KR102110634B1 - 자유형의 주의 영역들을 사용한 웨이퍼 검사 - Google Patents

자유형의 주의 영역들을 사용한 웨이퍼 검사 Download PDF

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KR102110634B1
KR102110634B1 KR1020167001820A KR20167001820A KR102110634B1 KR 102110634 B1 KR102110634 B1 KR 102110634B1 KR 1020167001820 A KR1020167001820 A KR 1020167001820A KR 20167001820 A KR20167001820 A KR 20167001820A KR 102110634 B1 KR102110634 B1 KR 102110634B1
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interest
regions
images
wafer
determining
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KR20160022377A (ko
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케농 우
타오 루오
리셍 가오
유진 쉬프린
아라빈드흐 발라지
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
KR1020167001820A 2013-06-21 2014-06-20 자유형의 주의 영역들을 사용한 웨이퍼 검사 Active KR102110634B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361837936P 2013-06-21 2013-06-21
US61/837,936 2013-06-21
US201361913380P 2013-12-08 2013-12-08
US61/913,380 2013-12-08
US14/168,011 US9171364B2 (en) 2013-06-21 2014-01-30 Wafer inspection using free-form care areas
US14/168,011 2014-01-30
PCT/US2014/043473 WO2014205385A1 (en) 2013-06-21 2014-06-20 Wafer inspection using free-form care areas

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Publication Number Publication Date
KR20160022377A KR20160022377A (ko) 2016-02-29
KR102110634B1 true KR102110634B1 (ko) 2020-05-13

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KR1020167001820A Active KR102110634B1 (ko) 2013-06-21 2014-06-20 자유형의 주의 영역들을 사용한 웨이퍼 검사

Country Status (7)

Country Link
US (1) US9171364B2 (https=)
JP (1) JP6220061B2 (https=)
KR (1) KR102110634B1 (https=)
CN (1) CN105453245B (https=)
IL (1) IL243236B (https=)
TW (1) TWI605249B (https=)
WO (1) WO2014205385A1 (https=)

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US9401016B2 (en) 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection
US10043261B2 (en) * 2016-01-11 2018-08-07 Kla-Tencor Corp. Generating simulated output for a specimen
US10339262B2 (en) * 2016-03-29 2019-07-02 Kla-Tencor Corporation System and method for defining care areas in repeating structures of design data
US10740888B2 (en) * 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
US10146036B2 (en) 2016-06-07 2018-12-04 Globalfoundries Inc. Semiconductor wafer inspection using care area group-specific threshold settings for detecting defects
US11580398B2 (en) * 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
US10679909B2 (en) * 2016-11-21 2020-06-09 Kla-Tencor Corporation System, method and non-transitory computer readable medium for tuning sensitivies of, and determining a process window for, a modulated wafer
US10402688B2 (en) * 2016-12-07 2019-09-03 Kla-Tencor Corporation Data augmentation for convolutional neural network-based defect inspection
US10692690B2 (en) 2017-03-27 2020-06-23 Kla-Tencor Corporation Care areas for improved electron beam defect detection
US10600177B2 (en) * 2017-08-09 2020-03-24 Kla-Tencor Corporation Nuisance reduction using location-based attributes
US10997710B2 (en) 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
CN109560000B (zh) * 2018-11-30 2020-08-25 上海华力微电子有限公司 一种晶圆缺陷扫描方法
US11776859B2 (en) 2018-12-19 2023-10-03 Kla Corporation Care area based swath speed for throughput and sensitivity improvement
US11379972B2 (en) 2020-06-03 2022-07-05 Applied Materials Israel Ltd. Detecting defects in semiconductor specimens using weak labeling
US20220101114A1 (en) * 2020-09-27 2022-03-31 Kla Corporation Interpretable deep learning-based defect detection and classification
US12165306B2 (en) * 2021-03-16 2024-12-10 Kla Corporation Segmentation of design care areas with a rendered design image
US20240370992A1 (en) * 2021-08-27 2024-11-07 Hitachi High-Tech Corporation Computer System and Analysis Method
US20230128610A1 (en) * 2021-10-25 2023-04-27 Kla Corporation Continuous Machine Learning Model Training for Semiconductor Manufacturing

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JP3566470B2 (ja) * 1996-09-17 2004-09-15 株式会社日立製作所 パターン検査方法及びその装置
US8089058B2 (en) 2005-09-01 2012-01-03 Camtek Ltd. Method for establishing a wafer testing recipe
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
US7894659B2 (en) 2007-02-28 2011-02-22 Kla-Tencor Technologies Corp. Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
CN101295659B (zh) * 2007-04-29 2010-06-09 中芯国际集成电路制造(上海)有限公司 半导体器件的缺陷检测方法
US8254661B2 (en) 2008-06-02 2012-08-28 Applied Materials Israel, Ltd. System and method for generating spatial signatures
KR101342203B1 (ko) * 2010-01-05 2013-12-16 가부시키가이샤 히다치 하이테크놀로지즈 Ｓｅｍ을 이용한 결함 검사 방법 및 장치
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JP5722551B2 (ja) * 2010-05-13 2015-05-20 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
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US9171364B2 (en) * 2013-06-21 2015-10-27 Kla-Tencor Corp. Wafer inspection using free-form care areas
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Publication number Publication date
CN105453245A (zh) 2016-03-30
KR20160022377A (ko) 2016-02-29
JP6220061B2 (ja) 2017-10-25
TWI605249B (zh) 2017-11-11
IL243236B (en) 2019-02-28
US9171364B2 (en) 2015-10-27
CN105453245B (zh) 2018-10-26
JP2016524334A (ja) 2016-08-12
TW201510516A (zh) 2015-03-16
US20140376802A1 (en) 2014-12-25
WO2014205385A1 (en) 2014-12-24

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