KR102060209B1 - 공정 인식 계측 - Google Patents

공정 인식 계측 Download PDF

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Publication number
KR102060209B1
KR102060209B1 KR1020147010969A KR20147010969A KR102060209B1 KR 102060209 B1 KR102060209 B1 KR 102060209B1 KR 1020147010969 A KR1020147010969 A KR 1020147010969A KR 20147010969 A KR20147010969 A KR 20147010969A KR 102060209 B1 KR102060209 B1 KR 102060209B1
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wafer
optical
simulating
computer
properties
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Korean (ko)
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KR20140069255A (ko
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쉐펑 리우
영호 알렉스 추앙
존 필든
빈-밍 벤자민 타사이
징징 장
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18—Manufacturability analysis or optimisation for manufacturability
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/32—Circuit design at the digital level
    • G06F30/333—Design for testability [DFT], e.g. scan chain or built-in self-test [BIST]
    • G—PHYSICS
    • G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16Z—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS, NOT OTHERWISE PROVIDED FOR
    • G16Z99/00—Subject matter not provided for in other main groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020147010969A 2011-09-23 2012-09-20 공정 인식 계측 Active KR102060209B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161538699P 2011-09-23 2011-09-23
US61/538,699 2011-09-23
US13/411,433 2012-03-02
US13/411,433 US8468471B2 (en) 2011-09-23 2012-03-02 Process aware metrology
PCT/US2012/056272 WO2013043831A2 (en) 2011-09-23 2012-09-20 Process aware metrology

Publications (2)

Publication Number Publication Date
KR20140069255A KR20140069255A (ko) 2014-06-09
KR102060209B1 true KR102060209B1 (ko) 2019-12-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147010969A Active KR102060209B1 (ko) 2011-09-23 2012-09-20 공정 인식 계측

Country Status (6)

Country Link
US (2) US8468471B2 (enExample)
EP (1) EP2758990B1 (enExample)
JP (1) JP5959648B2 (enExample)
KR (1) KR102060209B1 (enExample)
IL (1) IL231667B (enExample)
WO (1) WO2013043831A2 (enExample)

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Also Published As

Publication number Publication date
US20130282340A1 (en) 2013-10-24
EP2758990B1 (en) 2019-03-06
EP2758990A4 (en) 2015-10-14
EP2758990A2 (en) 2014-07-30
WO2013043831A2 (en) 2013-03-28
IL231667B (en) 2018-02-28
JP2014526805A (ja) 2014-10-06
JP5959648B2 (ja) 2016-08-02
WO2013043831A3 (en) 2013-05-23
US8468471B2 (en) 2013-06-18
US8832611B2 (en) 2014-09-09
US20130080984A1 (en) 2013-03-28
IL231667A0 (en) 2014-05-28
KR20140069255A (ko) 2014-06-09

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