KR102089247B1 - Cleaning apparatus and method of fabricating the display device including cleaning using the same - Google Patents

Abstract

The present invention is a cleaning device for cleaning a panel on which a printed circuit board (PCB) is mounted, a plurality of rollers are provided, and a cleaning line provided with a panel input zone and a cleaning zone is located adjacent to the cleaning line and conveyed. And a conveying line equipped with a front cover covering the means and the conveying means, where DI (deionized water) is sprayed only on the cleaning line, and the conveying line is prevented from infiltrating the DI by the front cover. It provides a cleaning device characterized in that the panel is moved in one direction by the roller and the conveying means and the surface of the panel is cleaned, and a method for manufacturing a flexible display device including cleaning using the same.

Description

Cleaning device and method of manufacturing a display device including cleaning using the same {Cleaning apparatus and method of fabricating the display device including cleaning using the same}

The present invention can be cleaned without the PCB being exposed to the cleaning liquid in a state where the PCB equipped with the driving circuit is mounted, and the cleaning device characterized by being able to continuously inject the panel in the state where the PCB is mounted and using the same It relates to a method of manufacturing a display element including a cleaning method.

In recent years, as the society has entered a full-fledged information age, the display field for processing and displaying a large amount of information has rapidly developed, and in response, various various flat panel display devices have been developed and attracting attention.

Specific examples of such a flat panel display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an organic light emitting display Devices (Organic Electroluminescence Display device: OLED), Electrophoretic Display device (EPD), etc. These flat panel display devices show excellent performance of thinning, lightening, and low power consumption. : CRT).

Such a flat panel display device is lighter and thinner than a cathode ray tube (CRT), and has an advantage of large size.

On the other hand, such a flat panel display device generally uses a glass substrate to withstand the high heat generated during the manufacturing process, and the flat panel display device manufactured using such a glass substrate has reduced the thickness and flexibility of light weight, which is a recent trend of display devices. There is a limit to giving.

Therefore, in recent years, it is manufactured by using a flexible material such as plastic instead of a relatively heavy glass substrate, which can maintain the display performance even if it bends like paper, and is relatively light and thin compared to displays made of glass substrates. A flexible display device having an is rapidly emerging as a next-generation flat panel display device.

On the other hand, in manufacturing such a flexible display device, the plastic film used to have flexible properties is well bent and is directly applied to manufacturing equipment for conventional display devices targeted for processing glass substrates because of its inherent properties weak to heat. Hard.

For example, when transporting by track equipment or a robot, particularly when a plastic film is placed on the robot arm, it is severely warped and falls between the robot arms, or when receiving the substrate for storage as a cassette for storing the substrate. There is a disadvantage in that the deflection width of the substrate is larger than the width of the cassette stage, and thus storage by the robot is impossible.

Therefore, the manufacturing of the display device using the plastic substrate, unlike the manufacturing of the display device using the general glass substrate, the color filter forming a color filter layer for color processing or an array process for forming an array element such as a thin film transistor with only the plastic substrate itself The process cannot be carried out.

In order to overcome this problem, by attaching the plastic substrate to one surface of a carrier substrate capable of conveying a rigid material such as a glass substrate using an adhesive or the like, a state in which the conveying process is possible is made, and then general indication A flexible display device is completed by performing a device manufacturing process.

Meanwhile, in order to separate the carrier substrate from the flexible panel, the flexible display device undergoes a desorption process of the carrier substrate and has a very flexible state for desorption of the carrier substrate.

In the case of manufacturing a flat panel display device using a glass substrate, a process of mounting a PCB for driving such a display proceeds while two substrates are finally joined to form a display panel, but in the case of a flexible display device, a carrier substrate is used. After desorption, it has very flexible properties, and it cannot be mounted on the PCB due to the flexible properties of the panel.

Therefore, the mounting of the PCB is also performed before detaching the carrier substrate.

Meanwhile, in order to detach the carrier substrate while the carrier substrate is mounted on the PCB, a laser beam is irradiated on the entire surface of the carrier substrate in order to weaken the bonding force between the carrier substrate and the plastic substrate. It should be irradiated to have a uniform energy density on the front surface of the carrier substrate.

If a foreign substance or the like is present on the surface of the carrier substrate, a laser beam of an appropriate density for desorption of the carrier substrate cannot be irradiated to the portion where the foreign material is located by refraction, diffraction or reflection or absorption of the irradiated laser beam. When the carrier substrate is detached from the flexible panel, the adhesive strength between the flexible panel and the carrier substrate is maintained, so that the plastic substrate, which is one component of the flexible panel, is torn or torn, causing many defects, thereby producing mass production of flexible displays Castle is decreasing.

Therefore, the cleaning process is performed on the carrier substrate prior to the laser beam irradiation, more accurately before detaching the flexible panel on which the PCB is mounted and the carrier substrate.

1 is a schematic plan view of a cleaning device for cleaning a panel (hereinafter referred to as a carrier panel) in a state where a conventional PCB-mounted flexible panel and a carrier substrate are bonded.

The cleaning device 10 of the conventional carrier panel is composed of an input zone (zone1), a cleaning zone (zone2), a drying zone (zone3), and a pickup zone (zone4) of the carrier panel.

And the input zone (zone1) and the washing zone (zone2) is provided with a rail (13), furthermore, located on the rail (13), the stage 16 and the stage (16) on which the carrier panel (70) is seated It is provided with a rotating cover 19 attached to the.

In addition, the cleaning zone (zone2) is provided with a plurality of nozzles (22) to which DI (Deionized water) is injected, the rear end of the nozzle (22) is in contact with the surface of the carrier panel 70, the carrier panel ( A physical foreign substance removing means 25 for physically removing foreign substances attached to the surface of 70) is provided, and further, an air knife 30 is provided at one end of the washing zone 2.

In addition, in the drying zone (zone3), a support means (35) on which the cleaned carrier panel (70) is placed is located, and one side of the support means (35) irradiates hot air on the surface of the carrier panel (70). Drying means 40 is provided.

And the pick-up zone (zone4) is equipped with a robot 45 to pick up the carrier panel that has passed through the cleaning zone (zone2) and placed in the drying zone (zone3), the carrier is completed drying in the drying zone (zone3) A robot 45 is provided to move the panel 70 to a cassette (not shown) or other process equipment (not shown) to proceed with other processes.

In the conventional cleaning apparatus 10 having such a configuration, when the carrier panel 70 is seated on the stage 16 positioned in the input zone 1, alignment of the carrier panel 70 is achieved, and the carrier panel Corresponding to the PCB 73 mounted on the 70, the rotating cover 19 is rotated to be positioned on the PCB 73, thereby forming a state in which the PCB 73 is covered.

Subsequently, in the state where the PCB 73 is covered by the rotating cover 19, the stage 16 is located in the cleaning zone zone2 by moving along the rail 13, and the cleaning zone zone2. In DI is sprayed from the plurality of nozzles 22 on the surface of the carrier panel 70, and cleaning is performed to remove foreign substances attached to the surface of the carrier panel 70 by the physical foreign matter removing means 25.

At this time, the PCB 73 is kept covered by the rotating cover 19, thereby preventing the PCB 73 from being exposed to DI sprayed.

After the surface of the carrier panel 70 in the cleaning zone (zone2) is cleaned, the carrier panel 70 is moved to the drying zone (zone3) by the robot 45 located in the pickup zone (zone4). However, before moving to the drying zone (zone3), the one end of the cleaning zone (zone2) passes through the place where the air knife 30 is located while being positioned on the stage 16, so that the carrier panel 70 Most of the DI remaining on the surface is removed.

Next, in the carrier panel 70 in which DI has been removed from the surface by passing through the air knife 30, the rotating cover 19 rotates to expose the PCB 73.

Next, the carrier panel 70 in a state where the PCB 73 is exposed by rotating the rotating cover 19 is transferred by the robot 45 located in the pickup zone 4 to the drying zone 3 ) Is seated on the support means 35, and then dried by the hot air by the drying means 40 to complete the cleaning process by completely removing the DI remaining finely on the surface of the carrier panel 70. do.

However, as described above, the cleaning process of the carrier panel 70 proceeding through the conventional cleaning device 10 is mounted on the carrier panel 70 after the carrier panel 70 is seated on one stage 16. Since the cleaning is performed while maintaining the state where the rotating cover 19 covers the PCB 73, the other carrier panel 70 is transferred to the cleaning device 10 until the cleaning of one carrier panel 70 is completed. It cannot be put.

That is, in the conventional cleaning apparatus 10 for a carrier panel, the stage 16 is placed in the input zone (zone1) and the washing zone even if the time placed in the washing zone (zone2) where the carrier panel 70 is cleaned is excluded. Since the time for reciprocating (zone2) becomes a waiting time for actual cleaning, there is a lot of wasted time in addition to the time for pure cleaning, so the cleaning processing power per unit time decreases, and finally, productivity decreases due to the decrease in manufacturing time of the flexible display device per unit time. The situation is falling.

In order to improve the cleaning processing power per unit time, a plurality of cleaning devices 10 are required, which leads to an increase in investment cost, and increases the area of a manufacturing line for manufacturing flexible display devices, thereby manufacturing flexible display devices. This is a factor that increases the cost.

In order to solve the above-described problems, the present invention provides a cleaning device capable of improving the cleaning processing power per unit time by cleaning the PCB without being exposed to the cleaning solution or DI, and allowing the carrier panel to be continuously input without waiting time. It aims to improve the productivity of one display device.

In order to achieve the object as described above, the cleaning device according to the present invention, in a cleaning device for cleaning a panel mounted with a printed circuit board (PCB), a plurality of rollers are provided and the panel input zone and the cleaning zone A cleaning line provided; It is located adjacent to the cleaning line and includes a conveying means and a conveying line equipped with a front cover covering the conveying means, and only DI spraying of DI (deionized water) is performed on the cleaning line and the conveying line is the front cover. It is characterized in that the penetration of the DI is prevented, and the panel is moved in one direction by the roller and the conveying means, and the surface of the panel is cleaned.

In this case, the roller and the conveying means are synchronized with each other and rotated at the same speed, so that the panel placed on the roller and the conveying means and the printed circuit board (PCB) mounted on the panel are moved at the same speed, In addition, the panel is located on the roller, the panel and the PCB are connected to each other via FPCB, and the PCB is located on the transfer line, so that the PCB is covered by the front cover.

And the front cover is characterized in that it consists of an upper surface corresponding to the conveying means and a side bent at the upper surface, wherein the front end of the side of the front cover is based on the horizontal surface connecting the upper surfaces of the plurality of rollers. It is characterized by forming the same separation distance for the entire cover.

In addition, the front cover is characterized in that the part corresponding to the input zone forms a configuration that is bent upward in a vertical direction based on the horizontal surface connecting the upper surfaces of the plurality of rollers, wherein the front cover is the Both the upper surface and the side surface located in the part corresponding to the input zone have a constant angle with respect to one reference line in the width direction perpendicular to the longitudinal direction of the conveying line, or form a bent shape, or correspond to the input zone It is characterized in that the top and side surfaces located in the part form a bent shape based on a reference line having a predetermined angle with respect to the longitudinal direction of the transport line.

In addition, the front cover is characterized in that the side of the input zone is removed.

On the other hand, the inner surface of the upper surface of the front cover is provided with an air curtain that blows clean dry air (CDA) in one direction, and continuous flow of CDA occurs at the end of the side of the front cover and the separation area of the conveying means. It is characterized by suppressing the penetration of.

In addition, the cleaning zone is provided with a plurality of nozzles spraying the DI onto the roller, a physical foreign matter removal means, an air knife, and a drying means, wherein the plurality of nozzles are provided only at the front end of the physical foreign matter removal means or , Or is provided at the front end and rear end of the physical removal means.

In addition, the physical foreign matter removal means is a polishing cloth or a blade, the physical removal means is characterized in that rotating in direct contact with one surface of the panel.

A method of manufacturing a display element according to the present invention is a method of manufacturing a display element including cleaning using a cleaning device according to any one of claims 1 to 12, comprising: a first on a first carrier substrate. And a flexible panel in which a second plastic substrate is attached and having a FPCB on one side of the first plastic substrate, and a carrier panel having a PCB mounted thereon; The main body of the carrier panel corresponding to the first and second plastic substrates is located on a roller of the cleaning line, and the PCB is located on the transport line so that the PCB is cleaned so that the PCB is covered with the front cover. Inputting into the input zone of the device; And removing foreign substances on the surface of the first carrier substrate by passing the carrier panel through the cleaning zone of the cleaning device.

In this case, after the step of removing the foreign matter on the surface of the first carrier substrate, the step of detaching the first carrier substrate from the flexible panel after irradiating a laser beam to the surface of the first carrier substrate.

And the step of providing the carrier panel may include forming a first plastic substrate on the first carrier substrate; Forming a second plastic substrate on the second carrier substrate; Forming a first panel by adhering the first and second plastic substrates to each other and bonding them; Cleaning the first panel to remove foreign substances on the surface of the second carrier substrate; Forming a second panel by irradiating a laser beam to the surface of the second carrier substrate and removing the second carrier substrate from the first panel; And mounting the PCB through the FPCB with respect to the flexible panel of the second panel.

And before the step of bonding the first and second plastic substrates, a component for operating as one of a liquid crystal display device, an organic light emitting device and an electrophoretic display device after the first and second plastic substrates are bonded to each other And forming on the first and second plastic substrates or between the first and second plastic substrates.

The cleaning apparatus according to the present invention does not reciprocate by a stage for cleaning progress of the carrier panel on which the PCB is mounted, but a conventional cleaning apparatus by forming a line type cleaning apparatus in which the carrier panel continuously moves in one direction As described above, without waiting time for the stage to return from the cleaning zone to the input zone, the continuous input of the carrier panel is possible, thereby significantly improving the cleaning processing power per unit time, thereby reducing the manufacturing cost of the flexible display device.

1 is a schematic plan view of a cleaning device for cleaning a panel in a state in which a conventional PCB-mounted flexible panel and a carrier substrate are bonded.
2 is a plan view of a cleaning device for a carrier panel according to an embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view of a portion of FIG. 2 taken along III-III.
4A to 4D are perspective views of a front cover, which is a component of the cleaning device according to the present invention, showing various forms of a portion in which a carrier panel of the cleaning device is input.
5A to 5J are cross-sectional views of manufacturing steps of a flexible display device including cleaning using a cleaning device according to the present invention.
6 is a cross-sectional view showing a carrier panel of a flexible display device provided with a touch panel as an example of the flexible display device according to the present invention.

Hereinafter, the present invention will be described in more detail with reference to the drawings.

First, a cleaning device for cleaning a carrier panel according to the present invention will be described.

Here, the carrier panel forms a state in which a carrier substrate made of a glass material is attached to one surface of a flexible display panel manufactured using a plastic substrate having very flexible properties to suppress or reduce flexible properties during a manufacturing process. Furthermore, it means a panel in which a PCB including a driving circuit is mounted on one side of the display panel.

At this time, the flexible display panel is a liquid crystal display device having a liquid crystal layer between the upper and lower substrates made of a plastic substrate having flexible properties, an organic light emitting layer on any one of the upper or lower substrate made of a plastic substrate having flexible properties It may be any one of an electrophoretic display device including an electrophoretic layer between the upper and lower substrates made of a plastic substrate having flexible properties, an organic light emitting device having an organic light emitting diode comprising a.

In addition, the carrier panel may be further provided with a touch film or a panel having a touch sensor in addition to the flexible panel constituting the above-described liquid crystal display device, organic light emitting device, and electrophoretic display device. In this case, the touch film or the touch panel may be further mounted on a touch driving PCB to enable touch driving connected to a touch sensor on one side of itself.

At this time, it will be apparent that the cleaning device according to the present invention is not necessarily limited to the carrier panel, and can be applied to any panel or substrate in which the PCB is mounted.

On the other hand, Figure 2 is a plan view of the cleaning device of the carrier panel according to an embodiment of the present invention, Figure 3 is a schematic cross-sectional view of the portion cut along Figure III-III.

As shown, the cleaning device 100 for a carrier panel according to the present invention is a cleaning line (L1) to which DI is injected largely, and a PCB conveying line to simultaneously support and convey the PCB adjacent to the cleaning line (L1) ( L2).

At this time, the cleaning line (L1) and the PCB conveying line (L2) have the same length, the PCB conveying line (L2) in order to prevent exposure to DI (Deionized water) or the like ejected from the cleaning line (L1) the PCB It is characterized in that the front cover 110 is provided with respect to the front of the transfer line L2.

The cleaning device according to the present invention will be described in more detail.

First, a carrier panel 170 itself is placed on the cleaning line L1, a plurality of rollers 113 moving the carrier panel 170 in one direction, a plurality of nozzles 118 spraying DI, A physical foreign substance removing means 122 for removing foreign substances attached to one surface of the carrier panel 170 and an air cutter 125 for removing DI remaining on the surface of the carrier panel 170 are provided. The drying means 128 is provided outside the air cutter 125.

At this time, each of the plurality of rollers 113 has a constant speed and rotates in one direction, thereby serving to move the carrier panel 170 placed on the upper part at a constant speed.

The speed of the roller 113 is automatically passed when the carrier panel 170 passes through a section provided with a nozzle 118 for spraying DI that is actually cleaned and a place where the physical foreign material removing means 122 is located. By adjusting or slowing or stopping the rotational speed, it is characterized in that it is possible to perform driving to sufficiently remove contaminated parts and foreign matter attached parts of one surface of the carrier panel 170.

The plurality of nozzles 118, the physical foreign matter removing means 122, and the air cutter 125 are configured to be located on the roller 113, wherein the nozzle 118, the air cutter 125, and the drying means ( 128) is characterized in that the roller 113 is fixed in a proper position on the top.

The plurality of nozzles 118 spray DI, and the carrier panel 170 passes the nozzles 118 spraying the DI at a constant speed to remove the organic and inorganic materials present on the surface of the carrier panel 170. It serves to remove.

In this case, the plurality of nozzles 118 may be located at the front end or the front end and the rear end of the physical foreign matter removal means 122, or include the area where the physical foreign matter removal means 122 is provided, including its front end and rear end. It may be configured to continuously spray DI in a certain area of.

In the case of the nozzle 118a located at the front end of the physical foreign matter removal means 122, the physical foreign matter removal means 122 in which the sprayed DI proceeds by preferentially spraying DI on the surface of the carrier panel 170 And serves as an abrasive softener during friction with the surface of the carrier panel 170.

In addition, the nozzle 118b located at the rear end of the physical foreign matter removing means 122 serves to wash the surface of the carrier panel 170 after removing the foreign matter.

On the other hand, the physical foreign matter removing means 122 is provided with, for example, a rotating abrasive cloth or a blade, and is located above the roller 113, but is characterized in that it can move up and down, and the carrier panel 170 is the When passing through the place where the foreign material removal means 122 is located, the surface of the carrier panel 170, more precisely, the surface of the first carrier substrate (not shown) and the rotating abrasive cloth or the blade contact each other, and then rotate and rub. The foreign matter attached to the surface of the carrier panel 170 is effectively removed.

The air cutter 125 blows strong wind, and the DI is sprayed, so that the surface of the carrier panel 170 is finally left with DI, and thus the DI remaining on the surface of the carrier panel 170 is recalled. It serves to remove by moving in one direction from the surface of the carrier panel 170.

In addition, the drying means 128 has a temperature atmosphere of 70 to 90 ° C inside, and the carrier panel 170 passes through the drying means 128 at a constant speed to remain on the surface of the carrier panel 170. It serves to completely remove fine DI. At this time, the drying means 128 may be further provided with a blowing means (not shown) therein to form a configuration that allows the hot air having the temperature of 70 to 90 ℃ to enter the surface of the carrier panel 170.

Meanwhile, the PCB conveying means 140 provided in the PCB conveying line is driven in synchronization with a motor as an example of a driving means (not shown) that rotates the roller 113 in one direction, and moves on the roller 113. As a conveyor having the same moving speed as the moving speed of the carrier panel 170, when a PCB mounted on the carrier panel 170 and a touch panel (not shown) are further provided on the carrier panel 170, the touch panel (not shown) City) is mounted on the touch PCB (not shown).

In addition, a front cover 110 is provided in a fixed form on the upper part of the conveyor, which is the PCB conveying means 140, and the front cover 110 is bent at an upper surface facing the carrier panel 170 and at the upper surface. It comprises a side having a predetermined width.

At this time, the side of the front cover 110 is spaced apart a predetermined distance on the surface of the FPCB (Flexible printed circuit board) 176 connecting the carrier panel 170 and the PCB, the front cover 110 is the It is characterized by forming a configuration that completely covers the PCB (and the touch PCB) 176 mounted on the carrier panel 170.

Meanwhile, an air curtain 145 for spraying clean dry air (CDA) is further provided on the inner surface of the front cover 110.

Therefore, by the air curtain 145, the CDA is continuously blown from one end of the inner surface of the upper surface of the front cover 110 to one end of the side of the front cover 110, so that the PCB 173 and the carrier panel ( CDA flow from the inside to the outside is generated in the separation area between one end of the side of the front cover 110 and the surface of the FPCB 176 located on the FPCB 176 connecting 170), and such CDA It is characterized in that the DI sprayed by the plurality of nozzles 118 in the cleaning line L1 by the flow serves to prevent further penetration of the PCB 173 into the surface.

 On the other hand, Figures 4a to 4d is a perspective view of a front cover that is a component of the cleaning device according to the present invention, is a view showing a variety of forms for the portion of the carrier panel of the cleaning device is made. At this time, in the drawings, the dotted line shown spaced apart from the front cover shows a horizontal surface connecting the upper surface of the roller on which the carrier panel is seated.

The front cover 110 is composed of a top surface (110a) and a side surface (110b) formed by bending at one end of the top surface (110a), as shown in Figure 4a, in this case the top surface (110a) and side ( 110b) may be configured to form the same straight flat surface as a whole of the front cover 110, or as shown in FIGS. 4B and 4C, a portion located in the input zone where the carrier panel (170 in FIG. 2) is input. Regarding, it may be configured in a form in which bending occurs, and as shown in FIG. 4D, the side surface 110b is removed for the carrier panel (170 in FIG. 2) input zone of the cleaning device (100 in FIG. 2) It may be composed of.

The cleaning device according to the present invention (100 in FIG. 2) comprises a cleaning line (L1 in FIG. 2) and a PCB transfer line (L2 in FIG. 2) adjacent thereto, and the body of the carrier panel (170 in FIG. 2) is cleaned It should be put in the cleaning device (100 in FIG. 2) to be located in the line L1 and the PCB 173 to be located in the PCB conveying line L2.

However, the PCB transfer line (L2 in FIG. 2) is provided with a front cover 110, and one end of the side surface 110b of the front cover 110 extends the upper surface of the roller 113 more precisely. It is located very close to a horizontal plane (hereinafter referred to as a roller horizontal plane). The front cover 110, one end of the side 110b is configured so as to be very close to the horizontal surface of the roller, when the carrier panel 170 is inserted, the spacing between the front cover 110 and the surface of the FPCB (176 in FIG. 2) This is to effectively prevent the DI sprayed from the cleaning line (L1 in FIG. 2) from invading the PCB (173 in FIG. 2) by minimizing.

However, in this case, when one end of the front cover 110 and the side surface 110b forms a configuration adjacent to the horizontal surface of the roller, when the carrier panel (170 in FIG. 2) itself is introduced into the cleaning device (100 in FIG. 2) Be very careful.

That is, even if the carrier panel (170 in FIG. 2) flows slightly up and down with the cleaning device (100 in FIG. 2), the FPCB (176 in FIG. 2) contacts the side surface 110b of the front cover 110. As a result, tearing may occur, or when the carrier panel (170 in FIG. 2) itself is moved and is not seated in a desired position inside the cleaning device (100 in FIG. 2), when moving inside the cleaning device (100 in FIG. 2). The carrier panel 170 itself may be partially damaged by the bump, or the PCB (173 in FIG. 2) itself may not be covered by the front cover 110, and thus DI or the like may penetrate to cause a short circuit or the like.

Therefore, in order to solve this problem, the front cover 110 may be modified in various forms as illustrated in FIGS. 4B to 4D.

As shown in FIG. 4B, in the input zone in which the carrier panel (170 in FIG. 2) is input, the entire upper surface 110a and the side surface 110b are at a predetermined angle in a direction perpendicular to the horizontal surface of the roller. By forming the bent shape, the separation area (d1) between one end of the side surface (110b) of the front cover (110) and the horizontal surface of the roller is larger than the other area (the part where the actual carrier panel is cleaned) (d2). As shown in FIG. 4C, only the side surface 110b and a portion of the upper surface 110a adjacent to the side surface 110b of the front cover 110 of the portion corresponding to the input zone are referenced to the roller horizontal surface. In this way, by forming a bent shape at a predetermined angle in the vertical direction, the distance d2 between the one end of the side surface 110b of the front cover 110 and the horizontal surface of the roller is different from the other area (the cleaning of the actual carrier panel Made It can be set to have a larger value than the separation distance (d1) of the part).

In addition, the front cover 110, as shown in Figure 4d, for the input zone of the cleaning device (100 in FIG. 2) may be formed in a form in which the side surface 110b bent on the upper surface 110a is removed. .

In the cleaning device (100 in FIG. 2), the spraying of DI is not made in the actual input zone, but is performed in the cleaning zone provided with a plurality of nozzles 118, so even if the side 110b is removed for the input zone, the carrier There is no problem in that the PCB (173 in FIG. 2) mounted on the panel (170 in FIG. 2) is exposed to DI.

The cleaning device according to the present invention (110 in FIG. 2) is of a line type in which the carrier panel continuously moves in one direction without reciprocating by a stage for cleaning of the carrier panel (170 in FIG. 2). By forming the cleaning device, as in the conventional cleaning device (10 in FIG. 1), the carrier panel (FIG. 2, without waiting time for the stage to return from the cleaning zone (zone 2 in FIG. 1) to the input zone (zone 1 in FIG. 1) Since the continuous input of 170) is possible, the cleaning processing power per unit time is remarkably improved, thereby reducing the manufacturing cost of the flexible display device.

Hereinafter, a method for manufacturing a flexible display device including a method for cleaning a carrier panel using a cleaning device having the above-described configuration will be briefly described.

In this case, as the flexible display element, for example, a liquid crystal display device is taken as an example, but it may be apparent that it may be an organic electroluminescent device or an electrophoretic display device.

5A to 5J are cross-sectional views of manufacturing steps of a flexible display device including cleaning using a cleaning device according to the present invention.

First, as shown in FIG. 5A, the first plastic substrate 172 is formed by attaching a plastic film having very flexible properties to the first carrier substrate 171 made of glass, or the first carrier made of the glass material. The first plastic substrate 172 is formed on the substrate 171 by coating and curing the liquid plastic material, for example, PI (poly imide). At this time, although not shown in the drawings, the adhesion between the first carrier substrate 171 and the first plastic substrate 172 is reduced by laser beam irradiation in order to smoothly detach and detach the first carrier substrate 171 later. A first intermediate layer (not shown) having the characteristics to be formed is further formed.

In addition, a gate insulating film (not shown) is formed on the first plastic substrate 172 by performing an array process for a liquid crystal display device while the first plastic substrate 172 is provided on the first carrier substrate 171. The gate and data lines (not shown) that define a plurality of pixel areas (not shown) intersecting each other with and between, and are connected to the gate and data lines (not shown) as switching elements in each pixel area (not shown). A thin film transistor (not shown) and a pixel electrode (not shown) connected to a drain electrode (not shown) of the thin film transistor (not shown) are formed in each pixel area (not shown). In this case, a common electrode (not shown) spaced apart from the pixel electrode (not shown) may be further formed in each pixel area (not shown) according to the model of the liquid crystal display device, or the pixel electrode (not shown) A common electrode (not shown) having a plurality of openings (not shown) may be further formed in each pixel area (not shown) with an insulating layer (not shown) interposed therebetween.

Next, as illustrated in FIG. 5B, the same method as that in which the first plastic substrate 172 is formed on the first carrier substrate 171 is performed to provide flexible properties on the second carrier substrate 181 made of glass. A second plastic substrate 182 is formed.

Thereafter, a black matrix (not shown) having an opening (not shown) corresponding to each pixel area (not shown) is formed on the second plastic substrate 182, and red, green, and green are formed in each opening (not shown). A color filter layer (not shown) corresponding to the blue color filter pattern is formed. At this time, when a common electrode (not shown) is not formed on the first plastic substrate 172, a common electrode (not shown) is further formed on the front surface of the second plastic substrate 182 over the color filter layer (not shown). can do.

Next, as illustrated in FIG. 5C, after the first plastic substrate 172 and the second plastic substrate 182 are positioned to face each other and the liquid crystal layer 190 is restarted, the first or second plastic substrate A seal pattern (not shown) is formed along the rim of (182), and the first and second plastic substrates 172 and 182 are bonded together to form a first panel pn1. At this time, the first panel (pn1) is attached to the first and second carrier substrates (171, 182) outside the first and second plastic substrates (172, 182), and the PCB 173 is not mounted do.

Thereafter, as shown in FIG. 5D, unlike the general panel cleaning device (not shown), that is, the cleaning device of the present invention (100 of FIG. 2), the first panel pnl is made of only a cleaning line without a PCB conveying line. The surface of the second carrier substrate 181 is cleaned by inputting it into a general panel cleaning device (not shown) to remove foreign matter and contaminated parts of the surface.

Next, as shown in FIG. 5E, the second carrier substrate 181, which has been cleaned through a laser irradiation device (not shown), has an appropriate energy density on the front surface of the first panel pn1, which has been cleaned. The laser beam is irradiated.

The reason for irradiating the laser beam is to relieve adhesion by activating a second intermediate layer (not shown) positioned between the second plastic substrate 182 and the second carrier substrate 181.

Next, as shown in FIG. 5F, the second carrier substrate (FIG. 5E) is subjected to a desorption process of the second carrier substrate (181 of FIG. 5E) with respect to the first panel pn1 after laser beam irradiation. 181) to form the second panel (pn2) in a removed state.

Thereafter, as shown in FIG. 5G, the second plastic substrate 182 exposed from the second panel (FIG. 5F pn2) with the second carrier substrate (181 of FIG. 5E) removed The first polarizing plate 192 is attached to the side surface 110b. Since the second panel (FIG. 5F pn2) is still in a state where the first carrier substrate 171 is attached, flexibility is suppressed, so a general liquid crystal display manufacturing line can be used.

The attachment of the first polarizing plate 192 may be omitted when implementing a flexible display device as an organic light emitting device or an electrophoretic display device.

Next, by performing the process of mounting the PCB 173 with respect to the second panel (FIG. 5F pn2) to which the first polarizing plate 192 is attached, one side of the first plastic substrate 172 on which the array element is formed A plurality of FPCB (176) as a medium to mount the PCB 173 equipped with a driving circuit. In this way, the second panel (FIG. 5F pn2) in which the PCB 173 is mounted via the FPCB 176 is defined as the carrier panel 170.

In addition, as shown in FIG. 6 (a cross-sectional view showing a carrier panel of a flexible display device provided with a touch panel as an example of the flexible display device according to the present invention) in a state where the PCB 173 mounting process is completed, touch In order to form a flexible display device that gives a function, the touch film 220 in a state where the touch PCB 210 is mounted through an adhesive layer (not shown) on the outer surface 110b of the second plastic substrate 182 ) Or a touch panel (not shown) is attached.

The touch film 220 or the touch panel (not shown) is not necessarily attached and may be omitted.

Next, as shown in Figure 5h, the PCB (173) is mounted on the carrier panel 170 is the PCB (and the touch PCB (not shown) using the cleaning device (100 in Figure 2) according to the present invention )) By cleaning the surface of the first carrier substrate 171 without DI being penetrated into the 173, foreign matter and contaminants attached to the surface of the first carrier substrate 171 are completely removed.

That is, when the carrier panel 170 is seated in the input zone of the cleaning device (100 in FIG. 2) according to the present invention, the carrier panel 170 body (first and second plastic substrates 182 excluding PCB) are cemented. The roller 113 on which the placed portion is placed and the PCB conveying means 140 on which the PCB 173 is placed are synchronized to rotate at a constant speed to move the carrier panel 170 in one direction.

Thereafter, the carrier panel 170 moved in one direction, more precisely, the body of the carrier panel 170 reaches the cleaning zone, whereby DI is sprayed on the surface of the first carrier substrate 171, and the physical foreign matter removing means ( 2, 122) operates to remove foreign substances adhering to the surface of the first carrier substrate 171 by friction through direct contact with the surface of the first carrier substrate 171, and at the same time, the first by DI. The foreign material off the surface of the carrier substrate 171 is washed to be removed.

At this time, in the case of the PCB 173 moved through the PCB conveying means 140, it is covered by the front cover 110 and at the same time by the air curtain 145 provided on the inner surface of the front cover 110. As a state in which the flow of CDA is being generated, DI sprayed in the cleaning zone is characterized in that the penetration into the PCB 173 is basically blocked.

Next, the carrier panel 170 in which DI has been sprayed and the removal of physical foreign matter is passed through an air cutter (125 in FIG. 2) to remove DI remaining on the first carrier substrate 171.

In addition, the carrier panel 170 that has passed through the air cutter 125 passes through the drying means (128 of FIG. 2) to completely dry the DI in the minute moisture state remaining on the first carrier substrate 171.

On the other hand, after the cleaning of the carrier panel 170 using the cleaning device (100 in FIG. 2) according to the present invention capable of continuous input without DI penetration into the PCB 173 as described above, as shown in FIG. , A first intermediary layer (not shown) interposed between the first plastic substrate 172 and the first carrier substrate 171 by irradiating a laser beam to the surface of the first carrier substrate 171 through a laser irradiation device ) Weakens the adhesion.

Subsequently, as illustrated in FIG. 5J, the flexible display device 199 is removed by removing the first carrier substrate 171 from the carrier panel (170 in FIG. 5I) by detaching the first carrier substrate 171. To complete.

On the other hand, after the first carrier substrate (171 in FIG. 5I) is detached and removed, when the flexible display element 199 is made of a liquid crystal display, the outer surface 110b of the first plastic substrate 172 is The flexible display device 199 is completed by additionally performing a process of attaching the second polarizing plate 194.

On the other hand, when the flexible display element is made of an organic light emitting element or an electrophoretic display device, the cleaning process of the above-described carrier panel proceeds in the same manner, and only the components formed on the first plastic substrate and the second plastic substrate are changed. Since these processes are performed in the same way as a general organic electroluminescent device or a general electrophoretic display device manufacturing method, a detailed method of manufacturing a flexible display device comprising an organic electroluminescent device or an electrophoretic display device is omitted.

100: (for carrier panel) cleaning device
110: front cover
113: roller
118: nozzle
122: physical foreign matter removal means
125: air knife
128: drying means
140: PCB transfer device
145: air curtain
170: carrier panel
173: PCB
176: FPCB
L1: Cleaning line
L2: PCB transfer line

Claims (16)

In the cleaning device for cleaning a panel mounted with a printed circuit board (PCB),
A plurality of rollers, a panel input zone and a cleaning zone, and a cleaning line on which the panel is located;
A conveying line positioned adjacent to the cleaning line, the conveying means on which the PCB mounted on the panel is located, and a front cover covering the conveying means
Including, only the cleaning line is sprayed with DI (deionized water), the conveying line is prevented from infiltrating the DI by the front cover, the panel by the roller and the conveying means in one direction Cleaning device characterized in that the surface of the panel is moved while moving.
According to claim 1,
The roller and the conveying means are synchronized with each other and rotated at the same speed, thereby cleaning the panel placed on the roller and the conveying means and the printed circuit board (PCB) mounted on the panel at the same speed.
According to claim 2,
The panel is located on the roller, and the panel and the PCB are connected to each other via FPCB.
According to claim 1,
The front cover is a cleaning device characterized in that it consists of an upper surface corresponding to the conveying means and a side bent from the upper surface.
The method of claim 4,
A cleaning device characterized in that the ends of the side surfaces of the front cover form the same separation distance with respect to the entire front cover based on a horizontal surface connecting the upper surfaces of the plurality of rollers.
The method of claim 4,
The front cover is a cleaning device characterized in that the part corresponding to the input zone forms a configuration bent upward in a vertical direction based on a horizontal surface connecting the upper surfaces of the plurality of rollers.
The method of claim 6,
The front cover,
Both the upper surface and the side surface located in the part corresponding to the input zone have a constant angle with respect to one reference line in the width direction perpendicular to the longitudinal direction of the conveying line, or form a bent shape,
Alternatively, the cleaning device characterized in that the upper surface and the side surface located in the part corresponding to the input zone form a bent shape based on a reference line having a predetermined angle with respect to the longitudinal direction of the transport line.
According to claim 1,
The front cover is a cleaning device characterized in that the side of the input zone is removed.
According to claim 1,
The inner surface of the upper surface of the front cover is provided with an air curtain that blows clean dry air (CDA) in one direction. Cleaning device characterized in that to suppress the.
According to claim 1,
The cleaning zone is equipped with a plurality of nozzles spraying the DI onto the roller, a physical foreign substance removing means, an air knife and a drying means.
The method of claim 10,
The plurality of nozzles are provided only at the front end of the physical foreign matter removing means,
Or a cleaning device characterized in that provided at the front and rear ends of the physical removal means.
The method of claim 10,
The physical foreign substance removing means is a polishing cloth or a blade, and the physical foreign substance removing means is in direct contact with one surface of the panel and rotates.
A method for manufacturing a display element comprising cleaning using a cleaning device according to any one of claims 1 to 12,
Providing a carrier panel in a state in which a PCB is mounted by attaching a FPCB to one side of the first plastic substrate and attaching a flexible panel to which the first and second plastic substrates are bonded onto the first carrier substrate;
The main body of the carrier panel corresponding to the first and second plastic substrates is located on a roller of the cleaning line, and the PCB is located on the conveying line so that the PCB is covered so that the PCB is covered with the front cover. Inputting into the input zone of the cleaning device;
Removing foreign substances on the surface of the first carrier substrate by passing the carrier panel through the cleaning zone of the cleaning device.
Method for manufacturing a display device comprising a.
The method of claim 13,
After the step of removing the foreign matter on the surface of the first carrier substrate, a method of manufacturing a display device comprising irradiating a laser beam to the surface of the first carrier substrate and then detaching the first carrier substrate from the flexible panel.
The method of claim 14,
The step of providing the carrier panel,
Forming a first plastic substrate on the first carrier substrate;
Forming a second plastic substrate on the second carrier substrate;
Forming a first panel by adhering the first and second plastic substrates to each other and bonding them;
Cleaning the first panel to remove foreign substances on the surface of the second carrier substrate;
Forming a second panel by irradiating a laser beam to the surface of the second carrier substrate and removing the second carrier substrate from the first panel;
Mounting a PCB with the FPCB on the flexible panel of the second panel
Method for manufacturing a display device comprising a.
The method of claim 15,
Before the step of bonding the first and second plastic substrates
After the first and second plastic substrates are bonded to each other, a component for operating as one of a liquid crystal display device, an organic light emitting device, and an electrophoretic display device is formed on the first and second plastic substrates or the second Forming between the first and second plastic substrates
Method for manufacturing a display device comprising a.

Images