JP5874900B2 - Alignment device for exposure equipment - Google Patents

Description

  The present invention relates to an alignment apparatus for aligning a substrate and a mask in an exposure apparatus using a microlens array.

  2. Description of the Related Art Conventionally, in an exposure apparatus, exposure light is emitted from a light source, the exposure light is irradiated onto a substrate through a mask on which a pattern having a predetermined shape is formed, and the mask pattern is exposed on the substrate. Therefore, in order to expose the pattern at a predetermined position on the substrate with high accuracy, relative alignment between the mask and the substrate is important. For example, in the case where a single substrate is subjected to multiple exposures, misalignment between patterns formed by each exposure causes poor connection of the substrate circuit. It is necessary to align the gaps accurately. For example, Patent Document 1 discloses an exposure apparatus of a proximity exposure method in which a wafer to be exposed is disposed close to a mask. A mark is provided on both the mask and the wafer, and the mask and the wafer are relative to each other using the mark. It is comprised so that it may align.

  On the other hand, recently, an exposure apparatus that projects a mask pattern onto a substrate by a microlens array has been used. FIG. 13 is a schematic diagram showing an exposure apparatus using a microlens array. A mask 2 on which a pattern to be exposed on the substrate 1 is formed is disposed above the substrate 1 to be exposed with an appropriate distance from the substrate 1. A microlens array 3 in which microlenses 4 are two-dimensionally arranged is disposed between the substrate 1 and the mask 2, and exposure light is irradiated from above the mask 2 to the mask 2. 2 is projected onto the substrate 1 by the microlens array 3, and the pattern formed on the mask 2 is transferred by the microlens array 3 as an erecting equal-magnification image to a resist or the like on the substrate surface. .

  FIG. 14 is a view showing the microlens array 3 used in the exposure apparatus. As shown in FIG. 14, the microlens array 3 has, for example, a four-lens configuration and a structure in which four unit microlens arrays 3-1, 3-2, 3-3, 3-4 are stacked. Have Each unit microlens array 3-1 to 3-4 includes an optical system expressed by two convex lenses. Thereby, the exposure light once converges between the unit microlens array 3-2 and the unit microlens array 3-3, and further forms an image on the substrate below the unit microlens array 3-4. That is, an inverted equal magnification image of the mask 2 is formed between the unit micro lens array 3-2 and the unit micro lens array 3-3, and an erect equal magnification image of the mask 2 is formed on the substrate. Image. A polygonal field stop (for example, a hexagonal field stop 31) is disposed between the unit microlens array 3-2 and the unit microlens array 3-3, and the unit microlens array 3-3 and the unit microlens array 3- 4, a circular aperture stop 32 is arranged. The aperture stop 32 limits the NA (numerical aperture) of each microlens, and the hexagonal field stop 31 narrows the field of view to a hexagon near the imaging position. The hexagonal field stop 31 and the aperture stop 32 are provided for each microlens. For each microlens, the light transmission region of the microlens is shaped into a circle by the aperture stop 32 and exposure light is exposed on the substrate. The area is shaped into a hexagon. For example, as shown in FIG. 15, the hexagonal field stop 31 is formed as a hexagonal opening in the aperture stop 32 of the microlens. Therefore, the exposure light transmitted through the microlens array 1 by this hexagonal field stop 31 is irradiated only on the area surrounded by the hexagon shown in FIG. .

  In scan exposure using a microlens array, the mask 2 and the substrate 1 are usually fixed, and the microlens array 3, the exposure light source, and the optical system are integrally moved in a direction perpendicular to the paper surface in FIG. Thus, the exposure light scans over the substrate 1. In this case, it is necessary to provide alignment marks 1a and 2a on the upper surface of the substrate 1 and the lower surface of the mask 2, respectively, and relatively align the substrate 1 and the mask 2 using these alignment marks 1a and 2a as an index. There is.

JP 2004-103644 A

  However, when aligning the substrate 1 and the mask 2 with the alignment marks 1a and 2a, if the substrate 1 and the mask 2 are to be aligned with high accuracy of about ± 1 μm, the alignment marks 1a and 2a are the same. It is necessary to observe with the same camera. That is, if the alignment marks 1a and 2a are observed separately with different cameras, the relative positions of the alignment marks 1a and 2a cannot be guaranteed.

  In the case of proximity exposure as in Patent Document 1, the mask and the substrate are close to each other at about 200 μm, and this distance is within the depth of focus of the camera. Therefore, the mask alignment mark and the substrate alignment mark are simultaneously displayed on the camera. Can be observed. However, in the exposure apparatus using the microlens array 3, since the microlens array 3 needs to be interposed between the substrate 1 and the mask 2, the distance between the substrate 1 and the mask 2, that is, alignment. The gap G between the marks 1a and 2a is about 5 to 15 mm. This interval of 5 to 15 mm cannot be observed simultaneously with a normal camera lens system.

  As shown in FIG. 16, an optical path difference is provided between the reflected light from the alignment mark 1 a of the substrate 1 and the reflected light from the alignment mark 2 a of the mask 2, so that the alignment mark 1 a of the substrate 1 and the alignment of the mask 2 are aligned. It is also conceivable to correct the focus difference from the mark 2a.

As shown in FIG. 16, the gap G between the substrate 1 and the mask 2 is 5 to 15 mm. In this case, considering the visual field and alignment accuracy, the lens magnification needs to be about 4 times. Therefore, the alignment pattern gap G (= 5 to 15 mm) corresponds to 5 to 15 mm × 4 ² = 80 to 240 mm when viewed on the camera side. It is necessary to correct the focus difference of 80 to 240 mm.

  Therefore, in FIG. 16, the light from the light source 20 is converged by the lens 21, reflected by the reflecting mirror 22, and incident on the beam splitter 47 through the lens 23. Then, the light from the beam splitter 47 enters the mask 2 via the lenses 48 and 49, is reflected by the alignment mark 2 a of the mask 2, is incident on the substrate 1, and is reflected by the alignment mark 1 a of the substrate 1. . The light reflected by these alignment marks 1a and 2a is directed to the beam splitter 47, passes through the beam splitter 47, and then enters the beam splitter 44 via the lenses 46 and 45. The reflected light from the alignment marks 1a and 2a is separated into light directed to the beam splitter 41 and light directed to the mirror 43 by the beam splitter 44, and the light directed to the mirror 43 is transmitted to the beam splitter 41 by the mirror 42. Head. Then, the light from the beam splitter 44 is transmitted as it is at the beam splitter 41, and the light from the mirror 42 is reflected and travels to the camera 10. In this way, the light that has passed through the mirrors 43 and 42 from the beam splitter 44 and the light that has reached directly from the beam splitter 44 are detected by the camera 10. At this time, the total length of the optical path from the beam splitter 44 to the mirror 43, the optical path from the mirror 43 to the mirror 42, and the optical path from the mirror 42 to the beam splitter 41 is directly incident on the beam splitter 41 from the beam splitter 44. The length of the optical path is set to be longer by a focus difference of 80 to 240 mm. Therefore, the reflected light from the alignment mark 2a of the mask 2 and traveling on the optical path passing through the mirrors 42 and 43, and the reflected light from the alignment mark 1a of the substrate 1 and directly from the beam splitter 44 to the beam splitter 41. Both of the light traveling in the optical path incident on the laser beam form an image on a CCD (charge coupled device) of the camera 10, and the alignment marks 1 a and 2 a can be simultaneously observed by the camera 10.

  Thus, the focus difference (equivalent to 80 to 240 mm) between the patterns of the alignment marks 1a and 2a on the substrate 1 and the mask 2 can be corrected by dividing it into another optical path. However, when the focus difference is corrected by another optical path as described above, there is a problem that the relative positions of both patterns of the alignment marks 1a and 2a are shifted when an optical axis shift occurs in each optical path. For this reason, this method reduces the alignment accuracy. When the alignment accuracy is lowered, the exposure pattern accuracy is also lowered, which becomes a fatal problem for the recent exposure of a high-definition liquid crystal panel.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an alignment apparatus for an exposure apparatus that can perform alignment between a substrate and a mask with high accuracy.

An alignment apparatus for an exposure apparatus according to the present invention is provided in a scan exposure apparatus using a microlens array that transfers a mask pattern onto a substrate by scan exposure, and aligns the mask and the substrate relative to each other. In the alignment device for
An alignment light source for irradiating alignment light to a substrate alignment mark provided on the substrate and a mask alignment mark provided on the mask;
A microlens array interposed between the substrate and the mask to form the substrate alignment mark or the mask alignment mark on the mask or the substrate as an erect life-size image, respectively,
A camera that captures the substrate alignment mark and the mask alignment mark, one as an image of reflected light and the other as an erect life-size image;
A control device that adjusts the position of the mask and / or the substrate based on the substrate alignment mark and the mask alignment mark imaged by the camera;
Have
The microlens array is
A plurality of unit microlens arrays in which a plurality of microlenses are two-dimensionally arranged and stacked on each other;
A polygonal field stop having a polygonal aperture disposed at a reversal imaging position between the unit microlens arrays;
An aperture stop that limits the numerical aperture between the unit microlens arrays,
The plurality of microlenses are arranged in a direction orthogonal to the scan exposure direction to form a microlens array, and the microlens arrays are arranged in the scan exposure direction and adjacent to the scan exposure direction. Between the micro lens rows of the rows are arranged so as to be biased in a direction orthogonal to the scan exposure direction,
The control device moves the microlens array relative to the substrate and the mask in the scan exposure direction, and the substrate alignment mark by the camera at an interval that is not an integral multiple of the arrangement pitch of the microlens rows. The mask alignment mark image and the mask alignment mark image are captured a plurality of times, the captured plurality of images are superimposed, and the superimposed substrate alignment mark image and mask alignment mark image are used for alignment. And

An alignment apparatus for another exposure apparatus according to the present invention is provided in a scan exposure apparatus using a microlens array that transfers a mask pattern to a substrate by scan exposure, and relatively aligns the mask and the substrate. In an alignment apparatus for an exposure apparatus,
An alignment light source for irradiating alignment light to a substrate alignment mark provided on the substrate and a mask alignment mark provided on the mask;
A microlens array interposed between the substrate and the mask to form the substrate alignment mark or the mask alignment mark on the mask or the substrate as an erect life-size image, respectively,
A camera that captures the substrate alignment mark and the mask alignment mark, one as an image of reflected light and the other as an erect life-size image;
A control device that adjusts the position of the mask and / or the substrate based on the substrate alignment mark and the mask alignment mark imaged by the camera;
Have
The microlens array is
A plurality of unit microlens arrays in which a plurality of microlenses are two-dimensionally arranged and stacked on each other;
A polygonal field stop having a polygonal aperture disposed at a reversal imaging position between the unit microlens arrays;
An aperture stop that limits the numerical aperture between the unit microlens arrays,
The plurality of microlenses are arranged in a direction orthogonal to the scan exposure direction to form a microlens array, and the microlens arrays are arranged in the scan exposure direction and adjacent to the scan exposure direction. Between the micro lens rows of the rows are arranged so as to be biased in a direction orthogonal to the scan exposure direction,
The control device moves the microlens array relative to the substrate and the mask in a scanning exposure direction, and continuously moves the image of the substrate alignment mark and the image of the mask alignment mark by the camera. The image of the substrate alignment mark and the image of the mask alignment mark that are continuously imaged are used for alignment.

  In the alignment apparatus for an exposure apparatus according to the present invention, for example, one of the substrate alignment mark and the mask alignment mark has a frame shape, and the other has a rectangular shape positioned at the center of the frame during alignment. Can be configured.

  The alignment light source can be configured to emit alignment light coaxially with an optical axis of light detected by the camera, for example.

  In the alignment apparatus for an exposure apparatus according to the present invention, for example, the microlens array can be shared with the microlens array for exposure.

  In the alignment apparatus for an exposure apparatus according to the present invention, when the alignment light is irradiated onto the mask alignment mark and the substrate alignment mark by the alignment light source, the alignment light is transmitted through the mask and irradiated onto the substrate. Then, the reflected light is imaged as an erecting equal-magnification image of the substrate alignment mark on the mask by the microlens array. Alternatively, the alignment light is transmitted through the substrate, irradiated onto the mask, reflected by the mask alignment mark on the mask, and then reflected light is formed on the substrate as an erecting equal-magnification image of the mask alignment mark by the microlens array. Image. In the present invention, when the alignment light is irradiated onto the substrate alignment mark and the mask alignment mark from below the substrate by the alignment light source, the substrate is made of a light-transmitting material such as PI (polyimide) and ITO (tin-doped indium oxide). In this case, the alignment light is transmitted through the substrate, irradiated onto the mask, reflected by the mask alignment mark on the mask, and then reflected light is erected at the same size as the mask alignment mark on the substrate by the microlens array. It forms as an image. Therefore, the substrate alignment mark and the mask alignment mark can be captured by the camera on the mask or on the substrate, one as an image of reflected light and the other as an erecting equal-magnification image, and the gap G between the substrate and the mask. The focus difference on the camera side due to this is zero. Therefore, even when the optical axis of the alignment light is tilted, the relative position between the alignment marks detected by the camera does not change, and the alignment between the substrate and the mask can be performed with high accuracy. For example, in the camera, although the substrate and the mask are aligned, the camera mistakenly observes that the substrate is not aligned, or the substrate and the mask are not aligned. , Misalignment can be prevented when alignment is achieved. In the present invention, the control device adjusts the position of the mask and / or the substrate so that the substrate alignment mark detected by the camera matches the mask alignment mark. Can be done with precision.

  In the present invention, the image formed by the microlens array becomes an image corresponding to the shape of the opening by the polygonal field stop disposed at the reversal image forming position between the unit microlens arrays. In some cases, the edge of the alignment mark cannot be detected, and the detected alignment mark cannot be used for alignment between the substrate and the mask. However, in the present invention, the microlens array for forming an erecting equal-magnification image of the alignment mark has a microlens array in which a plurality of microlenses are arranged in a direction perpendicular to the scan exposure. A plurality of rows are arranged in the scan exposure direction, and the two microlens rows adjacent to each other in the scan exposure direction are arranged so as to be biased in a direction perpendicular to the scan exposure direction. The controller moves the scanning exposure direction relative to the substrate and the mask. Therefore, the images of both alignment marks are taken by the camera a plurality of times at intervals that are not an integral multiple of the arrangement pitch of the microlens rows, and the taken alignment mark images are superimposed or continuously taken as a moving image. Thus, the edge of the alignment mark imaged by the microlens array can be reliably detected, and the detected alignment mark can be used for alignment between the mask and the substrate.

(A) thru | or (c) were the images which were picked up with the figure which shows the image of the board | substrate alignment mark detected via a polygonal field stop with a microlens array, and the camera in the alignment apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the state which overlap | superposed the image of the board | substrate alignment mark. (A) is a figure which shows the alignment apparatus for exposure apparatuses which concerns on 1st Embodiment of this invention, (b) is a figure which shows the relative positional relationship of the alignment mark detected. (A), (b) is a figure which shows the case where the optical path of alignment light inclines in the exposure apparatus shown in FIG. It is a figure which shows the alignment apparatus for exposure apparatuses which concerns on the comparative example of this invention. It is a figure which shows the optical path of alignment light in the alignment apparatus which concerns on the comparative example of this invention. (A) thru | or (d) is a figure which shows the case where the micro lens array for alignment is not provided in the alignment apparatus which concerns on 1st Embodiment. (A) thru | or (d) are the board | substrate alignment imaged as a moving image continuously with the image of the board | substrate alignment mark detected via a polygonal field stop, and the camera in the alignment apparatus which concerns on 2nd Embodiment of this invention. It is a figure which shows the image of a mark. (A) is a figure which shows the alignment apparatus for exposure apparatuses which concerns on 3rd Embodiment of this invention, (b) is a figure which shows the relative positional relationship of the alignment mark detected. (A) is a figure which shows the alignment apparatus for exposure apparatuses which concerns on 4th Embodiment of this invention, (b) is a figure which shows the relative positional relationship of the alignment mark detected. (A), (b) is a figure which shows the case where the optical path of alignment light inclines in the exposure apparatus shown in FIG. (A) is a figure which shows the alignment apparatus for exposure apparatuses which concerns on 5th Embodiment of this invention, (b) is a figure which shows the relative positional relationship of the alignment mark detected. (A) is a figure which shows the alignment apparatus for exposure apparatuses which concerns on 6th Embodiment of this invention, (b) is a figure which shows the relative positional relationship of the alignment mark detected. It is a figure which shows the exposure apparatus which uses a micro lens array. It is sectional drawing which shows arrangement | positioning of a unit micro lens array. It is a figure which shows the aperture shape of a micro lens. It is a figure which shows the alignment apparatus which provides an optical path difference and absorbs the gap between a board | substrate and a mask.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. FIGS. 1A to 1C are diagrams showing a substrate alignment mark image detected through a polygonal field stop together with a microlens array and a camera in the alignment apparatus according to the first embodiment of the present invention. FIG. 2A is a diagram showing a state in which the images of the substrate alignment marks imaged in FIG. 2 are superimposed, FIG. 2A is a diagram showing an alignment apparatus for an exposure apparatus according to the first embodiment of the present invention, and FIG. It is a figure which shows the relative positional relationship of the alignment mark made. As shown in FIG. 2, in this embodiment, an exposure apparatus provided with an alignment apparatus is a microlens array 3 between a substrate 1 and a mask 2 as in a conventional scan exposure apparatus using a microlens array. The exposure light emitted from the exposure light source 8 is transmitted through the pattern formed on the mask 2, and an erecting equal-magnification image of the pattern is formed on the substrate by the microlens array 3. Then, the microlens array 3, the exposure light source, and the optical system are integrally moved relative to the mask 2 and the substrate 1 in a direction perpendicular to the paper surface in FIG. 2 (hereinafter referred to as a scan exposure direction). The exposure light scans on the substrate 1 and the pattern of the mask 2 is transferred onto the substrate 1. In this exposure apparatus, the alignment apparatus is used for relative alignment between the substrate 1 and the mask 2.

The alignment apparatus according to the present embodiment irradiates alignment light from above the mask 2 onto the substrate alignment mark 1 a provided on the substrate 1 and the mask alignment mark 2 a provided on the mask 2 above the mask 2. An alignment light source 5 is provided. As shown in FIG. 2A, in the present embodiment, the alignment light source 5 is built in a one-focus type coaxial episcopic microscope together with a camera 6 that detects the substrate alignment mark 1a and the mask alignment mark 2a. . The alignment light source 5 is configured to emit alignment light coaxially with the optical axis of the light detected by the camera 6. As the alignment light source 5, laser light or lamp light transmitted through an interference filter can be used. As the lamp light source, for example, a halogen lamp is preferably used because the cost can be reduced. The alignment light source 5 may be provided separately from the camera 6. The light emitted from the alignment light source 5 is applied to the mask 2 and the substrate 1 through an optical system such as a reflecting mirror and a beam splitter.

  Similarly to the conventional microlens array shown in FIG. 14, the microlens array 3 has, for example, a four-lens eight-lens configuration, and four unit microlens arrays 3-1, 3-2, 3-3, 3- 4 has a laminated structure. Each unit microlens array 3-1 to 3-4 includes a plurality of microlenses 4 arranged two-dimensionally. For example, in the unit microlens arrays 3-1 to 3-4, a plurality of microlens rows in which a plurality of microlenses are arranged are arranged in a direction orthogonal to the arrangement direction. The microlenses of the adjacent microlens rows are offset from each other in the row direction. For example, one microlens row group is configured by three rows of microlens rows. The microlens array 3 is arranged in the exposure apparatus and the alignment apparatus so that the arrangement direction of the microlenses in each microlens array is perpendicular to the relative scan exposure direction with respect to the substrate 1 and the mask 2. . In the present embodiment, the microlens array 3 is moved between the substrate alignment mark 1a and the mask alignment mark 2a when the relative alignment between the substrate 1 and the mask 2 is performed. 3 is moved during exposure and during alignment, and the microlens array 3 for exposure is shared and used for alignment.

  The exposure apparatus is provided with a drive device (not shown) for moving the microlens array 3, for example, and is controlled by a control device. At the time of exposure, the control device controls the microlens array 3 to move in the scan exposure direction integrally with the light source 8. Further, at the time of alignment, the control device controls the microlens array 3 to move in the scan exposure direction in a state in which the alignment light is irradiated, so that the light reflected from the substrate 1 is microlens. Corresponding to the hexagonal aperture of the hexagonal field stop 31 of the array 3, it is configured to be detected from the camera 6 side. In the present embodiment, the moving direction of the microlens array 3 is the same direction during exposure and during alignment.

  The mask 2 is provided with, for example, a frame-shaped mask alignment mark 2a, and the substrate 1 is provided with, for example, a rectangular substrate alignment mark 1a that is smaller than the mask alignment mark 2a. When the substrate 1 and the mask 2 are in a predetermined positional relationship during alignment, as shown in FIG. 2B, the substrate alignment mark 1a detected by the camera 6 is positioned at the center of the mask alignment mark 2a. To do.

  In the present embodiment, when the substrate 1 and the mask 2 are aligned, the microlens array 3 forms an erecting equal-magnification image reflected from the substrate alignment mark 1 a on the mask 2 and above the mask 2. The reflected light reflected from the mask alignment mark 2a and the erecting equal-magnification image of the substrate alignment mark 1a imaged on the mask 2 are simultaneously detected by the camera 6 provided in FIG.

  As shown in FIG. 2A, the camera 6 is connected to a second control device 9 that controls the position of the mask 2, and the second control device 9 determines the substrate 1 based on the detection result by the camera 6. When the alignment between the mask 2 and the mask 2 is necessary, the mask 2 is moved. For example, when the position of the substrate alignment mark 1a detected by the camera 6 is deviated from the center of the frame-shaped mask alignment mark 2a, the second controller 9 determines that the substrate alignment mark 1a is the mask alignment mark 2a. The mask 2 is moved so as to be positioned at the center. 2A, the second control device 9 is connected to, for example, a stage on which the substrate 1 is placed and moves the substrate 1 to move the substrate 1 and the mask. 2 may be configured. Alternatively, the second control device 9 may be configured to align the substrate 1 and the mask 2 by moving both the substrate 1 and the mask 2.

  At the time of alignment, the reflected light reflected from the substrate alignment mark 1a by the microlens array 3 arranged between the mask alignment mark 2a and the substrate alignment mark 1a is transmitted through the microlens array 3 and the mask 2 An erecting equal-magnification image of the substrate alignment mark 1a is formed on the top. Therefore, a gap G of 5 to 15 mm actually exists between the substrate 1 and the mask 2, but the focus difference on the camera 6 side caused by this gap G becomes zero. Therefore, the alignment marks 1a and 2a of the substrate 1 and the mask 2 having different distances from the sensor of the camera 6 can be simultaneously imaged on the camera 6, and the positions of the substrate 1 and the mask 2 are adjusted using each alignment mark as an index. Then, the alignment between the substrate 1 and the mask 2 can be performed with high accuracy. Further, by setting the focus difference on the camera side to 0, as shown in FIG. 3A, the relative positions of the alignment marks do not change even when the optical axis of the alignment light is inclined (FIG. 3 ( b)) An extremely high alignment accuracy can be obtained.

  For example, a hexagonal field stop 31 as shown in FIGS. 14 and 15 is arranged at the reversal imaging position between the unit microlens arrays of the microlens array 3. Therefore, the image of the substrate alignment mark 1 a formed on the mask 2 is an image corresponding to the opening of the hexagonal field stop 31. Therefore, instantaneously, the edge of the substrate alignment mark 1a may not be at a position corresponding to the opening of the hexagonal field stop 31, and the edge of the substrate alignment mark 1a cannot be detected from the camera 6 side. There are cases where the center position of the mark 1a cannot be specified and the detected image cannot be used for alignment between the substrate 1 and the mask 2.

  However, in the present embodiment, the microlens array 3 includes a plurality of microlenses arranged in a direction orthogonal to the scan exposure direction to form a microlens row, and a plurality of microlens rows are arranged in the scan exposure direction. The two microlens rows adjacent to each other in the scan exposure direction are arranged so as to be deviated in a direction perpendicular to the scan exposure direction. During alignment, the controller performs scan exposure. Controlled to move in the direction. Then, the control device captures the images of both alignment marks with the camera a plurality of times at intervals that are not an integral multiple of the arrangement pitch of each microlens array of the microlens array 3, and superimposes the captured images. The images of the superimposed substrate alignment mark 1a and mask alignment mark 2a are used for alignment. Therefore, even when the polygonal field stop is provided, the edge of the substrate alignment mark 1a can be reliably identified. That is, as shown in FIGS. 1A to 1C, the edge of the image of the substrate alignment mark 1a detected by the camera 6 may not be detected instantaneously. For example, as shown in FIG. 1A, the left edge of the alignment mark 1 a cannot be detected by the camera 6. However, while the control device moves the microlens array 3 in the scan exposure direction, the camera 6 causes the image of the substrate alignment mark 1a to be multiple times at intervals that are not an integral multiple of the arrangement pitch of the microlens rows of the microlens array 3. As shown in the drawings on the right side of FIG. 1A to FIG. 1C, the edge of the substrate alignment mark 1a can be reliably detected by superimposing a plurality of captured images, and the substrate 1 And the mask 2 can be aligned. At this time, when the alignment marks 1a and 2a are imaged by the camera 6 at an interval that is an integral multiple of the arrangement pitch of the microlens rows, the image of the substrate alignment mark 1a is orthogonal to the scan exposure direction by multiple imaging. It is detected so that it may line up in the direction. Therefore, when the edge in the scanning direction of the substrate alignment mark 1a cannot be detected by the first imaging, the edge in the scanning exposure direction of the substrate alignment mark 1a cannot be detected even in the second and subsequent imaging. The number of times of imaging by the camera 6 is preferably equal to or greater than the number of rows of microlens rows constituting the microlens row group.

  Next, the operation of the alignment apparatus according to the present embodiment configured as described above will be described. The microlens array 3 is positioned below the pattern area provided on the mask 2 during exposure. First, the microlens array 3 is moved in the right direction in FIG. 2, and is moved between the substrate alignment mark 1a and the mask alignment mark 2a. Next, alignment light is emitted from an alignment light source 5 such as a halogen lamp built in the camera 6 and the control device controls the microlens array 3 to move in the scan exposure direction. The alignment light is first applied to the mask 2 via an optical system such as a reflecting mirror and a beam splitter. The alignment light irradiated on the mask 2 is reflected by the mask alignment mark 2a. On the other hand, the alignment light transmitted through the mask 2 is transmitted through the microlens array 3 disposed below the mask 2 and irradiated onto the substrate 1.

  Then, the reflected light reflected by the substrate alignment mark 1 a passes through the microlens array 3 and enters the mask 2 again, and an erecting equal-magnification image of the substrate alignment mark 1 a is formed on the mask 2. Then, each reflected light is incident on the sensor of the camera 6 and an erecting equal-magnification image of the mask alignment mark 2a and the substrate alignment mark 1a formed on the mask 2 is detected. Thus, in this embodiment, since the camera 6 detects an erecting equal-magnification image of the substrate alignment mark 1a imaged on the mask 2, in practice, between the substrate 1 and the mask 2, There is a gap G of 5 to 15 mm, but on the camera 6 side, the focus difference due to this gap G is zero.

  The control device causes the camera 6 to pick up an image of the substrate alignment mark 1a formed on the mask 2 together with the mask alignment mark 2a a plurality of times (FIG. 1). That is, since the hexagonal field stop 31 is provided in the reversal imaging position between the unit microlens arrays in the microlens array 3, the image of the substrate alignment mark 1a imaged on the mask 2 is hexagonal. An image corresponding to the opening of the field stop 31 is obtained, and in some cases, the edge of the substrate alignment mark 1a cannot be detected instantaneously from the camera 6 side. For example, as shown in FIG. 1A, the left edge of the substrate alignment mark 1a cannot be detected, and the center position of the substrate alignment mark 1a cannot be specified. There are cases where it cannot be used for alignment with the mask 2. However, in the present embodiment, the substrate alignment marks are spaced at intervals that are not an integral multiple of the arrangement pitch of each microlens array of the microlens array 3 by the camera 6 while the microlens array 3 is moved in the scan exposure direction by the control device. The image of 1a is taken a plurality of times. Then, the control device superimposes the plurality of captured images and uses the superimposed images of the alignment marks 1a and 2a for alignment. Thereby, the edge of the substrate alignment mark 1a can be reliably detected. Therefore, the center position of the substrate alignment mark 1a can be reliably specified, and can be used for highly accurate alignment.

  Then, the substrate 1 and the mask 2 are aligned by the substrate and mask alignment marks 1a and 2a detected by the camera 6. For example, when the position of the substrate alignment mark 1a detected by the camera 6 is deviated from the center of the frame-shaped mask alignment mark 2a, the second control device 9 sets the substrate alignment mark 1a to the mask alignment mark 2a. The mask 2 is moved so as to be positioned at the center, and the substrate 1 and the mask 2 are aligned. In this embodiment, since the focus difference on the camera 6 side caused by the gap G between the substrate 1 and the mask 2 is 0, the alignment marks 1a and 2a of the substrate 1 and the mask 2 are used as indices, and The alignment with the mask 2 can be performed with high accuracy.

  Further, since an erecting equal-magnification image of the substrate alignment mark 1a is formed on the mask 2, as shown in FIG. 3 (a), it is detected by the camera 6 even when the optical axis of the alignment light is inclined. The relative positions of the alignment marks 1a and 2a of the substrate and the mask do not change from the case of FIG. 2B where the alignment light is irradiated perpendicularly to the substrate 1 and the mask 2, as shown in FIG. The alignment accuracy is not lowered by the inclination of the optical axis of the alignment light.

  Hereinafter, the above effect when the optical axis of the alignment light is tilted will be described in detail in comparison with the comparative example. FIG. 4 is a view showing an alignment apparatus for an exposure apparatus according to a comparative example of the present invention, and FIG. 5 is a view showing an optical path of alignment light in the alignment apparatus according to the comparative example of the present invention. As shown in FIGS. 4 and 5, this alignment apparatus is an alignment apparatus using a bifocal type coaxial epi-illumination. For example, a first light source 27 that emits long wavelength light and a short wavelength light are emitted. The long-wavelength light from the first light source 27 is reflected by the reflecting mirror 29, then travels toward the beam splitter 28, and the short-wavelength light from the second light source 26 is reflected by the second light source 26. With this beam splitter 28, it gathers with the long wavelength light from the first light source 27. These collective lights are converged by the lens 30, reflected by the beam splitter 24, pass through the lens 25, and then travel toward the mask 2 and the substrate 1. The collective light is incident on the mask 2 and the substrate 1 perpendicularly to the surface thereof, reflected by the alignment mark 2a of the mask 2 and the alignment mark 1a of the substrate 1, and returns to the same optical path as the incident optical path. The reflected light passes through the beam splitter 24, enters the camera 20 through the lenses 23 and 22 and the filter 21. Therefore, the reflecting mirror 29 and the beam splitter 28 constitute a first optical system that collects the long wavelength light and the short wavelength light emitted from the first and second light sources 27 and 26 in the same optical path, and the lens 30. The beam splitter 24 and the lens 25 constitute a second optical system that irradiates the collective light from the first optical system onto the mask 2 and the substrate 1 perpendicularly to the surfaces thereof. The lens 25, the beam splitter 24, and the lens 23, the lens 22 constitutes a third optical system that guides the reflected light reflected by the mask 2 and the alignment marks 2a, 1a of the substrate 1 to the camera 20 after returning the same optical path as the second optical system.

  In this comparative example, when, for example, red light having a wavelength of 670 nm is emitted from the first light source 27 and blue light having a wavelength of, for example, 405 nm is emitted from the second light source 26, these lights are collected by the beam splitter 28. Then, the same optical path travels to the camera 20. That is, as shown in FIG. 4, the collective light travels from the beam splitter 24 toward the mask 2 and the substrate 1 and enters the mask 2 and the substrate 1 perpendicularly to the surface thereof.

  After that, the reflected light of the collective light reflected by the alignment mark of the mask 2 and the alignment mark of the substrate 1 passes through the same optical path as the incident light, travels straight through the beam splitter 24, passes through the filter 21, and reaches the sensor of the camera 20. Incident. At this time, the collective light passes through the optical system composed of the same lenses 25, 23, and 22. Therefore, in the case of such the same lens, the blue light (wavelength 405 nm) has a short focal length, and the red light (wavelength 670 nm) is the focal point. The distance is long. Therefore, if the optical constants and the like of the lenses 25, 23, and 22 are appropriately set, the blue light component of the light incident on the sensor of the camera 20 and reflected by the alignment mark of the mask 2 is the sensor of the camera 20. The light reflected by the alignment mark on the substrate 1 farther from the camera 20 can be focused at the sensor of the camera 20. In the alignment apparatus of the comparative example configured as described above, the gap G between the substrate 1 and the mask 2 is about 5 to 15 mm, but the red light and the blue light of the incident light to the camera 20 are different. Since the focal point is focused on the sensor through the length, for example, 5 mm of the gap G is absorbed, and the alignment marks 1a and 2a of both the substrate 1 and the mask 2 can be focused on the sensor of the camera 20, and Both the alignment pattern and the alignment pattern on the mask 2 can be simultaneously observed by focusing the sensor.

  In the alignment apparatus of the comparative example configured as described above, as shown in FIG. 6A, when the alignment light is irradiated perpendicularly to the substrate 1 and the mask 2, as shown in FIG. In addition, a predetermined alignment accuracy is obtained. However, as shown in FIG. 6C, when the optical axis of the alignment light is inclined, the optical path of the reflected light changes, and the substrate 1 and the mask 2 are caused by the gap G between the substrate 1 and the mask 2. Even in a predetermined positional relationship, as shown in FIG. 6D, the positions of the alignment marks 1a and 2a detected on the camera 6 side are shifted. Then, in practice, the alignment mark 2a and the alignment mark 1a are coincident in position, and the camera 6 is not aligned even though the mask 2 and the substrate 1 are aligned. It will be mistakenly observed. In other words, although the substrate 1 and the mask 2 are not aligned, the camera 6 may cause the alignment mark 1a to be observed as being in the center of the alignment mark 2a. If the mask 2 is aligned, it will be mistakenly observed.

  On the other hand, in the present embodiment, an erecting equal-magnification image of the substrate alignment mark 1a is formed on the mask 2 by the microlens array 3, and therefore, as shown in FIG. 3 (b), the relative positions of the substrate and mask alignment marks 1a and 2a detected by the camera 6 do not change, and extremely high alignment accuracy can be obtained. Can do.

  In the comparative example, it is necessary to provide two alignment light sources having different wavelengths, and the structure and the alignment method are slightly complicated. However, in the alignment apparatus according to the present embodiment, an exposure micro light is used during alignment. By simply moving the lens array 3 between the substrate alignment mark 1a and the mask alignment mark 2a, the focus difference on the camera 6 side caused by the gap G between the substrate 1 and the mask 2 is reduced to 0, and high alignment accuracy is achieved. As a result, only one alignment light source is required.

  After the alignment between the substrate 1 and the mask 2, the microlens array 3 is moved leftward in FIG. 2 and moved below the pattern area provided in the mask 2, and then exposure light is emitted, Scan exposure by the microlens array 3 is started. In the present embodiment, as described above, since high alignment accuracy is obtained, the exposure accuracy in scan exposure can be kept extremely high.

  In addition, the shape of the alignment marks 1a and 2a of the substrate and mask in this embodiment is an example, and the alignment between the substrate 1 and the mask 2 can be performed by detecting each alignment mark 1a and 2a with the camera 6. As long as the present invention is not limited by the shape of the alignment marks 1a and 2a.

  In the present embodiment, the alignment light source 5 is built in the microscope together with the camera 6, and the case where the alignment light is configured to be emitted coaxially with the optical axis of the light detected by the camera 6 will be described. However, in the present invention, an erecting equal-magnification image of one of the substrate 1 and the mask 2 is formed on the other, and this is detected by the camera 6, so that the optical axis of the light emitted from the alignment light source 5 is the camera The optical axis of the reflected light detected at 1 may not be coaxial.

  Next, an alignment apparatus for an exposure apparatus according to the second embodiment of the present invention will be described. FIGS. 7 (a) to 7 (d) are images of the substrate alignment mark detected through the polygonal field stop and continuously captured as a moving image by the camera in the alignment apparatus according to the second embodiment of the present invention. It is a figure which shows the image of the done substrate alignment mark. The present embodiment is different from the first embodiment in that the camera 6 continuously captures an erecting equal-magnification image of the substrate alignment mark 1a formed on the mask 2 during alignment. FIG. 7 shows, as an example, a state in which the microlens rows of the microlens array 3 arranged in the scan exposure direction are moved by the arrangement pitch in the scan exposure direction.

  In the present embodiment, at the time of alignment, the control device continuously captures erecting equal-magnification images of the substrate alignment marks 1a formed on the mask 2 by the camera 6 while moving the microlens array 3. Thus, as shown in FIGS. 7B to 7D, the image of the substrate alignment mark 1a formed on the mask 2 corresponding to the opening of the hexagonal field stop 31 is obtained by scanning. The image is detected so as to extend in a strip shape. For example, as shown in FIG. 7, when the microlens array 3 is one in which three microlens rows are arranged in the scan exposure direction to form one microlens group, the imaging time by the camera 6 is set. Is set to be equal to or longer than the time during which the microlens array 3 is moved by 3 pitches of the arrangement pitch of the microlens rows, so that the entire substrate alignment mark 1a is detected on the camera 6 side as shown in FIG. be able to. Therefore, in the present embodiment, the center position of the substrate alignment mark 1a can be detected with higher accuracy than in the first embodiment.

  Next, an alignment apparatus for an exposure apparatus according to a third embodiment of the present invention will be described. FIG. 8A is a view showing an alignment apparatus for an exposure apparatus according to the third embodiment of the present invention, and FIG. 8B is a view showing a relative positional relationship of detected alignment marks. In the first embodiment and the second embodiment, the case where the microlens array 3 for exposure is moved during exposure and during alignment and a single microlens array is shared for exposure and alignment is described. However, as shown in FIG. 8, in the present embodiment, the microlens array 3 is provided with a size that includes an exposure position irradiated with the exposure light and an alignment position irradiated with the alignment light. Yes. About another structure, it is the same as that of 1st Embodiment.

  As in the present embodiment, one shared microlens array 3 is composed of a microlens array having a size including an exposure position and an alignment position, so that the microlens array 3 can be used during exposure and during alignment. There is no need to move the. Further, it is possible to share a configuration in which the microlens array 3 is moved during exposure and alignment, for example, a driving device. Other effects are the same as those of the first embodiment.

  As in the second embodiment, the image of the substrate alignment mark 1a formed on the mask 2 by the camera 6 is continuously moved together with the image of the mask alignment mark 2a while moving the microlens array 3 during alignment. By configuring so as to capture the image, the same effect as the second embodiment can be obtained.

  Next, an alignment apparatus for an exposure apparatus according to a fourth embodiment of the present invention will be described. FIG. 9A is a view showing an alignment apparatus for an exposure apparatus according to the third embodiment of the present invention, FIG. 9B is a view showing the relative positional relationship of detected alignment marks, and FIG. , (B) is a view showing a case where the optical path of the alignment light is inclined in the exposure apparatus shown in FIG. As shown in FIG. 9, in this embodiment, the microlens array includes two (first) microlens arrays 3 for exposure and two (second) microlens arrays 7 for alignment. Yes. The second microlens array 7 has the same optical characteristics as the (first) microlens array 3. Other configurations are the same as those of the first embodiment.

  Also in this embodiment, an erecting equal-magnification image of the substrate alignment mark 1a can be formed on the mask 2, and the camera 6 side caused by the gap G of 5 to 15 mm between the substrate 1 and the mask 2 As in the first embodiment, alignment between the substrate 1 and the mask 2 can be performed with high accuracy. Further, as shown in FIG. 10, even when the optical axis of the alignment light is inclined, the relative position between the alignment marks does not change, and extremely high alignment accuracy can be obtained. Further, in the microlens array, the microlens array 3 for exposure and the microlens array 7 for alignment are configured separately, so that, similarly to the third embodiment, at the time of exposure and at the time of alignment, There is no need to move the microlens array 3.

  Also in the present embodiment, during alignment, the control device moves the micro lens array 7 while the micro lens array 7 is moved, and the image of the substrate alignment mark 1a formed on the mask 2 by the camera 6 together with the mask alignment mark 2a. The same effect as that of the first embodiment can be obtained by imaging a plurality of times at intervals that are not an integral multiple of the arrangement pitch of each microlens array of the lens array 3 and using the captured alignment mark images for alignment. It is done. Further, by moving the microlens array 7, the image of the substrate alignment mark 1 a formed on the mask 2 by the camera 6 is continuously taken together with the image of the mask alignment mark 2 a, so that the second The same effect as the embodiment can be obtained.

  In the present embodiment, the microlens array 3 for exposure and the microlens array 7 for alignment are provided, so that the scan exposure direction of the microlens array 3 during exposure and the microlens array 7 during alignment are aligned. The moving direction can be different. That is, the effect of the present invention can be obtained if the movement direction of the microlens array 7 by the second driving device is a direction orthogonal to the arrangement direction of the microlenses constituting the microlens array.

  Next, an alignment apparatus for an exposure apparatus according to a fifth embodiment of the present invention will be described. FIG. 11A is a view showing an alignment apparatus for an exposure apparatus according to the fourth embodiment of the present invention, and FIG. 11B is a view showing a relative positional relationship of detected alignment marks. As shown in FIG. 11, in this embodiment, the alignment light source 5 and the camera 6 are disposed below the substrate 1 and irradiate alignment light from below the substrate. The substrate alignment mark 1b has a frame shape, and the mask alignment mark 2b has a rectangular shape. In the present embodiment, the substrate 1 to be exposed is made of a light-transmitting material such as PI (polyimide) and ITO (tin-doped indium oxide), for example, and alignment light is transmitted through the substrate 1 and mask 2 Is irradiated. That is, in the present embodiment, when the substrate 1 is made of a light transmissive material, the irradiation direction of the alignment light and the shapes of the alignment marks 1b and 2b of the substrate 1 and the mask 2 are different from those of the first embodiment. The configuration of is the same as that of the first embodiment.

Also in this embodiment, the microlens array 3 for exposure is moved between the mask alignment mark 2b and the substrate alignment mark 1b when the relative alignment between the substrate 1 and the mask 2 is performed. The microlens array 3 is used by being moved during exposure and alignment. At the time of alignment, the reflected light reflected from the mask alignment mark 2b by the microlens array 3 is transmitted through the microlens array 3, and an erecting equal-magnification image of the mask alignment mark 2b is formed on the substrate 1. Imaged. At this time, the image of the mask alignment mark 2b formed on the substrate 1 by the hexagonal field stop 31 provided at the reverse imaging position between the unit microlens arrays of the microlens array 3 It becomes an image corresponding to the opening. Therefore, instantaneously, the edge of the mask alignment mark 2b cannot be detected from the camera 6 side, the center position of the mask alignment mark 2b cannot be specified, and the image of the captured alignment mark 2b is used as the substrate 1 and the mask 2 In some cases, it cannot be used for alignment. However, in the microlens array 3, a plurality of microlenses are arranged in a direction orthogonal to the scan exposure direction to form a microlens row, and the microlens row is arranged in a plurality of rows in the scan exposure direction. The two microlens rows adjacent to each other in the scan exposure direction are arranged so as to be deviated in a direction orthogonal to the scan exposure direction, and are moved in the scan exposure direction by the control device during alignment. Be controlled. Therefore, also in this embodiment, the control device displays the image of the mask alignment mark 2b imaged on the substrate 1 by the camera 6 together with the substrate alignment mark 1b of the arrangement pitch of each microlens array of the microlens array 3. By taking a plurality of images at intervals that are not an integral multiple, superimposing a plurality of captured images, and using the superimposed image of the substrate alignment mark 1 b and the mask alignment mark 2 b for alignment, Even when the mask alignment mark 2 is provided, the edge of the mask alignment mark 2 b can be reliably identified and used for alignment between the substrate 1 and the mask 2.

Further, a gap G of 5 to 15 mm exists between the substrate 1 and the mask 2, and the focus difference on the camera 6 side caused by this gap G becomes zero. Therefore, also in the present embodiment, as in the first to fourth embodiments, the alignment between the substrate 1 and the mask 2 can be performed with high accuracy using the alignment marks 1b and 2b of the substrate 1 and the mask 2 as indices. it can. For example, when the position of the mask alignment mark 2b detected by the camera 6 is deviated from the center of the frame-shaped substrate alignment mark 1b, the second control device 9 sets the mask alignment mark 2b to the position of the substrate alignment mark 1b. The mask 2 is moved so as to be positioned at the center, and the substrate 1 and the mask 2 are aligned. Further, for forming an erect image of the mask alignment marks 2 b on the substrate 1, even when the optical axis of the alignment light is inclined, the substrate and the mask to be detected by the camera 6 the alignment marks 1b and 2b The relative position does not change from the case where the alignment light is irradiated perpendicularly to the substrate 1 and the mask 2, and extremely high alignment accuracy can be obtained.

Also in this embodiment, at the time of alignment, the control device, while moving the microlens array 3, the substrate alignment marks 1 b image of imaged on the mask 2 by the camera 6, the mask alignment marks 2 b image of In addition, the same effect as that of the second embodiment can be obtained by configuring so as to continuously capture images.

  In addition, by providing the microlens array 3 with a size that includes the exposure position irradiated with the exposure light and the alignment position irradiated with the alignment light, as in the third embodiment, during exposure and during alignment. Thus, there is no need to move the microlens array 3.

  Next, an alignment apparatus for an exposure apparatus according to a sixth embodiment of the present invention will be described. 12A is a view showing an alignment apparatus for an exposure apparatus according to the sixth embodiment of the present invention, and FIG. 12B is a view showing a relative positional relationship of detected alignment marks. As shown in FIG. 12, in the present embodiment, as in the fourth embodiment, the microlens array is provided with two microlens arrays 3 for exposure and two microlens arrays 7 for alignment. The alignment microlens array 7 has the same optical characteristics as the exposure microlens array 3. Thereby, in this embodiment, the effect similar to 4th Embodiment is acquired.

  Also in this embodiment, as in the fourth embodiment, the scanning exposure direction of the microlens array 3 during exposure and the moving direction (first direction) of the microlens array 7 during alignment are different. Can do. That is, the effect of the present invention can be obtained if the movement direction of the microlens array 7 by the control device is a direction orthogonal to the arrangement direction of the microlenses constituting the microlens array.

1: substrate, 2: mask, 3: (first) micro lens array, 4: micro lens, 5: alignment light source, 6, 20: camera, 7: second micro lens array, 1a, 1b: substrate alignment Mark, 2a, 2b: mask alignment mark, 21: filter, 22, 23, 25, 30: lens, 24, 28: beam splitter, 29: reflector, 9: second control device

Claims (5)

In an alignment apparatus for an exposure apparatus that is provided in a scan exposure apparatus using a microlens array that transfers a mask pattern to a substrate by scan exposure, and relatively aligns the mask and the substrate,
An alignment light source for irradiating alignment light to a substrate alignment mark provided on the substrate and a mask alignment mark provided on the mask;
A microlens array interposed between the substrate and the mask to form the substrate alignment mark or the mask alignment mark on the mask or the substrate as an erect life-size image, respectively,
A camera that captures the substrate alignment mark and the mask alignment mark, one as an image of reflected light and the other as an erect life-size image;
A control device that adjusts the position of the mask and / or the substrate based on the substrate alignment mark and the mask alignment mark imaged by the camera;
Have
The microlens array is
A plurality of unit microlens arrays in which a plurality of microlenses are two-dimensionally arranged and stacked on each other;
A polygonal field stop having a polygonal aperture disposed at a reversal imaging position between the unit microlens arrays;
An aperture stop that limits the numerical aperture between the unit microlens arrays,
The plurality of microlenses are arranged in a direction orthogonal to the scan exposure direction to form a microlens array, and the microlens arrays are arranged in the scan exposure direction and adjacent to the scan exposure direction. Between the micro lens rows of the rows are arranged so as to be biased in a direction orthogonal to the scan exposure direction,
The control device moves the microlens array relative to the substrate and the mask in the scan exposure direction, and the substrate alignment mark by the camera at an interval that is not an integral multiple of the arrangement pitch of the microlens rows. The mask alignment mark image and the mask alignment mark image are captured a plurality of times, the captured plurality of images are superimposed, and the superimposed substrate alignment mark image and mask alignment mark image are used for alignment. An alignment apparatus for an exposure apparatus. In an alignment apparatus for an exposure apparatus that is provided in a scan exposure apparatus using a microlens array that transfers a mask pattern to a substrate by scan exposure, and relatively aligns the mask and the substrate,
An alignment light source for irradiating alignment light to a substrate alignment mark provided on the substrate and a mask alignment mark provided on the mask;
A microlens array interposed between the substrate and the mask to form the substrate alignment mark or the mask alignment mark on the mask or the substrate as an erect life-size image, respectively,
A camera that captures the substrate alignment mark and the mask alignment mark, one as an image of reflected light and the other as an erect life-size image;
A control device that adjusts the position of the mask and / or the substrate based on the substrate alignment mark and the mask alignment mark imaged by the camera;
Have
The microlens array is
A plurality of unit microlens arrays in which a plurality of microlenses are two-dimensionally arranged and stacked on each other;
A polygonal field stop having a polygonal aperture disposed at a reversal imaging position between the unit microlens arrays;
An aperture stop that limits the numerical aperture between the unit microlens arrays,
The plurality of microlenses are arranged in a direction orthogonal to the scan exposure direction to form a microlens array, and the microlens arrays are arranged in the scan exposure direction and adjacent to the scan exposure direction. Between the micro lens rows of the rows are arranged so as to be biased in a direction orthogonal to the scan exposure direction,
The control device moves the microlens array relative to the substrate and the mask in a scanning exposure direction, and continuously moves the image of the substrate alignment mark and the image of the mask alignment mark by the camera. An alignment apparatus for an exposure apparatus, characterized in that an image of a substrate alignment mark and an image of a mask alignment mark that are continuously captured are used for alignment. 3. The exposure apparatus according to claim 1, wherein one of the substrate alignment mark and the mask alignment mark has a frame shape, and the other has a rectangular shape positioned at the center of the frame during alignment. Alignment device. 4. The alignment apparatus for an exposure apparatus according to claim 1, wherein the alignment light source emits alignment light coaxially with an optical axis of light detected by the camera. 5. The alignment apparatus for an exposure apparatus according to any one of claims 1 to 4, wherein the microlens array is shared with a microlens array for exposure.

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