KR20160004883A - Electronic component module and manufacturing method threrof - Google Patents

Electronic component module and manufacturing method threrof Download PDF

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Publication number
KR20160004883A
KR20160004883A KR1020140147111A KR20140147111A KR20160004883A KR 20160004883 A KR20160004883 A KR 20160004883A KR 1020140147111 A KR1020140147111 A KR 1020140147111A KR 20140147111 A KR20140147111 A KR 20140147111A KR 20160004883 A KR20160004883 A KR 20160004883A
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KR
South Korea
Prior art keywords
electrode
forming
external connection
substrate
protective layer
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KR1020140147111A
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Korean (ko)
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KR101922873B1 (en
Inventor
유도재
임재현
류종인
오규환
이기주
Original Assignee
삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to US14/732,550 priority Critical patent/US10356911B2/en
Priority to CN201510387300.4A priority patent/CN105244327B/en
Publication of KR20160004883A publication Critical patent/KR20160004883A/en
Application granted granted Critical
Publication of KR101922873B1 publication Critical patent/KR101922873B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The present invention relates to an electronic component module for forming an external terminal in a mold part, and a manufacturing method thereof. The electronic component module according to an embodiment of the present invention includes a substrate which includes a mounting electrode and an external connection electrode, and has an insulating protection layer formed on an external surface; at least one electronic device mounted on the mounting electrode; a mold part which seals the electronic device; and at least one connection conductor which has an end bonded to the external connection electrode of the substrate, and penetrates the mold part to be formed in the mold part. The insulating protection layer may be separated from the connection conductor.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic device module,

The present invention relates to an electronic device module capable of disposing an external terminal on the outside of a mold part and a method of manufacturing the same.

In order to realize miniaturization and weight reduction of electronic devices, not only a technique of reducing the individual size of the mounting parts but also a system on chip (SOC) technique of making a plurality of individual elements into one chip or a plurality of individual (SIP) technology, which is a system for integrating devices into one package.

In addition, a structure for mounting electronic components on both sides of a substrate and a structure for forming external terminals on both sides of the package have also been developed in order to manufacture an electronic device module having a small size and high performance.

Japanese Patent No. 4840508

An object of the present invention is to provide an electronic device module in which an external terminal is formed in a mold part of an electronic device module and a method of manufacturing the electronic device module.

An electronic device module according to an embodiment of the present invention includes a substrate including an electrode for mounting and an electrode for external connection, and having an insulating protective layer formed on an outer surface thereof; At least one electronic element mounted on the mounting electrode; A mold part for sealing the electronic device; And at least one connecting conductor having one end joined to the electrode for external connection of the substrate and formed in the mold part through the mold part, wherein the insulating protection layer can be spaced apart from the connecting conductor .

According to another aspect of the present invention, there is provided a method of manufacturing an electronic device module, including: preparing a substrate having an electrode for mounting and an electrode for external connection, Mounting at least one electronic element on the mounting electrode; Forming a mold part for sealing the electronic device; Forming a via hole in the mold so that the insulating protection layer is not exposed; And forming a connection conductor in the via hole by a plating method.

In the electronic element module according to the present invention, electronic elements are mounted on both sides of a substrate, and all the electronic elements are sealed by a mold part. Therefore, many devices can be mounted in one electronic device module while easily protecting them from the outside.

And the mold part is directly bonded to the electrode for external connection via the insulating film. Therefore, the molded part can be bonded very firmly to the electrode for external connection.

In addition, since the laser is irradiated on the insulating protective layer during the laser drilling process, the insulating protective layer can be prevented from being peeled off from the electrode for external connection, and plating reliability can be ensured.

1 is a cross-sectional view schematically showing an electronic device module according to an embodiment of the present invention;
FIG. 2 is a partially cut-away perspective view showing the interior of the electronic device module shown in FIG. 1; FIG.
Fig. 3 is an enlarged partial cross-sectional view of the portion A of Fig. 1; Fig.
4A to 4H are cross-sectional views illustrating a method of manufacturing the electronic device module shown in FIG. 1;
5 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.
6A and 6C illustrate a method of manufacturing an electronic device module according to another embodiment of the present invention.
7 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.
8A and 8C illustrate a method of manufacturing an electronic device module according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. In addition, the shape and size of elements in the figures may be exaggerated for clarity.

1 is a cross-sectional view schematically showing an electronic device module according to an embodiment of the present invention. FIG. 2 is a partially cutaway perspective view showing the inside of the electronic device module shown in FIG. 1, and FIG. 3 is a partially enlarged cross-sectional view showing an enlarged view of a portion A of FIG.

1 to 3, the electronic device module 100 according to the present embodiment includes an electronic device 1, a substrate 10, a mold portion 30, a connecting conductor 20, and an external terminal 28. [ As shown in FIG.

The electronic device 1 includes various devices such as a passive device 1a and an active device 1b, and any device that can be mounted on a substrate can be used as the electronic device 1. [

The electronic device 1 may be mounted on one or both surfaces of a substrate 10 described below. In FIG. 1, the active element 1b and the passive element 1a are mounted on the upper surface of the substrate 10, and the passive element 1a is mounted on the lower surface. However, the present invention is not limited thereto, and electronic elements 1 may be arranged in various forms on both sides of the substrate 10 according to the size and shape of the electronic elements 1 and the design of the electronic element module 100 .

The electronic devices 1 may be mounted on the substrate 10 in the form of a flip chip or may be electrically bonded to the substrate 10 via a bonding wire 2.

Substrate 10 may be any of a variety of substrates (e.g., ceramic substrates, printed circuit boards, flexible substrates, etc.) well known in the art and may include at least one electronic element 1 on at least one side Can be mounted.

A plurality of electrodes 13 and 16 may be formed on one surface or both surfaces of the substrate 10. Here, the electrode may include a plurality of external connection electrodes 16 electrically connected to the external terminals 28 and a plurality of mounting electrodes 13 for mounting the electronic device 1. The external connection electrode 16 is provided to be electrically connected to a connection conductor 20 to be described later and is connected to the external terminal 28 through the connection conductor 20.

Although not shown, a wiring pattern may be formed on both sides of the substrate 10 to electrically connect the mounting electrodes 13 and the electrodes 16 for external connection.

The substrate 10 according to this embodiment may be a multilayer substrate formed of a plurality of layers, and a circuit pattern 15 for forming an electrical connection may be formed between the respective layers.

The substrate 10 according to the present embodiment may also include a conductive via 14 for electrically connecting the electrodes 13 and 16 to the circuit patterns 15 formed in the substrate 10 .

On the other hand, an electrolytic plating wiring (not shown) may be formed on at least one surface of the substrate 10. The electrolytic plating wiring can be used in the process of forming the connection conductor 20 to be described later by electrolytic plating.

The substrate 10 according to this embodiment may be a substrate in which a plurality of the same mounting regions are repeatedly arranged to simultaneously manufacture a plurality of individual modules. In particular, the substrate 10 may have a rectangular shape or a long strip shape Lt; / RTI > In this case, an electronic element module can be manufactured for each of a plurality of individual module mounting areas.

The mold part 30 may include a first mold part 31 formed on the upper surface of the substrate 10 and a second mold part 35 formed on the lower surface of the substrate 10. [

The mold part 30 seals the electronic elements 1 mounted on both sides of the substrate 10. It is also possible to prevent an electrical short between the electronic elements 1 from being generated by filling between the electronic elements 1 mounted on the substrate 10 and to prevent the electronic elements 1 from being electrically short- (1) is fixed on a substrate to safely protect the electronic elements (1) from external impacts.

The mold part 30 according to the present embodiment is formed of an insulating material including a resin material such as an EMC (Epoxy Molding Compound). However, the present invention is not limited thereto.

The first mold part 31 according to the present embodiment is formed to cover the entire one surface of the substrate 10. In this embodiment, all the electronic devices 1 are embedded in the first mold part 31 as an example. However, the present invention is not limited to this, and at least one of the electronic elements 1 to be embedded in the first mold part 31 may be partially exposed to the outside of the first mold part 31, Application is possible.

The second mold part 35 is formed on the lower surface of the substrate 10, and a connecting conductor 20 is formed inside.

The second mold part 35 may be formed in such a manner as to completely embed the electronic devices 1 in the same manner as the first mold part 31. However, It is also possible to do.

The connection conductors 20 are connected to at least one surface of the substrate 10 and one end thereof is joined to the substrate 10 and the other end thereof is exposed to the outside of the mold portion 30, . Therefore, the connection conductor 20 is formed in the mold part 30 in such a manner as to penetrate the mold part 30. [

The connection conductors 20 may be formed of a conductive material, and may be formed of copper, gold, silver, aluminum, or an alloy thereof.

The connecting conductor 20 according to the present embodiment is formed of the same material as the electrodes 13 and 16. Specifically, the connection conductor 20 is formed of the same material as the external connection electrode 16 to which the connection conductor 20 is connected.

Therefore, when the external connection electrode 16 is formed of copper (Cu), the connection conductor 20 is also formed of copper (Cu), and the connection conductor 20 and the external connection electrode 16 are made of the same material .

The connection conductor 20 according to the present embodiment may be formed in a shape similar to a cone having one end, that is, a horizontal cross-sectional area smaller toward the substrate 10 side. However, the present invention is not limited thereto, and can be modified into various shapes as long as the horizontal cross-sectional area of the substrate 10 side can be formed smaller than the horizontal cross-sectional area of the outer surface side of the mold portion 30. [

The other end of the connecting conductor 20 may be recessed inwardly of the via hole 37 as shown in FIG. The external terminal 28 is partly filled into the via hole 37 to fill the remaining space.

In this case, since a part of the external terminal 28 is inserted into the via-hole 37 in the form of a protrusion, the bonding force between the junction conductor 10 and the mold part 35 can be increased.

However, the present invention is not limited to this, and the other end of the connecting conductor 20 may be formed to protrude outward from the substrate 10, or may be formed in a flat shape parallel to one surface of the substrate 10 Various variations are possible.

The external terminal 28 may be bonded to the other end of the connection conductor 20. The external terminal 28 electrically and physically connects the electronic element module 100 and a main board (not shown) on which the electronic element module 100 is mounted. The external terminal 28 may be formed in various shapes such as a bump or a solder ball.

In this embodiment, the case where the connecting conductor 20 is formed only in the second mold part 35 is taken as an example. However, the constitution of the present invention is not limited thereto, and it is possible to form it in the first mold part 35 as required.

In the electronic device module 100 according to the present embodiment configured as described above, the insulating protective layer 17 is formed on the surface of the substrate 10 as shown in FIG. The insulating protective layer 17 is formed on one or both surfaces of the substrate 10 and covers wiring patterns (not shown) formed on the substrate 10 to protect the wiring patterns.

The insulating protection layer 17 may be formed of a solder resist layer.

The insulating protection layer 17 may partially cover the electrodes 13 and 16 formed on the substrate 10. More specifically, the insulating protection layer 17 can partially cover an outer portion of the electrode 16 for external connection according to the present embodiment that is not bonded to the connection conductor 20.

For example, the insulating protective layer 17 may be formed to cover the rim portion of the electrode 16 for external connection. At this time, the insulating protection layer 17 is not in contact with the connection conductor 20, but is formed at a position spaced apart from the connection conductor 20 by a certain distance. Therefore, when the second mold part 35 is omitted, the electrode 16 for external connection can be partially exposed between the insulating protective layer 17 and the connecting conductor 20.

The second mold part 35 according to the present embodiment is disposed so as to cover the insulating protective layer 17 formed on the electrode 16 for external connection.

The insulating protective layer 17 formed on the electrode 16 for external connection is completely embedded in the second mold portion 35 and the second mold portion 35 is formed of the insulating protective layer 17 and the connecting conductor 20 ).

3, the connecting conductor 20 is not in contact with the insulating protective layer 17 at the portion to be bonded to the electrode 16 for external connection, but is in contact with only the second mold portion 35 do.

In this structure, a groove (17a in FIG. 4A) is formed in the insulating protective layer 17 formed on the electrode 16 for external connection in the process of manufacturing the substrate, the mold part 30 is formed in the groove 17a, Can be realized by forming the connecting conductor 20. This will be described in more detail in the following manufacturing method.

Next, a method of manufacturing the electronic element module according to the present embodiment will be described.

4A to 4H are cross-sectional views illustrating a method of manufacturing the electronic device module shown in FIG.

Referring to FIG. 4A, the step of preparing the substrate 10 is performed. As described above, the substrate 10 may be a multi-layer substrate, and the mounting electrodes 13 may be formed on both sides. And an electrode 16 for external connection may be formed on the lower surface.

In addition, the substrate 10 according to the present embodiment has the insulating protective layer 17 formed on one side or both sides thereof. The insulating protection layer 17 may be formed so as to cover the wiring pattern formed on the substrate 10 as described above. And the electrodes 13 and 16 can be completely buried in the insulating protective layer 17 or can be exposed.

More specifically, most of the mounting electrodes 13 on which the electronic element 1 is mounted are exposed to the outside of the insulating protection layer 17. [ Here, a nickel / gold (Ni / Au) plating layer (not shown) may be formed on the exposed surface of the mounting electrode 13 to prevent an oxide film from being formed.

On the other hand, most of the electrodes 16 for external connection are buried in the insulating protective layer 17, and only a part thereof is partially exposed to the outside by the grooves 17a formed in the insulating protective layer 17.

At this time, a nickel / gold (Ni / Au) plating layer is not formed on the exposed portion of the electrode 16 for external connection. Therefore, an insulating film (16a in Fig. 4B) such as an oxide film can be formed on the exposed surface of the electrode 16 for external connection according to the exposure environment and the exposure time.

The groove 17a formed in the insulating protective layer 17 may be formed in a ring shape smaller than the area of the electrode 16 for external connection corresponding to the shape of the electrode. More specifically, the outer contour (e.g., outer diameter) of the groove 17a is formed to be spaced inwardly from the outer contour of the electrode 16 for external connection.

The outer contour of the groove 17a may be formed to be the same as the outer contour of the electrode 16 for external connection. If necessary, the outer contour of the groove 17a may be connected to the external connection electrode 16). However, the inner contour of the groove 17a is formed to be smaller than the outer contour of the electrode 16 for external connection. The groove 17a may be formed in the process of forming the insulating protective layer 17 on the substrate 10 . However, the present invention is not limited to this, and it is also possible to form the insulating protective layer 17 completely covering the external connection electrode 16 and the mounting electrode 13, if necessary, and then remove a part thereof.

4B, a step of mounting the electronic element 1 on one surface or upper surface of the substrate 10 is performed. In this step, a solder paste is printed on a mounting electrode 13 formed on one surface of a substrate 10 through a screen printing method and the electronic elements 1 are placed thereon, and then applying heat through a reflow process to melt and cure the solder paste.

The mounting electrodes 13 formed on the substrate 10 and the electrodes 13 of the electronic element 1 formed on the substrate 10 are bonded to each other by using the bonding wire 2 after the electronic element 1 is mounted on one surface of the substrate 10, And then electrically connecting them to each other.

Meanwhile, in this process, the insulating layer 16a is formed on the exposed surface of the external connection electrode 16 of the substrate 10 through the groove of the insulating protection layer 17 by the heat applied in the reflow process .

Subsequently, a step of forming the first mold part 31 on one side of the substrate 10 is performed. In this step, as shown in FIG. 4C, first, a step of disposing the substrate 10 on which the electronic element 1 is mounted in the mold 90 is performed.

Subsequently, molding resin is injected into the mold 90 to form the first mold part 31 as shown in FIG. 4D. The electronic components 1 mounted on the upper surface of the substrate 10 can be protected from the outside by the first mold part 31. [

Then, as shown in Fig. 4E, the step of mounting the electronic elements 1 on the lower surface of the substrate 10 is performed. In this step, a solder paste is printed on the mounting electrode 13 through a screen printing method or the like, and the electronic elements 1 are placed on the solder paste. Thereafter, heat is applied through a reflow process Followed by melting and curing the solder paste.

Next, a step of forming a second mold part 35 in the lower part of the substrate 10 is performed as shown in FIG. 4F. This step may be performed by placing the substrate 10 in the mold 90 (FIG. 4C) and then injecting the molding resin into the mold 90, as in the case shown in FIG. 4C.

In this process, the molding resin forming the mold part 30 flows into the groove 17a formed in the insulating protection layer 17 and is filled in the groove 17a. Therefore, the mold portion 30 is formed to contact the external connection electrode 16 through the groove 17a.

On the other hand, an insulating film 16a (for example, an oxide film) is formed on the external connection electrode 16 exposed through the groove 17a of the insulating protection layer 17 to the outside. Therefore, the molding resin (for example, EMC) forming the mold portion 30 is contacted with the insulating film 16a without contacting the electrode 16 for external connection. So that it can be bonded more firmly than when the mold part 30 is directly bonded to a metal or conductor such as copper (Cu).

Then, the step of forming the connecting conductor 20 is carried out.

First, a via hole 37 is formed in the second mold part 35 as shown in FIG. 4G. The via hole 37 may be formed using a laser drill.

The via hole 37 may be formed in a conical shape having a smaller horizontal cross-sectional area toward the substrate 10 side.

The via hole 37 formed in the groove of the insulating protection layer 17 may be formed along the groove 17a formed in the insulating protection layer 17.

(Or diameter) of the via hole 37 is formed in an area (or diameter) smaller than the area (or diameter) formed by the outer periphery of the groove 17a in the insulating protection layer 17. [ And the outer surface of the insulating protection layer 17 may have an area larger than an area formed by the outer surface of the groove 17a.

Therefore, the manufacturing method according to the present embodiment can form the via hole 37 by irradiating the laser only to the mold part 30 without irradiating the insulating protective layer 17. Accordingly, since the inner surface of the via hole 37 is entirely made of the same material (for example, EMC), the inner surface can be uniformly formed as a whole.

On the other hand, when the insulating protective layer 17 is partly exposed in the mold part 30 and the laser is irradiated on the insulating protective layer 17, the insulating protective layer 17 is electrically connected to the external connection electrode 17, (16). ≪ / RTI > In this case, the peeled portion may act as a factor that hinders plating in the plating process described below.

However, in the case where the mold part 30 is firmly bonded to the external connection electrode 16 via the insulating film 16a and only the mold part 30 is removed through the laser as in this embodiment, The above-mentioned problem can be solved because the light is not irradiated to the light source 17.

Here, the insulating protective layer 17 disposed at the center of the groove 17a may be irradiated with a laser, but this is not applicable to the above-mentioned problem of peeling because it is a part to be removed.

Subsequently, the conductive material is filled in the via hole 37 to form the connecting conductor 20 as shown in FIG. 4H.

The connecting conductor 20 according to the present embodiment is formed through a plating process. When the connecting conductor 20 is formed of copper (Cu), copper plating can be performed.

Here, the plating process may be performed by electrolytic plating only. In this case, via holes 37 are sequentially filled from the external electrode terminals 16 of the substrate 10 by using electrolytic plating wiring (not shown) formed on the substrate 10 to form the connection conductors 20 can do. However, the present invention is not limited thereto, and electroless plating may be used as needed.

Meanwhile, as described above, the mold unit 30 according to the present embodiment is formed of an epoxy mold compound (EMC). It is generally known that the surface of EMC, a thermosetting resin, is not easily plated, that is, the joining of metals.

Therefore, the manufacturing method according to the present embodiment uses a mechanical interlocking (hooking, anchoring theory) or an anchoring effect to plate the conductor on the EMC surface. This means that the adhesive penetrates into the irregular structure (irregularity) of the surface of the adherend and is bonded by mechanical engagement.

That is, the manufacturing method according to the present embodiment uses a method in which the inner surface of the via hole 37 formed by EMC is made as rough as possible and the plating material is bonded to the inner surface of the via hole 37 in the anchor effect in the plating process.

For this, in the present embodiment, the irregular structure is formed by increasing the inner surface roughness (or roughness roughness) of the via hole 37 as much as possible in the process of forming the via hole 37 using the laser. Here, the surface roughness can be increased by controlling the type of laser, the spot size, and the power of the laser.

Even if the molded portion 30 is formed of EMC material, the interconnection between the connection conductors 20 and the inner surfaces of the via holes 37 can be easily formed.

On the other hand, in order to increase the bonding force between the connection conductor 20 and the mold part 30, after various catalyst metals such as gold, platinum, and palladium are firstly disposed in the area to be plated, Do.

In addition, the external connection electrode 16 exposed to the inside of the via hole 37 can be partially etched to minimize the influence of the impact generated in the electrode 16 for external connection due to laser irradiation.

In addition, the present invention is not limited to the above-mentioned method. For example, after the connecting conductor 20 is partially formed in the via hole 37 in a plating manner, a conductive paste is applied by a screen printing method to completely fill the via hole 37, Various modifications are possible.

When the connection conductor 20 is formed through the above process, the external terminal 28 is formed at the other end of the connection conductor 20 to complete the electronic device module 100 according to the present embodiment shown in FIG. 1 .

Here, the external terminal 28 may be formed in various shapes such as a bump or a solder ball instead of a pad.

Since the insulating layer 17 is not thermally stressed in the process of forming the via hole 37 as described above, since the inner surface of the via hole 37 is formed only of the mold part 30,

Therefore, even if the connection conductor 20 is formed by filling the via hole 37 sequentially from the external electrode terminal 16, the insulating protection layer 17 is not peeled off from the external connection electrode 16. However, the present invention is not limited thereto It is also possible to use electroless plating as required.

do. The insulating protective layer 17 can be peeled off from the electrode 16 for external connection due to thermal shock caused by laser irradiation or the like when the laser is irradiated on the insulating protective layer 17. [ In this case, the peeled portion may act as a factor that hinders plating in the plating process described below.

The electronic element module 100 according to the present embodiment manufactured through the steps described above is characterized in that the electronic elements 1 are mounted on both sides of the substrate 10 and the electronic elements 1 are formed by the mold part 30. [ Are all sealed. Therefore, many elements can be mounted in one electronic device module 100 and easily protected from the outside.

In addition, the connection conductor 20 is formed in the mold part 30 through the plating method, and is connected to the external terminal 28. Therefore, the conductor path connecting the substrate 10 to the outside and the circuit wiring can be easily implemented even in the double-sided molding structure or the package stack structure.

On the other hand, in the conventional case, when an external terminal is directly formed on the external connection electrode 16 made of copper (Cu), the exposed surface of the external connection electrode 16 is plated with nickel (Ni) To form an under-bump metallurgy (UMB), and then an external terminal 28 is bonded to the UMB.

This is a structure for preventing the externally connecting electrode 16 exposed to the outside due to heat applied to the electrode for external connection from being oxidized in a reflow process or the like for device mounting.

However, in the method of manufacturing an electronic device module according to the present embodiment, the external terminal 28 is formed on the mold part 30 via the connecting conductor 20 without forming the external terminal 28 directly on the substrate 10 do.

More specifically, after the external connection electrode 16 of the substrate 10 is covered with the insulating protective layer 17, the electronic element is mounted and the mold part 30 is formed, A via hole 37 is formed to form a connection conductor 20.

Therefore, the time for the external connection electrode 16 to be exposed to the outside is short, and after the external connection electrode 16 is exposed to the outside, the reflow process does not proceed, so that high temperature heat is not applied. Therefore, even if the base metal layer is not formed on the external connection electrode 16 as in the conventional art, the external connection electrode 16 is not easily oxidized. Accordingly, since the step of forming the base metal layer can be omitted, there is an advantage that the manufacturing is very easy.

According to this manufacturing method, the electronic element module 100 according to the present embodiment is directly bonded to the copper-made connecting conductor 20 on the copper-made external connection electrode 16. That is, the external connection electrodes 16 and the connection conductors 20 according to the present embodiment are formed integrally with the same metal (for example, copper) without the use of a different kind of metal such as a base metal layer.

Therefore, there is no interface between the external connection electrode 16 and the connection conductor 20 due to different kinds of metal, which is advantageous in securing the bonding reliability between the electrodes.

In the method of manufacturing an electronic device module according to the present embodiment, a groove 17a is partially formed in the insulating protective layer 17 before forming the mold part 30, and an insulating film (not shown) is formed on the electrode exposed through the groove 17a 16a.

The mold part 30 is bonded to the external connection electrode 16 via the insulating film 16a. Therefore, the interface bonding force between the mold portion 30 and the external connection electrode 16 can be increased, so that the mold portion 30 can be bonded to the external connection electrode 16 very firmly.

The insulating layer 17 is not exposed to the inner surface of the via hole 37 and the via hole 37 is formed in the via hole 37 after the mold part 30 is filled in the groove 17a. The inner surface can be formed only of the mold part 30. Therefore, in the laser drilling process, the laser is irradiated on the insulating protective layer 17, so that the insulating protective layer 17 can be prevented from being peeled off from the electrode 16 for external connection.

The connecting conductor according to this embodiment is formed by growing from the electrode 16 for external connection through electroplating. When the insulating protective layer 17 is exposed in the via hole 37 and the insulating protective layer 17 is partly peeled off from the electrode 16 for external connection in the via hole 37, (17) interferes with the growth of the connecting conductor (20), so that the connecting conductor is hardly formed normally.

However, as described above, since the manufacturing method according to the present embodiment forms the inner surface of the via hole 37 with only the molding portion 30, the above-described problem can be completely solved, and the plating reliability can be secured.

In this embodiment, the first mold part 31 is first formed and then the second mold part 35 is formed. However, the present invention is not limited thereto. For example, the second mold part 35 may be formed first, or the first and second mold parts 31 and 35 may be formed together.

5 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.

Referring to FIG. 5, the electronic element module 200 according to the present embodiment is configured so that the connecting conductor 20 completely fills the via hole 37. And the external terminal 28 is bonded to the other end of the connection conductor 20.

In this case, the joint surface of the external terminal 28 and the connecting conductor 20 may be formed on the same plane as the external surface of the second mold part 35. [

As such, the connection conductor 20 according to the present embodiment can be modified into various forms.

6A to 6C illustrate a method of manufacturing an electronic device module according to another embodiment of the present invention. FIGS. 6A, 6A, 6B, 4F, 6C, Respectively.

The method of manufacturing an electronic device module according to the present embodiment is similar to the above embodiment and has a difference in the shape of the groove 17a formed in the insulating protective layer 17 and the implementation in the process.

First, referring to FIG. 6A, in the manufacturing method according to the present embodiment, the grooves 17a formed in the insulating protection layer 17 are formed in a cylindrical shape or a container shape instead of an annular shape. In this case, since most of the electrodes 16 for external connection are exposed to the outside, the insulating film 16a may be formed over the entire exposed surface in the manufacturing process.

Here, the cylindrical groove 17a formed in the insulating protective layer 17 can be formed in the process of manufacturing the insulating protective layer 17. [ Alternatively, after the insulating protective layer 17 is formed, it may be formed by laser processing, etching, or the like.

Then, following the steps shown in FIGS. 4B to 4E, a step of forming the mold part 30 as shown in FIG. 6B is performed. At this time, the second mold part 35 is filled in the groove 17a formed in the insulating protective layer 17. The mold part 30 is firmly bonded to the external connection electrode 16 via the insulating film 16a.

Then, a via hole 37 is formed as shown in FIG. 6C. The via hole 37 may be formed through a laser drill in the same manner as in the above embodiment.

Then, the surface of the electrode 16 for external connection exposed inside the via hole 37 is etched to remove the insulating film 16a. This completes the structure shown in Fig. 4g.

Subsequently, after the connection conductor 20 is formed by electrolytic plating as shown in FIG. 4H, an external terminal 28 is formed at the end of the connection conductor 20 to connect the electronic element module 100 shown in FIG. 1 Can be manufactured.

7 is a cross-sectional view schematically showing an electronic device module according to another embodiment of the present invention.

7, the electronic device module 300 according to the present embodiment is configured similarly to the electronic device module 100 shown in FIG. 1, and the mold portion 31 is formed on only one side of the substrate 10 There is a difference in point. In this case, since only one mold part 31 is formed, manufacturing process and manufacturing cost can be reduced.

In this embodiment, the insulating protective layer 17 is disposed apart from the electrode 16 for external connection by a certain distance without covering or contacting the electrode 16 for external connection. Therefore, the entirety of the external connection electrode 16 is completely exposed to the outside of the insulating protection layer 17.

Such a structure can be manufactured through the method shown in Figs. 8A and 8B below.

8A to 8C are views for explaining a method of manufacturing an electronic device module according to still another embodiment of the present invention, and are a method for manufacturing the structure of the connection terminal shown in FIG.

Referring to FIG. 8A, the manufacturing method according to the present embodiment is similar to the manufacturing method of FIGS. 6A and 6B except that the grooves 17a formed in the insulating protective layer 17 are formed in a cylindrical shape or a container shape . In this case, since most of the electrodes 16 for external connection are exposed to the outside, the insulating film 16a may be formed on the entire exposed surfaces of the electrodes 16 for external connection in the manufacturing process.

Here, the cylindrical groove 17a formed in the insulating protective layer 17 can be formed in the process of manufacturing the insulating protective layer 17. [ Alternatively, after the insulating protective layer 17 is formed, it may be formed through laser processing or the like.

The insulating protective layer 17 is disposed apart from the electrode 16 for external connection by a certain distance without covering or contacting the electrode 16 for external connection. Therefore, the entirety of the external connection electrode 16 is completely exposed to the outside of the insulating protection layer 17.

After completing the first mold part according to the steps shown in FIGS. 4B to 4E, a step of forming the second mold part 35 as shown in FIG. 8B is performed. At this time, the second mold part 35 is filled in the groove 17a formed in the insulating protective layer 17. The second mold part 35 is firmly bonded to the external connection electrode 16 via the insulating film 16a.

Then, a via hole 37 is formed as shown in FIG. 8C. The surface of the external connection electrode 16 exposed inside the via hole 37 is etched to remove the insulating film 16a to complete the structure shown in FIG. 4G.

Then, as shown in FIG. 4H, after the connection conductor 20 is formed by electrolytic plating, the external terminal 28 is formed at the end of the connection conductor 20 to complete the electronic device module.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be obvious to those of ordinary skill in the art.

100, 200, 300: electronic device module
1: Electronic device
10: substrate
16: Electrode for external connection
16a:
17: Insulation protective layer
17a: Home
20: connection conductor
28: External terminal
30: Mold part
31: first mold part
35: second mold part
37: via hole

Claims (19)

A substrate including an electrode for mounting and an electrode for external connection, the substrate having an insulating protective layer formed on an outer surface thereof;
At least one electronic element mounted on the mounting electrode;
A mold part for sealing the electronic device; And
At least one connection conductor formed in the mold portion in such a manner that one end thereof is joined to the electrode for external connection of the substrate and penetrates the mold portion;
/ RTI >
Wherein the insulating protective layer is spaced apart from the connecting conductor.
The mold according to claim 1,
And an electronic element to be filled between the insulating protection layer and the connection conductor module.
The semiconductor device according to claim 1,
And an electronic element formed by partially covering the external connection electrode module.
The semiconductor device according to claim 1,
And an electronic element module.
The mold according to claim 1,
And an electronic element partially bonded to the external connection electrode module.
6. The method of claim 5,
Wherein an insulating film is interposed between the mold part and the external connection electrode, module.
The mold according to claim 1,
Electronic device formed by EMC (Epoxy Molding Compound) module.
The method according to claim 1,
And an external connection terminal which is fastened to the other end of the connection conductor.
Preparing a substrate having an electrode for mounting and an electrode for external connection, the substrate having an insulating protective layer formed on an outer surface thereof;
Mounting at least one electronic element on the mounting electrode;
Forming a mold part for sealing the electronic device;
Forming a via hole in the mold so that the insulating protection layer is not exposed; And
Forming a connection conductor in the via hole by a plating method;
≪ / RTI >
10. The method of claim 9, wherein mounting the electronic device comprises:
And mounting a plurality of the electronic devices on both sides of the substrate.
10. The method of claim 9, wherein forming the mold portion comprises:
And forming molds on both sides of the substrate.
10. The method of claim 9, wherein forming the via-
And increasing the roughness of the inner surface of the via hole by using the laser.
10. The method of claim 9, wherein forming the mold portion comprises:
Forming the molded part using an epoxy molding compound (EMC), and the step of forming the connection conductor is a step of forming the connection conductor through copper plating.
10. The method of claim 9,
And forming an external connection terminal on the connecting conductor.
10. The method of claim 9, wherein preparing the substrate further comprises:
Preparing a substrate on which an electrolytic plating wiring is formed on at least one surface of the substrate,
Wherein forming the connecting conductor comprises forming the connecting conductor by electroplating.
10. The method of claim 9, wherein preparing the substrate further comprises:
Forming the mounting electrode and the external connection electrode; And
Forming the insulating protective layer so that a part or the whole of the electrode for external connection is exposed;
≪ / RTI >
17. The method of claim 16, wherein forming the insulating protective layer comprises:
Forming an insulating protective layer on the electrode for external connection, and forming a groove in the insulating protective layer to partially expose the electrode for external connection.
[18] The method of claim 17,
Wherein the electronic device module is formed in a ring shape or a container shape.
18. The method of claim 17, wherein forming the via-
And exposing the external connection electrode to an area smaller than the groove formed in the insulating protection layer.
KR1020140147111A 2014-07-04 2014-10-28 Manufacturing method of electronic component modul KR101922873B1 (en)

Priority Applications (2)

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US14/732,550 US10356911B2 (en) 2014-07-04 2015-06-05 Electronic device module and method of manufacturing the same
CN201510387300.4A CN105244327B (en) 2014-07-04 2015-07-03 Electronic apparatus module and its manufacture method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140083834 2014-07-04
KR20140083834 2014-07-04

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Publication number Priority date Publication date Assignee Title
JP4329884B2 (en) * 2007-11-20 2009-09-09 株式会社村田製作所 Built-in module

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