ニューフレアテクノロジー 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021941A (ja) * 1998-07-06 2000-01-21 Toshiba Corp ウェーハストレス測定装置及びウェーハ状態測定装置
JP2016025242A (ja) * 2014-07-22 2016-02-08 住友電気工業株式会社 半導体ウエハの反り測定装置

Also Published As

Publication number Publication date
TW201937778A (zh) 2019-09-16
KR20190082568A (ko) 2019-07-10
CN109994395A (zh) 2019-07-09

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