KR102094520B1 - Apparatus for treating substrate, method for treating the same and method for fabricating display device using the same - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, a processing method, and a display device manufacturing method using the same, the disclosed configuration comprising: a first upper layer portion for horizontally transferring an input substrate; A lower layer portion including a substrate processing unit performing a cleaning and drying process for the substrate; And a second upper layer portion which is transferred in the horizontal direction to discharge the substrate transferred in the vertical direction through the substrate processing portion of the lower layer to the outside. The substrate is transferred through the first substrate transfer portion provided in the first upper layer portion. A second substrate transfer unit transferring in the vertical direction; A third substrate transfer unit horizontally transferring the substrate supplied from the second substrate transfer unit to the substrate processing unit of the lower layer portion; A fourth substrate transfer unit for transferring the substrate roughly through the substrate processing unit of the lower layer in a horizontal direction; A fifth substrate transfer unit transferring the substrate transferred through the fourth substrate transfer unit in a vertical direction; And a sixth substrate transfer unit transferring in the horizontal direction to discharge the substrate supplied from the fifth substrate transfer unit to the outside.

Description

Substrate processing device and method and manufacturing method of display device using the same {APPARATUS FOR TREATING SUBSTRATE, METHOD FOR TREATING THE SAME AND METHOD FOR FABRICATING DISPLAY DEVICE USING THE SAME}

The present invention relates to a substrate processing apparatus and a processing method and a display device manufacturing method using the same, more specifically, to minimize the occurrence of foreign matter inside the device, maintain cleanliness, and operate a circulating loop without discharging the substrate inside the substrate processing device The present invention relates to a substrate processing apparatus and a processing method that enable this, and a display device manufacturing method using the same.

In general, since semiconductor devices, solar cells, display devices, etc. are manufactured through numerous process steps, numerous facilities and corresponding facilities are operated to perform each process.

For this reason, in order to manufacture semiconductor devices, solar cells, display devices, etc., there is a problem that a device that consumes enormous cost and equipment and a large space required for the operation of the device are necessarily required.

In particular, in a manufacturing process of a semiconductor device, a solar cell, a display device, etc., a substrate cleaning and drying process for cleaning a substrate (or semiconductor substrate) in order to remove residual materials, particles, and contaminants is essential.

Conventional substrate cleaning and drying apparatus for a substrate cleaning and drying process has a multilayer structure configured to be divided into a lower layer portion and an upper layer portion.

The lower layer portion is provided on a lower conveyor for transporting a substrate to be pressured from the outside in a horizontal direction, and a substrate processing unit installed on a lower conveyor to sequentially perform a cleaning process and a drying process for the substrate.

In addition, the upper layer portion is provided with a horizontal conveyor for transferring the substrate that has been dried in the substrate processing unit in a horizontal direction to unload it to the outside.

Lift conveyors that move up and down are installed at one side of the upper and lower layers.

The lift conveyor transfers the substrate that has been dried in the lower layer to the upper layer conveyor.

Therefore, the horizontal conveyor is installed along the longitudinal direction on the upper layer, and the substrate is horizontally transferred through the horizontal conveyor to move to the cleaning equipment by the lift conveyor and then subjected to the cleaning process and drying process to proceed with the cleaning process. After the substrate is lifted by another lift conveyor and transferred through a horizontal conveyor provided on the upper layer again, it is discharged to the outside through the substrate inlet to perform another process.

As described above, the conventional substrate cleaning and drying apparatus is driven by a circulating operation system that transports the lower substrate to the upper layer using a lift conveyor and a horizontal conveyor.

On the other hand, a substrate processing apparatus for manufacturing a semiconductor device, a solar cell, a display device, etc. is configured to include a thin film forming apparatus for forming a predetermined thin film on a substrate processed by the above-described substrate cleaning and drying apparatus.

In addition, since the above-described substrate processing apparatus is provided with each of the thin film forming apparatus and the substrate cleaning and drying apparatus independently of each other, after loading the substrate processed by the above-described substrate cleaning and drying apparatus into the cassette, the cassette is formed into a thin film forming apparatus. It is configured to further include a substrate transport device for transporting to.

As described above, according to the substrate processing apparatus according to the prior art, the horizontal conveyor provided in the upper layer portion is elongated along the lengthwise direction, after the substrate is horizontally transferred to the left on the horizontal conveyor and subjected to a cleaning process and a drying process. The substrate processing apparatus must be repeatedly driven with a circulation system that is discharged to the outside by horizontally transferring the substrate from the right side again.

Therefore, since the conventional substrate processing apparatus uses a system in which the substrates are horizontally transferred from the horizontal conveyor to the left and right on multiple horizontal conveyors, many foreign matters may be generated. In particular, the horizontal conveyor is provided long in the longitudinal direction of the upper layer of the substrate processing apparatus, and since the substrate transfer portion moves from the left to the right end in the horizontal direction, the substrate transfer distance is lengthened as much as before and after the substrate treatment. In many cases, foreign matters generated on the conveyor or other structures fall or adhere to the substrate surface.

The present invention is to solve the problems of the prior art, the object of the present invention is to minimize the occurrence of foreign matter inside the substrate processing apparatus, maintain the cleanliness and to enable the circulation loop operation without discharging the substrate inside the substrate processing apparatus It is to provide a substrate processing apparatus and a processing method and a display device manufacturing method using the same.

The substrate processing apparatus according to the present invention for achieving the above object, the first upper layer portion for horizontally transferring the input substrate; A lower layer portion including a substrate processing unit performing a cleaning and drying process for the substrate; And a second upper layer portion which is transferred in the horizontal direction to discharge the substrate transferred in the vertical direction through the substrate processing portion of the lower layer to the outside. The substrate is transferred through the first substrate transfer portion provided in the first upper layer portion. A second substrate transfer unit transferring in the vertical direction; A third substrate transfer unit horizontally transferring the substrate supplied from the second substrate transfer unit to the substrate processing unit of the lower layer portion; And a fourth substrate transfer unit for transferring the substrate that has passed through the substrate processing unit of the lower layer in a horizontal direction. A fifth substrate transfer unit transferring the substrate transferred through the fourth substrate transfer unit in a vertical direction; It characterized in that it is configured to include; a sixth substrate transfer unit for transferring in a horizontal direction to discharge the substrate supplied from the fifth substrate transfer unit to the outside.

A substrate processing apparatus according to the present invention for achieving the above object, has a plurality of first hand forks to be horizontally transferred, a first substrate transfer unit for transferring in the horizontal direction; A second substrate transfer unit seated on the plurality of second hand forks to transfer the horizontally transferred substrate in a vertical direction; A third substrate transfer unit horizontally transferring the substrate supplied from the second substrate transfer unit to a substrate processing unit; A substrate processing unit performing a cleaning / drying process while transferring the substrate supplied from the third substrate transfer unit in a horizontal direction; A fourth substrate transfer unit transferring the substrate supplied from the substrate processing unit in a horizontal direction; A fifth substrate transfer unit seating the substrate supplied from the fourth substrate transfer unit on a plurality of third hand forks and transferring it in a vertical direction; A sixth substrate transfer unit seated on a plurality of fourth hand forks to transfer the substrate supplied from the fifth substrate transfer unit in a horizontal direction; And it characterized in that it comprises a seventh substrate transfer unit for moving the substrate supplied through the sixth substrate transfer unit to the first substrate transfer unit again.

A substrate processing apparatus according to the present invention for achieving the above object includes: a port portion for loading a substrate from the outside into the apparatus or unloading a cleaned / dried substrate to the outside; A thin film forming apparatus for forming a thin film on the cleaned / dried substrate; And it characterized in that it comprises a substrate transfer unit for transporting the substrate between the port portion and the substrate cleaning / drying apparatus and the thin film forming apparatus.

 A substrate processing method according to the present invention for achieving the above object includes: loading a substrate from the outside into the device or unloading a cleaned / dried substrate to the outside; Forming a thin film on the cleaned / dried substrate; And transporting the substrate on which the thin film is formed.

A method of manufacturing a display device according to the present invention for achieving the above object comprises: loading a substrate from the outside into the device or unloading a cleaned / dried substrate to the outside; And forming a thin film on the cleaned / dried substrate.

According to the substrate processing apparatus, method, and display device manufacturing method according to the present invention, there are the following effects.

Accordingly, according to the substrate processing apparatus, method, and method for manufacturing a display device using the same according to the present invention, the substrate has an independent substrate inlet and a substrate outlet, and a separate sixth substrate on the side of the substrate outlet separately from the first substrate transfer unit into which the substrate is injected. In addition to having a transfer unit, a separate seventh substrate transfer unit for adsorbing and transferring a substrate is provided to minimize foreign matter generated inside the substrate processing apparatus, maintain cleanliness inside the apparatus, and do not discharge the substrate from inside the substrate processing apparatus. Without circulating loop operation.

In addition, according to the substrate processing apparatus, method, and display device manufacturing method using the same according to the present invention, the movement length of the substrate transfer unit provided in each of the first upper layer portion and the second upper layer portion of the substrate processing apparatus is the entire length of the device as before. Due to the structure that is not extended and partially cut, that is, the distance of the pair of rails is reduced to limit the moving distance, it is possible to remove or block the contaminants generated from the substrate transfer portion located on the lower surface of the existing substrate. That is, by minimizing the movement distance of the substrate transfer unit provided in each of the first upper layer portion and the second upper layer portion of the substrate processing apparatus, it is possible to minimize foreign matter generated in the substrate processing apparatus from falling or adhering to the substrate. That is, according to the present invention, the time belt driving unit of the first and sixth substrate transfer units is deleted at the loading / unloading position, thereby fundamentally minimizing the generation of pollution due to contamination sources, for example, scattering of foreign substances.

1 is a cross-sectional view for schematically illustrating a substrate processing apparatus according to the present invention.
2 is a perspective view schematically illustrating a substrate processing apparatus according to the present invention.
3 is a perspective view for schematically explaining the first substrate transfer unit in the substrate processing apparatus according to the present invention.
4A is a plan view schematically illustrating a substrate seated on a first substrate transfer unit in the substrate processing apparatus according to the present invention.
4B is a plan view schematically illustrating a state in which a plurality of hand forks provided on a first substrate transfer unit is transferred in a horizontal direction in a substrate processing apparatus according to the present invention.
5 is a plan view for schematically illustrating a seventh substrate transfer unit in the substrate processing apparatus according to the present invention.
6 is a cross-sectional view schematically illustrating a state in which a seventh substrate transfer unit adsorbs a substrate in the substrate processing apparatus according to the present invention.
7A to 7I are diagrams for explaining the cleaning / drying process of the substrate step by step using the substrate processing apparatus according to the present invention.
8 is a diagram schematically showing an equipment system for manufacturing a display device using a substrate processing apparatus according to an embodiment of the present invention.

Hereinafter, a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

In describing an embodiment of the present invention, when a structure is described as being formed "on" or "below" another structure, such a description may include a third structure between these structures as well as when the structures are in contact with each other. It should be construed as inclusive even if it is intervened. If multi-faceted, the terms “directly above” or “directly below” are used, these structures should be construed as limited to being in contact with each other.

1 is a cross-sectional view for schematically illustrating a substrate processing apparatus according to the present invention.

2 is a perspective view schematically illustrating a substrate processing apparatus according to the present invention.

3 is a perspective view for schematically explaining the first substrate transfer unit in the substrate processing apparatus according to the present invention.

4A is a plan view schematically illustrating a substrate seated on a first substrate transfer unit in the substrate processing apparatus according to the present invention.

4B is a plan view schematically illustrating a state in which a plurality of hand forks provided on a first substrate transfer unit is transferred in a horizontal direction in a substrate processing apparatus according to the present invention.

5 is a plan view for schematically illustrating a seventh substrate transfer unit in the substrate processing apparatus according to the present invention.

6 is a cross-sectional view schematically illustrating a state in which a seventh substrate transfer unit adsorbs a substrate in the substrate processing apparatus according to the present invention.

1 and 2, the substrate processing apparatus 10 according to the present invention includes a base frame 100, first to fourth substrate transfer units 200, 300, 400, 600, a substrate processing unit 500, It comprises a fifth to seventh substrate transfer unit (700, 250, 800).

Here, the base frame 100 is configured to be divided into a lower layer portion 110, a first upper layer portion 120, and a second upper layer portion 130.

A first substrate transfer unit 200 is installed on the first upper layer 120, and a second substrate transfer unit 300, a third substrate transfer unit 400, a substrate processing unit 500 and a fourth substrate are installed on the lower layer 110. The transfer part 600 is installed.

The first substrate transfer unit 200, as shown in FIG. 3, is installed to be transferred in the horizontal direction to the first upper layer portion 120 of the base frame 100. The first substrate transfer unit 200 transfers the substrate S input through the substrate entrance in the horizontal direction and supplies it to the second substrate transfer unit 300.

To this end, the first substrate transfer unit 200, as shown in Figures 3, 4a and 4b, a pair of the first rail 205, the first transfer frame 210, the first fork support 220 , A plurality of first horizontal movement fork 225 installed at regular intervals on the first fork support 220 and the first horizontal movement fork 225 is formed at regular intervals to support the substrate S It comprises a plurality of first support pins 227. At this time, the pair of first rails 205 are installed at predetermined intervals on the first and second upper layers 120 and 130 of the base frame 100 to be parallel to the horizontal direction. The pair of first rails 205 guide the horizontal transport of the first transport frame 210. In particular, as shown in FIG. 2, the time belt driving unit (not shown) of the first substrate transfer unit 200 is deleted at a loading / unloading position, thereby causing contamination, for example, foreign matter scattering. Pollution can be minimized fundamentally.

The first transport frame 210 is installed to be transportable on a pair of first rails 205 and is transported in a horizontal direction according to the guidance of the pair of first rails 205.

To this end, a first transport block (not shown) is provided on both sides of the first transport frame 210 so as to be transportable on a pair of first rails 205. At this time, the first transfer block and the first rail 205 configure the LM guider module to transfer the first transfer frame 210 in the horizontal direction.

In addition, the first fork support 220 is installed on the first transfer frame 210 and supports a plurality of first horizontal movement forks 225 horizontally transferred according to the guidance of the first transfer frame. To this end, a first transport block (not shown) is provided on both sides of the first fork support 220 to be transportably coupled to the first transport frame 210. At this time, the first transfer block and the first transfer frame 210 constitute the LM guide module to transfer the first fork support 220 in the horizontal direction.

In addition, the plurality of first horizontal movement forks 225 are installed at regular intervals on the first fork support 220 to support the substrate S, and the plurality of first support pins 227 are the plurality of It is installed in a grid shape having a predetermined height on the first horizontal moving fork 225 to support the substrate (S).

On the other hand, the first substrate transfer unit 200, although not shown in the drawing, may be configured to further include a substrate rotation unit (not shown).

Here, the reason for rotating the substrate using the substrate rotation unit (not shown), for example, the substrate that is input to the substrate entrance and exit the cleaning process and drying process in the substrate processing unit 500 or the substrate outlet (not shown) If a defect occurs at a specific site afterwards, it is not known whether the defect occurred in the cleaning and drying process or in the process before the injection, so the cleaning process and drying process are performed after rotating at a predetermined angle of the substrate. When performed, it is possible to know from which process the above defect occurred.

As illustrated in FIG. 2, the second substrate transfer unit 300 vertically moves the substrate S transferred in the horizontal direction by the first substrate transfer unit 200 using a plurality of first hand forks 310. Transfer in the direction to supply to the third substrate transfer unit 400.

To this end, the second substrate transfer unit 300 includes a plurality of first hand forks 310, a first fork support bar 320, a first fork frame 330 and a first lifting lift 340 do.

Each of the plurality of first hand forks 310 is spaced apart at predetermined intervals to have a cantilever shape to support the rear surface of the substrate S. At this time, in order to prevent self sagging of the first hand fork 310 by the load of the substrate S, the rear surfaces of each of the plurality of first hand forks 310 are formed to be inclined. That is, the thickness of each of the plurality of first hand forks 310 becomes thinner from one side to the other. In addition, a plurality of support pins (not shown) may be protruded at regular intervals on the upper surfaces of the plurality of first hand forks 310. At this time, by forming a plurality of support pins (not shown) on the upper surface of the first hand fork 310 to contact and support the substrate, when the substrate is large, the structure of the processing device may fall or fall due to shaking or tilting. It can prevent the damage. Also, instead of the plurality of first hand forks, a plurality of lift fin structures may be used.

Meanwhile, a deflection preventing member (not shown) for preventing sagging of the substrate and a sensor (not shown) for detecting the presence or absence of the substrate may be installed in each of the plurality of first hand forks 310. At this time, the deflection preventing member may be composed of a plurality of blocks, a plurality of pins, or a plurality of pads installed on the upper surface of the first hand fork 310 to have a regular interval. And, the sensor may be installed for each sagging prevention member.

The first fork support bar 320 commonly supports one side of each of the plurality of first hand forks 310. Accordingly, the plurality of first hand forks 310 are spaced apart at predetermined intervals to be parallel in the horizontal direction and are supported by the first fork support bar 320.

The first fork frame 330 supports the central portion of the side or rear surface of the first fork support bar 320. Here, the first fork frame 310 and the first fork support bar 320 may be configured as one body.

The first lifting lift 340 is installed to be adjacent to the center of the front surface of the third substrate transfer unit 400 to elevate the first fork frame 330 in the vertical direction. To this end, the first lifting lift 340 is configured to include a ball screw module (not shown) or LM guider module (not shown) for lifting the first fork frame 330.

The ball screw module includes a ball screw shaft (not shown), a rotating motor (not shown), a frame lifting hole 341, and a ball screw nut (not shown).

The ball screw shaft is vertically installed so as to be supported by a plurality of brackets (not shown) and rotated according to the rotation of the rotating motor.

The frame lifting hole 341 is formed on the inner surface of the first lifting lift 340 so that the first fork frame 330 can lift.

The first lifting lift 340 including the ball screw module rotates the ball screw shaft through a rotating motor to raise and lower the ball screw nut to raise and lower the first fork frame 330.

Further, the LM guider module may include an LM guider rail (not shown), and an LM guider block (not shown).

The LM guider rail is formed perpendicular to the inner surface of the first lifting lift 340.

The LM guider block is installed on the inner surface of the first fork frame 330 and is movably coupled to the LM guider rail.

The first lifting lift 340 including the LM guider module moves the first fork frame 330 by transferring the LM guider block along the LM guider rail.

On the other hand, in the above description, the first lifting lift 340 is described as being configured as one, but is not limited thereto, and when the size of the substrate S is increased, the first fork support bar 320 is simultaneously provided at a plurality of points. It may be composed of a plurality of lifting.

1 and 2, the third substrate transfer unit 400 receives the substrate S transferred in the vertical direction from the second substrate transfer unit 300, and the supplied substrate S in the horizontal direction. It is transferred and supplied to the substrate processing unit 500. To this end, the third substrate transfer unit 400 is not shown in the drawing, but is configured to include a plurality of first roller frames, a first shaft, a first shaft rotation member, and a first rotation transmission member.

The plurality of first roller frames transfer the substrate S supplied from the second substrate transfer unit 300 in a horizontal direction to supply it to the substrate processing unit 500. To this end, each of the plurality of first roller frames includes a first support frame and a plurality of first rollers.

Each of the first support frames is installed side by side in a horizontal direction to adjoin one side of the substrate processing unit 500, that is, the front portion. At this time, each of the first support frames is spaced apart at predetermined intervals so that a plurality of hand forks for lifting can pass. That is, each of the first support frames is installed so as to be spaced apart at a predetermined interval so as not to disturb the movement trajectories of the plurality of hand forks 310 descending to transfer the substrate S in the vertical direction.

Meanwhile, each of the first support frames may be formed to have different heights to tilt the substrate S mounted on a plurality of rollers at a predetermined angle, for example, about 5 degrees.

The plurality of first rollers are installed at regular intervals on one or both sides corresponding to the longitudinal direction of each of the first support frames. At this time, it is preferable that each of the plurality of first rollers is installed on both sides of each of the first support frames. To this end, each of the plurality of first rollers is installed at both edges of the roller drive shaft passing through the first support frame.

The first shaft is installed to penetrate the other side of each of the first support frames adjacent to the substrate processing unit 500.

The first shaft rotating member (not shown) is a driving motor, and is installed on an outer side first support frame among a plurality of first support frames to rotate the first shaft. At this time, the rotational force of the first shaft rotating member may be transmitted to the first shaft through a belt, chain, or a plurality of gears (not shown).

The first rotation transmission member (not shown) is installed inside each of the first support frames to transmit the rotational force of the first shaft to the plurality of rollers. At this time, the rotational force of the first shaft may be transmitted to a plurality of rollers installed on each of the first support frames through a belt, chain, or a plurality of gears (not shown).

Meanwhile, the third substrate transfer unit 400 may further include a plurality of first transfer guide units (not shown).

Although not shown in the drawings, the plurality of first transport guide portions are installed on each of the outer first roller frames among the plurality of first roller frames to guide transport of the substrate S that is horizontally transferred to the plurality of rollers. To this end, the plurality of first conveying guide parts includes a guide plate, a guide rod, and a guide roller.

Meanwhile, as illustrated in FIGS. 1 and 2, the substrate processing unit 500 performs a cleaning process and a drying process while transporting the substrate S supplied from the third substrate transfer unit 400 in a horizontal direction, thereby performing the substrate S ). To this end, the substrate processing unit 500 includes a roller conveyor 510, a cleaning unit (not shown), and a drying unit (not shown).

The roller conveyor 510 is a third substrate transfer unit 400 using a plurality of drive shafts 513 rotatably installed between the first and second conveyor frames 511 and 512 at regular intervals along a direction orthogonal to the horizontal direction. ) Transfers the substrate (S) supplied from the horizontal direction. At this time, a plurality of conveying rollers 514 are provided on the plurality of roller driving shafts 513 to have a constant interval.

The plurality of roller drive shafts 513 rotate in conjunction with rotation of the drive motor 515 installed on one side of the first conveyor frame 511. Here, the rotational force of the drive motor 515 is transmitted to the plurality of roller drive shafts 513 through drive shafts 516 installed on one side of the first and second conveyor frames 511 and 512.

A plurality of guide roller portions 517 for guiding the horizontal transfer of the substrate S conveyed in the horizontal direction by the plurality of transfer rollers 514 are provided on the outer surfaces of the first and second conveyor frames 511 and 512. Can be installed. Since the plurality of guide roller portions 517 are configured in the same manner as the first transfer guide portion (not shown) of the third substrate transfer portion 400 described above, the description thereof will be replaced by the description of the first transfer guide portion. .

Meanwhile, the roller conveyor 510 may be configured to have the same structure as the third substrate transfer unit 400 described above, and may also transfer the substrate S in a horizontal direction.

The cleaning unit (not shown) includes first to third cleaning modules (not shown) continuously installed.

The first cleaning module cleans the organic foreign material on the substrate S. At this time, the first cleaning module may clean the organic foreign matter on the substrate S using the atmospheric pressure plasma.

In addition to spraying ultrapure water (DI), the second cleaning module primarily cleans the substrate S on which the organic foreign matter has been cleaned using a brush roller (not shown). Here, an air injection nozzle for removing ultrapure water on the substrate S by using air may be installed at an end of the second cleaning module.

The third cleaning module secondly cleans the substrate S by spraying ultrapure water DI on the first cleaned substrate S. Here, an air injection nozzle for removing ultrapure water on the substrate S using air may be installed at an end of the third cleaning module.

The drying unit dries the substrate S that has been cleaned in the washing unit. At this time, the drying unit may dry the substrate S using air knives installed on the upper and lower portions of the substrate S.

As illustrated in FIGS. 1 and 2, the fourth substrate transfer unit 600 is installed adjacent to the rear surface of the substrate processing unit 500 to transfer the substrate S discharged from the substrate processing unit 500 in a horizontal direction. To this end, the fourth substrate transfer unit 600 includes a plurality of second roller frames 610a, 610b, and 610c, a second shaft 620, a second shaft rotation member 630, and a first rotation transmission member (not shown) ), And a plurality of second conveying guide parts 640.

The fourth substrate transfer unit 600 having such a configuration is different only in reference numerals, and is configured to have the same structure as the third substrate transfer unit 400 and the substrate processing unit 500 to be symmetrical with the third substrate transfer unit 400. Since it is the same as the third substrate transfer unit 400 except that it is installed adjacent to the rear portion of the detailed description thereof will be replaced by the above description.

1 and 2, the fifth substrate transfer unit 700 transfers the substrate S transferred in the horizontal direction by the fourth substrate transfer unit 600 in the vertical direction, so that the sixth substrate transfer unit 250 To supply. To this end, the fifth substrate transfer unit 700 includes a plurality of second hand forks 710, a second fork support bar 720, a second fork frame 730, and a second lifting lift 740 do.

The fifth substrate transfer unit 700 having such a configuration is different only in reference numerals, and is configured to have the same structure as the second substrate transfer unit 300 and a fourth substrate transfer unit to be symmetrical with the second substrate transfer unit 300 ( Since it is the same as the second substrate transfer unit 300 except that it is installed adjacent to the rear portion of 600), a detailed description thereof will be replaced by the above-described description.

On the other hand, the second lifting lift 740 may be configured in plurality to simultaneously lift the second fork support bar 720 at a plurality of points.

The sixth substrate transfer unit 250 is installed to be transferred in the horizontal direction to the second upper layer 130 of the base frame 100, as shown in FIGS. 1 and 2. The sixth substrate transfer unit 250 transfers the substrate S input through the substrate entrance in the horizontal direction so as to be positioned on the substrate outlet (not shown).

To this end, although not shown in the drawing, the sixth substrate transfer unit 250 includes a pair of rails, a second transfer frame, a second fork support, and a plurality of second horizontal movements installed at regular intervals on the second fork support It comprises a plurality of second support pins formed at regular intervals on the upper surface of the fork and these second horizontally moving forks to support the substrate S. At this time, the pair of rails are installed at predetermined intervals on the second upper layer 130 of the base frame 100 to be parallel to the horizontal direction. This pair of second rails guides the horizontal transport of the second transport frame. In particular, as shown in FIG. 2, the time belt driving unit (not shown) of the sixth substrate transfer unit 250 is also deleted from the loading / unloading position, as in the first substrate transfer unit 200, It is possible to fundamentally minimize the occurrence of pollution caused by pollution sources, for example, scattering of foreign substances.

The second transport frame is installed to be transportable on a pair of second rails and is transported in a horizontal direction according to the guidance of the pair of second rails.

The sixth substrate transfer unit 250 having such a configuration is only different from the reference numerals, and is configured to have the same structure as the first substrate transfer unit 200 and is the same as the first substrate transfer unit 200, and thus a detailed description thereof. Will be replaced by the above description.

On the other hand, the seventh substrate transfer unit 800 is provided separately for infinite cycling, as shown in FIGS. 5 and 6, is installed inside the upper surface of the second upper layer 130, supplied from the sixth substrate transfer unit 250 In order to adsorb the substrate (S), the upper and lower operations are performed, and the upper and lower portions are moved to the first substrate transfer unit 200 in the first upper layer portion 120. To this end, the seventh substrate transfer unit 800 is provided with a substrate plate 810 and a plurality of functions provided on the substrate plate 810 to suck air by a separate external device to adsorb structures attached to the plate surface. It comprises a suction pad 815. At this time, the plurality of adsorption pads 815 are provided at regular intervals on the front surface of the substrate plate 810. In addition, the seventh substrate transfer unit 800 may be configured to move up and down using a cylinder or a servo motor.

 Therefore, as described above, the substrate processing apparatus according to the present invention has a substrate inlet and a substrate outlet that are independent of each other, and a separate sixth substrate transfer portion on the side of the substrate outlet separately from the first substrate transfer portion to which the substrate is introduced. Of course, by providing a separate seventh substrate transfer unit that adsorbs and transports the substrate, it minimizes the foreign matter generated inside the substrate processing apparatus, maintains the cleanliness inside the apparatus, and performs a circulating loop operation without discharging the substrate from inside the substrate processing apparatus. It is possible.

In addition, in the substrate processing apparatus according to the present invention, the movement length of the substrate transfer unit provided in each of the first upper layer portion and the second upper layer portion of the substrate processing apparatus is not extended over the entire length of the apparatus as in the past, and a part is cut off, that is, By limiting the moving distance by reducing the distance of a pair of rails, it is possible to remove or block contaminants generated from the substrate transfer part located on the lower surface of the existing substrate. That is, by minimizing the movement distance of the substrate transfer unit provided in each of the first upper layer portion and the second upper layer portion of the substrate processing apparatus, it is possible to minimize foreign matter generated in the substrate processing apparatus from falling or adhering to the substrate. That is, according to the present invention, since the time belt driving units of the first and sixth substrate transfer units are deleted at the loading / unloading position, it is possible to minimize the occurrence of contamination by contamination sources, for example, scattering of foreign substances.

Meanwhile, the substrate cleaning and drying method using the substrate processing apparatus according to the present invention will be described with reference to FIGS. 7A to 7I.

7A to 7I are diagrams for explaining the cleaning / drying process of the substrate step by step using the substrate processing apparatus according to the present invention.

First, as illustrated in FIG. 7A, an external substrate S is introduced onto the first substrate transfer unit 200 through a substrate input port (not shown) of the base frame 100.

Then, as shown in FIG. 7B, when the substrate S is supported on the first substrate transfer unit 200, the second substrate is transferred through the first substrate transfer unit 200 through a pair of first rails 205. It is horizontally transferred to the transfer unit 300 (first process). In this case, the first substrate transfer unit 200 may rotate the supported substrate S at a predetermined angle.

Subsequently, referring to FIGS. 4A and 4B, the first fork support 220 constituting the first substrate transfer part 200 is horizontally moved on the first transport frame 210 to be attached to the first fork support 220. A plurality of first horizontal movement forks 225 installed at regular intervals are positioned above the first hand fork 310 of the second substrate transfer part 300 (second process). At this time, the first horizontal movement fork 225 is adjusted to come to a position that is shifted from the first hand fork 310, that is, a position that does not overlap.

Then, as shown in FIG. 7B, when the substrate S is transferred to the first vertical transfer position, the second horizontal transfer unit 300 inserted between the first horizontal movement fork 225 and the substrate S By raising the first hand fork 310 to a predetermined height, the substrate S supported by the first horizontal moving fork 225 of the first substrate transfer unit 200 is moved to a plurality of first hand forks 310 to be seated. (3rd course).

Subsequently, as shown in FIG. 7C, the first fork support 220 supporting the first horizontal movement fork 225 of the first substrate transfer unit 200 is returned to the original position of the first transfer frame 210. In the horizontally moved state, the first substrate transfer part 200 is horizontally moved to the original position (fourth process).

Then, by lowering the plurality of first hand forks 310 of the second substrate transfer unit 300 toward the first horizontal transfer position, the substrate S supported by the plurality of first hand forks 310 is first horizontal. Transfer to the transfer position (step 5). At this time, although the plurality of first hand forks 310 are not illustrated in the drawing, the substrate S supported by the plurality of first hand forks 310 by passing through the plurality of first roller frames and descending is plural. It is seated on the first roller frame.

Subsequently, as illustrated in FIG. 7D, the substrate S in the first horizontal transfer position and the substrate S in the first horizontal transfer position through the driving of the plurality of first roller frames (not shown) are processed in the substrate processing unit. It is transferred horizontally toward (500) (Process 6).

Then, when the substrate S is horizontally transferred toward the substrate processing unit 500 so as to deviate from the length of the plurality of first hand forks 310 in the first horizontal transfer position, the plurality of first hand forks 310 are raised. (Process 7). At this time, the substrate S is input to the substrate processing unit 500.

Subsequently, the plurality of first hand forks 310 are continuously raised to return to the first vertical transfer position. At this time, the substrate processing unit 500 performs the cleaning process and the drying process while transferring the substrate S in the horizontal direction according to the driving of the roller conveyor 510 (8th process). In addition, the first substrate transfer unit 200 transfers a new substrate (not shown) input to the substrate entrance through the first and second processes to the first vertical transfer position.

Then, referring to FIG. 2, the cleaned substrate S is cleaned and dried by the substrate processing unit 500 by driving the second roller frames 610a, 610b, and 610c of the fourth substrate transfer unit 600. Is transferred horizontally to the second vertical transfer position (Process 9).

Subsequently, as shown in FIG. 7E, when the cleaned substrate S is transferred to the second vertical transfer position, the fifth substrate transfer unit lowered to pass between the plurality of second roller frames 610a, 610b, and 610c ( The plurality of second hand forks 710 of 700) are lowered to a predetermined height to seat the cleaned substrate S (10th process).

 Then, as shown in FIG. 7F, the plurality of second hand forks 710 supported by the plurality of second hand forks 710 by raising the plurality of second hand forks 710 of the fifth substrate transfer part 700 toward the second horizontal transfer position The substrate S is transferred to the second horizontal transfer position (Step 11).

Subsequently, when the substrate S is transferred to the second horizontal transfer position, the sixth substrate transfer unit 250 is horizontally transferred to the fifth substrate transfer unit 700 through a pair of second rails (not shown) (twelfth). process). At this time, the sixth substrate transfer unit 250 may rotate the supported substrate S at a predetermined angle.

Subsequently, although not shown in the drawings, the second fork support constituting the sixth substrate transport unit 250 having the same structure as the first substrate transport unit 200 is horizontally moved on the second transport frame only by the different reference numerals. , Positioning a plurality of second horizontal movement fork installed at a predetermined interval on the second fork support under the second hand fork 710 of the fifth substrate transfer part (step 13). At this time, the second horizontal movement fork is adjusted to come to a position shifted from the second hand fork 710, that is, a position that does not overlap.

Then, the first hand fork 710 of the fifth substrate transfer unit 700 is lowered to move and seat the substrate S on the second horizontal movement fork of the sixth substrate transfer unit 250 (step 14).

Subsequently, as shown in FIG. 7G, the fifth substrate transfer unit 700 returns to its original position, and the second fork support supporting the second horizontal movement fork of the sixth substrate transfer unit 250 is the second. By horizontally moving to the original position of the transfer frame, the substrate S is positioned on the sixth substrate transfer unit 250 (step 15)

Then, while the substrate S is seated, the sixth substrate transfer unit 250 is horizontally transferred through a pair of second rails (not shown) to the substrate outlet (not shown) position (Process 16). .

 Subsequently, as illustrated in FIGS. 7H and 7I, the second upper layer portion is transferred to the outside through the substrate discharge port or, if necessary, to the first substrate transfer unit 200 again, as shown in FIGS. 7H and 7I. It is transferred to the first substrate transfer unit 200 through the seventh substrate transfer unit 800 provided on the 130 to be seated. In this case, referring to FIGS. 5 and 6, the sixth substrate transfer unit 250 is seated by a plurality of suction pads 815 provided on the substrate plate 810 constituting the seventh substrate transfer unit 800. The substrate S is placed on the first substrate transfer unit 200 in a state where the substrate S is adsorbed, so that the substrate S is seated on the first substrate transfer unit 200 (Step 17).

The cleaning / drying method of the substrate using the substrate processing apparatus according to the present invention is performed by continuously performing the cleaning process and drying process for the substrate S by repeating the first to seventeenth processes shown in FIGS. 7A to 7I. The cleaning process for the substrate S is performed.

Therefore, according to the substrate cleaning / drying method using the substrate processing apparatus according to the present invention, the substrate has a separate substrate inlet and a substrate outlet, and a separate sixth substrate transfer section on the substrate outlet side separately from the first substrate transfer section into which the substrate is fed. By providing a separate seventh substrate transfer unit that adsorbs and transports the substrate as well as being provided, the foreign matter generated inside the substrate processing device is minimized, the cleanliness inside the device is maintained, and the substrate is not discharged inside the processing device. Enables loop operation.

Further, according to the substrate cleaning / drying method using the substrate processing apparatus according to the present invention, the movement length of the substrate transfer unit provided in each of the first upper layer portion and the second upper layer portion of the substrate processing apparatus is extended over the entire length of the device as before. It is not part of the structure, that is, by reducing the distance of the pair of rails to reduce the travel distance, it is possible to remove or block the contaminants generated from the substrate transfer portion located on the existing substrate lower surface. That is, by minimizing the movement distance of the substrate transfer unit provided in each of the first upper layer portion and the second upper layer portion of the substrate processing apparatus, it is possible to minimize foreign matter generated in the substrate processing apparatus from falling or adhering to the substrate. That is, according to the present invention, since the time belt driving units of the first and sixth substrate transfer units are deleted at the loading / unloading position, it is possible to minimize the occurrence of contamination by contamination sources, for example, scattering of foreign substances.

8 is a diagram schematically showing an equipment system for manufacturing a display device using a substrate processing apparatus according to an embodiment of the present invention.

8, a display device manufacturing apparatus using a substrate processing apparatus according to an embodiment of the present invention, a clean room (1); It comprises a port portion 2, a substrate transport unit 3, a substrate cleaning / drying apparatus 10, 20, 30, and a thin film forming apparatus 5.

The clean room 1 provides space to have a predetermined cleanliness, and a port portion 2, a substrate transfer unit 3, a substrate cleaning / drying device 10, 20, 30, and a thin film are formed therein. The device 5 is installed.

The port part 2 is installed inside the clean room 1 to unload the substrate on which the substrate is loaded or processed. At this time, a cassette (not shown) in which a plurality of substrates are loaded may be loaded or unloaded in the port part 2.

The substrate transfer unit 3 is installed between the port portion 2, the substrate cleaning / drying devices 10, 20, 30, and the thin film forming device 5.

The substrate transport unit 3 takes out the cleaned substrate from the substrate cleaning / drying devices 10, 20, and 30 and transports it to the substrate cleaning / drying devices 10, 20, 30.

The substrate cleaning / drying device 10 according to the present invention is configured to include the substrate cleaning / drying device according to the present invention, and is input from the substrate transport unit 3 through the substrate cleaning / drying method shown in FIGS. 7A to 7I. By performing a cleaning process and a drying process for the substrate, a detailed description thereof will be replaced by the above-described description.

The thin film forming apparatus 5 forms a predetermined thin film on the cleaned substrate loaded through the substrate transport unit 3. To this end, the thin film forming apparatus 5 may be configured to include a transfer chamber 51, a load lock chamber 52, a preheating chamber 53, a plurality of process chambers 54, and a cooling chamber 55. .

The transfer chamber 51 is disposed in the central portion of each chamber 52 to 55 to transport the substrate between the chambers. To this end, the transfer chamber 51 is configured to include a transfer robot 56 for transporting the substrate. Around the transfer chamber 51, a load lock chamber 52, a preheating chamber 53, a plurality of process chambers 54, and a cooling chamber 55 are arranged in a cluster form.

The load lock chamber 52 is connected to the transfer chamber 51 so as to be adjacent to the substrate transfer unit 3. The load lock chamber 52 temporarily stores the substrate supplied by the substrate transfer unit 3 or temporarily stores the substrate on which the thin film forming process supplied by the transfer chamber 51 is completed.

The preheating chamber 53 preheats the substrate supplied from the load lock chamber 52 by the transfer robot 56 to have a temperature higher than that of the set thin film deposition process. At this time, the preheating temperature of the substrate is a cooling margin, such as the transfer time from the preheating chamber 53 to the plurality of process chambers 54 by the transfer robot 56, the process time in the plurality of process chambers 54, and the process temperature. It can be set in consideration of. The preheating chamber 53 may preheat the substrate to a set temperature using a heating device such as a coil heater or a lamp heater.

Meanwhile, the load lock chamber 52 and the preheating chamber 53 may have a stacked structure. That is, the load lock chamber 52 is disposed in the lower portion, and the preheating chamber 53 may be disposed in the upper portion of the load lock chamber 52.

The plurality of process chambers 54 receives the preheated substrate from the preheating chamber 53 through the transfer robot 56 and thin films using a chemical vapor deposition process or a sputtering process on the preheated substrate The deposition process is performed.

The cooling chamber 55 receives a substrate on which a thin film is formed from a plurality of process chambers 54 through a transfer robot 56 and lowers the temperature of the substrate heated by the thin film deposition process to a predetermined temperature. On the other hand, when the process of lowering the temperature of the substrate to a predetermined temperature according to the manufacturing process and subsequent processes is not necessary, the cooling chamber 55 may be replaced with the process chamber 54.

Meanwhile, the substrate cleaning / drying devices 10, 20, and 30 may perform a cleaning process and a drying process for the substrate on which the thin film is formed by the thin film forming device 5.

As described above, the display device manufacturing equipment using the substrate processing apparatus according to the embodiment of the present invention includes a port portion 2, a substrate transfer unit 3, a substrate cleaning / drying apparatus 10 in one clean room 1 20, 30), and by forming the thin film forming apparatus 5 to be integrated with each other, the substrate transport time can be reduced to improve productivity, and contamination of the substrate generated during the substrate transport process can be prevented.

Those skilled in the art to which the present invention pertains will understand that the above-described present invention can be implemented in other specific forms without changing its technical spirit or essential features.

Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the following claims rather than the above detailed description, and it should be interpreted that all changes or modifications derived from the meaning and scope of the claims and equivalent concepts are included in the scope of the present invention. do.

10: substrate processing apparatus 100: base frame
200: first substrate transfer unit 205: first rail
210: first transfer frame 220: first fork support
225: first horizontal movement fork 227: support pin
250: sixth substrate transfer unit 300: second substrate transfer unit
310: first hand fork 320: first fork support bar
330: first fork frame 340: lifting lift
400: third substrate transfer section 500: substrate processing section 600: fourth substrate transfer section 700: fifth substrate transfer section 800: seventh substrate transfer section 810: substrate plate
815: adsorption pad

Claims (19)

It is divided into a lower layer portion, a first upper layer portion disposed on the lower layer portion and a second upper layer portion disposed on the first upper layer portion,
A substrate processing unit disposed on the lower layer to perform a cleaning and drying process on the substrate;
A first substrate transfer unit which is disposed on the first upper layer portion and overlaps the substrate processing unit in a vertical direction and receives a substrate input from the outside;
A second substrate transfer unit disposed on one side of the substrate processing unit and receiving a substrate from the first substrate transfer unit of the first upper layer unit and transferring the substrate to the lower layer unit;
A third substrate transfer unit disposed on a lower layer between the second substrate transfer unit and the substrate processing unit and receiving a substrate from the second substrate transfer unit and transferring the substrate to the substrate processing unit;
A fifth substrate transfer unit disposed between the substrate processing unit and facing the second substrate transfer unit and transferring the substrate from the lower layer unit to the second upper layer unit;
A fourth substrate transfer unit disposed on a lower layer between the substrate processing unit and the fifth substrate transfer unit and receiving the substrate processed by the substrate processing unit and transferring the substrate processed in the horizontal direction to the fifth substrate transfer unit;
A sixth substrate transfer unit which is disposed on the second upper layer portion so as to overlap the substrate processing unit in a vertical direction and transfers the substrate in a horizontal direction to receive the substrate from the fifth substrate transfer unit and discharge the substrate to the outside; And
And a seventh substrate transfer unit disposed on the sixth substrate transfer unit while being vertically overlapped with the substrate processing unit and receiving the substrate from the sixth substrate transfer unit and transferring the substrate to the first substrate transfer unit,
The seventh substrate transfer unit includes a substrate plate and a plurality of adsorption pads provided on the surface of the substrate plate to absorb air by a separate external device and adsorb a structure attached to the surface of the substrate plate,
The seventh substrate transfer unit moves upward and downward between the first and second upper layer regions,
The seventh substrate transfer portion adsorbs the substrate of the sixth substrate transfer portion of the second upper layer portion and descends to the first substrate transfer portion of the first upper layer portion to seat the adsorbed substrate on the first substrate transfer portion. Device. The method of claim 1, wherein the first and six substrate transfer parts are formed with a pair of rails, a transfer frame, a fork support, a plurality of horizontal movement forks installed at regular intervals on the fork supports, and a predetermined interval on the top surface of these horizontal movement forks. And a plurality of first support pins that support the substrate. delete delete The substrate processing apparatus according to claim 1, wherein a substrate inlet is provided in the first upper layer, and a substrate outlet is provided in the second upper layer. The method of claim 1, wherein the first substrate transfer portion is horizontally moved only to the second substrate transfer portion to transfer the substrate, and the sixth substrate transfer portion is horizontally moved only to the fifth substrate transfer portion to transfer the cleaned substrate. Substrate processing apparatus characterized in that. delete delete delete delete delete delete delete delete delete delete delete Cleaning the substrate using the substrate processing apparatus according to any one of claims 1, 2, 5 and 6; And
And forming a thin film on the cleaned substrate. 19. The method of claim 18, wherein the substrate is any one of a substrate for a display panel, a substrate for a semiconductor, and a substrate for a solar cell.

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