KR101986546B1 - Substrate griding apparatus and griding method - Google Patents
Substrate griding apparatus and griding method Download PDFInfo
- Publication number
- KR101986546B1 KR101986546B1 KR1020130060571A KR20130060571A KR101986546B1 KR 101986546 B1 KR101986546 B1 KR 101986546B1 KR 1020130060571 A KR1020130060571 A KR 1020130060571A KR 20130060571 A KR20130060571 A KR 20130060571A KR 101986546 B1 KR101986546 B1 KR 101986546B1
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- South Korea
- Prior art keywords
- substrate
- polishing
- point
- center point
- support table
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/20—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of plastics
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Disclosed is a substrate polishing apparatus of the present invention. More specifically, the present invention relates to a substrate polishing apparatus and method for polishing the edges of a transparent glass substrate or a plastic substrate used in a flat panel display device.
According to the exemplary embodiment of the present invention, the edge of the substrate can be polished closer to the ideal circle by determining the coordinates of the polishing point by the polar coordinate method, replacing the rectangular coordinate method used in the curved polishing process of the conventional substrate. In addition, since the curved polishing process is performed by moving and rotating the substrates on both sides of the polishing wheel, two substrates can be simultaneously processed in one apparatus, thereby improving productivity.
Description
The present invention relates to a substrate polishing apparatus, and more particularly, to a substrate polishing apparatus and method for polishing a transparent glass substrate or a plastic substrate used in a flat panel display.
Glass substrates or plastic substrates used in flat panel displays such as liquid crystal display (LCD), organic electroluminescence (OLED), plasma display panel (PDP), etc. It is manufactured by dividing.
FIG. 1 is a diagram illustrating a general substrate processing process, and prepares a mother substrate on which signal wiring and a thin film transistor are formed (a), and divides them into a plurality of substrates by scribing them by a predetermined size in the x and y axis directions. (b).
In this case, the plurality of divided substrates have a sharp shape at both ends thereof, and thus cannot be used in the display device, and smoothly polish each side and edge (c). After the polishing process is completed, the substrate is mounted on a case or the like to form one unit substrate (d).
In particular, as shown in FIG. 2, in the aforementioned polishing process (c), the edges of the
However, in the conventional curved polishing method, a rectangular coordinate method for determining coordinates as a distance between two linear axes of the X and Y axes with respect to a reference point is used to determine a position to be polished on a substrate. That is, the curved polishing apparatus determines a reference point that is the center of the circle for each corner of the
Therefore, the cutting position of the
However, there are limitations in setting the number of such polishing points to a large number, and there are limitations in implementing the ideal circle L1 even if very many polishing points are set to approach a curved shape.
SUMMARY OF THE INVENTION The present invention has been made to overcome the above limitations, and an object of the present invention is to provide a substrate curved polishing method having an ideal circular shape in place of a conventional rectangular coordinate method in a curved polishing method of a substrate.
In addition, the present invention has another object to reduce the time of the substrate manufacturing process by simultaneously polishing two substrates in one substrate polishing apparatus.
In order to achieve the above object, a substrate polishing apparatus according to a preferred embodiment of the present invention, the substrate support table; The substrate is mounted on the support table and loaded from the outside. The substrate is disposed in the first direction and the second direction by determining a point (hereinafter, referred to as a “polishing point”) where the polishing process is applied on the actual substrate in a polar coordinate method. A substrate stacking unit configured to move and rotate in a direction; A polishing wheel disposed at the center of the support table to polish an area corresponding to the polishing point on the substrate by rotational driving; And a wheel fixing portion coupled to the support table and for positioning the polishing wheel on the substrate loading portion.
In addition, the substrate polishing method according to an embodiment of the present invention, the step of loading a substrate; Positioning the substrate as a starting point for polishing; And a substrate installed on the support table and loaded from the outside, and determining a point (hereinafter, referred to as a “polishing center point”) on which the polishing process is applied on the actual substrate in a polar coordinate method. Moving and rotating in two directions.
Substrate polishing apparatus and method according to an embodiment of the present invention by determining the coordinates of the polishing point in the polar coordinate method in place of the rectangular coordinate method used in the curved polishing process for the side and the edge of the conventional substrate, the side and edge of the substrate The effect can be polished closer to the ideal circle.
In addition, according to the present invention, since the curved polishing process is performed by moving and rotating the substrate on both sides of the polishing wheel, two substrates can be simultaneously polished in one device, thereby improving productivity.
1 is a view showing a general substrate processing process.
FIG. 2 is a diagram illustrating a corner shape when the edge of the substrate is polished by the rectangular coordinate method in the polishing process during the substrate processing step.
3 is a perspective view showing the structure of a substrate polishing apparatus according to an embodiment of the present invention.
4 is a view illustrating a process of polishing two substrates loaded on a substrate polishing apparatus.
5 and 6 are diagrams for explaining a polishing center point and a polishing point setting method according to the polar coordinate method used in the substrate polishing apparatus according to an embodiment of the present invention.
7 and 8 illustrate a substrate polishing method according to an embodiment of the present invention.
Hereinafter, a substrate polishing apparatus and method according to a preferred embodiment of the present invention with reference to the drawings.
Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the embodiments are intended to complete the disclosure of the present invention, but the general knowledge in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention.
In particular, the substrate to be polished in the embodiment of the present invention may be applied to any flat panel display device such as a liquid crystal display, a liquid crystal display (LCD), an organic light emitting diode (OLED), a plasma display panel (PDP), etc. If the structure of the substrate is described as an example of the substrate of the liquid crystal display device currently widely used, a plurality of gate wirings and data wirings arranged on the lower substrate by an array process to define pixel regions And a thin film transistor which is a driving element connected to the gate wiring and the data wiring in each of the pixel regions. In addition, the pixel electrode for driving the liquid crystal layer may be formed by being connected to the thin film transistor through the array process and applying a signal through the thin film transistor.
In addition, a color filter layer including a red, green, and blue sub-color filter that implements color by a color filter process may be formed on the upper substrate that is separated by a predetermined distance with the liquid crystal layer interposed therebetween. In this case, when a liquid crystal display device having an in-plane switching (IPS) method is manufactured, the common electrode may be formed on an array substrate on which the pixel electrode is formed through the array process.
3 is a perspective view illustrating a structure of a substrate polishing apparatus according to an embodiment of the present invention, and FIG. 4 is a view illustrating a process of polishing two substrates loaded on the substrate polishing apparatus.
Referring to FIG. 3, the
The support table 210 is provided with a
The
That is, the
The
The
That is, the position of the
As the
The
According to the above-described structure, the
At this time, it is preferable that the
In particular, the movement paths of the
5 and 6 are diagrams for explaining a polishing center point and a polishing point setting method according to the polar coordinate method used in the substrate polishing apparatus according to an embodiment of the present invention.
Referring to FIG. 5, in order to set the polishing center point and the polishing point, the center point CT0 of the
Here, the polishing center point is defined as a point on which polishing is given when each edge has an ideal circular shape of the same shape. When the
However, in practice, the
If the coordinates of the polishing center points CTa, CTb, CTc, and CTd are CTa (Xa, Ya), CTb (Xb, Yb), CTc (Xc, Yc) and CTd (Xd, Yd), respectively, This can be calculated as the distance (d) from the coordinates CT0 (X0, T0) of the center point, so that the polishing point rotates a certain angle (Θ) from the polishing center points (CTa, CTb, CTc, CTd) to the circular radius (R). It is defined as points within a path.
Accordingly, when the path data of the polishing point is calculated, the
As an example, a method of processing the divided B region of the
Hereinafter, a substrate polishing method according to an embodiment of the present invention will be described with reference to the drawings.
7 and 8 illustrate a substrate polishing method according to an embodiment of the present invention. Referring first to Figure 7, the substrate polishing method of the present invention, the step of loading the substrate on the table (S100), positioning the substrate as a starting point (S110) and polishing according to the polar coordinates for each corner of the substrate Comprising the step (S120) to perform the process.
Loading the substrate on the table (S100) is a step in which the substrate divided from the mother substrate is transferred from the outside and loaded on the substrate loading portion of the substrate polishing apparatus. In this case, two substrate loading units may be provided in one apparatus, and thus, two substrates may be loaded at the same time.
Positioning the substrate as a starting point of polishing (S110) is a step of placing the substrate at a process starting point corresponding to the position of the polishing wheel to perform the polishing process. In this step, the center point of the substrate can be set.
The step of performing a polishing process according to the polar coordinate value of each edge of the substrate (S120) is installed on the support table to load the substrate transferred from the outside, the point where the polishing process is applied on the actual substrate in the polar coordinate method, that is, polishing It is a step of moving and rotating the substrate in a first direction and a second direction by determining a point. In particular, the polishing point is set based on the polishing center point away from the center point of the substrate by a predetermined distance (d), and therefore, the step of calculating the polishing center point first must be preceded.
Hereinafter, the polishing step (S120) will be described in more detail with reference to the drawings.
Referring to FIG. 8, in the substrate polishing method of the present invention, calculating a polishing center value corresponding to each edge in correspondence with a reference coordinate (S210) and calculating path data when the substrate is rotated based on the polishing center coordinate value. In step S220 and in response to the path data, the substrate is moved to X and Y and rotated at an angle Θ (S230).
Computing the polishing center value corresponding to the edge (S210), the substrate is divided into four regions through the set substrate center point, and setting one polishing center point for each four division region using the coordinates of the substrate center point to be.
Computing the path data when the substrate is rotated based on the polishing center coordinate value (S220) is to calculate points in the path when the substrate is rotated by a circular radius to be polished through the coordinates of the polishing center point. The path data is then the polishing point that is removed when the actual substrate is polished.
In operation S230, the substrate is moved to X and Y in response to the path data and the substrate is rotated at a predetermined angle Θ. The calculated path data, that is, the polishing point is obtained as the center point of the substrate rather than the actual path. It is calculated by using the polishing center point and the rotation angle through this. Since the polishing wheel cannot be positioned only by the rotation of the substrate, the substrate is rotated at a certain angle (Θ) and moved along the X and Y axes. Controlling the substrate such that the polishing wheel contacts the polishing point.
Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.
101: first substrate 102: second substrate
200
220: substrate loading portion 221: first running member
225: second running member 227: rotating member
230: polishing wheel 240: wheel fixing portion
Claims (13)
A substrate loading part installed on the support table to load a substrate transferred from the outside, and moving and rotating the substrate in a first direction and a second direction;
A controller for determining a point (hereinafter, referred to as a “polishing point”) to which a polishing process is applied in the substrate;
A polishing wheel disposed at the center of the support table to polish an area corresponding to the polishing point on the substrate by rotational driving; And
A wheel fixing portion coupled to the support table and for positioning the polishing wheel on the substrate loading portion,
The polishing point is a point in a path when the substrate is rotated at an angle θ based on a circular center point (hereinafter, referred to as a polishing center point) to be formed adjacent to each edge of the substrate. Substrate polishing apparatus defined.
The polishing center point is,
And a substrate polishing apparatus set to a point located at a predetermined distance d from the center point of the substrate.
The substrate loading portion,
A rotating member loaded with the substrate and rotating the substrate in a predetermined direction;
A first traveling member coupled to a lower portion of the rotating member to move in a first direction; And
And a second traveling member fixed to the support table and coupled to a lower portion of the first traveling member to move in a second direction.
The substrate loading portion,
2. A substrate polishing apparatus, wherein two are provided to simultaneously load the first and second substrates.
The rotating member,
And a substrate polishing apparatus for rotating the first and second substrates in different directions, respectively.
Positioning the substrate as a starting point for polishing;
Determining a point (hereinafter, referred to as a “polishing point”) to which the polishing process is applied in the substrate; And
The substrate is moved and rotated in a first direction and a second direction in a path corresponding to the polishing point by using the substrate loading unit, and the polishing of the polishing point is performed by using a polishing wheel disposed at the center of the support table. Performing the process,
The polishing point is a point in a path when the substrate is rotated at an angle θ based on a circular center point (hereinafter, referred to as a polishing center point) to be formed adjacent to each edge of the substrate. Substrate polishing method defined.
Determining the polishing point,
Calculating the polishing center point using the center point of the substrate; And
Calculating path data when the substrate is rotated based on the polishing center point, and determining the polishing point;
The performing of the polishing process includes moving the substrate in first and second directions and rotating the substrate at a predetermined angle in response to the path data.
The polishing center point is set to a point located at a predetermined distance (d) from the center point of the substrate.
The substrate loading portion,
A rotating member loaded with the substrate and rotating the substrate in a predetermined direction;
A first traveling member coupled to a lower portion of the rotating member to move in a first direction; And
And a second traveling member fixed to the support table and coupled to a lower portion of the first traveling member to move in a second direction.
The substrate loading portion,
A substrate polishing method, wherein two are provided to simultaneously load the first and second substrates.
The rotating member,
And polishing the first and second substrates in different directions, respectively.
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KR1020130060571A KR101986546B1 (en) | 2013-05-28 | 2013-05-28 | Substrate griding apparatus and griding method |
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KR1020130060571A KR101986546B1 (en) | 2013-05-28 | 2013-05-28 | Substrate griding apparatus and griding method |
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KR101986546B1 true KR101986546B1 (en) | 2019-09-30 |
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KR20020054872A (en) * | 2000-12-28 | 2002-07-08 | 구본준, 론 위라하디락사 | Device for grinding a panel and method for grinding the same |
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