KR102026107B1 - Light exposure device and method for manufacturing exposed material - Google Patents
Light exposure device and method for manufacturing exposed material Download PDFInfo
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- KR102026107B1 KR102026107B1 KR1020147018966A KR20147018966A KR102026107B1 KR 102026107 B1 KR102026107 B1 KR 102026107B1 KR 1020147018966 A KR1020147018966 A KR 1020147018966A KR 20147018966 A KR20147018966 A KR 20147018966A KR 102026107 B1 KR102026107 B1 KR 102026107B1
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- exposure
- alignment mark
- mask
- imaging
- exposed material
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
It is possible to more accurately specify the relative positions of the exposure mask and the exposed material without using complicated and expensive mechanisms, and further eliminate the delay in working time using the exposure apparatus. The exposure apparatus according to the present invention captures at least a part of the first alignment marks and the second alignment marks formed on the exposure mask through the microlens array, and does not disturb the exposure to the exposed material when the imaging is completed. An image pickup section that moves in a predetermined direction so as to be aligned, a position alignment control section for aligning positions of the exposed material and the exposure mask on the basis of the positional information of the first and second position alignment marks, and from the light source before movement of the image pickup section is completed. An exposure start timing control part is provided so that irradiation of exposure light may be started.
Description
BACKGROUND OF THE
Conventionally, the exposure apparatus which exposes to-be-exposed material by a predetermined pattern using the mask for exposure is known. Such an exposure apparatus is used, for example, in the manufacture of color filters for liquid crystal displays, in alignment treatment of optical alignment films, and the like. When using an exposure mask, it is necessary to align the position of an exposure mask and a to-be-exposed material. As an example, the mark for position alignment is used for position alignment of an exposure mask and a to-be-exposed material (for example, patent document 1).
In the method described in
However, in the position detection method described in
Moreover, the position detection apparatus of
In addition, in the method described in
Accordingly, it is an object of the present invention to more accurately specify the relative positions of an exposure mask and an exposed material without using complicated and expensive mechanisms for exposing the exposed material, and to eliminate the delay in working time using the exposure apparatus.
The present invention relates to an exposure apparatus. In order to achieve the above object, an exposure apparatus according to the present invention includes a light source for irradiating exposure light to an exposure material, an exposure mask supported between the light source and the exposure material, a microlens array disposed between the exposure material and the exposure mask; A first position formed in the exposure mask through the microlens array to align the positions of the exposure material and the exposure mask by using the first position alignment mark provided on the exposure material and the second position alignment mark provided on the exposure mask. At least a portion of the alignment mark and the second position alignment mark, and when the imaging is completed, the imaging unit moving in a predetermined direction so as not to disturb the exposure to the exposed material, and the first imaging unit captured by the imaging unit. An image recognition unit for recognizing at least a portion of the position alignment mark and the second position alignment mark, and a first position recognized by the image recognition unit A position alignment control unit for aligning positions of the exposed material and the exposure mask based on at least a portion of the alignment marks and the position information of the second position alignment mark, and an exposure to start irradiation of exposure light from the light source before movement of the imaging unit is completed; A start timing controller.
"Exposed material" refers to an object to be exposed. The "exposed material" includes a substrate and a substrate having a surface to be exposed, and examples of the "exposed material" include a glass substrate laminated with a photoresist film, a photosensitive film, and various members exposed to manufacture a liquid crystal panel. "Before the movement of the imaging part is completed" means before the movement of the imaging part is completed and the imaging part stops in a predetermined position. Therefore, "before the movement of the imaging part is completed" includes "before the movement of the imaging part starts", "simultaneous with the movement start of the imaging part", and "after the movement of the imaging part starts, and before the movement of the imaging part is completed".
For example, a light source irradiates exposure light while moving.
As an example, the microlens array moves in one direction between the first position alignment mark provided on the exposed material and the second position alignment mark provided on the exposure mask while the imaging unit is capturing, and the light source is irradiating the exposure light. , Together with the light source, moves in one direction in the opposite direction.
The microlens array moves between the first alignment mark provided on the exposed material and the second alignment mark provided on the exposure mask while the imaging unit is capturing, and the imaging unit moves to the exposure mask through the moving microlens array. At least a part of the formed first alignment marks is taken together with the second alignment marks in a plurality of times or continuously, and the image recognition unit superimposes the images taken multiple times or continuously to the marks for the second alignment. It may also be configured to generate a synthesized image for specifying the position of the first position alignment mark.
Moreover, this invention relates to the manufacturing method of an exposure material. An exposure material for an exposure material using an exposure apparatus including a light source for irradiating exposure light, an exposure mask supported between the light source and the exposure material, and a microlens array disposed between the exposure material and the exposure mask. In the manufacturing method, an image is formed on the exposure mask through a microlens array to align the positions of the exposure material and the exposure mask using the first position alignment mark provided on the exposure material and the second position alignment mark provided on the exposure mask. An imaging step for imaging at least a portion of the first alignment mark and the second alignment mark of the exposure mask, and at least a portion of the first alignment mark captured by the imaging step and the second alignment An image recognition step of recognizing the mark by the image recognition unit and a first position alignment recognized by the image recognition step A position alignment step of aligning the exposed material and the exposure mask with the position alignment control unit based on at least a part of the mark and position information of the second position alignment mark; and after the imaging in the imaging step is completed, exposure to the exposed material The exposure start timing control unit is configured for the exposure material and the exposure position aligned by the position alignment step before the imaging unit moving step in which the imaging unit moves in a predetermined direction and the movement of the imaging unit in the imaging unit moving step is completed, so as not to interfere. An exposure start step of causing irradiation of exposure light from the light source to the mask.
"Exposure material" means that exposure is completed and "exposure material" is exposed. The "exposure material" includes an exposed substrate and a substrate, and examples of the "exposure material" include an exposed glass substrate, an exposed film, and various members exposed to manufacture a liquid crystal panel.
For example, the method further includes an exposure step of irradiating exposure light while the light source is moving.
As an example, in the imaging step, the microlens array moves in one direction between the first alignment mark provided on the to-be-exposed material and the second alignment mark provided on the exposure mask, and in the exposure step, the microlens array moves together with the light source. Move in the reverse direction of one direction.
In the imaging step, the microlens array is moved between the first position alignment mark provided on the to-be-exposed material and the second position alignment mark provided on the exposure mask, and the first position formed on the exposure mask through the moving micro lens array. At least a part of the mark for alignment is picked up by the image pickup unit a plurality of times or continuously with the mark for the second position alignment, and in the image recognition step, the image recognition unit superimposes the images picked up multiple times or continuously in the second position alignment. The composition may be configured to generate a composite image for specifying the position of the first position alignment mark with respect to the dragon mark.
An exposure apparatus according to the present invention includes an image pickup unit for picking up at least a portion of the first position alignment mark formed in the exposure mask through a microlens array, a second position alignment mark, and a first image picked up by the image pickup unit. And an image recognizing unit for recognizing at least a part of the position alignment mark and the second position alignment mark. Since at least a part of the first position alignment mark to be imaged is formed on the exposure mask through the microlens array, the imaging unit includes a second position alignment mark provided on the exposure mask and an image formed on the exposure mask through the microlens array. At least a part of the 1 position alignment mark can be imaged on the same plane. Therefore, the shift | offset | difference of the imaging position of the 1st alignment mark and the 2nd alignment mark which originates in the distance between the to-be-exposed material provided with the 1st alignment mark and the exposure mask provided with the 2nd alignment mark is eliminated. Can be.
The exposure apparatus which concerns on this invention did not employ | adopt the method of adjusting the optical path length of the optical path with respect to an imaging object in order to eliminate the said shift of the said imaging position. Therefore, even if the optical axis of the image pickup unit for imaging the first and second position alignment marks is out of a predetermined angle, the first position alignment mark and the second position alignment imaged by the image pickup unit and recognized by the image recognition unit The relative position of the dragon mark does not change. Therefore, the relative position of a mask for exposure and a to-be-exposed material can be specified more correctly.
Moreover, in order to image the 1st alignment mark and the 2nd alignment mark, it is not necessary to provide the two optical paths of a different optical path length, and the optical path length adjustment means with respect to each optical path, Furthermore, on the optical axis of each optical path You do not need to place the alignment reticle in the. Therefore, a costly complicated mechanism is unnecessary for the alignment of the exposure mask and the exposed material.
In addition, the exposure apparatus according to the present invention includes an imaging unit which moves in a predetermined direction so as not to interfere with exposure to an exposed material when imaging is completed, and an exposure start which starts irradiation of exposure light from a light source before movement of the imaging unit is completed. It includes a timing controller. Therefore, since exposure starts before the movement of an imaging part is completed, the delay of the working time using an exposure apparatus can be eliminated.
As described above, according to the exposure apparatus according to the present invention, it is possible to more accurately specify the relative position of the exposure mask and the exposure material without using a complicated and expensive mechanism in the exposure of the exposure material, and furthermore, The delay can be eliminated.
When the exposure light is irradiated while the light source is moved, a smaller light source can be used, and the exposure apparatus can be miniaturized.
The microlens array is moved in one direction between the first position alignment mark provided on the to-be-exposed material and the second position alignment mark provided on the exposure mask while the imaging unit is capturing, and while the light source is illuminating the exposure light, In addition, when it is comprised so that it may move to the reverse direction of one direction, imaging of the 1st position alignment mark and exposure of a to-be-exposed material can be performed using a smaller and common microlens array. Since a large microlens array is expensive, the imaging cost of the 1st alignment mark and exposure of the to-be-exposed material can be made possible by using a smaller and common microlens array, and the manufacturing cost of an exposure apparatus can be reduced.
The image pickup unit captures at least a portion of the first alignment mark formed on the exposure mask through the moving microlens array multiple times or continuously with the second alignment mark, and the image recognition unit multiple times or continuously. The first image formed on the exposure mask through the microlens array, when the image captured by the above is superimposed so as to generate a composite image for specifying the position of the first alignment mark relative to the second alignment mark. By superimposing a partial image of the alignment mark, more positional information of the first alignment mark can be obtained. Therefore, the position of the first position alignment mark formed by the microlens array can be more surely specified.
The exposure material manufacturing method which concerns on this invention is an imaging step which an imaging part picks up at least a part of the 1st position alignment mark formed in the exposure mask through the microlens array, and the 2nd position alignment mark of the exposure mask, and the imaging step, And an image recognition step of recognizing at least a part of the first position alignment mark and the second position alignment mark picked up by the image recognition unit.
Since at least a part of the first position alignment mark to be picked up is formed in the exposure mask through the microlens array, the imaging unit is a second position alignment mark provided in the exposure mask and the first position formed in the exposure mask through the microlens array. At least a part of the alignment mark can be imaged on the same plane. Therefore, the shift | offset | difference of the imaging position of the 1st alignment mark and the 2nd alignment mark which originates in the distance between the to-be-exposed material provided with the 1st alignment mark and the exposure mask provided with the 2nd alignment mark is eliminated. Can be. In the exposure material manufacturing method which concerns on this invention, the method of adjusting the optical path length of the optical path with respect to an imaging object was not employ | adopted in order to eliminate the said shift of the said imaging position. Therefore, even if the optical axis of the image pickup unit for imaging the first and second position alignment marks is out of a predetermined angle, the first position alignment mark and the second position alignment imaged by the image pickup unit and recognized by the image recognition unit The relative position of the dragon mark does not change. Therefore, the relative position of a mask for exposure and a to-be-exposed material can be specified more correctly.
Moreover, in order to image the 1st alignment mark and the 2nd alignment mark, it is not necessary to provide the two optical paths of a different optical path length, and the optical path length adjustment means with respect to each optical path, Furthermore, on the optical axis of each optical path You do not need to place the alignment reticle in the. Therefore, a costly complicated mechanism is unnecessary for the alignment of the exposure mask and the exposed material.
Moreover, the exposure material manufacturing method which concerns on this invention is an imaging part movement step which an imaging part moves to a predetermined direction so that the exposure to a to-be-exposed material does not interfere after the imaging in an imaging step is complete | finished, and the imaging part in an imaging part movement step Before the movement is completed, the exposure start timing control section includes an exposure start step of causing irradiation of exposure light from the light source to the exposed material and the exposure mask that are aligned by the position alignment step. In the exposure start step, the light source starts exposure before the movement of the imaging unit is completed, thereby eliminating the delay of the working time using the exposure apparatus.
As described above, according to the exposure material manufacturing method according to the present invention, the relative position of the exposure mask and the exposure material is more precisely specified without using a complicated and expensive mechanism for exposure of the exposure material, and further, the working time using the exposure apparatus. This can eliminate the delay.
In the case where the light source further includes an exposure step of irradiating the exposure light, a smaller light source can be used, and the exposure apparatus can be miniaturized.
In the imaging step, the microlens array moves in one direction between the first position alignment mark provided on the to-be-exposed material and the second position alignment mark provided on the exposure mask, and in the exposure step, the microlens array moves in one direction together with the light source. When configured to move in the reverse direction, the imaging of the first alignment mark and the exposure of the exposed material can be performed using a smaller and common microlens array. Since the large sized microlens array is expensive, it is possible to reduce the manufacturing cost of the exposure apparatus as imaging of the first positioning mark and exposure of the exposed material can be made possible by using a smaller and common microlens array.
In the imaging step, the imaging unit picks up at least a portion of the first alignment marks formed on the exposure mask through the moving microlens array a plurality of times or successively together with the second alignment marks. In the case where the image recognition unit is configured to generate a composite image for specifying the position of the first position alignment mark with respect to the second position alignment mark by superimposing the images picked up multiple times or continuously, By overlapping the partial image of the 1st alignment mark image-formed on the exposure mask through this, more positional information of the 1st alignment mark can be acquired. Therefore, the position of the first position alignment mark formed by the microlens array can be more surely specified.
1 is a side view of an exposure apparatus according to a first embodiment,
FIG. 2A is a plan view of the exposure mask shown in FIG. 1 seen from the exposed material side, and FIG. 2B is a plan view of the exposed material shown in FIG. 1 viewed from the light source part side, and FIG. ) Is a plan view of the first position alignment mark and the second position alignment mark shown in FIG. 1,
3A is a schematic diagram showing the structure of the microlens array shown in FIG. 1, and FIG. 3B is a schematic diagram showing the positional relationship between the field of view aperture and the aperture stop of the microlens array shown in FIG. 1. ,
4 is a schematic diagram showing the positional relationship between the arrangement of the microlens array and the field stop shown in FIG.
5 (a) to 5 (c) show a partial image of the first alignment mark formed by the microlens array shown in FIG. 1 and a partial image of the first alignment mark. Iii) is an explanatory diagram showing a composite image superimposed, (d) of FIG. 5 is an image diagram showing a first position alignment mark and a second position alignment mark displayed on the composite image,
FIG. 6A is a side view showing the positional relationship of each structural member in the exposure apparatus according to the first embodiment, and FIG. 6B is the position of each structural member in the exposure apparatus according to the first embodiment. Side view showing the relationship,
FIG. 7C is a side view showing the positional relationship of each structural member in the exposure apparatus according to the first embodiment, and FIG. 7D is the position of each structural member in the exposure apparatus according to the first embodiment. Side view showing the relationship,
8 is a flowchart illustrating a process relating to an operating method of the exposure apparatus according to the first embodiment and a method of manufacturing an exposure material using the exposure apparatus.
FIG. 9 is a plan view showing an exposed side surface of the to-be-exposed material shown in FIG. 1.
[First embodiment]
EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described by attached drawing. 1 is a side view of the exposure apparatus according to the first embodiment. The exposure apparatus according to the first embodiment exposes the exposed material through an exposure mask having a predetermined mask pattern. The
Moreover, the
The to-
The
In the present embodiment, the
The
The
In the
In the to-
The enlarged view of the 1st
The
The
The
The configuration of the
A
The relationship between the
The positional relationship of the
The hexagon of each
When the
Therefore, the exposure-
The
5 (a) to 5 (c), the image of the
FIG. 5A shows an image of the first
The
5C shows an image of the first
It is preferable that the partial image of the
The composite image which superimposed three images picked up in FIG.5 (a)-(c) is shown to FIG.5 (d). The
In addition, in FIG.5 (d), as an example, the case where the 1st
Next, the operation method of the
In order to image the first
The
When the
As described above, the
Therefore, the center position of the
When the alignment of the
In step S4, the
In the above, with respect to the
Sixteen
As an example, first, four
When the alignment and exposure of each
The
However, in the
In the case of the
In addition, in the case of the
In the
Furthermore, in the
Moreover, since the
In the
[Other embodiment]
As mentioned above, although embodiment of this invention was described, this invention is not limited to embodiment mentioned above, A various deformation | transformation and a change are possible based on the technical idea of this invention. For example, in the
The shapes of the first positioning marks 7 and the second positioning marks 8 are not limited to those shown in Fig. 2C. The mark of any shape may be sufficient as it is a mark which can specify the position of the 1st
The number of the first positioning marks 7 and the second positioning marks 8 is preferably two or more for the exposure area in order to maintain the accuracy of the alignment, but the number is not limited. The arrangement position of the 1st
In the first embodiment, the
In the first embodiment, the
In the first embodiment, the
1 exposure device
2 exposed material
3 light source
4 Exposure Mask
5 Exposure light
6 microlens array
7 1st position alignment mark
8 2nd position alignment mark
10 Imaging Section
12 Image Recognition
16 position alignment control
18 Exposure start timing control
Claims (8)
An exposure mask supported between the light source and the exposed material;
A microlens array disposed between the exposed material and the exposure mask;
In order to align the position of the exposed material and the exposure mask by using the first position alignment mark provided on the exposed material and the second position alignment mark provided on the exposure mask, the exposure mask is connected to the exposure mask through the microlens array. An imaging unit which picks up at least a portion of the formed first alignment marks and the second alignment marks, and moves in a predetermined direction so as not to disturb exposure to the exposed material when the imaging is completed;
An image recognizing unit recognizing at least a portion of the first positioning mark and the second positioning mark captured by the imaging unit;
A position alignment control unit for aligning positions of the exposed material and the exposure mask based on at least a portion of the first position alignment mark recognized by the image recognition unit and position information of the second position alignment mark;
Exposure start timing control part which causes irradiation of the exposure light from the light source to begin before the movement of the image pickup part is completed.
And
The microlens array moves between the first position alignment mark provided on the exposed material and the second position alignment mark provided on the exposure mask while the imaging unit is capturing an image,
The image pickup unit picks up at least a portion of the first alignment mark formed in the exposure mask through the moving microlens array multiple times or continuously together with the second alignment mark,
And the image recognition unit generates a composite image for specifying the position of the first alignment mark relative to the second alignment mark by superimposing the images picked up multiple times or continuously. Exposure apparatus.
And the light source irradiates the exposure light while moving.
The microlens array moves in one direction between the first alignment mark provided on the exposed material and the second alignment mark provided on the exposure mask while the imaging unit is capturing, and the light source is moved in the furnace. While irradiating light light, the exposure apparatus moves together with the light source in the reverse direction of the one direction.
In order to align the position of the exposed material and the exposure mask by using the first position alignment mark provided on the exposed material and the second position alignment mark provided on the exposure mask, the exposure mask is connected to the exposure mask through the microlens array. An imaging step of capturing at least a portion of the formed first alignment marks and a second alignment mark of the exposure mask;
An image recognition step of recognizing at least a portion of the first position alignment mark and the second position alignment mark picked up by the image pickup step;
A position alignment step of aligning the to-be-exposed material and the exposure mask by the position alignment control unit based on at least a part of the first position alignment mark recognized by the image recognition step and position information of the second position alignment mark;
An imaging section moving step of moving the imaging section in a predetermined direction so as not to disturb the exposure to the exposed material after the imaging in the imaging step is finished;
Before the movement of the imaging unit in the imaging unit movement step is completed, the exposure start timing control unit starts irradiation of the exposure light from the light source to the exposed material and the exposure mask that are aligned by the position alignment step. Exposure start step to ensure
Including,
In the imaging step, the microlens array is moved between the first alignment mark provided on the exposed material and the second alignment mark provided on the exposure mask, and the exposure is performed through the microlens array. At least a portion of the first alignment mark formed in the mask is imaged by the imaging unit a plurality of times or continuously with the second alignment mark,
In the image recognition step, the image recognition unit generates a composite image for specifying the position of the first position alignment mark relative to the second position alignment mark by superimposing the images picked up multiple times or continuously. An exposure material manufacturing method characterized by the above-mentioned.
And an exposure step of irradiating the exposure light while the light source is moving.
In the imaging step, the microlens array is moved in one direction between the first alignment mark provided on the exposed material and the second alignment mark provided on the exposure mask,
In the exposing step, the microlens array is moved in the reverse direction of the one direction with the light source.
Applications Claiming Priority (3)
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JPJP-P-2012-001454 | 2012-01-06 | ||
JP2012001454A JP5842251B2 (en) | 2012-01-06 | 2012-01-06 | Exposure apparatus and exposed material manufacturing method |
PCT/JP2013/050011 WO2013103152A1 (en) | 2012-01-06 | 2013-01-04 | Light exposure device and method for manufacturing exposed material |
Publications (2)
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KR20140119697A KR20140119697A (en) | 2014-10-10 |
KR102026107B1 true KR102026107B1 (en) | 2019-09-27 |
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KR1020147018966A KR102026107B1 (en) | 2012-01-06 | 2013-01-04 | Light exposure device and method for manufacturing exposed material |
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JP (1) | JP5842251B2 (en) |
KR (1) | KR102026107B1 (en) |
CN (1) | CN104024943B (en) |
TW (1) | TWI578110B (en) |
WO (1) | WO2013103152A1 (en) |
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CN104702340A (en) * | 2015-02-15 | 2015-06-10 | 长芯盛(武汉)科技有限公司 | Optical transmission terminal |
TW201643557A (en) * | 2015-03-31 | 2016-12-16 | 尼康股份有限公司 | Exposure apparatus, manufacturing method of flat panel display, device manufacturing method, and exposure method |
CN110232867B (en) * | 2019-05-13 | 2022-01-04 | Tcl华星光电技术有限公司 | Mother board exposure structure of display panel |
NL2029773B1 (en) * | 2021-11-16 | 2022-12-30 | Univ Xihua | Composite lithography alignment system and method based on super-resolution imaging of dielectric microspheres |
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JP2003241396A (en) * | 2002-02-19 | 2003-08-27 | Hitachi Electronics Eng Co Ltd | Aligner and method for alignment |
JP2009277900A (en) * | 2008-05-15 | 2009-11-26 | V Technology Co Ltd | Exposure device and photomask |
KR101941323B1 (en) | 2011-08-10 | 2019-01-22 | 브이 테크놀로지 씨오. 엘티디 | Alignment device and alignment mark for optical exposure device |
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JPH09244254A (en) * | 1996-03-13 | 1997-09-19 | Nikon Corp | Exposure device for liquid crystal |
JPH10116774A (en) * | 1996-10-15 | 1998-05-06 | Matsushita Electric Ind Co Ltd | Method and apparatus for exposure |
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JP2004103644A (en) | 2002-09-05 | 2004-04-02 | Sumitomo Heavy Ind Ltd | Apparatus and method for detecting position of approaching mask and wafer |
JP4219645B2 (en) * | 2002-09-12 | 2009-02-04 | シャープ株式会社 | Microlens array exposure method |
JP5382412B2 (en) * | 2008-10-24 | 2014-01-08 | 株式会社ブイ・テクノロジー | Exposure apparatus and photomask |
JP4921512B2 (en) * | 2009-04-13 | 2012-04-25 | キヤノン株式会社 | Exposure method, exposure apparatus, and device manufacturing method |
JP5294490B2 (en) * | 2009-12-22 | 2013-09-18 | 株式会社ブイ・テクノロジー | Photo mask |
-
2012
- 2012-01-06 JP JP2012001454A patent/JP5842251B2/en active Active
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2013
- 2013-01-02 TW TW102100003A patent/TWI578110B/en not_active IP Right Cessation
- 2013-01-04 WO PCT/JP2013/050011 patent/WO2013103152A1/en active Application Filing
- 2013-01-04 KR KR1020147018966A patent/KR102026107B1/en active IP Right Grant
- 2013-01-04 CN CN201380004517.1A patent/CN104024943B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003241396A (en) * | 2002-02-19 | 2003-08-27 | Hitachi Electronics Eng Co Ltd | Aligner and method for alignment |
JP2009277900A (en) * | 2008-05-15 | 2009-11-26 | V Technology Co Ltd | Exposure device and photomask |
KR101941323B1 (en) | 2011-08-10 | 2019-01-22 | 브이 테크놀로지 씨오. 엘티디 | Alignment device and alignment mark for optical exposure device |
Also Published As
Publication number | Publication date |
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JP2013142719A (en) | 2013-07-22 |
KR20140119697A (en) | 2014-10-10 |
TWI578110B (en) | 2017-04-11 |
CN104024943A (en) | 2014-09-03 |
TW201331724A (en) | 2013-08-01 |
CN104024943B (en) | 2016-03-02 |
JP5842251B2 (en) | 2016-01-13 |
WO2013103152A1 (en) | 2013-07-11 |
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