KR102034992B1 - Automatic polishing device - Google Patents

Abstract

The present invention relates to an automatic polishing device to grind the outer circumferential surface of a fixed cylindrical workpiece by a predetermined thickness. According to one embodiment of the present invention, the automatic polishing device comprises: a shelf unit providing a plain surface at a predetermined height; a fixed chuck disposed on the upper side of the shelf unit and inserting at least a part of one side of a workpiece thereinto to fix the same; a moving chuck arranged to face the fixed chuck in a longitudinal direction to press the other side of the workpiece; a polishing unit disposed between the fixed and moving chucks and grinding the outer circumferential surface of the workpiece placed between the fixed and moving chucks; a coolant spray unit adjacent to the polishing unit to spray coolant between the polishing unit and the workpiece when the polishing unit polishes the workpiece; a screen unit stood from the front end of the shelf unit to prevent grinding fragments of the workpiece from being scattered to the outside when the polishing unit polishes the workpiece; and a control unit controlling lateral position movement of the polishing unit to grind the workpiece by a predetermined thickness.

Description

Automatic polishing device

The present invention relates to an automatic polishing apparatus, and more particularly, to an automatic polishing apparatus for grinding the outer peripheral surface of a fixed cylindrical workpiece by a predetermined thickness.

In general, the grinding machine is a machine tool for processing a workpiece by a grinding wheel that rotates at high speed, and can be used for machining bearings or automobile parts, because micro-precision processing is possible.

Such grinding machines include various types such as cylindrical grinding machines, planar grinding machines, shaped grinding machines, thread grinding machines, gear grinding machines, etc. In the case of double cylindrical grinding machines, they are used to grind workpieces provided in an approximately axial shape, and are rotatable to a motor. A grinding wheel provided in a circular shape is used to grind the outer circumferential surface of the workpiece.

On the other hand, as a related art, Korean Patent Registration No. 10-1450125 (Registration Date: October 6, 2014) 'cylindrical grinding machine' is disclosed.

The Korean Patent discloses that a grinding wheel for polishing a workpiece is mounted at the tip of the spindle, and the spindle is inserted into the shaft insertion hole through the first and second bearings spaced apart from inside the shaft insertion hole into which the spindle is inserted. It includes a main shaft supporting the rotation, instead of the transmission of the driving force through the belt to apply the motor direct method so that the driving force of the motor is directly transmitted to the spindle, it is possible to stably support the rotation of the spindle while improving the rotation accuracy have.

An object of the present invention is to provide an apparatus for grinding the outer peripheral surface of a fixed cylindrical workpiece by a predetermined thickness.

In the automatic polishing device according to an embodiment of the present invention, in the automatic polishing device for grinding the outer peripheral surface of the fixed cylindrical workpiece by a predetermined thickness, the shelf portion provided with a plane at a predetermined height, disposed on the shelf side, At least a portion of one side of the workpiece is inserted, the fixed chuck to be fixed, the mobile chuck to press the other side of the fixed chuck, arranged to face in the longitudinal direction, disposed between the fixed chuck and the mobile chuck, A polishing portion for grinding the outer circumferential surface of the workpiece located between the fixed chuck and the moving chuck, disposed adjacent to the polishing portion, and spraying coolant between the polishing portion and the workpiece when grinding the workpiece by the polishing portion. When the grinding of the workpiece by the cooling water injection unit, the front end of the shelf portion, the grinding of the workpiece by the grinding unit And a control unit for controlling the positional movement in the width direction of the polishing unit such that the screen unit prevents the pieces from scattering to the outside and the workpiece is ground by a predetermined thickness, and the lathe unit is formed by the polishing unit. When the outer peripheral surface is ground, it can be moved in the longitudinal direction so that the thickness of the workpiece is constant.

The polishing part of the automatic polishing apparatus according to an embodiment of the present invention, while being connected to the shelf part, is connected to the width direction moving part which is moved in the width direction with respect to the shelf part, connected to the width direction moving part, and the length And a grinder portion formed along an outer circumferential surface of the abrasive rotating portion and a polishing rotary part rotated along a rotating shaft formed in a direction, and the control unit includes: the workpiece is seated between the fixed chuck and the moving chuck. The width direction moving part to be moved to a second position where the grinder part and the outer circumferential surface of the workpiece are in contact with each other at a first position where the outer circumferential surface of the workpiece is disposed at a first separation distance The width direction moving part is returned to the first position from the second position, and then the Further moves the thickness has the width direction to control the east to be positioned in the third position.

The shelf part of the automatic polishing apparatus according to an embodiment of the present invention, a main body portion to be seated on the ground, a planar providing portion which is mounted on the upper surface of the main body portion and provides a plane parallel to the ground and the plane providing portion the main body portion A longitudinal movement part configured to move in the longitudinal direction with respect to the reference, wherein the longitudinal movement part is positioned in the longitudinal direction after the width movement part is moved from the first position to the third position Moved so that the outer peripheral surface of the workpiece is ground along the longitudinal direction, and wherein the control unit, when the widthwise movement portion is moved from the first position to the second position, the outer peripheral surface of the grinder portion and the workpiece The article is controlled when the longitudinal movement portion is opposed to the opposite side, and the width movement portion is moved from the first position to the third position. The longitudinal movement part may be controlled such that a liner part and an end of the workpiece face each other.

The fixed chuck of the automatic polishing apparatus according to an embodiment of the present invention includes an insertion portion into which at least a portion of one side of the workpiece is inserted and a chuck rotation portion for rotating the insertion portion, and the movable chuck includes the other side of the workpiece. And a guide moving part which is moved in the longitudinal direction along the planar provision part while being connected to the contact part for pressing the contact part and the contact part, wherein the guide moving part is provided with the contact part along the length of the workpiece fixed to the fixed chuck. It can be moved along the plane providing portion so that the separation distance of the fixed chuck.

The contact portion of the automatic polishing apparatus according to the embodiment of the present invention is connected to the connecting portion connected to the guide moving portion and the connecting portion, and arranged to face the insertion portion of the fixed chuck, press the other side of the workpiece And an elastic pressing portion, wherein the elastic pressing portion penetrates through the connection portion, one side protrudes from an opposite surface of the connection portion facing the insertion portion, and faces the insertion portion, and the other side passes through the connection portion. Compression-elastic deformation when an external force is applied to the return part in a direction away from the insertion part and a lever part connected to the return part protruding to the opposite side of the connection part and the return part protruding from the opposite side of the connection part. When the external force is released, the elastic portion for providing a restoring force so that the return unit returns to its original position Can.

The shelf portion of the automatic polishing apparatus according to an embodiment of the present invention, the coolant sprayed from the coolant injection unit while being connected to the guide portion and the guide portion embedded in the longitudinal direction from the upper surface of the planar providing portion to collect the coolant Further comprising a drain for providing a movement path to be collected by the portion, wherein the guide movement portion is positioned in the longitudinal direction along the guide portion while seated on the guide portion, the guide portion, the movement path of the guide movement portion And a passage through which the coolant moves, wherein a distance between the contact portion and the insertion portion is changed according to a movement distance moved along the guide portion of the guide movement portion, and the drain portion slopes downward toward the coolant collection portion. Can be formed.

The rotating shaft of the chuck rotating part and the rotating rotating part of the polishing rotating part of the automatic polishing apparatus according to the embodiment of the present invention are formed at the same height, and when the position is moved from the first position to the second position of the width direction moving part. The distance between the grinder and the outer circumferential surface of the workpiece may be moved.

The cooling water injection unit of the automatic polishing apparatus according to an embodiment of the present invention has a supply hose part connected to the cooling water supply unit to which the cooling water is supplied, and the supply hose part is formed of a goose neck and applied external force. Deformed according to, the screen portion is inserted into the recessed recessed portion of the planar provision portion, the sliding portion is slid along the recessed portion and is connected to the sliding portion is standing, the workpiece between the polishing portion It is provided with a blocking portion to be positioned, wherein the blocking portion may be formed of a transparent material to be able to check the grinding progress state of the workpiece from the outside.

According to the present invention, by automatically controlling the position movement of the grinding portion according to the size of the workpiece, the grinding process by a predetermined thickness can be precisely implemented.

In addition, during the grinding process, it is possible to prevent deformation or breakage of the workpiece or the grinding member due to the processing heat that may occur.

1 and 2 is a schematic perspective view showing an automatic polishing device according to an embodiment of the present invention.
3 to 6 is a schematic view for explaining the operation sequence of the automatic polishing apparatus according to an embodiment of the present invention.
7 and 8 are schematic views for explaining a fixed chuck and a moving chuck of the automatic polishing device according to an embodiment of the present invention.
9 is a schematic view for explaining a polishing unit of the automatic polishing device according to an embodiment of the present invention.

Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may deteriorate other inventions or the present invention by adding, modifying, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be readily proposed, but they will also be included within the scope of the inventive concept.

In addition, the components with the same functions within the scope of the same idea shown in the drawings of each embodiment will be described using the same reference numerals.

1 and 2 are schematic perspective views showing an automatic polishing device according to an embodiment of the present invention.

1 and 2, the automatic polishing apparatus 1 according to an embodiment of the present invention may be an apparatus for grinding the outer circumferential surface of the fixed cylindrical workpiece P by a predetermined thickness.

Automatic polishing apparatus 1 according to an embodiment of the present invention, the shelf portion 10, the fixed chuck 20, the moving chuck 30, the polishing portion 40, the cooling water injection unit 50, the screen portion ( 60) and a controller (not shown).

The shelf part 10 may provide a plane at a predetermined height.

Specifically, the shelf portion 10, the main body portion 11 which is seated on the ground, the plane providing portion 13 and the plane which is mounted on the upper surface of the main body portion 11 and provides a plane parallel to the ground The provision part 13 may be provided with a longitudinal movement part 15 to move the position in the longitudinal direction X with respect to the main body part 11.

In addition, when the outer circumferential surface of the workpiece P is ground by the polishing unit 40, the planar provision portion 13 is moved in the longitudinal direction X so that the thickness of the workpiece P is constant. You can do that. The predetermined thickness processing of the workpiece P according to the positional movement of the planar provision portion 13 in the longitudinal direction X will be described later.

The fixing chuck 20 is disposed above the shelf part 10 and may be fixed while at least a portion of one side of the workpiece P is inserted.

The moving chuck 30 may press the other side of the workpiece P while being disposed to face the fixed chuck 20 in the longitudinal direction (X).

The workpiece P may be limited in position movement while being disposed between the fixed chuck 20 and the moving chuck 30.

Accordingly, the workpiece (P) while the outer peripheral surface is ground by the polishing unit 40, the position movement is limited, more precise thickness processing can be implemented.

The polishing unit 40 is disposed between the fixed chuck 20 and the moving chuck 30, and the outer circumferential surface of the workpiece P located between the fixed chuck 20 and the moving chuck 30. Can be ground.

Specifically, the polishing part 40 may be rotated while being in contact with the outer circumferential surface of the work piece P to cut the surface of the work piece P so that the thickness of the work piece P may be reduced. .

In addition, when the bending of the surface of the workpiece (P) is necessary, it can be moved in the width direction (Y) so that the surface of the workpiece (P) forms a constant shape.

The cooling water injection unit 50 is disposed adjacent to the polishing unit 40, and the grinding unit 40 and the processing unit P are ground when the workpiece P is ground by the polishing unit 40. Cooling water can be sprayed in between.

Cooling water is the processing heat to prevent the workpiece (P) or the polishing unit 40 from being damaged by the processing heat that may occur in the contact area during the processing of the workpiece (P) by the polishing unit 40 It can play a role of lowering.

The screen portion 60 stands on the front end of the shelf portion 10, so that when the workpiece P is ground by the polishing part 40, the grinding fragments of the workpiece P are scattered to the outside. Can be prevented.

The controller may control the positional movement of the polishing unit 40 in the width direction Y so that the workpiece P is ground by a predetermined thickness.

3 to 6 is a schematic view for explaining the operation sequence of the automatic polishing apparatus according to an embodiment of the present invention.

3 to 6, the polishing part 40 of the automatic polishing device 1 according to the embodiment of the present invention includes a widthwise moving part 41, a polishing rotating part 43, and a grinder part 45. ) May be provided.

The width direction moving part 41 may be moved in the width direction Y with respect to the shelf part 10 while being connected to the shelf part 10.

The polishing rotating part 43 may be connected to the width direction moving part 41 and may be rotated along a rotation axis (not shown) formed in the longitudinal direction X.

The grinder part 45 is formed along the outer circumferential surface of the polishing rotating part 43, and can grind the workpiece P.

On the other hand, the control unit, when the workpiece (P) is seated between the fixed chuck 20 and the moving chuck 30, so that the outer peripheral surface of the grinder 45 and the workpiece (P) is spaced apart. In the first position (see FIG. 2), the widthwise movement unit 41 is moved to the second position (see FIG. 3) so that the grinder part 45 and the outer circumferential surface of the workpiece P come into contact with each other. By controlling, the first separation distance between the grinder 45 and the workpiece (P) can be measured.

The positional movement of the widthwise movement part 41 from the first position to the second position may be a positional movement for measuring a separation distance between the grinder 45 and the workpiece P.

Specifically, the workpiece (P) disposed between the fixed chuck 20 and the moving chuck 30, the separation distance with the grinder portion 45 can be determined according to the thickness, the width direction moving portion 41 is moved to position the distance between the grinder 45 and the workpiece (P), and then moved by a predetermined thickness from the distance, the outer peripheral surface of the workpiece (P) by a predetermined thickness It can be ground.

In addition, the control unit, after the widthwise movement unit 41 is returned from the second position to the first position, the moving portion more toward the workpiece (P) by the predetermined thickness than the first separation distance The widthwise movement part 41 may be controlled to be positioned at a third position.

The positional movement of the widthwise moving part 41 from the first position to the third position may be a positional movement for grinding the workpiece P.

On the other hand, the longitudinal movement portion 15 of the shelf portion 10 is positioned in the longitudinal direction X after the width movement portion 41 is moved from the first position to the third position. It can be moved so that the outer peripheral surface of the workpiece (P) is ground along the longitudinal direction (X).

The controller may be configured such that when the widthwise movement part 41 is moved from the first position to the second position, the lengthwise direction is such that the outer peripheral surface of the grinder 45 and the workpiece P face each other. The eastern part 15 can be controlled.

The controller may be configured such that the length of the grinder 45 and the workpiece P are opposite to each other when the widthwise movement part 41 is moved from the first position to the third position. The direction moving unit 15 can be controlled (see FIG. 4).

Specifically, since the width direction moving part 41 is a positional movement for measuring the separation distance between the grinder part 45 and the workpiece P when the width direction moving part 41 is moved from the first position to the second position. In the state where the grinder part 45 and the outer circumferential surface of the work piece P face each other, the grinder part 45 and the work piece P are moved in contact with each other.

In addition, the width direction moving part 41 is moved from the first position to the third position in a state where the end of the grinder portion 45 and the work piece P face each other. The state in which the grinder portion 45 and the end of the workpiece P face each other may be implemented by the longitudinal moving portion 15 (see FIG. 5).

In addition, in the state where the width direction moving part 41 is moved to the third position, the lengthwise moving part 41 is moved to the longitudinal direction X by the lengthwise moving part 15 to the grinder part 45. By this, grinding can be implemented from the end of the workpiece P to the opposite end (see FIG. 6).

Grinding of the workpiece (P) may be implemented by the grinder 45 rotated by the abrasive rotating portion 43.

On the other hand, the cooling water injection unit 50 of the automatic polishing apparatus 1 according to an embodiment of the present invention may include a supply hose 53 connected to the cooling water supply unit 51 to which the cooling water is supplied.

The supply hose part 53 is formed of a goose neck, and may be deformed according to an applied external force.

Accordingly, the goose neck is deformed according to the size of the workpiece P disposed between the fixed chuck 20 and the movable chuck 30, and is supplied to the contact area between the abrasive portion 40 and the workpiece P. The end of the hose portion 53 can be positioned.

In addition, the supply hose portion 53 is connected to the polishing portion 40, and moves along with the polishing portion 40 when the position movement of the polishing portion 40 in the longitudinal direction (X), Cooling water may be continuously sprayed on the contact area between the polishing unit 40 and the workpiece P.

On the other hand, the screen portion 60 is standing, while being inserted into the recessed recessed portion of the plane providing portion 13, connected to the sliding portion 61 and the sliding portion 61 sliding along the recessed portion And a blocking part 63 to allow the workpiece P to be positioned between the polishing part 40.

The blocking portion 63 is formed of a transparent material to check the grinding progress state of the workpiece (P) from the outside.

7 and 8 are schematic views for explaining a fixed chuck and a moving chuck of the automatic polishing device according to an embodiment of the present invention.

7 and 8, the fixed chuck 20 of the automatic polishing apparatus 1 according to the embodiment of the present invention includes an insertion part 21 into which at least a portion of one side of the workpiece P is inserted. It may be provided with a chuck rotating portion 23 for rotating the insertion portion 21.

The moving chuck 30 is moved in the longitudinal direction X along the plane providing part 13 while being connected to the contact part 31 and the contact part 31 for pressing the other side of the workpiece P. It may be provided with a guide moving portion 33.

The rotation axis of the chuck rotation part 23 and the rotation axis of the polishing rotation part 43 are formed at the same height, and when the position of the width direction moving part 41 moves from the first position to the second position, the article The width direction moving part 41 may be moved by a distance between the liner part 45 and the outer circumferential surface of the workpiece P.

If the rotation axis of the chuck rotation part 23 and the rotation axis of the polishing rotation part 43 are not formed at the same height, the position shift from the first position of the width direction moving part 41 to the second position is performed. When the grinder portion 45 and the widthwise movement portion 41 is moved so as to contact the outer peripheral surface of the workpiece (P) is moved more than the actual separation distance, is not ground by a predetermined thickness, By grinding thicker, tolerances can be a factor.

The rotation axis of the chuck rotation part 23 of the present invention and the rotation axis of the polishing rotation part 43 accurately space the distance between the grinder part 45 and the outer circumferential surface of the workpiece P by the width direction moving part 41. To measure, they are formed at the same height.

The guide moving part 33 is the plane providing part 13 to adjust the separation distance between the contact part 31 and the fixing chuck 20 according to the length of the workpiece (P) fixed to the fixing chuck 20. Can be moved along the

The contact part 31 is connected through the connection part 31a and the connection part 31a connected to the guide moving part 33 and is disposed to face the insertion part 21 of the fixing chuck 20. It may be provided with an elastic pressing portion 31b for pressing the other side of the workpiece (P).

The elastic pressing part 31b may include a return part 311, a lever part 313, and an elastic part 315.

The return portion 311 penetrates through the connection portion 31a, and one side thereof protrudes from an opposing surface of the connection portion 31a facing the insertion portion 21 to face the insertion portion 21. The other side may protrude to the opposite surface of the connection portion 31a through the connection portion 31a.

The lever part 313 may be connected to the return part 311 protruding to the opposite surface of the connection part 31a.

The elastic part 315 is compressively elastically deformed when an external force is applied to the return part 311 in a direction away from the inserting part 21 and is moved. When the external force is released, the return part 311 ) Can provide restoring force to return to the original position.

By the restoring force of the elastic portion 315, the return portion 311 can press the other side of the workpiece (P), the workpiece (P) one side is fixed by the fixing chuck 20, The other side may be disposed between the fixed chuck 20 and the moving chuck 30 while being pressed by the return unit 311.

Figure 9 is a schematic diagram for explaining the drainage of the automatic polishing apparatus according to an embodiment of the present invention.

Referring to FIG. 9, the shelf part 10 is connected to the guide part 17 and the guide part 17 embedded in the longitudinal direction X from the upper surface of the planar providing part 13. The cooling water spraying unit 50 may further include a drain 19 for providing a movement path so that the cooling water injected into the cooling water collecting unit (not shown).

The guide moving part 33 may be moved in the longitudinal direction X along the guide part 17 while being seated on the guide part 17.

The guide unit 17 may guide a movement path of the guide moving unit 33 and may provide a passage through which the coolant moves.

The separation distance between the contact part 31 and the insertion part 21 may be changed according to the moving distance moved along the guide part 17 of the guide moving part 33.

Thereby, the thickness of the outer peripheral surface of the workpiece | work P can be ground, regardless of the length of the workpiece | work P grinding by the said automatic grinding | polishing apparatus 1.

In addition, the drain 19 may be formed to be inclined downward toward the cooling water collection unit.

Accordingly, the coolant injected between the polishing part 40 and the work piece P flows along the drain part 19 while being dropped onto the planar part 13, and drain hole 191. Can be collected through the coolant collection unit.

In summary, the coolant sprayed between the polishing unit 40 and the workpiece P moves along the guide unit 17, and through the drain unit 19 connected to the guide unit 17, the cooling water. It may be collected by the collecting unit, the guide 17 may be formed to be inclined downward toward the drain 19.

The downwardly inclined surface of the guide portion 17 to the drain portion 19 is formed to be inclined finely, and the guide movement portion 33 moved along the guide portion 17 has a height change according to the positional movement. You can write it down.

In addition, the pressurization of the other side of the workpiece (P) by the contact portion 31, according to the shape of the return portion 311 formed larger than the other side of the workpiece (P) according to the change in the height of the guide moving portion (33). There can be no degradation.

In the above description of the configuration and features of the present invention based on the embodiment according to the present invention, the present invention is not limited thereto, and various changes or modifications can be made within the spirit and scope of the present invention. It will be apparent to those skilled in the art that such changes or modifications fall within the scope of the appended claims.

1: automatic polishing machine
P: workpiece
X: longitudinal direction
Y: width direction
10: shelf
20: fixed chuck
30: moving chuck
40: grinding part
50: cooling water injection unit
60: screen portion

Claims (8)

In the automatic polishing device for grinding the outer peripheral surface of the fixed cylindrical workpiece by a predetermined thickness,
A shelf portion providing a plane at a predetermined height;
A fixed chuck disposed on the shelf and fixed with at least a portion of one side of the workpiece inserted;
A moving chuck configured to press the other side of the workpiece while being disposed to face the fixed chuck in a longitudinal direction;
A polishing unit which is disposed between the fixed chuck and the moving chuck, for grinding the outer circumferential surface of the workpiece located between the fixed chuck and the moving chuck;
A cooling water injection unit disposed adjacent to the polishing unit and configured to spray cooling water between the polishing unit and the workpiece when the workpiece is ground by the polishing unit;
A screen portion standing on the front end of the shelf part to prevent the grinding pieces of the workpiece from scattering to the outside when the workpiece is ground by the polishing part; And
And a control unit for controlling the positional movement in the width direction of the polishing unit so that the workpiece is ground by a predetermined thickness.
The shelf part,
When the outer circumferential surface of the workpiece is ground by the polishing unit, the workpiece is moved in the longitudinal direction so that the thickness of the workpiece is constant.
The polishing unit,
A width direction moving part which is moved in the width direction relative to the shelf part while being connected to the shelf part, an abrasive rotating part connected to the width direction moving part and rotated along a rotation axis formed in the longitudinal direction and an outer circumferential surface of the polishing rotating part Is formed along, and provided with a grinder portion for grinding the workpiece,
The control unit,
A second position where the grinder portion and the outer circumferential surface of the workpiece come into contact with each other when the workpiece is seated between the fixed chuck and the moving chuck, and the outer circumferential surface of the grinder portion and the workpiece is spaced apart from each other; By controlling the widthwise moving portion to move to the position, so that the first separation distance between the grinder and the workpiece is measured,
After the width direction moving part is returned from the second position to the first position, the width direction moving part moves further toward the workpiece by the predetermined thickness than the first separation distance to be located at the third position. Control,
The fixed chuck,
At least a portion of one side of the workpiece is inserted and provided with a chuck rotating portion for rotating the insert,
The moving chuck,
It is provided with a contact portion for pressing the other side of the workpiece and the guide moving portion is moved in the longitudinal direction along the planar portion, while being connected to the contact portion,
The guide moving unit,
It is moved along the plane providing portion to adjust the separation distance between the contact portion and the fixed chuck according to the length of the workpiece fixed to the fixed chuck,
The contact portion,
A connecting part connected to the guide moving part and connected to the connecting part, the elastic pressing part pressing the other side of the workpiece while being disposed to face the insertion part of the fixed chuck,
The elastic pressing unit,
A return portion penetrating the connection portion, one side protruding from the opposite surface of the connection portion facing the insertion portion, facing the insertion portion, and the other side passing through the connection portion and protruding to the opposite surface of the connection portion,
A lever part connected to the return part protruding to the opposite side of the connection part;
When the external force is applied to move the position in the direction away from the insertion portion is moved to the compression elastic deformation, when the external force is released, the return portion is provided with an elastic portion for providing a restoring force to return to the original position Automatic polishing machine. delete The method of claim 1,
The shelf part,
A main body part seated on the ground, a planar provision part seated on an upper surface of the main body part and providing a plane parallel to the ground, and a longitudinal moving part allowing the planar provision part to be moved in the longitudinal direction with respect to the main body part; ,
The longitudinal moving portion,
After the widthwise movement unit is moved from the first position to the third position, the widthwise movement unit is moved in the longitudinal direction so that the outer peripheral surface of the workpiece is ground along the longitudinal direction,
The control unit,
When the widthwise movement unit is moved from the first position to the second position, the longitudinal movement unit is controlled such that the grinder unit and the outer circumferential surface of the workpiece face each other, and the widthwise movement unit is formed in the first position. And the longitudinal movement portion is controlled so that the grinder portion and the end of the workpiece face each other when the position is moved from the first position to the third position.
delete delete The method of claim 3,
The shelf part,
And a guide part embedded in the longitudinal direction from an upper surface of the planar providing part and a drain part providing a movement path such that the coolant injected from the coolant injection part is collected into the coolant collection part while being connected to the guide part.
The guide moving unit,
While seated in the guide portion, the position is moved in the longitudinal direction along the guide portion,
The guide unit,
It guides the movement path of the guide moving portion, and provides a passage for the cooling water is moved,
The distance between the contact portion and the insertion portion is changed according to the movement distance moved along the guide portion of the guide movement portion,
The drainage portion, characterized in that the automatic polishing device is formed to be inclined downward toward the cooling water collection unit.
The method of claim 6,
The rotation axis of the chuck rotation part and the rotation axis of the polishing rotation part are formed at the same height so that the distance between the grinder part and the outer circumferential surface of the workpiece when the position movement from the first position to the second position of the width direction movement part is moved. Automatic grinding apparatus characterized in that to be moved by a distance.
The method of claim 3,
The cooling water injection unit,
It is provided with a supply hose connected to the cooling water supply is supplied with the cooling water,
The supply hose portion is formed of a goose neck, deformed according to the applied external force,
The screen unit,
It is inserted into the recessed recessed portion of the planar provision portion, the sliding portion sliding along the recessed portion and connected with the sliding portion, standing up, and has a blocking portion for positioning the workpiece between the polishing portion,
The blocking unit,
It is formed of a transparent material, the automatic polishing device, characterized in that to check the grinding progress state of the workpiece from the outside.

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