KR102103975B1 - Space transformer for probe card and Manufacturing method thereof - Google Patents

Abstract

Disclosed is a space converter for a probe card for inspecting whether a semiconductor element is defective. In particular, provided is the space converter having a new structure which can improve versatility. More specifically, one embodiment of the present invention provides the space converter for a probe card, including a plate in which a plurality of through holes are formed, a substrate portion in which a plurality of via holes are formed and a plurality of pads are electrically connected to correspond to the via hole, and a conductive wire having one end penetrating the through hole of the plate, located so as not to protrude from the lower end of the plate, and the other end penetrating the via hole of the substrate portion to be electrically bonded.

Description

Space transformer for probe card and manufacturing method thereof

Disclosed is a space converter used in a probe card for inspecting a semiconductor device for defects, and particularly relates to a space converter having a new structure capable of improving versatility.

Unless otherwise indicated herein, the content described in this section is not prior art to the claims of this application and is not admitted to be prior art by inclusion in this section.

In general, a semiconductor manufacturing process includes a fabrication process for forming an electrical device on a wafer, and an electrical die sorting (EDS) process for inspecting the electrical properties of each device configured on a wafer. , It is manufactured through a package process that assembles a wafer on which a pattern is formed into each chip. Here, the EDS process refers to a process of inspecting a semiconductor device designed on a wafer by applying an electrical signal to determine whether it is operating properly before separating it from the wafer. At this time, the equipment used is a probe card.

The probe card includes a substrate connected to a test device, a probe head contacting a semiconductor element on a wafer, and a space converter connecting the substrate and the probe head. The role of the space converter is to expand the area and spacing of the contact area of the semiconductor so that the pad can contact the test device. As semiconductor chips have recently been highly integrated, the pads of the semiconductor chip have been miniaturized. Roles are becoming important.

Regarding the existing space converter, in Korean Patent Publication No. 10-1047537, a main circuit board having an opening in the center, a lower end coupled to an opening of the main circuit board, and a reinforcing member to prevent deformation of the main circuit board , Seated on the upper side of the reinforcing member, a plurality of through holes are formed on the surface, a sub circuit board electrically connected to the main circuit board, mounted to be positioned below an opening of the main circuit board, and a plurality of through holes on the surface The space transformer (where the space transformer is the same as the space transformer in Korean translation of the space transformer) is formed, and both ends are respectively inserted into the through holes of the sub-circuit board and the space transformer to electrically conduct the sub-circuit board and the space transformer. A plurality of connecting wires and one end are in contact with the conductors fitted in the through holes of the space transducer, and the other end is subject to inspection. To contact the tapered post and a probe card including a probe provided at the lower side of the transducer area.

 However, in order to use the space transformer disclosed in the Korean Patent Publication, there is a problem in that an opening must be formed so that the space transformer can be mounted on the main circuit board, which makes it difficult to design the main circuit board. There was a problem that the bulkiness, the structure was complicated, and the electrical path was long, resulting in poor electrical characteristics.

In addition, a conventional multi-layer ceramic substrate such as MLC (Multi layer ceramic), MLO (Multi layer organic) may be used as a space converter, but there is a problem in that the manufacturing process is difficult and cost is very high.

1. Korean Patent Publication No. 10-1047537

It is intended to provide a space converter that does not penetrate the main circuit board and forms a structure similar to MLC at a low cost, but can be applied to various interfaces.

Disclosed is a plate portion in which a plurality of through-holes are formed, a plurality of via-holes are formed, a substrate portion in which a plurality of pads electrically connected to correspond to the via-holes are formed, and one end penetrates through the through-holes of the plate, It is located so as not to protrude at the lower end, and the other end presents a space converter for a probe card including a conductive wire that is electrically bonded through the via hole of the substrate portion.

In addition, the disclosed content relates to a method for manufacturing a space converter for a probe card, a first step of drilling a through hole in a plate, positioning the conductive wire through the through hole, and then penetrating the conductive wire by an adhesive member. A second step of fixing to the hole, a third step of stacking a substrate portion on which the plurality of via holes are formed and a plurality of pads electrically connected to correspond to the via holes are formed on the plate, once unfixed to the plate of the conductive wire A probe card including a fourth step of electrically bonding, and a fifth step of smoothly polishing the conductive wire penetrated through the through hole and protruding in a bottom direction, and forming a pad, after being positioned to penetrate the via hole. The manufacturing method of the space converter for the present is presented as an example.

According to the disclosed embodiment, by reproducing a structure such as MLC at a low cost, it is possible to combine without penetrating the main circuit board, reducing design constraints of the main circuit board, and space converter capable of combining with various interfaces such as commercial interposers. Can provide.

The effects of the present embodiments are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a cross-sectional view of a space converter for a probe card according to an embodiment of the disclosed content.
Figure 2 is an exploded view of a space converter for a probe card according to an embodiment of the disclosed content.
Figure 3 is a flow diagram of a method of manufacturing a space converter for a probe card according to an embodiment of the disclosed content.
Figure 4 is a schematic diagram of a method of manufacturing a space converter for a probe card according to an embodiment of the disclosed content.
5 is a various use state diagram of the space converter for a probe card according to an embodiment of the disclosed content.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains. It is provided to fully inform the holder of the scope of the invention, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

In describing embodiments of the present invention, when it is determined that a detailed description of known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. And the terms to be described later are terms defined in consideration of functions in an embodiment of the present invention, which may vary according to a user's or operator's intention or practice. Therefore, the definition should be made based on the contents throughout this specification.

Hereinafter, a preferred embodiment of an improved space converter for a probe card will be described with reference to the accompanying drawings.

1 and 2, the space converter 10 for a probe card has a plate 11 on which a plurality of through holes 11-1 are formed and a plurality of via holes 12-1 are formed and the via hole is formed. The substrate portion 12 on which a plurality of pads 12-3 electrically connected to correspond to (12-1) are formed and one end penetrates the through hole 11-1 of the plate 11, but the plate ( 11) is located so as not to protrude from the lower end, and the other end includes a conductive wire 14 that is electrically bonded through the via hole 12-1 of the substrate portion 12. The space converter 10 for the probe card is coupled between the probe card main PCB 40 and the probe head 20 to which the probe pin 21 is coupled, and serves to inspect a semiconductor device.

Looking in more detail with reference to Figures 1 and 2, the plate 11 is made of an insulator, so that the electrical signal can not pass, it is preferably made of a ceramic (ceramic) material. The shape of the plate 11 can achieve a plate shape having a narrow width compared to the width, and the thickness of the portion where the through hole 11-1 of the plate 11 is formed is made thinner than the other portions, thereby forming a branch shape. The groove portion 11-2 can be formed.

The through hole 11-1 formed in the plate 11 may be drilled by a machine tool. It can be physically drilled through a drilling machine, and a process of trimming the inner periphery of the through hole 11-1 can be added. In addition, it can be drilled using a laser. As the integration of semiconductors accelerates, the pads 14-1 located at the lower portion of the space converter 10 must also be formed at a fine pitch, and thus, preferably, a very short-wave (VHF) laser that generates a pulse of a picosecond. It may be used, or using a microwave (UHF) laser that generates a femtosecond pulse to drill the through hole 11-1 in the plate (11). The through-hole 11-1 may be perforated in a circular or polygonal shape, and the width of the through-hole 11-1 may be formed to correspond to the width of the conductive wire 14, and is to be inspected. It can be drilled with a number corresponding to the pad of the semiconductor.

The substrate portion 12 is formed with a plurality of via holes 12-1, and a plurality of pads 12-3 that can be electrically connected to the via holes 12-1 are formed. The via hole 12-1 means that an electrical signal is transmitted by plating the inner wall of a general through hole with a conductive material. The plurality of pads 12-3 corresponding to the via hole 12-1 may be electrically connected, and may be connected by a conducting wire, and may be electrically connected by printing a circuit on the substrate portion 12. Preferably, the circuit can be printed on the upper or lower surface of the substrate portion 12 by a MEMS process, and an electrical signal transmission channel is formed therein using a multi-layer circuit board, so that the via hole 12-1 and the pad are formed. (12-3) can be connected electrically.

One end of the conductive wire 14 passes through the through hole 11-1 of the plate 11, but is positioned so as not to protrude from the lower end of the plate 11, and the other end is the via hole of the substrate portion 12 It can be electrically joined through (12-1). The conductive wire 14 may be formed of a conductive material to transmit electrical signals, and may have a shape having a narrow width and extending in the longitudinal direction. In addition, since the conductive wires 14 are configured to transmit and receive independent signals from each other inside the space converter 10 and not to interfere with each other, it is preferable to form a coating with an insulator on the outer surface of the conductive wires 14. . In addition, since the pitch between the conductive wires 14 is finely formed, it may be desirable to form the thickness of the coating not thick. As the material of the sheath, it must have both flexibility and insulation so as not to be damaged by the movement of the wire.Silicone Rubber (SR), Teflon (Fluororesin), PVC (Polyvinyl-Chloride), PE (Polyethylene), Polyurethane (Polyurethane, PUT), PET (Polyester), or the like may be used, and is not limited to the above examples, and any material capable of shielding noise and interference between the conductive wires 14 may be included. In addition, one end and the other end of the conductive wire 14 fixed or bonded to the plate 11 and the via hole 12-1 are for transmitting an electrical signal, and the covering of the fixed or bonded portion must be removed. Ham will be apparent from the standpoint of a person skilled in the art.

One end of the conductive wire 14 is positioned to penetrate the through hole 11-1 of the plate 11, but can be fixed with an adhesive member to prevent separation. The adhesive member may include any configuration capable of fixing the conductive wire 14 and the plate 11, and preferably can be fixed using an epoxy adhesive having high heat resistance and high electrical insulation properties. One end of the conductive wire 14 positioned not to protrude from the lower end of the plate 11 may form a pad 14-1 for electrical contact. The pad 14-1 is formed to be flat by grinding the cross-section of the conductive wire 14, or leaving only a portion of the conductive wire 14 through mechanical polishing, and vertically cross-sectioning the conductive wire 14 It can be formed by spreading a wide width by pressing in the direction. A hard and excellent corrosion-resistant nickel (Ni) plating layer may be formed on the formed pad 14-1, and a gold (Au) plating layer may be additionally formed on the nickel plating layer to prevent oxidation of the nickel plating layer.

The other end of the conductive wire 14 fixed to the plate 11 is located through the via hole 12-1 formed in the substrate portion 12, but is to be electrically connected to the via hole 12-1. You can. Since the conductive wire 14 is joined to the via hole 12-1 to transmit an electrical signal to the pad 12-3 corresponding to the via hole 12-1, the conductive wire 14 and the The via hole 12-1 may be fixed to maintain electrical characteristics. Preferably it can be by soldering. Soldering may be performed by soft soldering using lead having a melting temperature of 450 ° C or lower and hard soldering using lead having a melting temperature of 450 ° C or higher, and in the case of soft soldering, tin , Lead, aluminum, and zinc alloys can be used. For hard soldering, silver lead, brass lead, aluminum lead, copper lead, and nickel lead can be used.

Between the substrate portion 12 and the plate 11, it may include a gap plate 13 interposed in a state not in contact with the conductive wire (14). The gap plate 13 may be formed in the same shape as the plate 11, an opening 13-1 may be formed so as not to contact the conductive wire 14, and the opening 13-1 is the It may be formed to correspond to the width of the groove portion 11-2 that can be formed on the plate (11). The gap plate 13 may be formed of an insulator to prevent electrical contact with the conductive wire 14, or may be formed of a conductive material to shield external noise. Preferably, the inner surface of the opening 13-1 is formed of an insulator, but the outer surface is formed of a conductive material, thereby preventing electrical contact with the conductive wire 14 and shielding external noise.

The sub-substrate 15 has conductive pads 15-1 and 2 formed on upper and lower surfaces, and conductive pads 15-2 formed on the lower surface and pads 12-3 located on the upper surface of the substrate 12 ) May be stacked to contact each other. The sub-substrate 15 may be electrically connected such that the conductive pad 15-1 formed on the upper surface and the conductive pad 15-2 formed on the lower surface correspond to each other. The sub-substrate 15 may be formed in the same shape as the substrate portion 12, and a conductive pad 15-2 formed on a lower surface of the sub-substrate 15 is formed on the upper surface of the substrate portion 12. It can be formed to correspond to the pad (12-3). The sub-board 15 is an opening in a portion extending to the upper surface of the via hole 12-1 so as not to contact the ball 12-2 formed on the via hole 12-1 of the substrate portion 12 Can be formed. Alternatively, it may be formed only of a portion corresponding to the pad 12-3 formed on the upper surface of the substrate portion 12. A short with the ball 12-2 formed in the via hole 12-1 can be prevented through the sub-board 15, and it can be stably connected to the main PCB of the probe card.

The plate 11, the gap plate 13, the substrate portion 12 and the sub-substrate 15 are stacked, can be adhered by a mutual adhesive member, and secured so as not to be displaced or separated from each other by placing separate supports. You can.

Hereinafter, a method of manufacturing the improved spacer 10 for a probe card according to the above description will be described with reference to FIGS. 3 and 4.

The manufacturing method of the space converter 10 for a probe card is a first step of drilling a through hole 11-1 in the plate 11, and is positioned through the conductive wire 14 in the through hole 11-1. After, the second step of fixing the conductive wire 14 to the through hole 11-1 by an adhesive member, a plurality of via holes 12-1 are formed to correspond to the via holes 12-1. A third step of stacking the substrate portion 12 on which the plurality of pads 12-3 electrically connected are formed on the plate 11, one end that is not fixed to the plate 11 of the conductive wire 14 After being positioned to penetrate the via hole 12-1, the fourth step of electrically bonding and the conductive wire 14 penetrated through the through hole 11-1 and projected in the bottom direction are flatly polished, And a fifth step of forming the pad 14-1.

Looking specifically, in the first step, the through hole 11-1 is drilled in the plate 11. The plate 11 is made of an insulator, and is formed of a material through which an electrical signal cannot pass, and preferably may be formed of a ceramic material. The shape of the plate 11 can achieve a plate shape having a narrow width compared to the width, and the thickness of the portion where the through hole 11-1 is formed is thinner than the other portions, and the branched groove portion 11-2 ). In the above drilling method, the through hole (11-1) can be drilled by a machine tool. It can be physically drilled through a drilling machine, and a process of trimming the inner periphery of the through hole 11-1 can be added. In addition, as the integration of semiconductors is accelerated, the pads 14-1 positioned at the lower portion of the space converter 10 may be punched using a laser so that they can be formed at a fine pitch. In order to allow the through-hole 11-1 to be accurately and cleanly drilled, it is necessary to use an ultra-short-wave (VHF) laser generating a picosecond pulse or an ultra-short-wave (UHF) laser generating a femtosecond pulse. desirable. The through-hole 11-1 may be perforated in a circular or polygonal shape, and the width of the through-hole 11-1 may be formed to correspond to the width of the conductive wire 14, and is to be inspected. It can be drilled with a number corresponding to the pad of the semiconductor.

In the second step, after the conductive wire 14 is positioned through the through hole 11-1, the conductive wire 14 is fixed to the through hole 11-1 by an adhesive member. The conductive wire 14 may be formed of a conductive material to transmit electrical signals, and may have a shape having a narrow width and extending in the longitudinal direction. In addition, since the conductive wires 14 are configured to transmit and receive independent signals from each other inside the space converter 10 and not to interfere with each other, it is preferable to form a coating with an insulator on the outer surface of the conductive wires 14. . In addition, since the pitch between the conductive wires 14 is finely formed, it may be desirable to form the thickness of the coating not thick. As the material of the sheath, it must have both flexibility and insulation so as not to be damaged by the movement of the wire.Silicone Rubber (SR), Teflon (Fluororesin), PVC (Polyvinyl-Chloride), PE (Polyethylene), Polyurethane (Polyurethane, PUT), PET (Polyester), or the like may be used, and is not limited to the above examples, and any material capable of shielding noise and interference between the conductive wires 14 may be included. In addition, one end and the other end of the conductive wire 14 fixed or bonded to the plate 11 and the via hole 12-1 are for transmitting an electrical signal, and the covering of the fixed or bonded portion must be removed. Ham will be apparent from the standpoint of a person skilled in the art. One end of the conductive wire 14 is placed through the through hole 11-1 and fixed to the through hole 11-1 by an adhesive member, wherein the adhesive member is the conductive wire 14 and the It may include any configuration capable of fixing the plate 11, and preferably can be fixed using an epoxy adhesive having high heat resistance and high electrical insulation properties.

In the third step, the plate 11 is formed with a substrate portion 12 on which a plurality of via holes 12-1 are formed and a plurality of pads 12-3 electrically connected to correspond to the via holes 12-1 are formed. To stack on. The via hole 12-1 formed in the substrate portion 12 is configured to be plated with a conductive material on the inner wall of a general through hole, so that an electrical signal can be transmitted, and the plurality of via holes 12-1 correspond to the via hole 12-1. The pads 12-3 of may be electrically connected, and may be connected by a conducting wire, and may be electrically connected by printing a circuit on the substrate portion 12. Preferably, the circuit can be printed on the upper or lower surface of the substrate portion 12 by a MEMS process, and an electrical signal transmission channel is formed therein using a multi-layer circuit board, so that the via hole 12-1 and the pad are formed. (12-3) can be connected electrically. The substrate portion 12 is stacked on the plate 11, the via hole 12-1 of the substrate portion 12 is stacked to a position that can be connected to the other end of the conductive wire 14 is not fixed. desirable.

Alternatively, the substrate portion 12 may be stacked on the plate 11 under the interposition of a gap plate 13 separating the substrate portion 12 without being in contact with the conductive wire 14. That is, the step of stacking the substrate portion 12 on the plate 11 in the third step may include a step of interposing a gap plate 13 between the substrate portion 12 and the plate 11. You can. The gap plate 13 may be formed in the same shape as the plate 11, an opening 13-1 may be formed so as not to contact the conductive wire 14, and the opening 13-1 It may be formed to correspond to the width of the groove portion 11-2 that can be formed on the plate (11). The gap plate 13 may be formed of an insulator to prevent electrical contact with the conductive wire 14, or may be formed of a conductive material to shield external noise. Preferably, the inner surface of the opening 13-1 is formed of an insulator, but the outer surface is formed of a conductive material, thereby preventing electrical contact with the conductive wire 14 and shielding external noise.

In the fourth step, one end that is not fixed to the plate 11 of the conductive wire 14 is positioned to penetrate the via hole 12-1, and then electrically bonded. Since the conductive wire 14 is joined to the via hole 12-1 to transmit an electrical signal to the pad 12-3 corresponding to the via hole 12-1, the conductive wire 14 and the The via hole 12-1 may be fixed to maintain electrical characteristics. Preferably it can be by soldering. Soldering may be performed by soft soldering using lead having a melting temperature of 450 ° C or lower and hard soldering using lead having a melting temperature of 450 ° C or higher, and in the case of soft soldering, tin , Lead, aluminum, and zinc alloys can be used. For hard soldering, silver lead, brass lead, aluminum lead, copper lead, and nickel lead can be used.

In the fifth step, the conductive wire 14, which penetrates through the through hole 11-1 and protrudes in the bottom direction, is polished flat to form a pad 14-1. The protruding conductive wire 14 may be cut so that only a certain portion remains, and the cross-section may be flattened through mechanical polishing to form a pad 14-1. Alternatively, a portion of the conductive wire 14 may be left through the mechanical polishing, and a cross-section of the conductive wire 14 may be pressed in a vertical direction to spread wide to form a pad 14-1. A hard and excellent corrosion-resistant nickel (Ni) plating layer may be formed on the formed pad 14-1, and a gold (Au) plating layer may be additionally formed on the nickel plating layer to prevent oxidation of the nickel plating layer.

After the fifth step, the sixth step of stacking the sub-substrate 15 on the upper and lower conductive pads 15-1 and 2 on the upper surface of the substrate portion 12 may be further included. The conductive pad 15-2 formed on the lower surface of the sub-substrate 15 and the pad 12-3 located on the upper surface of the substrate portion 12 may be stacked to contact each other. The sub-substrate 15 may be electrically connected such that the conductive pad 15-1 formed on the upper surface and the conductive pad 15-2 formed on the lower surface correspond to each other. The sub-substrate 15 may be formed in the same shape as the substrate portion 12, and a conductive pad 15-2 formed on a lower surface of the sub-substrate 15 is formed on the upper surface of the substrate portion 12. It can be formed to correspond to the pad (12-3). The sub-board 15 is an opening in a portion extending to the upper surface of the via hole 12-1 so as not to contact the ball 12-2 formed on the via hole 12-1 of the substrate portion 12 Can be formed. Alternatively, it may be formed only of a portion corresponding to the pad 12-3 formed on the upper surface of the substrate portion 12. Through the sub-substrate 15, shorts with the ball 12-2 formed in the via hole 12-1 can be prevented, and it can be stably connected to the main PCB 40 of the probe card.

The plate 11, the gap plate 13, the substrate portion 12, and the sub-substrate 15 are stacked, but may each include a process fixed by a mutual adhesive member, or by shifting each other by placing separate supports. Or it may include a process for fixing so as not to be separated.

As shown in FIG. 5, the space converter 10 manufactured by the method for manufacturing a space converter 10 for a probe card or a space converter for a probe card disclosed in the present specification has a stacked structure, and the main PCB of the probe card It does not require a separate opening in 40, it can be connected to the main PCB 40 through a rubber interposer 30 or a common commercial interposer 30, as shown in Figure 5 (a), As shown in (b) of 5, the main PCB 40 may be directly connected by bonding, and as shown in FIG. 5 (c), pogo-pin instead of the sub-board 15 may be used. It can be connected to the main PCB 40 of the probe card through the interface 31.

The disclosed content is only an example, and can be variously changed by a person having ordinary skill in the art without departing from the gist of the claims claimed in the claims. It is not limited to the embodiment.

10: space converter
11: Plate 11-1: Through hole
11-2: Home
12: substrate portion 12-1: via hole
12-2: Soldering ball 12-3: Pad (substrate part)
13: gap plate 13-1: opening
14: conductive wire 14-1: pad (conductive wire)
15: sub-board 15-1: upper conductive pad (sub-board)
15-2: Bottom conductive pad (sub substrate)
20: probe head
21: probe pin
30: interposer
31: pogo pin interface
40: probe card main PCB

Claims (6)

A plate in which a plurality of through holes are formed;
A substrate portion in which a plurality of via holes are formed and a plurality of substrate portion pads electrically connected to correspond to the via holes are formed;
One end is through the through hole of the plate, but is located so as not to protrude from the lower end of the plate, the other end is a conductive wire that is electrically bonded through the via hole of the substrate portion; And
It includes; a gap plate interposed while spaced apart from the substrate portion and the plate in a state that does not contact the conductive wire, includes,

The plate makes the thickness of the portion where the through hole is formed thinner than the other portion, thereby forming a branched groove portion,
The through-hole of the plate is perforated using an ultra-short-wave (VHF) laser that generates a picosecond pulse, or an ultra-short-wave (UHF) laser that generates a femtosecond pulse,
The conductive wire is fixed with an adhesive member to prevent separation, and the adhesive member is an epoxy adhesive,
One end of the conductive wire forms a conductive wire pad for electrical contact,
The conductive wire pad is formed by polishing a cross-section of the conductive wire to form a flat surface, or by leaving only a portion of the conductive wire through mechanical polishing and pressing the cross-section of the conductive wire in the vertical direction to spread the width,

In the gap plate, an opening is formed so as not to contact the conductive wire, and the opening is formed to correspond to a width of a groove formed in the plate,
The inner surface of the opening is formed of an insulator, the outer surface is formed of a conductive material, to prevent electrical contact with the conductive wires and space converter for a probe card, characterized in that to shield external noise.
delete The method according to claim 1,
A space converter for a probe card, wherein conductive pads are formed on the upper and lower surfaces, and a sub-substrate stacked such that the conductive pads formed on the lower surface and the pads located on the upper surface of the substrate portion are in contact with each other.
Regarding the method of manufacturing a space converter for a probe card,
A first step of drilling through-holes in the plate;
A second step of positioning the conductive wire through the through hole and fixing the conductive wire to the through hole by an adhesive member;
A third step of stacking a substrate portion on the plate where a plurality of via holes are formed and a plurality of substrate portion pads electrically connected to correspond to the via hole are formed;
A fourth step of positioning one end of the conductive wire not fixed to the plate to penetrate the via hole, and then electrically bonding it; And
It includes; a fifth step of forming a conductive wire pad by processing the conductive wire penetrated through the through hole and protruding in the bottom direction;

The plate makes the thickness of the portion where the through hole is formed thinner than the other portion, thereby forming a branched groove portion,
The through-hole of the plate is perforated using an ultra-short-wave (VHF) laser that generates a picosecond pulse, or an ultra-short-wave (UHF) laser that generates a femtosecond pulse,
The conductive wire is fixed with an adhesive member to prevent separation, and the adhesive member is an epoxy adhesive,
One end of the conductive wire forms a conductive wire pad for electrical contact,
The conductive wire pad is formed by polishing a cross-section of the conductive wire to form a flat surface, or by leaving only a portion of the conductive wire through mechanical polishing and pressing the cross-section of the conductive wire in the vertical direction to spread the width,

In the third step, the substrate portion is laminated on the plate under the interposition of a gap plate separating the substrate portion without contacting the conductive wire,
In the gap plate, an opening is formed so as not to contact the conductive wire, and the opening is formed to correspond to a width of a groove formed in the plate,
The inner surface of the opening is formed of an insulator, but the outer surface is formed of a conductive material, preventing electrical contact with the conductive wire and shielding external noise.
delete The method according to claim 4,
After the fifth step, the method of manufacturing a space converter for a probe card, characterized in that it further comprises a sixth step of stacking the sub-substrate on the upper and lower conductive pads on the upper surface of the substrate portion.

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