KR102069253B1 - 스캐터로메트리 측정들을 위한 조명 구성들 - Google Patents
스캐터로메트리 측정들을 위한 조명 구성들 Download PDFInfo
- Publication number
- KR102069253B1 KR102069253B1 KR1020167003924A KR20167003924A KR102069253B1 KR 102069253 B1 KR102069253 B1 KR 102069253B1 KR 1020167003924 A KR1020167003924 A KR 1020167003924A KR 20167003924 A KR20167003924 A KR 20167003924A KR 102069253 B1 KR102069253 B1 KR 102069253B1
- Authority
- KR
- South Korea
- Prior art keywords
- illumination
- target
- scatterometry
- illumination beam
- pupil plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005286 illumination Methods 0.000 title claims abstract description 316
- 238000005259 measurement Methods 0.000 title claims abstract description 128
- 210000001747 pupil Anatomy 0.000 claims abstract description 125
- 238000000034 method Methods 0.000 claims abstract description 68
- 238000003384 imaging method Methods 0.000 claims abstract description 36
- 230000000737 periodic effect Effects 0.000 claims description 13
- 238000000691 measurement method Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000000644 propagated effect Effects 0.000 abstract description 2
- 239000011295 pitch Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 16
- 230000008859 change Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 230000002123 temporal effect Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
- F21V14/02—Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
- G03F7/706849—Irradiation branch, e.g. optical system details, illumination mode or polarisation control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/40—Lighting for industrial, commercial, recreational or military use
- F21W2131/403—Lighting for industrial, commercial, recreational or military use for machines
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361847883P | 2013-07-18 | 2013-07-18 | |
| US61/847,883 | 2013-07-18 | ||
| PCT/US2014/046724 WO2015009739A1 (en) | 2013-07-18 | 2014-07-15 | Illumination configurations for scatterometry measurements |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207001237A Division KR102202523B1 (ko) | 2013-07-18 | 2014-07-15 | 스캐터로메트리 측정들을 위한 조명 구성들 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160034343A KR20160034343A (ko) | 2016-03-29 |
| KR102069253B1 true KR102069253B1 (ko) | 2020-01-22 |
Family
ID=52346681
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167003924A Active KR102069253B1 (ko) | 2013-07-18 | 2014-07-15 | 스캐터로메트리 측정들을 위한 조명 구성들 |
| KR1020207001237A Active KR102202523B1 (ko) | 2013-07-18 | 2014-07-15 | 스캐터로메트리 측정들을 위한 조명 구성들 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207001237A Active KR102202523B1 (ko) | 2013-07-18 | 2014-07-15 | 스캐터로메트리 측정들을 위한 조명 구성들 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6486917B2 (enExample) |
| KR (2) | KR102069253B1 (enExample) |
| TW (1) | TWI640761B (enExample) |
| WO (1) | WO2015009739A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105807573B (zh) * | 2014-12-31 | 2017-12-29 | 上海微电子装备(集团)股份有限公司 | 用于套刻误差检测的装置和方法 |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| US11112369B2 (en) * | 2017-06-19 | 2021-09-07 | Kla-Tencor Corporation | Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay |
| US11112691B2 (en) * | 2019-01-16 | 2021-09-07 | Kla Corporation | Inspection system with non-circular pupil |
| EP3876037A1 (en) * | 2020-03-06 | 2021-09-08 | ASML Netherlands B.V. | Metrology method and device for measuring a periodic structure on a substrate |
| WO2021151754A1 (en) * | 2020-01-29 | 2021-08-05 | Asml Netherlands B.V. | Metrology method and device for measuring a periodic structure on a substrate |
| US11346657B2 (en) * | 2020-05-22 | 2022-05-31 | Kla Corporation | Measurement modes for overlay |
| CN114253065B (zh) * | 2021-12-20 | 2025-08-01 | 武汉天马微电子有限公司 | 掩膜版及其制备方法、显示面板、显示装置和光刻设备 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859424A (en) * | 1997-04-08 | 1999-01-12 | Kla-Tencor Corporation | Apodizing filter system useful for reducing spot size in optical measurements and other applications |
| US6538730B2 (en) * | 2001-04-06 | 2003-03-25 | Kla-Tencor Technologies Corporation | Defect detection system |
| US7528953B2 (en) * | 2005-03-01 | 2009-05-05 | Kla-Tencor Technologies Corp. | Target acquisition and overlay metrology based on two diffracted orders imaging |
| US7589832B2 (en) * | 2006-08-10 | 2009-09-15 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method |
| US7573584B2 (en) * | 2006-09-25 | 2009-08-11 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| DE602007012927D1 (de) * | 2006-11-27 | 2011-04-14 | Philips Solid State Lighting | Itlicher projektionsbeleuchtung |
| US7618163B2 (en) * | 2007-04-02 | 2009-11-17 | Ruud Lighting, Inc. | Light-directing LED apparatus |
| DE102008046362A1 (de) * | 2008-09-09 | 2010-03-18 | Diehl Bgt Defence Gmbh & Co. Kg | Gegenstandserfassungssystem mit einem Bilderfassungssystem |
| JP5277348B2 (ja) * | 2009-05-11 | 2013-08-28 | エーエスエムエル ネザーランズ ビー.ブイ. | オーバーレイエラーを決定する方法 |
| KR20120039659A (ko) * | 2009-06-22 | 2012-04-25 | 에이에스엠엘 홀딩 엔.브이. | 물체 검사 시스템 및 물체 검사 방법 |
| IL217843A (en) * | 2011-02-11 | 2016-11-30 | Asml Netherlands Bv | A system and method for testing, a lithographic system, a cell for lithographic processing, and a method for producing a device |
| DE102011006468B4 (de) * | 2011-03-31 | 2014-08-28 | Carl Zeiss Smt Gmbh | Vermessung eines abbildenden optischen Systems durch Überlagerung von Mustern |
| NL2008936A (en) | 2011-07-28 | 2013-01-29 | Asml Netherlands Bv | Illumination source for use in inspection methods and/or lithography inspection and lithographic apparatus and inspection method. |
| US20130077086A1 (en) * | 2011-09-23 | 2013-03-28 | Kla-Tencor Corporation | Solid-State Laser And Inspection System Using 193nm Laser |
-
2014
- 2014-07-15 KR KR1020167003924A patent/KR102069253B1/ko active Active
- 2014-07-15 KR KR1020207001237A patent/KR102202523B1/ko active Active
- 2014-07-15 JP JP2016527043A patent/JP6486917B2/ja active Active
- 2014-07-15 WO PCT/US2014/046724 patent/WO2015009739A1/en not_active Ceased
- 2014-07-16 TW TW103124411A patent/TWI640761B/zh active
-
2019
- 2019-02-20 JP JP2019028295A patent/JP6745367B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6745367B2 (ja) | 2020-08-26 |
| JP2016527501A (ja) | 2016-09-08 |
| TWI640761B (zh) | 2018-11-11 |
| KR20160034343A (ko) | 2016-03-29 |
| JP6486917B2 (ja) | 2019-03-20 |
| JP2019078773A (ja) | 2019-05-23 |
| WO2015009739A1 (en) | 2015-01-22 |
| TW201522942A (zh) | 2015-06-16 |
| KR20200008043A (ko) | 2020-01-22 |
| KR102202523B1 (ko) | 2021-01-13 |
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Patent event date: 20160216 Patent event code: PA01051R01D Comment text: International Patent Application |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20191015 |
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Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20200114 |
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