KR101922879B1 - Multilayered capacitor - Google Patents

Abstract

The present invention is characterized in that a conductive resin layer of an external electrode is disposed on a surface of the body where an internal electrode is exposed and an intermetallic compound which is in contact with the conductive connection portion of the conductive resin layer and the internal electrode, A multilayer capacitor capable of reducing ESR (Equivalent Series Resistance) of a multilayer ceramic capacitor by contacting a plurality of metal particles and the second electrode layer, and improving a bending strength and reliability.

Description

[0001] MULTILAYERED CAPACITOR [0002]

The present invention relates to a stacked capacitor.

The multilayer capacitor is an important chip component used in industries such as communication, computer, home appliance, automobile and the like due to its small size, high capacity and easy mounting, and in particular, various kinds of electronic components such as a cellular phone, a computer, It is a core passive element used in communication equipment.

In recent years, with the miniaturization and high performance of electronic devices, the thickness of the stacked capacitor is also becoming smaller and higher in capacity, and in this trend, it is becoming more important to secure high reliability of the stacked capacitor.

As a method for securing high reliability of such a stacked capacitor, in order to absorb tensile stress generated in a mechanical or thermal environment and to prevent a crack caused by stress, a conductive resin layer A technique is disclosed.

Such a conductive resin layer serves to electrically and mechanically bond the sintered electrode layer of the external electrode of the stacked capacitor to the plating layer and protects the stacked capacitor from mechanical and thermal stresses depending on the process temperature and the bending impact of the substrate during circuit board mounting It also adds a role.

Conventionally, due to the low electrical and mechanical bonding strength of the conductive resin layer, a sintered electrode layer is applied to secure electrical and mechanical bonding strength with the internal electrode, and then a conductive resin layer is formed on the sintered electrode layer.

However, in such a structure, cracks are generated due to the sintered electrode layer, and there is a limitation in the role of protecting the stacked capacitor from the mechanical and thermal stresses depending on the temperature and the bending impact of the substrate.

In addition, if the conductive resin layer is directly applied to the internal electrode without the sintered electrode layer in the conventional structure, the electrical and mechanical bonding force is reduced, and the capacity decreases and ESR (Equivalent Series Resistance) increases. .

Japanese Patent Laid-Open No. 2005-051226 Japanese Patent No. 5104313

It is an object of the present invention to improve the electrical and mechanical bonding force between the internal electrode and the conductive resin layer by applying the conductive resin layer as the primary external electrode layer, thereby securing the capacity, reducing the equivalent series resistance (ESR) And to provide a stacked capacitor capable of improving the performance of the stacked capacitor.

According to an aspect of the present invention, there is provided a plasma display panel comprising a plurality of dielectric layers and a plurality of first and second internal electrodes arranged alternately with the dielectric layer interposed therebetween, the first and second surfaces being opposed to each other, Third and fourth surfaces connected to and facing each other, fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other, A body having a plurality of first and second grooves formed between the dielectric layers disposed on the fourth surface so as to expose one ends of the first and second internal electrodes, respectively; An intermetallic compound disposed in the first and second trenches and connected to one end of the first and second internal electrodes, respectively; And first and second external electrodes respectively disposed on the third and fourth surfaces of the body; Wherein the first and second external electrodes are respectively disposed on the third and fourth surfaces of the body and include a plurality of metal particles, a conductive connection portion surrounding the plurality of metal particles and contacting the intermetallic compound, A conductive resin layer including a base resin; And a first electrode layer disposed on the conductive resin layer and in contact with the conductive connection portion; And a capacitor connected to the capacitor.

According to one embodiment of the present invention, the capacitance of the stacked capacitor can be secured at a certain level, ESR can be reduced, the bending strength can be improved, and reliability can be improved.

1 is a perspective view schematically showing a stacked capacitor according to an embodiment of the present invention.
2 is a sectional view taken along the line I-I 'in Fig.
3 is an enlarged cross-sectional view of the region A in Fig.
Fig. 4 is a cross-sectional view taken along the line A in Fig. 2 showing that the metal particles are flaked. Fig.
Fig. 5 is a cross-sectional view taken along the line A in Fig. 2 showing that the metal particles are composed of a mixture of a spherical shape and a flake shape.
6 is a state diagram showing that copper particles and tin-bismuth particles are dispersed in an epoxy.
7 is a state diagram showing the removal of an oxide film of copper particles by an oxide film remover or heat.
FIG. 8 is a state diagram showing an oxide film remover or an oxide film of tin / bismuth particles removed by heat.
Fig. 9 is a state diagram showing that tin / bismuth particles melt and flow.
10 is a state diagram showing that copper particles and tin / bismuth particles react with each other to form an intermetallic compound.
11 is a cross-sectional view schematically showing a stacked capacitor according to still another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

The shape and size of elements in the drawings may be exaggerated for clarity.

In the drawings, like reference numerals are used to designate like elements that are functionally equivalent to the same reference numerals in the drawings.

In addition, "including" an element throughout the specification does not exclude other elements unless specifically stated to the contrary.

In addition, throughout the specification, to be formed on "on " means properly formed not only in direct contact, but also should be construed accordingly depending on the context which may mean that it may further include other components .

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and similar parts are denoted by similar reference numerals throughout the specification .

Laminated type  Capacitor

FIG. 1 is a perspective view showing a stacked capacitor according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line I-I 'of FIG.

Referring to FIGS. 1 and 2, a stacked capacitor 100 according to an embodiment of the present invention includes a body 110 and first and second external electrodes 130 and 140.

The body 110 may include an active area serving as a part contributing to capacity formation of the capacitor and upper and lower covers 112 and 113 formed respectively on upper and lower parts of the active area as upper and lower margin parts.

In one embodiment of the present invention, the body 110 is not particularly limited in shape, but may be substantially a hexahedral shape.

That is, the body 110 may have a substantially hexahedral shape but not a complete hexahedral shape due to the thickness difference due to the arrangement of the internal electrodes and the polishing of the corner portions.

In order to clearly explain the embodiment of the present invention, when the directions of the hexahedron are defined, X, Y, and Z shown in the drawing indicate the longitudinal direction, the width direction, and the thickness direction, respectively.

Here, the thickness direction can be used in the same concept as the lamination direction in which the dielectric layers are laminated.

In the body 110, both surfaces opposite to each other in the Z direction are defined as first and second surfaces 1 and 2, and are connected to the first and second surfaces 1 and 2, Is defined as a third and a fourth surface 3 and 4 and connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4, The opposing both surfaces are defined as the fifth and sixth surfaces 5 and 6. At this time, the first surface 1 may be a mounting surface.

The active region may have a structure in which a plurality of dielectric layers 111 and a plurality of first and second inner electrodes 121 and 122 are alternately stacked with a dielectric layer 111 sandwiched therebetween.

In the active region, a dielectric layer 111 (not shown) is formed on the third and fourth surfaces 3 and 4 of the body 100 so as to expose one end of the first and second internal electrodes 121 and 122, respectively. A plurality of first and second grooves are formed.

In the first and second trenches, an intermetallic compound 150 is formed which is in contact with one end of each of the first and second internal electrodes 121 and 122, respectively.

The dielectric layer 111 may include a ceramic powder having a high dielectric constant, for example, a barium titanate (BaTiO ₃ ) -based or a strontium titanate (SrTiO ₃ ) -based powder, but the present invention is not limited thereto.

At this time, the thickness of the dielectric layer 111 may be arbitrarily changed according to the capacity design of the stacked capacitor 100. In consideration of the size and the capacity of the body 110, the thickness of the first layer may be 0.1 to 10 μm after firing However, the present invention is not limited thereto.

The first and second internal electrodes 121 and 122 may be arranged to face each other with the dielectric layer 111 interposed therebetween.

The first and second internal electrodes 121 and 122 are a pair of electrodes having different polarities and a conductive paste containing a conductive metal with a predetermined thickness is printed on the dielectric layer 111 to sandwich the dielectric layer 111 between the electrodes. And alternately exposed through the third and fourth surfaces 3 and 4 of the body 110 along the stacking direction of the dielectric layers 111. The dielectric layers 111 are electrically connected to each other Can be insulated.

The first and second internal electrodes 121 and 122 are formed in such a manner that portions alternately exposed through the third and fourth surfaces 3 and 4 of the body 110 are electrically connected to the first and second internal electrodes 121 and 122 through the intermetallic compound 150. [ And may be electrically connected to the external electrodes 130 and 140, respectively.

Accordingly, when a voltage is applied to the first and second external electrodes 130 and 140, charges are accumulated between the first and second internal electrodes 121 and 122, which are opposed to each other through the intermetallic compound 150, The capacitance of the stacked capacitor 100 is proportional to the area of the area where the first and second internal electrodes 121 and 122 overlap each other.

The thickness of the first and second internal electrodes 121 and 122 may be determined depending on the application and may be determined to fall within a range of 0.2 to 1.0 탆 in consideration of the size and capacity of the ceramic body 110, The present invention is not limited thereto.

The conductive metal included in the first and second internal electrodes 121 and 122 may be one of nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof. But is not limited thereto. In the present embodiment, the intermetallic compound 150 may be nickel-tin (Ni-Sn) when the first and second internal electrodes 121 and 122 are nickel.

The upper and lower covers 112 and 113 may have the same material and configuration as the dielectric layer 111 of the active area except that they do not include internal electrodes.

That is, the upper and lower covers 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active region in the Z direction, respectively. Basically, The second internal electrodes 121 and 122 can be prevented from being damaged.

The first and second external electrodes 130 and 140 may include conductive resin layers 131 and 141 and first electrode layers 132 and 142 disposed on the conductive resin layers 131 and 141, respectively.

The conductive resin layers 131 and 141 are formed on the third and fourth surfaces 3 and 4 of the body 110 and are exposed through the intermetallic compound 150 formed in the first and second trenches, Electrical contact between the first external electrode 130 and the first internal electrode 121 and electrical continuity between the second external electrode 140 and the second internal electrode 122 are established by being in contact with and connected to the internal electrodes 121 and 122, .

The conductive resin layers 131 and 132 are formed on the third and fourth surfaces 3 and 4 of the body 110 and the first and second surfaces 1 and 2 of the body 110 , 2, and a band portion extending to a portion of the fifth and sixth surfaces 5, 6, respectively.

The formation of the conductive resin layers 131 and 141 on the third and fourth surfaces 3 and 4 of the body 110 can improve the plating solution and moisture permeation preventing property.

The first electrode layers 132 and 142 are disposed on the conductive resin layers 131 and 141 and are in contact with the conductive connecting portions of the conductive resin layers 131 and 141, Accordingly, the first electrode layers 132 and 142 can further improve the plating solution and moisture permeation preventing property.

The first electrode layers 132 and 142 may include a metal component and the metal component may be one of copper (Cu), tin (Sn), nickel (Ni), palladium (Pd) Or an alloy thereof, and the present invention is not limited thereto.

The first electrode layers 132 and 142 may be formed by plating copper or a thin film deposition process such as CVD / PVD.

3 is an enlarged cross-sectional view of the region A in Fig.

The first external electrode 130 is electrically connected to the first internal electrode 121 and the second external electrode 130 is electrically connected to the second external electrode 130. [ Since the first external electrode 130 and the second external electrode 140 are similar in configuration to each other, the first external electrode 130 will be described below with reference to the second external electrode 130, It is assumed that the external electrode 140 is included.

3, the conductive resin layer 131 of the first external electrode 130 includes a plurality of metal particles 131a, a conductive connecting portion 131b contacting the intermetallic compound 150, and a base resin 131c ).

The conductive resin layer 131 electrically and mechanically bonds the intermetallic compound 150 and the first electrode layer 132. When the stacked capacitor 100 is mounted on a substrate, the conductive resin layer 131 is generated in a mechanical or thermal environment And prevent the crack from occurring, and protect the stacked capacitor 100 from the bending impact of the substrate.

The conductive resin layer 131 may be formed by applying a paste in which a plurality of metal particles 131a are dispersed in the base resin 131c on the third surface 3 of the body 100 and drying and curing have.

Therefore, unlike the conventional method of forming external electrodes by firing, metal particles are not completely melted and exist in a randomly dispersed form in the base resin 131c and can be contained in the conductive resin layer 131.

On the other hand, the metal particles 131a may not be present in the conductive resin layer 131 when they react with the low melting point metal constituting the conductive connection part 131b and the intermetallic compound 150.

However, in the following description, the metal particles 131a are included in the conductive resin layer 131 for convenience of explanation.

At this time, the metal particles 131a may include at least one of copper (Cu) or copper coated with nickel (Ni), silver (Ag), silver coated with silver, and tin (Sn).

The size of the metal particles 131a may be 0.2 to 20 占 퐉.

On the other hand, the metal particles contained in the conductive resin layer 131 are not only spherical but also made of flake-shaped metal particles 131a 'as required, as shown in Fig. 4, And may be a mixed type of the spherical metal particles 131a and the flaky metal particles 131a '.

The conductive connecting part 131b serves to surround the plurality of metal particles 131a in a state in which the metal is melted and to connect the metal connecting parts 131b to each other to minimize the stress in the body 110 and to improve the high- have.

The conductive connecting portion 131b may increase the electrical conductivity of the conductive resin layer 131 to lower the resistance of the conductive resin layer 131. [

When the metal particles 131a are included in the conductive resin layer 131, the conductive connection part 131b may increase the connectivity between the metal particles 131a to further reduce the resistance of the conductive resin layer 131 have.

Also, the low melting point metal contained in the conductive connecting portion 131b may have a melting point lower than the curing temperature of the base resin 131c.

At this time, the low melting point metal contained in the conductive connecting portion 131b may have a melting point of preferably 300 ° C or less.

Specifically, the metal included in the conductive connecting portion 131b may be composed of two or more alloys selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), and bismuth have.

At this time, when the conductive particles 131a are contained in the conductive resin layer 131, the conductive connection part 131b may surround the plurality of metal particles 131a in a molten state and may be connected to each other.

That is, since the low melting point metal contained in the conductive connecting portion 131b has a melting point lower than the curing temperature of the base resin 131c, it melts in the course of the drying and curing process, and the conductive connecting portion 131b can cover the metal particles 131a in a molten state.

The conductive resin layer 131 is formed by dipping the low melting point solder resin paste after the low melting point solder resin paste is manufactured. In the case of applying a metal coated with silver or silver to the metal particles 131a during the manufacture of the low melting point solder resin paste, May comprise Ag ₃ Sn.

At this time, the first and second internal electrodes 121 and 122 may include nickel (Ni). In this case, the intermetallic compound 150 may include nickel-tin (Ni-Sn).

When a paste in which metal particles are dispersed is used as an electrode material, a smooth flow is observed when the flow of electrons is in the metal-metal contact, but when the base resin surrounds the metal particles, the flow of electrons can be rapidly reduced.

In order to solve this problem, the amount of the base resin is extremely reduced and the amount of the metal is increased to increase the contact ratio between the metal particles, thereby improving the conductivity. Conversely, Problems can arise.

In the present embodiment, the contact ratio between the metal particles can be increased by the conductive connecting portion even if the amount of the thermosetting resin is not extremely reduced, and the electrical conductivity in the conductive resin layer can be improved without a problem of deterioration of the bonding strength of the external electrode. Thus, the ESR of the stacked capacitor can be reduced.

The intermetallic compound 150 is disposed in the first and second trenches and contacts the conductive connection part 131b to connect the first or second internal electrodes 121 and 122 to the conductive connection part 131b. At this time, the exposed surface of the intermetallic compound 150 may form a substantially flat surface with respect to the third or fourth surfaces 3 and 4 of the body, and the conductive resin layer 131 may be made of metal An additional intercalation compound 150 may be formed.

The electrical and mechanical bonding between the conductive resin layer 131 and the first or second inner electrodes 121 and 122 is improved so that the contact resistance between the conductive resin layer 131 and the first or second inner electrodes 121 and 122 . ≪ / RTI >

The base resin 131c may include a thermosetting resin having electrical insulation properties.

At this time, the thermosetting resin may be, for example, an epoxy resin, but the present invention is not limited thereto.

The base resin 131c serves to mechanically bond the body 110 and the first electrode layer 132 to each other.

A second electrode layer may be further disposed on the first electrode layers 132 and 142.

In this case, the second electrode layer may be a plated layer, for example, a nickel (Ni) plated layer 133 and a tin (Sn) plated layer 134, 144 are sequentially formed in the order of the first electrode layers 132 and 142 It may be a laminated structure. Meanwhile, the second electrode layer may be formed using nickel or tin in a thin film deposition method such as CVD / PVD.

Mechanism of formation of conductive resin layer

FIG. 6 is a state view showing that copper particles and tin-bismuth particles are dispersed in epoxy, FIG. 7 is a state diagram showing removal of an oxide film of copper particles by an oxide film remover or heat, and FIG. 9 is a state diagram showing that tin / bismuth particles melt and flow, and Fig. 10 is a view showing a state in which tin / bismuth particles react with copper-tin / Layer is formed.

Hereinafter, the mechanism for forming the conductive resin layer 131 will be described with reference to FIGS. 6 to 10. FIG.

The conductive resin layer of the present embodiment includes a plurality of metal particles, a low melting point metal, and a base resin. Here, the metal particles may be copper coated with nickel, silver or silver coated with copper, tin or tin, In the examples, copper particles will be described as an example.

Sn-Bi, Sn-Ag, Sn-Ag, Sn-Pb, Sn-Cu, Sn-Ag, Cu and the like can be applied. The base resin is set to use an epoxy resin.

6 to 8, the copper particles 310 as the metal particles having a high melting point and the tin / bismuth (Sn / Bi) particles 410 as the low melting point metal contained in the epoxy resin as the base resin 131c And oxide films 311 and 411 are present on the surface. Also, the oxide film 121a is present on the surface of the first internal electrode 121 as well.

The oxide films 311 and 411 prevent the copper particles 310 and the tin / bismuth particles 410 from reacting with each other to form a copper-tin layer. An oxide film remover or heat (ΔT) Or may be removed by treating with an acid solution if necessary. At this time, the oxide film 121a of the first internal electrode 121 may also be removed.

As the oxide film remover, an acid, a base, hydrogen halide, or the like can be used, but the present invention is not limited thereto.

9 and 10, the tin / bismuth particles from which the oxide film has been removed start to melt at about 140 DEG C, and the molten tin / bismuth particles 412 are flowable and move toward the oxide film- The first internal electrode 121 is exposed to the first groove portion of the body 110 in which the first internal electrode 121 is exposed by reacting with the copper particles 310 at a predetermined temperature to form a conductive connection portion 131b, An intermetallic compound 150 which is a copper-tin layer is formed.

The intermetallic compound 150 thus formed is connected to the conductive connection part 131b made of copper-tin of the conductive resin layer, so that the contact resistance between the first internal electrode 121 and the conductive resin layer can be reduced.

The copper particles 131a shown in FIG. 10 represent copper particles present in the conductive connecting portion 131b after the reaction.

At this time, the tin / bismuth particles 412 are likely to be surface oxidized and may interfere with the formation of the intermetallic compound 150 in this case. Therefore, tin / bismuth particles can be surface-treated if necessary so that the carbon content is 60.5 to 1.0% in order to prevent such surface oxidation.

On the other hand, the size of the metal particles for forming the intermetallic compound may be 0.2 to 20 탆. At this time, the metal particles may be one of nickel, silver, silver coated copper, tin coated copper, and copper.

In order to form an intermetallic compound, tin / bismuth particles dissolved in a solution state at a predetermined temperature must flow around the groove portion of the body and the metal particles. When the size of the metal particles exceeds 20 μm, The spacing is too wide to prevent the tin / bismuth solution from moving easily between the groove portion of the body and the metal particles, which may interfere with the formation of the intermetallic compound.

On the contrary, when the size of the metal particles is 20 μm or less, the distance between the metal particles is reduced, and the capillary force generated in the reduced area can move the tin / bismuth solution to the groove of the body more easily, It becomes.

However, if the size of the metal particles is less than 0.2 탆, oxidation may occur on the surface of the metal particles, which may interfere with the formation of intermetallic compounds.

In this mechanism, the melting temperature of the tin-bismuth particles and the formation temperature of the intermetallic compound should be lower than the curing temperature of the epoxy resin as the base resin.

If the melting temperature of the tin-bismuth particles and the formation temperature of the intermetallic compound are higher than the curing temperature of the epoxy resin, the base resin is cured first and the melted tin-bismuth particles can not move to the surface of the copper particles. - tin layers can not be formed.

In addition, the content of tin / bismuth particles relative to the total metal particles for formation of the intermetallic compound may be 10 to 90 wt%.

If the content of tin / bismuth particles is less than 10 wt%, the size of the intermetallic compound formed by the reaction with the metal particles is excessively increased. Therefore, it is difficult to form an intermetallic compound in the groove portion of the body, It is also difficult to place it on the surface.

If the content of tin / bismuth particles exceeds 90 wt%, tin / bismuth reacts with each other to form an intermetallic compound, and the tin / bismuth particle size may become too large.

It is also necessary to control the content of tin in the tin / bismuth particles.

In the present embodiment, since the component which reacts with the metal particles to form an intermetallic compound is tin, the content (x) of Sn in Snx-Biy is 10 wt% or more of the total metal particles .

If the content (x) of tin is less than 10 wt% of the total metal particles, the ESR of the manufactured stacked capacitor can be increased.

In a stacked capacitor in which a conductive resin layer is applied to an external electrode, ESR is affected by various kinds of resistors applied to the external electrode.

Such resistance components include resistance of the internal electrode, contact resistance between the conductive resin layer and the internal electrode, resistance of the conductive resin layer, contact resistance between the first electrode layer and the conductive resin layer, and resistance of the first electrode layer.

Here, the resistance of the internal electrode and the resistance of the first electrode layer do not vary to a fixed value.

According to the present embodiment, there is no firing electrode layer between the external electrode and the body, so that the bending stress of the fired electrode layer, which is generated in the conventional chip bending, can be eliminated, and cracks generated in the body can be prevented by lowering the process temperature.

Also, the bending strength of the stacked capacitor can be further improved as compared with the embodiment in which the bonding strength of the external electrode is increased by the intermetallic compound and the fired electrode layer is included in the outermost portion of the external electrode.

In addition, the electrical connection between the internal electrode and the conductive resin layer is improved by the intermetallic compound, and the contact resistance is reduced, so that the ESR of the stacked capacitor can be further lowered.

In the conventional external electrode of the stacked capacitor, a copper (Cu) paste is applied to both ends of a body to which an internal electrode is exposed, and an electrode layer is formed by firing the electrode. In order to prevent dissolution of a solder on the electrode layer, And a tin (Sn) plating layer is further formed on the nickel plating layer to improve the wettability of the solder when the chip substrate is mounted on the nickel plating layer.

At this time, the nickel plating layer plays a role of preventing external moisture penetration together with the tin plating layer, but it can not sufficiently prevent the penetration of the plating solution and moisture due to the minute defects of the nickel plating layer.

In the laminated capacitor of this embodiment, a plating liquid and a low-melting-point metal resin resistant to penetration of moisture from the outside were formed as primary external electrodes.

The low melting point metal resin electrode has a low melting point metal and forms an internal electrode (Ni electrode) and an intermetallic compound (IMC) in a low temperature curing process, so that the electrical connection is excellent.

Also, due to the formation of IMC in the low-melting-point metal resin electrode, it is possible to suppress penetration of the plating solution and permeation of external moisture.

In order to further improve the plating solution and moisture permeation preventing property, a Cu electrode layer was formed by a plating process with a secondary external electrode.

Since the Cu electrode layer formed by plating has a high electrode density, it is possible to further improve the plating solution and moisture permeation preventing property as compared with the sintered Cu electrode layer.

Thereafter, a Ni plating layer for preventing solder dissolution and a Sn plating layer for improving solder wettability are formed.

Since the external electrode forming process can proceed at a temperature of 250 degrees or less, a waterproof coating process for preventing moisture penetration can be applied.

In addition, since the plating liquid and the prevention of external moisture penetration can be improved, the thickness of the primary external electrode of the low melting point metal resin can be lowered compared with the conventional fired Cu electrode, so that the effective area and capacity of the chip can be improved.

That is, according to this embodiment, the primary electrode layer of the external electrode is made of a low melting point metal resin layer, the secondary electrode layer is made of a Cu electrode layer, the tertiary electrode layer is made of an Ni electrode layer, and the quaternary electrode layer is made of a Sn electrode layer.

Variation example

11, a stacked capacitor 100 'according to another embodiment of the present invention is formed by stacking moisture-permeation prevention films 161 and 162 on first and second surfaces 1 and 2 of a body 110, respectively, .

Here, in order to avoid redundancy, structures similar to those of the above-described one embodiment will not be described in detail, and moisture permeation prevention films 161 and 162 having a structure different from that of the above-described embodiment are illustrated and described in detail on the basis thereof .

The moisture permeation preventive films 161 and 162 may be organic or inorganic layers such as parylene Al ₂ O ₃ and SiO ₂ and may be formed by dipping, coating and PVD / CVD, A deposition process, or the like.

In this embodiment, an inner layer which is in contact with the third and fourth surfaces 3 and 4 of the body 110 is formed of a conductive resin layer, and a low melting point metal which can be processed at a low temperature is applied to the conductive resin layer An organic layer which can not be used at a high process temperature can be applied as a moisture permeation preventive film.

Such moisture permeation preventing films 161 and 162 have the effect of greatly improving the reliability.

Laminated type  Method of manufacturing capacitor

Hereinafter, a method for fabricating a stacked capacitor according to an embodiment of the present invention will be described in detail. However, the present invention is not limited to this, and a method of manufacturing a stacked capacitor according to the present embodiment A description overlapping with the description of FIG.

A method of manufacturing a multilayer capacitor according to the present embodiment is characterized in that a slurry formed by including a powder such as barium titanate (BaTiO ₃ ) is coated on a carrier film and dried to provide a plurality of ceramic green sheets, Thereby, the dielectric layer and the cover can be formed.

The ceramic green sheet is prepared by mixing a ceramic powder, a binder and a solvent to prepare a slurry, and the slurry is formed into a sheet having a thickness of several micrometers by a doctor blade method or the like.

Next, an internal electrode is formed by applying a conductive paste for an internal electrode containing a conductive metal such as copper on the green sheet by a screen printing method or the like.

Thereafter, a plurality of green sheets on which the internal electrodes are printed and a plurality of green sheets on which the internal electrodes are not printed on the upper and lower surfaces of the stacked body are stacked and then fired to prepare the body. At this time, the internal electrodes may be composed of first and second internal electrodes having different polarities.

That is, the body includes a dielectric layer, first and second internal electrodes, and a cover. The dielectric layer is formed by firing a green sheet on which internal electrodes are printed, and the cover is formed by firing a green sheet on which internal electrodes are not printed.

The body may also include first and second surfaces facing each other, third and fourth surfaces connected to and facing each other, first and second surfaces, and third and fourth surfaces, And a plurality of second dielectric layers interposed between the first dielectric layer and the second dielectric layer so as to expose one end of the first internal electrode and the second internal electrode, respectively, on the third and fourth surfaces, 1 and the second groove portion are formed.

Next, a conductive resin composition containing metal particles, a thermosetting resin and a low melting point metal having a melting point lower than that of the thermosetting resin is prepared.

The conductive resin composition may be prepared by mixing copper particles as metal particles, tin / bismuth particles as a low melting point metal, an oxide film removing agent and an epoxy resin in an amount of 4 to 15 wt%, using a 3-roll mill Followed by dispersion.

The conductive resin composition may be coated on the third and fourth surfaces of the body, dried and cured to form a conductive resin layer having a conductive connection portion surrounding the melted low melting point metal.

At this time, the step of forming the conductive resin layer may include a step of removing the oxide film on the surface of the metal particles and the low melting point metal contained in the thermosetting resin, and then the metal particles from which the oxide film has been removed are reacted with the low- And the low-melting-point metal flows to the first and second groove portions of the body and flows into the first and second groove portions in a state that the copper is in contact with one end of the first and second internal electrodes in the first and second groove portions, - tin or the like can be formed.

At this time, if some of the metal particles remain without reacting with the low melting point metal, the remaining metal particles may be present in the conductive resin layer in a state covered by the molten low melting point metal.

In addition, the metal particles may be copper or at least one of copper coated with nickel, silver and silver, and copper coated with tin, but the present invention is not limited thereto.

The low melting point metal may be at least one of Sn / Bi, Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu, but the present invention is not limited thereto.

The thermosetting resin may include, for example, an epoxy resin, but the present invention is not limited thereto. For example, a resin having a low molecular weight in a liquid state at room temperature and having a low molecular weight among bisphenol A resin, glycol epoxy resin, novolak epoxy resin, .

Next, a first electrode layer is formed to be electrically connected to the conductive resin layer.

The first electrode layer may be formed by applying a paste containing a conductive metal and glass, followed by firing.

The conductive metal may be at least one selected from the group consisting of copper or nickel, palladium, gold, silver, and alloys thereof, though it is not particularly limited.

The glass is not particularly limited, and a material having the same composition as the glass used for manufacturing the external electrode of a general stacked capacitor can be used.

And forming a second electrode layer on the first electrode layer. The second electrode layer may be formed by plating, for example, a nickel plating layer and a tin plating layer formed further on the nickel plating layer.

Meanwhile, the step of forming the moisture permeation prevention layer on the first and second surfaces of the body before applying the conductive resin composition to the body may be performed first.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the invention. It will be obvious to those of ordinary skill in the art.

100, 100 ': stacked capacitor
110: Body
111: dielectric layer
112, 113: upper and lower covers
121 and 122: first and second inner electrodes
130, 140: first and second outer electrodes
131, 141: conductive resin layer
132. 142: First electrode layer
133, 143: Nickel plated layer
134, 144: tin plating layer
131a: metal particles
131b: conductive connection
131c: base resin
150: intermetallic compound
161, 162: moisture permeation preventing film

Claims (40)

A plurality of first internal electrodes and a plurality of second internal electrodes arranged alternately with each other with the dielectric layer sandwiched therebetween, the first and second surfaces being opposed to each other, the first and second surfaces being connected to the first and second surfaces, 3, and a fourth surface, fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and opposed to each other, And a plurality of first and second grooves formed between upper and lower dielectric layers such that one end of the second internal electrode is exposed;
An intermetallic compound disposed in the first and second trenches and connected to one end of the first and second internal electrodes, respectively; And
First and second external electrodes respectively disposed on the third and fourth surfaces of the body; / RTI >
Wherein the first and second external electrodes
A conductive resin layer disposed on the third and fourth surfaces of the body, the conductive resin layer including a plurality of metal particles, a conductive connection portion surrounding the plurality of metal particles and contacting the intermetallic compound, and a base resin; And
A first electrode layer disposed on the conductive resin layer and contacting the conductive connection portion; / RTI >
Wherein the conductive connection portion has a melting point lower than a curing temperature of the base resin.
delete The method according to claim 1,
Wherein the conductive connecting portion has a melting point of 300 DEG C or less.
The method according to claim 1,
Wherein the conductive connection portion comprises at least two selected from tin, lead, indium, copper, silver and bismuth.
The method according to claim 1,
Wherein the conductive resin layer is at least one of copper, nickel, silver, silver-coated copper, and tin-coated copper.
The method according to claim 1,
Wherein the internal electrode comprises nickel and the intermetallic compound comprises nickel-tin (Ni-Sn).
The method according to claim 1,
Wherein the internal electrode comprises one of nickel, copper, and palladium, or an alloy thereof.
The method according to claim 1,
Wherein the conductive resin layer is one of a spherical shape, a flake shape, and a mixed shape of a spherical shape and a flake shape.
The method according to claim 1,
And a moisture permeation preventing film formed on the first and second surfaces of the body, respectively.
The method according to claim 1,
The external electrode may include a connection portion formed on the third and fourth surfaces of the body, and a band portion extending from the connection portion to a portion of the first and second surfaces of the body and a portion of the fifth and sixth surfaces, respectively And a capacitor.
The method according to claim 1,
Wherein the first electrode layer comprises one of copper, tin, nickel, palladium, and gold or an alloy thereof.
The method according to claim 1,
Wherein the first and second external electrodes further include a second electrode layer disposed on the first electrode layer.
13. The method of claim 12,
And the second electrode layer includes a nickel plated layer and a tin plated layer formed in order on the first electrode layer.
The method according to claim 1,
And the upper and lower covers having the same material and composition as the dielectric layer are disposed on the upper and lower surfaces of the body, respectively.
A plurality of first internal electrodes and a plurality of second internal electrodes arranged alternately with each other with the dielectric layer sandwiched therebetween, the first and second surfaces being opposed to each other, the first and second surfaces being connected to the first and second surfaces, Third and fourth surfaces, fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other, and one end of the first and second internal electrodes Wherein the first and second surfaces are exposed through the third and fourth surfaces, respectively;
An intermetallic compound connected to one end of each of the first and second internal electrodes;
A moisture permeation preventing film formed on the first and second surfaces of the body, respectively; And
First and second external electrodes respectively disposed on the third and fourth surfaces of the body; / RTI >
Wherein the first and second external electrodes
A conductive resin layer disposed on the third and fourth surfaces of the body, the conductive resin layer including a plurality of metal particles, a conductive connection portion surrounding the plurality of metal particles and contacting the intermetallic compound, and a base resin; And
A first electrode layer disposed on the conductive resin layer and contacting the conductive connection portion; / RTI >
Wherein the conductive connection portion has a melting point lower than a curing temperature of the base resin.
delete 16. The method of claim 15,
Wherein the conductive connecting portion has a melting point of 300 DEG C or less.
16. The method of claim 15,
Wherein the conductive connection portion comprises at least two selected from tin, lead, indium, copper, silver and bismuth.
16. The method of claim 15,
Wherein the conductive resin layer is at least one of copper, nickel, silver, silver-coated copper, and tin-coated copper.
16. The method of claim 15,
Wherein the internal electrode comprises nickel and the intermetallic compound comprises nickel-tin (Ni-Sn).
16. The method of claim 15,
Wherein the internal electrode comprises one of nickel, copper, and palladium, or an alloy thereof.
16. The method of claim 15,
Wherein the conductive resin layer is one of a spherical shape, a flake shape, and a mixed shape of a spherical shape and a flake shape.
16. The method of claim 15,
The external electrode may include a connection portion formed on the third and fourth surfaces of the body, and a band portion extending from the connection portion to a portion of the first and second surfaces of the body and a portion of the fifth and sixth surfaces, respectively And a capacitor.
16. The method of claim 15,
Wherein the first electrode layer comprises one of copper, tin, nickel, palladium, and gold or an alloy thereof.
16. The method of claim 15,
Wherein the first and second external electrodes further include a second electrode layer disposed on the first electrode layer.
26. The method of claim 25,
And the second electrode layer includes a nickel plated layer and a tin plated layer formed in order on the first electrode layer.
16. The method of claim 15,
And the upper and lower covers having the same material and composition as the dielectric layer are disposed on the upper and lower surfaces of the body, respectively.
A plurality of first internal electrodes and a plurality of second internal electrodes arranged alternately with each other with the dielectric layer sandwiched therebetween, the first and second surfaces being opposed to each other, the first and second surfaces being connected to the first and second surfaces, Third and fourth surfaces, fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other, and one end of the first and second internal electrodes Wherein the first and second surfaces are exposed through the third and fourth surfaces, respectively;
An intermetallic compound connected to one end of each of the first and second internal electrodes; And
First and second external electrodes respectively disposed on the third and fourth surfaces of the body; / RTI >
Wherein the first and second external electrodes
A conductive resin layer disposed on the third and fourth surfaces of the body, the conductive resin layer including a plurality of metal particles, a conductive connection portion surrounding the plurality of metal particles and contacting the intermetallic compound, and a base resin; And
A first electrode layer disposed on the conductive resin layer and contacting the conductive connection portion; / RTI >
Wherein the first electrode layer is a copper plating layer,
Wherein the conductive connection portion has a melting point lower than a curing temperature of the base resin.
delete 29. The method of claim 28,
Wherein the conductive connecting portion has a melting point of 300 DEG C or less.
29. The method of claim 28,
Wherein the conductive connection portion comprises at least two selected from tin, lead, indium, copper, silver and bismuth.
29. The method of claim 28,
Wherein the conductive resin layer is at least one of copper, nickel, silver, silver-coated copper, and tin-coated copper.
29. The method of claim 28,
Wherein the internal electrode comprises nickel and the intermetallic compound comprises nickel-tin (Ni-Sn).
29. The method of claim 28,
Wherein the internal electrode comprises one of nickel, copper, and palladium, or an alloy thereof.
29. The method of claim 28,
Wherein the conductive resin layer is one of a spherical shape, a flake shape, and a mixed shape of a spherical shape and a flake shape.
29. The method of claim 28,
And a moisture permeation preventing film formed on the first and second surfaces of the body, respectively.
29. The method of claim 28,
The external electrode may include a connection portion formed on the third and fourth surfaces of the body, and a band portion extending from the connection portion to a portion of the first and second surfaces of the body and a portion of the fifth and sixth surfaces, respectively And a capacitor.
29. The method of claim 28,
Wherein the first and second external electrodes further include a second electrode layer disposed on the first electrode layer.
39. The method of claim 38,
And the second electrode layer includes a nickel plated layer and a tin plated layer formed in order on the first electrode layer.
29. The method of claim 28,
And the upper and lower covers having the same material and composition as the dielectric layer are disposed on the upper and lower surfaces of the body, respectively.

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