KR101946599B1 - Polishing apparatus - Google Patents

Polishing apparatus Download PDF

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Publication number
KR101946599B1
KR101946599B1 KR1020150161979A KR20150161979A KR101946599B1 KR 101946599 B1 KR101946599 B1 KR 101946599B1 KR 1020150161979 A KR1020150161979 A KR 1020150161979A KR 20150161979 A KR20150161979 A KR 20150161979A KR 101946599 B1 KR101946599 B1 KR 101946599B1
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KR
South Korea
Prior art keywords
polishing
axis
polished
unit
axis variable
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KR1020150161979A
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Korean (ko)
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KR20170058143A (en
Inventor
윤종훈
신광호
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(주)에코맥스
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Priority to KR1020150161979A priority Critical patent/KR101946599B1/en
Publication of KR20170058143A publication Critical patent/KR20170058143A/en
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Publication of KR101946599B1 publication Critical patent/KR101946599B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/0031Machines having several working posts; Feeding and manipulating devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/0031Machines having several working posts; Feeding and manipulating devices
    • B24B13/0037Machines having several working posts; Feeding and manipulating devices the lenses being worked by different tools, e.g. for rough-grinding, fine-grinding, polishing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass

Abstract

The present invention provides a polishing apparatus capable of cross-polishing. The cross-polishable polishing apparatus includes a body portion, a seating portion provided on the body portion, on which the object to be polished is seated; A polishing unit installed on the main body so as to be positioned above the seating unit, the polishing unit polishing the object to be polished; And a cross polishing unit installed in the main body to vary the polishing position for the object to be polished along different axes.

Description

[0001] POLISHING APPARATUS [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus capable of cross-polishing, and more particularly, to a polishing apparatus capable of cross-polishing capable of increasing an amount of grinding by polishing an object to be polished while being moved along an axis forming an orthogonal direction.

Generally, processing of a material to be polished such as a lens or a cover glass is composed of a device for transferring a material to be polished, a device for fixing the material to be polished, and a device for polishing the material to be polished.

Conventionally, a material to be polished, which has a hemispherical shape or a right angle and has grooves, is polished and processed into a predetermined shape through a polishing apparatus to be molded.

Normally, an abrasive member included in a polishing apparatus for polishing is rotated by itself and guided by a linear guide to polish a material to be polished.

As a result, the polishing rate at the portion to be polished may be lowered and the uniformity of the polished surface may be lowered.

In other words, conventionally, there is a problem that the abrasive material is not polished while the abrasive material flows along an axis forming the orthogonal direction, and the amount of grinding is remarkably lowered.

A prior art document related to the present invention is Korean Patent Registration No. 10-0778806 (registered on November 16, 2007).

An object of the present invention is to provide a polishing apparatus capable of cross-polishing capable of increasing an amount of grinding by polishing an object to be polished while flowing along an axis forming an orthogonal direction.

In a preferred aspect, the present invention provides a polishing apparatus capable of cross-polishing.

The cross-polishable polishing apparatus includes a body portion, a seating portion provided on the body portion, on which the object to be polished is seated; A polishing unit installed on the main body so as to be positioned above the seating unit, the polishing unit polishing the object to be polished; And a cross polishing unit installed in the main body to vary the polishing position for the object to be polished along different axes.

It is preferable that the cross polishing section controls the polishing section so as to be movable along the X axis and the Y axis.

Wherein the cross polishing section comprises: an X-axis variable section disposed in the seating section for varying the polishing section along the X axis; a Y-axis varying section for varying the X-axis varying section along the Y-axis; And a control unit for controlling the driving of the shaft variable portion.

Preferably, the control unit independently drives the X-axis variable unit and the Y-axis variable unit, and controls the reciprocating movement within a set movement interval.

The polishing unit includes a polishing head provided on the X-axis variable portion and having a rotary motor rotated by receiving a control signal from the control unit; and a polishing head mounted on the polishing head, rotated by driving the rotary motor, And a polishing member for polishing the wafer.

Preferably, the object to be polished is formed with a groove at a central portion thereof as the object is polished, and a polishing region comprising a rim constituting an outer edge of the groove.

The control unit preferably simultaneously reciprocates the X-axis varying unit and the Y-axis varying unit such that the polishing member is simultaneously cross-polished along different axes at a position where the abrasive member forms an edge with the frame in the groove .

It is preferable that the polishing section is lifted by the lifting section.

It is preferable that the polishing head is provided with a distance sensor for measuring a distance value to a polishing region formed on the object to be polished and transmitting the measured distance value to the control unit.

The control unit preferably sets a reference distance value up to the polishing area.

The control unit preferably controls driving of the elevation unit, the X-axis variable unit, and the Y-axis variable unit such that the measured distance value reaches the reference distance value.

And a rotating portion is further provided between the X-axis varying portion and the Y-axis varying portion.

Preferably, the rotation unit receives the control signal from the control unit and horizontally rotates the X-axis variable unit at an angle set to make an acute angle or an obtuse angle with respect to the Y-axis moving path of the Y-axis varying unit.

It is preferable that the polishing member is detachable from the polishing head.

The present invention has an effect that the polishing rate per unit time or the amount of grinding can be relatively improved since the polishing object can be polished while moving the polishing member in an ascending and descending direction and in a direction intersecting with the XY axis.

Further, the present invention has the effect of increasing the polishing progression rate of the object to be polished.

Further, it is an object of the present invention to solve the problem of non-polishing (phenomenon of less polishing) occurring in a corner area of a groove forming a polishing area when a target such as a cover glass is polished, Effect.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1A is a view showing a polishing apparatus capable of cross-polishing according to the present invention. FIG.
1B is a view showing a configuration of a polishing portion according to the present invention.
FIG. 2 is a schematic diagram showing the driving of the X-axis variable part and the Y-axis variable part of the present invention.
3 is a view showing a relationship between a polishing part and an object to be polished according to the present invention.
4 is a view showing an object to be polished according to the present invention.
5 is a view showing an example in which an abrasive section according to the present invention is reciprocated and driven along an intersecting axis.
6 is a view showing a process of polishing the edges of the object to be polished.
7 is a flow chart showing the polishing action of the polishing apparatus of the present invention.
8 is a view showing an example in which the X-axis variable portion according to the present invention is rotatable.
9 is a diagram showing an example in which the crossing angles of the X and Y-axis varying parts are variable.
10 is a view showing an example in which a silicon layer is formed at the lower end of the abrasive member according to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a polishing apparatus capable of cross-polishing of the present invention will be described with reference to the accompanying drawings.

FIG. 1A is a view showing a polishing apparatus capable of cross-polishing according to the present invention, FIG. 1B is a view showing a configuration of a polishing unit according to the present invention, FIG. 2 is a schematic FIG. 3 is a view showing a relationship between a polishing part and an object to be polished according to the present invention. FIG.

First, the configuration of the polishing apparatus of the present invention will be described with reference to Figs. 1A to 3.

The polishing apparatus of the present invention mainly comprises a main body 100, a seating part 200, a polishing part 300, and a cross polishing part 400.

In the seat part 200,

The seating part 200 is installed at the lower end of the main body 100.

The object to be polished 10 is seated and fixed to an upper end of the seating part 200. A seating member 210 may be installed on the upper end of the seating part 200 to receive the abrasive article 10.

In the polishing section 300,

The polishing part 300 is disposed on the seating part 200 and is installed on an X-axis variable part 410 described later.

The polishing unit 300 has a polishing head 310 having a rotation motor 311.

The polishing head 310 is provided with an abrasive member 320 detachable from the polishing head 310.

Referring to FIGS. 1A and 1B, the rotation motor 311 may be installed inside the polishing head 310.

The rotating motor 311 has a rotating shaft 311a and the polishing head 310 is provided with a fixing bracket 330 to which the polishing member 320 is fixed.

Accordingly, the fixing bracket 300 rotates in conjunction with the rotation of the rotation shaft 311a.

A plurality of first fastening holes (H1) are formed on the rim of the fixing bracket (330).

A plurality of second fastening holes (H2) are formed on the upper outer peripheral portion of the abrasive member (320).

The plurality of first and second fasteners H1 and H2 are fixed by a plurality of fastening bolts B, respectively.

Therefore, the object to be polished can be fixedly installed as the first and second fasteners are fastened by the fastening bolts in a state of being fitted in the fastening bracket.

Although not shown in the drawing, a metal may be fixed to the upper end of the abrasive member 320, and an electromagnet may be further installed in the fixing bracket 330.

The electromagnet may be magnetized as a current is supplied from the current supplier, and may be attached with a metal and a magnetic force of the abrasive member, so that the abrasive member can be fixed or released to be replaceable.

Here, the current supplier is driven by receiving a control signal from the control unit.

According to the present invention, as described above, the polishing member 320 is configured to be detachable from the polishing head 310, and the polishing members 320 of various shapes are replaced and mounted, There is an advantage to be able to produce.

The cross-

The cross polishing unit 400 according to the present invention includes an X-axis variable portion 410 and a Y-axis variable portion 420.

The X-axis variable portion 410 includes an X-axis rail 411 disposed along the X-axis direction and a polishing portion 300 connected to the X-axis rail 411. The X- And a first moving motor 412 that moves along the axis.

The first moving motor 412 is driven under the control of the control unit 30.

Here, the polishing head 310 of the above-described polishing unit 300 is connected to the X-axis rail 411.

An X-axis rail groove 411a is formed in the X-axis rail 411 and an upper end of the polishing head 310 is installed to be movable along the X-axis rail groove 411a.

The Y-axis variable portion 420 is installed on the main body 100 along the Y-axis and is located above the X-axis variable portion 410.

The Y-axis variable portion 420 is composed of a Y-axis rail 421 and a second moving motor 422.

The Y-axis rail 421 is installed on the main body 100 so as to be positioned above the X-axis rail 411.

The upper ends of the plurality of legs 413 connected to the upper ends of the X-axis rails 411 are connected to the Y-axis rails 421 by rails.

The upper ends of the plurality of legs 413 are moved along Y-axis rail grooves 421a formed in the Y-axis rail 421. [

The second moving motor 422 receives a control signal from the controller 430 and moves a plurality of legs 413 connected to the upper end of the X-axis rail 411 along the Y axis.

Accordingly, the polishing unit 300 can be moved along the X-axis by the movement of the X-axis rail 411, and can be moved along the Y-axis by the movement of the Y-axis rail 421.

The Y-axis rail 421 is connected to a lift unit 500 installed in the main body 100 and can be raised and lowered up and down.

The elevating unit 500 includes a plurality of elevating cylinders 510 installed on the main body 100 and having an elevating shaft 511 extending and retracted up and down. The elevating cylinder 510 is driven under the control of the controller 430.

The elevating cylinders 510 are installed in the main body 100 so as to be arranged along the vertical direction at the upper portion of the Y-axis rail 421.

The elevating shaft 511 of each of the elevating cylinders 510 is connected to the Y-axis rail 421.

Accordingly, the elevating part 500 can variably adjust the elevating position of the polishing part 300 including the X-axis rail 411 according to the elongation and contraction of the elevating shaft 511.

In addition, the control unit 430 can independently control the X-axis variable unit 410 and the Y-axis variable unit 420 to be controlled to reciprocate within the set movement interval.

4 is a view showing an object to be polished according to the present invention.

4, the abrasive article 10 according to the present invention has a groove 11a formed at its central portion as it is polished and a polishing region 11b composed of a rim 11b constituting the outer edge of the groove 11a 11).

The abraded object to be polished may be a cover glass having a right-angled groove 11a or a cover glass having a curved groove 11b ', as shown in Fig.

5 is a view showing an example in which an abrasive section according to the present invention is reciprocated and driven along an intersecting axis.

5, the control unit 430 according to the present invention is configured such that during polishing, the abrasive member 320 intersects at right angles with each other at a position where the abrasive member 320 forms an edge with the rim 11b in the groove 11a, The X-axis variable portion 410 and the Y-axis variable portion 420 are simultaneously reciprocated so as to be polished.

Therefore, the grinding amount can be increased by cross-flowing along the crossing axis at one position to perform polishing.

3, in the polishing head 310 according to the present invention, the distance value to the polishing region 11 formed on the object 10 to be polished is measured, And a distance sensor 340 for transmitting to the controller 430.

A reference distance value up to the polishing area 11 is previously set in the controller 430.

The controller 430 controls driving of the elevator 500 and the X-axis variable portion 410 and the Y-axis variable portion 420 such that the measured distance value reaches the reference distance value.

Next, the operation of the polishing apparatus of the present invention having the above-described structure will be described.

FIG. 6 is a view showing a process of polishing an edge of an object to be polished, and FIG. 7 is a flowchart showing a polishing action of the polishing apparatus of the present invention.

In addition, the construction of the polishing apparatus of the present invention will be described with reference to Figs. 1 to 6.

An object to be polished (10) is seated on a seat (200) according to the present invention.

The abrasive article 10 may be a cover glass in which a grinding area 11 formed with a groove 11a and a rim 11b of a predetermined shape is formed as the abrasive article 10 is polished.

The X and Y variable parts 410 and 420 and the elevating part 500 are positioned on the upper part of the seating part 200 so that the polishing member 320 is positioned.

The control unit 430 lowers the elevation shaft 511 of the plurality of elevating cylinders 510 to position the polishing member 620 at the initial polishing position. The initial polishing position is a position where the lower end of the polishing member 320 contacts the upper surface of the object 10 to be polished.

In this case, the control unit 430 sets information about the polishing region 11 having a predetermined shape in advance on the object to be polished 10.

For example, the depth and the area of the polishing area 11.

Next, the controller 430 polishes the object to be polished 10 using the elevator 500 and the X and Y variable portions 410 and 420 so as to form the corresponding information.

That is, the control unit 430 drives the rotating motor 311 to rotate the polishing member 320.

At this time, the elevating part 500 adjusts the elevating position of the polishing member 320 substantially by moving the Y-axis varying part 410 up and down under the control of the controller 430.

At the same time, the control unit 430 drives the X and Y variable portions 410 and 420 simultaneously.

That is, the first moving motor 412 of the X-axis variable portion 410 is driven to reciprocate the polishing member 320 in the polishing operation within the reciprocating movement width set along the X axis, And the second moving motor 422 is used to reciprocate the X-axis rail 411 within the reciprocating movement width set along the Y-axis.

Accordingly, as shown in FIG. 5, the polishing member 320 according to the present invention polishes the object 10 while reciprocating along the X, Y, and Y axes that intersect with each other.

Accordingly, the polishing rate or the amount of grinding per unit time can be increased.

According to the above driving, the polishing area 11 formed by the groove 11a and the rim 11b can be formed on the object 10 to be polished.

According to the present invention, it is possible to judge whether or not polishing at the corner portion in the groove 11a constituting the polishing region 11 is normally performed.

The control unit 430 moves the polishing head 310 to the position above the edge of the groove 11a by using the X and Y variable portions 410 and 420. [

The distance sensor 340 mounted on the polishing head 310 measures the distance Lm from the bottom of the polishing region 11 and transmits the measured distance Lm to the controller 430.

The controller 430 determines whether the measured distance value Lm is a reference distance value L0. The reference distance value L0 may be information included in the information on the polishing area 11 described above.

For example, when the measured distance value Lm does not reach the reference distance value L0, the control unit 430 determines that the polishing is abnormal, and determines that the polishing unit 500, the X and Y variable units 410 and 420 The cross polishing is performed again so that the distance value Lm measured at the corner portion of the groove 11a reaches the reference distance value L0.

Of course, if the polishing member 10 is positioned at the edge of the groove 11a during polishing, the control unit 430 may perform polishing using the elevating unit 500, X and Y variable portions 410 and 420 as described above .

Therefore, the polishing member 320 can simultaneously form the polishing region 11 while being moved simultaneously along the X-axis and the Y-axis at any position to be polished.

Therefore, according to the present invention, it is possible to improve the quality of a product to be produced by further performing polishing on an abnormally polished edge portion in the groove 11a of the polishing region 11. [

8 is a view showing an example in which the X-axis variable portion according to the present invention is rotatable.

Referring to FIG. 8, a rotation part may be further provided between the X-axis variable part 410 and the Y-axis variable part according to the present invention.

The rotation unit includes first and second connection plates 461 and 462 and a motor 470 connected to the centers of the first and second connection plates 461 and 462 to rotate the first and second connection plates 461 and 462 do.

Here, the plurality of legs 413 described above are composed of the first reds 413a and the second legs 413b.

The first legs 413a are connected to the Y axis rail 421 to flow along the Y axis and the second legs 413b are connected to be fixed to the X axis rail 411. [

The lower end of the first legs 413a is fixed to the upper end of the first connecting plate 461 and the upper end of the second legs 413b is fixed to the lower end of the second connecting plate 432. [ do.

The first and second connection plates 461 and 462 are disposed so as to overlap each other vertically.

The centers of the first and second connection plates 461 and 462 are connected to each other by a rotation guide shaft 471 so as to form a rotation center.

The rotation guide shaft 471 can horizontally rotate the second connection plate 462 by driving the motor 470 to adjust the rotation angle as shown in FIG.

Therefore, in the present invention, the crossing angle [theta] between the axes of the abrasive members 320 that are cross-flowed substantially is changed by changing the crossing angle [theta] with respect to the Y axis rail 421 in the X- It is possible to adjust the polishing angle to an acute angle or an obtuse angle so as to increase the polishing efficiency as occasion demands.

In addition, the intersection angle [theta] between the intersecting axes can be preset in the control unit and can control the driving of the motor 470 described above.

10 is a view showing an example in which a silicon layer is formed at the lower end of the abrasive member according to the present invention.

Referring to FIG. 10, a silicon layer 600 having a predetermined thickness may be further formed on the lower end of the polishing member 320 according to the present invention.

The silicon layer 600 is a region to be physically contacted with the object 10 to be polished to improve the surface quality of the object to be polished.

In addition, the silicon layer 600 according to the present invention may be removable at the lower end of the abrasive member 320.

For example, although not shown in the drawing, a metal case capable of bolt fastening is further provided at the lower end of the abrasive member 320, and a silicon layer is formed on the outer surface of the case.

Therefore, when replacing the silicon layer with another, the case may be removed from the lower end of the abrasive member and the other case having another silicon layer may be re-attached to the lower end of the abrasive member.

Meanwhile, although not shown in the drawing, a rotating rotation axis to be rotated may be formed on one side of the polishing head 310 according to the present invention.

In this case, a plurality of connecting rods extending in the radial direction are formed on the rotation shaft.

The alternate rotary shaft is rotationally driven by the alternate rotary motor, whereby the rotational positions of the plurality of connecting rods can be varied.

And an abrasive member having a different shape may be mounted on each end of each of the plurality of connecting rods. Of course, the abrasive member may be detachably installed at the end of each connecting rod in the same manner as described above.

However, the connection rods are provided with rotation motors 311 for rotating the respective polishing members 320 individually.

Therefore, when the abrasive member 320 is replaced with another shape, the present invention can be achieved by rotating the alternate rotation motor so that the abrasive member 320 is positioned at the abrasive position.

Through the above-described structure and action, the embodiment according to the present invention can polish an object to be polished while lifting the polishing member and moving it in a direction crossing along the XY axis, so that the polishing rate or the amount of grinding per unit time Can be relatively improved.

Further, the embodiment according to the present invention can increase the polishing progression amount of the object to be polished.

In addition, the embodiment according to the present invention solves the problem that unpolished (phenomenon of less polishing) occurs in the edge area of the groove forming the polishing area when the object such as the cover glass is polished to improve the quality of the product .

Although the present invention has been described with respect to specific embodiments of the polishing apparatus capable of cross-polishing, it is apparent that various modifications are possible within the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

10: object to be polished
100:
200:
300:
310: Polishing head
320: abrasive member
400: cross-polished portion
410: X-axis variable section
411: X-axis rail
420: Y-axis variable section
421: Y-axis rail
430:
500:
600: silicon layer

Claims (9)

The body portion
A seating part installed on the main body part and on which an object to be polished is seated;
A polishing unit installed on the main body so as to be positioned above the seating unit, the polishing unit polishing the object to be polished; And
And a cross polishing unit installed on the main body to vary the polishing position for the object to be polished along different axes,
The cross-
The polishing unit is controlled to be movable along the X axis and the Y axis,
The cross-
An X-axis variable portion disposed in the seating portion, the X-axis variable portion changing the polishing portion along the X-
A Y-axis variable portion for varying the X-axis variable portion along the Y-axis,
And a control unit for controlling driving of the X-axis variable unit and the Y-axis variable unit,
Wherein,
The X-axis variable section and the Y-axis variable section are independently driven, and the control is performed so as to reciprocate within the set movement interval,
The polishing unit includes:
A polishing head provided on the X-axis variable section and having a rotary motor rotated by receiving a control signal from the control section;
And a polishing member provided on the polishing head and rotated by driving of the rotation motor to polish the object to be polished,
The object to be polished,
A groove is formed at the central portion as the polishing is performed, and a polishing region comprising a rim constituting the outer periphery of the groove is formed,
Wherein,
The X-axis variable portion and the Y-axis varying portion are simultaneously reciprocated so that, during polishing, the abrasive member is simultaneously cross-polished along different axes at a position where the edge of the abutment with the rim is in the groove,
Wherein the polishing member is detachable from the polishing head,
A silicon layer having a predetermined thickness that is detachable is formed on a lower end of the polishing member,
A metal case capable of being bolt-fastened is further provided at a lower end of the abrasive member, another silicon layer is formed on an outer surface of the case,
A rotating rotation axis is formed on one side of the polishing head,
A plurality of connection rods extending in a radial direction are formed on the rotation shaft,
Wherein the rotation shaft is rotatably driven by a rotation motor, the rotation positions of the plurality of connection rods are variable,
And an abrasive member having a different shape is mounted on an end of each of the plurality of connecting rods.
delete delete delete delete delete The method according to claim 1,
The polishing section is lifted and lowered by the lifting section,
In the polishing head,
There is provided a distance sensor for measuring a distance value to a polishing region formed on the object to be polished and transmitting the measured distance value to the control unit,
In the control unit,
A reference distance value up to the polishing area is preset,
Wherein,
Axis variable portion and the Y-axis variable portion so that the measured distance value reaches the reference distance value.
8. The method of claim 7,
A rotating portion is further provided between the X-axis variable portion and the Y-axis variable portion,
Wherein the rotary section receives the control signal from the control section and horizontally rotates the X-axis variable section at an angle set to make an acute angle or an obtuse angle with respect to the Y-axis moving path of the Y-axis varying section. .


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KR1020150161979A 2015-11-18 2015-11-18 Polishing apparatus KR101946599B1 (en)

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KR20170058143A KR20170058143A (en) 2017-05-26
KR101946599B1 true KR101946599B1 (en) 2019-02-11

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100745407B1 (en) 2006-06-20 2007-08-02 전자부품연구원 Apparatus and method for polishing a partial section of optical wave guide in optical printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100745407B1 (en) 2006-06-20 2007-08-02 전자부품연구원 Apparatus and method for polishing a partial section of optical wave guide in optical printed circuit board

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