KR101991513B1 - Touch panel, method for producing touch panel, and conductive film - Google Patents

Abstract

The conductive film 10 provided on the display panel 158 is provided with the conductive portion 14 having the mesh pattern 20 of the metal thin line 16 and the intersection portion 24 of the mesh pattern 20, Satisfies Sa x 0.01 <Sb? Sa x 5.00 when the moire interference portion 26 is formed and the area of the intersection portion 24 is Sa and the area of the moire interference portion 26 is Sb. The conductive film 10 includes a transparent substrate 12, a conductive portion 14 formed of a thin metal wire 16 formed on a principal surface 12a of the transparent substrate 12 with an adhesive layer 62 interposed therebetween, And a difference in refractive index between the adhesive layer 62 and the transparent coating layer 64 is 0.1 or less. The conductive coating layer 64 is formed to cover the exposed portion of the conductive part 14 and the adhesive layer 62.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch panel, a method of manufacturing a touch panel, and a conductive film,

The present invention relates to a touch panel having a conductive film capable of suppressing generation of moire, a method of manufacturing a touch panel using the conductive film having good optical characteristics such as visible light transmittance and visibility, and a conductive film.

Recently, a touch panel has attracted attention.

In order to prevent the electrodes arranged in a matrix shape from being conspicuous in such a touch panel, an example in which the electrodes are made of indium tin oxide (ITO) is disclosed (see, for example, JP-A-2010-86684).

The touch panel is mainly applied to a small size such as a PDA (portable information terminal) or a mobile phone, but it is thought that the size of the touch panel will be increased by application to a PC display or the like.

In this future trend, since the conventional electrode uses ITO (indium tin oxide), as the resistance increases and the application size increases, the transfer speed of the current between the electrodes becomes slower and the response speed And the time from detection of the position to detection of the position) is slowed.

Therefore, it is conceivable to reduce the surface resistance by arranging a large number of gratings made of metal fine wires (metal fine wires) to construct an electrode. As a touch panel using metal thin wire as an electrode, for example, U.S. Patent No. 5,113,041, U.S. Patent Application No. 95/27334, U.S. Patent Application Publication No. 2004/0239650, and U.S. Patent No. 720,2859 are known .

Further, as a conductive film for a touch panel, Japanese Unexamined Patent Application Publication No. 2010-108878 and Japanese Unexamined Patent Publication No. 2010-108877 have been disclosed. These publications disclose a conductive film 10 having a conductive layer 14 containing silver formed by exposing and developing a silver chloride emulsion layer 16 on a support 12 so that the conductive layer 14 is patterned with a mesh pattern As shown in Fig. According to the conductive films related to Japanese Patent Application Laid-Open Nos. 2010-108878 and 2010-108877, the conductive film for a touch panel has preferable conductivity, the moire is sufficiently reduced, and the touch panel characteristics are excellent.

However, when the metal thin wire is used for an electrode, since the metal thin wire is made of an opaque material, transparency and visibility are a problem. In addition, when the touch panel is used, it is required to improve the ability to detect the touch position.

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a touch panel having an improved ability to detect a touch position, a touch panel having a conductive film capable of suppressing occurrence of moire even when mounted on a display panel, And also to provide a method for manufacturing a touch panel and a conductive film which can secure high transparency even when the electrode is constituted by an electrode.

[1] A touch panel according to a first aspect of the present invention is a touch panel comprising a conductive film for detecting a touch position, wherein the conductive film has a conductive portion having a mesh pattern of fine metal wires, When the area of the intersection is Sa and the area of the touch position detection capability improving section is Sb,

Sa x 0.01 < Sb &amp;le; Sa 5.00

.

[2] In the first aspect of the present invention, when the area of the intersection is Sa and the area of the touch position detection capability improving section is Sb,

Sa x 0.50? Sb? Sa 5.00

.

[3] In the first aspect of the present invention, when the area of the intersection is Sa and the area of the touch position detecting capability improving section is Sb,

Sa x 0.50? Sb? Sa 1.50

.

[4] In the first aspect of the present invention, when the area of the intersection is Sa and the area of the touch position detection capability improving section is Sb,

Sa x 0.90? Sb? Sa 1.10

.

[5] A touch panel according to a second aspect of the present invention is a touch panel comprising a conductive film provided on a display panel, wherein the conductive film has a conductive portion having a mesh pattern of fine metal wires, When the moire interference portion is formed at the intersection portion and the area of the intersection portion is Sa and the area of the moire interference portion is Sb,

Sa x 0.01 < Sb &amp;le; Sa 5.00

.

[6] In the second aspect of the present invention, when the area of the intersection is Sa and the area of the moiré interference is Sb,

Sa x 0.50? Sb? Sa 5.00

.

[7] In the second aspect of the present invention, when the area of the intersection is Sa and the area of the moire preventing portion is Sb,

Sa x 0.50? Sb? Sa 1.50

.

[8] In the second aspect of the present invention, when the area of the intersection is Sa and the area of the moiré suppression is Sb,

Sa x 0.90? Sb? Sa 1.10

.

[9] A manufacturing method of a touch panel according to a third aspect of the present invention is a manufacturing method of a touch panel including a manufacturing process of a conductive film for manufacturing a conductive film, wherein the manufacturing process of the conductive film comprises: A step of bonding a metal foil of a conductive material having a roughened surface to a bonding surface of the adhesive layer on the main surface to transfer the roughened surface of the metal foil to the adhesive layer; Forming a conductive pattern made of the metal foil having a line width of 9 占 퐉 or less and a thickness of 3 占 퐉 or less by partially removing the metal foil by a chemical etching process; And a step of coating a transparent coating layer having a refractive index difference of 0.1 or less with the adhesive layer.

[10] In the third aspect of the present invention, in the step of coating with the transparent coating layer, the rough surface of the surface of the metal foil transferred to the adhesive layer may be smoothly coated with the transparent coating layer.

[11] In the third aspect of the present invention, the metal foil may be gold leaf.

[12] A conductive film according to a fourth aspect of the present invention is a conductive film provided on a display panel of a display device, wherein the conductive film has a conductive portion having a mesh pattern of fine metal wires, Wherein when the area of the intersection is Sa and the area of the moiré suppression is Sb,

Sa x 0.01 < Sb &amp;le; Sa 5.00

.

[13] In the fourth aspect of the present invention, when the area of the intersection is Sa and the area of the moiré suppression is Sb,

Sa x 0.50? Sb? Sa 5.00

.

[14] In the fourth aspect of the present invention, when the area of the intersection is Sa and the area of the moire interference portion is Sb,

Sa x 0.50? Sb? Sa 1.50

.

[15] In the fourth aspect of the present invention, when the area of the intersection is Sa and the area of the moiré suppression is Sb,

Sa x 0.90? Sb? Sa 1.10

.

[16] In the fourth aspect of the present invention, the crossing portion is formed by intersecting the first and second fine lines made of metal constituting the mesh pattern, and the moire suppressing portion is formed by one side face of the first fine line, A second inhibition portion formed between one side surface of the second fine wire and a second inhibition portion formed between one side surface of the first fine wire and the other side surface of the second fine wire, And a fourth inhibiting portion formed between the other side of the first fine line and the other side of the second fine line.

[17] In the fourth aspect of the present invention, when the respective areas of the first inhibiting portion, the second inhibiting portion, the third inhibiting portion, and the fourth inhibiting portion are Sb1, Sb2, Sb3, Sb4,

Sb = Sb1 + Sb2 + Sb3 + Sb4

.

[18] In the fourth aspect of the present invention, it is preferable that the line width of the fine line is 1 to 15 μm.

[19] In the fourth aspect of the present invention, it is preferable that the line width of the fine line is 1 to 9 μm.

[20] In the fourth aspect of the present invention, it is preferable that the line interval of the fine lines is 65 to 500 μm.

A conductive film according to a fifth aspect of the present invention is a conductive film comprising a transparent substrate, a conductive portion formed by a metal thin wire formed on a main surface of the transparent substrate with an adhesive layer interposed therebetween, And a difference in refractive index between the adhesive layer and the transparent coating layer is 0.1 or less.

[22] In the fifth aspect of the present invention, it is preferable that the line width of the metal thin wire is 9 μm or less.

[23] In the fifth aspect of the present invention, it is preferable that the thin metal wire has a thickness of 3 μm or less.

In the fifth aspect of the present invention, the conductive portion may have two or more conductive patterns formed by the metal thin wires arranged in a second direction extending in the first direction and orthogonal to the first direction, respectively .

In the fifth aspect of the present invention, the conductive pattern may have a pattern in which a plurality of mesh shapes are formed by the metal wire and the opening.

In the fifth aspect of the present invention, it is preferable that the conductive pattern is constituted such that at least two catastrophes are connected to each other in the first direction via connection portions made of the metal thin wires, .

According to the touch panel of the present invention, since the conductive film having the touch position detection capability enhancer is provided, the touch position detection capability enhancer can increase the electrical sensibility and improve the ability to detect the touch position.

Further, according to the touch panel according to the present invention, since the conductive film capable of suppressing generation of moiré is provided, there is no case that the display screen is difficult to be seen as moir, and the display quality is improved and the operability is improved .

Further, according to the conductive film of the present invention, the generation of moire can be suppressed even when the conductive film is mounted on the display panel of the display device with a simple structure, and therefore, the display quality of the touch panel can be improved, Operability can also be improved.

Further, according to the method of manufacturing a touch panel and the conductive film according to the present invention, even when electrodes are formed of a metal thin line pattern in a touch panel, good visibility can be maintained because they are covered with a specific transparent coating layer. In general, the portion of the adhesive layer on which the conductive material is removed is transferred to the rough surface of the concave surface of the conductive material, so light is scattered in the rough surface shape and transparency is impaired. In the present invention, Is smoothly applied, diffuse reflection is suppressed to the minimum, and transparency is developed. Further, by forming the transparent gas as a polyethylene terephthalate film, it is possible to provide a conductive film having good transparency, heat resistance, low cost, and excellent handling properties and transparency. By forming the transparent conductive pattern on the metal foil by a chemical etching process, it is possible to provide a conductive film having transparency excellent in workability.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages will become more apparent from the following description of a preferred embodiment example taken in conjunction with the accompanying drawings.

1 is a plan view showing an example of a conductive film according to the first embodiment.
2 is a cross-sectional view showing a part of the conductive film omitted.
Fig. 3 is a plan view partially showing an enlarged example of the conductive film. Fig.
4 is a plan view partially showing another example of the conductive film.
Fig. 5 is a plan view partially showing an enlarged example of another example of the conductive film. Fig.
Fig. 6 is a plan view partially showing another example of the conductive film. Fig.
7A to 7C are process drawings showing an example of a method of manufacturing a conductive film according to the first embodiment;
8 is a characteristic diagram showing the relationship between the exposure energy and the image density in the digital writing exposure of the silver salt photosensitive layer.
Figs. 9A and 9B are process drawings showing another example of the method for producing a conductive film according to the first embodiment; Fig.
10A and 10B are process drawings showing still another example of a method of manufacturing a conductive film according to the first embodiment;
11 is a process chart showing still another example of a method for producing a conductive film according to the first embodiment.
12 is a cross-sectional view showing a part of the conductive film according to the second embodiment omitted.
13A to 13B are process drawings showing a manufacturing method of a conductive film.
14 is an exploded perspective view showing a configuration of a touch panel;
15 is an exploded perspective view showing a part of the laminated conductive film omitted.
Fig. 16A is a cross-sectional view showing a part of the laminated conductive film formed by the conductive film according to the first embodiment, and Fig. 16B is a cross-sectional view partially showing another example of the laminated conductive film.
Fig. 17A is a cross-sectional view partially showing an example of the laminated conductive film by the conductive film according to the second embodiment, and Fig. 17B is a cross-sectional view partially showing another example of the laminated conductive film.
18 is a plan view showing a pattern example of a first conductive pattern formed on a first conductive film;
19 is a plan view showing a pattern example of a second conductive pattern formed on a second conductive film;
20 is a plan view showing an example in which the first conductive film and the second conductive film are combined to form an example of a laminated conductive film.
21 is an explanatory view showing a state in which one line is formed by the first auxiliary line and the second auxiliary line;

Embodiments of a method of manufacturing a touch panel and a touch panel including the conductive film and the conductive film according to the present invention will be described below with reference to Figs. In the present specification, &quot; &quot; representing the numerical range is used as a meaning including the numerical values described before and after the lower limit and the upper limit.

First, the conductive film 10a according to the first embodiment is also used as an electrode of a touch panel or the like. As shown in Figs. 1 and 2, a transparent substrate 12 (see Fig. 2) And a conductive portion 14 formed on one of the main surfaces of the base portion 11a. The conductive portion 14 has a mesh pattern 20 made of a metal thin wire (hereinafter referred to as a metal thin wire 16) and an opening portion 18, for example. The metal wire 16 is made of, for example, gold (Au), silver (Ag), or copper (Cu).

Specifically, the conductive portion 14 includes a plurality of first metal thin lines 16a (in the x direction in Fig. 1) arranged in the second direction (y direction in Fig. 1) And a mesh pattern 20 extending in the second direction and formed by intersecting a plurality of second metal thin lines 16b arranged in the first direction, respectively. The combination shape of one mesh shape 22 of the mesh pattern 20, that is, one opening 18 and four metal thin lines 16 surrounding the one opening 18, And may be square or rhomboid. Alternatively, a polygonal shape such as a regular hexagon may be used. The shape of one side may be a linear shape, a curved shape, or an arc shape. In the case of forming a circle, for example, two opposing sides may be formed into an outwardly convex circular arc shape, and other opposite sides may be formed into an inward convex circular arc. The shape of each side may be a broken line shape in which an outward convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sinusoidal curve.

1 and 3, the conductive film 10a is formed so as to be adjacent to the intersection 24 of the mesh pattern 20 constituting the conductive portion 14 and to be opposed to the moire suppression portion 26 When the area of the intersection 24 is Sa and the area of the moire interference portion 26 is Sb,

Sa x 0.01 < Sb &amp;le; Sa 5.00

. Sa? 0.50? Sb? Sa? 5.00, more preferably Sa? 0.50? Sb? Sa 1.50, more preferably Sa? 0.90? Sb? Sa x 0.90? Sb? Sa 1.10.

The moire interference portion 26 includes a first inhibition portion 26a formed between one side face of the first metal fine line 16a and one side face of the second metal fine line 16b and a first metal thin line 16a And the other side surface of the first metal thin line 16a and the second side surface of the second metal thin line 16b are formed between the other side surface of the second metal thin line 16b and the other side surface of the second metal thin line 16b, A fourth inhibiting portion 26d formed between the other side surface of the first metal fine wire 16a and the other side surface of the second metal fine wire 16b, .

When the areas of the first tension piece 26a, the second force piece 26b, the third force piece 26c, and the fourth force piece 26d are Sb1, Sb2, Sb3, Sb4,

Sb = Sb1 + Sb2 + Sb3 + Sb4

.

In this case, the line width La of the first metal fine line 16a and the line width Lb of the second metal fine line 16b are 1 to 15 占 퐉, preferably 1 to 9 占 퐉. The line widths of the first metal fine line 16a and the second metal fine line 16b may be the same or different. The line spacing of the first metal thin line 16a and the line spacing of the second metal thin line 16b is 60 to 500 占 퐉. The line intervals of the first metal fine wire 16a and the second metal fine wire 16b may be the same or different.

As described above, in the first embodiment, the moiré suppression portion 26 is formed adjacent to the intersection portion 24 of the mesh pattern 20 constituting the conductive portion 14, The area and the area of the moire interference portion 26 are optimized. As a result, the amount of light transmitted through the conductive portion 14 becomes almost the same at the portions other than the intersection portion 24 and the intersection portion 24, so that the mesh pattern 20 appears to have disappeared , Generation of moiré is suppressed. Further, since the line width of the metal thin line 16 is set to 1 to 15 m and the line interval of the metal thin line 16 is set to 65 to 500 m, high light transmittance and good visibility (the mesh pattern 20 is not noticeable ) At the same time.

1 and 3, the first inhibiting portion 26a to the fourth inhibiting portion 26d constituting the moire preventing portion 26 may have a triangular shape as shown in Fig. 4, As shown in Fig. 5, a circular notch may be formed in a triangle, or a circle may be formed in a quarter, as shown in Fig. 6, as shown in Fig. Of course, it may be asymmetric.

Next, a method for manufacturing the conductive film 10a will be described with reference to Figs. 7A to 11B.

7A, the silver salt photosensitive layer 30 is formed on the transparent substrate 12, and the silver salt photosensitive layer 30 is exposed as shown in Fig. 7B, A conductive portion 14 (mesh pattern 20 or the like) is formed by a combination of the metal silver portion 32 and the light-transmitting portion 34. Then, In this case, it is preferable that the metal silver halide portion 32 is composed of silver halide silver which is formed by developing silver halide. Thereafter, as shown in Fig. 7C, the conductive metal 36 such as a plating layer may be carried on the metal silver part 32. Fig.

The mask used in the exposure to the silver halide photosensitive layer 30 may have a mask pattern corresponding to the pattern in which the moiré inhibition portion 26 is formed at the intersection portion 24 of the mesh pattern 20. [

Alternatively, a pattern in which the moire preventing portion 26 is formed at the intersection 24 of the mesh pattern 20 may be exposed to the silver salt photosensitive layer 30 by digital write exposure to the silver salt photosensitive layer 30 .

In this case, when the first metal thin line 16a and the second metal thin line 16b are subjected to the digital write exposure in view of the characteristics of the exposure energy and the image density distribution shown in Fig. 8, Exposure is performed with the exposure energy E1 and exposure is performed with the second exposure energy E2 in the region where the image density is saturated at the time of digital write exposure of the intersection portion 24. [ At this time, the first exposure energy E1 is smaller than the second exposure energy E2.

By increasing the exposure energy, light leakage to the adjacent portion of the intersection 24 occurs, thereby causing a light bleed region. In the subsequent developing process, the light bleed region is formed at the intersection 24 And is implemented as a moire inhibition unit 26 adjacent to each other. In this method, since the exposure energy is selectively switched depending on the position, the moire preventing portion 26 can be easily formed adjacent to the intersection portion 24, and the manufacturing cost can be reduced .

9A, a resist pattern 44 is formed by exposing and developing the photoresist film 42 on the copper foil 40 formed on the transparent substrate 12, for example, The conductive portion 14 (the mesh pattern 20 or the like) may be formed by etching the copper foil 40 exposed from the resist pattern 44 as shown in Fig. 9B. In this case, the mask used in the exposure to the photoresist film 42 may have a mask pattern corresponding to the pattern in which the moire interference portion 26 is formed at the intersection portion 24 of the mesh pattern 20.

Alternatively, a digital write exposure of the photoresist film 42 may expose a pattern in which the moire preventing portion 26 is formed at the intersection 24 of the mesh pattern 20 in the photoresist film 42 .

10A, a pattern 52 of the conductive portion 14 is formed by printing a paste 50 containing fine metal particles on the transparent substrate 12, and as shown in FIG. 10B, (The mesh pattern 20 or the like) may be formed by applying a metal plating 54 to the conductive part 52. [

Alternatively, as shown in Fig. 11, even when the metal thin film 60 is printed and formed on the transparent substrate 12 by a screen printing plate, a gravure printing plate, or an inkjet to constitute the conductive portion 14 (the mesh pattern 20 or the like) do.

Next, in the conductive film 10a according to the first embodiment, description will be made mainly on a method of using a silver halide photographic photosensitive material, which is a particularly preferable embodiment.

The manufacturing method of the conductive film 10a includes the following three types depending on the form of the photosensitive material and the developing process.

(1) Physical phenomenon The photosensitive silver halide silver-free photosensitive material not containing nuclei is chemically developed or thermally developed to form a metal silver halide on the photosensitive material.

(2) A mode of dissolving physical development of a photosensitive silver halide silver / silver photosensitive material containing a physical phenomenon nucleus in a silver halide emulsion layer to form a silver halide on the photosensitive material.

(3) A photosensitive silver halide silver-free photosensitive material containing no physical phenomenon nuclei and an image receiving sheet having a non-photosensitive layer containing physical phenomenon nuclei are overlapped and subjected to diffusion transfer development to form a metal silver halide on the non- mode.

The mode (1) is an integrated monochrome developing type, and a light transmitting conductive film such as a light transmitting conductive film is formed on the photosensitive material. The obtained phenomenon is a chemical phenomenon or a heat phenomenon, and since the filament is a high-surface surface, the activity is high in the subsequent plating or physical development process.

In the aspect (2), in the exposed portion, the silver halide particles near the physical development nuclei are dissolved and deposited on the developing nuclei, so that a light transmissive electroconductive film such as a light transmissive electroconductive film is formed on the photosensitive material. This is also an integral type of black and white phenomenon. Since the developing action is precipitation on the physical phenomenon nucleus, it is highly active, but the phenomenon is spherical with a small specific surface.

In the embodiment (3), the silver halide particles are dissolved and diffused in the unexposed portion, and the silver halide particles are deposited on the developing nuclei on the image receiving sheet to form a light transmitting conductive film such as a light transmitting conductive film on the image receiving sheet. In the so-called separate type, the image-receiving sheet is peeled from the photosensitive material and used.

Any of the embodiments can be selected from negative development processing and reversal development processing (in the case of the diffusion transfer method, negative type development processing becomes possible by using an auto-positive photosensitive material as the photosensitive material).

The chemical phenomenon, thermal phenomenon, dissolution physical phenomenon, and diffusion transfer phenomenon referred to herein are the same as those commonly used in the art, and they are generally used in photochemical textbooks such as "Photochemistry" (Kyoritsu Publishing Co., (Published in 1955), CEKMees edition The Theory of Photographic Processes, 4th ed. (Published by Mcmillan, 1977). The present invention relates to a liquid processing method. As another developing method, a technique of applying a thermal developing method can be referred to. For example, Japanese Patent Laid-Open Publication No. 2004-184693, Japanese Laid-Open Patent Publication No. 2004-334077, Japanese Laid-Open Patent Publication No. 2005-010752, Japanese Patent Application No. 2004-244080, Japanese Patent Application No. 2004-085655 Can be applied.

Here, the constitution of each layer of the conductive film 10a according to the present embodiment will be described in detail below.

[Transparent gas (12)]

Examples of the transparent substrate 12 include a plastic film, a plastic plate, and a glass plate.

The raw materials of the plastic film and the plastic plate include, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); Polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene and EVA; Vinyl resin; In addition, polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) and the like can be used.

As the transparent substrate 12, PET (melting point: 258 ° C), PEN (melting point: 269 ° C), PE (melting point: 135 ° C), PP (melting point: 163 ° C), polystyrene A plastic film or a plastic plate having a melting point of not higher than about 290 DEG C such as polyvinylidene chloride (melting point: 212 DEG C) or TAC (melting point: 290 DEG C) From the viewpoint of PET, PET is preferable. Since transparency is required for the conductive film 10a for the touch panel, it is preferable that the transparency of the transparent substrate 12 is high.

[Silver Photosensitive Layer (30)]

The silver salt photosensitive layer 30 which is the conductive portion 14 (mesh pattern 20 or the like) of the conductive film 10a contains additives such as a solvent and a dye in addition to a silver salt and a binder.

Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as acetic acid silver. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.

The coating amount (the amount of the silver salt applied) of the silver salt photosensitive layer 30 is preferably 1 to 30 g / m 2 in terms of silver, more preferably 1 to 25 g / m 2, further preferably 5 to 20 g / Do. By setting the coating amount in the above range, desired surface resistance can be obtained when the conductive film 10a is used.

Examples of the binder used in this embodiment include gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and its derivatives, polyethylene oxide, polyvinylamine, chitosan, Polylysine, polyacrylic acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. They have neutral, anionic, and cationic properties depending on the ionic properties of the functional groups.

The content of the binder contained in the silver halide photosensitive layer 30 of the present embodiment is not particularly limited and can be appropriately determined within a range capable of exhibiting dispersibility and adhesion. The content of the binder in the silver salt photosensitive layer 30 is preferably 1/4 or more, more preferably 1/2 or more, in terms of silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, more preferably 50/1 or less. Further, it is more preferable that the volume ratio of silver / binder is 1/1 to 4/1. Most preferably from 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt photosensitive layer 30 within this range, it is possible to suppress the variation in the resistance value and obtain the conductive film 10a having a uniform surface resistance even when the amount of application is adjusted. The silver / binder volume ratio is obtained by converting the silver halide amount / binder amount (weight ratio) of the raw material into the silver amount / binder amount (weight ratio) and further converting the silver amount / binder amount (weight ratio) into the silver amount / Can be obtained.

<Solvent>

The solvent used for forming the silver salt photosensitive layer 30 is not particularly limited, and examples thereof include water, an organic solvent (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, Sulfoxides such as dimethyl sulfoxide and the like, esters such as ethyl acetate, and ethers), ionic liquids, and mixed solvents thereof.

The content of the solvent used in the silver halide photosensitive layer 30 of the present embodiment is in the range of 30 to 90 mass% with respect to the total mass of the silver salt, binder and the like contained in the silver halide photosensitive layer 30, .

<Other additives>

The various additives used in the present embodiment are not particularly limited and well-known ones can be preferably used.

[Other Layers]

A protective layer (not shown) may be formed on the silver salt photosensitive layer 30. In the present embodiment, the &quot; protective layer &quot; means a layer comprising a binder such as gelatin or a polymer, and is formed on the silver salt photosensitive layer 30 having photosensitivity to exhibit an effect of preventing scratching and improving mechanical properties do. The thickness is preferably 0.5 占 퐉 or less. The coating method and the forming method of the protective layer are not particularly limited, and known coating methods and forming methods can be appropriately selected. Further, a subbing layer may be formed below the silver salt photosensitive layer 30, for example.

Next, each step of the method for producing the conductive film 10a will be described.

[Exposure]

In the present embodiment, the case where the mesh pattern 20 is formed by a printing method is included, but the mesh pattern 20 is formed by exposure and development other than the printing method. That is, the photosensitive material having the silver salt photosensitive layer 30 formed on the transparent substrate 12 or the photosensitive material coated with the photopolymer for photolithography is exposed. The exposure can be carried out using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light, ultraviolet light, and radiation such as X-rays. A light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]

In this embodiment, after the silver salt photosensitive layer 30 is exposed, further development processing is performed. Conventional development processing techniques used for silver salt photographic film, photo paper, film for printing plate, and emulsion mask for photomask can be used for the development processing. Although there is no particular limitation on the developer, a PQ developer, an MQ developer, a MAA developer, or the like can be used. In the case of commercial products, for example, CN-16, CR-56, CP45X, FD- T-1, C-41, E-6, RA-4, D-19 and D-72 of KODAK Corporation or a developer contained in the kit. A lease developer may also be used.

The developing treatment in the present embodiment may include a fixing treatment carried out for the purpose of removing and stabilizing the silver salt of the unexposed portion. The fixing treatment in this embodiment can be performed using a fixing treatment technique used for a silver salt photographic film, a photo paper, a film for printing plate, and an emulsion mask for a photomask.

The conductive film 10a is obtained through the above-described steps. The surface resistance of the conductive film 10a obtained is 0.1 to 100 ohms / sq. Is preferable. The lower limit value is 1 ohm / sq. And preferably 10 ohms / sq. Is more preferable. The upper limit is 70 ohms / sq. And preferably 50 ohms / sq. Is more preferable. The electroconductive film 10a after the development treatment may be further subjected to calendering or may be adjusted by a desired surface resistance by calendering.

[Physical phenomenon and plating treatment]

In the present embodiment, for the purpose of improving the conductivity of the metal silver part 32 formed by the above exposure and development processing, even if physical development and / or plating treatment for supporting the conductive metal particles on the metal silver part 32 is performed do. In the present embodiment, the conductive metal particles may be supported on the metal silver part 32 only by either physical development or plating, or the conductive metal particles may be supported on the metal silver part by combining physical development and plating. It is also referred to as a &quot; conductive metal part &quot; including a part subjected to physical development and / or plating treatment.

[Conductive metal part]

The line width of the conductive metal part (line width of the metal thin line 16) of the present embodiment is preferably 1 占 퐉 or more, 3 占 퐉 or more, 4 占 퐉 or more, or 5 占 퐉 or more and the upper limit is preferably 15 占 퐉 or less and 10 占 퐉 or less , 9 μm or less, and 8 μm or less. When the line width is less than the above lower limit value, the conductivity becomes insufficient, and thus the detection sensitivity becomes insufficient when used in a touch panel. On the other hand, if the upper limit value is exceeded, the moiré caused by the mesh pattern 20 becomes noticeable, or the visibility is deteriorated when used in a touch panel. Also, in the above range, the moire of the mesh pattern 20 is improved, and visibility is particularly improved. The line spacing of the metal thin wires 16 is preferably 65 占 퐉 to 500 占 퐉, more preferably 100 占 퐉 to 400 占 퐉, more preferably 150 占 퐉 to 300 占 퐉, and most preferably 210 占 퐉 to 250 占 퐉 Or less. The conductive metal portion may have a portion having a line width larger than 200 占 퐉 for the purpose of connecting the earth or the like.

In the conductive metal part in the present embodiment, the opening ratio is preferably 85% or more, more preferably 90% or more, and most preferably 95% or more in terms of visible light transmittance. The aperture ratio is the ratio of the conductive portion of the conductive portion (the first major grating 202A, the first connecting portion 106A, the second major grating 202B, the second connecting portion 106B, the sub grating 104, , And the aperture ratio on a square lattice pattern having a line width of 15 占 퐉 and a pitch of 300 占 퐉, for example, is 90%.

[Light transmitting portion]

The "light-transmitting portion" in the present embodiment means a portion of the conductive film 10a having a light-transmitting property other than the conductive metal portion. As described above, the transmittance in the light transmissive portion is 90% or more, which is represented by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the transparent substrate 12, 95% or more, more preferably 97% or more, still more preferably 98% or more, and most preferably 99% or more.

Regarding the exposure method, a method using a glass mask or a pattern exposure method by laser imaging is preferable.

[Conductive film (10a)]

The thickness of the transparent substrate 12 in the conductive film 10a according to the present embodiment is preferably 5 to 350 占 퐉, more preferably 30 to 150 占 퐉. A transmittance of a desired visible light is obtained in a range of 5 to 350 mu m, and handling is also easy.

The thickness of the metal silver portion formed on the transparent substrate 12 can be appropriately determined according to the coating thickness of the silver salt photosensitive layer coating material applied on the transparent substrate 12. [ The thickness of the metal silver part 32 can be selected from 0.001 mm to 0.2 mm, preferably 30 占 퐉 or less, more preferably 20 占 퐉 or less, even more preferably 0.01 to 9 占 퐉, and most preferably 0.05 to 5 占 퐉 desirable. It is also preferable that the metal silver part 32 is a patterned one. The metallic silver portion 32 may be a single layer or an intermediate layer of two or more layers. In the case where the metal silver part 32 is in a patterned state and has a middle-layer structure of two or more layers, a different darkness can be imparted so that it can be sensitized to different wavelengths. Thus, when the exposure wavelength is changed and exposed, different patterns can be formed in each layer.

In the use of a touch panel, the thickness of the conductive metal part is preferably because the viewing angle of the display panel becomes wider as the thickness of the conductive metal part is thinner. From this viewpoint, the thickness of the layer made of the conductive metal supported on the conductive metal part is preferably less than 9 占 퐉, more preferably 0.1 占 퐉 or more and less than 5 占 퐉, and still more preferably 0.1 占 퐉 or more and less than 3 占 퐉.

In this embodiment, the metal silver part 32 having a desired thickness is formed by controlling the coating thickness of the silver salt photosensitive layer 30 described above, and the thickness of the layer made of the conductive metal particles by physical development and / It is possible to easily form the conductive film 10a having a thickness of less than 5 mu m, preferably less than 3 mu m.

In the method for manufacturing the conductive film 10a according to the present embodiment, it is not always necessary to perform a step such as plating. This is because, in the method for producing the conductive film 10a according to the present embodiment, desired surface resistance can be obtained by adjusting the application amount of silver halide photosensitive layer 30 and the silver / binder volume ratio. It is also possible to perform calendering or the like as necessary.

(Durability treatment after development)

It is preferable that the silver halide photosensitive layer 30 is subjected to developing treatment, and then immersed in a dyestuff to be subjected to a dyestuff treatment. As the film-forming agent, for example, those described in JP-A-2-141279 such as glutaraldehyde, adipoaldehyde, 2,3-dihydroxy-1,4-dioxane and other dialdehydes and boric acid .

A functional layer such as an antireflection layer or a hard coat layer may be imparted to the conductive film 10a and the later-described laminated conductive film 154. [

The present invention can be suitably used in combination with the techniques disclosed in the open publications and international publication pamphlets described in Tables 1 and 2 below. , "Japanese Patent Laid-Open Publication", "Patent Gazette", "Ho-pamphlet" and the like will be omitted.

12, the conductive film 10b according to the second embodiment is also used as an electrode of a touch panel or the like and includes a transparent substrate 12 and an adhesive layer (not shown) formed on the transparent substrate 12 And a transparent covering layer 64 formed so as to cover the exposed portion of the conductive portion 14 and the adhesive layer 62. The transparent cover layer 64 is formed of a metal thin wire 16 formed on the adhesive layer 62, . In particular, the difference in refractive index between the adhesive layer 62 and the transparent coating layer 64 is preferably 0.1 or less, more preferably 0.08 or less, and even more preferably 0.05 or less. In this conductive film 10b, the moiré inhibition portion 26 described above may also be formed.

Here, a method of manufacturing the conductive film 10b will be described with reference to Figs. 13A to 13C.

First, as shown in Fig. 13A, a metal foil 66 made of a conductive material is bonded onto the main surface 12a of the transparent base 12 with an adhesive layer 62 interposed therebetween. At this time, the metal foil 66 having the roughened surface of the adhesive layer 62 is bonded to the adhesive layer 62. Thus, the roughened surface of the metal foil 66 is transferred to the surface of the adhesive layer 62 that is adhered to the metal foil 66.

The metal foil 66 on the adhesive layer 62 is partially removed by a chemical etching process to form a metal foil 66 having a line width of 9 mu m or less and a thickness of 3 mu m or less Conductive pattern 120 is formed. That is, the conductive portion 14 is formed by the metal thin wire 16.

As shown in Fig. 13C, the transparent cover layer 64 covering the conductive pattern 120 and the adhesive layer 62 with a difference in refractive index from the adhesive layer 62 is 0.1 or less.

In the portion of the adhesive layer 62 where the metal foil 66 is removed, since the rough surface shape of the metal foil 66 is transferred, the light is scattered in the rough surface shape, and transparency is impaired. However, in the manufacturing method according to the present embodiment, since the transparent cover layer 64 having a refractive index difference of 0.1 or less from the adhesive layer 62 is coated on the above-described rough surface shape, irregular reflection on the rough surface shape is minimized And transparency is developed.

In the above-described manufacturing method, since the conductive pattern 120 formed on the transparent substrate 12 is composed of the thin metal wires 16 having a line width of 9 m or less and a thickness of 3 m or less, It also shows the effect.

Next, preferred embodiments of the constituent members of the conductive film 10b according to the present embodiment will be described below.

[Transparent gas (12)]

The transparent substrate 12 may be made of a material selected from the group consisting of polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate, polyolefins such as polyethylene, polypropylene, polystyrene and EVA, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, A film made of plastic such as polysulfone, polyethersulfone, polycarbonate, polyamide, polyimide, and acrylic resin, and has a total visible light transmittance of 70% or more.

The transparent substrate 12 may be colored to such an extent as not to interfere with the function of the touch panel, or may be used as a single layer, but may be used as a multilayer film in which two or more layers are combined. Among these, polyethylene terephthalate film is most suitable in terms of transparency, heat resistance, ease of handling, and price. The thickness of the transparent substrate 12 is preferably from 5 to 200 占 퐉 because the thickness of the transparent substrate 12 is poor when it is thin and the transmittance of visible light is low when the thickness is large. More preferably 10 to 100 占 퐉, and still more preferably 25 to 50 占 퐉.

[Metal fine wire (16)]

As the metal thin wire 16, an alloy containing one or more of metals such as copper, aluminum, nickel, iron, gold, silver, stainless steel, tungsten, chrome and titanium may be used. Among them, it is preferable that gold or silver is suitable as the electrode of the touch panel in terms of conductivity and ease of circuit processing, and gold foil having a thickness of 3 占 퐉 or less.

In the case of using silver as the metal thin wire 16, it is preferable to blacken the surface in order to prevent the metal from being oxidized and discolored over time. The blackening treatment may be performed before or after the formation of the conductive pattern 120. This can be carried out after the formation of the conductive pattern 120 by using a method practiced in the field of printed wiring boards. For example, at 95 占 폚 for 2 minutes in an aqueous solution of sodium hypochlorite (31 g / l), sodium hydroxide (15 g / l) and trisodium phosphate (12 g / l).

As a method of bringing the metal thin wires 16 into close contact with the transparent substrate 12, it is most convenient to join them via the adhesive layer 62 made mainly of acrylic or epoxy resin. When it is necessary to reduce the film thickness of the metal thin wire 16, one or two or more of thin film forming techniques such as a vacuum vapor deposition method, a sputtering method, an ion plating method, a chemical vapor deposition method, and an electroless and electroplating method may be combined .

[Conductive pattern 120]

As a method of forming the conductive pattern 120 on the transparent substrate 12, a metal foil 66 is formed on the transparent substrate 12 as in the above-described manufacturing method, It is effective in terms of processability to form the conductive pattern 120 by the conductive pattern 16. In addition, the photosensitive resin layer disposed on the transparent substrate 12 is exposed and developed using a mask for drawing the conductive pattern 120, and a conductive pattern (not shown) formed by the thin metal wires 16 is formed by combining electroless plating and electroplating. And a method of forming the insulating layer 120 may be used. An example of the conductive pattern 120 applied to the touch panel will be described later.

[Adhesive layer (62)]

As the adhesive layer 62, for example, an epoxy adhesive layer or an acrylic adhesive layer can be used.

[Transparent Coating Layer (64)]

The difference between the refractive index of the transparent cover layer 64 for covering the conductive pattern 120 and the adhesive layer 62 is 0.1 or less in the conductive film 10b produced by the manufacturing method according to the present embodiment. This is because the visible light transmittance is lowered when the refractive indexes of the adhesive layer 62 and the transparent coating layer 64 are different from each other, and when the difference in refractive index is 0.1 or less, the visible light transmittance is lowered.

When the transparent substrate 12 is made of polyethylene terephthalate (n = 1.575: refractive index), the material of the transparent coating layer 64 satisfying these requirements is preferably a bisphenol A epoxy resin, a bisphenol F epoxy resin, a tetrahydroxyphenyl Epoxy resins such as methane type epoxy resin, novolak type epoxy resin, resorcinol type epoxy resin, polyalcohol / polyglycol type epoxy resin, polyolefin type epoxy resin and alicyclic or halogenated bisphenol (both having a refractive index of 1.55 to 1.60) . (N = 1.52), polyisoprene (n = 1.521), poly-1,2-butadiene (n = 1.50), polyisobutene (n = 1.505 to 1.51) (N = 1.50), poly-2-heptyl-1,3-butadiene (n = 1.50) Polypropylene (n = 1.4495), polyvinyl ethyl ether (n = 1.454), polyvinylhexyl ether (n = 1.4591), polyvinyl butyl ether (n = 1.4563), polyesters such as polyvinyl acetate (n = 1.4665) and polyvinyl propionate (n = 1.4665), polyurethane (n = 1.5-1.6), ethyl cellulose (n = 1.479 ), Polyvinyl chloride (n = 1.54 to 1.55), polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633), polysulfide , Phenoxy resin (n = 1.5 to 1.6), and the like. They exhibit a desirable visible light transmittance.

(N = 1.4665), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463), and the like were used in place of the above-mentioned resin in the case where the transparent substrate 12 was an acrylic resin. , Poly-t-butyl acrylate (n = 1.4638), poly-3-ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethacrylate (n = 1.465), polymethyl acrylate 1.472 to 1.480), polyisopropyl methacrylate (n = 1.4728), polydodecyl methacrylate (n = 1.474), polytetradecyl methacrylate (n = 1.4746), poly-n-propyl methacrylate n = 1.484), poly-3,3,5-trimethylcyclohexylmethacrylate (n = 1.484), polyethylmethacrylate (n = 1.485), poly-2-nitro-2-methylpropyl methacrylate n = 1.4868), polytetracarbanyl methacrylate (n = 1.4889), poly-1,1-diethylpropyl methacrylate (n = 1.4889), polymethyl methacrylate 893) can be used as the poly (meth) acrylate. These acrylic polymers may be copolymerized with two or more kinds, if necessary, or two or more kinds may be mixed and used.

As an acrylic resin and a copolymer resin other than acrylic, an epoxy acrylate, a urethane acrylate, a polyether acrylate, and a polyester acrylate may also be used. Particularly, from the viewpoint of adhesiveness, epoxy acrylate and polyether acrylate are excellent. Examples of the epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether Diallyl ether, resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylol propane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol (Meth) acrylic acid adducts such as glycidyl glycidyl ether, lauryl tetraglycidyl ether, sorbitol tetraglycidyl ether and the like. The epoxy acrylate is effective for improving the adhesiveness because it has a hydroxyl group in the molecule, and these copolymer resins can be used in combination of two or more as needed. The weight average molecular weight of the polymer as the main component of the transparent coating layer 64 is 1,000 or more. If the molecular weight is 1,000 or less, the adhesion of the adherend to the adherend (the transparent substrate 12, the adhesive layer 62, and the conductive pattern 120) deteriorates because the cohesive force of the composition is excessively low.

Examples of the curing agent for the transparent coating layer 64 include amines such as triethylenetetramine, xylenediamine and diaminodiphenylmethane, phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride Acid anhydrides such as acid, diaminodiphenylsulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, ethylmethylimidazole and the like can be used. These may be used alone or in combination of two or more. These crosslinking agents are preferably added in an amount of 0.1 to 50 parts by weight, preferably 1 to 30 parts by weight, based on 100 parts by weight of the polymer. If the amount is less than 0.1 part by weight, curing becomes insufficient, and if it exceeds 50 parts by weight, excessive crosslinking may occur, and adherence may be adversely affected.

Additives such as a diluent, a plasticizer, an antioxidant, a filler, and a tackifier may be added to the resin composition of the transparent coating layer 64 used in the present embodiment, if necessary. The resin composition of the transparent coating layer 64 is applied to cover a portion or an entire surface including the conductive pattern 120 on the transparent substrate 12 and subjected to a solvent drying and heat curing process, . The transparent coating layer 64 of the adhesive film can directly be applied to a display such as a liquid crystal display, an organic EL, or an inorganic EL to be used as a touch panel for a display, or an acrylic It can be used as a keyboard or a touch panel for a ten-key independent of the display by being attached to a plate or sheet such as a plate or a glass plate.

[Application example for touch panel]

Next, an example in which the touch panel 150 is formed using the conductive film 10a and the conductive film 10b will be described with reference to Figs. 14 to 21. Fig. The touch panel 150 may be a resistive type or a capacitive touch panel.

The touch panel 150 has a sensor main body 152 and a control circuit (composed of an IC circuit or the like) not shown. As shown in Figs. 14, 15 and 16A (or 17A), the sensor main body 152 is formed by laminating a first conductive film 10A and a second conductive film 10B, which will be described later 154, and a protective layer 156 stacked thereon. The laminated conductive film 154 and the protective layer 156 are disposed on the display panel 158 of the display device 157 such as a liquid crystal display. The first conductive film 10A and the second conductive film 10B may be formed by using the conductive film 10a described above (see Figs. 1, 2 and 16A) or the conductive film 10b (see Figs. 12 and 17A) . The sensor main body 152 has a sensor portion 160 disposed in an area corresponding to the display screen 158a of the display panel 158 as viewed from the top surface and a sensor portion 160 disposed in an area corresponding to the outer peripheral portion of the display panel 158 And a terminal wiring portion 162 (so-called frame) arranged therein.

When the conductive film 10a shown in Fig. 2 is used as the first conductive film 10A applied to the touch panel 150, as shown in Figs. 15, 16A, and 18, the first transparent substrate 12A (See Fig. 16A). The first conductive portion 14A is formed on one main surface of the first conductive portion 14A. When the conductive film 10b shown in Fig. 12 is used, as shown in Figs. 8, 17A, and 18, the first transparent substrate 12A and the first transparent substrate 12A, Is formed so as to cover the first conductive portion 14A formed by the thin metal wire 16 formed through the first adhesive layer 62a and the first adhesive layer 62a exposed to the first conductive portion 14A, And the first transparent coating layer 64a having a difference in refractive index from the one adhesive layer 62a of 0.1 or less.

18, the first conductive portions 14A extend in the third direction (m direction) and are arranged in the fourth direction (n direction) orthogonal to the third direction, and the plurality of gratings Two or more first conductive patterns 120A (having a mesh pattern 20) formed by a metal thin wire 16 composed of a plurality of metal wires 16 and metal thin wires 16 arranged around the first conductive patterns 120A 1 auxiliary pattern 200A.

The first conductive pattern 120A is formed by connecting two or more first major gratings 202A in series in a third direction and each first major grating 202A is formed by combining two or more minor gratings 204 . The above-described first auxiliary pattern 200A, which is not connected to the first large grid 202A, is formed around the sides of the first large grid 202A.

A first connecting portion 206A for electrically connecting these first large gratings 202A is formed between the adjacent first large gratings 202A. The first connecting portion 206A is configured by disposing a septum 208 having a size in which n (n is a real number greater than 1) small gratings 204 are arranged in a second direction (y direction). A first removal unit 210A in which one side of the sub grating 204 is removed is provided at a portion adjacent to the septum 208 among the sides along the first direction (x direction) of the first major grid 202A Respectively. The sub grating 204 has the smallest square shape here. In the example of FIG. 18, the septum 208 has a size in which three small gratings 204 are arranged in the second direction.

In addition, a first insulation portion 212A electrically insulated between adjacent first conductive patterns 120A is disposed.

The first auxiliary pattern 200A described above includes a plurality of first auxiliary lines 214A arranged along the side 203a along the first direction among the side 203a of the first large grid 202A A plurality of first auxiliary lines 214A arranged along the side 203a along the second direction among the side 203a of the first large grid 202A And two first L-shaped patterns 216A in which two first auxiliary lines 214A are combined in an L-shaped pattern are arranged so as to face each other in the first insulating portion 212A Pattern.

The length of each first auxiliary line 214A in the axial direction has a length of 4/5 or less, preferably 1/2 or less of one side along the inner periphery of the sub-grating 204. [ Each of the first auxiliary lines 214A is formed at a position spaced apart from the first large grid 202A by a predetermined distance. The predetermined distance is a length obtained by subtracting the length in the axial direction of the first auxiliary line 214A from the length of one side along the inner periphery of the sub grating 204. [ For example, if the length of the first auxiliary line 214A in the axial direction is 4/5 or 1/2 of one side along the inner periphery of the sub-grating 204, Or one-half or one-half of one side.

15, the open end of the first large grid 202A, which is present on one end side of each first conductive pattern 120A, is connected to the first conductive film 10A, So that the first connecting portion 206A does not exist. The end portion of the first major grid 202A existing on the other end side of each first conductive pattern 120A is electrically connected to the first terminal wiring pattern (not shown) formed by the thin metal wire 16 via the first wire connecting portion 184a 186a.

14 and 15, the first conductive film 10A applied to the touch panel 150 is provided with a plurality of first conductive patterns 120A And a plurality of first terminal wiring patterns 186a led out from the first wiring portions 184a are arranged in the terminal wiring portion 162. [

In the example of Fig. 14, the outer shape of the first conductive film 10A has a rectangular shape as viewed from the upper surface, and the outer shape of the sensor portion 160 also has a rectangular shape. A plurality of first terminals 188a are arranged in the longitudinal direction of one long side of the first conductive film 10A in the longitudinally central portion of the one long side of the first conductive film 10A among the terminal wiring portions 162 . A plurality of first connection portions 184a are arranged in a straight line along one long side of the sensor portion 160 (long side nearest to one long side of one side of the first conductive film 10A: n direction). The first terminal wiring patterns 186a led out from the respective first connection portions 184a are routed toward the substantially central portion on one long side of the first conductive film 10A and are connected to the corresponding first terminals 188a, As shown in Fig.

When the conductive film 10a shown in Fig. 2 is used as the first conductive film 10A applied to the touch panel 150, as shown in Figs. 15, 16A, and 18, the first transparent substrate 12A (See Fig. 16A). The first conductive portion 14A is formed on one main surface of the first conductive portion 14A. When the conductive film 10b shown in Fig. 12 is used, as shown in Figs. 15, 17A, and 18, the first transparent substrate 12A and the first transparent substrate 12A Is formed so as to cover the first conductive portion 14A formed by the thin metal wire 16 formed through the first adhesive layer 62a and the first adhesive layer 62a exposed to the first conductive portion 14A, And the first transparent coating layer 64a having a difference in refractive index from the one adhesive layer 62a of 0.1 or less.

On the other hand, when the conductive film 10a shown in Fig. 2 is used, the second conductive film 10B is formed on the main surface of the second transparent base body 12B as shown in Figs. 15, 16A and 19 And a second conductive portion 14B. When the conductive film 10b shown in Fig. 12 is used, as shown in Figs. 15, 17A and 19, the second transparent base body 12B and the second transparent base body 12B, The second conductive portion 14B formed by the thin metal wire 16 formed through the second adhesive layer 62b and the second adhesive layer 62b exposed by the second conductive portion 14B, And the second transparent coating layer 64b in which the difference in refractive index from the second adhesive layer 62b is 0.1 or less.

The second conductive portions 14B extend in the fourth direction (n direction) and are arranged in the third direction (m direction), respectively. The second conductive portions 14B are formed by the metal thin wires 16, A conductive pattern 120B having a mesh pattern 20 and a second auxiliary pattern 200B formed of metal thin lines 16 arranged around the second conductive patterns 120B.

The second conductive pattern 120B is constituted by connecting two or more second major gratings 202B in series in the fourth direction and each of the second major gratings 202B is formed by combining two or more minor gratings 204 . The above-described second auxiliary pattern 200B, which is not connected to the second major grating 202B, is formed around the side of the second major grating 202B.

A second connecting portion 206B for electrically connecting these second large gratings 202B is formed between the adjacent second large gratings 202B. The second connecting portion 206B is configured by disposing a septum 208 having a size in which n small gratings 204 (n is a real number larger than 1) are arranged in the first direction (x direction). A second removal unit 210B in which one side of the sub grating 204 is removed is provided at a portion adjacent to the septum 208 among the sides along the second direction (y direction) of the second major grid 202B Respectively.

Further, a second insulation portion 212B electrically insulated between the adjacent second conductive patterns 120B is disposed.

The second auxiliary pattern 200B described above includes a plurality of second auxiliary lines 214B arranged along the side 203b along the second direction among the side 203b of the second large grid 202B A plurality of second auxiliary lines 214B arranged along the side 203b along the first direction among the side 203b of the second major grid 202B Two second L-stapling patterns 216B in which two second auxiliary lines 214B are combined in an L-shape in the second insulating portion 212B are arranged so as to face each other Pattern.

The length of each second auxiliary line 214B in the axial direction is set to 4/5 or less of one side along the inner periphery of the sub-grating 204, preferably, 1 / / 2 or less. Each second auxiliary line 214B is formed at a position spaced a predetermined distance from the second major grid 202B. The predetermined distance is the length obtained by subtracting the length in the axial direction of the second auxiliary line 214B from the length of one side along the inner periphery of the sub-grating 204, similarly to the above-described first auxiliary line 214A . For example, if the length of the second auxiliary line 214B in the axial direction is 4/5 or 1/2 of one side along the inner periphery of the sub-grating 204, the predetermined distance corresponds to the inner periphery of the sub- 1/5 or 1/2 of one side.

15, the second conductive film 10B constructed as described above has an open end of the second major grid 202B which is present on one end side of each second conductive pattern 120B, And the second connecting portion 206B does not exist. On the other hand, the ends of the second major grating 202B on the other end side of each odd-numbered second conductive pattern 120B and the end of the second major conductive grating 202B on the other end side of the even- The ends of the second large grid 202B are electrically connected to the second terminal wiring patterns 186b by the thin metal wires 16 via the second wire connecting portions 184b.

15, the second conductive film 10B applied to the touch panel 150 includes a plurality of second conductive patterns 120B arranged at portions corresponding to the sensor portions 160, A plurality of second terminal wiring patterns 186b led out from the respective second wiring portions 184b are arranged in the wiring portion 162. [

As shown in Fig. 14, a plurality of second terminals 188b are formed in a longitudinally central portion of one of the terminal wirings 162 on the long side of one side of the second conductive film 10B, And are arranged in the longitudinal direction of the long side. In addition, a plurality of second connection portions 184b (for example, an odd-numbered portion) is formed along one short side of the sensor portion 160 (short side nearest one side of one side of the second conductive film 10B) (The short side of the second conductive film 10B closest to the other short side of the second conductive film 10B in the direction of m) of the sensor portion 160 is arranged in a straight line, (For example, the even-numbered second connection portions 184b) are arranged in a straight line.

For example, the odd-numbered second conductive patterns 120B of the plurality of second conductive patterns 120B are connected to the corresponding odd-numbered second connection portions 184b, and the even- Numbered second connection portions 184b are connected to the corresponding even-numbered second connection portions 184b, respectively. The second terminal wiring pattern 186b derived from the odd-numbered second wiring portion 184b and the second terminal wiring pattern 186b derived from the even-numbered second wiring portion 184b are electrically connected to the second conductive film 10B, and are electrically connected to the corresponding second terminals 188b, respectively.

The first terminal wiring pattern 186a may be formed in the same manner as the above-described second terminal wiring pattern 186b and the second terminal wiring pattern 186b may be formed in the above- (186a).

The length of one side of the first major lattice 202A and the second major lattice 202B is preferably 3 to 10 mm, more preferably 4 to 6 mm. If the length of one side is less than the lower limit value, the capacitance of the first major grating 202A and the second major grating 202B at the time of detection is reduced, so that the probability of detection failure increases. On the other hand, if the upper limit value is exceeded, there is a fear that the position detection accuracy is lowered. From the same viewpoint, the length of one side of the sub grating 204 constituting the first major grating 202A and the second major grating 202B is preferably 50 to 500 mu m. When the sub grating 204 is within the above range, the transparency can be maintained more favorably, and the display can be visually perceived without discomfort when mounted on the display panel 158 of the display device 157.

The line width of the first conductive pattern 120A (the first major grid 202A and the septum 208), the width of the second conductive pattern 120B (the second major grid 202B, the septum 208) The line widths of the first auxiliary pattern 200A (the first auxiliary line 214A) and the second auxiliary pattern 200B (the second auxiliary line 214B) are 1 to 15 mu m, respectively. In this case, the line width of the first conductive pattern 120A or the line width of the second conductive pattern 120B may be the same or different. It is preferable that the line widths of the first conductive pattern 120A, the second conductive pattern 120B, the first auxiliary pattern 200A, and the second auxiliary pattern 200B are the same.

That is, the line width of the metal thin line 16 is preferably 1 to 15 mu m. It is preferable that the line spacing (the interval between adjacent metal thin lines 16) is 50 to 500 mu m. It is preferable that the first conductive film 10A and the second conductive film 10B have an opening ratio of 85% or more in terms of visible light transmittance.

When the first conductive film 10A is laminated on the second conductive film 10B to form the laminated conductive film 154, as shown in Fig. 20, the first conductive pattern 120A and the first conductive film 10A Specifically, the first connecting portion 206A of the first conductive pattern 120A and the second connecting portion 206B of the second conductive pattern 120B are arranged so as to cross each other, The first insulating portion 212A of the first conductive portion 14A and the second insulating portion 12B of the second conductive portion 14B (see FIG. 16A or FIG. 17A) 212B are opposed to each other with the first transparent substrate 12A interposed therebetween.

The second conductive film 10B is formed so as to fill the gap of the first large grid 202A formed on the first conductive film 10A when the laminated conductive film 154 is viewed from above, And the two large gratings 202B are arranged. At this time, a combination pattern 218 is formed between the first major grating 202A and the second major grating 202B, in which the first auxiliary pattern 200A and the second auxiliary pattern 200B face each other. The combination pattern 218 is formed such that the first axis 220A of the first auxiliary line 214A and the second axis 220B of the second auxiliary line 214B coincide with each other, One auxiliary line 214A and the second auxiliary line 214B do not overlap and one end of the first auxiliary line 214A and one end of the second auxiliary line 214B coincide with each other, (204). In short, the combination pattern 218 is a combination of two or more sub-gratings 204. As a result, when the laminated conductive film 154 is viewed from above, a plurality of sub-gratings 204 are laid down as shown in Fig.

Here, for example, when the first auxiliary line 214A and the second auxiliary line 214B are not formed, a blank area corresponding to the width of the combination pattern 218 is formed, The boundary of the lattice 202A and the boundary of the second large lattice 202B are conspicuous, and the visibility deteriorates. To avoid this, it is also conceivable to eliminate the blank areas by overlapping the sides 203b of the second major grating 202B with the sides 203a of the first large grating 202A. However, a slight deviation in the overlapping positional accuracy (The lines become thicker) and the boundaries between the first large lattice 202A and the second large lattice 202B become conspicuous and the visibility deteriorates A problem arises.

On the other hand, in the present embodiment, as described above, the first auxiliary line 214A and the second auxiliary line 214B are overlapped with each other so that the first major grid 202A and the second major grid 202B ) Is not conspicuous, and visibility is improved.

As described above, for example, when the side 203b of the second major grating 202B is overlapped with the side 203a of the first major grating 202A to eliminate the blank region, the first major grating 202A The side 203b of the second major grating 202B is positioned immediately below each side 203a of the first main grating 202A. At this time, the side 203a of the first major grating 202A and the side 203b of the second major grating 202B each also function as a conductive portion, so that the side 203a of the first major grating 202A, A parasitic capacitance is formed between the sides 203b of the two large gratings 202B and the presence of this parasitic capacitance functions as a noise component with respect to the charge information and causes a remarkable decrease in the S / N ratio. Since the parasitic capacitance is formed between each first major grid 202A and each second major grid 202B, a large number of parasitic capacitances can be applied to the first and second conductive patterns 120A and 120B in parallel So that there is a problem that the CR time constant becomes large. When the CR time constant is increased, the rising time of the waveform of the voltage signal supplied to the first conductive pattern 120A (and the second conductive pattern 120B) becomes slow, and the generation of the electric field for detecting the position is almost There is a fear that it will not be done. Also, the rise time or fall time of the waveform of the transfer signal from the first conductive pattern 120A and the second conductive pattern 120B is also slowed down, and it is feared that the change of the waveform of the transfer signal in a predetermined scan time can not be grasped . This leads to a decrease in the detection precision and a decrease in the response speed. That is, in order to improve the detection precision and the response speed, it is necessary to reduce the number of the first major grating 202A and the second major grating 202B (reduce the resolution) For example, a problem that it is not applicable to a B5 size, an A4 size, or a larger screen.

On the other hand, in the present embodiment, as shown in Fig. 16A, the projection distance Lf between the side 203a of the first large grid 202A and the side 203b of the second large grid 202B, for example, Is made to be substantially equal to the length of one side of the sub grating 204. Therefore, the parasitic capacitance formed between the first large grating 202A and the second large grating 202B becomes small. As a result, the number of times of CR correction becomes small, and detection accuracy and response speed can be improved. In the combination pattern 218 of the first auxiliary line 214A and the second auxiliary line 214B, the end portion of the first auxiliary line 214A and the end portion of the second auxiliary line 214B are opposed to each other However, the first auxiliary line 214A is electrically disconnected from the first large grid 202A and electrically insulated, and the second auxiliary line 214B is also disconnected from the second large grid 202B, The increase in parasitic capacitance formed between the first major grating 202A and the second major grating 202B does not lead to an increase in the parasitic capacitance formed between the first major grating 202A and the second major grating 202B.

The optimum distance of the projection distance Lf described above is smaller than the size of the first major grating 202A and the second major grating 202B but smaller than the sizes of the first major grating 202A and the second major grating 202B It is preferable to set them appropriately according to the size (line width and length of one side) of the grating 204. In this case, if the size of the sub grating 204 is excessively large with respect to the first major grating 202A and the second major grating 202B having a constant size, the light transmittance is improved. Since the dynamic range of the transmitted signal is small, There is a fear that the detection sensitivity is lowered. On the other hand, if the size of the sub grating 204 is too small, the detection sensitivity is improved. However, there is a limit to the reduction of the line width, so that the light transmittance may deteriorate.

Therefore, the optimal value (optimum distance) of the projection distance Lf described above is preferably 100 to 400 mu m, more preferably 200 to 300 mu m, more preferably 200 to 300 mu m when the line width of the small grating 204 is 1 to 9 mu m Mu m. When the linewidth of the sub grating 204 is narrowed, the above-described optimum distance can be shortened. Since the electric resistance is increased, even if the parasitic capacitance is small, the CR time constant is increased. As a result, There is fear that it may cause. Therefore, the line width of the sub-grating 204 is preferably in the above-described range.

Based on the size of the display panel 158 or the size of the sensor portion 160 and the resolution of the touch position detection (such as the pulse period of the drive pulse), the first large grid 202A and the second large grid The size of the small grating 204 and the size of the small grating 204 are determined and the optimum distance between the first large grating 202A and the second large grating 202B is calculated based on the line width of the small grating 204 .

In this embodiment, the conductive film 10a on which the moire interference portion 26 is formed or the conductive film 10b on which the moire interference portion 26 is formed is used. Therefore, for example, as shown in Figs. 1 and 3 Likewise, the first conductive pattern 120A (mesh pattern 20) constituting the first conductive portion 14A and the second conductive pattern 120B (the mesh pattern 20) constituting the second conductive portion 14B, , The moire inhibition portion 26 having the above-described relationship is positioned adjacent to the intersection portion 24 of the mesh pattern 20. As a result, the amount of light transmitted through the first conductive portion 14A and the second conductive portion 14B can be substantially the same at portions other than the intersection portion 24 and the intersection portion 24, It is possible to minimize the degradation of the image quality. That is, there is no case in which the display screen is difficult to be seen as moir, so that the display quality can be improved and the operability can be improved. In addition, since the line width of the metal thin line 16 is 1 to 15 占 퐉 and the line spacing of the metal thin line 16 is 50 to 500 占 퐉, a high light transmittance and good visibility (the mesh pattern 20 is difficult to notice ) At the same time. Further, in the present embodiment, since the moire inhibition portion 26 exists, the portion can increase the electrical detection, and therefore, the detection capability of the touch position can be enhanced. Particularly, in the capacitive touch panel, it is preferable because the capacitance detection ability improves. In short, the moire inhibition section 26 also functions as a touch position detection capability improving section.

17A, the first conductive pattern 120A of the first conductive film 10A and the exposed portion of the first adhesive layer 62a exposed on the upper surface of the first conductive pattern 120A are exposed, for example, A first transparent coating layer 64a having a refractive index difference of 0.1 or less with respect to the first adhesive layer 62a is coated and a second adhesive layer 62b exposed to the second conductive pattern 120B of the second conductive film 10B, Since the second transparent coating layer 64b having a refractive index difference of 0.1 or less with the second adhesive layer 62b is coated on the first adhesive layer 62a and the second adhesive layer 62b in the uneven surface or the roughened surface formed on the first adhesive layer 62a and the second adhesive layer 62b The laminated conductive film 154 exhibits transparency as a whole.

When the laminated conductive film 154 is used as the touch panel 150, the protective layer 156 is laminated on the first conductive film 10A, and a plurality of the first conductive films 10A The first terminal wiring pattern 186a derived from the first conductive pattern 120A and the second terminal wiring pattern 186b derived from the plurality of second conductive patterns 120B of the second conductive film 10B To the control circuit for controlling the scan.

As a detection method of the touch position, a magnetic capacitance method or a mutual capacitance method can be preferably employed. That is, in the case of the magnetic capacitance type, a voltage signal for touch position detection is supplied to the first conductive pattern 120A in order and a voltage signal for touch position detection is supplied to the second conductive pattern 120B in order . Since the capacitance between the first conductive pattern 120A and the second conductive pattern 120B opposed to the touch position and the GND (ground) is increased by bringing the fingertip into contact with or close to the upper surface of the protection layer 156, The waveform of the transfer signal from the first conductive pattern 120A and the second conductive pattern 120B becomes a waveform different from the waveform of the transfer signal from the other conductive pattern. Therefore, the control circuit calculates the touch position based on the transfer signal supplied from the first conductive pattern 120A and the second conductive pattern 120B. On the other hand, in the case of the mutual capacitance type, for example, a voltage signal for touch position detection is sequentially supplied to the first conductive pattern 120A, and a sensing signal is applied to the second conductive pattern 120B Detection). The stray capacitance of the finger is applied in parallel to the parasitic capacitance between the first conductive pattern 120A and the second conductive pattern 120B opposed to the touch position by bringing the fingertip into contact with or close to the upper surface of the protective layer 156 The waveform of the transfer signal from the second conductive pattern 120B is different from the waveform of the transfer signal from the second conductive pattern 120B. Therefore, in the control circuit, the touch position is calculated based on the order of the first conductive pattern 120A supplying the voltage signal and the transfer signal from the supplied second conductive pattern 120B. By adopting such a method of detecting the touch position of the magnetic capacitance method or the mutual capacitance method, it is possible to detect each touch position even when two fingertips touch or come close to the upper surface of the protective layer 156 at the same time. As a prior art relating to a detection type circuit of a projection type electrostatic capacitance type, there are disclosed in US Pat. No. 4,582,955, U.S. Patent No. 4,686,332, U.S. Patent No. 4,733,222, U.S. Patent No. 5,374,787, U.S. Patent No. 5,543,588 Specification, U.S. Patent No. 7,030,860, U.S. Patent Application Publication No. 2004/0155871, and the like.

15 and 16A, in the case of using the conductive film 10a shown in Fig. 2, the laminated conductive film 154 described above has a structure in which the first conductive film 12A is formed on one main surface of the first transparent substrate 12A, The second conductive portion 14B is formed on one main surface of the second transparent base 12B while the second conductive portion 14B is formed on the other surface of the second transparent base 12B as shown in Fig. The first conductive portion 14A may be formed on the main surface and the second conductive portion 14B may be formed on the rubbing surface of the first transparent base 12A. In this case, the first transparent substrate 12A is laminated on the second conductive portion 14B without the second transparent substrate 12B, and the first conductive portion 12A is formed on the first transparent substrate 12A 14A are stacked. The first conductive film 10A and the second conductive film 10B may have another layer therebetween. If the first conductive portion 14A and the second conductive portion 14B are in an insulating state, May be disposed opposite to each other.

In the above-described laminated conductive film 154, when the conductive film 10b shown in Fig. 12 is used, as shown in Figs. 15 and 17A, the first transparent base body 12A The second conductive portion 14B is formed on one main surface of the second transparent base 12B. In addition, as shown in Fig. 17B, the first transparent base 12A, The first conductive portion 14A is formed on the principal surface 12Aa of the first transparent substrate 12A with the first adhesive layer 62a interposed therebetween and the second adhesive layer 62b is provided on the other principal surface 12Ab of the first transparent substrate 12A The second conductive portion 14B may be formed. In this case, the first transparent substrate 12A is laminated on the second conductive portion 14B without the second transparent substrate 12B, and the first conductive portion 12A is formed on the first transparent substrate 12A 14A are stacked. Also in this case, the first transparent cover layer 64a is formed so as to cover the first adhesive layer 62a exposed to the first conductive portion 14A, the second adhesive layer 62b exposed to the second conductive portion 14B, The second transparent coating layer 64b is formed. The first conductive film 10A and the second conductive film 10B may have different layers therebetween. If the first conductive portion 14A and the second conductive portion 14B are in an insulating state, Or may be disposed opposite to each other.

14, the laminated conductive film 154 is produced by combining the first conductive film 10A and the second conductive film 10B, and the laminated conductive film is laminated on the display device 157 By attaching the display panel 158 to the display panel 158, the touch panel 150 is manufactured. In this case, for example, in the corner portions of the first conductive film 10A and the second conductive film 10B, the positioning used for the application of the first conductive film 10A and the second conductive film 10B It is preferable to form the first alignment mark 194a and the second alignment mark 194b. The first alignment mark 194a and the second alignment mark 194b are formed so that when the first conductive film 10A and the second conductive film 10B are combined to form a laminated conductive film 154, And this composite alignment mark also functions as a positioning alignment mark used when the laminated conductive film 154 is provided on the display panel 158. [

In the example described above, the first conductive film 10A and the second conductive film 10B are applied to the touch panel 150 of the projection type capacitance type. In addition, the surface type capacitance type touch Panel, or a resistive film type touch panel.

As the conductive pattern formed on the first conductive film 10A or the second conductive film 10B, in addition to the above, a mesh pattern is divided into strips in the insulating portion, and a plurality of parallel conductive patterns are used .

That is, as a pattern related to the first modification, two or more stripe-shaped first conductors extending in a first direction (x direction) from the terminals and arranged in a second direction (y direction) orthogonal to the first direction, Pattern. As a pattern related to the second modified example, as opposed to the first modified example, two or more band-shaped members extending in the second direction (y direction) and arranged in the first direction (x direction) 2 conductive pattern. Each conductive pattern can be a pattern in which a plurality of closed mesh shapes surrounding one opening portion with metal thin lines are arranged. Examples of the mesh shape include a square shape, a rectangular shape, a square shape, and the like.

By overlapping the pattern relating to the first modification described above and the pattern relating to the second modification with, for example, a transparent substrate interposed therebetween, a pattern in which the first conductive pattern on the strip and the second conductive pattern on the strip intersect each other Which is preferable for use in a conductive pattern of a touch panel of projection type capacitance type, for example.

Hereinafter, the present invention will be described in more detail with reference to examples of the present invention. The materials, amounts used, ratios, processing contents, processing procedures and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Accordingly, the scope of the present invention should not be construed as being limited by the following specific examples.

[First Embodiment]

In the first embodiment, the surface resistance and the transmittance of the conductive films related to Examples 1 to 32, Comparative Examples 1 to 20, and Reference Examples 1 to 8 were measured, and moire and visibility were evaluated. Details of the examples 1 to 32, comparative examples 1 to 20, and reference examples 1 to 8, and measurement results and evaluation results are shown in Tables 3 and 4 below.

<Examples 1 to 32, Comparative Examples 1 to 20, Reference Examples 1 to 8>

(Silver halide photosensitive material)

(I = 0.2 mol%, Br = 40 mol%) having an average spherical equivalent diameter of 0.1 mu m and containing 10.0 g of gelatin relative to 150 g of Ag in an aqueous medium was prepared.

K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added to the emulsion so that the concentration was 10 ^-7 (mol / mol), and the silver bromide grains were doped with Rh ions and Ir ions. Na ₂ PdCl ₄ was added to the emulsion, and further chlorine / potassium sulfate and sodium thiosulfate were used to increase / decrease the pH value. Then, the first transparent substrate 12A and the second transparent substrate 12A were coated with the gelatin epidermal agent so that the application amount of silver was 10 g / And applied on the second transparent base body 12B (here, all of them are polyethylene terephthalate (PET)). At this time, the Ag / gelatin volume ratio was 2/1.

A PET support having a width of 30 cm was coated with a width of 25 cm by 20 m, and both ends were cut by 3 cm so as to leave a center of 24 cm of the coating, thereby obtaining a silver halide photosensitive material on the roll.

(Exposure)

To expose the silver halide photosensitive material, an exposure head using a DMD (Digital Mirror Device) described in the embodiment of the invention of Japanese Patent Laid-Open No. 2004-1224 was aligned to a width of 25 cm, and a silver halide photosensitive layer 30 (Photosensitive material) feeding mechanism and a winding mechanism are mounted so that the speed variation of the exposure surface and the speed fluctuation of the winding and feeding mechanism are the same as those of the exposure section And a continuous exposure apparatus in which warping with a buffer action was formed so as not to affect the speed. The wavelength of the exposure light was 400 nm, the beam type was approximately square of 12 占 퐉, and the output of the laser light source was 100 占..

Exposure was carried out in accordance with the following setting such that the mesh pattern 20 was transferred to the silver halide photosensitive layer 30 and the interval (line spacing) between the fine line patterns to be the metal fine lines 16 later became 300 mu m. Table 3 shows the line width of the fine metal wire 16 constituting the mesh pattern 20, the area Sa of the intersection 24, the area Sb of the moire preventing portion 26, and the like.

In order to expose the silver halide photosensitive layer 30 to a pattern in which the moire inhibition portion 26 is formed adjacent to the intersection portion 24 of the mesh pattern 20, .

That is, the first exposure head irradiates a single beam while drawing the exposure pattern on the silver halide photosensitive layer 30 while the laser beam reciprocates in a direction perpendicular to the conveying direction of the silver halide photosensitive layer 30. Therefore, the beam is inclined at 45 degrees to the silver halide photosensitive layer 30 in a slant shape corresponding to the ratio of the conveying speed of the silver halide photosensitive layer 30 to the moving speed of the head in the direction perpendicular to the conveying direction, (30), the image is drawn in the reverse warp direction in conjunction with the reciprocating motion of the head.

In the second exposure head, in the point that a laser beam is reciprocating in a direction perpendicular to the conveying direction of the silver halide photosensitive layer 30 and a single beam is irradiated to draw an exposure pattern on the silver halide photosensitive layer 30, Head, where the movement initiator of the head is 180 degrees or a multiple of the first head and the movement initiator. Therefore, when the first exposure head is inclined from one end of the silver halide photosensitive layer 30, the second exposure head is moved from the other end of the silver halide photosensitive layer 30 in the direction opposite to the moving direction of the first exposure head And reversely tilts the silver halide photosensitive layer 30 while moving. Thus, the mesh pattern 20 is formed.

The third exposure head is a fixed head in that the laser beam of the first and second exposure heads is a movable head reciprocating in a direction perpendicular to the conveying direction of the silver halide photosensitive layer 30, So that the head passes the intersection of the laser beam of the exposure head. When a plurality of intersection portions are drawn in the width direction of the silver salt photosensitive layer 30, a third head corresponding to the number is formed. The laser oscillation period is set so that the laser beam irradiated from the third head is irradiated with the intermittent laser beam only for a short time only when the third head passes the intersection. Further, the irradiation time is set to a time at which the moire resistance portion 26 of the desired size can be imaged.

(Development processing)

· Prescription 1 ℓ of developer

20 g of hydroquinone

50 g of sodium sulfite

Potassium carbonate 40 g

2 g of ethylenediaminetetraacetic acid

3 g of potassium bromide

Polyethylene glycol 2000 1 g

Potassium hydroxide 4 g

Adjusted to pH 10.3

· Prescription 1 L prescription

Ammonium thiosulfate (75%) 300 ml

Ammonium sulfite · 1 beard 25 g

8 g of 1,3-diaminopropane-4-acetic acid

Acetic acid 5 g

Ammonia water (27%) 1 g

Adjusted to pH 6.2

The exposed photosensitive material was subjected to 20 seconds of treatment with 35 ° C for 30 seconds, fixation at 34 ° C for 23 seconds, and washing with running water (5 L / min) using an automatic developing machine FG-710PTS manufactured by Fuji Film Co., Respectively.

(Reference Example 1)

The conductive film according to Reference Example 1 manufactured in the same manner as that of Reference Example 1 has a line width of 0.5 탆 (line spacing 300 탆) of mesh pattern 20, an area Sa of intersection 24 of 0.25 탆 ² , And the area Sb was 0.0050 mu m &lt; ^{2 &} gt ;.

(Reference Examples 2 to 4)

The conductive films related to Reference Examples 2, 3 and 4 are the same as Reference Example 1 described above except that the area Sb of the moiré suppressing portion 26 is 0.2250 탆 ² , 0.2750 탆 ² and 1.2500 탆 ² , respectively Respectively.

(Comparative Examples 1 and 2)

The conductive films relating to Comparative Examples 1 and 2 were produced in the same manner as in Reference Example 1 described above except that the area Sb of the moire inhibition portion 26 was set to 0.0025 탆 ² and 1.5000 탆 ² , respectively.

(Example 1)

The conductive film according to Example 1 manufactured in Example 1 is such that the line width of the mesh pattern 20 is 1.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection portion 24 is 1.00 占 퐉 ² , And the area Sb was 0.0200 mu m &lt; ^{2 &} gt ;.

(Examples 2 to 4)

Carried out similar to Example 2, 3 and 4 the conductive film, except that the an area (Sb) of the moire billion portion 26 respectively to 0.9000 ㎛ ^2, 1.1000 ㎛ ² and 5.0000 ㎛ ^2, the embodiment described above in Example 1 related to the Respectively.

(Comparative Examples 3 and 4)

Comparative Examples 3 and 4, the conductive film is related to, except that the an area (Sb) of the moire billion portion 26 respectively 0.0100 and 6.0000 ㎛ ² ㎛ ^2, was prepared in the same manner as in Example 1 described above.

(Example 5)

The conductive film according to Example 5 manufactured in Example 5 is such that the line width of the mesh pattern 20 is 3.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection portion 24 is 9.00 占 퐉 ² , And the area Sb was 0.1800 占 퐉 ² .

(Examples 6 to 8)

The conductive films related to Examples 6, 7, and 8 are the same as Example 5 described above except that the area Sb of the moire inhibition portion 26 is set to 8.1000 탆 ² , 9.9000 탆 ^2, and 45.0000 탆 ² , respectively Respectively.

(Comparative Examples 5 and 6)

The conductive films relating to Comparative Examples 5 and 6 were produced in the same manner as in Example 5 except that the area Sb of the moire inhibition portion 26 was 0.0900 탆 ² and 54.0000 탆 ² , respectively.

(Example 9)

The conductive film according to Example 9 produced was such that the line width of the mesh pattern 20 was 4.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection portion 24 was 16.00 占 퐉 ² , And the area Sb was 0.3200 mu m &lt; ^{2 &} gt ;.

(Examples 10 to 12)

The conductive films related to Examples 10, 11 and 12 are the same as Example 9 described above except that the area Sb of the moiré suppressing portion 26 is 14.4000 탆 ² , 17.6000 탆 ² and 80.0000 탆 ² , respectively Respectively.

(Comparative Examples 7 and 8)

Comparative conductive film relating to Examples 7 and 8, except that an area (Sb) of the moire billion portion 26, respectively, and 96.0000 0.1600 ㎛ ² ㎛ ^2, was manufactured in the same manner as the ninth embodiment described above.

(Example 13)

The conductive film according to Example 13 produced was such that the line width of the mesh pattern 20 was 5.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection portion 24 was 25.00 占 퐉 ² , And the area Sb was 0.5000 mu m &lt; ^{2 &} gt ;.

(Examples 14 to 16)

The conductive films related to Examples 14, 15, and 16 are the same as Example 13 described above except that the area Sb of the moire inhibition portion 26 is set to 22.5000 탆 ² , 27.5000 탆 ^2, and 125.0000 탆 ² , respectively Respectively.

(Comparative Examples 9 and 10)

Comparative Examples 9 and 10 associated with the conductive film is, except that the an area (Sb) of the moire billion portion 26 respectively to 0.2500 ㎛ ² and 150.0000 ㎛ ^2, was prepared in the same manner as in the Example 13 described above.

(Example 17)

The conductive film according to Example 17 produced was such that the line width of the mesh pattern 20 was 8.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection portion 24 was 64.00 占 퐉 ² , And the area Sb was 1.2800 占 퐉 ² .

(Examples 18 to 20)

The conductive films relating to Examples 18, 19 and 20 were obtained in the same manner as in Example 17 except that the area Sb of the moire inhibition portion 26 was 57.6000 탆 ² , 70.4000 탆 ² , and 320.0000 탆 ² , respectively. .

(Comparative Examples 11 and 12)

Conductive film relating to Comparative Examples 11 and 12, except that an area (Sb) of the moire billion portion 26 respectively to 0.6400 ㎛ ² and 384.0000 ㎛ ^2, was prepared in the same manner as in the Example 17 described above.

(Example 21)

The conductive film according to Example 21 produced was such that the line width of the mesh pattern 20 was 9.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection 24 was 81.00 占 퐉 ² , And the area Sb was 1.6200 mu m &lt; ^{2 &} gt ;.

(Examples 22 to 24)

The conductive films related to Examples 22, 23 and 24 are the same as Example 21 described above except that the area Sb of the moiré suppressing portion 26 is 72.9000 탆 ² , 89.1000 탆 ² and 405.0000 탆 ² , respectively Respectively.

(Comparative Examples 13 and 14)

Conductive film relating to Comparative Examples 13 and 14, except that an area (Sb) of the moire billion portion 26 respectively to 0.8100 ㎛ ² and 486.0000 ㎛ ^2, was prepared in the same manner as in the Example 21 described above.

(Example 25)

The conductive film according to the produced Example 25 has the line width of the mesh pattern 20 of 10.0 占 퐉 (line spacing 300 占 퐉), the area Sa of the intersection 24 of 100.00 占 퐉 ² , And the area Sb was 2.0000 탆 ² .

(Examples 26 to 28)

Examples 26, 27 and 28, the conductive film relating to the, except that the an area (Sb) of the moire billion portion 26 respectively to 90.0000 ㎛ ^2, 110.0000 ㎛ ² and 500.0000 ㎛ ^2, the same as the above-mentioned Example 25 Respectively.

(Comparative Examples 15 and 16)

The conductive films relating to Comparative Examples 15 and 16 were produced in the same manner as in Example 25 except that the area Sb of the moire preventing portion 26 was set to 1.0000 탆 ² and 600.0000 탆 ² , respectively.

(Example 29)

The conductive film according to Example 29 produced had a line width of 15.0 占 퐉 (line spacing 300 占 퐉) of the mesh pattern 20, an area Sa of 225 占 퐉 ² of the intersection portion 24, And the area Sb was 4.5000 mu m &lt; ^{2 &} gt ;.

(Examples 30 to 32)

Exemplary conductive film relating to Examples 30, 31 and 32, except that an area (Sb) of the moire billion portion 26 respectively 202.5000 ㎛ ^2, 247.5000 ㎛ ² and 1125.0000 ㎛ ^2, the same as that of Example 29 described above Respectively.

(Comparative Examples 17 and 18)

The conductive films relating to Comparative Examples 17 and 18 were produced in the same manner as in Example 29 except that the area Sb of the moiré hold portion 26 was set to 2.2500 탆 ² and 1350.0000 탆 ² , respectively.

(Reference Example 5)

The conductive film according to Reference Example 5 manufactured in the same manner as in Reference Example 5 has a line width of 20.0 占 퐉 (line spacing 300 占 퐉) of mesh pattern 20, an area Sa of intersection 24 of 400.00 占 퐉 ² , The area Sb was 8.0000 탆 ² .

(Reference Examples 6 to 8)

The conductive films related to Reference Examples 6, 7, and 8 are the same as Reference Example 5 described above except that the area Sb of the moiré hold portion 26 is 360.0000 탆 ² , 440.0000 탆 ^2, and 2000.0000 탆 ² , respectively Respectively.

(Comparative Examples 19 and 20)

The conductive films relating to Comparative Examples 19 and 20 were produced in the same manner as in Reference Example 5 described above, except that the area Sb of the moire inhibition portion 26 was 4.0000 탆 ² and 2400.0000 탆 ² , respectively.

(Surface resistance measurement)

The surface resistivity of the conductive film is an average value measured at arbitrary 10 points by a Lester GP (model MCP-T610) serial four probe probe (ASP) manufactured by Dia Instruments Inc. in order to confirm the accuracy of the detection accuracy.

(Measurement of transmittance)

In order to confirm the transparency, the transmittance of the conductive film was measured using a spectrophotometer.

(Evaluation of moiré)

Each of the conductive films was attached to the display panel 158 of the display device 157 with respect to each of Examples 1 to 32 and Comparative Examples 1 to 20 and Reference Examples 1 to 8, And drives the display device 157 to display white. In this state, the rotating disk was rotated between the bias angles of -20 ° and + 20 °, and visual observation and evaluation of the moiré were carried out. In addition, Pavilion Notebook PC dm1a (11.6 inch glossy liquid crystal WXGA / 1366 x 768) manufactured by HP was used as the evaluation display.

The evaluation of the moiré was carried out at an observation distance of 0.5 m from the display screen of the display device 157. The case where the moire is not displayed at present is represented by o, , And the case where the moire is present is indicated by x. When the angular range of A and B is less than 10 degrees and the angular range of B is less than 30 degrees, C, &amp; cirf &amp; &amp; cir &amp; and the angular range of x is 30 DEG or more.

From Table 3 and Table 4, all of Examples 1 to 32 satisfying Sa x 0.01 < Sb &amp;le; Sa 5.00 were all good in both moire, conductivity and light transmittance. In particular, Examples 2, 3, 6, 7, 10, 11, 14, 15, 18, 19, 22, 23, 26, 27, 30, and 31 satisfying Sa x 0.90? There was no occurrence. On the other hand, in all of Comparative Examples 1 to 20, moire was present.

Using the conductive films according to the above-described Examples 1 to 32, a projection type capacitance type touch panel was manufactured. All moirés have not been turned on. Further, as a result of operating by touching with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. In addition, when two or more points were touched and operated, it was confirmed that the same good result was obtained, and that it was possible to cope with multi-touch.

[Second Embodiment]

In the second example, the visible light transmittance and visibility of the components using the adhesive films relating to Examples 41 to 50 and Comparative Examples 21 to 27 were measured. The results are shown in Tables 5 and 6.

(Example 41)

&Lt; Production example of adhesive film (1) >

A transparent PET film (refractive index n = 1.575) having a thickness of 50 占 퐉 was used as the transparent substrate 12 and an epoxy adhesive sheet (Nikafrex SAF; manufactured by Nikkan Kogyo Co., Ltd., n = 1.58 ), The surface of the gold foil having a thickness of 2 占 퐉, which is a conductive material, was adhered to the epoxy-based adhesive sheet side by heating lamination under the conditions of 180 占 폚 and 30 kgf / cm2. The obtained gold foil-attached PET film was subjected to a photolithography process (resist film sticking-exposure-development-chemical etching-resist film peeling) and a conductive pattern in which a plurality of lattices (square shapes) To obtain the constituent material (1). The line width of the metal thin line 16 is 6 占 퐉 and the interval (line spacing) between the metal thin lines 16 is 300 占 퐉. A transparent coating layer 1 to be described later was coated on the constituent material 1 so as to have a dry coating thickness of about 10 占 퐉 and dried to obtain an adhesive film 1 having transparency. Then, the adhesive film 1 was heat-pressed on a commercially available acrylic plate (Comogras; manufactured by Kuraray Co., Ltd., thickness 3 mm) under the conditions of 110 캜 and 20 kgf / cm 2 using a roll laminator.

(Example 42)

&Lt; Production example of adhesive film (2) >

A transparent PET film having a thickness of 25 占 퐉 was used as the transparent base body 12 and a 3 占 퐉 -thick gold foil having a thickness of 3 占 퐉 as a conductive material was formed thereon by using Pairlax LF-0200 (manufactured by DuPont Japan Limited, Film, n = 1.47) at 170 캜 under a condition of 20 kg / cm 2 by a roll laminator. This gold-plated PET film was subjected to the same photolithographic process as in the production example of the adhesive film 1 to form a conductive pattern on the PET film in which a plurality of lattices (tetrahedrons) of metal thin wires 16 were arranged, Material (2) was obtained. The line width of the metal thin line 16 is 6 占 퐉 and the line spacing is 200 占 퐉. A transparent coating layer 2 to be described later was coated on the constituent material 2 so as to have a dry coating thickness of about 10 占 퐉 and dried to obtain an adhesive film 2 having transparency. Then, the adhesive film 2 was heat-pressed on a commercially available acrylic plate at 110 DEG C and 30 kgf / cm2 for 30 minutes using a hot press machine.

(Example 43)

<Production Example of Adhesive Film (3)> [

A transparent PET film having a thickness of 50 占 퐉 was used as the transparent base body 12 and gold foil having a thickness of 1 占 퐉 as a conductive material was formed thereon by using Pairlacx LF-0200 (produced by DuPont Japan Limited, acrylic adhesive Film, n = 1.47) at 170 캜 under a condition of 20 kg / cm 2 by a roll laminator. This gold-plated PET film was subjected to the same photolithographic process as in the production example of the adhesive film 1 to form a conductive pattern on the PET film in which a plurality of lattices (tetrahedrons) of metal thin wires 16 were arranged, Material (3) was obtained. The line width of the metal thin line 16 is 1 mu m and the line spacing is 300 mu m. A transparent coating layer 3 to be described later was applied onto the constituent material 3 so as to have a dry coating thickness of about 10 mu m and dried to obtain an adhesive film 3 having transparency. Then, the adhesive film 3 was heat-pressed on a commercially available acrylic plate at 110 DEG C, 30 kgf / cm &lt; 2 &gt; for 30 minutes using a hot press machine.

&Lt; Composition of transparent coating layer (1)

, 100 parts by weight of TBA-HME (high molecular weight epoxy resin, Mw = 300,000 manufactured by Hitachi Chemical Co., Ltd.), 25 parts by weight of YD-8125 (Bisphenol A type epoxy resin, 12.5 parts by weight of a mask isocyanate), 0.3 parts by weight of 2-ethyl-4-methylimidazole, 330 parts by weight of MEK, and 15 parts by weight of cyclohexanone The components of the transparent coating layer were mixed with MEK and cyclohexanone To prepare a varnish of the transparent coating layer (1). The varnish was softened on a glass plate and heated and dried to obtain a refractive index of 1.57.

&Lt; Composition of transparent coating layer (2)

100 parts by weight of YP-30 (phenoxy resin, Mw = 60,000), 10 parts by weight of YD-8125 (bisphenol A type epoxy resin manufactured by Tohto Kasei Co., Ltd.), 10 parts by weight of IPDI 5 parts by weight of 2-ethyl-4-methylimidazole, 285 parts by weight of MEK, and 5 parts by weight of cyclohexanone. The components of the transparent coating layer were dissolved in MEK and cyclohexanone And a varnish of a transparent coating layer (2) was prepared. The varnish was softened on a glass plate and heated and dried to obtain a refractive index of 1.55.

&Lt; Composition of transparent coating layer (3)

, 100 weight parts of HTR-600LB (polyacrylic acid ester, Mw = 70,000, manufactured by Teikoku Chemical Industry Co., Ltd.), 4.5 weight parts of Colonate L (trifunctional isocyanate manufactured by Nippon Polyurethane Industry Co., Ltd.) 0.4 parts by weight of laurelate, 450 parts by weight of toluene, 10 parts by weight of ethyl acetate, and the components of the transparent coating layer were dissolved in toluene and ethyl acetate to prepare a varnish of the transparent coating layer (3). The varnish was softened on a glass plate and dried by heating to obtain a refractive index of 1.47.

(Example 44)

An adhesive film was obtained in the same manner as in Example 41 except that the line width of the metal thin line 16 was changed to 9 탆.

(Example 45)

An adhesive film was obtained in the same manner as in Example 42 except that the wire width of the thin metal wire 16 was 1 占 퐉.

(Example 46)

An adhesive film was obtained in the same manner as in Example 43 except that the line interval of the metal thin line 16 was set to 500 mu m.

(Example 47)

An adhesive film was obtained in the same manner as in Example 41 except that the wire interval of the metal thin line 16 was set to 200 mu m.

(Example 48)

An adhesive film was obtained in the same manner as in Example 41 except that the thickness of the transparent base body 12 was 25 占 퐉.

(Example 49)

An adhesive film was obtained in the same manner as in Example 42 except that the thickness of the transparent base body 12 was 50 占 퐉, the line spacing of the metal thin line 16 was 300 占 퐉, and the thickness was 2 占 퐉.

(Example 50)

An adhesive film was obtained in the same manner as in Example 43 except that the line width of the metal thin line 16 was 6 mu m and the thickness was 2 mu m.

(Comparative Example 21)

An adhesive film was obtained in the same manner as in Example 41 except that the line width of the metal thin wire 16 was changed to 20 占 퐉.

(Comparative Example 22)

An adhesive film was obtained in the same manner as in Example 42 except that the line interval of the metal thin line 16 was 20 占 퐉.

(Comparative Example 23)

An adhesive film was obtained in the same manner as in Example 42 except that the thickness of the thin metal wire 16 was 15 占 퐉.

(Comparative Example 24)

An adhesive film was obtained in the same manner as in Example 41 except that a transparent coating layer 4 (phenol-formaldehyde resin (Mw = 50,000, n = 1.73) was used as the transparent coating layer 64.

(Comparative Example 25)

An adhesive film was obtained in the same manner as in Example 43 except that a transparent coating layer 5 (polydimethylsiloxane (Mw = 4.5 million, n = 1.43) was used as the transparent coating layer 64.

(Comparative Example 26)

An adhesive film was obtained in the same manner as in Example 43 except that a transparent coating layer 6 (polyvinylidene fluoride (Mw = 120,000, n = 1.42) was used as the transparent coating layer 64.

(Comparative Example 27)

An adhesive film was obtained in the same manner as in Example 41 except that a filler-containing polyethylene film (visible light transmittance: 20% or less) having a thickness of 60 占 퐉 was used as the transparent substrate 12.

Visible light transmittance and visibility of the composition using the thus obtained adhesive film were measured. The results are shown in Tables 5 and 6.

The visible light transmittance was measured using an average value of the transmittance of 400 to 800 nm using a double beam spectrophotometer (200-10 type, manufactured by Hitachi, Ltd.). The visibility was evaluated by evaluating whether the adhesive film pasted on the acrylic plate could recognize a conductive pattern drawn with a conductive material visually at a distance of 0.5 m, and what can not be recognized is referred to as &quot; good &quot; Respectively.

It is needless to say that the touch panel, the method of manufacturing the touch panel, and the conductive film according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

Claims (26)

delete delete delete delete delete delete delete delete A manufacturing method of a touch panel (150) including a conductive film manufacturing process for manufacturing a conductive film (10)
In the conductive film production process,
A metal foil 66 of a conductive material having a roughened surface to which the adhesive layer 62 is adhered is adhered to the adhesive layer 62 via the adhesive layer 62 on the principal surface 12a of the transparent substrate 12, A step of transferring the rough surface shape of the concave surface of the metal foil 66,
A step of forming a conductive pattern 120 made of the metal foil 66 having a line width of 9 mu m or less and a thickness of 3 mu m or less by partially removing the metal foil 66 by the chemical etching process,
Covering the transparent covering layer (64) having a refractive index difference of 0.1 or less from the adhesive layer (62) over the conductive pattern (120) and the exposed portion of the adhesive layer (62)
And a step of forming a conductive film as an adhesive film by performing a solvent drying treatment and a heat hardening treatment after coating the transparent coating layer. 10. The method of claim 9,
Wherein the step of coating with the transparent coating layer (64) is performed such that the rough surface of the surface of the metal foil (66) transferred to the adhesive layer (62) is smoothly coated with the transparent coating layer (64) Way. 10. The method of claim 9,
Wherein the metal foil (66) is a gold foil. delete delete delete delete delete delete delete delete delete A transparent substrate 12,
A conductive portion 14 formed by a thin metal wire 16 having a line width of 9 占 퐉 or less and a thickness of 3 占 퐉 or less and formed on the main surface 12a of the transparent base 12 with an adhesive layer 62 therebetween,
And a transparent coating layer (64) formed to cover the conductive part (14) and the exposed part of the adhesive layer (62)
The difference in refractive index between the adhesive layer (62) and the transparent coating layer (64) is 0.1 or less,
The metal thin wire is formed by patterning a metal foil,
Wherein the surface of the portion where the adhesive layer is exposed is transferred with the rough surface shape of the surface of the metal foil adhered to the adhesive layer,
Wherein the transparent coating layer has adhesiveness. delete delete 22. The method of claim 21,
The conductive portions 14 each have two or more conductive patterns 120 extending in a first direction and formed by the metal thin wires 16 arranged in a second direction orthogonal to the first direction . 25. The method of claim 24,
Wherein the conductive pattern (120) has a pattern in which a plurality of mesh shapes are formed by the thin metal wires (16) and openings. 25. The method of claim 24,
The conductive pattern 120 is configured such that at least two catheters are connected to each other in the first direction via connection portions of the metal thin wires 16,
Wherein each of said catastrophic bodies is formed by combining at least two sublattices (204).

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