WO2020091325A1

WO2020091325A1 - Plasma reactor capable of preventing clogging by using ground and performing plurality of plasma reaction processes

Info

Publication number: WO2020091325A1
Application number: PCT/KR2019/014226
Authority: WO
Inventors: 고경오; 서광하; 김대승
Original assignee: (주)이큐글로벌
Priority date: 2018-10-29
Filing date: 2019-10-28
Publication date: 2020-05-07

Abstract

Disclosed is a plasma reactor capable of preventing clogging by using ground and performing a plurality of plasma reaction processes. The plasma reactor includes a body, at least one electrode assembly formed on the body, and the ground formed at an inlet side of the plasma reactor to confine plasma within the plasma reactor.

Description

Plasma reactor that prevents clogging by using ground and can process multiple plasma reactions

The present invention relates to a plasma reactor having a plurality of electrode assemblies and using a ground to prevent clogging of the inlet or piping.

The present invention relates to a plasma reactor capable of processing a plurality of plasma reactions.

Conventional plasma reactors use a single electrode assembly in a circular form around the dielectric.

Therefore, when a problem occurred in the electrode assembly, the power had to be turned off, and as a result, there was a problem in that the plasma reaction could not be performed and contaminants introduced from the process chamber flowed to the vacuum pump.

In addition, there is a problem in that plasma penetrates into the inlet or piping of the plasma reactor and the inlet or the piping is blocked.

In addition, there is a problem in that by-products are accumulated and blocked at the inlet or outlet of the plasma reactor.

The present invention provides a plasma reactor having a ground and a plurality of electrode assemblies that confine the plasma.

In addition, the present invention is to provide a plasma reactor capable of reliably decomposing and removing contaminants through a plurality of plasma treatments and also removing contaminants accumulated at inlets and outlets.

In order to achieve the above object, a plasma reactor according to an embodiment of the present invention comprises a body; At least one electrode assembly formed on the body; And a ground formed on an inlet side of the plasma reactor to trap plasma inside the plasma reactor.

The plasma reactor according to another embodiment of the present invention includes an inlet plasma reaction unit having a first electrode assembly and a first internal ground, and a main plasma reaction unit connected to the inlet plasma reaction unit and having at least one second electrode assembly do. Here, each of the electrode assemblies has a dielectric and an electrode, and the inlet plasma reaction unit causes a primary plasma reaction to primarily decompose pollutants, and the main plasma reaction unit causes a second plasma reaction to secondaryly decompose pollutants. .

A plasma reactor according to another embodiment of the present invention includes an inlet plasma reaction unit having a first electrode assembly and a first internal ground; And a main plasma reaction unit connected to the inlet plasma reaction unit and having at least one second electrode assembly. Here, both the inlet plasma reaction unit and the main plasma reaction unit generate a plasma reaction during a process time, and during the idle time, the inlet plasma reaction unit causes a plasma reaction and the main plasma reaction unit does not cause a plasma reaction.

The plasma reactor according to the present invention uses a plurality of electrode assemblies, and as a result, the life and function of the plasma reactor can be improved.

In addition, since the ground is formed on the inlet side of the plasma reactor, the plasma is confined inside the plasma reactor, and as a result, the phenomenon that the inlet or the piping connected to the inlet can be prevented from clogging.

In addition, the plasma reactor performs three plasma treatments, and as a result, contaminants are completely removed and contaminants accumulated at the inlet or outlet can be prevented from clogging the inlet and outlet.

1 is a view schematically showing a process system according to an embodiment of the present invention.

2 is a cross-sectional view showing a plasma reactor roll according to an embodiment of the present invention.

3 is a view showing a plasma discharge flow in the plasma reactor of FIG. 2.

FIG. 4 is a view showing the flow of pollutants in the plasma reactor of FIG. 2.

5 and 6 are views showing the structure of the ground according to another embodiment of the present invention.

7 is a view showing the flow of an electric field in a plasma reactor according to another embodiment of the present invention.

FIG. 8 is a view showing the flow of pollutants in the plasma reactor of FIG. 7.

9 is a view showing a plasma reactor according to another embodiment of the present invention.

10 is a view showing a plasma reactor according to an embodiment of the present invention.

11 is a diagram illustrating a plasma reactor cut along the z1-z1 line and the x1-x1 line.

12 and 13 are diagrams showing a plasma discharge flow and a pollutant flow.

The singular expression used in this specification includes the plural expression unless the context clearly indicates otherwise. In this specification, the terms "consisting of" or "comprising" should not be construed as including all of the various components, or various steps described in the specification, among which some components or some steps It may not be included, or it should be construed to further include additional components or steps. In addition, terms such as “... unit” and “module” described in the specification mean a unit that processes at least one function or operation, which may be implemented in hardware or software, or a combination of hardware and software. .

The present invention relates to a plasma reactor, and may have a structure to prevent clogging of the inlet. For example, a ground may be formed to confine plasma inside the plasma reactor near the inlet of the plasma reactor.

In addition, the plasma reactor can decompose contaminants by implementing a plurality of electrode assemblies.

In the conventional plasma reactor, one electrode assembly is formed over the entire body. Therefore, when a problem occurs in the electrode assembly, power supplied to the electrode assembly is cut off, and as a result, plasma reaction does not occur. As a result, a problem arises in that contaminants introduced from the process chamber flow directly into the vacuum pump.

On the other hand, in the plasma reactor of the present invention, since a plurality of electrode assemblies are formed on the body, even if a problem occurs in some electrode assemblies, the plasma reaction is continuously caused by the normal electrode assembly. There is no flow problem.

In addition, the plasma reactor of the present invention completely removes contaminants through a plurality of plasma reactions, and in particular, it is possible to prevent clogging of inlets or outlets by removing accumulated contaminants.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, the process system of the present embodiment may include a process chamber 102, a plasma reactor 100 and a vacuum pump 104. The process chamber 102 and the plasma reactor 100 may be connected through the first vacuum pipe 110, and the plasma reactor 100 and the vacuum pump 104 may be connected through the second vacuum pipe 112.

However, the plasma reactor 100 is not only disposed between the process chamber 102 and the vacuum pump 104, and may be installed between the vacuum pump 104 and the scrubber or on the top of the scrubber. In addition, a plurality of plasma reactors can be installed in various locations between the process chamber, vacuum piping, vacuum pump, scrubber. That is, the plasma reactor 100 is not limited in position as long as it decomposes contaminants using a plasma reaction.

Hereinafter, for convenience of description, it is assumed that the plasma reactor 100 is disposed between the process chamber 102 and the vacuum pump 104.

The process chamber 102 may perform a deposition process, an etching process, or a cleaning process in a vacuum state. However, the gas used in the process chamber 102 varies depending on the process.

As a result, depending on the process, the exhaust gas including the precursor, process gas, cleaning gas, or by-products from the process chamber 102 is input to the plasma reactor 100 through the first vacuum pipe 110. That is, contaminants are input from the process chamber 102 to the plasma reactor 100.

These contaminants can be deposited on the inner surface of the pipe to block the inside of the pipe. In addition, when the contaminants are input to the vacuum pump 104, the temperature and pressure conditions inside the vacuum pump 104 may rapidly change, and as a result, the contaminants cause a phase change to cause the inside of the vacuum pump 104 to change. Can be solidified or liquefied. This can cause the vacuum pump 104 to fail. In particular, when the pollutants are discharged into the atmosphere, they cause great problems.

Accordingly, a plasma reactor 100 for removing such contaminants may be installed between the process chamber 102 and the vacuum pump 104.

The plasma reactor 100 decomposes and removes the input contaminants. Specifically, the plasma reactor 100 generates an electric field using an electrode, and the pollutant may be decomposed by plasma reaction by the electric field.

Here, when the electrode is destroyed, plasma reaction does not occur in the plasma reactor 100. As a result, contaminants input from the process chamber 102 can be input to the vacuum pump 104.

Therefore, the plasma reactor 100 of the present invention uses a plurality of electrodes rather than one electrode. As a result, even if some of the electrodes are destroyed, the other electrode is operating normally, so the plasma reactor 100 can continuously decompose and remove contaminants. That is, the life of the plasma reactor 100 can be extended and functions can be improved.

According to another embodiment, the ground may be additionally installed on the inlet side of the plasma reactor 100. As will be described later, if there is no such ground, as the buffer chamber serves as a ground, a low-density plasma state may penetrate to the inlet side and cannot completely treat contaminants, thereby forming a solid material. The inlet or a pipe connected to the inlet may be blocked. Therefore, it is necessary to confine plasma into the interior of the plasma reactor 100 so that plasma discharge does not occur at the inlet side of the plasma reactor 100. Grounding performs this role.

In summary, the plasma reactor 100 of the present embodiment can extend the life of a plasma by using a ground to trap the plasma inside the plasma reactor 100 and implementing a plurality of electrode assemblies.

On the other hand, although it was mentioned that a ground for trapping plasma is formed in the plasma reactor 100 in which a plurality of electrode assemblies are formed, the ground may be formed in the plasma reactor in which one electrode assembly is formed.

Hereinafter, various embodiments of the plasma reactor 100 will be described in detail.

2 is a sectional view showing a plasma reactor roll according to an embodiment of the present invention, FIG. 3 is a diagram showing a plasma discharge flow in the plasma reactor of FIG. 2, and FIG. 4 is a contaminant in the plasma reactor of FIG. It is a diagram showing the flow of. 5 and 6 are views showing the structure of the ground according to another embodiment of the present invention.

Referring to FIG. 2, the plasma reactor of the present embodiment includes a body 200, a plurality of

electrode assemblies

202a, 202b, 202c and 202d formed on the body 200, an inlet buffer chamber 210, and an outlet buffer chamber ( 212) and ground (220).

According to an embodiment, the body 200 may have a rectangular shape, and electrode assemblies 202 may be formed on the surfaces. In FIG. 2, four

electrode assemblies

202a, 202b, 202c, and 202d are formed, but it is sufficient if two or more electrode assemblies are formed spaced apart from each other.

The electrode assembly 202 may include a dielectric 230 formed on the body 200 and an electrode 232 formed on the dielectric 230, for example, a high voltage electrode. For example, a positive voltage may be applied to the electrode 232.

According to an embodiment, since the body 200 functions as a ground, an electric field is generated between the electrodes 232 and the body 200 as a positive voltage is applied to the electrodes 232 as illustrated in FIG. 3. Is formed, resulting in a plasma reaction. As a result, contaminants input through the inlet from the process chamber 102 can be decomposed and removed. For example, gas may be ionized, and ions may react with by-products to decompose the by-products.

At this time, if the ground 220 is not formed inside the inlet buffer chamber 210, an electric field affects the inlet or the inside of the pipe, so that a plasma reaction may occur inside the inlet or inside the pipe. In this case, since the density of the plasma is low, contaminants cannot be completely processed inside the inlet or the pipe, so that a solid substance may be generated, and such a solid substance may block the inlet or the pipe. Accordingly, the plasma reactor 100 of the present invention forms a ground 220 inside the inlet buffer chamber 210 to trap the plasma inside the plasma reactor 100 as shown in FIG. 3. As a result, clogging of the inlet or the piping can be prevented.

That is, as shown in FIG. 4, when the pollutant input from the process chamber 102 flows to the plasma reactor 100, the plasma 220 is decomposed through the plasma reaction inside the plasma reactor 100 while the ground 220 is disassembled. It is possible to prevent clogging of an inlet or a pipe connected to the inlet. At this time, the ground 220 may be supported by the support 222.

On the other hand, although the ground may be formed inside the outlet buffer chamber 212, since the pollutants are sufficiently decomposed and removed inside the plasma reactor 100, even if there is no ground, the outlet may not be blocked. Therefore, it is not essential that ground is formed in the outlet buffer chamber 212.

In addition, although in FIG. 2 to FIG. 4, one ground 220 is formed to extend in the width direction of the inlet buffer chamber 210, but the plurality of

grounds

220a, 220b, and 220c are mutually as shown in FIG. It may be formed inside the inlet buffer chamber 210 in a separated state, and as shown in FIG. 6, the inlet buffer chamber 210 may be provided in the width direction in the vertical direction as well as the ground 220d installed in the

width direction

220e or 220f) may be further formed. In this case, the ground 220d and the

ground

220e or 220f are separated from each other.

According to an embodiment, a plurality of electrode assemblies 202 separated from each other may be formed on the body 200.

According to an embodiment, two or more electrode assemblies 202, for example, four

electrode assemblies

202a, 202b, 202c, and 202d may be formed spaced apart from each other on the body 200.

For example, as illustrated in FIG. 2, the body 200 may have a rectangular shape, and

electrode assemblies

202a, 202b, 202c, or 202d may be formed on the surfaces, respectively. Specifically, the first electrode assembly 202a, the second electrode assembly 202b, the third electrode assembly 202c, and the fourth electrode assembly 202d may be arranged with a predetermined distance therebetween.

If only one electrode is formed over the entire body 200, contaminants may flow through the body 200 to the vacuum pump 104 when the electrode does not normally operate due to dielectric or electrode damage. Therefore, the operation of the plasma reactor must be stopped immediately, that is, the power applied to the electrode must be cut off immediately.

On the other hand, if a plurality of electrode assemblies 202 are formed on the body 200, even if some electrode assemblies 202 do not operate normally, other electrode assemblies 202 operate normally, and contaminants can be continuously removed. have. That is, the life of the plasma reactor 100 can be extended.

According to an embodiment, power may be applied to the electrode assemblies 202 respectively. At this time, the power sources may be sub-power sources separated from one power source.

If some of the electrode assemblies 202 do not operate normally, a stronger power is applied to the electrode assembly operating normally, thereby increasing plasma density. At this time, power may be cut off to the electrodes of the electrode assembly that do not operate normally. As a result, even if some electrode assemblies do not operate normally, the efficiency of removing contaminants may be similar to when all electrode assemblies operate normally.

In summary, a plurality of electrode assemblies 202 may be formed on the body 200 and the ground 220 may be arranged inside the buffer chamber 210.

On the other hand, although the function of confining the plasma was performed by the ground 220, there is no limitation as long as the plasma is confined into the plasma reactor 100. The member performing this function may be referred to as a blocking part.

7 is a view showing the flow of an electric field in a plasma reactor according to another embodiment of the present invention, and FIG. 8 is a view showing the flow of pollutants in the plasma reactor of FIG. 7.

7 and 8, the plasma reactor 100 of the present embodiment includes a body 700, a plurality of

electrode assemblies

702a, 702b, 702c and 702d, an inlet portion 710, and an outlet portion 712, A buffer chamber 720 and a second ground 722 may be included. In addition, the plasma reactor 100 may further include a first ground 704 formed through the body 700.

The body 700 is a housing, through which contaminants flow. According to one embodiment, the body 700 may operate as a ground.

The electrode assembly 702 is formed on a portion of the body 700 and may include a dielectric 730 formed on the body 700 and an electrode 732 formed on the dielectric 730. Here, a positive voltage may be applied to the electrode 732. As a result, an electric field is formed between the electrode 732 and the body 700 operating as a ground as illustrated in FIG. 7, and a plasma reaction occurs by the electric field, whereby contaminants can be decomposed and removed.

Specifically, contaminants input through the buffer chamber 720 and the inlet 710 flow through the space between the body 700 and the first ground 704 as shown in FIG. 8, and thus contaminants The contaminants may be decomposed and removed by plasma reaction while flowing inside the body 200.

According to an embodiment, two or more electrode assemblies 702, for example, four

electrode assemblies

702a, 702b, 702c and 702d may be formed to be spaced apart from each other on the body 700.

For example, as illustrated in FIG. 7, the body 700 may have a hexagonal shape, and

electrode assemblies

702a, 702b, 702c, or 702d may be formed on four of the six surfaces, respectively. Specifically, the first electrode assembly 702a and the second electrode assembly 702b are respectively formed on two of the right sides of the faces of the body 700 in a state spaced apart from each other by the third electrode assembly 702c. And the fourth electrode assembly 702d may be respectively formed on two left surfaces of the surfaces of the body 700 in a state spaced apart from each other.

According to an embodiment, power may be applied to the electrode assemblies 702 respectively. At this time, the power sources may be sub-power sources separated from one power source.

When some of the electrode assemblies 702 do not operate normally, a stronger power is applied to the electrode assembly operating normally, thereby increasing the plasma density. At this time, power may be cut off to the electrodes of the electrode assembly that do not operate normally. As a result, even if some electrode assemblies do not operate normally, the efficiency of removing contaminants may be similar to when all electrode assemblies operate normally.

According to an embodiment, the first ground 704 may be formed through the central portion of the body 700, and as a result, at least a portion of the first ground 704 may be arranged inside the body 700. . The ground 704 may serve to stabilize the plasma reaction by minimizing interference between electrodes. That is, due to the first ground 704, the interference between the electric fields by the electrode is minimized, so that the plasma reaction can be stabilized.

However, since the body 700 operates as a ground, the first ground 704 may be omitted. Alternatively, when the first ground 704 is present, the body 700 does not need to operate as a ground. However, considering the efficiency of decomposing pollutants, it is advantageous that the body 700 operates as the ground and the first ground 704 is formed inside the body 700 rather than only one ground.

According to one embodiment, the first ground 704 may be formed in a cylindrical rolled shape, and as a result, may face the

electrode assemblies

702a, 702b, 702c, and 702d, respectively.

The buffer chamber 720 is formed on the inlet 710, and a second ground 722 may be formed therein. The second ground 722 serves to confine the plasma into the plasma reactor 100.

In summary, a plurality of electrode assemblies 702 spaced apart from each other on the surface of the body 700 is formed, a first ground 704 is formed inside the body 700, and inside the buffer chamber 720. A second ground 722 may be formed.

Referring to FIG. 9, the plasma reactor of the present embodiment includes a body 900,

electrodes

902a and 902b, one inlet 910, a plurality of

outlets

912, 914 and 916, and a buffer chamber 920. And ground 922. At this time, vacuum pumps may be connected to the

outlets

912, 914, and 916, respectively.

In FIG. 7, one outlet 712 and one vacuum pump 104 may exist, so that the capacity of the vacuum pump 104 may be insufficient, whereas the plasma reactor of this embodiment uses a plurality of vacuum pumps, thereby providing sufficient capacity. Can be secured.

However, even if a plurality of

outlets

912, 914, and 916 are included, a plurality of

electrode assemblies

902a and 902b are formed on the body 900 and plasma is generated inside the buffer chamber 920. ), The ground 922 to be confined to the inside may be formed. Compared to FIG. 7,

outlet portions

914 and 916 are formed instead of

electrode assemblies

702b and 702c.

FIG. 10 is a view showing a plasma reactor according to an embodiment of the present invention, FIG. 11 is a view showing a plasma reactor cut along the z1-z1 line and the x1-x1 line, and FIGS. 12 and 13 are plasma These are diagrams showing discharge flow and pollutant flow.

10 to 13, the plasma reactor 100 of this embodiment may include an inlet plasma reaction unit, a main plasma reaction unit, and an outlet plasma reaction unit.

The inlet plasma reaction part corresponds to the inlet part of the plasma reactor 100 to which contaminants are input from the process chamber 102, and the inlet body 1102 and at least one electrode assembly 1106 formed on the inlet body 1102 It includes.

The electrode assembly 1106 may include a dielectric 1120 formed on the inlet body 1102 and an electrode 1122 formed on the dielectric 1120. Here, a positive voltage may be applied to the electrode 1122.

According to an embodiment, the inlet inner ground 1112 may be formed in the inner space of the inlet body 1102. The inlet inner ground 1112 is supported by a support 1116. Meanwhile, the inlet inner ground 1112 may be formed of a plurality of sub-inlet inner grounds spaced from each other.

In addition, the electrode assembly 1106 and the inlet inner ground 1112 are arranged oppositely as illustrated in FIG. 3, by adjusting the distance between the electrode assembly 1106 and the inlet inner ground 1112 to set the opposite discharge and creepage Discharge may occur. At this time, ions generated by the plasma discharge may mainly be concentrated in the electrode assembly 1106 and the inlet inner ground 1112 near (A).

That is, some of the contaminants are decomposed inside the inlet body 1102, that is, pre-treated, and then contaminants are input to the main plasma reaction unit.

Also, the plasma reactor 100 may decompose and remove contaminants accumulated in the inlet of the inlet plasma reaction unit, the piping connected to the inlet, or the floor.

On the other hand, the inlet ground (1112) can prevent clogging of the inlet or pipe. Specifically, when the inlet inner ground 1112 does not exist, an electric field generated in the main plasma reaction unit affects the inlet or the inside of the pipe, so that a plasma reaction may occur within the inlet or inside the pipe. In this case, since the density of the plasma is low, contaminants cannot be completely processed inside the inlet or the pipe, so that a solid substance may be generated, and such a solid substance may block the inlet or the pipe. Accordingly, the plasma reactor 100 of the present invention forms an inlet inner ground 1112 inside the inlet plasma reaction unit to trap plasma inside the main plasma reaction unit as shown in FIGS. 12 and 13. As a result, it is possible to prevent the phenomenon that the inlet or the piping is blocked.

In order to prevent such a clogging phenomenon, the inlet inner ground 1112 has a bent portion, but the bent portion is bent in the inlet direction. This is to prevent the electric field from proceeding to the entrance.

The main plasma reaction unit is connected to the inlet plasma reaction unit, and may include a main body 1100 operating as a ground and at least one electrode assembly, for example, two

electrode assemblies

1108a and 1108b.

When a positive voltage is applied to the electrode of the electrode assembly 1108, an electric field is formed between the electrode and the main body 1100 and the inlet internal ground 1112 as shown in FIGS. Secondary disassembly and removal. That is, creeping discharge occurs. At this time, the electric field is trapped inside the main plasma reaction unit without proceeding to the inlet and outlet by the inlet inner ground 1112 and the outlet inner ground 1114.

The outlet plasma reaction unit is connected to the main plasma reaction unit, and thirdly decomposes and removes contaminants input from the main plasma reaction unit.

The outlet plasma reaction unit includes an outlet body 1104 and at least one electrode assembly 1110.

According to one embodiment, an outlet inner ground 1114 is formed inside the outlet plasma reaction unit, and the outlet inner ground 1114 may be supported by the support 1118.

Here, the electrode assembly 1110 and the outlet inner ground 1114 may be arranged to face each other, but by setting a distance between the electrode assembly 1110 and the outlet inner ground 1114, counter discharge and creepage discharge may be generated. have. At this time, the plasma discharge may be concentrated near the electrode assembly 1110 and the outlet inner ground 1114 (B).

In order to prevent clogging of the outlet, the outlet inner ground 1114 has a bent portion, but the bent portion is bent in the outlet direction. This is to prevent the electric field from proceeding to the outlet.

Meanwhile, the ground 1114 inside the outlet may not exist. This is because there are not many contaminants in the outlet plasma reaction part, so there are almost no contaminants accumulated and almost no clogging of the pipe occurs.

In summary, the plasma reactor 100 of the present invention can completely remove contaminants input from the process chamber 102 using the inlet plasma reaction unit, the main plasma reaction unit, and the outlet plasma reaction unit. At this time, an opposite discharge may occur in the inlet plasma reaction unit and the outlet plasma reaction unit, and creeping discharge may occur in the main plasma reaction unit.

Looking at the driving operation of the plasma reactor 100, during the process time for removing contaminants input from the process chamber 102, plasma discharge may occur in the inlet plasma reaction unit, the main plasma reaction unit, and the outlet plasma reaction unit. Can be.

On the other hand, during the idle time, in order to reduce power consumption, the main plasma reaction unit is not driven, and only the inlet plasma reaction unit and the outlet plasma reaction unit where contaminants are mainly accumulated may be driven. Of course, since the contaminants hardly accumulate in the outlet plasma reaction unit, only the inlet plasma reaction unit may be driven.

Meanwhile, although not mentioned above, at least one of the inlet plasma reaction unit, the main plasma reaction unit, and the outlet plasma reaction unit may include a plurality of electrode assemblies.

If only one electrode is formed over the entire body, contaminants may flow through the body to the vacuum pump 104 when the electrode does not operate normally due to dielectric or electrode damage. Therefore, the operation of the plasma reactor must be stopped immediately, that is, the power applied to the electrode must be cut off immediately.

On the other hand, if a plurality of electrode assemblies are formed on the body, even if some electrode assemblies do not operate normally, other electrode assemblies operate normally, so that contaminants can be continuously removed. That is, the life of the plasma reactor 100 can be extended.

According to an embodiment, power may be applied to the electrode assemblies, respectively. At this time, the power sources may be sub-power sources separated from one power source.

When some of the electrode assemblies do not operate normally, a stronger power is applied to the electrode assembly operating normally, thereby increasing plasma density. At this time, power may be cut off to the electrodes of the electrode assembly that do not operate normally. As a result, even if some electrode assemblies do not operate normally, the efficiency of removing contaminants may be similar to when all electrode assemblies operate normally.

On the other hand, the components of the above-described embodiments can be easily grasped from a process point of view. That is, each component can be identified by each process. Also, the process of the above-described embodiment can be easily grasped from the perspective of the components of the device.

The scope of the present invention is indicated by the following claims, and all modifications or variations derived from the meaning and scope of the claims and their equivalent concepts should be interpreted to be included in the scope of the present invention.

Claims

In the plasma reactor,

body;

At least one electrode assembly formed on the body; And

It is formed on the inlet side of the plasma reactor, characterized in that it comprises a ground to trap the plasma inside the plasma reactor.
According to claim 1,

Further comprising a buffer chamber formed between the body and the vacuum pipe,

The ground is a plasma reactor, characterized in that formed in the buffer chamber.
The plasma reactor of claim 1, wherein the ground is composed of a plurality of sub-grounds separated from each other.
According to claim 1, A plurality of electrode assemblies spaced apart from each other are formed on the body functioning as a ground,

The electrode assemblies have a dielectric formed on the body and an electrode formed on the dielectric, and a plasma reaction occurs as power is applied to the electrodes of the electrode assemblies, and contaminants flowing through the body are decomposed. Plasma reactor.
The contaminant of claim 4, wherein a ground is additionally formed on the inside of the body, and the electrodes of the electrode assemblies and the inner ground are facing each other, and an electric field is formed between the electrodes and the inner ground. Plasma reactor, characterized in that to remove.
The plasma reactor of claim 4, wherein when some electrode assemblies do not normally operate, a higher power is applied to the electrode assemblies operating normally.
The plasma reactor of claim 4, wherein a plurality of outlet portions are formed in the body, and the outlet portions are respectively connected to vacuum pumps.
An inlet plasma reaction unit having a first electrode assembly and a first internal ground; And

It is connected to the inlet plasma reaction unit, and includes a main plasma reaction unit having at least one second electrode assembly,

Each of the electrode assemblies has a dielectric and an electrode, and the inlet plasma reaction unit causes a primary plasma reaction to firstly decompose pollutants, and the main plasma reaction unit causes a second plasma reaction to secondarily decompose pollutants. Plasma reactor.
9. The plasma reactor of claim 8, wherein counter discharge and creepage discharge can be generated by adjusting and setting the distance between the electrode size inside the first electrode assembly and the first internal ground.
The method of claim 9,

A plasma reactor, characterized in that a portion of the first internal ground is bent in the inlet direction of the plasma reactor.
The method of claim 8,

It is connected to the main plasma reaction unit, further comprising an outlet plasma reaction unit having a third electrode assembly and a second internal ground,

Plasma reactor, characterized in that it is possible to generate a counter discharge and creep discharge by adjusting the distance between the electrode size inside the third electrode assembly and the second internal ground.
The method of claim 11,

A plasma reactor, characterized in that a portion of the second internal ground is bent in the exit direction of the plasma reactor.
12. The method of claim 11, wherein during the process time, the inlet plasma reaction unit, the main plasma reaction unit and the outlet plasma reaction unit all generate plasma discharge, and during the idle time, at least one of the inlet plasma reaction unit and the outlet plasma reaction unit Plasma reactor, characterized in that the plasma discharge and the main plasma reaction does not cause a plasma discharge.
The method of claim 8, wherein the main plasma discharge unit includes a plurality of electrode assemblies separated from each other,

If some of the electrode assemblies do not operate normally, the plasma reactor is characterized in that higher power is applied to the other electrode assembly.
9. The plasma reactor of claim 8, wherein the first internal ground is formed in the interior space of the inlet plasma discharge unit.
An inlet plasma reaction unit having a first electrode assembly and a first internal ground; And

It is connected to the inlet plasma reaction unit, and includes a main plasma reaction unit having at least one second electrode assembly,

The plasma reactor, characterized in that both the inlet plasma reaction unit and the main plasma reaction unit generate a plasma reaction during a process time, and during the idle time, the inlet plasma reaction unit causes a plasma reaction and the main plasma reaction unit does not cause a plasma reaction.
The method of claim 16, further comprising an outlet plasma reaction unit connected to the main plasma reaction unit and having a third electrode assembly and a second internal ground,

The inlet plasma reaction unit, the main plasma reaction unit and the outlet plasma reaction unit, each of which causes a plasma discharge to remove the contaminants by tertiary decomposition plasma reactor.