KR101922873B1 - Manufacturing method of electronic component modul - Google Patents
Manufacturing method of electronic component modul Download PDFInfo
- Publication number
- KR101922873B1 KR101922873B1 KR1020140147111A KR20140147111A KR101922873B1 KR 101922873 B1 KR101922873 B1 KR 101922873B1 KR 1020140147111 A KR1020140147111 A KR 1020140147111A KR 20140147111 A KR20140147111 A KR 20140147111A KR 101922873 B1 KR101922873 B1 KR 101922873B1
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- KR
- South Korea
- Prior art keywords
- forming
- electrode
- substrate
- external connection
- protective layer
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device module capable of forming an external terminal in a mold part and a method of manufacturing the electronic device module. According to another aspect of the present invention, there is provided an electronic device module comprising: a substrate having an electrode for mounting and an electrode for external connection, and having an insulating protective layer formed on an outer surface thereof; At least one electronic element mounted on the mounting electrode; A mold part for sealing the electronic device; And at least one connecting conductor having one end joined to the electrode for external connection of the substrate and formed in the mold part through the mold part, wherein the insulating protection layer can be spaced apart from the connecting conductor .
Description
The present invention relates to an electronic device module capable of disposing an external terminal on the outside of a mold part and a method of manufacturing the same.
In order to realize miniaturization and weight reduction of electronic devices, not only a technique of reducing the individual size of the mounting parts but also a system on chip (SOC) technique of making a plurality of individual elements into one chip or a plurality of individual (SIP) technology, which is a system for integrating devices into one package.
In addition, a structure for mounting electronic components on both sides of a substrate and a structure for forming external terminals on both sides of the package have also been developed in order to manufacture an electronic device module having a small size and high performance.
An object of the present invention is to provide an electronic device module in which an external terminal is formed in a mold part of an electronic device module and a method of manufacturing the electronic device module.
A method of manufacturing an electronic device module according to an embodiment of the present invention includes the steps of preparing a substrate having an electrode for mounting and an electrode for external connection and having an insulating protective layer formed on an outer surface thereof; Mounting at least one electronic element on the mounting electrode; Forming a mold part for sealing the electronic device; Forming a via hole in the mold so that the insulating protection layer is not exposed; And forming a connection conductor in the via hole by a plating method.
delete
In the electronic element module according to the present invention, electronic elements are mounted on both sides of a substrate, and all the electronic elements are sealed by a mold part. Therefore, many devices can be mounted in one electronic device module while easily protecting them from the outside.
And the mold part is directly bonded to the electrode for external connection via the insulating film. Therefore, the molded part can be bonded very firmly to the electrode for external connection.
In addition, since the laser is irradiated on the insulating protective layer during the laser drilling process, the insulating protective layer can be prevented from being peeled off from the electrode for external connection, and plating reliability can be ensured.
1 is a cross-sectional view schematically showing an electronic device module according to an embodiment of the present invention;
FIG. 2 is a partially cut-away perspective view showing the interior of the electronic device module shown in FIG. 1; FIG.
Fig. 3 is an enlarged partial cross-sectional view of the portion A of Fig. 1; Fig.
4A to 4H are cross-sectional views illustrating a method of manufacturing the electronic device module shown in FIG. 1;
5 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.
6A and 6C illustrate a method of manufacturing an electronic device module according to another embodiment of the present invention.
7 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.
8A and 8C illustrate a method of manufacturing an electronic device module according to another embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. In addition, the shape and size of elements in the figures may be exaggerated for clarity.
1 is a cross-sectional view schematically showing an electronic device module according to an embodiment of the present invention. FIG. 2 is a partially cutaway perspective view showing the inside of the electronic device module shown in FIG. 1, and FIG. 3 is a partially enlarged cross-sectional view showing an enlarged view of a portion A of FIG.
1 to 3, the
The
The
The
A plurality of
Although not shown, a wiring pattern may be formed on both sides of the
The
The
On the other hand, an electrolytic plating wiring (not shown) may be formed on at least one surface of the
The
The
The
The
The
The
The
The
The
The connecting
Therefore, when the
The
The other end of the connecting
In this case, since a part of the
However, the present invention is not limited to this, and the other end of the connecting
The
In this embodiment, the case where the connecting
In the
The insulating
The insulating
For example, the insulating
The
The insulating
3, the connecting
In this structure, a groove (17a in FIG. 4A) is formed in the insulating
Next, a method of manufacturing the electronic element module according to the present embodiment will be described.
4A to 4H are cross-sectional views illustrating a method of manufacturing the electronic device module shown in FIG.
Referring to FIG. 4A, the step of preparing the
In addition, the
More specifically, most of the mounting
On the other hand, most of the
At this time, a nickel / gold (Ni / Au) plating layer is not formed on the exposed portion of the
The
The outer contour of the
4B, a step of mounting the
The mounting
Meanwhile, in this process, the insulating
Subsequently, a step of forming the
Subsequently, molding resin is injected into the
Then, as shown in Fig. 4E, the step of mounting the
Next, a step of forming a
In this process, the molding resin forming the
On the other hand, an insulating
Then, the step of forming the connecting
First, a via
The via
The via
(Or diameter) of the via
Therefore, the manufacturing method according to the present embodiment can form the via
On the other hand, when the insulating
However, in the case where the
Here, the insulating
Subsequently, the conductive material is filled in the via
The connecting
Here, the plating process may be performed by electrolytic plating only. In this case, the via holes 37 are sequentially filled from the
Meanwhile, as described above, the
Therefore, the manufacturing method according to the present embodiment uses a mechanical interlocking (hooking, anchoring theory) or an anchoring effect to plate the conductor on the EMC surface. This means that the adhesive penetrates into the irregular structure (irregularity) of the surface of the adherend and is bonded by mechanical engagement.
That is, the manufacturing method according to the present embodiment uses a method in which the inner surface of the via
For this, in the present embodiment, the irregular structure is formed by increasing the inner surface roughness (or roughness roughness) of the via
Even if the molded
On the other hand, in order to increase the bonding force between the
In addition, the
In addition, the present invention is not limited to the above-mentioned method. For example, after the
When the
Here, the
Since the insulating
Therefore, even if the
do. The insulating
The
In addition, the
On the other hand, in the conventional case, when an external terminal is directly formed on the
This is a structure for preventing the externally connecting
However, in the method of manufacturing an electronic device module according to the present embodiment, the
More specifically, after the
Therefore, the time for the
According to this manufacturing method, the
Therefore, there is no interface between the
In the method of manufacturing an electronic device module according to the present embodiment, a
The
The insulating
The connecting conductor according to this embodiment is formed by growing from the
However, as described above, since the manufacturing method according to the present embodiment forms the inner surface of the via
In this embodiment, the
5 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.
Referring to FIG. 5, the
In this case, the joint surface of the
As such, the
6A to 6C illustrate a method of manufacturing an electronic device module according to another embodiment of the present invention. FIGS. 6A, 6A, 6B, 4F, 6C, Respectively.
The method of manufacturing an electronic device module according to the present embodiment is similar to the above embodiment and has a difference in the shape of the
First, referring to FIG. 6A, in the manufacturing method according to the present embodiment, the
Here, the
Then, following the steps shown in FIGS. 4B to 4E, a step of forming the
Then, a via
Then, the surface of the
Subsequently, after the
7 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.
7, the
In this embodiment, the insulating
Such a structure can be manufactured through the method shown in Figs. 8A and 8B below.
8A to 8C are views for explaining a method of manufacturing an electronic device module according to still another embodiment of the present invention, and are a method for manufacturing the structure of the connection terminal shown in FIG.
Referring to FIG. 8A, the manufacturing method according to the present embodiment is similar to the manufacturing method of FIGS. 6A and 6B except that the
Here, the
The insulating
After completing the first mold part according to the steps shown in FIGS. 4B to 4E, a step of forming the
Then, a via
Then, as shown in FIG. 4H, after the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be obvious to those of ordinary skill in the art.
100, 200, 300: electronic device module
1: Electronic device
10: substrate
16: Electrode for external connection
16a:
17: Insulation protective layer
17a: Home
20: connection conductor
28: External terminal
30: Mold part
31: first mold part
35: second mold part
37: via hole
Claims (19)
Mounting at least one electronic element on the mounting electrode;
Forming a mold part for sealing the electronic device;
Forming a via hole in the mold so that the insulating protection layer is not exposed; And
Forming a connection conductor in the via hole by a plating method;
≪ / RTI >
And mounting a plurality of the electronic devices on both sides of the substrate.
And forming molds on both sides of the substrate.
And increasing the roughness of the inner surface of the via hole by using a laser.
Forming the molded part using an epoxy molding compound (EMC), and the step of forming the connection conductor is a step of forming the connection conductor through copper plating.
And forming an external connection terminal on the connecting conductor.
Preparing a substrate on which an electrolytic plating wiring is formed on at least one surface of the substrate,
Wherein forming the connecting conductor comprises forming the connecting conductor by electroplating.
Forming the mounting electrode and the external connection electrode; And
Forming the insulating protective layer so that a part or the whole of the electrode for external connection is exposed;
≪ / RTI >
Forming an insulating protective layer on the electrode for external connection, and forming a groove in the insulating protective layer to partially expose the electrode for external connection.
Wherein the electronic device module is formed in a ring shape or a container shape.
And exposing the external connection electrode to an area smaller than the groove formed in the insulating protection layer.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/732,550 US10356911B2 (en) | 2014-07-04 | 2015-06-05 | Electronic device module and method of manufacturing the same |
CN201510387300.4A CN105244327B (en) | 2014-07-04 | 2015-07-03 | Electronic apparatus module and its manufacture method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140083834 | 2014-07-04 | ||
KR20140083834 | 2014-07-04 |
Publications (2)
Publication Number | Publication Date |
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KR20160004883A KR20160004883A (en) | 2016-01-13 |
KR101922873B1 true KR101922873B1 (en) | 2018-11-29 |
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KR1020140147111A KR101922873B1 (en) | 2014-07-04 | 2014-10-28 | Manufacturing method of electronic component modul |
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KR (1) | KR101922873B1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100220448A1 (en) * | 2007-11-20 | 2010-09-02 | Murata Manufacturing Co., Ltd. | Component-containing module |
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2014
- 2014-10-28 KR KR1020140147111A patent/KR101922873B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100220448A1 (en) * | 2007-11-20 | 2010-09-02 | Murata Manufacturing Co., Ltd. | Component-containing module |
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