KR101986546B1

KR101986546B1 - Substrate griding apparatus and griding method

Info

Publication number: KR101986546B1
Application number: KR1020130060571A
Authority: KR
Inventors: 황지훈; 이정준; 이승후; 이상철
Original assignee: 엘지디스플레이 주식회사
Priority date: 2013-05-28
Filing date: 2013-05-28
Publication date: 2019-09-30
Also published as: KR20140139892A

Abstract

Disclosed is a substrate polishing apparatus of the present invention. More specifically, the present invention relates to a substrate polishing apparatus and method for polishing the edges of a transparent glass substrate or a plastic substrate used in a flat panel display device.
According to the exemplary embodiment of the present invention, the edge of the substrate can be polished closer to the ideal circle by determining the coordinates of the polishing point by the polar coordinate method, replacing the rectangular coordinate method used in the curved polishing process of the conventional substrate. In addition, since the curved polishing process is performed by moving and rotating the substrates on both sides of the polishing wheel, two substrates can be simultaneously processed in one apparatus, thereby improving productivity.

Description

Substrate polishing apparatus and method {SUBSTRATE GRIDING APPARATUS AND GRIDING METHOD}

The present invention relates to a substrate polishing apparatus, and more particularly, to a substrate polishing apparatus and method for polishing a transparent glass substrate or a plastic substrate used in a flat panel display.

Glass substrates or plastic substrates used in flat panel displays such as liquid crystal display (LCD), organic electroluminescence (OLED), plasma display panel (PDP), etc. It is manufactured by dividing.

FIG. 1 is a diagram illustrating a general substrate processing process, and prepares a mother substrate on which signal wiring and a thin film transistor are formed (a), and divides them into a plurality of substrates by scribing them by a predetermined size in the x and y axis directions. (b).

In this case, the plurality of divided substrates have a sharp shape at both ends thereof, and thus cannot be used in the display device, and smoothly polish each side and edge (c). After the polishing process is completed, the substrate is mounted on a case or the like to form one unit substrate (d).

In particular, as shown in FIG. 2, in the aforementioned polishing process (c), the edges of the unit substrate 10 may be gently polished so that the edges may have a gentle curved shape rather than a rectangular shape. It is desirable to process such a curved polishing process for the edge to have a shape as close to the ideal circle L1 as possible in accordance with the recent trend of diversification of the design of the flat panel display device.

However, in the conventional curved polishing method, a rectangular coordinate method for determining coordinates as a distance between two linear axes of the X and Y axes with respect to a reference point is used to determine a position to be polished on a substrate. That is, the curved polishing apparatus determines a reference point that is the center of the circle for each corner of the substrate 10, and determines the position where cutting is necessary as coordinates for the X and Y axes with respect to the reference point to perform polishing.

Therefore, the cutting position of the substrate 10 is represented by a plurality of polishing points located at a predetermined distance from the reference point, and the polishing is performed by their circular interpolation (CirCular interpolation). As an example, the polishing point may be determined by any two points of the edges of the substrate 10, A points positioned at X1 and Y1 coordinates, and B points located at X2 and Y2 coordinates. Accordingly, the shorter the distance between the two A and B points, that is, the larger the number of polishing points, the closer the edge of the substrate 10 is to be polished closer to the ideal circle.

However, there are limitations in setting the number of such polishing points to a large number, and there are limitations in implementing the ideal circle L1 even if very many polishing points are set to approach a curved shape.

SUMMARY OF THE INVENTION The present invention has been made to overcome the above limitations, and an object of the present invention is to provide a substrate curved polishing method having an ideal circular shape in place of a conventional rectangular coordinate method in a curved polishing method of a substrate.

In addition, the present invention has another object to reduce the time of the substrate manufacturing process by simultaneously polishing two substrates in one substrate polishing apparatus.

In order to achieve the above object, a substrate polishing apparatus according to a preferred embodiment of the present invention, the substrate support table; The substrate is mounted on the support table and loaded from the outside. The substrate is disposed in the first direction and the second direction by determining a point (hereinafter, referred to as a “polishing point”) where the polishing process is applied on the actual substrate in a polar coordinate method. A substrate stacking unit configured to move and rotate in a direction; A polishing wheel disposed at the center of the support table to polish an area corresponding to the polishing point on the substrate by rotational driving; And a wheel fixing portion coupled to the support table and for positioning the polishing wheel on the substrate loading portion.

In addition, the substrate polishing method according to an embodiment of the present invention, the step of loading a substrate; Positioning the substrate as a starting point for polishing; And a substrate installed on the support table and loaded from the outside, and determining a point (hereinafter, referred to as a “polishing center point”) on which the polishing process is applied on the actual substrate in a polar coordinate method. Moving and rotating in two directions.

Substrate polishing apparatus and method according to an embodiment of the present invention by determining the coordinates of the polishing point in the polar coordinate method in place of the rectangular coordinate method used in the curved polishing process for the side and the edge of the conventional substrate, the side and edge of the substrate The effect can be polished closer to the ideal circle.

In addition, according to the present invention, since the curved polishing process is performed by moving and rotating the substrate on both sides of the polishing wheel, two substrates can be simultaneously polished in one device, thereby improving productivity.

1 is a view showing a general substrate processing process.
FIG. 2 is a diagram illustrating a corner shape when the edge of the substrate is polished by the rectangular coordinate method in the polishing process during the substrate processing step.
3 is a perspective view showing the structure of a substrate polishing apparatus according to an embodiment of the present invention.
4 is a view illustrating a process of polishing two substrates loaded on a substrate polishing apparatus.
5 and 6 are diagrams for explaining a polishing center point and a polishing point setting method according to the polar coordinate method used in the substrate polishing apparatus according to an embodiment of the present invention.
7 and 8 illustrate a substrate polishing method according to an embodiment of the present invention.

Hereinafter, a substrate polishing apparatus and method according to a preferred embodiment of the present invention with reference to the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the embodiments are intended to complete the disclosure of the present invention, but the general knowledge in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention.

In particular, the substrate to be polished in the embodiment of the present invention may be applied to any flat panel display device such as a liquid crystal display, a liquid crystal display (LCD), an organic light emitting diode (OLED), a plasma display panel (PDP), etc. If the structure of the substrate is described as an example of the substrate of the liquid crystal display device currently widely used, a plurality of gate wirings and data wirings arranged on the lower substrate by an array process to define pixel regions And a thin film transistor which is a driving element connected to the gate wiring and the data wiring in each of the pixel regions. In addition, the pixel electrode for driving the liquid crystal layer may be formed by being connected to the thin film transistor through the array process and applying a signal through the thin film transistor.

In addition, a color filter layer including a red, green, and blue sub-color filter that implements color by a color filter process may be formed on the upper substrate that is separated by a predetermined distance with the liquid crystal layer interposed therebetween. In this case, when a liquid crystal display device having an in-plane switching (IPS) method is manufactured, the common electrode may be formed on an array substrate on which the pixel electrode is formed through the array process.

3 is a perspective view illustrating a structure of a substrate polishing apparatus according to an embodiment of the present invention, and FIG. 4 is a view illustrating a process of polishing two substrates loaded on the substrate polishing apparatus.

Referring to FIG. 3, the substrate polishing apparatus 200 of the present invention includes a support table 210, a substrate loading unit 220, a polishing wheel 230, and a wheel fixing unit 240.

The support table 210 is provided with a substrate loading part 220 and a wheel fixing part 240, and stably fixed to the floor so that the substrates 101 and 102 transferred from the outside are seated on the substrate loading part 220 without damage. It is.

The substrate loading unit 220 is installed on the support table 210 and serves to stably seat the first and second substrates 101 and 102 transferred from the outside at the initial point of the process, respectively. To this end, the substrate loading unit 220 is fixed to the support table 210, the first traveling member 221 and the rotating member 227 coupled to the lower portion of the second traveling member 225 to move in the first direction. And a second traveling member 225 coupled to the lower side of the panel) to move in the second direction, and the first and second substrates 101 and 102 mounted thereon, and a rotating member 227 to rotate in the predetermined direction. .

That is, the substrate loading unit 220 of the present invention moves the first and second substrates 101 and 102 in the X-axis direction and the Y-axis direction, respectively, and rotates at a predetermined angle Θ to fix the position in place. The polishing process is performed by contacting the rotating polishing wheel 230.

The substrate stacker 220 moves and rotates the first and second substrates 101 and 102 through a path determined by the polar coordinate method, and the path is a controller (not shown) connected to the substrate stacker 220. Can be determined by. In detail, the controller (not shown) determines a plurality of polishing points through polar coordinates during the polishing process, and moves the substrate in the first and second directions while rotating the substrate at a predetermined angle in response to the polishing wheel 230. The four corners of the first and second substrates 101 and 102 are polished in a curved shape.

The polishing wheel 230 is disposed at the center of the polishing apparatus and allows the first and second substrates 101 and 102 mounted on the substrate loading unit 220 to polish the edges during the first and second directions and the rotating process. do. In particular, the polishing wheel 230 has a structure that only rotates in one direction by a connected rotating shaft (not shown) but does not move in the first direction and the first direction.

That is, the position of the polishing wheel 230 is fixed on the support table 210 to perform only a rotation drive, and the polishing process proceeds as the object to be polished is moved to the polishing wheel 230.

As the abrasive wheel 230, a grindstone or abrasive stone is used, and is substantially circular. In addition, since the polishing wheel 230 substantially serves to polish a glass substrate or a plastic substrate, the polishing wheel 230 is made of at least a material stronger than glass, and the material may be quartz, silicon carbide, aluminum oxide, iron oxide, chromium oxide, or the like. This can be used.

The wheel fixing part 240 is installed at the center of the substrate polishing apparatus 200, and the polishing wheel 230 is coupled to the bottom in a bridge structure. Although not shown, the wheel fixing part 240 is connected to the polishing wheel 230 through a predetermined rotation axis (not shown), and the rotation axis is connected to an external power source (not shown) and is applied by a rotation force applied from the power source. The polishing wheel 230 is configured to rotate in a predetermined direction during the polishing process. That is, the rotation shaft is configured to perform the substrate polishing process by rotating only the position of the polishing wheel 230 at the upper portion of the substrate loading part 220.

According to the above-described structure, the substrate polishing apparatus 200 of the present invention transfers the two first and second substrates 101 and 102 cut and transferred from the mother substrate to the rotating member 227 of the substrate loading part 220. The polishing process is performed by loading and contacting the polishing wheel 230 that rotates in one direction according to the movement and rotation of the substrate of the first travel member 225 and the second travel member 227.

At this time, it is preferable that the first substrate 101 and the second substrate 102 are set to rotate in different directions, and the rotation direction Θ 3 of the polishing wheel 230 may be applied in any direction.

In particular, the movement paths of the first substrate 101 and the second substrate 102 are determined based on the polishing point determined by the polar coordinate calculation by the controller, and each corner of the substrate has a predetermined angle and direction Θ1 from the polishing point, respectively. , Θ2), and the polishing proceeds.

5 and 6 are diagrams for explaining a polishing center point and a polishing point setting method according to the polar coordinate method used in the substrate polishing apparatus according to an embodiment of the present invention.

Referring to FIG. 5, in order to set the polishing center point and the polishing point, the center point CT0 of the target substrate 100 is set. Next, since there are four corners in total, the substrate 100 is divided into four regions (A, B, C, and D), and when the coordinates of the substrate center point CT0 are X0 and Y0, each divided region (A, One polishing center point is set for B, C, and D).

Here, the polishing center point is defined as a point on which polishing is given when each edge has an ideal circular shape of the same shape. When the substrate 100 is rotated with respect to the center point CT0, a part out of an edge required for actual polishing may be polished, and the shape of the polished curve is closer to a straight line as the size of the substrate 100 increases. do. Therefore, if one polishing center point CTa, CTb, CTc, CTd is set for each of the divided regions A, B, C, and D, and not the center point CT0, polishing is performed based on the assumption that the substrate rotates. Only the necessary edge areas can be machined accurately.

However, in practice, the substrate 100 cannot be rotated based on the respective polishing center points CTa, CTb, CTc, and CTd, and accordingly, the present invention rotates the center point CT0 of the substrate 100, The coordinates of CT0) are moved on the X and Y axes so that the substrate 100 has the same effect as the substrate 100 rotated with respect to the polishing center points CTa, CTb, CTc, and CTd.

If the coordinates of the polishing center points CTa, CTb, CTc, and CTd are CTa (Xa, Ya), CTb (Xb, Yb), CTc (Xc, Yc) and CTd (Xd, Yd), respectively, This can be calculated as the distance (d) from the coordinates CT0 (X0, T0) of the center point, so that the polishing point rotates a certain angle (Θ) from the polishing center points (CTa, CTb, CTc, CTd) to the circular radius (R). It is defined as points within a path.

Accordingly, when the path data of the polishing point is calculated, the substrate 100 is moved on the X-axis and the Y-axis, and at the same time, the substrate 100 is rotated at an angle Θ to polish in an ideal circular shape.

As an example, a method of processing the divided B region of the substrate 100 will be described. As illustrated in FIG. 6, the polishing center point (CTb) is based on the center point CT0 (X0, Y0) of the substrate 100. (Xb, Yb)) is set, and the point rotated by an angle Θ with respect to the polishing center point (CTb (Xb, Yb)) according to the radius R of the circle becomes the polishing point. When the rotation angle is 0 ° at the first polishing point b1 (R, Θ1), the rotation angle is 90 ° at the second polishing point b2 (R, Θ2), and the third polishing point b3 (R, In Θ3), the rotation angle is determined to be 45 °.

Hereinafter, a substrate polishing method according to an embodiment of the present invention will be described with reference to the drawings.

7 and 8 illustrate a substrate polishing method according to an embodiment of the present invention. Referring first to Figure 7, the substrate polishing method of the present invention, the step of loading the substrate on the table (S100), positioning the substrate as a starting point (S110) and polishing according to the polar coordinates for each corner of the substrate Comprising the step (S120) to perform the process.

Loading the substrate on the table (S100) is a step in which the substrate divided from the mother substrate is transferred from the outside and loaded on the substrate loading portion of the substrate polishing apparatus. In this case, two substrate loading units may be provided in one apparatus, and thus, two substrates may be loaded at the same time.

Positioning the substrate as a starting point of polishing (S110) is a step of placing the substrate at a process starting point corresponding to the position of the polishing wheel to perform the polishing process. In this step, the center point of the substrate can be set.

The step of performing a polishing process according to the polar coordinate value of each edge of the substrate (S120) is installed on the support table to load the substrate transferred from the outside, the point where the polishing process is applied on the actual substrate in the polar coordinate method, that is, polishing It is a step of moving and rotating the substrate in a first direction and a second direction by determining a point. In particular, the polishing point is set based on the polishing center point away from the center point of the substrate by a predetermined distance (d), and therefore, the step of calculating the polishing center point first must be preceded.

Hereinafter, the polishing step (S120) will be described in more detail with reference to the drawings.

Referring to FIG. 8, in the substrate polishing method of the present invention, calculating a polishing center value corresponding to each edge in correspondence with a reference coordinate (S210) and calculating path data when the substrate is rotated based on the polishing center coordinate value. In step S220 and in response to the path data, the substrate is moved to X and Y and rotated at an angle Θ (S230).

Computing the polishing center value corresponding to the edge (S210), the substrate is divided into four regions through the set substrate center point, and setting one polishing center point for each four division region using the coordinates of the substrate center point to be.

Computing the path data when the substrate is rotated based on the polishing center coordinate value (S220) is to calculate points in the path when the substrate is rotated by a circular radius to be polished through the coordinates of the polishing center point. The path data is then the polishing point that is removed when the actual substrate is polished.

In operation S230, the substrate is moved to X and Y in response to the path data and the substrate is rotated at a predetermined angle Θ. The calculated path data, that is, the polishing point is obtained as the center point of the substrate rather than the actual path. It is calculated by using the polishing center point and the rotation angle through this. Since the polishing wheel cannot be positioned only by the rotation of the substrate, the substrate is rotated at a certain angle (Θ) and moved along the X and Y axes. Controlling the substrate such that the polishing wheel contacts the polishing point.

Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

101: first substrate 102: second substrate
200 substrate polishing apparatus 210 support table
220: substrate loading portion 221: first running member
225: second running member 227: rotating member
230: polishing wheel 240: wheel fixing portion

Claims

Support table;
A substrate loading part installed on the support table to load a substrate transferred from the outside, and moving and rotating the substrate in a first direction and a second direction;
A controller for determining a point (hereinafter, referred to as a “polishing point”) to which a polishing process is applied in the substrate;
A polishing wheel disposed at the center of the support table to polish an area corresponding to the polishing point on the substrate by rotational driving; And
A wheel fixing portion coupled to the support table and for positioning the polishing wheel on the substrate loading portion,
The polishing point is a point in a path when the substrate is rotated at an angle θ based on a circular center point (hereinafter, referred to as a polishing center point) to be formed adjacent to each edge of the substrate. Substrate polishing apparatus defined.

delete

The method of claim 1,
The polishing center point is,
And a substrate polishing apparatus set to a point located at a predetermined distance d from the center point of the substrate.

The method of claim 1,
The substrate loading portion,
A rotating member loaded with the substrate and rotating the substrate in a predetermined direction;
A first traveling member coupled to a lower portion of the rotating member to move in a first direction; And
And a second traveling member fixed to the support table and coupled to a lower portion of the first traveling member to move in a second direction.

The method of claim 4, wherein
The substrate loading portion,
2. A substrate polishing apparatus, wherein two are provided to simultaneously load the first and second substrates.

The method of claim 5,
The rotating member,
And a substrate polishing apparatus for rotating the first and second substrates in different directions, respectively.

Stacking the substrate transferred from the outside into a substrate stacking unit provided on the support table;
Positioning the substrate as a starting point for polishing;
Determining a point (hereinafter, referred to as a “polishing point”) to which the polishing process is applied in the substrate; And
The substrate is moved and rotated in a first direction and a second direction in a path corresponding to the polishing point by using the substrate loading unit, and the polishing of the polishing point is performed by using a polishing wheel disposed at the center of the support table. Performing the process,
The polishing point is a point in a path when the substrate is rotated at an angle θ based on a circular center point (hereinafter, referred to as a polishing center point) to be formed adjacent to each edge of the substrate. Substrate polishing method defined.

The method of claim 7, wherein
Determining the polishing point,
Calculating the polishing center point using the center point of the substrate; And
Calculating path data when the substrate is rotated based on the polishing center point, and determining the polishing point;
The performing of the polishing process includes moving the substrate in first and second directions and rotating the substrate at a predetermined angle in response to the path data.

delete

The method of claim 8,
The polishing center point is set to a point located at a predetermined distance (d) from the center point of the substrate.

The method of claim 7, wherein
The substrate loading portion,
A rotating member loaded with the substrate and rotating the substrate in a predetermined direction;
A first traveling member coupled to a lower portion of the rotating member to move in a first direction; And
And a second traveling member fixed to the support table and coupled to a lower portion of the first traveling member to move in a second direction.

The method of claim 11,
The substrate loading portion,
A substrate polishing method, wherein two are provided to simultaneously load the first and second substrates.

The method of claim 12,
The rotating member,
And polishing the first and second substrates in different directions, respectively.