KR102052280B1 - Plasma reactor for preventing blockage by using ground - Google Patents

Abstract

Disclosed is a plasma reactor having a ground which keeps plasma in the reactor. The plasma reactor comprises a body, at least one electrode assembly formed on the body; and the ground formed at an inlet of the plasma reactor and keeping the plasma in the plasma reactor. The plasma reactor according to the present invention uses a plurality of electrode assemblies, thereby improving life and functions of the plasma reactor.

Description

Plasma reactor to prevent clogging by using grounding {PLASMA REACTOR FOR PREVENTING BLOCKAGE BY USING GROUND}

The present invention relates to a plasma reactor having a plurality of electrode assemblies and using the ground to prevent clogging of the inlet or the pipe.

Conventional plasma reactors use one electrode assembly in a circular roll around a dielectric.

Therefore, when a problem occurs in the electrode assembly, the power supply must be turned off, and as a result, a pollutant introduced from the process chamber flows to the vacuum pump because the plasma reaction cannot be performed.

In addition, there is a problem that the plasma infiltrates into the inlet or pipe of the plasma reactor and the inlet or the pipe is blocked.

KR 10-1882813 B

The present invention provides a plasma reactor having a ground confining a plasma and a plurality of electrode assemblies.

In order to achieve the above object, the plasma reactor according to an embodiment of the present invention includes a body; At least one electrode assembly formed on the body; And a ground formed at an inlet side of the plasma reactor to confine the plasma inside the plasma reactor.

According to another embodiment of the present invention, a plasma reactor includes a body operating to ground; At least one electrode assembly formed on the body; And a blocking unit for blocking an electric field generated when a specific voltage is applied to the electrode of the electrode assembly to the inlet of the plasma reactor or the pipe connected to the inlet of the plasma reactor.

The plasma reactor according to the present invention uses a plurality of electrode assemblies, and as a result, the life and function of the plasma reactor can be improved.

In addition, since the ground is formed at the inlet side of the plasma reactor, the plasma is trapped inside the plasma reactor, as a result it can be prevented that the inlet or the pipe connected to the inlet is blocked.

1 is a view schematically showing a process system according to an embodiment of the present invention.
2 is a cross-sectional view showing a plasma reactor roll according to an embodiment of the present invention.
3 is a diagram illustrating a plasma discharge flow in the plasma reactor of FIG. 2.
4 is a diagram illustrating the flow of contaminants in the plasma reactor of FIG. 2.
5 and 6 are views showing the structure of the ground according to another embodiment of the present invention.
7 is a view showing the flow of the electric field in the plasma reactor according to another embodiment of the present invention.
FIG. 8 is a diagram illustrating the flow of contaminants in the plasma reactor of FIG. 7.
9 is a view showing a plasma reactor according to another embodiment of the present invention.

As used herein, the singular forms "a", "an" and "the" include plural forms unless the context clearly indicates otherwise. In this specification, terms such as “consisting of” or “comprising” should not be construed as necessarily including all of the various components or steps described in the specification, and some of the components or some steps It should be construed that it may not be included or may further include additional components or steps. In addition, the terms "... unit", "module", etc. described in the specification mean a unit for processing at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software. .

The present invention relates to a plasma reactor, and may have a structure for preventing an inlet blockage. For example, a ground may be formed near the inlet of the plasma reactor to trap the plasma inside the plasma reactor.

In addition, the plasma reactor may implement a plurality of electrode assemblies to decompose contaminants.

In a conventional plasma reactor, one electrode assembly is formed over the entire body. Therefore, in this case, when a problem occurs in the electrode assembly, the power supplied to the electrode assembly is cut off, and as a result, the plasma reaction does not occur. As a result, a problem arises that contaminants introduced from the process chamber flow directly into the vacuum pump.

On the other hand, in the plasma reactor of the present invention, since a plurality of electrode assemblies are formed on the body, even if a problem occurs in some electrode assemblies, the plasma reaction is continuously performed by the normal electrode assembly, and as a result, contaminants during the process are transferred to the vacuum pump. There is no flow problem.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view schematically showing a process system according to an embodiment of the present invention.

Referring to FIG. 1, the process system of this embodiment may include a process chamber 102, a plasma reactor 100, and a vacuum pump 104. The process chamber 102 and the plasma reactor 100 may be connected through the first vacuum pipe 110, and the plasma reactor 100 and the vacuum pump 104 may be connected through the second vacuum pipe 112.

However, the plasma reactor 100 is not only disposed between the process chamber 102 and the vacuum pump 104, but may be installed between the vacuum pump 104 and the scrubber or on the top of the scrubber. In addition, a plurality of plasma reactors may be installed at various locations between the process chamber, the vacuum piping, the vacuum pump, and the scrubber. That is, the plasma reactor 100 is not limited in position as long as it decomposes contaminants using the plasma reaction.

Hereinafter, for convenience of description, it will be assumed that the plasma reactor 100 is disposed between the process chamber 102 and the vacuum pump 104.

The process chamber 102 may perform a deposition process, an etching process, or a cleaning process in a vacuum state. However, the gas used in the process chamber 102 varies depending on the process.

As a result, the exhaust gas including the precursor, the process gas, the cleaning gas, or the byproduct is input from the process chamber 102 to the plasma reactor 100 through the first vacuum pipe 110 according to the process. That is, contaminants enter the plasma reactor 100 from the process chamber 102.

Such contaminants may be deposited on the inner surface of the pipe and block the inside of the pipe. In addition, when the contaminants are input to the vacuum pump 104, the temperature conditions and the pressure conditions within the vacuum pump 104 may change rapidly, and as a result, the contaminants cause a phase change and thus the inside of the vacuum pump 104. Can be solidified or liquefied at This may cause failure of the vacuum pump 104. In particular, the release of the pollutants into the atmosphere causes a great problem.

Thus, a plasma reactor 100 for removing such contaminants may be installed between the process chamber 102 and the vacuum pump 104.

The plasma reactor 100 serves to decompose and remove the input contaminants. Specifically, the plasma reactor 100 generates an electric field using an electrode, the contaminant may be decomposed by the plasma reaction by the electric field.

Here, if the electrode is destroyed, the plasma reaction does not occur in the plasma reactor 100. As a result, contaminants input from the process chamber 102 can be input to the vacuum pump 104.

Therefore, the plasma reactor 100 of the present invention uses a plurality of electrodes instead of one electrode. As a result, even if some electrodes are destroyed, the other electrodes operate normally, so that the plasma reactor 100 can continuously decompose and remove contaminants. That is, it is possible to extend the life of the plasma reactor 100 and improve its function.

According to another embodiment, the ground may be additionally installed at the inlet side of the plasma reactor 100. As will be described later, in the absence of such a ground, as the buffer chamber serves as a ground, a low-density plasma state may penetrate to the inlet side, thereby not completely treating contaminants and forming a solid material. The inlet or the pipe connected to the inlet may be blocked. Therefore, it is necessary to trap the plasma inside the plasma reactor 100 so that plasma discharge does not occur at the inlet side of the plasma reactor 100. Grounding plays this role.

In summary, the plasma reactor 100 according to the present embodiment may extend the life by confining the plasma to the inside of the plasma reactor 100 using a ground and implementing a plurality of electrode assemblies.

On the other hand, although it is mentioned to form a ground to trap the plasma in the plasma reactor 100, a plurality of electrode assemblies are formed, the ground may be formed in the plasma reactor in which one electrode assembly is formed.

Hereinafter, various embodiments of the plasma reactor 100 will be described in detail.

2 is a cross-sectional view showing a plasma reactor according to an embodiment of the present invention, Figure 3 is a view showing the plasma discharge flow in the plasma reactor of Figure 2, Figure 4 is a contaminant in the plasma reactor of FIG. A diagram illustrating the flow of. 5 and 6 are views showing the structure of the ground according to another embodiment of the present invention.

2, the plasma reactor according to the present embodiment includes a body 200, a plurality of electrode assemblies 202a, 202b, 202c, and 202d formed on the body 200, an inlet buffer chamber 210, and an outlet buffer chamber ( 212 and ground 220.

According to an embodiment, the body 200 may have a rectangular shape, and electrode assemblies 202 may be formed on the surfaces. In FIG. 2, four electrode assemblies 202a, 202b, 202c, and 202d are formed, but two or more electrode assemblies are sufficient to be spaced apart from each other.

The electrode assembly 202 may include a dielectric 230 formed on the body 200 and an electrode 232 formed on the dielectric 230, for example, a high voltage electrode. For example, a positive voltage may be applied to the electrode 232.

According to an embodiment, since the body 200 functions as a ground, an electric field may be generated between the electrodes 232 and the body 200 as a positive voltage is applied to the electrodes 232 as shown in FIG. 3. Is formed, resulting in a plasma reaction. As a result, contaminants input through the inlet from the process chamber 102 can be decomposed and removed. For example, the gas may be ionized and the ions may react with the byproduct to decompose the byproduct.

At this time, if the ground 220 is not formed in the inlet buffer chamber 210, the electric field may affect the inlet or the inside of the pipe and a plasma reaction may occur in the inlet or the pipe. In this case, since the density of the plasma is low, contaminants may not be completely processed inside the inlet or the pipe, and a solid material may be generated, and the solid material may block the inlet or the pipe. Accordingly, the plasma reactor 100 of the present invention forms a ground 220 inside the inlet buffer chamber 210 to confine the plasma to the interior of the plasma reactor 100 as shown in FIG. 3. As a result, clogging of the inlet or the pipe can be prevented.

That is, as shown in FIG. 4, when the contaminants input from the process chamber 102 flow into the plasma reactor 100, the ground 220 is decomposed while decomposing the contaminants through the plasma reaction inside the plasma reactor 100. It is possible to prevent the blockage of the inlet or the pipe connected to the inlet. In this case, the ground 220 may be supported by the support 222.

On the other hand, although the ground may be formed inside the outlet buffer chamber 212, since the contaminants have been sufficiently decomposed and removed within the plasma reactor 100, the outlet may not be blocked even without ground. Therefore, it is not essential that ground is formed in the outlet buffer chamber 212.

In addition, although one ground 220 extends in the width direction of the inlet buffer chamber 210 in FIGS. 2 to 4, a plurality of grounds 220a, 220b, and 220c are mutually connected as shown in FIG. 5. It may be formed inside the inlet buffer chamber 210 in a separated state, and as shown in FIG. 6, the ground 220e or not only in the vertical direction as well as the ground 220d installed in the width direction in the inlet buffer chamber 210. 220f) may be further formed. In this case, the ground 220d and the ground 220e or 220f are separated from each other.

According to an embodiment, a plurality of electrode assemblies 202 separated from each other may be formed on the body 200.

According to one embodiment, two or more electrode assemblies 202, for example four electrode assemblies 202a, 202b, 202c and 202d, may be formed spaced apart from each other on the body 200.

For example, as shown in FIG. 3, the body 200 may have a rectangular shape, and electrode assemblies 202a, 202b, 202c, or 202d may be formed on the surfaces, respectively. Specifically, the first electrode assembly 202a, the second electrode assembly 202b, the third electrode assembly 202c, and the fourth electrode assembly 202d may be arranged at predetermined intervals.

If only one electrode is formed throughout the body 200, contaminants may flow through the body 200 to the vacuum pump 104 when the electrode does not operate normally due to breakage of the dielectric or the electrode. Therefore, the operation of the plasma reactor must be stopped immediately, i.e., the power applied to the electrode must be cut off immediately.

On the other hand, when the plurality of electrode assemblies 202 are formed in the body 200, even if some electrode assemblies 202 do not operate normally, the other electrode assembly 202 operates normally so that contaminants may be continuously removed. have. That is, the lifetime of the plasma reactor 100 can be extended.

According to an embodiment, power may be applied to the electrode assemblies 202, respectively. In this case, the power sources may be sub-power sources separated from one power source.

When some of the electrode assemblies 202 do not operate normally, a stronger power may be applied to the normally operating electrode assembly to increase the plasma density. At this time, the power supply may be cut off to the electrode of the electrode assembly that does not operate normally. As a result, the contaminant removal efficiency may be similar to when all electrode assemblies operate normally even though some electrode assemblies do not operate normally.

In summary, a plurality of electrode assemblies 202 may be formed on the body 200, and the ground 220 may be arranged in the buffer chamber 210.

Meanwhile, although the ground 220 performs the function of confining the plasma, there is no limitation as long as the plasma is confined within the plasma reactor 100. Members that perform this function may be referred to collectively as blocking portions.

7 is a view showing the flow of the electric field in the plasma reactor according to another embodiment of the present invention, Figure 8 is a view showing the flow of contaminants in the plasma reactor of FIG.

7 and 8, the plasma reactor 100 of this embodiment includes a body 700, a plurality of electrode assemblies 702a, 702b, 702c and 702d, an inlet 710, an outlet 712, It may include a buffer chamber 720 and a second ground 722. In addition, the plasma reactor 100 may further include a first ground 704 formed through the body 700.

Body 700 is a housing, the contaminant flows through the interior. According to one embodiment, the body 700 may operate as ground.

The electrode assembly 702 is formed on a portion of the body 700 and may include a dielectric 730 formed on the body 700 and an electrode 732 formed on the dielectric 730. In this case, a positive voltage may be applied to the electrode 732. As a result, as shown in FIG. 7, an electric field is formed between the electrode 732 and the body 700 operating as the ground, and the electric field may cause a plasma reaction to decompose and remove contaminants.

In detail, contaminants input through the buffer chamber 720 and the inlet 710 flow through the space between the body 700 and the first ground 704 as shown in FIG. The contaminants may be decomposed and removed by a plasma reaction while flowing inside the body 200.

According to one embodiment, two or more electrode assemblies 702, for example four electrode assemblies 702a, 702b, 702c and 702d, may be formed spaced apart from each other over the body 700.

For example, as shown in FIG. 7, the body 700 may have a hexagonal shape, and electrode assemblies 702a, 702b, 702c or 702d may be formed on four of the six surfaces. Specifically, the first electrode assembly 702a and the second electrode assembly 702b are respectively formed on two surfaces on the right side of the surfaces of the body 700 in a state of being spaced apart by a predetermined interval, and the third electrode assembly 702c. And the fourth electrode assembly 702d may be formed on two surfaces on the left side of the surfaces of the body 700 with the fourth electrode assembly 702d spaced apart from each other by a predetermined interval.

According to an embodiment, power may be applied to the electrode assemblies 702, respectively. In this case, the power sources may be sub-power sources separated from one power source.

When some of the electrode assemblies 702 do not operate normally, a stronger power may be applied to the normally operating electrode assembly to increase the plasma density. At this time, the power supply may be cut off to the electrode of the electrode assembly that does not operate normally. As a result, the contaminant removal efficiency may be similar to when all electrode assemblies operate normally even though some electrode assemblies do not operate normally.

According to one embodiment, a first ground 704 may be formed through a central portion of the body 700, such that at least a portion of the first ground 704 is arranged inside the body 700. . The ground 704 may serve to stabilize the plasma reaction by minimizing interference between electrodes. That is, the first ground 704 may minimize the interference between the electric field by the electrode to stabilize the plasma reaction.

However, since the body 700 operates as the ground, the first ground 704 may be omitted. Alternatively, when the first ground 704 is present, the body 700 may not operate as the ground. However, in consideration of pollutant decomposition efficiency and the like, it is advantageous that the body 700 operates as the ground and the first ground 704 is formed inside the body 700, rather than only one ground.

According to one embodiment, the first ground 704 may be formed in a cylindrical rolled shape, and as a result, may face the electrode assemblies 702a, 702b, 702c and 702d, respectively.

The buffer chamber 720 may be formed on the inlet 710, and a second ground 702 may be formed therein. The second ground 720 confines the plasma into the plasma reactor 100.

In summary, a plurality of electrode assemblies 700 are spaced apart from each other on the surface of the body 700, a first ground 704 is formed inside the body 700, and the buffer chamber 720 is disposed inside the body 700. A second ground 722 can be formed.

9 is a view showing a plasma reactor according to another embodiment of the present invention.

Referring to FIG. 9, the plasma reactor according to the present embodiment includes a body 900, electrodes 902a and 902b, one inlet 910, a plurality of outlets 912, 914 and 916, and a buffer chamber 920. And ground 922. At this time, the vacuum pumps may be connected to the outlets 912, 914, and 916, respectively.

In FIG. 7, one outlet 712 and one vacuum pump 104 may be present and thus the capacity of the vacuum pump 104 may be insufficient, whereas the plasma reactor of the present embodiment uses a plurality of vacuum pumps, thereby providing sufficient capacity. Can be secured.

However, even though it includes a plurality of outlets 912, 914, and 916, a plurality of electrode assemblies 902a and 902b are formed on the body 900, and the plasma is injected into the buffer chamber 920. The ground 922 may be formed to be confined to the inside of the shell. Compared with FIG. 7, outlets 914 and 916 are formed instead of electrode assemblies 702b and 702c.

On the other hand, the components of the above-described embodiment can be easily identified from a process point of view. That is, each component can be identified as a respective process. In addition, the process of the above-described embodiment can be easily understood in terms of the components of the apparatus.

The embodiments of the present invention described above are disclosed for purposes of illustration, and those skilled in the art having ordinary knowledge of the present invention may make various modifications, changes, and additions within the spirit and scope of the present invention. Should be considered to be within the scope of the following claims.

100: plasma reactor 102: process chamber
104: vacuum pump 200: body
202: electrode assembly 210: inlet buffer chamber
212: outlet buffer chamber 220: ground

Claims (9)

In a plasma reactor,
body;
At least one electrode assembly formed on the body; And
A ground formed at an inlet side of the plasma reactor to confine the plasma inside the plasma reactor,
The ground is formed inside the body at the inlet side, and as the electric field generated by the electrode assembly is blocked from traveling to the inlet by the ground, the plasma does not proceed to the inlet so that the plasma at the inlet is Plasma reactor, characterized in that to prevent the discharge. The method of claim 1,
Further comprising a buffer chamber formed between the body and the vacuum pipe,
And wherein the ground is formed inside the buffer chamber. The plasma reactor of claim 1, wherein the ground comprises a plurality of sub-grounds separated from each other. The method of claim 1, wherein a plurality of electrode assemblies spaced from each other are formed on the body serving as a ground.
The electrode assemblies have a dielectric formed on the body and an electrode formed on the dielectric, and when a power is applied to the electrodes of the electrode assemblies, a plasma reaction occurs to decompose pollutants flowing through the body. Plasma reactor. The method of claim 4, wherein the ground is further formed inside the body, the electrodes of the electrode assemblies and the ground of the inner facing each other, an electric field is formed between the electrodes and the ground of the inner contaminated material Plasma reactor, characterized in that to remove. The plasma reactor of claim 4, wherein a higher power is applied to an electrode assembly that is normally operated when some electrode assemblies are not normally operated. The plasma reactor of claim 4, wherein a plurality of outlets are formed in the body, and the outlets are connected to vacuum pumps, respectively. In a plasma reactor,
A body operating to ground;
At least one electrode assembly formed on the body; And
It includes a blocking unit for blocking the electric field generated when a specific voltage is applied to the electrode of the electrode assembly to the inlet of the plasma reactor or the pipe connected to the inlet of the plasma reactor,
The blocking portion is formed inside the body at the inlet side, and the plasma proceeds to the inlet and the pipe as the electric field generated by the electrode assembly is blocked by the blocking unit to the inlet and the pipe. Plasma reactor, characterized in that for preventing the plasma discharge in the inlet and the pipe. The plasma reactor of claim 8, wherein the blocking part is ground, and a plurality of electrode assemblies are arranged spaced apart from each other on the body.

Images