KR101982518B1 - Apparatus for testing of semiconductor including structures that improve wind direction - Google Patents

Abstract

According to the present invention, provided is a wind direction improvement semiconductor inspection apparatus, which tests the weather resistance of a plurality of semiconductor elements. The wind direction improvement semiconductor inspection apparatus comprises: an experiment chamber including the plurality of semiconductor elements and capable of controlling internal temperatures; a blowing unit generating the flow of air in the test chamber; and a guiding unit guiding the flow of air in a direction in which the plurality of semiconductor elements are located, and in a direction perpendicular to a direction in which the plurality of semiconductor elements are arranged. According to the present invention, the air which raised or lowered the temperature can be supplied to each of the semiconductor elements in the test chamber.

Description

Wind direction improvement semiconductor inspection device {APPARATUS FOR TESTING OF SEMICONDUCTOR INCLUDING STRUCTURES THAT IMPROVE WIND DIRECTION}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wind direction improving semiconductor inspection device capable of supplying air having a temperature increased or decreased to each of a plurality of semiconductor elements.

The semiconductor inspection device is a device that tests whether a change in performance occurs in a high or low temperature environment of a semiconductor located inside the chamber by heating or cooling air in the chamber using a temperature control device. It is possible to classify faulty or defective semiconductors.

That is, the semiconductor inspection apparatus heats or cools the temperature inside the chamber in which the semiconductor is located to test the performance of the semiconductor, thereby preventing the chamber and the semiconductor from being unnecessarily maintained at a high or low temperature after the test is completed. To this end, a process of returning the temperature of the inside of the chamber and the semiconductor to which the temperature rises or falls due to the heated or cooled internal temperature is returned to room temperature.

Conventionally, in order to return the temperature of the chamber and the semiconductor to room temperature, the cooler or the heater is operated based on the temperature of the current chamber, and the air whose temperature rises or falls by the cooler or the heater is applied to the chamber and the semiconductor using a motor. The feeding method was used.

For example, Korean Patent No. 10-2010-0022168 uses a heater and an evaporator to lower or raise the temperature of a test room including a semiconductor device, and to test the heated or cooled air using a circulation motor and a duct. By transferring to each part of the method, the method of changing the temperature of the test room containing a semiconductor element more efficiently is proposed.

However, this method simply transfers the air whose temperature is raised or lowered by using a motor, and since the air flow generated from the motor is transferred in a direction in which a plurality of semiconductors are arranged, a plurality of densely formed gaps are generally formed. Due to the semiconductors, there is a problem in that air is not completely transferred from the point where air is transported to the semiconductor located at the far side.

In addition, in this case, the temperature difference between the semiconductor located near and the semiconductor located far from the point where air is transported among the plurality of semiconductors included in the chamber may occur in a clear manner, thereby causing errors in the semiconductor inspection apparatus. There was a problem that damage may occur in the semiconductor.

Republic of Korea Patent Publication No. 10-2010-0022168

The present invention is to solve the above-mentioned problems of the prior art, while guiding the flow of air to increase or decrease the temperature in a direction in which the plurality of semiconductor elements are located, induces a direction perpendicular to the direction in which the plurality of semiconductor elements are listed This is to provide a wind direction improving semiconductor inspection device capable of supplying air having a temperature increased or decreased to each of a plurality of semiconductor elements.

However, the technical problem to be achieved by the present embodiment is not limited to the technical problems as described above, and other technical problems may exist.

In order to achieve the object of the present invention, the wind direction improving semiconductor inspection apparatus according to the present invention is a semiconductor inspection apparatus for testing weather resistance of a plurality of semiconductor elements, including the plurality of semiconductor elements, and controls the temperature inside. An experimental chamber; A blower to generate a flow of air in the test chamber; And an induction part for guiding the flow of air in a direction in which the plurality of semiconductor devices are located, and in a direction perpendicular to a direction in which the plurality of semiconductor devices are arranged.

In an embodiment, the semiconductor inspection apparatus may further include a temperature detector configured to detect a temperature inside the experiment chamber.

In one embodiment, the experimental chamber may include a heater and a freezer to control the temperature of the interior to a high or low temperature.

In one embodiment, the heater and the freezer may control the temperature inside the experiment chamber to a high or low temperature based on the temperature sensing result of the temperature sensing unit.

In one embodiment, the freezer may operate before the heater.

In one embodiment, the blower may generate a flow of air based on the result of the temperature detection of the temperature sensor.

In one embodiment, the blower may generate a flow of air controlled to a high temperature or low temperature inside the experiment chamber.

In one embodiment, the blower may be formed on both sides of the experiment chamber, respectively.

In one embodiment, the induction part may include an induction hole through which air is introduced from the inside of the experiment chamber.

In one embodiment, the blower is formed in the induction part, it may generate a flow of air introduced through the induction hole.

In one embodiment, the blower may be formed on both sides of the inside of the guide portion.

In an embodiment, the semiconductor inspection apparatus may further include a pressure generating part formed inside the induction part and generating a pressure in the induction part by closing a portion of the induction part.

According to any one of the problem solving means of the present invention described above, the present invention is to guide the flow of air to increase or decrease the temperature in the direction in which the plurality of semiconductor elements are located, the direction perpendicular to the direction in which the plurality of semiconductor elements are listed By inducing to, it is possible to supply the air having the temperature increased or decreased to each of the plurality of semiconductor elements, whereby the temperature inside the plurality of semiconductor elements and the chamber can be changed more easily and accurately.

In addition, the present invention induces a flow of air generated by using at least two blowers in a direction in which a plurality of semiconductor elements are located, in a direction perpendicular to the direction in which the plurality of semiconductor elements are arranged, thereby a plurality of semiconductor elements and The temperature inside the chamber can be changed more quickly.

1 and 2 are views showing the configuration of the wind direction improving semiconductor inspection apparatus according to an embodiment of the present invention.
3 is a view showing the configuration of an experimental chamber according to an embodiment of the present invention.
4 is a diagram illustrating a configuration of a wind direction improving semiconductor inspection apparatus according to another exemplary embodiment of the present invention.
5 is a diagram illustrating a configuration of a wind direction improving semiconductor inspection apparatus according to another exemplary embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise. In addition, when a part in the specification is said to be "connected" to another part, this includes not only the case in which it is directly connected, but also connected through the other part in the middle. Furthermore, throughout this specification, when a member is located "on" another member, this includes not only when one member is in contact with another member but also when another member is present between the two members.

In the present specification, the term 'unit' includes a unit realized by hardware, a unit realized by software, and a unit realized by both. In addition, one unit may be realized using two or more pieces of hardware, and two or more units may be realized by one piece of hardware.

Hereinafter, with reference to the accompanying configuration diagram or processing flow chart, it will be described in detail for the practice of the present invention.

1 and 2 are views showing the configuration of the wind direction improving semiconductor inspection apparatus according to an embodiment of the present invention. More specifically, FIG. 1 is a side view of a wind direction improvement semiconductor inspection apparatus and a configuration included therein according to an embodiment of the present invention, and FIG. 2 is a wind direction improvement semiconductor inspection apparatus and an embodiment thereof according to an embodiment of the present invention. It is a figure which looked at the structure contained from the upper side.

1 and 2, the wind direction improving semiconductor inspection apparatus 100 according to the present invention includes a test chamber 110 configured to have a space therein and a flow of air inside the test chamber using power. It may include a blowing unit 120 and the induction unit 130 to guide the flow of air generated from the blowing unit in a predetermined direction.

In addition, the wind direction improving semiconductor inspection apparatus 100 according to the present invention may further include a temperature sensing unit 140 and a pressure generating unit 150 as its components.

Hereinafter, the wind direction improving semiconductor inspection apparatus 100 according to the present invention will be described with reference to FIGS. 1 to 3.

3 is a view showing the configuration of an experimental chamber according to an embodiment of the present invention.

1 to 3, the experiment chamber 110 may include a plurality of semiconductor devices a in an internal space, and may control a temperature inside or outside at a high temperature or a low temperature. Here, the plurality of semiconductor devices a included in the internal space of the experiment chamber 110 may be arranged in a predetermined direction.

The experiment chamber 110 may include a heater (not shown) and a freezer (not shown) for controlling the temperature of the interior to a high temperature or a low temperature.

The experiment chamber 110 may operate a refrigerator (not shown), and then operate a heater (not shown) to control the internal temperature at a high temperature or a low temperature. For example, when the experiment chamber 110 intends to increase the internal temperature, the experiment chamber 110 operates a refrigerator (not shown) and then operates a heater (not shown), and outputs the output of the heater (not shown). The internal temperature can be raised by making it higher than the output of). Here, the operation of the refrigerator (not shown) in advance of the heater (not shown) may be to prevent the occurrence of water vapor and condensation in the experiment chamber 110, but is not limited thereto. .

The experiment chamber 110 is to control the internal temperature to a high temperature or a low temperature to test the performance of the semiconductor device (a) in a high temperature or low temperature state, if one of ordinary skill in the art Since the configuration and features will be fully understood, detailed description thereof will be omitted.

The blowing unit 120 may be formed at one side of the experiment chamber 110 and generate a flow of air in the experiment chamber 110 by using power. To this end, a motor may be connected to one side of the blower 120. Referring to FIG. 1, the blower 120 may be disposed at one side of a fan and a side of the fan in which the air flows in the inner space of the experiment chamber 110 (the upper side of the fan in FIG. 1). It may be configured to include a motor that is connected and generates power.

The blower 120 may generate a flow of air whose temperature is raised or lowered by a heater (not shown) or a freezer (not shown) using power generated from the power unit. Here, the air blowing unit 120 generates a flow of air whose temperature is raised or lowered increases or decreases the temperature of the plurality of semiconductor elements a included in the experiment chamber 110 and the experiment chamber 110. It may be intended to be, but should not be limited to this.

2 and 3, the blower 120 may be formed on both sides of the experiment chamber 110, respectively. That is, the two blowers 120 respectively formed on both sides of the experiment chamber 110 may generate a flow of air by using power at each position.

Blower 120 may be formed in the induction unit 130 to be described later, it should be noted that it is not limited thereto.

The induction part 130 may be formed to have a space used as an air flow path therein, and a direction in which the plurality of semiconductor elements a are located in the flow of air generated from the blower 120 using the internal space. In this case, the plurality of semiconductor devices a may be guided in a direction perpendicular to the direction in which the plurality of semiconductor devices are arranged.

1 to 3, a blower 120 may be formed at one side of the inner space of the induction part 130, and a plurality of semiconductor devices may be configured to control the flow of air generated from the blower 120 through the inner space. It may be guided in the direction in which a) is located, but in a direction perpendicular to the direction in which the plurality of semiconductor devices a are listed.

That is, the experiment chamber 110 may be formed to have a space therein, and may include a plurality of semiconductor elements a, a blower 120, and an induction part 130 in the space. In addition, the blower 120 may be formed on one side of the induction unit 130, and may generate a flow of air in the experiment chamber 110 by using power. In addition, the induction part 130 guides the flow of air generated from the blower part 120 in a direction in which the plurality of semiconductor elements a is located, but in a direction perpendicular to the direction in which the plurality of semiconductor elements a is arranged. As a result, the flow of air generated from the blower 120 may be transferred to each of the plurality of semiconductor devices a.

Referring to FIG. 3, for example, a plurality of semiconductor devices a arranged in the directions of y1 and y2 may be disposed in the internal space of the experiment chamber 110. In addition, the one or more blowers 120 formed on one side of the inner space of the induction part 130 may generate a flow of air in the inner space of the induction part 130 using power. In addition, the flow of air generated by the blower 120 may be transported in the x1 direction and the y2 direction along the inner space of the induction part 130, and then transported in the x2 direction. That is, the induction unit 130 induces the flow of air generated by the blower 120 in the direction in which the plurality of semiconductor elements a is located, but the directions in which the plurality of the semiconductor elements a are arranged (y1 direction and y2). Direction) and in a direction perpendicular to the direction (x2 direction).

Hereinafter, the wind direction improving semiconductor inspection apparatus 100 according to another exemplary embodiment of the present invention will be described with reference to FIG. 4.

4 is a diagram illustrating the configuration of the wind direction improving semiconductor inspection apparatus 100 according to another embodiment of the present invention.

Referring to FIG. 4, the wind direction improving semiconductor inspection apparatus 100 according to another embodiment of the present invention may prevent the air flow from being dispersed in the experiment chamber 110, the blower 120, and the internal space. It may include an induction part 130 formed in a shape including a plurality of paths through which air flows.

The induction unit 130 guides the flow of air in a direction in which the plurality of semiconductor elements a are located, but the air is within a predetermined distance from a point where the plurality of semiconductor elements a is located through a plurality of air flow paths. By being conveyed, it is possible to prevent the flow of air in the induction part 130 to be dispersed.

In addition, an induction hole 131 through which air is introduced from the inside of the experiment chamber 110 may be formed at one side of the inner space of the induction part 130. That is, the blower 120 formed inside the induction part 130 may generate a flow of air from the air introduced through the induction hole 131.

The blowing unit 120 may be formed at both sides of the induction unit 130. That is, two blowers 120 may be formed at both sides of the induction part 130 to generate a flow of air introduced through the induction hole 131.

Hereinafter, an apparatus for improving wind direction semiconductor inspection according to another exemplary embodiment of the present invention will be described with reference to FIG. 5.

5 is a diagram illustrating a configuration of a wind direction improving semiconductor inspection apparatus according to another exemplary embodiment of the present invention.

Referring to FIG. 5, the wind direction improving semiconductor inspection apparatus 100 according to an exemplary embodiment of the present invention may include an internal space of a temperature sensing unit 140 and an induction unit 130 that sense a temperature of an internal space of an experiment chamber 110. The pressure generating unit 150 for generating a pressure may be further included.

The temperature sensing unit 140 is formed in the interior space of the experiment chamber 110 and can sense the temperature of the interior space.

The experiment chamber 110 may control the temperature of the internal space using a heater (not shown) or a freezer (not shown), but may control the temperature of the internal space based on a result of the temperature sensing of the temperature sensing unit 140. . For example, the experiment chamber 110 controls a temperature of an internal space by operating a heater (not shown) or a freezer (not shown) based on a difference between a temperature set by a user and a temperature detected by the temperature detector 140. can do.

The blower 120 may generate an air flow based on a result of temperature sensing of the temperature detector 140. For example, when a difference between the temperature set by the user and the temperature detected by the temperature sensing unit 140 occurs, the experiment chamber 110 operates a heater (not shown) or a freezer (not shown) to control the temperature of the internal space. To raise or lower, but if the difference between the temperature set by the user and the temperature detected from the temperature sensing unit 140 is more than a predetermined value, by increasing the power of the blower 120 to raise or lower the temperature of the internal space more quickly You can.

The pressure generator 150 is formed in the induction part 130, and closes the inside of the induction part 130 to generate a pressure in the internal space of the induction part 130.

The pressure generating unit 150 may be formed with a plurality of holes (Hole) through which air passes. That is, when the pressure generating unit 150 is formed in the space inside the induction part 130, the flow of air in the space inside the induction part 130 may have straightness due to the pressure generated from the pressure generating part 150. That is, the wind direction improving semiconductor inspection apparatus 100 according to the embodiment of the present invention increases the intensity of the flow of air supplied to the plurality of semiconductor elements a through the pressure generating unit 150, thereby experiment chamber 110. The flow of air can be prevented from being dispersed inside.

The description of the present invention described above is for illustrative purposes, and those skilled in the art can understand that the present invention can be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. There will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

In addition, the scope of the present invention is shown by the following claims rather than the detailed description, it should be construed that all changes or modifications derived from the meaning and scope of the claims and equivalent concepts thereof are included in the scope of the present invention. do.

100: wind direction improvement semiconductor inspection device
110: experimental chamber
120: blower
130: induction part
131: guide ball
140: temperature detection unit
150: pressure generating unit

Claims (12)

In the wind direction improving semiconductor inspection device for testing weather resistance for a plurality of semiconductor elements,
An experiment chamber including the plurality of semiconductor elements and capable of controlling internal temperatures;
A blower to generate a flow of air in the test chamber;
An induction part for guiding the flow of air in a direction in which the plurality of semiconductor devices are located, and in a direction perpendicular to a direction in which the plurality of semiconductor devices are arranged; And
And a pressure generation unit formed in the induction part to generate a pressure in the induction part by closing a portion of the induction part. The method of claim 1,
The semiconductor inspection apparatus further includes a temperature sensing unit configured to sense a temperature inside the experiment chamber. The method of claim 2,
The experimental chamber is improved wind direction semiconductor inspection apparatus including a heater and a freezer to control the temperature inside or at a high temperature. The method of claim 3, wherein
And the heater and the freezer are configured to control the temperature inside the test chamber to a high temperature or a low temperature based on a temperature sensing result of the temperature sensing unit. The method of claim 3, wherein
And the freezer is operated before the heater. The method of claim 2,
And the air blowing unit generates air flow based on a result of temperature sensing of the temperature sensing unit. The method of claim 1,
The blower is a wind direction improved semiconductor inspection device to generate a flow of air controlled to a high temperature or low temperature inside the experiment chamber. The method of claim 1,
The blowing unit is a wind direction improvement semiconductor inspection apparatus is formed on both sides of the experimental chamber, respectively. The method of claim 1,
The induction part is improved wind direction semiconductor inspection apparatus that includes an induction hole through which air is introduced from the inside of the experiment chamber. The method of claim 9,
The blower is formed in the guide portion, and the wind direction improving semiconductor inspection device to generate a flow of air introduced through the guide hole. The method of claim 10,
The blower is formed on both sides of the inside of the guide portion wind direction improving semiconductor inspection device. delete

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