KR101982583B1 - Photoreaction molding system and process for injection molding using sequential light exposure technique - Google Patents

Photoreaction molding system and process for injection molding using sequential light exposure technique Download PDF

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Publication number
KR101982583B1
KR101982583B1 KR1020170137674A KR20170137674A KR101982583B1 KR 101982583 B1 KR101982583 B1 KR 101982583B1 KR 1020170137674 A KR1020170137674 A KR 1020170137674A KR 20170137674 A KR20170137674 A KR 20170137674A KR 101982583 B1 KR101982583 B1 KR 101982583B1
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KR
South Korea
Prior art keywords
mold
exposure
resin
cavity
gap
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KR1020170137674A
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Korean (ko)
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KR20190044979A (en
Inventor
심용식
이원석
안수지
Original Assignee
주식회사 지앤아이솔루션
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Priority to KR1020170137674A priority Critical patent/KR101982583B1/en
Priority to PCT/KR2018/006417 priority patent/WO2019083114A1/en
Publication of KR20190044979A publication Critical patent/KR20190044979A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0075—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping curing or polymerising by irradiation
    • B29C2045/77—

Abstract

According to one embodiment of the present invention, a photoreactive molding mold system for removing burrs using a sequential exposure technique is disclosed. The photoreactive molding mold system comprises: a first mold; And a second mold, wherein the first mold comprises: a cavity in which a resin can be received in a first surface formed to face the second mold among the surfaces formed in the first mold; And an exposure module disposed opposite the first surface and facing the second surface of the first mold and capable of irradiating a light beam toward the second surface, the second mold comprising: Wherein the second mold provides pressure to the received resin by moving in a direction of the first surface of the first mold, the exposure module comprising: It is possible to cure at least a portion of the received resin to a predetermined viscosity by first irradiating a light beam of a pre-cured exposure dose prior to irradiating the full cured exposure dose toward the entire second face.

Description

TECHNICAL FIELD [0001] The present invention relates to a photoreactive molding mold system and process using a sequential exposure technique,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoreactive molding mold system using a sequential exposure technique, and more particularly, to a system for sequentially exposing a photoreactive resin to suppress generation of burrs during injection molding.

Since plastics are advantageous in mass production at low cost, light in weight, and can realize various physical properties, they are used as core materials in most products leading to domestic and overseas industries. Among them, the largest number of molded articles are produced by the injection molding method. Especially, plastic injection molding products ranging from automobiles, mobile phones, household appliances, to vessels, aviation and interior and exterior materials are being manufactured in accordance with the trend of high-grade and multifunctional plastic products.

Exposure Technique Injection molding is one of the injection molding techniques, and is an injection molding technique using photoreactive materials. When filling the material in the cavity and irradiating light while pressurizing the filled material, the filled material is hardened and a product is produced.

In this case, if there is a minute gap in the cavity in which the material is filled, a burr may be generated due to a minute gap. As the filled resin is pressurized, at least a part of the resin flows into the fine gap, and the material is hardened while flowing and burrs are generated.

The burr causes many problems such as impairing the beauty of the produced product, causing unintended product failure, and the like.

Therefore, much research has been conducted on a method and apparatus for suppressing burr formation during injection molding using an exposure technique.

Korea Registered Patent: No. 10-1565515

The present invention has been devised to cope with the background art described above, and is intended to suppress the generation of burrs by successively exposing the photoreactive resin during injection molding.

According to a first aspect of the present invention, there is provided a photoreactive molding mold system for removing burrs using a sequential exposure technique, the photoreactive molding mold system comprising: ; And a second mold, wherein the first mold comprises: a cavity in which a resin can be received in a first surface formed to face the second mold among the surfaces formed in the first mold; And an exposure module disposed opposite the first surface and facing the second surface of the first mold and capable of irradiating a light beam toward the second surface, the second mold comprising: Wherein the second mold provides pressure to the received resin by moving in a direction of the first surface of the first mold, the exposure module comprising: It is possible to cure at least a portion of the received resin to a predetermined viscosity by first irradiating a light beam of a pre-cured exposure dose prior to irradiating the full cured exposure dose toward the entire second face.

The second aspect relates to an injection molding method using a sequential exposure technique, comprising: a resin filling step of filling a cavity of a first mold with resin, the first mold being formed to face the second mold, A first surface, a second surface opposite the first surface, and an exposure module capable of irradiating a light beam toward the second surface; An oxygen removing step of sucking air in the cavity; A first irradiating step of irradiating a light beam of a linear exposure amount toward the second surface; A pressing step of pressing the filled resin with a second mold after the first irradiation step is started; And a second irradiating step of irradiating a light ray of a full curing exposure dose toward the second surface; . ≪ / RTI >

According to an embodiment of the present invention, the generation of burrs can be suppressed by using the sequential exposure technique.

Various aspects are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following examples, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects. However, it will be apparent that such aspect (s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more aspects.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic diagram illustrating a photoreactive molding mold system in accordance with one embodiment of the present invention.
FIG. 2 is a view for explaining components and operation of a photoreaction molding mold system according to an embodiment of the present invention. Referring to FIG.
FIG. 3 shows a flowchart for explaining the injection molding method according to an embodiment of the present invention.
4 is a view for explaining a sequential exposure technique according to an embodiment of the present invention.
5 is a view for explaining a gap for generating a burr in the photoreactive molding mold system according to an embodiment of the present invention.
6 illustrates a general injection molding step according to an embodiment of the present invention.
7 shows an in-mold injection molding step according to an embodiment of the present invention.
FIG. 8 is a table and a graph showing the thickness of a cured layer according to exposure time when an acrylic resin according to an embodiment of the present invention is exposed to ultraviolet rays having an exposure energy of 3.0 mJ / cm 2 sec.
Figure 9 illustrates a first mold formed with a plurality of molds and an ejector pin, according to one embodiment of the present invention.

Various embodiments and / or aspects are now described with reference to the drawings. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects. However, it will also be appreciated by those of ordinary skill in the art that such aspect (s) may be practiced without these specific details. The following description and the annexed drawings set forth in detail certain illustrative aspects of one or more aspects. It is to be understood, however, that such aspects are illustrative and that some of the various ways of practicing various aspects of the principles of various aspects may be utilized, and that the description set forth is intended to include all such aspects and their equivalents.

In addition, various aspects and features will be presented by a system that may include one or more devices, terminals, servers, devices, components and / or modules, and the like. It is to be understood and appreciated that the various systems may include additional devices, terminals, servers, devices, components and / or modules, and / or devices, terminals, It should also be understood and appreciated that the present invention may not include all of the devices, components, modules, and the like.

As used herein, the terms " an embodiment, " " an embodiment, " " an embodiment, " " an embodiment ", etc. are intended to indicate that any aspect or design described is better or worse than other aspects or designs. . As used herein, the terms 'component', 'module', 'system', 'interface' and the like generally refer to a computer-related entity such as a combination of hardware, , ≪ / RTI > or software.

In addition, the term " or " is intended to mean " exclusive or " That is, it is intended to mean one of the natural inclusive substitutions " X uses A or B ", unless otherwise specified or unclear in context. That is, X uses A; X uses B; Or when X uses both A and B, " X uses A or B " can be applied to either of these cases. It should also be understood that the term " and / or " as used herein refers to and includes all possible combinations of one or more of the listed related items.

It is also to be understood that the term " comprises " and / or " comprising " means that the feature and / or component is present, but does not exclude the presence or addition of one or more other features, components and / It should be understood that it does not. Also, unless the context clearly dictates otherwise or to the contrary, the singular forms in this specification and claims should generally be construed to mean " one or more. &Quot;

Before describing the embodiments of the present invention in detail, it is to be understood that the present invention is not limited to the above-described embodiments, but may be modified and changed without departing from the scope and spirit of the invention. It is also to be understood that the terminology or words used in the present specification and claims should be interpreted with reference to the meaning of the inventive concept of the present invention based on the principle that the inventor can define the concept of appropriate terms to describe his invention in the best way It should be interpreted as a concept.

The burr disclosed in the present specification means that a part of the workpiece rises and remains due to plastic deformation of the workpiece when a resin or metal is processed. The appearance of the bur is a factor that deteriorates the quality of the functional product and causes the failure of the injection molding product.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram illustrating a photoreactive molding mold system in accordance with one embodiment of the present invention.

Referring to FIG. 1 (a), a photoreactive molding mold system 1000 (see FIG. 2) includes a first mold 200 (see FIG. 2) and a second mold 100 See FIG. 2). The first mold 200 may include a cavity 250 (see FIG. 2) in which a material can be filled and may include an exposure module 240 (see FIG. 2) for irradiating the cavity 250 with a light beam .

Referring to FIG. 1 (b), the photoreactive molding mold system 1000 may further include a pretreatment module 400 (see FIG. 2) for removing oxygen in the cavity. The cavity 250 of the photoreaction molding system 1000 may be filled with a material. Here, the material may include a photocurable resin.

As shown in FIG. 1 (b), the pre-processing module 400 may remove oxygen in the cavity 250 before the material contained in the cavity 250 is linearized. For example, the pre-processing module 400 can remove oxygen by sucking air in the cavity 250. For example, the pre-processing module 400 can vacuum the air in the cavity 250 to remove oxygen-containing air.

In addition, the pretreatment module 400 can remove oxygen by injecting an inert gas into the cavity 250. Here, the inert gas may include, but is not limited to, argon (Ar), helium (He), neon (Ne)

Referring to FIG. 1 (c), the material filled in the cavity 250 of the photoreactive molding mold system 1000 can be pressed by the movement of the second mold 100. Here, the material may be pre-cured by the light beam primarily irradiated by the exposure module 240 before the pressurization of the material is started, and after the start of the pressurization, by the light beams irradiated by the exposure module 240 Can be fully cured.

As a result, the photoreactive molding mold system 1000 can produce a product having a specific shape.

6) exists in the first mold 200 in which the cavity 250 is formed, a material filled in the cavity 250 flows into the gap by pressurization, so that a burr may be generated .

According to an embodiment of the present invention, the beam of the pre-cured exposure dose may be first irradiated (primary ray irradiation, pre-curing) to the first half of the workpiece before the filled material is pressed to reduce the incidence of burrs, As a result, the viscosity of the material increases, and the rate of occurrence of burrs due to the pressurization of the second mold 100 can be reduced.

FIG. 2 is a view for explaining components and operation of a photoreaction molding mold system according to an embodiment of the present invention. Referring to FIG.

According to one embodiment of the present invention, the photoreactive molding mold system 1000 may include a first mold 200, a second mold 100, and a pre-processing module 400.

The first mold 200 may have a cavity 250 in which a material can be accommodated in the first surface 212 formed to face the second mold 100 among the surfaces formed in the first mold 200. Also, a second surface 214 may be provided in a direction opposite to the first surface 212.

The first mold 200 may include an exposure module 240 and the exposure module 240 may irradiate a light beam toward the second side 214. Further, the exposure module 240 can irradiate the light toward the first surface 212 and irradiate the light to the cavity 250. [

The second mold 100 may have a core 120 at a position corresponding to the cavity 250. The second mold 100 can move to the first mold 200 and the core 120 can press the cavity 250 when the second mold 100 moves in the direction of the cavity 250. [ When the cavity 250 is filled with a material, the core 120 can press the filled material.

The preprocessing module 400 may remove oxygen in the cavity 250 before the material contained in the cavity 250 is pre-cured. For example, the pre-processing module 400 can remove oxygen by sucking air in the cavity 250. For example, the pre-processing module 400 can vacuum the air in the cavity 250 to remove oxygen-containing air.

In addition, the pretreatment module 400 can remove oxygen by injecting an inert gas into the cavity 250. Here, the inert gas may include, but is not limited to, argon (Ar), helium (He), neon (Ne)

According to an embodiment of the present invention, the preprocessing module 400 may be provided on at least one of the components located at upper, lower, right, and left sides with respect to the cavity 250. In addition, the pre-processing module 400 may be provided in the cavity 250. The position and form of the preprocessing module 400 are not limited to the above-described embodiments.

The material to be filled in the cavity 250 may vary. For example, the cavity 250 may be filled with a thermoplastic resin, and the photoreactive resin may be filled. When the cavity 250 is filled with the photoreactive resin, the filled photoreactive resin can be cured by the light irradiated by the exposure module 240. In this case, the photoreactive resin may include an ultraviolet curing resin, and the exposure module 240 may irradiate ultraviolet rays.

According to one embodiment of the present invention, the exposure module 240 includes a plurality of exposures (not shown) that are positioned at a lower portion apart from the second surface of the first mold and facing the second surface, Units.

Each of the plurality of exposure units may be mapped with each of the corresponding portions of the second surface 214 to illuminate the light beam toward corresponding portions of the second surface when illuminated.

In this case, the plurality of exposure units may be divided into a plurality of groups. For example, the plurality of exposure units may be divided into a first exposure unit group arranged to face an edge portion of the second surface 214 and a second exposure unit group arranged to face a portion except an edge portion of the second surface have.

In this case, the edge portion of the second surface 214 may include a portion of the second surface 214 corresponding to the gap formed in the first surface 212. For example, when a fine gap is present on the first surface 212 by the take-out portion formed on the first surface 212, a portion of the second surface 214 corresponding to the fine gap may be an edge portion. As a result, when the exposure module 240 irradiates the light beam toward the edge of the second surface 214, the irradiated light beam can touch a fine gap formed on the first surface 212 and / or its periphery.

According to one embodiment of the present invention, the exposure module 240 first irradiates the beam of the pre-cured exposure dose toward the entirety of the second face of the first mold 200, before contacting the second mold 100 with the received material So that at least a portion of the material received on a portion of the first side can be pre-cured (pre-cured) to a predetermined viscosity. For example, the photoresponsive molding system 1000 may include a first exposure unit group disposed to face the second face and an exposure unit included in the second exposure unit group, Of the light beam. As a result, photoresist forming mold system 1000 may first harden at least a portion of the material to a predetermined viscosity prior to pressing the material contained in cavity 250 through core 120.

Here, the pre-cured exposure dose may include an exposure amount to cure the material contained in the cavity 250 to a predetermined viscosity, and the pre-cured exposure dose may be determined based on a predetermined viscosity of the material.

The predetermined viscosity may include a viscosity at which the material accommodated in the cavity 250 does not flow into the gap formed between the constituent elements even when the second mold 100 is pressurized, that is, the viscosity does not generate burrs.

According to one embodiment of the present invention, the predetermined viscosity can be determined based on the width of the gap formed between the side of the protrusion and the side of the core 120. [ For example, if the width of the gap formed between the side surface of the protrusion and the side surface of the core 120 is 0.01 mm, the predetermined viscosity may be lower than when the width of the gap is 0.05 mm.

According to one embodiment of the present invention, the predetermined viscosity may comprise the viscosity of the melt of 5000 +/- 1000 cps. When the material contained in the cavity 250 is cured to a viscosity of 5000 cps, the burr may not be generated even if the material is pressed under the condition that the assembly tolerance of the general mold system is 0.03 mm.

According to another embodiment of the present invention, the exposure module 240 is configured to irradiate the beam of the pre-cured exposure dose toward the entirety of the second face of the first mold 200 first, before the second mold 100 contacts the received material To form a cured layer of a predetermined thickness on at least a portion of the material received on a portion of the first surface.

Here, the amount of pre-cured exposure may include an exposure amount for forming a cured layer of a predetermined thickness on at least a part of the material accommodated in the cavity 250, and the amount of pre-cured exposure may be determined based on a predetermined thickness of the material hardened layer .

The predetermined thickness of the cured layer may comprise more than the width of the gap formed between the components of the photoreactively forming mold system 1000. That is, the thickness of the hardened layer that does not generate burrs.

According to one embodiment of the present invention, the predetermined viscosity can be determined based on the width of the gap formed between the side of the protrusion and the side of the core 120. [ For example, if the width of the gap formed between the side surface of the protrusion and the side surface of the core 120 is 0.01 mm, the predetermined viscosity may be lower than when the width of the gap is 0.05 mm.

Thereafter, the photoreactive molding mold system 1000 moves the second mold 100 to press the pre-curled material received in the cavity 250, and a first group of exposure units arranged to face the second surface The exposure units included in the second exposure unit group can be turned on together to irradiate the light of the full curing exposure dose. As a result, the photoreactive molding mold system 1000 can completely cure the material accommodated in the cavity 250.

Here, the full curing exposure dose may include an exposure dose that completely cures the entire material contained in the cavity 250. [

According to another embodiment of the present invention, the exposure module 240 may first irradiate a beam of pre-cured exposure toward a portion of a second side of the first mold 200, thereby causing a portion of the first side At least a portion of the material being received may be cured to a predetermined viscosity. For example, the photoresponse forming mold system 1000 may illuminate the exposure units included in the first exposure unit group arranged to face the edge portion of the second surface earlier than the exposure units included in another exposure unit group . As a result, photoresist forming mold system 1000 may first cure the material located at the periphery of the gap and / or gap of first surface 212 to a predetermined viscosity.

Thereafter, the photoreactive molding mold system 1000 can completely cure the material filled in the cavity by lighting the exposure units included in the other groups.

In this case, the photoresist forming mold system 1000 can light the exposure module 240 in various patterns.

For example, the photoresponsive molding system 1000 may illuminate the exposure unit to sequentially irradiate the full cured exposure dose in order from the edge of the second side 214 toward the center of the second side. In addition, the photoreactive molding mold system 1000 may simultaneously light the exposure units not facing the edge of the second surface 214.

In this case, the photoreactor forming mold system 1000 may illuminate the exposure units not facing the edge portion of the second surface while maintaining the lighting units of the exposure units facing the edge portion of the second surface.

Further, the photoreactor forming mold system 1000 may turn off the lighting of the exposure units facing the edge of the second surface, and may turn on the exposure units not facing the edge of the second surface.

The photoreactive molding mold system 1000 may also be configured such that the exposure units included in the exposure module 240 irradiate the edge of the second side 214 with a light beam of a pre- It is possible to allow the second curing of the rays of the full curing exposure dose toward the remaining portions except for the edge portion.

The photoresponse molding mold system 1000 also includes a photoresist forming mold system 1000 that exposes the light rays of the fully cured exposure dose in order from the edge portion of the second surface 214 of the first mold toward the center of the second surface 214, And the pattern in which the photoreactive molding mold system 1000 irradiates the light through the exposure module 240 is not limited thereto.

According to one embodiment of the present invention, the first mold 200 may include a top support 210 configured with a first side 212 and a second side 214. And a third surface 260 facing away from the lower surface of the upper support and facing the second surface 214 and having a lower support (not shown) having an exposure module 240 on the third surface 260 230 may be further provided

The first mold 200 may also include peripheral pillar portions 220 that contact the edges of the upper and lower supports 210 and 230 respectively and form the boundary of the first mold 200 have.

The peripheral pillar 220 may have protrusions extending from the first surface 212 of the upper support 210 toward the second mold 100 and the protrusions may be formed such that the material filled in the cavity 250 is the first It is possible to prevent outflow from the edge portion of the surface 212 to the outside of the first mold 200.

In this case, the upper support part 210 may be composed of a transparent medium which transmits ultraviolet rays.

According to one embodiment of the present invention, the photoreactive molding mold system 1000 can determine the intensity of the light rays irradiated by the exposure module 240 based on various factors. For example, the photoreactive molding mold system 1000 may have a surface tension of the material contained in the cavity 250, a width of a gap formed between the side surface of the protrusion and the side surface of the core, and a contact angle between the material and the first surface. The irradiation intensity of the light beam can be determined.

Here, the contact angle between the work and the first surface may include an angle between the line in the gas, the first surface and the contact point of the work in the cavity 250 and the angle formed between the first surface and the first surface, Can be determined based on the surface tension. Then, the surface tension of the material can be changed based on the viscosity of the material. For example, as the amount of exposure to the material increases, the viscosity of the material may increase, and as the viscosity of the material increases, the surface tension of the material may increase. And, as the surface tension of the material increases, the contact angle between the material and the first surface may become larger.

According to one embodiment of the present invention, the predetermined viscosity may comprise the viscosity of the melt of 5000 +/- 1000 cps. When the material accommodated in the cavity 250 is cured to a viscosity of 5000 cps of the molten resin, the surface tension of the material may increase, thereby increasing the contact angle between the material and the first surface. In this case, burrs may not be generated even if the material is pressed under the condition that the assembly tolerance of a general mold system is 0.03 mm.

According to one embodiment of the present invention, the material cured by the exposure module 240 may be attached to the second mold 100. The cured material is attached to the second mold 100, so that the user can easily obtain the molded material.

According to another embodiment of the present invention, the photoreactive molding mold system 1000 may include a control unit (not shown). The control unit (not shown) may be implemented by at least one processor and may control the operations of the photocatalytic reaction molding system 1000 described above.

FIG. 3 shows a flowchart for explaining the injection molding method according to an embodiment of the present invention.

In step S310, the photoreactive molding mold system 1000 can fill the cavity 250 of the first mold 200 with material.

The first mold 200 is formed to face the second mold 100 and has a first surface 212 having a cavity 250 and a second surface 214 facing the first surface 212, And an exposure module 240 that can irradiate a light beam toward the two surfaces 214. [

The material to be filled in the cavity 250 may include a thermoplastic resin and a photoreactive resin, and the photoreactive resin may include an ultraviolet curing resin.

In step S320, the photoreactive molding mold system 1000 may remove oxygen present in the cavity 250 through the pre-processing module 400. [

The preprocessing module 400 may remove oxygen in the cavity 250 before the material contained in the cavity 250 is pre-cured. For example, the pre-processing module 400 can remove oxygen by sucking air in the cavity 250. For example, the pre-processing module 400 can vacuum the air in the cavity 250 to remove oxygen-containing air.

In addition, the pretreatment module 400 can remove oxygen by injecting an inert gas into the cavity 250. Here, the inert gas may include, but is not limited to, argon (Ar), helium (He), neon (Ne)

When the pre-processing module 400 injects an inert gas into the cavity 250 to remove oxygen, the pre-processing module 400 inserts an inert gas into the cavity 250 before the optical reaction molding system 1000 pre- Can be injected. After the material is linearized, the pre-processing module 400 can vacuum the inside of the cavity 250 to remove the inert gas. Following this, the photoreactive molding mold system 1000 can fully cure the material in the cavity 250. [

When the preprocessing module 400 makes the inside of the cavity 250 to be in a vacuum state, the material of low molecular state may be evaporated, so that the photoreactive molding mold system 1000 can quickly vacuum the inside of the cavity 250 The second mold 100 can be moved toward the first mold 200 to press the work.

According to an embodiment of the present invention, the preprocessing module 400 may be provided on at least one of the components located at upper, lower, right, and left sides with respect to the cavity 250. In addition, the pre-processing module 400 may be provided in the cavity 250. The position and form of the preprocessing module 400 are not limited to the above-described embodiments.

In step S330, the photoreact molding mold system 1000 may irradiate a beam of linearly-exposed dose toward the entire second surface 214. [

According to one embodiment of the present invention, the photoreactive molding mold system 1000 can irradiate the light through the exposure module 240, in which case all of the exposure units included in the exposure module 240 are exposed to the second side It is possible to irradiate a light beam of a linear exposure dose toward the entire surface of the substrate 214.

Here, the amount of pre-cured exposure may include an exposure amount for curing at least a part of the material accommodated in the cavity 250 to a predetermined viscosity. For example, the amount of linear exposure to the unit area of the acrylic resin may be 3.0 mJ / cm < 2 > and is not limited to the above-described embodiment.

Here, the predetermined viscosity may include a viscosity such that the material accommodated in the cavity 250 does not enter the gap formed between the constituent elements even when the second mold 100 is pressed, i.e., does not generate burrs.

According to one embodiment of the present invention, the predetermined viscosity can be determined based on the width of the gap formed between the side of the protrusion and the side of the core 120. For example, if the width of the gap formed between the side surface of the protrusion and the side surface of the core 120 is 0.01 mm, the predetermined viscosity may be lower than when the width of the gap is 0.05 mm. In this case, the larger the width of the gap, the higher the predetermined viscosity.

According to another embodiment of the present invention, the exposure module 240 can be divided into a plurality of groups of exposure units, wherein at least one of the plurality of exposure groups is first exposed to the edge of the second side 214 Rays can be irradiated.

In this case, the edge portion of the second surface 214 means a portion of the second surface 214 that corresponds to the gap formed in the first surface 212. For example, when a fine gap is present on the first surface 212 by the take-out portion formed on the first surface 212, a portion of the second surface 214 corresponding to the fine gap may be an edge portion. As a result, when the exposure module 240 irradiates the light beam toward the edge of the second surface 214, the irradiated light beam can touch a fine gap formed on the first surface 212 and / or its periphery.

In this case, the light beam irradiated by the exposure module 240 can increase the viscosity of the material filled in the cavity 250, and can harden the uncured material.

In step S340, the photoreactive molding mold system 1000 can pressurize the filled material using the second mold 100.

The photoreactive molding mold system 1000 may press the cavity 250 using the core 120 of the second mold 100. The second mold 100 can move toward the first mold 200 and the core of the second mold 100 can press the cavity 250 due to the movement of the second mold 100. [

When the cavity 250 is filled with a material, the core 120 of the second mold 100 can press the material filled in the cavity 250. The material may include a photoreactive resin, and the photoreceptor may include ultraviolet curing resin, but not limited thereto.

In this case, in step S330, the workpiece is primarily hardened and has a predetermined viscosity, so that even if the second mold 100 presses the core 120, the workpiece may not flow into the gap. That is, burrs may not occur.

At step S350, the photoreactive molding mold system 1000 may irradiate a full cure exposure dose of light toward the entire second side 214. [

Here, the full curing exposure dose may include an exposure dose that completely cures the material contained in the cavity 250. [

The photoresponse forming mold system 1000 can irradiate a light of a full curing exposure dose toward at least a part of the second surface 214 after the material filled in the cavity is pressed using the exposure module 240, The entire material filled in the resultant cavity 250 can be hardened.

In this case, photoresist forming mold system 1000 may allow exposure module 240 to irradiate a full cured exposure dose toward at least a portion of the second side in a variety of ways.

For example, all of the exposure units included in the exposure module 240 may irradiate a light beam toward the second side 214. [

Further, the exposure module 240 may light the exposure unit to sequentially irradiate the light beams in the order from the edge portion toward the central portion of the second surface.

In addition, the exposure module 240 may illuminate the exposure units not facing the edge portion of the second surface while maintaining the lighting units of the exposure units facing the edge portion of the second surface.

In addition, the exposure module 240 may turn off the lighting of the exposure units facing the edge of the second surface, and may turn on the exposure units not facing the edge of the second surface.

The manner in which the exposure module 240 illuminates the exposure units to irradiate the light of the full curing exposure dose is not limited thereto.

The present invention is not limited to the steps described above in Fig.

4 is a view for explaining a sequential exposure technique according to an embodiment of the present invention.

Referring to FIG. 4A, a gap 244 may be formed between the upper support portion 210 and the peripheral columnar portion 220. Also, a gap 245 may be formed between the core 120 and the projection.

A portion of the second surface 214 corresponding to the gap 244 may be the edge portion of the second surface 214. In this case,

According to one embodiment of the present invention, the pre-processing module 400 may remove oxygen in the cavity 250 before the material contained in the cavity 250 is pre-cured. For example, the pre-processing module 400 can remove oxygen by sucking air in the cavity 250. For example, the pre-processing module 400 can vacuum the air in the cavity 250 to remove oxygen-containing air.

In addition, the pretreatment module 400 can remove oxygen by injecting an inert gas into the cavity 250. Here, the inert gas may include, but is not limited to, argon (Ar), helium (He), neon (Ne)

The method of removing the oxygen in the cavity 250 by the preprocessing module 400 is not limited thereto.

According to an embodiment of the present invention, the photoreactive molding mold system 1000 may be configured such that a material filled in a cavity 250 is filled with a material filled in the cavity 250 by a core 120 of a second mold 100, (Primary exposure) to the entire surface of the second surface 214 before the light source 300 is pressed.

In this case, a plurality of exposure units included in the exposure module 240 provided on the third surface 260 may be lighted together, and at least a part of the material 300 filled in the cavity 250 may be heated to a predetermined viscosity Can be hardened.

According to another embodiment of the present invention, the photoreactive molding mold system 1000 includes a cavity 250 that is filled with a material and then filled with the material 250 filled in the cavity 250 by the core 120 of the second mold 100. [ (Primary exposure) a beam of linearly-exposed dose toward a portion of the second surface 214 before the substrate 300 is pressed.

In this case, the exposure module 240 provided on the third surface 260 may include a plurality of exposure units, and the exposure units may be divided into at least two exposure groups.

The first exposure group 242 disposed toward the edge of the second surface 214 among the exposure groups can be turned on before the material 300 filled in the cavity 250 is pressed, At least a portion of the material located on and / or around the gap formed in the first surface 212 may be cured to a predetermined viscosity.

Here, the predetermined viscosity may include a viscosity at which the material accommodated in the cavity 250 does not flow into the gap even when the second mold 100 is pressurized, that is, the viscosity at which no burr is generated.

The predetermined viscosity can be determined based on the width of the gap formed between the side of the protrusion and the side of the core 120. [ For example, if the width of the gap formed between the side surface of the protrusion and the side surface of the core 120 is 0.01 mm, the predetermined viscosity may be lower than when the width of the gap is 0.05 mm. In this case, the larger the width of the gap, the higher the predetermined viscosity.

Referring to FIG. 4 (b), the second mold 100 can move toward the first surface of the first mold 200. In this case, the core 120 of the second mold 100 can press the material contained in the cavity 250.

According to one embodiment of the present invention, at least a portion of the material contained in the cavity 250 is irradiated with a beam of a pre-cured exposure dose before being pressed by the core 120 of the second mold 100, The material may not flow into the gap 245 even if it is pressed by the core 120 of the second mold 100. [ That is, burrs may not occur.

The exposure module 240 can irradiate a light of a full curing exposure dose toward a part or the whole of the second surface 214 after the material filled in the cavity 250 is pressurized, The material 300 may be completely cured (secondary exposure).

FIG. 5 is a view for explaining a gap for generating a burr in the photoreaction molding mold system according to an embodiment of the present invention. Referring to FIG.

Referring to FIG. 5, a gap may be formed between the second mold 100 and the peripheral column 220 of the photoreactor forming mold system 1000. When the second mold 100 moves and the material accommodated in the cavity 250 is pressed without line-curing the material accommodated in the cavity 250, the pressure inside the cavity 250 increases to cause the material to flow through the gap (gap) 250), and burrs may occur.

According to one embodiment of the present invention, the photoreactive molding mold system 1000 may pre-cure at least a portion of the material through the exposure module 240 to a predetermined viscosity before the material contained in the cavity 250 is pressurized . When the material is linearized, the material can be kept at a certain level even if it is pressurized by the second mold 100, so that the material may not escape out of the cavity 250 through a gap. That is, burrs may not occur.

According to one embodiment of the present invention, the photoreactive molding mold system 1000 irradiates the material accommodated in the cavity 250 through the exposure module 240 with a light beam of a pre- Can be formed. If a cured layer of a predetermined thickness is formed on the workpiece, the workpiece may not escape out of the cavity 250 through the gap even if it is pressed by the second mold 100. That is, burrs may not occur.

Here, the predetermined thickness may be more than the width of the gap formed between the side surface of the protrusion and the side surface of the core 120. For example, when the width of the gap is 0.01 mm, the material accommodated in the cavity 250 may be linearly cured by the exposure module 240 to form a cured layer of 0.01 mm or more. In this case, the amount of pre-cured exposure of the light beam irradiated by the exposure module 240 can be determined based on the width of the gap.

6 illustrates a general injection molding step according to an embodiment of the present invention.

Fig. 6 shows a general injection molding step in which the material is filled before the second mold 100 moves toward the first mold 200. Fig.

In step S710, the cavity 250 of the photoreactive molding mold system 1000 may be filled with a material to be injection-molded.

Here, the material to be injection-molded may include a thermoplastic resin and a photoreactive resin. When the cavity 250 is filled with the photoreactive resin, the filled photoreactive resin can be cured by the light irradiated by the exposure module 240. In this case, the photoreactive resin may include an ultraviolet curing resin, and the exposure module 240 may irradiate ultraviolet rays.

In step S720, the pre-processing module 400 of the photoresponse forming mold system 1000 may remove oxygen in the cavity 250 before the material contained in the cavity 250 is pre-cured. For example, the pre-processing module 400 can remove oxygen by sucking air in the cavity 250. For example, the pre-processing module 400 can vacuum the air in the cavity 250 to remove oxygen-containing air.

In addition, the pretreatment module 400 can remove oxygen by injecting an inert gas into the cavity 250. Here, the inert gas may include, but is not limited to, argon (Ar), helium (He), neon (Ne)

In step S730, the photoreactive molding mold system 1000 may irradiate the beam received in the cavity 250 with a beam of linear magnification through the exposure module 240. [ In this case, at least a portion of the material contained in the cavity 250 may be cured (primary exposure) to a predetermined viscosity. The second mold 100 may move in the first surface direction of the first mold 200 and be accommodated in the cavity 250 to press the pre-curved material.

In step S740, the second mold 100 of the photoresponse forming mold system 1000 may move to the first mold 200 and be completely closed.

In step S750, the photoreactive molding mold system 1000 is received in the cavity 250 through the exposure module 240 to irradiate the pre-hardened material with a full cured exposure dose of light. In this case, the material can be completely cured (secondary exposure).

In step S760, the photoreactive molding mold system 1000 can separate the second mold 100 from the first mold 200 and take out the fully cured material.

7 shows an in-mold injection molding step according to an embodiment of the present invention.

FIG. 7 shows an in-mold injection molding step in which the material is filled after the second mold 100 moves toward the first mold 200.

The second mold 100 of the photoreactive molding mold system 1000 moves in the direction of the first surface of the first mold 200 and moves between the second mold 100 and the first mold 200 The material can be filled in the formed cavity 250.

In step S830, the photoreactive molding mold system 1000 can irradiate the material accommodated in the cavity 250 with rays of a pre-cured exposure dose through the exposure module 240. [ In this case, the material accommodated in the cavity 250 may be cured (primary exposure) to a predetermined viscosity.

In step S840, the second mold 100 of the photoreact molding mold system 1000 further moves toward the first surface of the first mold 200 to be accommodated in the cavity 250 to pressurize the pre- have.

In step S850, the photoreactive molding mold system 1000 can be completely cured (secondary exposure) by irradiating a light source with a full curing exposure dose to a material that is received in the cavity 250 and is linearized and pressed.

In step S860, the photoreactive molding mold system 1000 can separate the second mold 100 from the first mold 200 and take out the fully cured material.

According to another embodiment of the present invention, in step S820, the second mold 100 of the photoreactive molding mold system 1000 moves in the first surface direction of the first mold 200, And the first mold 200 may be filled with the primary material so that the primary injection may proceed preferentially. Here, the photoreactive molding mold system 1000 can perform the primary injection by thermally curing the primary material filled between the second mold 100 and the first mold 200. In this case, the first injected material can form a space in which the material to be injected secondarily can be filled, and the first injected material can be injected into the second mold 100 through the jointing of the parting surfaces of the second mold 100 and the first mold 200, And may be molded into a sealing structure to limit the generation of burrs of the material to be injected secondarily.

The primary material may include a thermosetting resin, and the thermosetting resin may include a phenol resin, a urea resin, a melamine resin, an epoxy resin, a polyester resin, and the like. The type of the primary material is not limited thereto.

The photoresponse forming mold system 1000 may remove oxygen in the cavity 250 before filling at least one of the primary and secondary materials between the second mold 100 and the first mold 200.

In step S830 according to another embodiment of the present invention, the photoreactive molding mold system 1000 can irradiate a light beam of a linear exposure dose through the exposure module 240 to the secondary material filled in the primary material. In this case, the secondary material filled in the primary material may be cured (primary exposure) to a predetermined viscosity.

In step S840 according to another embodiment of the present invention, the second mold 100 of the photoresponse forming mold system 1000 further moves toward the first surface of the first mold 200 to form a primary material and a primary material It is possible to pressurize the secondary material contained therein.

In step S850 according to another embodiment of the present invention, the photoreactive molding mold system 1000 is irradiated with light of a full curing exposure dose to a secondary material that is contained in the primary material and is linearized and pressed, (Secondary exposure).

The photoreactive molding mold system 1000 according to another embodiment of the present invention can separate the second mold 100 from the first mold 200 and take out the primary material and the fully cured secondary material.

FIG. 8 is a table and a graph showing the thickness of a cured layer according to exposure time when an acrylic resin according to an embodiment of the present invention is exposed to ultraviolet rays having an exposure energy of 3.0 mJ / cm 2 sec.

According to an embodiment of the present invention, the material accommodated in the cavity 250 may include acrylic resin. When the width of the gap formed between the side surface of the protrusion and the side surface of the core 120 is 0.06 mm, the photoreactive molding mold system 1000 is irradiated with light of a linear exposure dose of 3.0 mJ / cm 2 sec. 1 mold 200 for at least one second toward the entire second surface of the mold 200. In this case, a cured layer of 0.06 mm or more may be formed in the material accommodated in the cavity 250.

The material accommodated in the cavity 250 may have a hardened layer larger than the width of the gap, so that the material may not flow into the gap even when the second mold 100 is pressed. That is, burrs may not be generated.

Figure 9 illustrates a first mold formed with a plurality of molds and an ejector pin, according to one embodiment of the present invention.

According to an embodiment of the present invention, the first mold 200 may be provided with a plurality of molds 200-1, 200-2, and 200-3 and an ejector pin. In this case, various gaps may be formed between the first mold 200 and the second mold 100.

9, when the first mold 200 includes a plurality of molds 200-1, 200-2, and 200-3 and an ejector pin, the second mold 100 and the mold 200, At least one gap may be formed between the mold 200-1 and between the mold 200-1 and the mold 200-2 and between the mold 200-2 and 200-3 and the milfin 500 .

According to an embodiment of the present invention, when a plurality of gaps are formed between the first mold 200 and the second mold 100, a plurality of exposure modules 240 may be disposed between the first mold 200 and the second mold 100, (Not shown). For example, the plurality of exposure modules 240 may be provided in the vicinity of the gap formed by the inner side of the first mold 200 and the outer side of the second mold 100 being in contact with each other. The plurality of exposure modules 240 may be provided in the vicinity of a gap in which a plurality of molds 200-1, 200-2, and 200-3 forming the first mold 200 are formed in contact with each other. The plurality of exposure modules 240 may be provided in the vicinity of the gap where the plurality of molds 200-1, 200-2, and 200-3 are in contact with the microneedle 500.

Since a plurality of exposure modules 240 are provided as in the embodiment of the present invention, a portion of the material accommodated in the cavity 240 where burrs may occur can be linearized. In this case, the material located near at least one gap may be pre-cured by the exposure module 240 to have a predetermined viscosity, and a cured layer of a predetermined thickness may be formed.

The number, shape, and position of the mold and the mold 500 forming the first mold 200 and the positions of the plurality of exposure modules 240 are not limited to the above-described embodiment in Fig.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

Claims (13)

A photoresist molding mold system for removing burrs using a sequential exposure technique,
A first mold; And
A second mold;
/ RTI >
The first mold comprises:
A cavity in which a resin can be received in a first surface formed to face the second mold among the surfaces formed in the first mold; And
An exposure module disposed facing the first surface of the first mold and capable of irradiating a light beam toward the second surface;
/ RTI >
Said second mold comprising:
A core formed at a position corresponding to the cavity;
/ RTI >
The second mold may include:
Providing pressure to the received resin by moving in the direction of the first surface of the first mold,
In the exposure module,
The method comprising: irradiating a pre-cured exposure amount of light first before irradiating a full cured exposure dose of light onto the entirety of the second face of the first mold to form a gap Gap,
The gap
Which is a gap formed between the first mold and the second mold, in which the accommodated resin is introduced and the burr is generated as pressure is applied to the accommodated resin as the first mold moves,
Photoresponsive molding system. The method according to claim 1,
The photoresponsive molding system may include:
Further comprising a preprocessing module,
The pre-
And sucking air in the cavity before the accommodated resin is pressed by the second mold,
Photoresponsive molding system. The method according to claim 1,
The photoresponsive molding system may include:
Further comprising a preprocessing module,
The pre-
Injecting an inert gas into said cavity before said accommodated resin is pressurized by said second mold,
Wherein the air is sucked into the cavity to remove the inert gas after the accommodated resin is pre-
Photoresponsive molding system. The method according to claim 1,
Wherein the exposure module irradiates the beam of the pre-cured exposure dose toward the entire second face of the first mold after the resin is received and before the received resin is pressed by the second mold.
Photoresponsive molding system. 5. The method of claim 4,
Wherein the exposure module is configured to irradiate a light beam of the pre-cured exposure dose toward the entirety of the second face, and then to irradiate the entirety of the second face after the second mold starts to pressurize the received resin, Lt; / RTI >
Photoresponsive molding system. The method according to claim 1,
The first mold comprises:
An upper support portion composed of the first surface and the second surface in which the resin is accommodated;
A lower support having a third surface facing the second surface and spaced apart from a lower surface of the upper support and having the exposure module on the third surface; And
A peripheral pillar portion which contacts each of the edge portions of the upper support portion and the lower support portion and forms a boundary of the first mold;
≪ / RTI >
Photoresponsive molding system. The method according to claim 6,
The peripheral post has a protrusion extending from the first surface of the upper support toward the second mold,
The protrusion prevents the resin from flowing out from the edge portion of the first surface to the outside of the first mold,
Photoresponsive molding system. delete 8. The method of claim 7,
The gap
A protruding portion formed between the side surface of the core and the side surface of the protruding portion,
Photoresponsive molding system. delete The method according to claim 1,
In the exposure module,
And adjusting the amount of the pre-cured exposure by the exposure energy and the exposure time to adjust the thickness of the accommodated resin when irradiating the beam of the pre-
Photoresponsive molding system. In an injection molding method using sequential exposure techniques,
A resin filling step of filling a cavity of the first mold with a resin, the first mold being formed to face the second mold and having a first surface having the cavity, a second surface facing the first surface, And an exposure module capable of irradiating a light beam toward the second surface;
A first irradiating step of irradiating a light beam of a linear exposure amount toward the second surface;
A pressing step of pressing the filled resin with a second mold after the first irradiation step is started; And
A second irradiating step of irradiating a light beam having a full curing exposure dose toward the second surface;
Lt; / RTI >
Wherein the first irradiation step comprises:
Curing the filled resin to a thickness of a gap formed between the first mold and the second mold,
The gap
Which is a gap formed between the first mold and the second mold, in which pressure is applied to the accommodated resin by movement of the first mold to cause the accommodated resin to flow and generate a burr,
Injection molding method. delete
KR1020170137674A 2017-10-23 2017-10-23 Photoreaction molding system and process for injection molding using sequential light exposure technique KR101982583B1 (en)

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JP6200135B2 (en) * 2012-07-24 2017-09-20 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method
KR101565515B1 (en) 2013-02-06 2015-11-03 주식회사 엘지화학 Method for dicing semiconductor wafer
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JP2010067336A (en) * 2008-09-12 2010-03-25 Sony Disc & Digital Solutions Inc Vacuum transfer device and vacuum transfer method
KR101411596B1 (en) * 2012-12-28 2014-06-25 주식회사 엘엠에스 Uv manufacturing system

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