KR101953280B1 - Light emitting device and lighting system having the same - Google Patents

Abstract

The light emitting device according to the embodiment, the body having a first to fourth outer surface; A cavity disposed in the body and corresponding to the first to fourth outer surfaces and having inclined first to fourth inner surfaces; A first lead frame having a first bonding portion and a first lead portion disposed in the cavity; A second bonding part disposed in the cavity and adjacent to the first inner side surface of the cavity, a first connection part bent from the second bonding part, and extending from the first connection part in a first outer surface direction of the body; A second lead frame including a second lead portion; A first gap portion between the first lead frame and the second lead frame; And a light emitting chip on the first bonding portion, wherein the second lead frame includes a first penetration preventing portion that is stepped between an upper surface of the second bonding portion and an upper surface of the first connection portion, and includes a first inside of the cavity. The starting point of the inclination of the side is in contact with the surface of the first penetration prevention portion.

Description

LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME}

The present invention relates to a light emitting device and a lighting system having the same.

A light emitting device, such as a light emitting device, is a kind of semiconductor device that converts electrical energy into light, and has been spotlighted as a next-generation light source by replacing an existing fluorescent lamp and an incandescent lamp.

Since light emitting diodes generate light using semiconductor devices, they consume much less power than incandescent lamps that generate light by heating tungsten or fluorescent lamps that generate light by colliding ultraviolet light generated through high-pressure discharges with phosphors. .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, the light emitting diode has a longer life, a faster response characteristic, and an environment-friendly characteristic than a conventional light source.

Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic signs, and street lamps that are used indoors or outdoors. have.

The embodiment provides a light emitting device having a penetration prevention portion at the beginning of the inner surface of the cavity of the region of the lead frame.

The embodiment provides a light emitting device having a penetration prevention portion in a buffer portion extending from an inner side surface of a cavity in a region of a lead frame.

The embodiment provides a light emitting device having a penetration preventing portion at a portion bent at a predetermined angle from a bonding portion exposed to a cavity in an area of a lead frame.

The embodiment provides a light emitting device having a penetration preventing portion at a portion bent at a predetermined angle from a lead portion exposed to a lower surface of a body of an area of the lead frame.

Provided is a lighting system having a light emitting device according to the embodiment.

The light emitting device according to the embodiment, the body having a first to fourth outer surface; A cavity disposed in the body and corresponding to the first to fourth outer surfaces and having inclined first to fourth inner surfaces; A first lead frame having a first bonding portion and a first lead portion disposed in the cavity; A second bonding part disposed in the cavity and adjacent to the first inner side surface of the cavity, a first connection part bent from the second bonding part, and extending from the first connection part in a first outer surface direction of the body; A second lead frame including a second lead portion; A first gap portion between the first lead frame and the second lead frame; And a light emitting chip on the first bonding portion, wherein the second lead frame includes a first penetration preventing portion that is stepped between an upper surface of the second bonding portion and an upper surface of the first connection portion, and includes a first inside of the cavity. The starting point of the inclination of the side is in contact with the surface of the first penetration prevention portion.

The light emitting device according to the embodiment includes a body having a first to a fourth outer surface; A cavity disposed in the body and corresponding to the first to fourth outer surfaces and having inclined first to fourth inner surfaces; A first lead frame having a first bonding portion and a first lead portion disposed in the cavity; A second bonding part disposed in the cavity and adjacent to the first inner side surface of the cavity, a first connection part bent from the second bonding part, and extending from the first connection part in a first outer surface direction of the body; A second lead frame including a second lead portion; A first gap portion between the first lead frame and the second lead frame; And a light emitting chip on the first bonding portion, wherein the second lead frame includes a first penetration preventing portion that is stepped between an upper surface of the second bonding portion and an upper surface of the first connection portion, and the body of the cavity. And a first buffer portion extending from the first inner surface to the inside of the first penetration preventing portion, wherein an inclination starting point of the first inner surface of the cavity is spaced apart from the second bonding portion and is switched from an upper surface of the first buffer portion. .

The lighting system according to the embodiment includes a plurality of light emitting elements.

The embodiment can reduce the occurrence of burrs on the upper surface of the lead frame disposed in the cavity, thereby improving the electrical reliability due to the bonding of the wire to the lead frame.

The embodiment can improve the reliability of the light emitting device.

The embodiment can improve the reliability of the lighting system having the light emitting device.

1 is a plan view of a light emitting device according to a first embodiment.
2 is a view showing the body of the light emitting device of FIG.
3 is a cross-sectional view taken along the AA side of the light emitting device of FIG. 1.
4 is a cross-sectional view taken along the BB side of the light emitting device of FIG. 1.
5 is a cross-sectional view of the CC side of the light emitting device of FIG. 1.
6 is a sectional view taken along the line DD of the light emitting device of FIG. 1.
7 is a partially enlarged view of the light emitting device of FIG. 6.
FIG. 8 is an enlarged view of area A of FIG. 7.
9 is a view showing a burr of the body according to the structure of the comparative example and the embodiment.
FIG. 10 is a rear view of the light emitting device of FIG. 1.
FIG. 11 is a plan view of lead frames of the light emitting device of FIG. 1. FIG.
12 is a rear view of the lead frames of FIG. 11.
13 is a plan view illustrating a light emitting device according to a second embodiment.
14 is a sectional view taken along the line DD of the light emitting device of FIG. 13.
FIG. 15 is a partially enlarged view of FIG. 13.
16 is a partial side cross-sectional view of a light emitting device according to the third embodiment.
17 is a partial side cross-sectional view of a light emitting device according to the fourth embodiment.
18 is a partial side cross-sectional view of a light emitting device according to the fifth embodiment.
19 is a partial side cross-sectional view of a light emitting device according to the sixth embodiment.
20 is a partial side cross-sectional view of a light emitting device according to the seventh embodiment.
21 to 23 are diagrams showing modified examples of the light emitting device of FIG. 1.
24 is a plan view of a light emitting device according to an eighth embodiment.
FIG. 25 is a diagram illustrating a modified example of the light emitting device of FIG. 12.
26 is a plan view of a light emitting device according to the ninth embodiment.
27 is a view showing an example of a light emitting chip of a light emitting device according to the embodiment.
28 is a view showing another example of a light emitting chip of the light emitting device according to the embodiment.
29 is a perspective view illustrating a display device having a light emitting device according to an embodiment.
30 is a view showing another example of a display device having a light emitting device according to the embodiment.
31 is a view showing a lighting device having a light emitting device of the embodiment.

In the description of the embodiment, each substrate, frame, sheet, layer, or pattern is formed "on" or "under" of each substrate, frame, sheet, layer, or pattern. In the case of what is described as being intended, "on" and "under" include both "directly" or "indirectly" formed. . In addition, the criteria for the top or bottom of each component will be described with reference to the drawings. The size of each component in the drawings may be exaggerated for description, and does not mean a size that is actually applied.

Hereinafter, the embodiments will be apparent from the accompanying drawings and the description of the embodiments. In the drawings, sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size. Like reference numerals denote like elements throughout the description of the drawings.

Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

1 is a plan view of a light emitting device according to the first embodiment, FIG. 2 is a view showing a body of the light emitting device of FIG. 1, FIG. 3 is a sectional view taken along the AA side of the light emitting device of FIG. 5 is a sectional view taken along line BB of the light emitting device of FIG. 1, FIG. 6 is a sectional view taken along the DD side of the light emitting device of FIG. 1, and FIG. 7 is a partially enlarged view of the light emitting device of FIG. 6. 8 is an enlarged view of region A of FIG. 7, and FIG. 9 is a view illustrating a burr of a body according to a structure of a comparative example and an embodiment, and FIG. 10 is a rear view of the light emitting device of FIG. 1, and FIG. 11. 1 is a plan view of the lead frames of the light emitting device of FIG. 1, FIG. 12 is a perspective view of the second and third lead frames of FIG. 11, and FIG. 13 is a rear view of the lead frames of FIG. 11.

1 and 2, the light emitting device 100 includes a body 110 having a cavity 115 having an open upper portion, a plurality of lead frames 120, 130, and 140 disposed in the body 110, and the plurality of light emitting elements 100. At least one light emitting chip 151, 152 and the molding member 160 are disposed on at least one of the lead frames 120, 130, and 140.

The body 110 may be selected from an insulating material, a transparent material, and a conductive material. For example, the body 110 may be a resin material such as polyphthalamide (PPA), silicon (Si), metal, photo sensitive glass (PSG), or sapphire. It may be formed of at least one of a printed circuit board (PCB) such as (Al ₂ O ₃ ), silicon, epoxy molding compound (EMC), polymer-based, plastics. For example, the body 110 may be selected from a resin material such as polyphthalamide (PPA), silicone or epoxy material.

The shape of the body 110 may include a shape having a polygon, a circle, or a curved surface when viewed from above, but is not limited thereto. The body 110 includes a plurality of outer surfaces 11 to 14 at an outer portion, and at least one of the plurality of outer surfaces 11 to 14 is the same as that of FIGS. 3 and 4. It may be inclined with respect to the lower surface 17 or the lower surfaces of the lead frames. As another example, the plurality of outer surfaces 11 to 14 may be formed perpendicular to the lower surface 117 of the body 110.

As shown in FIG. 2, when viewing the light emitting device, the X-axis direction may be defined in the longitudinal direction, and the Y-axis direction may be defined in the width direction. Each of the outer surfaces 11-14 may be a polygonal shape, for example, a quadrangular shape or a trapezoidal shape as an outer side surface. The body 110 describes first to fourth outer surfaces 11 to 14 as an example, and the first outer surface 11 and the second outer surface 12 are opposite to each other, and the third outer surface. 13 and the fourth outer side 14 are opposite sides. The length Y1 of each of the first outer side 11 and the second outer side 12 may be different from the length X1 of the third outer side 13 and the fourth outer side 14, for example, The length Y1 (that is, the short side length) of the first outer surface 11 and the second outer surface 12 is the length X1 of the third outer surface 13 and the fourth outer surface 14 ( That is, it may be formed shorter than the long side). The length Y1 of the first outer surface 11 or the second outer surface 12 may be a distance between the third outer surface 13 and the fourth outer surface 14. The length X1 may be formed at a difference of two or more times, for example, 2.5 to 5 times, than the length Y1.

The body 110 may include ribs 15 and 16 on the third and fourth outer surfaces 13 and 14, and the ribs 15 and 16 may be formed in the length direction of the light emitting device.

The body 110 may include a cavity 115 in which an upper portion 10 is opened, and a circumferential surface 114 of the cavity 115 may be inclined with respect to the bottom of the cavity. The circumferential surface 114 of the cavity 115 includes first to fourth inner surfaces 41, 42, 43, and 44 connected to each other as shown in FIG. 2. The first inner side 41 corresponds to the first outer side 11, the second inner side 42 corresponds to the second outer side 12, and the third inner side 43 is formed on the first inner side 41. Corresponding to the third outer side 13, the fourth inner side 44 is disposed to correspond to the fourth outer side 14. The first inner side 41 and the second inner side 42 are disposed to face each other, and the third inner side 43 and the fourth inner side 44 are disposed to face each other. At least one of the first to fourth inner side surfaces 41, 42, 43, and 44 may be formed with at least a part of another inclined surface, but is not limited thereto.

A stepped structure 116 may be formed on an upper portion of the circumferential surface 114 of the cavity 115, and the stepped structure 116 may prevent resin overflow.

A plurality of lead frames 120, 130, 140, for example, two or three or more may be disposed in the body 110. The plurality of lead frames 120, 130, and 140 may be disposed below a first region A1 of the cavity, and beneath a second region A2 spaced apart from the first lead frame 120. The second and third lead frames 130 and 140 are partially disposed.

The first to third lead frames 120, 130, and 140 are metal materials, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), It may include at least one of platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), and may be formed of a single metal layer or a multilayer metal layer. As shown in FIG. 7, the thickness E0 of the first lead frame 120 may be formed in a range of 0.2 mm to 0.8 mm, for example, in a range of 0.2 mm to 0.4 mm, and the second and third lead frames 130 and 140 may be formed. It may be formed to the same thickness as the thickness, but is not limited thereto.

The first lead frame 120 may include a first bonding part 121 and a plurality of first lead parts 122 and 123, and the second lead frame 130 may include a first inner side surface of the cavity 115. And a second bonding portion 131 adjacent to 41 and a second lead portion 132 disposed below the first outer surface 11, wherein the third lead frame 140 is formed of the cavity 115. And a third bonding portion 141 adjacent to the first inner side surface 41 and a third lead portion 142 disposed below the first outer side surface 11.

Upper surfaces of the second and third bonding parts 131 and 141 of the second and third lead frames 130 and 140 are disposed at positions higher than upper surfaces of the first bonding part 121 of the first lead frame 120. The first gap portion 113 is disposed in an area between the first bonding portion 121 and the second and third bonding portions 131 and 141. The first gap portion 113 may include a stepped structure, for example, a surface at least partially inclined.

A second gap portion 112 may be disposed in an area between the second bonding portion 131 and the third bonding portion 141, and the second gap portion 112 may be formed to have a flat surface. It extends from the first gap 113. The first and second gap portions 113 and 112 are formed of a material of the body 110.

The upper surface area of the first bonding part 121 may be formed to be larger than the upper surface area of the second bonding part 131 or the third bonding part 141. For example, the second bonding part 131 and the An area larger than the sum of the areas of the third bonding parts 141 may be formed. In addition, the upper surface area of the first bonding part 121 may be formed as an area of two or more times the upper surface areas of the second and third bonding parts 131 and 141, but is not limited thereto. Here, the upper surfaces of the bonding parts 121, 131, and 141 are areas exposed to the bottom of the cavity 115, and are areas in which connection members such as wires, light emitting chips, and / or protection elements may be mounted.

The length X3 of the first bonding part 121 may be longer than the length B1 of the second bonding part 131 or the third bonding part 141. For example, B1 may be formed to a length less than 1/2 of X3. The width C1 of the second bonding part 131 or the width C2 of the third bonding part 141 may be smaller than the width Y2 of the first bonding part Y2.

In addition, the first area A1 of the cavity 115 is an area in which the first bonding part 121 of the first lead frame 120 is disposed, and the second area A2 is formed of the second and third lead frames ( It may be defined as an area in which the second and third bonding parts 131 and 141 of the 130 and 140 are disposed. The second area A2 is disposed closer to the first inner side surface 41 of the cavity 115 than the first area A1. As shown in FIG. 7, the depth of the cavity 115 is a first depth E1 from the upper portion 10 of the body 110 to the first bonding portion 121 of the first lead frame 120. The second and third lead frames 130 and 140 may be formed deeper than the second depth E2 to the second and third bonding portions 131 and 141.

The bottom width Y3 of the cavity 115 in the second area A2 may be wider than the bottom width of the cavity 115 in the first area A1 (ie, Y2). The lower end portion of the third inner side surface 43 in the second area A2 is formed in a concave curved shape, and the lower end portion of the fourth inner side surface 44 is formed in a concave curved shape. Space of the bonding parts 131 and 141 may be further secured. Lower ends of the third and fourth inner side surfaces 43 and 44 in the first area A1 may be formed in a line shape, but are not limited thereto.

3 and 4, the inclination angle θ3 of the third inner surface 43 of the cavity 115 connected to the first bonding part 121 of the first lead frame 120 is in the range of 91 to 160 degrees. The inclination angle θ4 of the third inner surface 43 of the cavity 115 connected to the second bonding part 131 of the second lead frame 130 may be smaller than the angle θ3. For example, it may be formed in the range of 90 ~ 140 degrees. In addition, the fourth inner surface 44 may be formed at the same angle as the third inner surface 43, and may be linearly symmetric with the third inner surface 43 based on the center side line.

The first lead parts 122 and 123 of the first lead frame 120 may extend from the first bonding part 121 to protrude outwardly from the second outer surface 12 of the body 110.

The second and third lead portions 132 and 142 of the second and third lead frames 130 and 140 extend from the second and third bonding portions 131 and 141 to extend the first outer surface 11 of the body 110. It may protrude further outward.

5 and 6, the first inner side 41 of the cavity 115 is the bottom of the cavity or the second bonding portion 131 and the third bonding portion 141 of the second and third lead frames 130 and 140. The first angle θ1 may be inclined with respect to an upper surface of the first angle θ1, and the first angle θ1 may be formed in a range of 91 to 160 degrees, for example, in a range of 100 to 140 degrees. In addition, the second inner side surface 42 of the cavity 115 is formed at the same angle as the first angle θ1 with respect to the bottom of the cavity or the top surface of the first bonding portion 121 of the first lead frame 120, It may be formed at other angles, but is not limited thereto.

Referring to FIG. 1, at least one light emitting chip, for example, a first light emitting chip 151 and a second light emitting chip 152 may be disposed on the first bonding part 121 of the first lead frame 120. . 5 and 6, the first light emitting chip 151 and the second light emitting chip 152 may be attached onto the first bonding part 121 by bonding members 191 and 192.

The first and second light emitting chips 151 and 152 may selectively emit light in a range of visible light to ultraviolet light, for example, a red LED chip, a blue LED chip, a green LED chip, a yellow green LED chip, UV LED chip, white LED chip can be selected. The first and second light emitting chips 151 and 152 include compound semiconductors of group III-V elements. The light emitting chips 151 and 152 are arranged in a chip structure having a horizontal electrode structure, but may be arranged in a chip structure having a vertical electrode structure in which two electrodes are disposed up and down.

The first connection member 161 is connected to the first light emitting chip 151 and the first bonding part 121 of the first lead frame 120, and the second connection member 162 is the first light emitting chip 151. And the second bonding portion 131 of the second lead frame 130, and the third connecting member 163 is the first bonding portion 121 of the second light emitting chip 152 and the first lead frame 120. ), And the fourth connection member 164 is connected to the second light emitting chip 152 and the third bonding part 141 of the third lead frame 140. The first to fourth connection members 161, 162, 163 and 164 may include a conductive pattern, for example, a wire. Here, the second bonding portion 131 and the third bonding portion 141 provide an area to be bonded to the second connecting member 162 and the third connecting member 163. However, the space between the second bonding portion 131 and the third bonding portion 141 may be tight according to the size of the package, and if another material is placed in the space, the second connection member 162 And it may be a cause of poor bonding of the third connection member 164, this cause may reduce the electrical reliability of the light emitting device.

3 to 6, a molding member 160 may be formed in the cavity 115. The molding member 160 may include a light transmissive resin layer such as silicon or epoxy, and may be formed in a single layer or multiple layers.

The molding member 160 may include a phosphor for converting a wavelength of light emitted onto the light emitting chips 151 and 152, and the phosphor may be selectively selected from YAG, TAG, Silicate, Nitride, and Oxy-nitride-based materials. Can be formed. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The surface of the molding member 160 may include at least one of a flat shape, concave shape, convex shape, for example, the surface of the molding member 160 may be formed of a concave curved surface, the concave curved surface Can be a light exit surface.

3, 11, and 12, the first lead frame 120 has a third inner side 43 and a third outer side 13 of the cavity 115 from the first bonding part 121. A first extension portion 124 extending into an area between the second extension portion 124 and a second extension portion 125 extending into an area between the fourth inner side surface 44 and the fourth outer side surface 14 of the cavity 115. It includes. The first extension part 124 and the second extension part 125 may be bent or protruded to be coupled to the body 110, and may include stepped penetration preventing structures 126 and 127 below the outer side thereof.

5, 11, and 12, one or a plurality of grooves 25 may be formed in an area of the upper surface of the first lead frame 120 that is in contact with the body 110. Reference numeral 25 may include a polygonal shape whose side cross section is triangular. The groove 25 may be disposed in an area in contact with the body 110 to increase the contact area with the body 110. The groove 25 may have a moisture penetration preventing structure.

One or a plurality of grooves 35 may be formed in an area of the upper surface of the second lead frame 130 disposed in the body 110, and the grooves 35 have a polygonal cross-sectional side shape. It may be formed in a shape. The groove 35 may be disposed in an area in contact with the body 110 to increase the contact area with the body 110. The groove 35 may have a moisture penetration preventing structure.

6, 11, and 12, one or a plurality of grooves 55 may be formed in an area disposed in the body 110 among the upper region of the third lead frame 140. Reference numeral 55 may include a polygonal shape such as a triangle. The groove 55 may be disposed in an area in contact with the body 110 to increase the contact area with the body 110. The groove 55 may have a moisture penetration prevention structure.

5 and 6, the first end portion 122 of the first lead frame 120 extends into the first gap portion 113 and includes a stepped penetration preventing structure 128 thereunder. . As illustrated in FIG. 7, the penetration preventing structure 128 may be formed to a depth of 1/3 to 1/2 of the thickness E0 of the first lead frame 120, but is not limited thereto.

The lower surface of the first lead frame 120 may be disposed on the same plane as the lower surface 17 of the body 110. Lower surfaces of the second and third lead parts 132 and 142 of the second and third lead frames 130 and 140 may be disposed on the same plane as the lower surface 17 of the body 110.

Here, the first gap portion 113 is formed in a structure having a wide lower width and a narrow upper width, the upper portion of which is a flat first surface 31 and a second surface inclined with respect to the first surface 31. And (32). The first surface 31 may be the same plane as the top surfaces of the second and third bonding portions 131 and 141, or may be formed higher or lower than the top surfaces of the other surfaces, for example, the second and third bonding portions 131 and 141. Can be. Here, when the height of the first surface 31 is formed higher than the upper surfaces of the light emitting chips 151 and 152, the second surface 32 may effectively reflect the light. The height of the first surface 31 may be formed as high as the difference between the top surface of the light emitting chips 151 and 152 and the range of 1 to 100 μm, but is not limited thereto. The first surface 31 of the first gap portion 113 is not formed, and the inclination angle of the inclined second surface 32 may be adjusted in a range of 10 to 90 degrees.

4, 5, 11, and 12, the second lead frame 130 may include a first connection part 133 connecting the second bonding part 131 and the second lead part 132; And an extension 134 extending into an area between the third inner side 43 of the cavity 115 and the third outer side 13 of the body 110. The extension part 134 includes a penetration preventing structure, and part of the extension part 134 may be bent and protruded in the upper direction of the body 110.

The first connector 133 and the second bonding part 131 are spaced apart from the lower surface 17 of the body 110. A portion of the second bonding portion 131 that contacts the first gap portion 113 may be formed of an intrusion preventing structure 36 to suppress moisture penetration.

The second lead frame 130 includes a penetration preventing part 50, and the penetration preventing part 50 is formed in a bent region between an upper surface of the second bonding part 131 and an upper surface of the first connection part 133. It is formed and in contact with the lower end of the first inner side 41 of the cavity 115. The penetration preventing unit 50 may provide a switching line or a bending line from an inclined starting point of the lower end of the first inner side 41 of the cavity 115, for example, from the bottom of the cavity of the second area A2.

The penetration preventing part 50 is formed in a stepped structure from an interface between the first inner side 41 of the cavity 115 and the second bonding part 131, and is formed when the injection molding of the body 110 is performed. The body material may be prevented from penetrating into the upper surface of the second bonding part 131 to suppress the occurrence of burrs. The penetration preventing part 50 may prevent moisture penetrating into an interface between the body 110 and the second lead frame 130. Accordingly, even when the connection member 162 such as the wire and / or the protection device are bonded onto the second bonding portion 131, the electrical reliability may be prevented from being degraded by the foreign matter such as the burr.

The penetration preventing part 50 is formed at an upper bent portion between the second bonding part 131 and the first connection part 133, which is formed from the second bonding part 131 and the first connection part 133. ) May be formed after bending, or before bending, but is not limited thereto.

4, 6, 11, and 12, the third lead frame 140 may include a second connection part 143 connecting the third bonding part 141 and the third lead part 142. And an extension 144 extending into an area between the fourth inner side 44 of the cavity 115 and the fourth outer side 14 of the body 110. The extension part 144 may include a penetration preventing structure, and a part of the extension part 144 may be bent and protrude in an upper direction of the body 110.

The second connecting portion 143 and the third bonding portion 141 are spaced apart from the lower surface 17 of the body 110. A portion of the third bonding portion 141 contacting with the first gap portion 113 may be formed as a penetration preventing structure 56 to suppress moisture penetration.

The third lead frame 140 includes a penetration preventing portion 51, and the penetration preventing portion 51 is formed at an upper surface bent portion between the third bonding portion 141 and the second connection portion 143. In contact with the lower end of the first inner side 41 of the cavity 115. The penetration preventing part 51 is formed in a stepped structure from an interface between the first inner side 41 of the cavity 115 and the third bonding part 141. By preventing the penetration of the body material to the upper surface of the three bonding portion 141 it can suppress the occurrence of burrs (burr). The penetration preventing part 51 may prevent moisture penetrating into an interface between the body 110 and the third lead frame 140. Accordingly, even when the connecting member 164 such as a wire is bonded onto the third bonding portion 141, deterioration of electrical reliability may be prevented by foreign matter such as a burr.

The penetration preventing unit 51 is formed at an upper bent portion between the third bonding unit 141 and the second connecting unit 143, which is formed from the third bonding unit 141 and the second connecting unit 143. ) May be formed after bending, or before bending, but is not limited thereto.

The starting point of the inclination of the first inner side 41 of the cavity 115 starts from the region of the penetration preventing portions 50, 51. That is, the starting point of the inclination of the first inner side 41 of the cavity 115 extends beyond the upper surfaces of the second and third bonding portions 131 and 141 to the surfaces (including the edge regions) of the penetration preventing portions 50 and 51. Contact.

Specifically, the structures of the bonding parts 131 and 141, the connection parts 133 and 143, and the penetration preventing parts 50 and 51 of the second and third lead frames 120 and 130 will be described in detail. Since the second and third lead frames 120 and 130 may be formed in the same structure, the detailed structure of the third lead frame 130 will be described with reference to FIGS. 7 and 8, and the second lead frame 120 will be described. For details of the structure, reference may be made to the description of the third lead frame 130.

Referring to FIGS. 7 and 8, the lower portion of the first inner side surface 41 of the cavity 115 starts from the outer edge of the third bonding portion 141 and the upper surface of the third bonding portion 141. Are spaced apart without contact.

The length B1 of the third bonding portion 141 of the third lead frame 140 is a space required for bonding the connection member (eg wire) or / and the protection element, and is 250 μm or more, for example, 400 μm to 600 μm. It can be formed in a range. When the length B1 of the third bonding part 141 is long, the distance between the first inner side 41 and the light emitting chip is increased, which may affect the luminance distribution of light. Accordingly, the length B1 may be formed to 600 μm or less. The penetration preventing unit 51 can suppress generation of unnecessary foreign matter from the first inner side surface 41. Accordingly, the length B1 of the third bonding part 141 may be optimized to the bonding space of the connection member, or the length B1 of the third bonding part 141 may be narrower in a limited space.

The penetration preventing unit 51 is a first surface 4, the first surface 4 and the second surface which is bent at an angle in the range of 90 to 130 degrees with respect to the upper surface 3 of the third bonding portion 141. And a second surface 5 which is bent between the inclined upper surfaces 6 of the connecting portion 143. The inner angle between the first surface 4 and the second surface 5 of the penetration preventing part 51 may be formed at an angle in the range of 60 to 120 degrees, for example, an angle of 90 ± 10 degrees. The height F1 of the first surface 4 may be formed at a depth in the range of 30 μm to 150 μm from the top surface of the third bonding part 141, and the width F2 of the second surface 5 may be The second connector 143 may have a width in a range of 50 μm to 160 μm. Here, the value of the height (F1) may be smaller than the value of the width (F2).

The penetration preventing parts 50 and 51 have a height F1 of the first surface 4 and a width F2 of the second surface 5, and when the liquid body material is injected, the injection mold In order to suppress the penetration into the upper surface of the bonding portion of the lead frame between the supporting force and the pressing force of the liquid body material, it serves as a buffer for the liquid body material.

The penetration preventing part 51 may have an angle θ2 between an upper surface 3 of the third bonding portion 141 and an upper surface 6 of the second connection portion 143, for example, in an angle of 181 degrees to 265 degrees. It may be formed in a portion bent in the range of 190 to 250 degrees. In addition, the penetration preventing part 51 functions as a blocking jaw at a portion where the upper surface 3 of the third bonding part 141 and the first inner side surface 41 of the cavity 115 come into contact with each other. The penetration preventing unit 51 is disposed in the body 110 and is in contact with a portion 45 of the body 110 to prevent moisture penetration. An angle θ5 between the third lead part 142 and the second connection part 143 may be formed in a range of 90 degrees to 160 degrees.

The difference E3 between the top surface of the first bonding part 121 of the first lead frame 120 and the top surface of the third bonding part 141 of the third lead frame 140 is formed in a range of 50 to 250 μm. Or a value smaller than the thickness E0 of the first lead frame 120.

As shown in FIG. 9A, when the lead frame 140 does not have a penetration preventing portion, a foreign material 41-1 such as a burr extending from the first inner side surface 41 of the body 110 may be formed. Generated and penetrates into the bonding area of the third bonding part 141 of the third lead frame 140. Since the boundary portion between the third bonding portion 141 and the second connecting portion 143 of the third lead frame 140 is formed with a surface having a predetermined curvature, the curved surface between the injection mold and the lead frame during injection molding As the body material of the liquid penetrates into the portion, foreign matters 41-1 such as burrs may be generated. Subsequently, when the end portion 164A of the connection member 164 or the protection element is bonded, poor bonding with the end portion 164A of the connection member 164 may occur by the foreign matter 41-1.

As illustrated in FIG. 9B, when the penetration prevention part is formed in the lead frame, foreign matter such as burrs may be prevented from occurring on the upper surface of the third bonding part 141 of the third lead frame 140. . That is, the penetration preventing part 51 provides a stepped jaw structure at the boundary portion between the first inner side 41 and the third bonding part 141 of the cavity 115, and thus, when injection molding the body 110, The penetration of the liquid body material into the part between the injection mold and the lead frame can be prevented. The penetration preventing part may be formed, for example, through a forging process on the bent portion of the lead frame.

10 is a rear view of the light emitting device of FIG. 1, FIG. 11 is a plan view of the lead frame of FIG. 1, and FIG. 12 is a rear view of the lead frame of FIG. 11.

Referring to FIG. 10, the light emitting device has a lower surface area of the first lead frame 121 exposed to the lower surface 17 of the body 110 and a second lead frame exposed to the lower surface 17 of the body 110. 130 and wider than a lower surface area of the third lead frame 140. In addition, each side of each lead frame (120, 130, 140) may include a concave-convex structure or a stepped structure for coupling with the body 110, but is not limited thereto.

Referring to FIG. 11, the first and second extension parts 124 and 125 of the upper region of the first lead frame 120 correspond to each other, and the length of the first lead frame 120 is smaller than the length of the first lead frame 120. . In addition, a plurality of grooves 25 may be formed between the first bonding portion 121 and the first lead portions 122 and 123 in the width direction perpendicular to the longitudinal direction of the light emitting device.

Penetration prevention portions 50 and 51 are formed in the second and third lead frames 130 and 140, and one or more grooves 35 and 55 are formed on the second and third lead portions 132 and 142 in the length direction of the light emitting device. It may be formed in a width direction that is orthogonal.

The penetration preventing portions 50 and 51 may be formed to have a length smaller than the widths of the second and third bonding portions 131 and 141, or may be formed to be the same as or longer than the widths of the first and second connecting portions 133 and 143. Can be.

Referring to FIG. 12, the moisture penetration preventing structures 128, 36, and 56 are disposed in the edge regions of the lead frames 120, 130, and 140, respectively. The moisture penetration preventing structures 128, 36, and 56 are formed in the width direction of the light emitting device.

13 to 15 are views illustrating a light emitting device according to a second embodiment. In describing the second embodiment, reference will be made to the first embodiment for the same configuration as the first embodiment.

Referring to the light emitting device 100A of FIG. 13, the first bonding portion 121 of the first lead frame 120 is disposed in the first region A1 of the cavity 115, and the second region A2 is disposed in the second region A2. The second bonding part 131 of the second lead frame 130 and the third bonding part 141 of the third lead frame 140 are disposed.

The second bonding portion 131 and the third bonding portion 141 are spaced apart from the first inner side 41 of the cavity 115. A first buffer portion 21 is formed between the second bonding portion 131 and the first inner side surface 41 of the cavity 115, and the third bonding portion 141 and the cavity 115 are formed. A second buffer portion 22 is formed between the first inner side surfaces 41. The first and second buffer parts 21 and 22 are connected to the second gap part 112 disposed between the second bonding part 131 and the third bonding part 141, and the second gap part 112 is connected to the first gap portion 113 and the first inner side surface 41. The first and second buffer parts 21 and 22 may be formed of a material of the body 110, and may be formed in the same plane as the upper surface of the second gap part 112 or in another plane.

The first buffer portion 21 maintains a gap between the second bonding portion 131 and the first inner surface 41 of the cavity 115, and the second buffer portion 22 The gap between the three bonding parts 141 and the first inner side surface 41 of the cavity 115 is maintained.

FIG. 14 is a sectional view taken along the E-E side of the light emitting device of FIG. 13, and FIG. 15 is a partially enlarged view of FIG. 14.

14 and 15, a stepped penetration preventing part 51 is formed below the second buffer part 22 from an upper surface of the third bonding part 141. Although not shown, a stepped penetration prevention part (not shown) is disposed below the first buffer part 21 from an upper surface of the second bonding part 131. For the structure of the penetration prevention part of the second lead frame, the description of the penetration prevention part 51 of the third lead frame will be referred to.

The length B3 of the third bonding part 141 of the third lead frame 140 is a space required for bonding the connecting member (eg, a wire), and is formed in a range of 400 μm to 600 μm, for example, 250 μm or more. Can be. When the length B3 of the third bonding part 141 is long, the distance between the first inner side 41 and the light emitting chip is increased, which may affect the luminance distribution of light. Accordingly, the length B3 may be formed to 600 μm or less. The penetration preventing part 51 can suppress the generation of unnecessary foreign matter from the second buffer part 22. Accordingly, the length B3 of the third bonding part 141 may be optimized to the bonding space of the connecting member, or the length B3 of the third bonding part 141 may be narrower in a limited space.

The penetration preventing part 51 may include a first surface 4, an angle between the first surface 4, and the second connection portion that are bent at an angle in a range of 50 to 90 with respect to the upper surface 3 of the third bonding portion 141. And a second surface 5 connecting between the inclined top surface 6 of 143. The inner angle between the first surface 4 and the second surface 5 may be formed at an angle in the range of 60 degrees to 120 degrees, for example, an angle of 90 ± 10 degrees. The height F1 of the first surface 4 may be formed in the range of 30 to 150 μm, and the width F2 of the second surface 5 may be formed in the range of 50 to 160 μm. Here, the value of the height (F1) may be smaller than the value of the width (F2).

In addition, the penetration preventing part 51 has an angle between the upper surface 3 of the third bonding portion 141 and the upper surface 6 of the second connecting portion 143 is bent at an angle in the range of 181 degrees to 265 degrees. It can be formed in the part. The second buffer portion 22 is disposed in the penetration preventing portion 51.

In addition, since the second buffer part 22 is disposed in the penetration preventing part 51, the penetration for preventing the infiltration of foreign substances generated from the second buffer part 22 or penetrating through the second buffer part 22. It will function as a prevention jaw.

The upper surface width F5 of the second buffer portion 22 may be formed to have a width substantially the same as the upper surface width of the first buffer portion 21, and the second surface 5 of the penetration preventing portion 51. It may have a width equal to or wider than the width (F2). The upper surface width F5 may be formed in the range of 50 ~ 300㎛.

The angle θ3 between the upper surface of the second buffer portion 22 and the first inner surface 41 of the cavity 115 may be formed at an angle greater than 90 degrees and less than 180 degrees, for example, 100 to 140 degrees. It can be formed within a range.

Although not shown, the structure of the penetration preventing portion of the second lead frame will be referred to the structure of the penetration preventing portion of the third lead frame.

16 is a partial side cross-sectional view of a light emitting device according to the third embodiment. In the description of the third embodiment, the same parts as those of the first and second embodiments will be described with reference to the description of the first and second embodiments.

Referring to FIG. 16, in the light emitting device, the lower end portion of the first inner side surface 41 of the cavity 115 and the penetration preventing portion 51B contact each other. The lower end portion of the first inner side surface 41 may be spaced apart from the first surface 4 of the penetration preventing portion 51B, and the spaced region 147 may be a groove. The lower end portion of the first inner side surface 41 may contact the edge portion of the second surface 5 of the penetration preventing portion 51B.

The lower end portion of the first inner side surface 41 is formed at a position lower than the upper surface 3 of the third bonding portion 141 of the third lead frame 140. The upper surface 3 of the third bonding portion 141 is separated from the first inner surface 41 by separating the lower end of the first inner surface 41 from the upper surface 3 of the third bonding portion 141. It can block the generation of foreign substances that penetrate into).

The starting point of the inclination of the first inner side 41 of the cavity 115 starts from the first and second buffer parts 21 and 22. That is, the starting point of the inclination of the first inner side 41 of the cavity 115 is switched from the top surfaces of the first and second buffer parts 21 and 22 and the second and third bonding parts 131 and 141. )

As another example, the lower end portion (ie, starting point) of the first inner side surface 41 may be lower than the upper surface 3 of the third bonding portion 141 of the third lead frame 140. It may be formed on the upper surface of the second connecting portion 143 of the 140 or the second surface 5 of the penetration prevention unit 51, but is not limited thereto.

A groove 27 may be formed in a portion of the upper surface of the first bonding portion 121 of the first lead frame 120, and the groove 27 may be a portion of the first gap portion 113. have.

Although not shown, the structure of the penetration preventing portion of the second lead frame will be referred to the structure of the penetration preventing portion of the third lead frame.

17 is a partial side cross-sectional view of a light emitting device according to the fourth embodiment. In describing the fourth embodiment, other configurations will be referred to the description of the above embodiment.

Referring to FIG. 17, the light emitting device includes a penetration preventing part 51C having a two-stepped structure on an upper portion between the third bonding part 141 and the second connection part 143 of the third lead frame 140. . The penetration preventing part 51C is provided with a first surface 4A and a second surface 5A having a step structure from an upper surface 3 of the third bonding portion 141, and then again a second surface 5A. From this, the third surface 4B and the fourth surface 5B having a stepped structure are arranged. Thereby, the penetration prevention part 51C which has a 2 or more step | paragraph structure can be provided.

The second buffer part 22 may be disposed on the penetration preventing part 51C to be spaced apart from the first inner side 41 of the cavity 115. As another example, the first embodiment and the penetration preventing unit 51C may be in contact with the lower end of the first inner side 41 of the cavity 115, but is not limited thereto. Accordingly, a failure of a connection member such as a wire on the upper surface 3 of the third bonding portion 141 can be prevented.

Although not shown, the structure of the penetration preventing portion of the second lead frame will be referred to the structure of the penetration preventing portion of the third lead frame.

18 is a partial side cross-sectional view of a light emitting device according to the fifth embodiment. In describing the fifth embodiment, other configurations will be referred to the description of the above embodiment.

Referring to FIG. 18, in the light emitting device, the second buffer part 22A is disposed in the penetration preventing part 51 of the third lead frame 140. The upper surface of the second buffer portion 22A is formed at a position lower than the upper surface 3 of the third bonding portion 141 of the third lead frame 140 by a predetermined gap G1. The gap G1 may be formed at a value smaller than the height (eg, in the range of 30 to 150 μm) of the first surface 4 of the penetration preventing part 51, for example, in the range of 1 to 50 μm. Accordingly, the thickness G2 of the second buffer portion 22A may be formed to a thickness lower than the height of the first surface 4. By forming a height difference between the upper surface of the second buffer portion 22A and the upper surface 3 of the third bonding portion 141, a jaw that prevents foreign substances generated or penetrated from the second buffer portion 22A is formed. Can provide. Accordingly, a failure of a connection member such as a wire on the upper surface 3 of the third bonding portion 141 can be prevented.

Although not shown, the structure of the penetration prevention portion of the second lead frame and the structure of the first buffer portion will be referred to the structure of the penetration prevention portion of the third lead frame.

19 is a partial side cross-sectional view of a light emitting device according to the sixth embodiment. In describing the sixth embodiment, other configurations will be referred to the description of the above embodiment.

Referring to FIG. 19, the light emitting device has a structure in which a plurality of penetration preventing parts are provided in the second lead frame (not shown) and the third lead frame 140. For convenience of description, the third lead frame 140 will be described.

The third lead frame 140 includes a stepped penetration preventing part 51 on an upper portion of the boundary portion between the third bonding part 141 and the second connection part 143, and the second connection part 143 and the third part. A stepped lower penetration preventing portion 53 is disposed below the boundary portion between the lead portions 142. The lower penetration preventing part 53 includes a first surface 7 stepped from the lower surface 142A of the third lead part 142 and a second surface 8 stepped from the first surface 7. do. The height F6 of the first surface 7 may be formed in the range of 30 to 150 μm, and the width F6 of the second surface 8 may be formed in the range of 50 to 160 μm. Here, the value of the height (F6) may be smaller than the value of the width (F7).

A portion 113B of the first gap portion 113 may be disposed in the lower penetration preventing portion 53, but is not limited thereto. By disposing the lower penetration preventing part 53, foreign matter generated from the first gap part 113 may be prevented from extending to the lower surface 142A of the third lead part 142.

20 is a partial side cross-sectional view of a light emitting device according to the seventh embodiment. In describing the seventh embodiment, other configurations will be referred to the description of the above embodiment.

Referring to FIG. 20, the light emitting device has a second buffer on the penetration preventing part 51 between the first inner side 41 of the cavity 115 and the third bonding part 141 of the third lead frame 140. The portion 22B may be disposed, and the upper surface of the second buffer portion 22B may be formed as a recess 22C or a rough structure. Accordingly, the groove 22C of the second buffer portion 22B can primarily prevent the liquid body material from penetrating. Accordingly, a failure of a connection member such as a wire on the upper surface 3 of the third bonding portion 141 can be prevented.

Although not shown, the structures of the penetration prevention portion and the first buffer portion of the second lead frame will be referred to the structures of the penetration prevention portion and the second buffer portion of the third lead frame.

21 to 23 are diagrams showing modified examples of the light emitting device of FIG. 1.

21 is a modified example of a light emitting device according to the embodiment. In the description of the light emitting device of FIG. 21, other configurations will be referred to the description of the above embodiment.

Referring to FIG. 21, in the light emitting device, the first and second light emitting chips 151 and 152 are disposed on the first bonding part 121 of the first lead frame 120 and the second of the second lead frame 130 is disposed. The first protection element 171 is disposed on the bonding portion 131, and the second protection element 172 is disposed on the third bonding portion 141 of the third lead frame 140.

The first light emitting chip 151 is connected to the first bonding part 121 and the second bonding part 131 by first and second connecting members 161 and 162, and the second light emitting chip 152 is first bonded. The third and fourth connecting members 163 and 164 are connected to the part 121 and the third bonding part 141.

The first protection element 171 is connected to the second bonding portion 131 by a conductive member (not shown), and is connected by the first bonding portion 121 and the fifth connection member 174. The second protection element 172 is connected to the third bonding portion 141 by a conductive member (not shown), and is connected by the first bonding portion 121 and the sixth connection member 175.

The boundary between the second and third bonding parts 131 and 141 and the first inner side surface 41 of the cavity 115 includes an intrusion prevention part as in the first embodiment or an intrusion prevention as in the second embodiment. A portion and a buffer portion may be provided, but are not limited thereto.

FIG. 22 is a diagram illustrating a modified example of the light emitting device of FIG. 1.

Referring to FIG. 22, the light emitting device is configured to arrange a large area of the light emitting chip 154 on the first bonding portion 121 of the first lead frame 120, and then to the first and second connection members 165 and 166. The second and third bonding parts 131 and 141 of the second and third lead frames 130 and 140 are connected to each other. The second and third lead frames 130 and 140 may have the same polarity, and the light emitting chip 154 is electrically connected to the first lead frame 120 through a conductive member (not shown).

A protection element 171A may be disposed in the third bonding portion 141 of the third lead frame 140, and the protection element 171A may be electrically connected to the first bonding portion 121 as a connecting member 175. Is connected.

The structure of the penetration preventing part of the second and third lead frames 130 and 140 will be referred to the structure and description of the above embodiment.

Referring to FIG. 23, the light emitting chip 155 is mounted on the first bonding part 121 of the first lead frame 120, and the light emitting chip 155 is electrically connected to the first bonding part 121. The second bonding portion 131 and the connecting member 165 are connected.

The protection element 171 is disposed on the third bonding part 141 of the third lead frame 140 and electrically connected to the third bonding part 141 and the first bonding part 121. The second and third lead frames 130 and 140 may be connected to power terminals having the same polarity, but are not limited thereto.

The structure of the penetration preventing part of the second and third lead frames 130 and 140 will be referred to the structure and description of the above-described embodiment.

24 is a plan view of a light emitting device according to an eighth embodiment. 24, another configuration will be referred to the first embodiment.

Referring to FIG. 24, the light emitting device includes two lead frames 120 and 130A, and at least one light emitting chip 151 is disposed on the first bonding part 121 of the first lead frame 120. The protection element 171 is disposed on the second bonding portion 131A of the two-lead frame 130A.

The second lead frame 130 includes a plurality of second lead parts 132 and 132A branched from the second bonding part 131A.

An intrusion prevention portion (not shown) is disposed at a boundary portion between the second bonding portion 131A and the first inner side surface 41 of the inner side 114 of the cavity 115, and the width of the penetration prevention portion is The width of the cavity 115 may be the same as or wider than the bottom width, but is not limited thereto. The structure of the penetration preventing unit may be formed as in the structure of the first embodiment or the second embodiment, but is not limited thereto.

FIG. 25 is a diagram illustrating a modified example of the light emitting device of FIG. 12. 25, the same parts as in the second embodiment will be described with reference to the description of the second embodiment.

Referring to FIG. 25, the light emitting device may arrange the first light emitting chip 151 and the second light emitting chip 152 on the first bonding part 121 of the first lead frame 120, and may include a second lead frame ( The first protection element 171 is disposed on the second bonding portion 131 of 130, and the second protection element 172 is disposed on the third bonding portion 141 of the third lead frame 140.

The first light emitting chip 151 and the first protection device 171 are connected to the first bonding part 121 and the second bonding part 131, and the second light emitting chip 152 and the second protection device ( The 172 is connected to the first bonding portion 121 and the third bonding portion 141. The first and second light emitting chips 151 and 152 may be disposed adjacent to each other, but is not limited thereto.

Between the second bonding portion 121 and the first inner side surface 41 of the cavity 115, a first buffer portion 21 extends from the first inner side surface 41, and the third bonding portion is formed. Between the 141 and the first inner side surface 41 of the cavity 115, a second buffer portion 22 extends from the first inner side surface 41.

26 is a plan view of a light emitting device according to the ninth embodiment.

Referring to FIG. 26, the light emitting device may include a body 210 having a cavity 215, first to fifth lead frames 220, 230, 240, 250, and 260, first and second light emitting chips 271 and 272, and first and second protection devices ( 291,292).

The first lead frame 220 is disposed at the bottom of the center region in the cavity 215, and the first and second light emitting chips 271 and 272 are disposed on the first lead frame 220. The first lead frame 220 serves as a heat radiation frame.

The second lead frame 230 protrudes from the second bonding portion 231 disposed adjacent to the first inner surface 41A of the cavity 215 and the first outer surface 11 of the body 210. And a second connection part (not shown) extending through the body 210 to connect the second lead part 232, the second bonding part 231, and the second lead part 232.

The third lead frame 240 protrudes to the third bonding part 241 disposed adjacent to the first inner side surface 41A of the cavity 215, and to the first outer side surface 11 of the body 210. And a third connector (not shown) extending through the body 210 to connect the third lead portion 242, the third bonding portion 241, and the third lead portion 242.

The fourth lead frame 250 protrudes to the fourth bonding part 251 disposed adjacent to the second inner side surface 42A of the cavity 215, and to the second outer side surface 12 of the body 210. And a fourth connection part (not shown) extending through the body 210 to connect the fourth lead part 252, the fourth bonding part 251, and the fourth lead part 252.

The fifth lead frame 260 protrudes from the second bonding portion 261 disposed adjacent to the second inner side surface 42A of the cavity 215 and the second outer side surface 12 of the body 210. And a fifth connector (not shown) extending through the body 210 to connect the fifth lead portion 262, the fifth bonding portion 261, and the fifth lead portion 262.

Third bonding of the second bonding part 231 of the second lead frame 230 and the third lead frame 240 between the first lead frame 220 and the first inner surface 41A of the cavity 215. Part 241 is disposed.

The fifth bonding portion 251 of the fourth lead frame 250 and the fifth of the fifth lead frame 260 between the first lead frame 220 and the second inner side surface 42A of the cavity 215. The bonding part 261 is arrange | positioned.

A gap portion 212, 213, 212A, and 213A are disposed between the first lead frame 220 and the second to fifth bonding portions 231, 241, 251 and 261 to physically separate each other.

The first light emitting chip 271 is connected to the second bonding portion 231 and the third bonding portion 241 by connecting members 281 and 283, and the first protection element 291 is connected to the third bonding portion 241. It is disposed on and connected to the second bonding portion 231 and the connection member 295.

The second light emitting chip 272 is connected to the fourth bonding portion 251 and the fifth bonding portion 261 by connecting members 283 and 294, and the second protection element is disposed on the fifth bonding portion 261. And a fourth bonding part 251 and a connecting member 296.

The top surface of the first lead frame 220 is disposed to a depth lower than the top surfaces of the second to fifth bonding parts 231, 241, 251 and 261, and the gap parts 213 and 213A are disposed at the outer portion of the first lead frame 220. ) Surface can be used as a reflective wall.

Intrusion prevention portions (not shown) are formed in the second and third lead frames 230 and 240 at the boundary portion between the second and third bonding portions 231 and 241 and the first inner side surface 41A of the cavity 215. As a result, foreign substances generated from the first inner side surface 41A may be blocked.

Penetration preventing portions (not shown) are formed in the fourth and fifth lead frames 250 and 260 at a boundary portion between the fourth and fifth bonding portions 251 and 261 and the second inner side surface 42A of the cavity 215. As a result, foreign substances generated from the second inner side surface 42A may be blocked.

The light emitting device of the embodiment may include a buffer unit (not shown) extending from the first and second inner side surfaces 41A and 42A of the cavity 215 as in the second embodiment, but is not limited thereto.

A light emitting chip according to an embodiment will be described with reference to FIGS. 27 and 28.

27 is a view illustrating a light emitting chip according to an embodiment.

Referring to FIG. 27, the light emitting chip according to the embodiment includes a substrate 311, a buffer layer 312, a light emitting structure 310, a first electrode 316, and a second electrode 317. The substrate 311 includes a substrate of a light transmissive or non-transparent material, and also includes a conductive or insulating substrate.

The buffer layer 312 reduces the lattice constant difference between the substrate 311 and the material of the light emitting structure 310 and may be formed of a nitride semiconductor. A nitride semiconductor layer that is not doped with a dopant may be further formed between the buffer layer 312 and the light emitting structure 310 to improve crystal quality.

The light emitting structure 310 includes a first conductive semiconductor layer 313, an active layer 314, and a second conductive semiconductor layer 315.

The first conductive semiconductor layer 313 is formed of a group III-V compound semiconductor doped with a first conductive dopant, and the first conductive semiconductor layer 313 is an n-type semiconductor layer. The conductive dopant is an n-type dopant and includes Si, Ge, Sn, Se, Te.

A first cladding layer may be formed between the first conductive semiconductor layer 313 and the active layer 314. The first cladding layer may be formed of a GaN-based semiconductor, and the band gap may be formed to be greater than or equal to the band gap of the active layer 314. The first cladding layer is formed of a first conductive type and serves to restrain the carrier.

The active layer 314 is disposed on the first conductive semiconductor layer 313 and optionally includes a single quantum well, a multi-quantum well (MQW), a quantum wire structure, or a quantum dot structure. do. The active layer 314 includes a cycle of a well layer and a barrier layer. The well layer includes a composition formula of In _x Al _y Ga _{1 -x- y} N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1), and the barrier layer is In _x Al _y It may include a composition formula of Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). The period of the well layer / barrier layer may be formed in one or more cycles using, for example, a stacked structure of InGaN / GaN, GaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, InAlGaN / InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than that of the well layer.

The second conductive semiconductor layer 315 is formed on the active layer 314. The second conductive semiconductor layer 315 may be formed of any one of a semiconductor doped with a second conductive dopant, for example, a compound semiconductor such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, or AlInN. The second conductive semiconductor layer 315 is a p-type semiconductor layer, and the second conductive dopant is a p-type dopant and may include Mg, Zn, Ca, Sr, and Ba.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN / GaN superlattice structure or an AlGaN / GaN superlattice structure. The superlattice structure of the second conductive semiconductor layer 315 may abnormally diffuse the current included in the voltage to protect the active layer 314.

In addition, the conductive type of the light emitting structure 310 may be disposed to be reversed. For example, the first conductive semiconductor layer 313 may be a P-type semiconductor layer, and the second conductive semiconductor layer 315 may be an n-type semiconductor layer. can do. The first conductive semiconductor layer having a polarity opposite to that of the second conductive type may be further disposed on the second conductive semiconductor layer 315.

The light emitting structure 310 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Here, p is a p-type semiconductor layer, n is an n-type semiconductor layer, and-includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer is in direct contact or indirect contact. Hereinafter, for convenience of description, the uppermost layer of the light emitting structure 310 will be described as the second conductive semiconductor layer 315.

The first electrode 316 is disposed on the first conductive semiconductor layer 313, and the second electrode 317 has a current diffusion layer on the second conductive semiconductor layer 315.

28 is a diagram illustrating another example of a light emitting chip according to one embodiment. In FIG. 28, the same parts as in FIG. 27 are omitted and will be briefly described.

Referring to FIG. 28, in the light emitting chip according to the embodiment, an ohmic contact layer 321 is formed under the light emitting structure 310, a reflective layer 324 is formed below the ohmic contact layer 321, and the reflective layer ( A support member 325 is formed under the 324, and a protective layer 323 may be formed around the reflective layer 324 and the light emitting structure 310.

The light emitting chip 3102 forms an ohmic contact layer 321 and a protective layer 323, a reflective layer 324, and a support member 325 under the second conductive semiconductor layer 315, and then removes the growth substrate. Can be formed.

The ohmic contact layer 321 is in ohmic contact with a lower layer of the light emitting structure 310, for example, the second conductive semiconductor layer 315, and the material may be selected from a metal oxide, a metal nitride, an insulating material, and a conductive material. For example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum (AZO) material consisting of zinc oxide), antimony tin oxide (ATO), gallium zinc oxide (GZO), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf and optional combinations thereof It can be formed from. In addition, it may be formed in a multi-layer using the metal material and light transmitting conductive materials such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, and the like. / Ag / Ni and the like can be laminated. An inside of the ohmic contact layer 321 may further include a layer blocking a current to correspond to the electrode 316.

The protective layer 323 may be selected from a metal oxide or an insulating material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IZAO), or IGZO. (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), SiO ₂ , SiO _x , SiO _x N _y , It may be selectively formed from Si ₃ N ₄ , Al ₂ O ₃ , TiO ₂ . The protective layer 323 may be formed using a sputtering method or a deposition method, and may prevent a metal such as the reflective layer 324 from shorting the layers of the light emitting structure 310.

The reflective layer 324 may be formed of a material made of a metal, for example, Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and a combination thereof. The reflective layer 324 may be formed larger than the width of the light emitting structure 310, which may improve the light reflection efficiency. A metal layer for bonding and a metal layer for heat diffusion may be further disposed between the reflective layer 324 and the support member 325, but the embodiment is not limited thereto.

The support member 325 is a base substrate, and may be a metal such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W), or a carrier wafer (eg, Si, Ge, GaAs, ZnO, SiC). A bonding layer may be further formed between the support member 325 and the reflective layer 324, and the bonding layer may bond two layers to each other. The disclosed light emitting chip is one example and is not limited to the features disclosed above. The light emitting chip may be selectively applied to the above embodiment of the light emitting device, but is not limited thereto.

<Lighting system>

The light emitting device or the light emitting device according to the embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light emitting elements are arranged, and includes a display device shown in FIGS. 29 and 30 and a lighting device shown in FIG. 31, and may include a lighting lamp, a traffic light, a vehicle headlamp, an electronic signboard, and the like. have.

29 is an exploded perspective view of a display device having a light emitting device according to the embodiment.

Referring to FIG. 29, the display apparatus 1000 according to the exemplary embodiment includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), An optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light source module 1031, and a reflective member 1022 on the optical sheet 1051. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 diffuses light to serve as a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin-based, such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN) It may include one of the resins.

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

The light source module 1031 may include at least one in the bottom cover 1011, and may provide light directly or indirectly at one side of the light guide plate 1041. The light source module 1031 includes a support member 1033 and a light emitting device 1035 according to the embodiment (s) disclosed above, wherein the light emitting device 1035 is disposed on the support member 1033 at predetermined intervals. Can be arrayed. The support member 1033 may be a substrate or a heat dissipation plate, but is not limited thereto.

The substrate may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate may include not only a general PCB, but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. The light emitting device 1035 may be mounted on a side surface of the bottom cover 1011 or on a heat dissipation plate. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

In addition, the plurality of light emitting devices 1035 may be mounted on the support member 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device 1035 may directly or indirectly provide light to a light incident part, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 may improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with an accommodating part 1012 having a box shape having an upper surface opened thereto, but is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizer may be attached to at least one surface of the display panel 1061, but the polarizer is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet. The optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses the incident light, the horizontal and / or vertical prism sheet focuses the incident light into the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness. In addition, a protective sheet may be disposed on the display panel 1061, but is not limited thereto.

Here, the light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light source module 1031, but are not limited thereto.

30 is a diagram illustrating a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 30, the display device 1100 may include a bottom cover 1152, a support member 1120 in which the light emitting device 1124 disclosed in the above embodiment (s) is arranged, an optical member 1154, and a display panel. 1155.

The support member 1120 and the light emitting device 1124 may be defined as a light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto. The light source module 1160 includes a support member 1120 and a plurality of light emitting devices 1124 arranged on the support member 1120.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, horizontal and vertical prism sheets, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, the horizontal and vertical prism sheets focus the incident light onto the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness.

The optical member 1154 is disposed on the light source module 1160 and performs surface light, or diffuses, condenses, or the like the light emitted from the light source module 1160.

31 is an exploded perspective view of a lighting device having a lighting device according to the embodiment.

Referring to FIG. 31, the lighting apparatus according to the embodiment may include a cover 2100, a light source module 2200, a heat radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. Can be. In addition, the lighting apparatus according to the embodiment may further include any one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or hemisphere, may be hollow, and may be provided in an open shape. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter or excite the light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat sink 2400. The cover 2100 may have a coupling part coupled to the heat sink 2400.

An inner surface of the cover 2100 may be coated with a milky paint. The milky paint may include a diffuser to diffuse light. The surface roughness of the inner surface of the cover 2100 may be greater than the surface roughness of the outer surface of the cover 2100. This is for the light from the light source module 2200 to be sufficiently scattered and diffused to be emitted to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent and opaque so that the light source module 2200 is visible from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the heat sink 2400. Thus, heat from the light source module 2200 is conducted to the heat sink 2400. The light source module 2200 may include a light emitting element 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the heat dissipator 2400, and includes a plurality of lighting elements 2210 and guide grooves 2310 into which the connector 2250 is inserted. The guide groove 2310 corresponds to the board and the connector 2250 of the lighting device 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 is reflected on the inner surface of the cover 2100 to reflect the light returned to the light source module 2200 side again toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting apparatus according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 may block the accommodating groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may include a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside to provide the light source module 2200. The power supply unit 2600 is accommodated in the accommodating groove 2725 of the inner case 2700, and is sealed in the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and an extension unit 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A plurality of parts may be disposed on one surface of the base 2650. The plurality of components may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling the driving of the light source module 2200, and an ESD for protecting the light source module 2200. (ElectroStatic discharge) protection element and the like, but may not be limited thereto.

The extension part 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension part 2670 may be provided to be equal to or smaller than the width of the connection part 2750 of the inner case 2700. Each end of the "+ wire" and the "-wire" may be electrically connected to the extension 2670, and the other end of the "+ wire" and the "-wire" may be electrically connected to the socket 2800. .

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is hardened, so that the power supply part 2600 can be fixed inside the inner case 2700.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. In addition, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

11-14: Outer side
41-44: medial side
50,51: intrusion prevention section
100,100A: light emitting device
110,210: body
115,215: Cavity
120,130,130A, 140,220,230,240,250,260: lead frame
121,131,131A, 141,231,241,251,261: bonding part
122,132,142,232,242,252,262: lead portion
133,143: connection
151,152,154,155,271,272: light emitting chip
160: molding member

Claims (13)

A body having a first to fourth outer side surface;
A cavity disposed in the body and corresponding to the first to fourth outer surfaces and having inclined first to fourth inner surfaces;
A first lead frame having a first bonding portion and a first lead portion disposed in the cavity;
A second bonding part disposed in the cavity and adjacent to the first inner side surface of the cavity, a first connection part bent from the second bonding part, and extending from the first connection part in a first outer surface direction of the body; A second lead frame including a second lead portion;
A first gap portion between the first lead frame and the second lead frame; And
A light emitting chip on the first bonding portion,
The second lead frame includes a first penetration preventing portion stepped between an upper surface of the second bonding portion and an upper surface of the first connecting portion,
The inclination start point of the first inner side surface of the cavity is in contact with the surface of the first penetration prevention portion. A body having a first to fourth outer side surface;
A cavity disposed in the body and corresponding to the first to fourth outer surfaces and having inclined first to fourth inner surfaces;
A first lead frame having a first bonding portion and a first lead portion disposed in the cavity;
A second bonding part disposed in the cavity and adjacent to the first inner side surface of the cavity, a first connection part bent from the second bonding part, and extending from the first connection part in a first outer surface direction of the body; A second lead frame including a second lead portion;
A first gap portion between the first lead frame and the second lead frame; And
A light emitting chip on the first bonding portion,
The second lead frame includes a first penetration preventing portion stepped between an upper surface of the second bonding portion and an upper surface of the first connecting portion,
The body includes a first buffer portion extending from the first inner side of the cavity into the first penetration preventing portion,
The inclination start point of the first inner side of the cavity is spaced apart from the second bonding portion and is switched from the upper surface of the first buffer portion. The method according to claim 1 or 2,
And a second penetration preventing portion stepped at a bent portion between the lower surface of the second lead portion and the lower surface of the first connection portion of the second lead frame. The method according to claim 1 or 2,
A portion of the body is disposed below the first inner side surface of the cavity in the first penetration preventing portion,
And the second lead frame includes an extension part extending into an area between the third side surface of the cavity and the third outer side surface of the body. The method of claim 1,
The first penetration preventing portion includes a first surface bent from the upper surface of the second bonding portion, and the first surface and the second surface bent from the upper surface of the first connecting portion. The method according to claim 1 or 2,
The inclination start point of the first inner side surface of the cavity is spaced apart from the upper surface of the second bonding portion. The method of claim 5,
And a first depth from the upper portion of the body to the first bonding portion of the first lead frame is deeper than a second depth from the upper portion of the body to the second bonding portion of the second lead frame. The method of claim 4, wherein
A portion of the extension portion is bent in the upper direction of the body protruding light emitting device. The method of claim 3,
The first penetration preventing portion is formed in the bent region between the upper surface of the second bonding portion and the upper surface of the first connecting portion and the light emitting device in contact with the lower end of the first inner surface of the cavity. The method of claim 2,
The upper surface of the first buffer portion is disposed on the same plane as the upper surface of the second bonding portion of the second lead frame. The method of claim 2,
The upper surface of the first buffer portion comprises a concave groove in which the first inner side of the cavity begins. delete delete

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