KR101965685B1 - High power ceramic chip resistor for high withstand voltage and assembling method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-power ceramic chip resistive element and a method for assembling a high-power ceramic chip resistive element, and more particularly, to a high-voltage ceramic chip resistive element and a method of assembling thereof. According to an embodiment of the present invention, a lead terminal 10 formed by bending such that at least a part of one side 10a is formed at a substantially right angle and at least a part of the other side 10b is bent at a substantially right angle; A chip resistor (20) soldered to one surface of one side (10a) of the lead terminal (10); An epoxy layer 30 applied to one surface of the chip resistor 20; And an insulating ceramic plate 40 formed with a through hole 42 through which the lead terminal 10 penetrates and which is disposed on the epoxy layer 30.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a high-power ceramic chip resistive element and a method of assembling the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-power ceramic chip resistive element and a method for assembling a high-power ceramic chip resistive element, and more particularly, to a high-voltage ceramic chip resistive element and a method of assembling thereof.

The high-power ceramic chip resistive element is a resistive element used for high power and is used in various fields. It is one of the most important elements of passive components mainly used in a mobile communication repeater. This component requires at least one of RF Resistor, RF Termination and RF Attenuator in various kinds of modules related to IT and mobile communication (Amplifier, Divider, Circulator, Isolator, Filter, Coupler, etc.) It is a part to be mounted.

Referring to FIG. 1, a high-power ceramic chip resistor element has a structure in which a chip resistor 20 including a ceramic substrate is mounted on a metal flange 60, (10), and an insulating ceramic plate (40) for protecting the chip resistor and the lead terminal (10) is bonded by epoxy. The high-power ceramic chip resistor element having such a configuration is used by fastening it to the mounting hole 62 of the flange 60 using a screw and soldering to the lead terminal 10 of the metal for applying electric power.

The high-power ceramic chip resistor according to the conventional structure (horizontal structure) as shown in FIG. 2A or 2B has the following problems.

First, the higher the power to be used, the higher the applied voltage. Even though the high applied voltage is well insulated, as shown in FIG. 2A, An arc current is generated in which current flows into the air between the metal lead terminal 60 (or the body) and the lead terminal 10 of the metal. As a result, it is generally not usable above 3,000 volts. The limit of the applied voltage can be determined by the withstand voltage test and the withstanding voltage is the limit of the applied voltage that can withstand without breaking when the alternating voltage specified in the insulating material to be tested is applied for 1 minute or Means the limit of the magnitude of the applied voltage that can be used without fear that the insulating portion will be destroyed.

The disadvantage of the conventional horizontal structure is that even when the used voltage is 3,000 volts or less, when the instantaneous peak voltage becomes 3,000 volts or more at the moment when the operation switch of the equipment equipped with the resistance element is turned on, Resistor elements of the structure can not be used. A typical device is a power source such as an RF generator used in semiconductor processing.

Therefore, unlike the conventional method, it is necessary to design a resistance element having a structure capable of withstanding a higher withstand voltage, or a method of assembling the same, as a high-power ceramic chip resistive element to withstand a high withstand voltage.

Korean Unexamined Patent Publication No. 1992-0022486 (published on Dec. 19, 1992)

The present invention has been made to solve the above-mentioned problems,

There is an object to provide a high-voltage ceramic chip resistor element for withstand voltage having a structure capable of withstanding an AC voltage of 5,000 volts or more and a method of assembling such a high-power ceramic chip resistor element.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned may be clearly understood by those skilled in the art from the following description.

The features of the present invention for achieving the objects of the present invention as described above and performing the characteristic functions of the present invention described below are as follows.

A high-power ceramic chip resistor element according to an embodiment of the present invention includes: a lead terminal bendingly formed so that at least a part of one side thereof is formed at right angles and at least a part of the other side thereof is right-angled; A chip resistor having one side of the lead terminal soldered to one side; An epoxy layer applied to one surface of the chip resistor; And an insulating ceramic plate having through-holes formed therein to penetrate the lead terminals and closely contact with the epoxy layer.

Further, the high-power ceramic chip resistor device according to an embodiment of the present invention may further include a metal flange soldered to the other surface of the chip resistor.

A method of assembling a high-power ceramic chip resistor device according to an embodiment of the present invention includes: a first bending step of bending at least a part of one side of a lead terminal at a right angle; A first soldering bonding step of soldering bonding one side of the lead terminal to the chip resistor; Applying an epoxy to the chip resistor; A bonding step of bonding an insulating ceramic plate having through-holes for penetrating lead terminals to a surface to which the epoxy is applied; A second soldering bonding step of soldering the chip resistor to a metal flange; And a second bending step of bending the other side of the lead terminal so as to face the outside of the chip resistor.

In addition, the second bending step may be performed prior to any one of the first bending step, the first soldering bonding step, the applying step, the bonding step, and the second soldering bonding step.

As described above, according to the high-power ceramic chip resistive element and the method of assembling the high-power ceramic chip resistive element which withstand the high withstand voltage of the present invention, the conventional problem of having a low withstand voltage due to the horizontal structure of the chip resistor and the metal lead is solved , And by changing to a vertical structure, it is possible to withstand high withstand voltage.

1 shows a perspective view of a high-power ceramic chip resistor element in which a lead terminal and a chip resistor form a horizontal structure,
2A shows a side view of a high-power ceramic chip resistive element having a horizontal structure,
2B shows a top view of a high-power ceramic chip resistive element having a horizontal structure,
FIG. 3A illustrates a high-power ceramic chip resistor element forming a vertical structure according to an embodiment of the present invention,
FIG. 3B is a top view of a high-power ceramic chip resistor device forming a vertical structure according to an embodiment of the present invention,
4 is a flowchart illustrating a method of assembling a high-power ceramic chip resistor according to an embodiment of the present invention,
FIG. 5A is a plan view of a lead terminal according to an embodiment of the present invention, FIG. 5B is a view illustrating that one side of a lead terminal is bent according to an embodiment of the present invention,
6A shows a state in which a lead terminal is bonded to a chip resistor according to an embodiment of the present invention,
6B shows a top view in which lead terminals are bonded to a chip resistor in accordance with an aspect of the present invention,
FIG. 7A illustrates an embodiment in which an insulating ceramic plate is attached to an epoxy layer applied to a chip resistor in accordance with an aspect of the present invention,
Figure 7b shows a top view of an insulating ceramic plate according to an aspect of the present invention,
8 illustrates a state in which a chip resistor is mounted on a metal flange according to an embodiment of the present invention.

The specific structure or functional description presented in the embodiment of the present invention is merely illustrative for the purpose of illustrating an embodiment according to the concept of the present invention, and embodiments according to the concept of the present invention can be implemented in various forms. And should not be construed as limited to the embodiments described herein, but should be understood to include all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Meanwhile, in the present invention, the terms first and / or second etc. may be used to describe various components, but the components are not limited to the terms. The terms may be referred to as a second element only for the purpose of distinguishing one element from another, for example, to the extent that it does not depart from the scope of the invention in accordance with the concept of the present invention, Similarly, the second component may also be referred to as the first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but it should be understood that there may be other elements in between something to do. On the other hand, when it is mentioned that an element is " directly connected " or " directly contacted " to another element, it should be understood that there are no other elements in between. Other expressions for describing the relationship between components, such as "between" and "between" or "adjacent to" and "directly adjacent to" should also be interpreted.

Like reference numerals designate like elements throughout the specification. It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprises " and / or " comprising ", as used herein, unless the recited element, step, operation, and / Or additions.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In order to solve the problem of the conventional resistance element generated by using the horizontal structure of the chip resistor and the lead terminal, the high-power ceramic chip resistor device according to the present invention is intended to be assembled by changing to a vertical structure between the chip resistor and the lead terminal. The reason for this is to provide the effect of enduring a higher withstand voltage by making the distance between the metal flange 60 (or the body) and the lead terminal 10 of the metal remote.

The high-power ceramic chip resistor element according to an embodiment of the present invention includes a chip resistor 20, a lead terminal 10 connected to the chip resistor 20, an epoxy layer 30 applied to the chip resistor 20, An insulating ceramic plate 40 adhered to the layer 30 and a metal flange 60 on which the chip resistor 20 is mounted.

3A and 3B, according to an embodiment of the present invention, at least a part of one side 10a is formed at a substantially right angle, and at least a part of the other side 10b is bent at a substantially right angle, (10); A chip resistor (20) soldered to one surface of one side (10a) of the lead terminal (10); An epoxy layer 30 applied to one surface of the chip resistor 20; And an insulating ceramic plate 40 formed with a through hole 42 through which the lead terminal 10 penetrates and which is disposed on the epoxy layer 30.

Further, according to an aspect of the present invention, the chip resistor 20 may further include a metal flange 60 soldered to the other surface thereof.

5A and 5B, the lead terminal 10 is formed such that one side 10a is bent or bent to form a substantially right angle. Further, as shown in Fig. 3A, the other side 10b of the lead terminal is bent or bent so as to form a substantially right angle. 3B, the other side 10b of the lead terminal 10a is formed by bending at a substantially right angle toward the outside of the chip resistor 20 or the high-power ceramic chip resistor element including the ceramic substrate . Here, the lead terminal 10 may be formed of a metal such as silver (Ag) or copper (Cu), for example.

One side 10a of the lead terminal 10 is soldered to one surface of a chip resistor 20 including a ceramic substrate such as an aluminum nitride substrate as shown in Figs. 6A and 6B. In particular, one side of the lead terminal 10 formed at approximately the right angle can be soldered to the conductor on the upper surface of the chip resistor.

On one side of the chip resistor 20 to which the lead terminal 10 is soldered, an epoxy layer 30 is applied as a thermally conductive epoxy adhesive for bonding between the ceramics, as shown in Fig. 7A. An insulating ceramic plate 40 of ceramic is attached on the epoxy layer 30 for protecting the chip resistor and the lead terminal. That is, the insulating ceramic plate 40 may be an insulating ceramic provided for protecting the pattern, and an insulating ceramic plate 40 made of ceramic may be formed by using epoxy to protect the lead terminals soldered and bonded to the chip resistor, .

Referring to FIG. 7B, the insulating ceramic plate 40 is formed with a through hole 42 through which the lead terminal 10 can pass. That is, the insulating ceramic plate 40 is processed into a shape having a hole so that the vertically raised lead terminal 10 can pass through.

7B to 8, after the epoxy layer 30 is applied to the chip resistor 20, the insulating ceramic plate 40 having the through hole 42 is closely contacted with the through hole 42, Allow the applied epoxy to protrude. The more the epoxy spills out, the better the withstanding voltage. Heat is then applied to cure the epoxy. In this case, it is sometimes possible to re-cure epoxy by applying the epoxy back to the exposed epoxy portion piercing through the through-hole 42 of the insulating ceramic plate 40 for higher withstand voltage. This process is one of the most important assembly processes to withstand high withstand voltage.

The chip resistor 20 can be soldered to the metal flange 60, as shown in Fig. Filler metal for soldering or brazing may be disposed between the metal flange 60 and the chip resistor 20. The metal flange 60 may be a copper (Cu) flange, and one side may be plated with nickel (Ni), silver (Ag), or the like. A thick film metallization may be provided to the chip resistor 20 for bonding the chip resistor 20 and the metal flange 60. [ A mounting hole 62 is formed in the metal flange 60 to facilitate mounting of the body to be mounted using a screw.

Referring to FIG. 4, a method of assembling a high-power ceramic chip resistor device according to an embodiment of the present invention will be described.

A method of assembling a high-power ceramic chip resistor device according to an embodiment of the present invention includes: a first bending step of bending at least a part of one side of a lead terminal at a right angle; A first soldering joining step of soldering joining one side of the lead terminal to the chip resistor; An application step of applying an epoxy to the chip resistor; A bonding step of bonding an insulating ceramic plate having through-holes for penetrating lead terminals to a surface to which the epoxy is applied; A second soldering bonding step of soldering bonding the chip resistor to the metal flange; And a second bending step of bending the other side of the lead terminal toward the outside of the chip resistor.

5A and 5B, a method of assembling a high-power ceramic chip resistor device according to an exemplary embodiment of the present invention includes bending or bending the lead terminal 10 so that at least a part of one side 10a of the lead terminal 10 forms a substantially right angle. And a first bending step (SlOO) for bending.

The method may further include a first soldering bonding step (S120) of soldering bonding the lead terminal (10) to the chip resistor (20). The one side 10a on which the bending is formed in the first bending step S100 can be soldered to one side of the chip resistor 20.

Further, the method may further include an epoxy applying step (S140) of applying an epoxy adhesive to one surface of the chip resistor 20 to which the lead terminal 10 is bonded.

The method may further include a bonding step (S160) of bonding the ceramic insulating ceramic plate (40) having the through hole (42) to the surface to which the epoxy is applied.

Next, a curing step (S180) is performed in which the epoxy is cured by applying heat. Also, a re-application and re-curing step (S200) may be performed in which epoxy is applied again to the exposed epoxy portion protruding into the through-hole 42 of the insulating ceramic plate 40 for higher withstand voltage.

Next, a second soldering step (S220) for soldering the chip resistor 20 to the metal flange 60 may be further included.

A second bending step S240 for bending at least a part of the other side 10b of the lead terminal 10 at a substantially right angle to bend the other side 10b of the lead terminal 10 toward the outside of the chip resistor 20 ). The second bending step S240 may be performed before any one of the steps S100 to S220 described above, and there is no restriction on the order.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. It will be apparent to those of ordinary skill in the art.

10: lead terminal 10a: one side
10b: the other side 20: chip resistor
30: Epoxy layer 40: Insulated ceramic plate
42: through hole 50: filler
60: metal flange 62: mounting hole

Claims (4)

delete delete A first bending step of bending at a right angle by a predetermined length from one end of the lead terminal;
A first soldering joining step of soldering joining a portion bent from the one end of the lead terminal by a predetermined length to the chip resistor;
Applying an epoxy to the chip resistor;
A bonding step of bonding an insulating ceramic plate having through-holes for penetrating lead terminals to a surface to which the epoxy is applied;
A curing step of curing the epoxy by applying heat thereto;
Preparing a metal flange made of a copper material, on both sides of which a mounting hole is formed through which a screw can be threaded, and whose one surface is plated with nickel or silver;
Providing a filler metal between the metal flange and the chip resistor;
A second soldering bonding step of soldering the chip resistor to a metal flange; And
And a second bending step of bending at a right angle so that a portion from the other end of the lead terminal to a predetermined length is parallel to the chip resistor and facing outward,
The second bending step may be performed prior to any one of the first bending step, the first soldering bonding step, the applying step, the bonding step, and the second soldering bonding step,
In the adhering step, when the insulating ceramic plate is brought into close contact with the epoxy-coated surface, a part of the applied epoxy is protruded through the through-hole and is closely contacted until a form is formed to surround a part of the outer circumferential surface of the lead terminal passing through the through- Lt; / RTI &
Further comprising a re-curing step of applying epoxy further to the outside of the epoxy which protrudes through the through-hole and surrounds a part of the outer circumferential surface of the lead terminal to cure after the curing step.
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