KR101966319B1 - Press apparatus and pressing method of substrate using the same - Google Patents

Abstract

The present invention relates to a pressing apparatus for touching a substrate, comprising: a mold stamping unit for pressing and pressing a strip substrate; a feeding unit for feeding the strip substrate to the mold stamping unit; And a control unit for automatically controlling the operation of the die take-up unit, the loading unit, and the take-out unit in accordance with the input signal.

Description

[0001] PRESS APPARATUS AND PRESSING METHOD OF SUBSTRATE USING THE SAME [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press apparatus and a substrate press method using the same, and more particularly, to a press apparatus for pressing a unit substrate from a strip substrate and a substrate press method using the same.

2. Description of the Related Art Generally, a printed circuit board (PCB) is fabricated such that a circuit pattern is formed using copper, silver, gold or the like so that a current is passed through one surface of a substrate made of resin.

Such a printed circuit board is manufactured by arranging a plurality of substrates of a unit unit having a constant interval and a predetermined size on one strip level substrate for mass production. Therefore, it is necessary to separate and unitize the unit substrate, that is, the unit substrate, from the strip substrate.

An operation of separating a plurality of unit substrates from a single substrate is usually performed by a stamping process, which is a press operation.

In the conventional punching process, a blanking mold or a complex mold is mounted on an electric or hydraulic press, an operator inserts a guide pin into a hole formed in advance on a substrate, and presses a press button to perform a punching operation. Then, the operator manually picks up the unit boards picked up individually and loads them in a separate product storage box.

As described above, in the mold processing for producing the printed circuit board, all the operations from the input of the substrate to the pressing of the press and the take-out of the product are performed manually.

In order to precisely punch the unit substrate using the press apparatus, it is important to accurately match the relative positions and angles of the substrate and the punching mold. Handling loss inevitably arises in the case of manual processing, As a result, there is a disadvantage that the position and angle of the mold are changed, resulting in damage to the product or productivity.

Patent Document 1: Korean Patent Laid-Open Publication No. 2014-0000035

SUMMARY OF THE INVENTION It is an object of the present invention to provide a press apparatus in which all operations from input of a substrate to press-take-out and product take-out are performed by an automated system without operator intervention and a method of pressing a substrate using the apparatus. have.

According to an aspect of the present invention, there is provided an automated press apparatus comprising: a mold stamping unit for pressing and pressing a strip substrate; a feeding unit for feeding the strip substrate to the mold stamping unit; And a control unit for automatically controlling each of the components by applying an operation signal to the input unit, the mold sprocket unit, and the blowout unit, Provided is a press apparatus that operates as an automated system without any intervention by a worker.

In addition, the present invention includes a loader picker for transferring the strip substrate at a standby point to a supply point after the suction, and is configured to individually transfer the unit substrate and the dummy scrap separated after punching, An unloader picker for picking up and transporting scrap and a knock out picker for picking up and transporting the unit substrate are provided. Here, the knockout picker is installed above the unloader picker, thereby picking up the unit substrate that is seated on the tray of the unloader picker on the unloader picker.

According to a second aspect of the present invention, there is provided a method of pressing a strip substrate, the method comprising: feeding a strip substrate onto a loader picker and supplying the strip substrate onto a lower mold of a die rubbing portion; lowering an upper mold of the die rubbing portion, A step of raising the mold, a step of adsorbing dummy scrap of the strip substrate on the unloader picker, and a step of raising the unloader picker up to the height of the upper mold and then dropping the unit substrate to the tray of the unloader picker A step of adsorbing the unit substrate to a knockout picker, and a step of unloading the dummy scrap and the unit substrate in a loading operation organically, thereby improving the productivity.

According to the press apparatus of the present invention and the substrate press method using the same, operation by a loader picker for supplying a strip substrate, operation by a mold rubbing portion for punching a supplied substrate, and unloader picker for picking up a punched substrate, The operation by the out-picker is performed organically according to the order, whereby the operation speed can be increased.

In addition, since the operation of each constituent device is automatically performed, it is possible to prevent an error caused by a manual operation, thereby preventing a fault of a product, and preventing a safety accident of an operator.

1 is a block diagram schematically showing the entire configuration of a press apparatus according to the present invention.
2 is a perspective view of a press apparatus according to the present invention.
Fig. 3 is a flowchart showing a sequence of a substrate pressing method using the press apparatus of the present invention
Figs. 4 to 18 are process drawings for explaining each step of the substrate pressing method using the press apparatus of the present invention

The advantages and features of the present invention and the techniques for achieving them will be apparent from the following detailed description taken in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The present embodiments are provided so that the disclosure of the present invention is not only limited thereto, but also may enable others skilled in the art to fully understand the scope of the invention.

The terms used herein are intended to illustrate the embodiments and are not intended to limit the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is to be understood that the terms 'comprise', and / or 'comprising' as used herein may be used to refer to the presence or absence of one or more other components, steps, operations, and / Or additions.

In addition, the components of the drawings are not necessarily drawn to scale; for example, the dimensions of some of the components of the drawings may be exaggerated relative to other components to facilitate understanding of the present invention. In the meantime, the same reference numerals denote the same elements throughout the drawings, and for the sake of simplicity and clarity of illustration, the drawings illustrate a general constructional scheme and are intended to unnecessarily obscure the discussion of the described embodiments of the present invention Detailed descriptions of known features and techniques may be omitted so as to avoid obscuring the invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram schematically showing the overall configuration of a press apparatus according to the present invention, and FIG. 2 is a perspective view of a press apparatus according to the present invention.

The press apparatus 100 according to the present invention is an apparatus for pressing a substrate supplied from the outside by a pressurizing method, wherein the substrate includes a strip having a plurality of unit substrate regions virtually divided by unit work lines, Level substrate (hereinafter referred to as a strip substrate), and after the substrate pressing method of the present invention, the plurality of unit substrates are separated and individualized from the strip substrate.

1 and 2, the press apparatus 100 according to the present invention includes a loading unit 110, a metal mold part 120, and a take-out unit 130, And a controller 140 for collectively controlling the operating states of the charging unit 110, the metal mold take-up unit 120, and the take-out unit 130, respectively.

That is, the control unit 140 applies an operation signal to the input unit 110, the mold take-up unit 120, and the take-out unit 130 according to a predetermined algorithm to organically operate each component in a predetermined order So that the press apparatus 100 of the present invention operates as an automated system.

Various shapes for punching the strip substrate (10 of FIG. 4) may be used for the metal tapping portion 120. In this embodiment, for example, a configuration for pressing the strip substrate 10 by a pressing method includes a lower mold 121 on which the strip substrate 10 is seated, and a lower mold 121 on which the strip substrate 10 on the lower mold 121 is pressed And an upper mold 122 for forming the upper mold.

That is, the upper mold 122 and the lower mold 121 are opposed to each other with a predetermined gap therebetween, and the strip substrate 10 transferred from the loading unit 110 is placed on the lower mold 121 The upper mold 122 descends toward the lower mold 121 and presses the strip substrate 10.

6A and 6B) are provided on opposite surfaces of the upper mold 122 and the lower mold 121 and the strip substrate 120 Is disposed on the stage 121a of the lower mold 121. [ A fine pattern corresponding to a unit pattern line of the strip substrate 10 is formed on the surface of the stage 122a of the upper mold 122. Accordingly, when the fine pattern is transferred according to the unit pattern line at the time of pressing, Respectively.

The mold tool 120 includes a cylinder (not shown) as a means for driving the upper mold 122. A head 123 coupled to the upper mold 122 is mounted on the upper mold 122. The head 123 is connected to a hydraulic cylinder or a pneumatic cylinder that operates, for example, 122). Accordingly, as the upper mold 122 descends toward the lower mold 121, the opposing surfaces of the upper mold 122 and the lower mold 121 come into contact with each other, and the strip substrate 10 is pressed.

Although the hydraulic cylinder or the pneumatic cylinder is used as the driving force of the upper mold 122 in the present embodiment, the present invention is not limited thereto, and the head combined with the upper mold 122 can be vertically moved up and down A mechanical system by a combination of various methods, for example, a servo motor and a link mechanism, may be used.

Meanwhile, as a structure for precise positioning and uniform pressure transmission, a plurality of guide posts 124 arranged parallel to each other may be provided between the upper mold 122 and the lower mold 121. One end of the guide post 124 is fixed to the upper mold 122 and a hole is formed in the lower mold 121 at a corresponding position of the guide post 124. The guide post 124 is inserted into the hole and penetrates through the lower mold 121. As a result, when the lower mold 122 is lowered, the upper mold 122 and the lower mold 122 are guided along the guide posts 124, The opposite surface of the mold 121 is matched at the correct position and a uniform pressure is transmitted to the lower mold 121.

The charging unit 110 is configured to supply the strip substrate 10 at the standby point to the metal tapping unit 120. The charging unit 110 sucks the strip substrate 10 by a vacuum suction method, And a loader picker 111 for transferring the loader to the lower mold 121 of the lower mold 120.

The loader picker 111 is cantilevered on one side of the first conveying plate 115. The first conveying plate 115 is slidably supported on the first conveying rail 116 by a ball screw or a linear motor And is installed movably. The first conveying rail 116 is disposed on one side of the mold tool 120, for example, on the left side, so that the loader picker 111 moves along with the movement of the first conveying plate 115, And moves linearly reciprocating forward and backward along the rail 116 toward the mold stopper 120.

The loader picker 111 includes a body part 112 connected to an external air ejector (not shown) to receive vacuum pressure, a vacuum pipe 113 extending from the body part 112, And a nozzle 114 disposed in the vacuum pipe 113 and communicating with the vacuum pipe 113. When the vacuum pressure of the air ejector is transmitted to the loader picker 111, a negative pressure is generated inside the body part 112 of the loader picker 111, The strip substrate 10 is vacuum-absorbed, and when the vacuum is broken, the strip substrate 10 is unloaded.

The loader picker 111 descends to the height of the lower mold 121 so that the strip substrate 10 can be safely lowered when the loader reaches the supply point or the upper portion of the lower mold 121, After unloading, repeat up and down movement again.

To this end, the loader picker 111 is installed on one side of the first conveying plate 115 so as to be movable up and down. In other words, a vertical rail is formed on one surface of the first conveyance plate 115 on which the loader picker 111 is provided. Accordingly, the loader picker 111 is moved in the vertical direction by the piston of the cylinder, And moves up and down on the rail of the main body 115. Here, the cylinder may be an air cylinder operating with air pressure as a power source, a hydraulic cylinder using a pressure of oil as a power source, or the like.

The take-out part 130 has a function of transferring the separated unit substrate 10a and the dummy scrap 10b after being pressed, and an unloader picker (not shown) for picking up and transporting the dummy scrap 10b And a knock out picker 135 (FIG. 14) for picking up and transporting the unit substrate 10a.

Here, the loading box is constituted by a first loading box (21 in FIG. 18) for loading the unit substrate 10a and a second loading box (22 in FIG. 14) for loading the dummy scrap 10b.

It is advantageous that the unit substrate 10a is a substrate used in an actual product and is classified into a form ready for shipment and ready for shipment. Accordingly, the first loading unit 21 is lowered when the unit substrate 10a is loaded with a certain amount, and is elevated to the original position when the unit substrate 10a is taken out by the operator so that the first loading unit 21 can be learned by the operator immediately after being loaded. Device. As such an elevator apparatus, there can be used a structure generally known in the art, including a plate on which the unit substrate 10a is mounted, a rail for guiding the plate up and down, and a driving means such as a motor.

The dummy scrap 10b is a part after the unit substrate 10a is separated from the strip substrate 10 and is then discarded or recycled so that loading and processing a plurality of dummy scrap 10b at one time is effective It is advantageous from the side. Therefore, it is preferable that the second loading box 22 is formed to have a size such that a plurality of dummy scrap 10b can be loaded thereon. Generally, the second loading box 22 may include a plate 22a corresponding to the size of the dummy scrap 10b and a guide pin 22b installed along the edge of the plate.

Like the loader picker 111, the unloader picker 131 and the knockout picker 135 have a body part connected to the air ejector and receiving a vacuum pressure, a vacuum pipe extending from the body part, And a nozzle communicated with the vacuum pipe, and is designed to linearly reciprocate forward and backward between the upper mold 122 and the lower mold 121.

Specifically, the unloader picker 131 and the knockout picker 135 are provided in a cantilever shape on one side of the second conveyance plate 132 and the third conveyance plate 136, respectively, and the second conveyance plate 132 are installed on the second conveying rail 133 so as to be slidable and the third conveying plate 136 is installed on the third conveying rail 137 in a sliding manner.

The second conveying rail 133 and the third conveying rail 137 are disposed on the other side of the other side of the mold tool 120 that is opposite to the first conveying rail 116, The loader picker 131 performs the linear reciprocating motion of the forward and backward movements toward the die take-up portion 12 along the second feed rail 133 along with the movement of the second feed plate 132. [ The knockout picker 135 also reciprocates forward and backward along the third conveying rail 137 along with the movement of the third conveying plate 136.

Like the loader picker 111, the unloader picker 131 is vertically movable on one side of the second conveying plate 132. The knockout picker 135 is also disposed in the third And is vertically movable on one side of the transfer plate 136. In other words, a vertical rail is formed on one surface of the second conveyance plate 132 on which the unloader picker 131 is provided. Accordingly, the unloader picker 131 is moved in the second And moves up and down on the rail of the transfer plate 132. Similarly, the knockout picker 135 is provided on one side of the third conveying plate 136 on which the knockout picker 135 is provided, And moves up and down on the rail of the transfer plate 136

In addition, a tray 134 on which the unit substrate 10a is mounted is installed at the upper end of the unloader picker 131. [ Therefore, the tray 134 is formed to have a size enough to accommodate all of the unit substrates 10a punched out, and the main surface of the tray 134 faces upward.

The knockout picker 135 is installed above the unloader picker 131 so that the knockout picker 135 is positioned above the second conveying rail 133. Thus, 134 of the unit substrate 10a.

FIG. 3 is a flow chart showing a sequence of a substrate pressing method using the press apparatus of the present invention, and FIGS. 4 to 18 are process diagrams for explaining each step of the substrate pressing method using the press apparatus of the present invention. Herein, FIGS. 4 to 18 schematically show the construction apparatus of the present invention used in the process to clearly explain only the features of the process.

3 to 18, a substrate pressing method using the press apparatus 110 according to the present invention is a method in which a strip substrate 10 is supplied to a metal mold part 120 as a first step (S100) The step of pressing the strip substrate 10 (S110) is performed.

4, the loader picker 111 is lowered downward, and the strip substrate 10 is placed on the nozzle 114. The loader picker 111 is placed on the strip substrate 10 Thereby adsorbing the hull (Fig. 5).

Then the loader picker 111 is raised to lift up the adsorbed strip substrate 10 and then the loader picker 111 is moved forward between the upper mold 122 and the lower mold 121 of the mold spear part 120 (Fig. 6). When the loader picker 111 reaches the target point, that is, the upper portion of the lower mold 121, the loader picker 111 is lowered to the position of the stage 121a of the lower mold 121, 10) is unloaded onto the stage 121a of the lower mold 121 (Fig. 7).

Then, the loader picker 111 is moved back to the original position so that only the strip substrate 10 is placed between the upper mold 122 and the lower mold 121 (Fig. 8), the lower mold 121 is lowered as it is, The substrate 10 is pressed (Fig. 9).

When the upper mold 122 is lifted up, the unit substrate 10a pulled out of the strip substrate 10 is lifted together with the upper mold 122 in a state of being closely contacted with the pressing surface of the upper mold 122, The dummy scrap 10b is placed on the lower mold 121 (Fig. 10).

Then, the dummy scrap 10b is sucked (S120) by using the unloader picker 131 and the process of S130 of sucking the unit substrate 10a using the knockout picker 135 is performed.

More specifically, the unloader picker 131 is moved forward between the upper mold 122 and the lower mold 121 while the upper mold 122 is lifted after the strip substrate 10 is pressed, The unloader picker 131 is lowered to the position of the stage 121a of the lower mold 121 when the picker 131 reaches the supply point, that is, the upper portion of the lower mold 121 (Fig.

Then, the dummy scrap 10b is vacuum-adsorbed to the nozzle of the unloader picker 131 and the unloader picker 131 is raised to the height of the upper die 122 (Fig. 12). Thereafter, when the unit substrate 10a pressed on the upper mold 122 drops onto the tray 134 of the unloader picker 131, the unloader picker 131 is lowered to a predetermined height (Fig. 13) And moves back to the position where the loading box 22 is located (Fig. 14). Accordingly, the dummy scrap 10b is adsorbed on the lower portion of the unloader picker 131, and the unit substrate 10a is seated on the tray 134 at the upper end thereof.

Next, the knockout picker 135 located above the unloader picker 131 is moved to the position where the unloader picker 131 is located, and then lowered to the height of the tray 134 (FIG. 15) 135) by sucking the unit substrate 10a (Fig. 16).

As a result, the unit substrate 10a and the dummy scrap 10b are attracted to the knockout picker 135 and the unloader picker 131, respectively. Finally, the dummy scrap 10b and the unit substrate 10a, (S140) to the loading box. At this time, the unloader picker 131 is vertically lowered to unload the dummy scrap 10b to the second loading box 22 (FIG. 17), and the knockout picker 135 moves to the first loading box 22 And unloads the unit substrate 10a to the first loading box 22 (Fig. 18).

The foregoing detailed description is illustrative of the present invention. It is also to be understood that the foregoing is illustrative and explanatory of preferred embodiments of the invention only, and that the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention. The foregoing embodiments are intended to illustrate the best mode contemplated for carrying out the invention and are not intended to limit the scope of the present invention to other modes of operation known in the art for utilizing other inventions such as the present invention, Various changes are possible. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. It is also to be understood that the appended claims are intended to cover such other embodiments.

100: Press apparatus 110 according to the present invention:
111: Loader picker 112: Body part
113: Vacuum piping 114: Nozzle
115: first conveyance plate 116: first conveyance rail
120: mold sprue 121: lower mold
122: upper mold 130:
131: Unloader picker 132: Second conveyance plate
133: second conveying rail 134: tray
135: Knockout picker 136: Third conveying plate
137: third conveying rail 10: strip substrate
10a: Unit substrate 10b: Dummy scrap

Claims (17)

A mold rubbing portion which presses the strip substrate and spatters:
An input unit for supplying the strip substrate to the metal tapping unit; And
And a take-out unit for transferring the unit substrate and the dummy scrap, which have been taken out from the strip substrate, to the stacker,
Wherein the takeout unit includes an unloader picker for picking up and transporting the dummy scrap, and a knock out picker for picking up and transporting the unit substrate.
The method according to claim 1,
And a control unit for automatically controlling operations of the mold speckle, the input unit, and the takeout unit according to an input signal.
The method according to claim 1,
Wherein the loading box comprises a first loading box for loading the unit substrate and a second loading box for loading the dummy scrap.
The method according to claim 1,
Wherein the mold rubbing portion comprises a lower mold on which the strip substrate is placed and an upper mold for pressing the strip substrate on the lower mold.
The method according to claim 1,
Wherein the charging unit comprises a loader picker for transferring the strip substrate at a standby point to a supply point after the adsorption.
6. The method of claim 5,
And a first conveying rail disposed on one side of the die punching portion and slidably moving the loader picker toward the die punching portion.
The method according to claim 6,
And a first conveyance plate installed on the one surface so as to move the loader picker up and down, and slidingly moving along the first conveyance rail.
delete The method according to claim 1,
Wherein the knockout picker is installed above the unloader picker.
The method according to claim 1,
Wherein the unloader picker includes a tray provided with a main surface facing upward.
11. The method of claim 10,
Wherein the knockout picker sucks and transports the unit substrate dropped onto the tray.
The method according to claim 1,
A second conveying rail which is disposed on the other side of the mold rubbing portion to move the unloader picker toward the mold rubbing portion and a third conveying rail which moves the knockout picker.
13. The method of claim 12,
A second conveying plate installed on the one surface so as to move the unloader picker up and down and sliding along the second conveying rail; And a third conveyance plate installed on one surface of the knockout picker so as to be movable in the up and down direction and sliding along the third conveyance rail.
A step of adsorbing a strip substrate on a loader picker, and supplying the strip substrate onto a lower mold of a die rubbing portion;
Lowering the upper mold of the mold spatula to press the strip substrate and raising the mold;
Adsorbing the dummy scrap to the unloader picker;
After the unloader picker is raised to the height of the upper mold and the unit substrate is dropped on the tray of the unloader picker, the unit substrate is attracted to the knockout picker; And
And unloading the dummy scrap and the unit substrate to the loading box,
The step of adsorbing the unit substrate includes the steps of lowering the unloader picker when the unit substrate is dropped onto the tray of the unloader picker, moving the unloader picker backward, Moving the knockout picker up to a height of the tray after moving the knockout picker toward the picker, and advancing to a step of sucking the unit substrate to the nozzle of the knockout picker.
15. The method of claim 14,
Wherein the step of feeding the strip substrate comprises the steps of positioning the loader picker on a strip substrate at a standby point, lowering the loader picker down and adsorbing the strip substrate onto the nozzle, Moving the picker forward between the upper mold and the lower mold; lowering the loader picker up to the position of the stage of the lower mold; unloading the strip substrate onto the stage of the lower mold; And moving backward to the original position.
15. The method of claim 14,
Wherein the step of adsorbing the dummy scrap comprises the steps of: advancing the unloader picker between the upper mold and the lower mold; lowering the unloader picker to a position of the stage of the lower mold; To the dummy scrap.
delete

Images