KR101953850B1 - Double Side Embedded Manufacturing Method - Google Patents

Abstract

The present invention relates to a double-side embedded manufacturing method, comprising: (a) selecting a core; (b) processing the cavity in the core so that the electronic device can be mounted on the core selected in the step (a); (c) fixing the electronic device on the cavity; (d) stacking one copper foil layer on one side of the core; And (e) forming a double-sided embedded substrate by stacking the other copper layer on the other surface of the core to form an embedded substrate having a minimum height.

Description

{Double Side Embedded Manufacturing Method}

The present invention relates to a double side embedded manufacturing method, and is a double side embedded manufacturing method in which a connection length between devices is shortened by manufacturing a double side PCB by selecting cores corresponding to passive device part thicknesses.

A printed circuit board (PCB) is a substrate on which an electronic component is mounted, in which a circuit pattern is formed by printing a conductive material such as copper on an electrically insulating substrate. At this time, the printed circuit board is divided into a double side printed circuit board (D / S PCB) and a single side printed circuit board (S / S PCB) along the side on which the conductor is formed.

In this case, the double-sided printed circuit board is a wiring board on which conductor patterns are formed on both sides of the insulator. In the double-sided printed circuit board, a Double Side TH PCB is formed by forming conductor patterns on both surfaces thereof and connecting the through- It is widely used.

Recently, there has been provided an embedded printed circuit board (PCB) in which an active element or a passive element is mounted on a printed circuit board as described above and is miniaturized through organic bonding. Korean Patent Registration No. 10-1440327 (" embedded printed circuit board and its manufacturing method ") is disclosed as a technology related to manufacturing the above-described embedded printed circuit board.

1, a cavity is formed in a base substrate S2, a device chip is placed and fixed on the cavity in the base substrate S4 and S5, and an insulating layer is stacked on both sides of the base substrate S8 ) To manufacture an embedded printed circuit board.

The manufacturing method described above is disadvantageous in that it requires a long manufacturing time because the insulation layers are laminated on both sides of one core, and the thickness of the embedded printed circuit board is increased. Since the embedded printed circuit board having a large thickness has a large connection length between devices, the inductance component is high and the electrical efficiency may be low. In addition, a method for improving existing dielectric loss has not been disclosed, .

Korean Registered Patent No. 10-1440327 (" embedded printed circuit board embedded in chip and its manufacturing method ", 2014.09.04)

The present invention relates to a double-side embedded manufacturing method, and more particularly, to a method of manufacturing a double-side embedded device in which a core corresponding to a height of a device is used as a base material to reduce the thickness of a printed circuit board, It is a double side embedded manufacturing method that can reduce the loss.

According to another aspect of the present invention, there is provided a double-side embedded manufacturing method comprising the steps of: (a) selecting a core; (b) machining the cavity (111) in the core (110) so that the electronic device (300) can be mounted on the core (110) selected in the step (a); (c) attaching a support tape 140 to one surface of the core 110 to fix the electronic device 300 to the cavity 111; (d) coupling one of the copper foil layers 130 to the other surface of the core 110 through the adhesive 120 and removing the support tape 140; And forming a double side embedded substrate (1000) by bonding another copper foil layer (130) to one side of the core (110) through an adhesive (120) Wherein the core 110 is semi-cured, and when the double-sided embedded substrate 1000 is formed in step (e), the core 110 is formed of an epoxy resin, And is characterized in that it is precolored.

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Further, after step (e), (f) machining the hole in the double side embedded substrate 1000 may be further included.

In the step (f), holes may be formed in the double side embedded substrate 1000 using an ultraviolet laser or a carbon dioxide gas laser.

In the step (f), the via hole 400 and the through hole 500 may be formed on the double side embedded substrate 1000.

The via hole 400 includes a first via hole 410 formed to face the core 110 in one direction and a second via hole 420 formed to face the other surface of the core 110 .

Further, after the step (f), (g) filling the through hole 500 with a conductor.

According to the method of manufacturing a double side embedded according to the present invention, the thickness of the embedded substrate can be minimized by selecting a core corresponding to the height of the electronic device and forming a copper foil layer on both sides of the core. This shortens the connection length between the devices, thereby reducing the inductance component, leading to an improvement in electrical performance, thereby increasing the efficiency of the electronic product on which the printed circuit board according to the present invention is mounted.

Further, since the manufacturing process of the embedded substrate having the minimum thickness is operated more efficiently, the present invention can lead to a significant reduction in the time required for producing the product in the field, which leads to the advantage that the cost of the product is reduced .

1 is a block diagram showing a method of manufacturing an embedded printed circuit board according to the prior art;
2 is a view illustrating a step (a) according to an embodiment of the double-side embedded manufacturing method of the present invention
3 is a view illustrating steps (b) and (c) according to an embodiment of the double-side embedded manufacturing method of the present invention
4 is a view showing step (d) according to an embodiment of the double-side embedded manufacturing method of the present invention
5 is a view illustrating step (e) according to an embodiment of the double-side embedded manufacturing method of the present invention
6 is a diagram illustrating steps (f) and (g) according to an embodiment of the double-side embedded manufacturing method of the present invention
7 is a view showing a laminated structure according to another embodiment of the double-side embedded manufacturing method of the present invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method of manufacturing a double-side embedded device according to various embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following drawings are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the following drawings, but may be embodied in other forms. Also, throughout the specification, like reference numerals designate like elements.

In the following description and drawings, unless otherwise indicated, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. A description of the known function and configuration that can be blurred is omitted.

≪ Example 1 >

FIG. 2 illustrates an embodiment of a double-side embedded manufacturing method according to the present invention, and FIG. 2 illustrates steps (a) and (b) of a double-side embedded manufacturing method. Referring to FIG. 2, the double-side embedded manufacturing method of the present invention may include (a) selecting a core corresponding to a thickness of an electronic device to be inserted. The step (a) is a process of preparing the core 110 having a thickness equal to the thickness or the height of the electronic device, as shown in FIG. 2- (a). At this time, the core 110 may be made of various materials, and the core 110 of the present invention may include an epoxy resin.

When the core 110 is selected through the above-described step (a), the double-side embedded manufacturing method according to the present invention is applied to the selected core 110 as shown in FIG. 2- (b) (B) machining the cavity (111) in the core (110) so that the core (300) can be mounted. In this case, in the step (b), a plurality of cavities 111 may be machined when a plurality of electronic devices to be inserted are formed, and the cavities 111 may be processed using an ultraviolet laser.

FIG. 3 shows an embodiment of a double-side embedded manufacturing method according to the present invention, and FIG. 3 shows a step (c) of a double-side embedded manufacturing method. 3, the double-side embedded manufacturing method of the present invention includes attaching a supporting tape 140 to one side of the core 110 after the steps (a) and (b) And (c) inserting the electronic element 300 in the cavity 111 and fixing the electronic element 300 on the cavity 111. [ 3 (a) shows that the support tape 140 is attached to one side of the core 110, and FIG. 3- (b) shows that the electronic device 300 is inserted into the cavity 111 .

At this time, the support tape 140 may use a silicone tape, and one side of the core may be supported using a PI silicone tape among the silicone tapes. Further, the support tape 140 may be formed so that the core 110 is disposed on a floor where the adhesive tape 140 or the adhesive tape 140 is simply supported by a bonding means other than the silicone tape. However, the support tape 140 of the present invention is detachably formed to further reduce the manufacturing time of the core 110.

The electronic device 300 may be a plurality of electronic devices 300 as described above, and a plurality of electronic devices 300 may be mounted in the core 110, as shown in FIG. 3- (c). 3 (c), the electronic device 300 of the present invention may include a plurality of devices including a first device 310 and a second device 320, A plurality of cavities 111 can be processed in the front line (b) so that a plurality of electronic devices 300 including the device 310 and the second device 320 can be mounted, respectively.

Also, the electronic device 300 inserted into the cavity 111 may be fixed using a separate auxiliary adhesive or a liquid bonding agent. In an embodiment of the present invention, the electronic device 300 may be fixed to the support And is fixed on the cavity 111 of the core 110 via the tape 140. As shown in Fig.

FIG. 4 shows an embodiment of a double-side embedded manufacturing method according to the present invention, and FIG. 4 shows a step (d) of a double-side embedded manufacturing method. Referring to FIG. 4- (a), the double-side embedded manufacturing method of the present invention further includes the step (d) of applying an adhesive 120 to the other surface of the core 110 and stacking the single copper foil 130 . At this time, it is preferable that the step (d) is performed while the core 110 made of epoxy is semi-cured. In the step (d), the double-sided embedded manufacturing method of the present invention may include removing the support tape 140 from one side of the core 110 while the core 110 is semi-cured. have. The step of removing the support tape 140 from one side of the core 110 is shown in more detail in FIGS. 4- (b) and 4- (c).

As described above, when the support tape 140 is removed, a part of the electronic device 300 may be exposed, so that the electronic device 300 is not detached from the core 110, 110 are preferably semi-cured.

FIG. 5 shows an embodiment of a double-side embedded manufacturing method according to the present invention, and FIG. 5 shows a step (e) of a double-side embedded manufacturing method. 5, an adhesive 120 is applied to one surface of the core 110 to form a double-sided embedded substrate 1000 with the other copper layer 130 (E). In the step (e), the double-sided embedded substrate 1000 may be formed so as to be fully cured. Accordingly, the electronic device 300 can be completely inserted on the double side embedded substrate 1000, and a stable lamination structure can be achieved. 5- (a) shows that the adhesive 120 is applied to one side of the core 110, and FIG. 5- (b) shows another copper layer 130 on the side of the core 110 Are stacked.

FIG. 6 is an embodiment of a double side embedded manufacturing method according to the present invention, and FIG. 6 is a view showing steps (f) and (g) of the double side embedded manufacturing method. Referring to FIG. 6- (a), the double-side embedded manufacturing method of the present invention may include the step (f) of machining holes in the double-side embedded substrate 1000. In the step (f), a hole may be formed in the double side embedded substrate 1000 using an ultraviolet laser or a carbon dioxide gas laser. The hole may include a via hole 400 and a through hole 500 have.

In this case, in the step (f), a via hole 400 is formed in the first element 310 and the second element 320, respectively, and the respective via holes 400 are processed to face different directions have. Accordingly, the double-side embedded substrate 1000 of the present invention has an advantage that the efficiency is further increased even though the double-sided embedded substrate 1000 has a small thickness.

Referring to FIG. 6- (b), the double-side embedded manufacturing method of the present invention may further include filling the through hole 500 with a conductor.

In addition, the copper foil layer 130 may be formed of a low-profile copper foil to correspond to high-speed and high-frequency signals. At this time, the low illuminance is related to the surface roughness of the copper foil layer 130, and the current density of high-speed and high-frequency signals converges on the conductor surface portion. When the surface of the metal conductor is formed into a smooth surface with low illuminance, So that the loss of current can be minimized.

The adhesive 120 may be a prepreg, but it may be formed through low-dielectric-constant bonding in order to cope with high-speed and high-frequency signals. This allows the double-side embedded substrate 1000 to have a low dielectric loss through the compatibility with the copper foil layer 130 described above, but the electrical performance can be improved with a low interlayer thickness.

The via hole 400 may include a first via hole 410 facing the one side of the core 110 and a second via hole 420 facing the other side of the core 110. The first via hole 410 and the second via hole 420 may be formed on the anode of one electronic device 300 or may include a plurality of electronic devices 300 respectively.

≪ Example 2 >

FIG. 7 shows another embodiment of a double-side embedded manufacturing method according to the present invention, and FIG. 7 shows a laminated structure of a double-side embedded. Referring to FIG. 7, the double-side embedded manufacturing method of the present invention includes a pair of the cores 110, and a pair of the cores 110 has a height equal to the height of the first and second elements 310 and 320, . ≪ / RTI >

Each of the pair of cores 110 may be formed as a semi-laminated laminated body 100 through steps (a) to (d) The adhesive 120 and the copper foil layer 130 may be laminated on the other surface of the core 110. [ The first element 310 or the second element 320 may be semi-cured in a state where the upper half of the first element 310 or the second element 320 is inserted into the cavity of the one core 110, 310 or the second element 320 can be semi-cured in a state in which a cavity into which the lower half is inserted is formed. Thus, the pair of stacked bodies 100 can be formed as a double-sided embedded substrate 1000 by bonding the cores 110 to face each other, and finally cured in the state of FIG. 7- (b) have. Or an adhesive or an adhesive tape may be formed between the pair of cores 110 facing each other.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And various modifications and changes may be made thereto by those skilled in the art to which the present invention pertains.

Therefore, it is to be understood that the subject matter of the present invention is not limited to the described embodiments, and all of the equivalents or equivalents of the claims are intended to fall within the scope of the present invention will be.

1000: Double side embedded substrate
100:
110: Core 111: Cavity
120: adhesive 130: copper foil layer
140: Support tape
300: electronic device
310: first element 320: second element
400: via hole 500: through hole

Claims (9)

(a) selecting a core 110;
(b) machining the cavity (111) in the core (110) so that the electronic device (300) can be mounted on the core (110) selected in the step (a);
(c) attaching a support tape 140 to one surface of the core 110 to fix the electronic device 300 to the cavity 111;
(d) coupling one of the copper foil layers 130 to the other surface of the core 110 through the adhesive 120 and removing the support tape 140; And
(e) forming a double-sided embedded substrate 1000 by bonding another copper foil layer 130 to one side of the core 110 through an adhesive 120;
, ≪ / RTI &
The core 110 comprises an epoxy resin,
In the step (d), the core 110 is semi-cured,
Wherein the core (110) is precured when the double side embedded substrate (1000) is formed in the step (e).
delete delete delete The method according to claim 1,
After the step (e)
(f) machining a hole in the double side embedded substrate 1000;
Further comprising the steps of:
6. The method of claim 5,
Wherein the step (f) includes processing holes in the double side embedded substrate (1000) using an ultraviolet laser or a carbon dioxide gas laser.

The method according to claim 5 or 6,
Wherein the step (f) includes processing the via hole (400) and the through hole (500) in the double side embedded substrate (1000).
8. The method of claim 7,
The via hole 400 includes a first via hole 410 and a second via hole 420 formed to face the core 110 in the direction of the other surface of the core 110, Double-sided embedded manufacturing method.
8. The method of claim 7,
After the step (f)
(g) filling the through hole (500) with a conductor;
Further comprising the steps of:

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