KR102030511B1 - Probe unit provided with buffer bump and manufacturing method - Google Patents

Abstract

The present invention relates to a probe unit having a high elastic buffer bump and a method of manufacturing the same. A probe unit for use in inspecting a display panel, the probe unit comprises a probe part including a plurality of contact bumps provided to be in contact with an electrode on a display panel, a probe film part bonded to the upper surface of the probe part, and a probe detection part which applies an electrical signal to the probe on the upper surface of one end of the probe film part and detects an output signal accordingly. The contact bump is mixed with a conductive material and a flexible material formed of metal powder to form a flexible bump. The flexible bump protrudes from the upper surface of the other end of the probe film part in a state where the metal powder is exposed to the outside so as to be in contact with the electrode on the display panel. The scratch of a flexible substrate can be prevented by minimizing damage to a pad.

Description

Probe unit provided with buffer bump and manufacturing method

The present invention relates to a probe unit having a buffer bump and a manufacturing method, and more particularly, to scratch the electrode pad portion during the electrode contact process for the flexible substrate display inspection and scratches generated during the process In order to minimize the defect caused by the scratch, the flexible buffer bump at the probe unit contact end contacting the probe unit with the flexible substrate display electrode in order to eliminate the scratches generated when the probe unit contacts the electrode for signal application. It relates to a probe unit having a high-elastic buffer bump to minimize the damage to the pad during contact with the flexible substrate display pad to prevent scratches and a method of manufacturing the same.

The display panel forms a thin film transistor, deposits a light emitting material on each pixel to display pixel information, and is configured to represent image information through a change in applied voltage.

In this case, the display inspection probe unit performs an inspection on the display panel produced through the cell process to check whether there is a defect that may occur in the manufacturing process.

The probe unit is a device for checking the abnormality of lighting while contacting the display pad to send and receive electrical signals.

1 is an overall configuration diagram of a probe unit for inspecting a conventional display panel, FIG. 2 is a perspective view of a conventional probe unit, and FIG. 3 is a configuration diagram of a conventional probe film.

 As shown in FIG. 1, the probe unit 10 is positioned on the display panel 20 to check for abnormality of each cell. In this case, the probe unit 10 applies an electrical signal to the electrode of the display panel 20, receives the output signal according to the electrode, and transmits the output signal to the inspection system.

Through this process, the display panel 20 can be inspected for defects such as point defects, predecessors, and spot defects that may occur in the manufacturing process.

As shown in FIG. 2, the above-described probe unit 10 generally includes a probe block 12, a PCB portion 16, and a head block 14.

The probe block 12 applies an electrical signal by contacting the probe to the electrode of the display panel 20, and detects an output signal according to the test process. Here, the probe block 12 may be integrally formed with a Taped Carrier Package (TCP) block (not shown), and the TCP block transmits an electrical signal received from the PCB unit 16 to the probe block 12. .

The head block 14 moves the probe block 12 up and down or fixes it at a predetermined position such that the probe of the probe block 12 contacts the electrode of the display panel 20 at a suitable physical pressure.

The PCB unit 16 generates an electrical signal for inspecting each cell of the display panel 20 and transmits the electrical signal to the probe block 12 through the film 18.

Conventional display panel is rigid type, so the pad scratch did not affect the defect, but it changed into flexible display, which caused the defect of the display panel such as scratching of the connection pad and short circuit of the electrode. It becomes a factor.

Since scratches on the electrode pads of the flexible board cause panel defects due to repeated assembly and bending of the inspection process, a technique is needed to minimize damage to the electrode pads including scratches that may occur during the inspection process. .

Conventional probe unit is produced in the form of a bump on the film plated, this type of plating is made of a hard metal to generate a scratch of the pad, a flexible contactor made of FPCB film 80 shown in FIG. The contact portion 81 scratches the pad with the metal plated portion.

In addition, the conventional probe unit forms bumps of a metal material through a semiconductor photo process and a plating process corresponding to a fine pitch, so that scratches of the pad are continuously generated and there is a limitation in mechanical improvement for reducing damage such as scratches.

Conventional probe unit is divided into the contact portion contacting the display pad portion and the FPCB portion connecting the inspection jig to configure the contactor structure of the front portion to test by bonding with the FPCB, or use the form of the FPCB as it is The test was conducted using the pad portion of the FPCB as a contactor.

The contactor structure was formed by bumping a metal material through a plating process to check the lighting while contacting the display pad. In the case of the FPCB, the pad portion of the FPCB is plated higher than other areas so that the plating pad portion contacts the display pad. Lighting was examined.

Conventional probe unit is in contact with the pad of the flexible display that is continuously bent in the form of bumps of the metal material not only has a problem that causes scratches on the display pad, but may also cause a failure of the entire display product.

Domestic Patent No. 10-1272882

The present invention was developed to solve the conventional problems as described above, the object of which is to form a mold on the flexible FPCB pad end and apply a polymer buffer material such as PDMS mixed powder metal powder such as nickel buffer type By forming bumps, buffer bumps formed on the mold by photoresist patterning, metal masking, laser drilling after film attachment such as PI, and film attachment such as laser processed PI, etc. It is to provide a probe unit having a buffer bump and a method of manufacturing the same to minimize the scratch to prevent scratches.

A probe unit having a buffer bump according to the present invention includes a probe unit for inspecting a display panel, the probe unit including a plurality of contact bumps provided to be in contact with an electrode on the display panel; A probe film part bonded to an upper surface of the probe part; And a probe detector configured to apply an electrical signal to the probe and detect an output signal according to one end of the probe film, wherein the contact bump is mixed with a conductive material formed of a metal powder and a flexible material to form a flexible bump. The flexible bumps are formed on the other end of the probe film part in a state where the metal powder is mixed so as to be in contact with the electrodes on the display panel.

In addition, in the probe unit having a buffer bump according to the present invention, the conductive material is characterized in that the Ni, Ag, Au, Ni powder is a highly conductive powder plated with AG or Au.

In addition, in the probe unit having a buffer bump according to the present invention, the flexible material is characterized in that the buffer type polymer material containing PDMS.

On the other hand, in the method for manufacturing a probe unit with a buffer bump according to the present invention, in the method for manufacturing a probe unit for inspecting a display panel, the buffer bump in the contact bump forming region on the upper surface of one end of the probe film portion of the probe unit Coating a photosensitive material for formation and forming a mold through exposure and development; Filling the metal powder into the bump forming portion; Filling the flexible material over the bumps filled with the metal powder to cure; And performing a grinding process and removing the mold.

On the other hand, the method of manufacturing a probe unit having a buffer bump according to the present invention, in the method for manufacturing a probe unit for inspecting a display panel, a mask for forming a buffer bump on one end of the probe film portion of the probe unit Forming; Filling and curing the metal powder and the flexible material into the bump forming part of the mask; And it is characterized in that it comprises a step of performing a grinding process.

On the other hand, in the method for manufacturing a probe unit with a buffer bump according to the present invention, in the method for manufacturing a probe unit for inspecting a display panel, the film layer is applied by applying a film to the upper surface of one end of the probe film portion of the probe unit Forming; Laser drilling a bump forming portion in the film layer and penetrating the film layer; Filling the metal powder into the bump portion formed through the film layer; Filling the flexible material over the bumps filled with the metal powder to cure; And performing a grinding process and removing the film layer.

In addition, in the method of manufacturing a probe unit with a buffer bump according to the present invention, the metal powder instead of the step of filling the metal powder into the bump forming portion, and the step of filling the flexible material over the bump filled with the metal powder After mixing the flexible material with the mixture is characterized in that the filling into the bump forming portion.

In addition, in the method of manufacturing a probe unit having a buffer bump according to the present invention, the flexible material PDMS is cured by a conductive material and a curing solution, the mixing ratio of the PDMS and the curing solution is characterized in that more than 10: 1. It is.

In addition, in the method of manufacturing a probe unit having a buffer bump according to the present invention, when the flexible material PDMS is cured by a conductive material and a curing solution, the curing temperature is characterized in that applied to 50 ℃ to 150 ℃ will be.

In addition, the method of manufacturing a probe unit having a buffer bump according to the present invention, characterized in that it is applied without removing the mold formed to fill the flexible material and metal powder.

According to the present invention, a probe unit having a high elastic buffer bump serves as a buffer between two layers when the bump of the probe unit and the electrode pad of the flexible substrate are in contact with each other during the flexible display inspection process, thereby minimizing deformation due to external force and By minimizing the occurrence of scratches, there is an effect that can reduce the occurrence of defects on the flexible substrate.

1 is an overall configuration diagram of a probe unit for inspecting a conventional display panel.
Figure 2 is a perspective view of a conventional probe unit, Figure 3 is a block diagram of a conventional probe film.
4A and 4B are schematic diagrams of a probe film having a buffer bump according to the present invention.
5A and 5B are schematic views showing a cross section of a probe film having a buffer bump according to the present invention.
Figure 6 shows the manufacturing process of the probe film with a buffer bump formed in accordance with a first embodiment of the present invention.
7 illustrates a process of manufacturing a probe film having a buffer bump according to a second embodiment of the present invention.
8 illustrates a process of manufacturing a probe film having a buffer bump according to a third embodiment of the present invention.
9 illustrates a process of manufacturing a probe film having a buffer bump according to a fourth embodiment of the present invention.
10 illustrates a process of manufacturing a probe film in which a buffer bump is formed according to a fifth embodiment of the present invention.

Hereinafter, a probe unit having a buffer bump according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4A and 4B are schematic diagrams of a probe film having a buffer bump according to the present invention, and FIGS. 5A and 5B are schematic views showing a cross section of a probe film having a buffer bump according to the present invention.

4 and 5, the probe film 80 mounted on the probe block for inspecting the display panel includes a plurality of probe parts each including contact bumps 82 provided to be in contact with a plurality of electrodes of the display panel. Probe film 80 is bonded to the upper surface of the probe portion 81 in a form provided in the probe film 80 (81).

In addition, since the contact bumps formed to correspond to the fine pitch do not match the position with the probe, a separate metal line is formed to cope with the probe by bonding the probe to the fine pitch.

In addition, a probe detector 83 for applying an electrical signal to the probe and detecting an output signal according to the probe is included on one end of the probe film 80 as illustrated in FIG. 3.

The contact bumps 82 are mixed with the conductive material formed of the metal powder 82a and the flexible material 82b to form the flexible bumps.

As shown in FIG. 5A, the flexible bump protrudes from an upper surface of the other end of the probe film part while the metal powder 82a is exposed to the outside so as to be in contact with the electrode on the display panel.

On the other hand, as shown in FIG. 5B, the type of the metal powder exposed to the outside may also be an embodiment in which the mold is not removed in the state in which the metal powder is filled in the mold wall for the case where the wearability verification cannot be tolerated.

The conductive material is a metal powder made of Ni, Ag, etc., and the flexible material is mixed with the metal powder by PDMS. At this time, a flexible material such as PDMS is applied onto the metal powder, or PDMS and Ni, Ag powder are mixed together. By coating, in order to harden by combining PDMS and Ni, Ag powder, the ratio of the PDMS and the curing solution proceeds by increasing the ratio of the curing solution from 10: 1 according to the specificity of the product.

In addition, the conductive material may be Ni, Ag, Au, a high conductivity powder coated with AG or Au to the Ni powder, and in another case, the conductive material is Ni + Ag, Ni + by adding a metal material It is also possible to apply Ag, Ni + metal plating, or nonmetal + metal material plating and coating.

Figure 6 shows the manufacturing process of the probe film with a buffer bump formed in accordance with a first embodiment of the present invention.

Referring to FIG. 6, first, a contact bump for a test is formed on an FPCB, and a mold 84 for buffer bump formation is formed in a contact bump forming area on an upper surface of one end of a probe film portion of a probe unit.

In this case, the mold 84 may apply the photosensitive materials PR, DFR, and photosensitive PI, and then pattern the bump forming portions by exposing and developing the photosensitive material using the mask 85.

At this time, the thickness of the photosensitive material is 10㎛ ~ 50㎛ select and pattern according to the pitch of the product.

Next, the metal powder is filled into the bump forming portion.

Metal powders such as Ni and Ag may be applied together with the PDMS material, which is a flexible material.

Meanwhile, the flexible material may be filled onto the bumps filled with the metal powder. Next, the step of curing the applied PDMS and Ni metal powder is performed.

Next, the step of filling the flexible material over the bumps filled with the metal powder to cure.

After filling the metal powder, such as Ni, Ag, into the pattern, a material such as PDMS is applied onto the metal powder as a flexible material.

At this time, the ratio of the PDMS and the curing solution proceeds by increasing the ratio of the curing solution from 10: 1 according to the characteristics of the product.

On the other hand, PDMS filling is filled in a mixed state, or by curing in advance to adjust the viscosity to fill. Filling of materials such as Ni and Ag can be carried out by filling Ni, Ag into a pattern first and then applying PDMS and mixing PDMS and Ni and Ag together.

PDMS is filled on bumps filled with metal powders such as Ni and Ag, and then curing is performed.

In case of hardening, natural hardening and oven or hot plate are used, and the working temperature is 50 to 150 degrees depending on the product.

Finally, the grinding process is performed and the photoresist is removed.

The bumps are planarized by grinding equipment or manual, and then the pattern material is removed to form the buffer bumps.

7 illustrates a process of manufacturing a probe film having a buffer bump according to a second embodiment of the present invention.

Referring to FIG. 7, first, contact bumps for testing are formed on the FPCB, and the patterned PI film 86 for buffer bump formation is aligned and attached to the contact bumps.

Here, the PI film has a thickness of 30um or 50um.

Metal powder is filled into the bump forming part of the mask.

Next, the flexible material is filled and cured on the bump filled with the metal powder.

Description of the metal powder filling and curing process is the same as described in FIG.

Finally, the grinding process is performed and the mask is removed. When the flattening operation is performed to the height of the pattern by the grinding operation, the buffer bump having flexibility is completed.

8 illustrates a process of manufacturing a probe film having a buffer bump according to a third embodiment of the present invention.

Referring to FIG. 8, first, a contact bump for a test is formed on an FPCB, and a film layer is formed by coating a film on one end of the probe film of the probe unit.

The bump forming portion in the film layer is laser drilled to penetrate the film layer.

At this time, a 30um or 50um dry film or a polymer film such as PI is applied and penetrated through the film using a laser.

Next, the metal powder 82a is filled into the bump portion formed through the film layer.

The flexible material is then filled and cured over the bumps filled with the metal powder.

Description of the metal powder filling and curing process is the same as described in FIG.

Finally, the grinding process is performed and the film layer is removed, and the cushioning bump having flexibility is completed when the flattening operation is performed to the pattern height by the grinding operation.

Referring to FIG. 9, first, a contact bump for a test is formed on an FPCB, and an stencil mask 87 is aligned on an upper surface of one end of a probe film portion of a probe unit.

Metal powder is filled into the bump portion formed on the aligned stencil mask 87.

The flexible material is then filled and cured over a bump filled with metal powder.

The description of the metal powder filling and curing process is the same as described in FIG. 6.

Finally, the stencil mask is removed to create a flexible cushioned bump.

Referring to FIG. 10, first, a contact bump for a test is formed on an FPCB, and a film such as PI 86 having a bump pattern formed on an upper surface of one end of a probe film portion of a probe unit is aligned and attached.

At this time, a 30um or 50um dry film or a polymer film such as PI is patterned and attached.

Next, the metal powder is filled into the bump portion formed by pattern processing.

The flexible material is then filled and cured over the bumps filled with the metal powder.

The description of the metal powder filling and curing process is the same as described in FIG. 6.

Finally, the grinding process is performed to planarize the film, thereby completing a cushioned bump having flexibility supported by the film wall.

Although the present invention has been described above by means of limited embodiments and drawings, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims. .

80: probe film 81: probe
82: contact bump 82a: metal powder
82b: flexible material 83: probe detection unit
84 mold 85 mask
86: PI film 87: stencil mask

Claims (10)

A probe unit having a buffer bump for inspecting a display panel, the probe unit comprising:
A probe part including a plurality of contact bumps provided to be in contact with an electrode on the display panel;
A probe film part bonded to an upper surface of the probe part; And
An upper surface of one end of the probe film part including a probe detector configured to apply an electrical signal to the probe and detect an output signal accordingly;
The contact bumps are mixed with a conductive material and a flexible material formed of a metal powder together with a curing solution and filled into the bump forming mold hole and cured to form a buffer bump in a vertical column shape, and to be in contact with an electrode on the display panel. And the buffer bump is formed to protrude on the upper surface of the other end of the probe film in a state in which the metal powder is exposed to the outside or the metal powder is contained in the mold. The method of claim 1,
The conductive material is a probe unit having a buffer bump, characterized in that the Ni, Ag, Au, Ni powder is a highly conductive powder plated with AG or Au. The method of claim 1,
The flexible material is a probe unit having a buffer bump, characterized in that the buffer polymer material including PDMS. In the manufacturing method of the probe unit for inspecting the display panel,
Coating a photosensitive material for forming a buffer bump on a contact bump forming region on an upper surface of one end of the probe film of the probe unit, and forming a mold through exposure and development;
Filling the metal powder into the bump forming mold hole;
Filling and mixing the flexible material and the curing solution into the bump-forming mold hole filled with the metal powder, followed by curing to form a buffer bump in a vertical column shape; And
Performing a grinding process and removing the mold. In the manufacturing method of the probe unit for inspecting the display panel,
Aligning the stencil mask on an upper surface of one end of the probe film portion of the probe unit to form a contact bump on the FPCB;
Filling a metal powder into a mold portion formed on the aligned stencil mask;
Filling and curing the compliant material over forming the bumps filled with the metal powder; And
Separating the stencil mask to cure the metal powder and the flexible material to form a buffer bump having a vertical pillar shape. In the manufacturing method of the probe unit for inspecting the display panel,
Forming a film layer by applying a film to an upper surface of one end of the probe film part of the probe unit;
Laser drilling a bump forming portion in the film layer and penetrating the film layer;
Filling the metal powder into the bump forming mold hole formed through the film layer;
Filling and mixing the flexible material into the bump-forming mold hole filled with the metal powder, followed by curing to form a buffer bump in a vertical column shape; And
Performing a grinding process and removing the film layer. The method according to any one of claims 4 to 6,
Instead of filling the metal powder into the bump forming mold and filling the flexible material into the bump forming mold filled with the metal powder, the metal powder and the flexible material are mixed and then the mixture is filled into the bump forming mold. Method for producing a probe unit, characterized in that. delete delete The method according to any one of claims 4 to 6
A method of manufacturing a probe unit, characterized in that it is applied without removing the mold formed to fill the flexible material and the metal powder.

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