KR102072749B1 - 액체를 피정제물로 하는 정제 방법, 규소 화합물 함유액을 피정제물로 하는 정제 방법, 실릴화제 약액, 막형성용 재료 또는 확산제 조성물의 제조 방법, 필터 미디어, 및 필터 디바이스 - Google Patents
액체를 피정제물로 하는 정제 방법, 규소 화합물 함유액을 피정제물로 하는 정제 방법, 실릴화제 약액, 막형성용 재료 또는 확산제 조성물의 제조 방법, 필터 미디어, 및 필터 디바이스 Download PDFInfo
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- KR102072749B1 KR102072749B1 KR1020187016143A KR20187016143A KR102072749B1 KR 102072749 B1 KR102072749 B1 KR 102072749B1 KR 1020187016143 A KR1020187016143 A KR 1020187016143A KR 20187016143 A KR20187016143 A KR 20187016143A KR 102072749 B1 KR102072749 B1 KR 102072749B1
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- liquid
- silicon compound
- polyimide
- porous membrane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/02—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor characterised by their properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/58—Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
- B01D71/62—Polycondensates having nitrogen-containing heterocyclic rings in the main chain
- B01D71/64—Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0002—Organic membrane manufacture
- B01D67/0023—Organic membrane manufacture by inducing porosity into non porous precursor membranes
- B01D67/003—Organic membrane manufacture by inducing porosity into non porous precursor membranes by selective elimination of components, e.g. by leaching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0081—After-treatment of organic or inorganic membranes
- B01D67/0093—Chemical modification
- B01D67/00931—Chemical modification by introduction of specific groups after membrane formation, e.g. by grafting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/58—Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
- B01D71/62—Polycondensates having nitrogen-containing heterocyclic rings in the main chain
- B01D71/64—Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
- B01D71/641—Polyamide-imides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/70—Polymers having silicon in the main chain, with or without sulfur, nitrogen, oxygen or carbon only
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/20—Purification, separation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H01L21/225—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/19—Diffusion sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2325/00—Details relating to properties of membranes
- B01D2325/02—Details relating to pores or porosity of the membranes
- B01D2325/021—Pore shapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2325/00—Details relating to properties of membranes
- B01D2325/02—Details relating to pores or porosity of the membranes
- B01D2325/0283—Pore size
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/14—Ultrafiltration; Microfiltration
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Transplantation (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015220512A JP6795884B2 (ja) | 2015-11-10 | 2015-11-10 | 液体を被精製物とする精製方法、ケイ素化合物含有液を被精製物とする精製方法、シリル化剤薬液、膜形成用材料又は拡散剤組成物の製造方法、フィルターメディア、及び、フィルターデバイス |
| JPJP-P-2015-220512 | 2015-11-10 | ||
| PCT/JP2016/082140 WO2017082088A1 (ja) | 2015-11-10 | 2016-10-28 | 液体を被精製物とする精製方法、ケイ素化合物含有液を被精製物とする精製方法、シリル化剤薬液、膜形成用材料又は拡散剤組成物の製造方法、フィルターメディア、及び、フィルターデバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180081121A KR20180081121A (ko) | 2018-07-13 |
| KR102072749B1 true KR102072749B1 (ko) | 2020-02-03 |
Family
ID=58695203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187016143A Active KR102072749B1 (ko) | 2015-11-10 | 2016-10-28 | 액체를 피정제물로 하는 정제 방법, 규소 화합물 함유액을 피정제물로 하는 정제 방법, 실릴화제 약액, 막형성용 재료 또는 확산제 조성물의 제조 방법, 필터 미디어, 및 필터 디바이스 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10525418B2 (enExample) |
| JP (1) | JP6795884B2 (enExample) |
| KR (1) | KR102072749B1 (enExample) |
| TW (1) | TWI724052B (enExample) |
| WO (1) | WO2017082088A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6486161B2 (ja) * | 2015-03-24 | 2019-03-20 | 東京応化工業株式会社 | シリル化剤薬液の調製方法及び表面処理方法 |
| JP7127937B2 (ja) * | 2016-11-01 | 2022-08-30 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | ポリイミド |
| JP6941504B2 (ja) * | 2017-08-28 | 2021-09-29 | 東京応化工業株式会社 | 強誘電体及びこれを備えるメモリー素子、並びに強誘電体の製造方法 |
| KR102690290B1 (ko) * | 2018-01-12 | 2024-08-05 | 후지필름 가부시키가이샤 | 약액, 및 약액의 제조 방법 |
| JP6526894B1 (ja) * | 2018-09-20 | 2019-06-05 | 日東電工株式会社 | 分離膜 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010270185A (ja) * | 2009-05-19 | 2010-12-02 | Daicel Chem Ind Ltd | フォトレジスト用高分子化合物の製造方法 |
| US20130045355A1 (en) * | 2010-04-07 | 2013-02-21 | Ube Industries, Ltd | Porous polyimide membrane and process for production thereof |
| WO2013094528A1 (ja) * | 2011-12-20 | 2013-06-27 | オルガノ株式会社 | 液体管理システム、および洗浄液の回収再生装置 |
| JP2014094501A (ja) * | 2012-11-09 | 2014-05-22 | Daicel Corp | 多孔膜積層体及びその製造方法 |
| WO2014115687A1 (ja) * | 2013-01-25 | 2014-07-31 | 住友ベークライト株式会社 | 浸透気化膜およびフェノール濃縮方法 |
| JP2015165009A (ja) * | 2014-02-28 | 2015-09-17 | ポール・コーポレーションPallCorporation | 高空隙容積を有する多孔質ポリマー膜 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4637476Y1 (enExample) | 1967-06-21 | 1971-12-24 | ||
| JPH0957069A (ja) * | 1995-08-30 | 1997-03-04 | Mitsubishi Chem Eng Corp | 浸透気化法による有機液体の精製方法及びそれに用いる装置並びにこれらを利用した蒸気乾燥 |
| JP4637476B2 (ja) | 2002-12-19 | 2011-02-23 | 東京応化工業株式会社 | ホトレジスト組成物の製造方法 |
| JP5128044B2 (ja) | 2003-12-10 | 2013-01-23 | 東京応化工業株式会社 | シリコン基板又は金属配線パターンが設けられたシリコン基板被覆用シリカ系被膜形成用材料の製造方法 |
| JP5249503B2 (ja) * | 2006-08-29 | 2013-07-31 | 三菱レイヨン株式会社 | 重合体粉末の製造方法およびレジスト組成物の製造方法 |
| JP5092721B2 (ja) * | 2007-12-05 | 2012-12-05 | Jsr株式会社 | フォトレジスト用樹脂の製造方法 |
| US7838425B2 (en) | 2008-06-16 | 2010-11-23 | Kabushiki Kaisha Toshiba | Method of treating surface of semiconductor substrate |
| SG185632A1 (en) * | 2010-06-07 | 2012-12-28 | Central Glass Co Ltd | Liquid chemical for foaming protecting film |
| US9228120B2 (en) | 2010-06-07 | 2016-01-05 | Central Glass Company, Limited | Liquid chemical for forming protecting film |
| WO2015020101A1 (ja) * | 2013-08-08 | 2015-02-12 | 東京応化工業株式会社 | 多孔質ポリイミド系樹脂膜の製造方法、多孔質ポリイミド系樹脂膜、及びそれを用いたセパレータ |
-
2015
- 2015-11-10 JP JP2015220512A patent/JP6795884B2/ja active Active
-
2016
- 2016-10-28 KR KR1020187016143A patent/KR102072749B1/ko active Active
- 2016-10-28 WO PCT/JP2016/082140 patent/WO2017082088A1/ja not_active Ceased
- 2016-10-28 US US15/772,931 patent/US10525418B2/en active Active
- 2016-11-07 TW TW105136138A patent/TWI724052B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010270185A (ja) * | 2009-05-19 | 2010-12-02 | Daicel Chem Ind Ltd | フォトレジスト用高分子化合物の製造方法 |
| US20130045355A1 (en) * | 2010-04-07 | 2013-02-21 | Ube Industries, Ltd | Porous polyimide membrane and process for production thereof |
| WO2013094528A1 (ja) * | 2011-12-20 | 2013-06-27 | オルガノ株式会社 | 液体管理システム、および洗浄液の回収再生装置 |
| JP2014094501A (ja) * | 2012-11-09 | 2014-05-22 | Daicel Corp | 多孔膜積層体及びその製造方法 |
| WO2014115687A1 (ja) * | 2013-01-25 | 2014-07-31 | 住友ベークライト株式会社 | 浸透気化膜およびフェノール濃縮方法 |
| JP2015165009A (ja) * | 2014-02-28 | 2015-09-17 | ポール・コーポレーションPallCorporation | 高空隙容積を有する多孔質ポリマー膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI724052B (zh) | 2021-04-11 |
| KR20180081121A (ko) | 2018-07-13 |
| JP2017087138A (ja) | 2017-05-25 |
| US10525418B2 (en) | 2020-01-07 |
| TW201731583A (zh) | 2017-09-16 |
| US20180311622A1 (en) | 2018-11-01 |
| JP6795884B2 (ja) | 2020-12-02 |
| WO2017082088A1 (ja) | 2017-05-18 |
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