KR20160010246A - Electric component module and manufacturing method threrof - Google Patents

Electric component module and manufacturing method threrof Download PDF

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Publication number
KR20160010246A
KR20160010246A KR1020140119231A KR20140119231A KR20160010246A KR 20160010246 A KR20160010246 A KR 20160010246A KR 1020140119231 A KR1020140119231 A KR 1020140119231A KR 20140119231 A KR20140119231 A KR 20140119231A KR 20160010246 A KR20160010246 A KR 20160010246A
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KR
South Korea
Prior art keywords
mold part
substrate
forming
plating
electronic device
Prior art date
Application number
KR1020140119231A
Other languages
Korean (ko)
Inventor
오규환
유도재
류종인
임재현
Original Assignee
삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to US14/724,740 priority Critical patent/US20160021737A1/en
Priority to CN201510424692.7A priority patent/CN105280624A/en
Publication of KR20160010246A publication Critical patent/KR20160010246A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate

Abstract

The present invention relates to an electric device module capable of forming an external terminal in a mold part, and a manufacturing method thereof. For this, the electronic device module according to the embodiment of the present invention, may include a substrate which has at least one external connection electrode and a plated wire extended from the external connection electrode by a constant distance; at least one electronic device mounted on the substrate; and a mold part for sealing the electronic device; and a plurality of connection conductors which are extended from the external connection electrode, and penetrate the mold part to be arranged in the mold part.

Description

[0001] ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THREROF [0002]

The present invention relates to an electronic device module capable of disposing an external terminal on the outside of a mold part and a method of manufacturing the same.

In order to realize miniaturization and weight reduction of electronic devices, not only a technique of reducing the individual size of the mounting parts but also a system on chip (SOC) technique of making a plurality of individual elements into one chip or a plurality of individual (SIP) technology, which is a system for integrating devices into one package.

In addition, a structure for mounting electronic components on both sides of a substrate and a structure for forming external terminals on both sides of the package have also been developed in order to manufacture an electronic device module having a small size and high performance.

Japanese Patent No. 4840508

An object of the present invention is to provide an electronic device module in which an external terminal is formed in a molded part of an electronic device module.

It is another object of the present invention to provide a method of manufacturing an electronic device module that forms a connecting conductor in a mold portion of an electronic device module through a plating process.

An electronic device module according to an embodiment of the present invention includes a substrate having at least one electrode for external connection and a plating line extending a certain distance from the electrode for external connection, at least one electronic device mounted on the substrate, And a plurality of connection conductors extending from the external connection electrode and disposed in the mold portion in such a manner as to penetrate the mold portion.

According to another aspect of the present invention, there is provided a method of manufacturing an electronic device module, comprising: preparing a substrate having a plating wire on one surface thereof; mounting at least one device on the substrate; forming a mold part by sealing the device; Forming a via hole in the mold portion, and forming a connection conductor in the via hole by a plating method through the plating line.

In the electronic element module according to the present invention, electronic elements are mounted on both sides of a substrate, and all the electronic elements are sealed by a mold part. Therefore, many devices can be mounted in one electronic device module while easily protecting them from the outside.

Further, since the connecting conductor is formed in the mold part through the plating method, the manufacturing is easy. In addition, since the plating line can be completely embedded in the electronic device module if necessary, it is also possible to prevent the electric field from concentrating around the plating line.

FIG. 1A is a perspective view schematically showing an electronic device module according to an embodiment of the present invention. FIG.
FIG. 1B is a bottom perspective view of the electronic device module shown in FIG. 1A; FIG.
2 is a cross-sectional view of the electronic device module shown in Fig.
3 is a partially enlarged cross-sectional view showing an enlarged view of a portion A in Fig.
4 is a plan view of the substrate shown in Fig.
5A to 5J are views for explaining a manufacturing method of the electronic device module shown in FIG. 1A;
5K to 5N are views for explaining a method of manufacturing an electronic device module according to another embodiment of the present invention.
6A is a perspective view schematically showing an electronic device module according to another embodiment of the present invention.
FIG. 6B is a bottom perspective view of the electronic device module shown in FIG. 6A. FIG.
7 is a cross-sectional view of the electronic device module shown in Fig.
8 is a partially enlarged cross-sectional view showing an enlarged view of a portion A in Fig.
9 is a plan view of the substrate shown in Fig.
10A to 10J are views for explaining a manufacturing method of the electronic element module shown in Fig. 6A. Fig.
11 is a bottom perspective view schematically showing an electronic device module according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. In addition, the shape and size of elements in the figures may be exaggerated for clarity.

FIG. 1A is a perspective view schematically showing an electronic device module according to an embodiment of the present invention, and FIG. 1B is a bottom perspective view of the electronic device module shown in FIG. 1A. FIG. 2 is a cross-sectional view of the electronic device module shown in FIG. 1A, FIG. 3 is a partially enlarged cross-sectional view showing an enlarged portion A of FIG. 2, and FIG. 4 is a plan view of the substrate shown in FIG. Here, FIG. 4 shows a state in which electronic elements are mounted, and FIG. 2 shows a cross section corresponding to CC in FIG.

1A to 4, an electronic device module 100 according to the present embodiment includes an electronic device 1, a substrate 10, a mold portion 30, a connecting conductor 20, and an external terminal 28. [ As shown in FIG.

The electronic device 1 includes various devices such as an active device 1a and a passive device 1b, and any device that can be mounted on a substrate can be used as the electronic device 1. [

The electronic device 1 may be mounted on one or both surfaces of a substrate 10 described below. The electronic devices 1 may be arranged in various forms on both sides of the substrate 10 according to the size and shape of the electronic devices 1 and the design of the electronic device module 100. [

The electronic devices 1 may be mounted on the substrate 10 in the form of a flip chip or may be electrically bonded to the substrate 10 via a bonding wire 2.

Substrate 10 may be any of a variety of substrates (e.g., ceramic substrates, printed circuit boards, flexible substrates, etc.) well known in the art and may include at least one electronic element 1 on at least one side Can be mounted.

A plurality of electrodes 13 and 16 may be formed on one surface or both surfaces of the substrate 10. Here, the electrode may include a plurality of mounting electrodes 13 for mounting the electronic device 1 and a plurality of external connection electrodes 16 to which the external terminals are electrically connected. The external connection electrode 16 is provided to be electrically connected to a connection conductor 20 to be described later and is connected to the external terminal 28 through the connection conductor 20.

The substrate 10 according to this embodiment may be a multilayer substrate formed of a plurality of layers, and a circuit pattern 15 for forming an electrical connection may be formed between the respective layers. The substrate 10 according to the present embodiment may include conductive vias 14 electrically connecting the electrodes 13 and 16 and the circuit patterns 15 formed in the substrate 10.

On the other hand, a plating line 17 used for electrolytic plating may be formed on at least one surface of the substrate 10. The plating line 17 can be used in the process of forming the connection conductor 20 to be described later by electrolytic plating.

The plating line 17 is used to form a connecting conductor 20 to be described later, which will be described in more detail in the following manufacturing method.

The plating line 17 may be formed in the form of a wiring pattern extending linearly and a predetermined distance from each of the external connection electrodes 16. At this time, each of the plating lines 17 may be arranged to face the outer direction of the substrate 10, but is not limited thereto.

The mold part 30 may include a first mold part 31 formed on the upper surface of the substrate 10 and a second mold part 35 formed on the lower surface of the substrate 10. [

The mold part 30 seals the electronic elements 1 mounted on both sides of the substrate 10. It is also possible to prevent an electrical short between the electronic elements 1 from being generated by filling between the electronic elements 1 mounted on the substrate 10 and to prevent the electronic elements 1 from being electrically short- (1) is fixed on a substrate to safely protect the electronic elements (1) from external impacts.

The mold part 30 according to the present embodiment is formed of an insulating material including a resin material such as an EMC (Epoxy Molding Compound). However, the present invention is not limited thereto.

The first mold part 31 according to the present embodiment is formed to cover the entire one surface of the substrate 10. In this embodiment, all the electronic elements 1 are completely embedded in the first mold part 31 as an example. However, the present invention is not limited to this, and at least one of the electronic elements 1 to be embedded in the first mold part 31 may be partially exposed to the outside of the first mold part 31, Application is possible.

The second mold part 35 is formed on the lower surface of the substrate 10, and at least one connecting conductor 20 is formed therein.

The second mold part 35 may be formed in such a manner as to completely embed the electronic devices 1 in the same manner as the first mold part 31. However, It is also possible to do.

The connecting conductor 20 is arranged to be bonded to the electrode 16 for external connection of the substrate 10 and has one end bonded to the substrate 10 and connected to the external terminal 28. Therefore, the connection conductor 20 is formed in the mold part 30 in such a manner as to penetrate the mold part 30. [

The connection conductors 20 may be formed of a conductive material, and may be formed of copper, gold, silver, aluminum, or an alloy thereof.

The connecting conductor 20 according to this embodiment may be formed of the same material as the electrodes 13 and 16. Specifically, the connection conductor 20 is formed of the same material as the external connection electrode 16 to which the connection conductor 20 is connected.

Therefore, when the external connection electrode 16 is formed of copper (Cu), the connection conductor 20 is also formed of copper (Cu), and the connection conductor 20 and the external connection electrode 16 are made of the same material .

In this case, since a different dissimilar metal such as nickel (Ni) or gold (Au) is not interposed between the external connection electrode 16 and the connection conductor 20, the coupling reliability between the external connection electrode 16 and the connection conductor 20 can be increased.

The connection conductor 20 according to the present embodiment may be formed in a shape similar to a cone having one end, that is, a horizontal cross-sectional area smaller toward the substrate 10 side. However, the present invention is not limited thereto, and can be modified into various shapes as long as the horizontal cross-sectional area of the substrate 10 side can be formed smaller than the horizontal cross-sectional area of the outer surface side of the mold portion 30. [

The external terminal 28 may be bonded to the other end of the connection conductor 20. The external terminal 28 electrically and physically connects the electronic element module 100 and a main board (not shown) on which the electronic element module 100 is mounted. The external terminal 28 may be formed in various shapes such as a bump or a solder ball.

The other end of the connecting conductor 20 may be recessed inwardly of the second mold part 35 as shown in Fig. And a part of the external terminal 28 flows into the via hole 37 to fill the remaining space. In this case, since a part of the external terminal 28 is inserted into the via-hole 37 in the form of a protrusion, the bonding force between the junction conductor 10 and the mold part 35 can be increased.

However, the present invention is not limited to this. The other end of the connection conductor 20 may protrude outwardly from the second mold part 35, or may be formed in a flat shape parallel to one surface of the substrate 10 Various variations are possible.

In this embodiment, the case where the connecting conductor 20 is formed only in the second mold part 35 is taken as an example. However, the structure of the present invention is not limited thereto, and it is possible to form the first mold part 31 in the first mold part 31 as needed.

Such a connection conductor 20 is not formed in the substrate 10 but is provided in the second mold section 35 for connecting the substrate 10 and the external terminal 28. Therefore, it can be formed in a size corresponding to the external terminal 28 or the electrode 16 for external connection of the substrate 10.

More specifically, the via hole 37 according to the present embodiment may be formed to have a depth of 200 mu m or more. 3, the depth H of the via hole 37 may be the same or larger than the maximum width (W, or diameter) of the via hole 37.

For example, the height H of the via-hole 37 may be formed to be 1 to 2 times the maximum width W of the via-hole 37. That is, when the maximum width W of the via-hole 37 is 200 占 퐉, the height H of the via-hole 37 may be 200 占 퐉 to 400 占 퐉. In this embodiment, the case where the width W of the via hole 37 is 300 mu m and the height H is 500 mu m is taken as an example.

On the other hand, when the height (length) of the connecting conductor 20 is formed smaller than the depth of the via hole 37 as in the present embodiment, the overall size of the connecting conductor 20 is slightly smaller than the overall size of the via hole 37 .

However, the present invention is not limited to this. When the connecting conductor 20 is completely filled and formed in the via hole 37, the connecting conductor 20 may be formed to have the same size as the via hole 37.

The connecting conductor 20 according to the present embodiment is formed by plating. However, as described above, the connection conductor 20 according to the present embodiment may have a large size and a long length as compared with a general conductive via formed on the substrate 10, which may result in a very long plating time.

To this end, the connecting conductor 20 according to the present embodiment is formed through electrolytic plating only, omitting the electroless plating. This will be described in more detail in the following manufacturing method.

In the electronic element module 100 according to the present embodiment described above, the electronic elements 1 are mounted on both sides of the substrate 10. The substrate 10 and the external connection terminal 28 are electrically connected by the connection conductor 20 disposed on the lower surface of the substrate 10. [

Accordingly, a plurality of electronic devices 1 can be mounted on one substrate, and the degree of integration of the devices can be increased.

3 and 4, the electronic device module 100 according to the present embodiment is formed by extending a plating line 17 on an electrode 16 for external connection formed on a substrate 10. This is a component that is added when the connection conductor 20 is formed by a plating method and is a component that is necessarily included when the electronic device module 100 is manufactured according to a manufacturing method described later.

Next, a method of manufacturing an electronic device module according to this embodiment will be described.

5A to 5J are cross-sectional views illustrating a method of manufacturing the electronic device module shown in FIG. 1A.

First, the step of preparing the substrate 10 is performed as shown in Figs. 5A and 5B. As described above, the substrate 10 may be a multilayer substrate having a top surface T and a bottom surface B, and the mounting electrodes 13 may be formed on both surfaces (not shown in FIG. 5B). At least one electrode 16 for external connection may be formed on the lower surface (B).

Further, the substrate 10 according to this embodiment has a plating line 17 extending from the electrode 16 for external connection. The plating line 17 may be arranged so as to extend toward the outside of the element mounting region as described above.

The substrate 10 prepared in this step may be a substrate having a plurality of the same mounting regions P repeatedly arranged in a rectangular or long strip shape having a large area. Therefore, the substrate and the substrate strip will be described below in combination.

This substrate strip 10 is for forming a plurality of electronic device modules simultaneously. A plurality of individual module mounting areas P are separated on the substrate strip 10, and a plurality of individual module mounting areas P ) Can be manufactured.

in this case. The plating pattern 18 may be formed along the individual module mounting area P. [ The plating pattern 18 is formed along the periphery of the individual module mounting area P and is electrically connected to the plating lines 17.

The plating pattern 18 may be electrically connected to the outside through a jig or the like to supply current to the plating line 17. [ However, the present invention is not limited thereto.

Then, a step of mounting the electronic element 1 on the upper surface of the substrate 10 as shown in Fig. 5C is performed. In this step, a solder paste is printed on a mounting electrode 13 formed on a top surface of a substrate 10 by a screen printing method or the like, and the electronic elements 1 are placed thereon, And then applying heat through a reflow process to melt and cure the solder paste.

However, the present invention is not limited to this configuration. The electronic element 1 may be mounted on the upper surface of the substrate 10, and then the mounting electrode 13 and the electronic element 1 May be performed through a process of electrically connecting the electrodes of the organic EL element.

In this step, the same electronic elements 1 may be mounted in the same arrangement in each individual module mounting area P.

Subsequently, a step of forming the first mold part 31 on the upper surface of the substrate 10 as shown in FIG. 5D is performed.

In this step, after the substrate 10 on which the electronic element 1 is mounted is placed in a mold (not shown), the first mold part 31 can be formed by injecting molding resin into the mold. The electronic elements 1 mounted on one surface or upper surface of the substrate 10 can be protected from the outside by the first mold portion 31.

5D, the first mold part 31 may be formed separately for each of the individual mounting areas P, but may be integrally formed so as to cover the entire individual mounting areas P of the substrate strip 10 It is also possible.

Then, as shown in Fig. 5E, the step of mounting the electronic elements 1 on the lower surface of the substrate 10 is performed. In this step, a solder paste is printed on the mounting electrodes 13 on the lower surface of the substrate 10 through a screen printing method, etc., and the electronic elements 1 are placed thereon, And then curing the solder paste.

Next, a step of forming a second mold part 35 on the lower surface of the substrate 10 as shown in FIG. 5F is performed. This step may also be performed by disposing the substrate 10 in the mold, and then injecting the molding resin into the mold.

Then, a via hole 37 is formed in the second mold part 35 as shown in Fig. 5G. The via hole 37 may be formed through a laser drill method.

The electrode 16 for external connection of the substrate 10 is exposed to the outside through the via hole 37. The via hole 37 may be formed in a conical shape having a smaller horizontal cross-sectional area toward the substrate 10 side. However, the present invention is not limited thereto.

In the meantime, the via hole 37 according to the present embodiment is not formed in the form of a through hole, but is formed as a blind via hole with one end clogged by the substrate 10.

As described above, the via hole 37 according to the present embodiment may be formed to have a size corresponding to the external terminal 28 or the electrode 16 for external connection of the substrate 10.

More specifically, the via hole 37 according to the present embodiment can be formed to a depth of 200 mu m or more. This is a size derived in consideration of the mounting height of the electronic elements 1 to be embedded in the second mold part 35. [

Therefore, when the mounting height of the electronic elements 1 is larger or smaller, the thickness of the mold portion 35 sealing them can be made larger or smaller, and the via hole (not shown) passing through the mold portion 35 37 may be changed corresponding to the thickness of the molded part 35. [

The depth of the via hole 37 may be 1 to 2 times larger than the maximum width (or maximum diameter) of the via hole 37.

For example, the via hole 37 according to the present embodiment may be formed to have a maximum diameter of 300 mu m and a depth of 500 mu m. However, the present invention is not limited thereto.

Subsequently, a connecting conductor 20 is formed in the via hole 37, as shown in Figs. 5H and 5I. When the connecting conductor 20 is formed of copper (Cu), copper plating can be performed. In addition, the plating process may be performed by electrolytic plating only.

More specifically, as shown in FIG. 5I, the metal frame 70 is first placed on the substrate 10 and brought into contact with the plating pattern 18. When a current is applied to the metal frame 70, a current is applied to the electrode for external connection (16 in Fig. 5H) through the plating pattern 18 and the plating line 17 in contact with the metal frame 70 Plating proceeds on the electrode 16 for external connection.

In FIG. 5I, the metal frame 70 is formed as a rod-shaped flat metal plate, but the present invention is not limited thereto. For example, a metal frame can be realized by a mesh having a mesh shape or a lattice shape, and various modifications are possible as needed.

The plating process according to the present embodiment grows a conductive material from the external full-speed electrode 16. Thus, the conductive material is filled in the via hole 37 sequentially and finally formed into the connecting conductor 20.

As described above, the via hole 37 according to the present embodiment is relatively large in size as compared with the conductive via formed in the substrate 10. Therefore, when the electroless plating is performed and the electroplating is performed, the conductor grows from the side wall of the via hole 37 toward the center. Since the growth speed is higher than that of the conductor growing at the bottom of the via hole 37 (that is, the terminal for external connection), voids are likely to be formed inside the connection conductor 20.

In addition, since the size of the via hole 37 is large, if the inside of the via hole 37 is plated by electroless plating, the time required for the plating process is greatly increased and the yield is reduced.

Therefore, the manufacturing method according to the present embodiment forms the connection conductor 20 by electrolytic plating only, without electroless plating.

Also, as described above, the mold unit 30 according to the present embodiment may be formed of an epoxy mold compound (EMC). It is generally known that the surface of EMC, a thermosetting resin, is not easily plated, that is, the joining of metals.

Therefore, the manufacturing method according to the present embodiment uses a mechanical interlocking (hooking, anchoring theory) or an anchoring effect to plate the conductor on the EMC surface. This means that the adhesive penetrates into the irregular structure (irregularity) of the surface of the adherend and is bonded by mechanical engagement.

That is, in the manufacturing method according to the present embodiment, the inner surface (37a of eh 5h) of the via hole 37 formed by EMC is made as rough as possible and the plating material is applied to the inner surface of the via hole 37 37a.

For this, in the present embodiment, the inner surface roughness (or roughness) of the via hole 37 is increased as much as possible in the process of forming the via hole 37 by using the laser, thereby forming an irregular and rough surface structure . Here, the surface roughness can be increased by controlling the type of laser, the spot size, and the power of the laser.

Even if the molded portion 30 is formed of EMC material, the interconnection between the connection conductors 20 and the inner surfaces of the via holes 37 can be easily formed.

On the other hand, in order to increase the bonding force between the connection conductor 20 and the mold part 30, after various catalyst metals such as gold, platinum, and palladium are firstly disposed in the area to be plated, Do.

In addition, the surface of the external connection electrode 16 exposed to the inside of the via hole 37 can be partially etched to minimize the influence of the impact generated in the electrode 16 for external connection due to laser irradiation.

Finally, a step of cutting the substrate strip 10 on which the mold part 30 is formed to form the individual electronic element module 100 is performed.

This step may be performed by cutting the mold part 30 and the substrate 10 along the cutting line Q shown in Fig. 5J.

As a result, the plating pattern 18 formed on the substrate strip 10 is removed and only the plating lines 17 are left on the substrate 10. The plating lines 17 are exposed to the outside of the mold part 30 through the cut surface of the substrate strip 10.

On the other hand, in the operation of the electronic device module, the plating lines 17 are unnecessary, but these plating lines 17 are inevitably left behind as the connecting conductor 20 is formed in the mold portion 30 by the plating process. Therefore, it can be seen that the electronic device module according to this embodiment through the plating lines 17 left on the substrate 10 has formed the connecting conductor 20 by the plating method.

Although not shown, a step of forming an external terminal (28 in Fig. 3) may be performed at the end of the connecting conductor 20 before or after the step of cutting the substrate strip 10. Here, the external terminal 28 may be formed in various forms such as a bump, a solder ball, a pad, etc., and may be omitted if necessary.

Through the above process, the electronic device module 100 according to the present embodiment shown in FIG. 1A can be completed.

Meanwhile, the method of manufacturing an electronic device module according to the present invention is not limited to the above-described embodiments, and various modifications are possible.

5K to 5N are views for explaining a method of manufacturing an electronic device module according to another embodiment of the present invention.

First, referring to FIG. 5K, a method for manufacturing an electronic device module according to the present embodiment prepares a substrate 10. The substrate 10 prepared in this step may be a substrate 10 having a plurality of the same mounting regions P repeatedly arranged thereon and a rectangular substrate 10 having a large area.

The external connection electrodes 16 are exposed to the outside of the substrate 10 according to the present embodiment and the plating lines 17 and the plating pattern 18 are not formed on the outside, (10).

In addition, a plating pad 18a is formed on one side of the substrate 10. The plating pad 18a is electrically connected to the plating pattern 18 of the substrate 10 and connected to an external conductive member for applying an electric current to the substrate during the plating process.

Therefore, the plating pattern 18 and the plating pad 18a can be electrically connected by an interlayer via (not shown). Further, the electrodes 16 for external connection and the plating lines 17 are electrically connected to each other by interlayer vias (14a in Fig. 5n).

In addition, the plating pattern 18 can be formed in one line between the two individual mounting regions P arranged adjacent to each other. That is, all of the two individual mounting area (P) plating lines 17 can be electrically connected to one plating pattern 18.

Then, as shown in FIG. 51, an electronic element is mounted on the substrate 10, and a mold part 30 is formed. 5n) is mounted on one surface of the substrate 10 similarly to the above-described embodiment, and then the first mold portion (31 of Fig. 5n) is formed, and then the other surface of the substrate 10 (1 in Fig. 5n) is mounted on the first mold portion (35 in Fig. 5n) and then the second mold portion (35 in Fig. 5n) is formed.

The first mold part 31 and the second mold part 35 are simultaneously formed on both surfaces of the substrate 10 after the electronic element 1 is mounted on both surfaces of the substrate 10 It is also possible to do.

In this embodiment, the second mold portion 35 may be formed separately for each of the individual mounting regions P similarly to the above-described embodiment, but it is also possible to cover the entire individual mounting region of the substrate 10 as shown in FIG. As shown in Fig. This is because the plating line 17 and the plating pattern 18 according to the present embodiment are formed inside the substrate 10 so that even if the second mold part 35 is integrally formed, The current can be applied.

Then, a via hole is formed in the second mold part 35 as shown in FIG. 5M, and then the connection conductor 20 is formed through electrolytic plating. And forms an external terminal (28 in Fig. 5n). Since these steps can be performed in the same manner as the above-described embodiment, a detailed description thereof will be omitted.

Meanwhile, in this step, the electroplating may be performed by electrically connecting the plating pad 18a of the substrate 10 to the outside. The plating pad 18a may be electrically connected to the outside through a conductive member such as a jig or a forceps, or a conductive wire, but is not limited thereto.

The current applied to the plating pad 18a is supplied to the electrode 16 for external connection along the plating pattern 18 and the plating line 17 formed in the substrate 10 and the interlayer via 14a. Thus, the connection conductor 20 can be formed on the electrode 16 for external connection through electrolytic plating.

Finally, the substrate 10 on which the mold part 30 is formed is cut to form the electronic element module 400 shown in FIG. 5N.

This step may be performed by cutting the mold part 30 and the substrate 10 along the outline of the plating pattern 18 shown in FIG. 5K.

Thus, the plating pattern 18 formed inside the substrate 10 is removed and only the plating lines 17 are left on the substrate 10. The plating lines 17 are exposed to the outside of the substrate 10 through the cut surface of the substrate 10, and are electrically separated from each other.

The electronic element modules 100 and 400 according to the present embodiment described above can be manufactured by mounting the electronic elements 1 on both sides of the substrate 10, do. Therefore, many elements can be mounted in one electronic device module 100 and easily protected from the outside.

Further, the connection conductor 20 is formed on the mold part 30 through the plating method, and then connected to the external terminal 28. Therefore, the conductor path connecting the substrate 10 to the outside and the circuit wiring can be easily implemented even in the double-sided molding structure or the package stack structure.

The present invention is not limited to the above-described embodiments, and various modifications are possible.

The embodiments described below are configured similarly to the above embodiment, and have a difference in the configuration of the mold part or the plating line. Therefore, detailed description of the same or similar components to those of the above-described embodiment will be omitted, and differences will be mainly described.

FIG. 6A is a perspective view schematically showing an electronic device module according to another embodiment of the present invention, and FIG. 6B is a bottom perspective view of the electronic device module shown in FIG. 6A. 7 is a cross-sectional view of the electronic device module shown in FIG. 6A, FIG. 8 is a partially enlarged cross-sectional view of the portion A of FIG. 7, and FIG. 9 is a plan view of the substrate shown in FIG. Here, FIG. 9 shows a state in which electronic elements are mounted for convenience of explanation, and FIG. 8 shows a cross section corresponding to CC in FIG.

6A to 9, an electronic device module 200 according to the present embodiment includes an electronic device 1, a substrate 10, a mold portion 30, a connecting conductor 20, and an external terminal 28. [ As shown in FIG.

The electronic device 1 can be configured in the same manner as in the above-described embodiment. Therefore, a detailed description thereof will be omitted.

The substrate 10 is entirely configured similarly to the above-described embodiment, and has a difference in the configuration of the plating line 17.

In the substrate 10 according to the present embodiment, at least one plating line 17 is connected to each of the external connection electrodes 16.

The plating line 17 is used to form a connecting conductor 20 to be described later, which will be described in more detail in the following manufacturing method.

The plating line 17 may be formed in the form of a wiring pattern extending linearly and a predetermined distance from each of the external connection electrodes 16. At this time, each of the plating lines 17 may be disposed so as to face the outward direction of the substrate 10, but the present invention is not limited thereto.

The plating line 17 according to the present embodiment is formed only in the substrate 10 and is not exposed to the side of the substrate 10, that is, the outside of the electronic device module 200.

When the plating line 17 is exposed to the outside of the substrate 10, the electromagnetic wave may flow in or out through the exposed plating line 17. [ The electric field can also be concentrated along the exposed portions.

The electronic element module 200 according to the present embodiment is configured such that the plating line 17 is formed only inside the substrate 10 and is completely covered by the mold portion 30. [ Therefore, the plating line 17 is not exposed to the outside.

Such a configuration can be realized by a manufacturing method according to an embodiment of the present invention, which will be described later.

The mold part 30 may include a first mold part 31 formed on the upper surface of the substrate 10 and a second mold part 35 formed on the lower surface of the substrate 10. [

The mold part 30 according to the present embodiment is formed of an insulating material including a resin material such as an EMC (Epoxy Molding Compound). However, the present invention is not limited thereto.

The first mold part 31 is formed to cover the entire one surface of the substrate 10.

The second mold part 35 is formed on the lower surface of the substrate 10, and a connecting conductor 20 is formed inside.

Also, the second mold part 35 according to the present embodiment can be divided into an inner mold part 35a and an outer mold part 35b.

The inner mold part 35a embeds the electronic elements 1 and the connection conductors 20 mounted on the lower surface of the substrate 10. [ The outer mold part 35b is disposed outside the inner mold part 35a.

The outer mold part 35b is provided for filling the plating line 17 described above. Therefore, the outer mold part 35b may be formed to have a width enough to cover the plating line 17 completely.

The connecting conductor 20 can also be constructed in the same manner as in the above-described embodiment. Therefore, a detailed description thereof will be omitted.

In the electronic device module 200 according to the present embodiment configured as above, the plating line 17 is formed only inside the electronic device module 200 without being exposed to the outside. This can be realized through the manufacturing method according to this embodiment.

Since the plating line 17 is not exposed to the outside of the electronic element module 200, it is possible to prevent the electromagnetic waves from flowing into / out from the exposed plating line 17 or concentrating the electric field along the exposed portion have.

Next, a method of manufacturing the electronic element module according to the present embodiment will be described.

10A to 10J are cross-sectional views illustrating a method of manufacturing the electronic device module shown in FIG. 6A.

First, a step of preparing the substrate 10 as shown in Figs. 10A and 10B is performed. As described above, the substrate 10 may be a multilayer substrate, and the mounting electrodes 13 may be formed on both sides (not shown in Fig. 10B). And an electrode 16 for external connection may be formed on the lower surface B. [

Further, the substrate 10 according to this embodiment has a plating line 17 extending from the electrode 16 for external connection. The plating line 17 may be arranged so as to extend toward the outside of the substrate 10 as described above.

Meanwhile, the substrate 10 prepared in this step may be a substrate in which a plurality of the same mounting regions P are repeatedly arranged, and a rectangular or long strip type substrate having a large area.

This substrate 10 is for forming a plurality of electronic device modules simultaneously. A plurality of individual module mounting areas P are divided on the substrate 10, and a plurality of individual module mounting areas P An electronic device module can be manufactured.

At least one through hole 11 may be formed in the substrate strip 10. The through holes 11 are formed in the space between the individual module mounting areas P and are formed along the boundary between the individual module mounting areas P.

The through hole 11 is used as a passage through which the molding resin moves in the process of forming the mold section 30 described later. This will be described later.

Then, a step of mounting the electronic element 1 on one surface, that is, the bottom surface B of the substrate 10, as shown in Fig. 10C, is performed. In this step, solder paste is printed on the mounting electrodes 13 formed on the lower surface B of the substrate 10 through a screen printing method or the like, and the electronic elements 1 are placed thereon , And then applying heat through a reflow process to melt and cure the solder paste.

The electronic device 1 is mounted on the lower surface B of the substrate 10 and then the mounting electrode 13 formed on the substrate 10 by using the bonding wire 2 and the electronic device 1) may be electrically connected to each other.

In this step, the same electronic elements 1 may be mounted in the same arrangement in each individual module mounting area P.

Subsequently, a step of forming a part of the second mold part 35, that is, the inner mold part 35a, is performed on one surface of the substrate 10 as shown in Fig. 10D.

In this step, the inner mold part 35a can be formed by disposing the substrate 10 on which the electronic element 1 is mounted in a mold (not shown), and then injecting the molding resin into the mold. As the inner mold part is formed, the electronic elements 1 mounted on the lower surface B of the substrate 10 can be protected from the outside by the inner mold part 35a.

Meanwhile, the second mold part 35 according to the present embodiment is formed for each individual module mounting area P, and is formed such that all of the through holes 11 are exposed. Therefore, the inner mold portion 35a is formed in the inner region defined by the through holes 11. [

The inner mold part 35a formed in this step is a part of the second mold part 35 and not the whole of the second mold part 35. The outer mold part which is the remaining part of the second mold part 35, In the process of forming the first mold part 31.

In addition, the inner mold part 35a formed in this step is formed in a size and shape such that the plating line 17 can be exposed to the outside of the inner mold part 35a. Therefore, after the inner mold part 35a is formed in this step, the plating lines 17 are exposed in such a manner that the ends of the plating lines are protruded to the outside of the inner mold part 35a.

Then, as shown in Fig. 10E, a via hole 37 is formed in the inner mold portion 35a. The via hole 37 may be formed using a laser drill.

The electrode 16 for external connection of the substrate 10 is exposed to the outside through the via hole 37. Meanwhile, as shown in FIG. 8, the via hole 37 may be formed in a conical shape having a smaller horizontal cross-sectional area toward the substrate 10 side. However, the present invention is not limited thereto.

Subsequently, the connection conductor 20 is formed in the via hole 37 through a plating method.

When the connecting conductor 20 is formed of copper (Cu), copper plating can be performed. Here, the plating process may be performed by electrolytic plating only.

More specifically, as shown in Fig. 10F, the metal frame 70 is first placed on the substrate 10 and brought into contact with the plating line (17 in Fig. 10E). When a current is applied to the metal frame 70, current is applied to the electrode for external connection (16 in FIG. 10B) through the plating line 17 electrically connected to the metal frame 70, ). ≪ / RTI >

The plating process proceeds from the external full-speed electrodes 16 sequentially filling the via holes 37 to finally form the connection conductors 20.

Then, a step of mounting the electronic elements 1 on the top surface T of the substrate 10 is performed as shown in Fig. 10G. In this step, a solder paste is printed on a mounting electrode (13 in FIG. 10A) through a screen printing method or the like, and the electronic elements 1 are placed thereon, and then a reflow process And then melting and curing the solder paste.

Next, a step of forming the first mold part 31 on the upper surface T of the substrate 10 is performed as shown in Fig. 10H. This step may be performed by disposing the substrate 10 in the mold, and then injecting the molding resin into the mold, as in the case shown in Fig. 10D.

The molding resin injected into the mold flows into the lower surface B of the substrate 10 through the through hole 11 as well as the upper surface T of the substrate 10 in this process.

Therefore, the molding resin is formed by forming the first mold part 31 on the upper surface T of the substrate 10 and forming the inner mold part 31 formed on the lower surface B of the substrate 10 as shown in Fig. And is filled along the circumference of the portion 35a to complete the outer mold portion 35b.

In this process, the further formed outer mold part 35b is formed so as to cover the plating line (17 in Fig. 10E) formed on the substrate 10. Therefore, the plating line 17 exposed on the lower surface of the substrate 10 is completely buried by the further formed outer mold portion 35b.

Finally, a step of cutting the substrate strip 10 on which the mold part 30 is formed to form the individual electronic element module 200 is performed.

This step may be performed by cutting the mold part 30 and the substrate 10 along the cutting line Q shown in Fig. 10J.

At this time, the cutting line Q is defined such that the plating line 17 according to the present embodiment is not exposed to the cut surface. For example, the cutting line Q may be formed between the through hole 11 and the plating line 17, or may be formed so as to partially share the inner wall of the through hole 11.

Accordingly, the electronic device module can be separated from the plating line 17 without being exposed to the outside, but completely embedded in the mold part 30. [

Although not shown, a step of forming an external connection terminal (28 in Fig. 3) may be performed at the end of the connection conductor 20 before or after the step of cutting the substrate strip 10. Here, the external terminals 28 may be formed in various forms such as bumps, solder balls, and pads.

Through the above process, the electronic device module 200 according to the present embodiment shown in FIG. 6A can be completed.

On the other hand, when the problem caused by the plating line exposed to the outside is negligibly small, the outer mold portion may be omitted so that a part of the plating line is exposed to the outside. In this case, the mold part may include only the inner mold part, or may include only the inner mold part and the first mold part.

11 is a bottom perspective view schematically showing an electronic device module according to another embodiment of the present invention.

Referring to FIG. 11, the electronic device module 300 according to the present embodiment includes a mold part (inner mold part) formed in the first molding process and a mold part formed in the second molding process And the outer mold part) are made different from each other.

The first mold part 31 formed on the upper surface of the substrate 10 is formed of the same material as the first mold part 35 and the second mold part 35 formed on the lower surface of the substrate 10 is formed on the inner mold part 35a, And the outer mold part 35b are made of different materials. The first mold part 31 and the outer mold part 35b of the second mold part 35 are formed of the same material.

As described above, the electronic device module according to the present embodiment can be modified into various forms.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be obvious to those of ordinary skill in the art.

100, 200, 300, 400: electronic device module
1: Electronic device
10: substrate
16: Electrode for external connection
17: Plating line
18: pattern for plating
20: connection conductor
28: External terminal
30: Mold part
31: first mold part
35: second mold part
37: via hole

Claims (35)

A substrate having at least one external connection electrode and a plating line extended from the external connection electrode by a predetermined distance;
At least one electronic device mounted thereon;
A mold part sealing the electronic device; And
A plurality of connection conductors extending from the external connection electrode and disposed in the mold part in such a manner as to penetrate the mold part;
.
The mold according to claim 1,
Electronic device formed by EMC (Epoxy Molding Compound) module.
The electronic device module according to claim 1, wherein an end of the plating line is exposed to the outside of the substrate.
The electronic device module according to claim 1, wherein the plating line is entirely disposed in the mold part.
The connector according to claim 1,
Wherein the maximum width of the connecting conductor is 1 to 2 times the maximum width of the connecting conductor.
6. The connector according to claim 5,
An electronic device module having a height of 200 m or more.
The connector according to claim 1,
Wherein the mold part is joined to the mold part through a mechanical interlocking mechanism.
The mold according to claim 1,
Wherein the electronic device module is formed on both sides of the substrate.
The method according to claim 1,
And an external terminal connected to an end of the connecting conductor.
Preparing a substrate on which a plating line is formed;
Mounting at least one element on the substrate;
Sealing the device to form a mold part;
Forming a via hole in the mold part; And
Forming a connection conductor in the via hole by a plating method through the plating line;
≪ / RTI >
11. The method of claim 10,
A substrate strip on which a plurality of individual module mounting areas are formed,
Wherein at least one external connection terminal is formed in the individual module mounting area, a conductive pattern is formed outside the individual module mounting area, and the plating line is electrically connected to the external connection terminal Method of manufacturing device module.
12. The method of claim 11, wherein after forming the connecting conductor,
Further comprising cutting the substrate strip for each individual module mounting area, wherein the conductive pattern is removed in the cutting step.
The plating apparatus according to claim 12,
And an end of the substrate strip is exposed to the outside of the mold part through a cut surface of the substrate strip.
11. The method according to claim 10, wherein the depth of the via hole
And the width of the via hole is 1 to 2 times the maximum width of the via hole.
11. The semiconductor device according to claim 10, wherein the via-
Wherein the height of the electronic device module is 200 mu m or more.
11. The method according to claim 10, wherein forming the via-
And increasing the roughness of the inner surface of the via hole by using a laser.
11. The method of claim 10, wherein forming the connecting conductor comprises:
And forming the connection conductor by an electrolytic plating process without an electroless plating process.
11. The method of claim 10,
Wherein the substrate includes an electrode for external connection electrically connected to the plating line,
And forming the via hole includes exposing the external connection electrode to the outside via the via hole.
19. The method of claim 18, wherein forming the connecting conductor comprises:
And a current is applied to the electrode for external connection through the plating line to grow the connection conductor from the electrode for external connection to fill the inside of the via hole.
20. The method of claim 19, wherein forming the connecting conductor comprises:
And bonding the connecting conductor to an inner surface of the via hole through a mechanical interlocking mechanism.
11. The method of claim 10, wherein forming the mold comprises:
Forming the mold part by using an epoxy molding compound (EMC), and the step of forming the connection conductor is a step of forming the connection conductor through electrolytic copper plating.
11. The method of claim 10,
And forming an external terminal on the connecting conductor.
11. The method of claim 10, wherein forming the mold comprises:
And forming an inner mold part so that at least a part of the plating wire is exposed to the outside.
24. The method of claim 23, wherein forming the connecting conductor comprises:
Contacting the metal frame with a plating line exposed to the outside of the inner mold part, and then applying a current to form the connection conductor.
24. The method of claim 23, wherein after forming the connecting conductor,
And forming an outer mold part on the outer side of the inner mold part to embed the plating line in the outer mold part.
26. The mold according to claim 25,
Wherein a molding resin flows into one surface of the substrate and is formed in a process of forming a new mold part on the other surface of the substrate.
27. The method of claim 26,
Wherein at least one through hole is formed between the individual module mounting areas and the molding resin flows into one surface of the substrate through the through hole, .
Preparing a substrate on which a plating line is formed;
Mounting at least one element on one surface of the substrate;
Forming an inner mold part to seal the element and expose a part of the plating line to the outside;
Forming a via hole in the inner mold part;
Forming a connection conductor in the via hole by a plating method through the plating line; And
Forming an outer mold part on one side of the substrate such that the plating line is completely embedded;
≪ / RTI >
29. The method of claim 28, wherein forming the outer mold part comprises:
Mounting at least one element on the other surface of the substrate; And
Forming a first mold part by injecting molding resin on the other surface of the substrate;
/ RTI >
Wherein the outer mold part is formed by flowing the molding resin into one surface of the substrate.
A substrate having at least one external connection electrode and a plating line extended from the external connection electrode by a predetermined distance;
At least one electronic device mounted on one surface of the substrate;
An inner mold part sealing the element such that a part of the plating line is exposed to the outside; And
A plurality of connecting conductors extending from the electrode for external connection and disposed in the inner mold part through the inner mold part;
.
31. The method of claim 30,
And an outer mold part for filling the plating line exposed to the outside of the inner mold part.
32. The method according to claim 31, wherein the inner mold part and the outer mold part comprise:
An electronic device module formed of different materials.
32. The method according to claim 31, wherein the inner mold part and the outer mold part comprise:
An electronic device module formed of the same material.
32. The method of claim 31,
And a first mold part formed on the other surface of the substrate.
35. The method according to claim 34, wherein the outer mold part and the first mold part comprise:
An electronic device module formed of the same material.
KR1020140119231A 2014-07-17 2014-09-05 Electric component module and manufacturing method threrof KR20160010246A (en)

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US10879160B2 (en) 2018-02-01 2020-12-29 SK Hynix Inc. Semiconductor package with packaging substrate
US10950512B2 (en) 2018-02-01 2021-03-16 SK Hynix Inc. Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP4840508B2 (en) 2007-07-06 2011-12-21 株式会社村田製作所 Manufacturing method of resin substrate and component built-in substrate, and resin substrate and component built-in substrate

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP4840508B2 (en) 2007-07-06 2011-12-21 株式会社村田製作所 Manufacturing method of resin substrate and component built-in substrate, and resin substrate and component built-in substrate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10879160B2 (en) 2018-02-01 2020-12-29 SK Hynix Inc. Semiconductor package with packaging substrate
US10950512B2 (en) 2018-02-01 2021-03-16 SK Hynix Inc. Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages
US11557523B2 (en) 2018-02-01 2023-01-17 SK Hynix Inc. Semiconductor packages and methods of forming the semiconductor packages

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