KR101904927B1 - Hybrid material and method of fabricating the same - Google Patents

Abstract

One embodiment of the present invention provides a hybrid material, comprising: a first layer containing copper; a second layer containing aluminum bonded to the first layer containing the copper; a third layer containing the aluminum bonded to the second layer containing the aluminum; and an intermediate reactive layer formed between the second layer and the third layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid material,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid material and a manufacturing method thereof, and more particularly, to a hybrid material of copper and aluminum and a manufacturing method thereof.

With the rapid expansion of the high-power LED lighting market and the semiconductor-based small-sized integrated parts market, development of high-output heat-radiating materials is required. Recently, a high power type heat dissipation component that is required recently needs a structure that can maximize heat conductivity, light weight, and heat radiation performance.

Korean Patent Publication No. 10-2008-0087889 (2008.10.01)

An object of the present invention is to provide a hybrid material excellent in interfacial bonding state while ensuring a high thermal conductivity and a method for producing the same. However, these problems are exemplary and do not limit the scope of the present invention.

And provides a hybrid material according to one aspect of the present invention. Wherein the hybrid material comprises a first layer containing copper; A second layer containing aluminum bonded to the first layer containing copper; And a third layer containing aluminum bonded to the second layer containing aluminum.

The hybrid material may further include an intermediate reaction layer formed between the second layer and the third layer and serving as a bonding buffer layer or a bonding strengthening layer of the second layer and the third layer.

In the hybrid material, the intermediate reaction layer is a layer formed between the second layer and the third layer containing aluminum in the casting and cooling process, and the composition of the intermediate reaction layer is a composition of the second layer and the It can be influenced by composition of three layers.

In the hybrid material, the second layer may be an aluminum alloy having a melting point of 660 캜 or lower.

In the hybrid material, the second layer may be a sub-alloy aluminum alloy.

In the hybrid material, the second layer containing aluminum may be an aluminum alloy having a lower melting point than the third layer containing aluminum.

In the hybrid material, the second layer containing aluminum may be an aluminum alloy having a silicon weight ratio of less than 12.6 wt%.

A method of manufacturing a hybrid material according to another aspect of the present invention is provided. A method of manufacturing a hybrid material includes: a first step of preparing a first bonding material in which a first layer containing copper and a second layer containing aluminum are clad-bonded; And a second step of forming a second bonding material which is cast-bonded to the second layer containing aluminum by pre-arranging the first bonding material in the mold and then injecting a molten metal containing aluminum.

In the method of manufacturing the hybrid material, the second layer may be an aluminum alloy having a melting point of 660 캜 or lower.

In the hybrid material manufacturing method, the second layer may be a sub-process aluminum alloy system.

In the hybrid material manufacturing method, the second layer containing aluminum may be an aluminum alloy having a melting point lower than that of the third layer containing aluminum.

In the hybrid material manufacturing method, the second layer containing aluminum may be an aluminum alloy having a silicon weight ratio lower than 12.6 wt%.

In the method of manufacturing the hybrid material, the second step is preferably such that, in disposing the first bonding material in the mold, the second layer containing aluminum is exposed in the mold so as to be in direct contact with the aluminum- And the like.

In the hybrid material manufacturing method, the second layer containing aluminum has a melting point lower than that of the first layer containing copper, and the first step is a step of mixing the first layer containing copper and the aluminum- And rolling the two layers together.

In the above-described method for producing a hybrid material, the second step may include a step of casting by injection of a molten metal containing aluminum.

In the method of manufacturing the hybrid material, the second step may include gravity casting by injecting a molten metal containing aluminum.

According to an embodiment of the present invention as described above, it is an object of the present invention to provide a hybrid material having a high thermal conductivity of 200 W / mK or more and a good interlayer interfacial bonding state, and a manufacturing method thereof. However, these problems are exemplary and do not limit the scope of the present invention.

1 is a flowchart illustrating a method of manufacturing a hybrid material according to embodiments of the present invention.
2 is a diagram schematically showing a cross-section of a hybrid material according to embodiments of the present invention.
3 is a diagram sequentially illustrating a process of manufacturing a hybrid material according to embodiments of the present invention.
4 is a photograph of a cross section of a first bonding material constituting a hybrid material according to embodiments of the present invention.
FIG. 5 is a photograph of the resultant product after the manufacturing process shown in FIG.
6 is a photograph of a cross section of a hybrid material (second bonding material) according to the embodiments of the present invention.
7 is a graph comparing thermal conductivities of materials according to Examples and Comparative Examples of the present invention.
8 is a diagram illustrating a part of a process for manufacturing a hybrid material according to a first comparative example of the present invention.
Fig. 9 is a photograph of the bonding state of the interface in the hybrid material according to the first comparative example of the present invention.
10 is a photograph of a part of a process of manufacturing a hybrid material according to a second comparative example of the present invention.
11 is a photograph of the bonding state of the interface in the hybrid material according to the second comparative example of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

FIG. 1 is a flowchart illustrating a method of manufacturing a hybrid material according to an embodiment of the present invention. FIG. 2 is a schematic view of a cross section of a hybrid material according to an embodiment of the present invention. 1 is a diagram sequentially illustrating a process of manufacturing a hybrid material according to embodiments of the present invention.

1 to 3, a method of manufacturing a hybrid material 1 according to embodiments of the present invention is a method of manufacturing a hybrid material 1 in which a first layer 10 containing copper and a second layer 20 containing aluminum are bonded A first step S100 of preparing the first bonding material 30; And the third bonding material 30 is preliminarily placed in the mold 110 and then the molten metal M containing aluminum is injected into the second layer 20 containing the aluminum, Wherein the first bonding material 30 comprises a first layer 10 containing copper and a second layer 20 containing aluminum, The second step S200 may include a step of pouring and casting a molten metal M containing aluminum. On the other hand, as a modified example, the second Step S200 may include gravity casting by injecting molten metal M containing aluminum.

A hybrid material (1) according to embodiments of the present invention implemented by performing this manufacturing method comprises a first layer (10) containing copper; A second layer (20) containing aluminum bonded to the first layer (10) containing copper; And a third layer (40) containing aluminum bonded to the second layer (20) containing the aluminum.

Furthermore, the hybrid material 1 may further include an intermediate reaction layer (not shown) formed between the second layer 20 and the third layer 40. The formation of the intermediate reaction layer may be determined according to the composition of the second layer 20 and the composition of the third layer 40.

The intermediate reaction layer may be a layer formed between layers containing aluminum in the casting and cooling process, and may be understood as a junction buffer layer or a junction strengthening layer of the second layer 20 and the third layer 40. The composition of the intermediate reaction layer is influenced by the composition of the second layer 20 and the composition of the third layer 40.

In the hybrid material, the second layer 20 may be an aluminum alloy having a melting point of 660 占 폚 or less in one aspect. In the hybrid material, the second layer 20 may be, from another viewpoint, a sub-alloy of aluminum alloy.

For example, in the hybrid material, the second layer 20 may be an aluminum alloy having a silicon weight ratio of less than 12.6 wt%.

In another aspect of the hybrid material, the second layer 20 containing aluminum may be an aluminum alloy having a lower melting point than the third layer 40 containing aluminum.

In general, aluminum and aluminum alloys can realize a complicated shape structure through a casting process and are advantageous in weight reduction. However, it is not easy to realize a thermal conductivity of 200 W / mK or more due to the inherent thermal conductivity limit of aluminum. The present inventors propose an aluminum alloy / copper hybrid material to which a copper plate having high thermal conductivity is bonded to overcome this problem.

If the aluminum material and the copper material are directly bonded to each other by the casting process, the bonding property of the interface is not excellent. Therefore, the first bonding material, which is obtained by bonding the copper material and the aluminum material by a process other than the casting process (for example, a cladding process) An aluminum alloy / copper hybrid material improved in bonding properties of the interface by realizing another aluminum material bonded to the aluminum alloy material of the first bonding material by the casting process.

In particular, it has been confirmed that the hybrid material 1 according to the embodiments of the present invention described above can secure a high thermal conductivity of about 200 W / mK or more while having good interlayer interface bonding state.

Hereinafter, experimental results that demonstrate this through specific experimental examples will be described.

The first layer 10 containing copper and the second layers 20a and 20b containing aluminum are bonded to the first bonding material 30 by cladding, for example, (See Fig. 4). The second layer 20 containing aluminum has a melting point lower than that of the first layer 10 containing copper and the first step S100 of preparing the first bonding material 30 is the first layer containing copper 10) and a second layer (20) containing aluminum.

For example, referring to FIG. 4A, the first bonding material 30 constituting the hybrid material according to the first embodiment of the present invention comprises a first layer 10 containing copper and a second layer 10 containing aluminum And the second layer 20a is clad-bonded. The second layer 20a containing aluminum contains less than 0.25 wt% (greater than 0) Si, less than 0.40 wt% (greater than 0) Fe, less than 0.05 wt% (greater than 0) Cu, less than 0.05 wt% By weight of Mn, less than 0.05% by weight of Mg, less than 0.05% by weight of Zn, less than 0.03% by weight of Ti, and the balance of Al. In this case, the melting point of the first layer 10 containing copper is 1085 ° C, the liquidus temperature of the second layer 20a containing aluminum is 659 ° C, and the second layer And the solidus temperature of the heat exchanger 20a is 643 ° C. The thickness of the first bonding material 30 tested is about 1 mm, and it can be confirmed that the cladding bonding interface is good.

4 (b), the first bonding material 30 constituting the hybrid material according to the second embodiment of the present invention includes a first layer 10 containing copper and a second layer 10 containing aluminum The second layer 20b is clad-bonded. The second layer 20a containing aluminum comprises 6.8 to 8.2 wt% Si, less than 0.80 wt% Fe, less than 0.25 wt% Cu (greater than 0), less than 0.10 wt% (greater than 0) Mn, less than 0.20 wt% (more than 0) of Zn, and the balance being Al (Al4343). In this case, the melting point of the first layer 10 containing copper is 1085 ° C, the liquidus temperature of the second layer 20a containing aluminum is 617 ° C, and the second layer containing aluminum And the solidus temperature of the solid solution 20a is 575 ° C. The thickness of the first bonding material 30 tested is about 1 mm, and the cladding bonding interface is also good.

Next, as a second step (S200), the first bonding material 30 is preliminarily placed in the molds 110a and 110b, and then the molten metal M containing aluminum is injected into the first bonding material 30, To form a third layer 40 (see Fig. 3) containing aluminum that has been cast bonded to the second layer 20 of the second layer.

Referring to FIG. 3A, a first bonding material 30 is charged into the lower mold 110a, and the second bonding material 30 is charged so that the second layer 20 containing aluminum is exposed. When the lower mold 110a and the upper mold 110b are combined, an inner space 115 to be filled with the molten metal M is formed. The molten metal M accommodated in the crucible 140 is injected into the chamber 120 connected to the inner space 115.

Referring to FIG. 3 (b), the molten metal M is injected into the inner space 115 in the mold by the plunger 130. In this case, the second layer 20 containing aluminum in the first bonding material 30 and the molten metal M come into direct contact with each other.

3C, after the molten metal M solidifies and the molds 110a and 110b are removed, the resultant product 50 is transferred to the solidification material 40 in which the first bonding material 30 and the molten metal M are solidified, . FIG. 5 is a photograph of the resultant product after the manufacturing process shown in FIG.

6 is a photograph of a section of a hybrid material according to embodiments of the present invention. It can be understood that the hybrid material referred to here is obtained by processing the portion of the inlet region into which the molten metal M flows, for example, in the resultant 50 shown in Fig. 3 (c) and Fig.

6 (a), which is a photograph of a cross-section microstructure of a hybrid material according to the first embodiment of the present invention observed by an optical microscope, the first layer 10 containing copper and the second layer The layer 20a is clad-bonded. The second layer 20a containing aluminum contains less than 0.25 wt% (greater than 0) Si, less than 0.40 wt% (greater than 0) Fe, less than 0.05 wt% (greater than 0) Cu, less than 0.05 wt% By weight of Mn, less than 0.05% by weight of Mg, less than 0.05% by weight of Zn, less than 0.03% by weight of Ti, and the balance of Al. Further, a third layer 40 containing aluminum is cast-bonded to the second layer 20a containing aluminum. According to the photographed photograph, it can be confirmed that both the cladding bonding state (interfacial state between 10 and 20a) and the casting bonding state (interfacial state between 20a and 40) are both good.

6 (b), which is a photograph of a cross-section microstructure of a hybrid material according to the second embodiment of the present invention, which is observed with an optical microscope, the first layer 10 containing copper and the second layer Layer 20b is clad-bonded. The second layer 20b containing aluminum comprises 6.8 to 8.2 wt% Si, less than 0.80 wt% Fe, less than 0.25 wt% Cu (greater than 0), less than 0.10 wt% (greater than 0) Mn, less than 0.20 wt% (more than 0) of Zn, and the balance being Al (Al4343). Further, a third layer 40 containing aluminum is cast-bonded to the second layer 20b containing aluminum. According to the photographed photograph, it can be confirmed that both the cladding bonding state (interfacial state between 10 and 20b) and the casting bonding state (interfacial state between 20b and 40) are both good.

7 is a graph comparing thermal conductivities of materials according to Examples and Comparative Examples of the present invention. This thermal conductivity measurement was performed at two temperature conditions of 25 ° C and 200 ° C.

7, the specimen of Example A is formed by the above-described method for producing a hybrid material of the present invention. The specimen of the first layer 10 containing copper having a thickness of 0.6 mm, the second layer 10 containing aluminum having a thickness of 0.4 mm, An aluminum alloy (A1050) which is a layer 20, and a third layer (40) which contains aluminum with a thickness of 3 mm. The third layer (40) containing aluminum is formed by preliminarily charging a first bonding material, in which a first layer (10) containing copper and a second layer (20) containing aluminum is clad- do.

In FIG. 7, the specimen of Example B is formed by the above-described method of manufacturing the hybrid material of the present invention. The first layer 10 containing copper has a copper layer with a thickness of 0.6 mm, a second layer 20, an aluminum alloy (A4343) having a thickness of 0.4 mm, and a third layer (40) containing aluminum having a thickness of 3 mm. The third layer (40) containing aluminum is formed by preliminarily charging a first bonding material, in which a first layer (10) containing copper and a second layer (20) containing aluminum is clad- do.

In FIG. 7, the specimen of Comparative Example A is a single general cast alloy containing aluminum having a thickness of 4 mm, consisting of a third layer containing aluminum. On the other hand, the composition of the third layer containing aluminum in the specimens of Comparative Example A, Example A, and Example B in Fig. 7 are the same, 0.9-1.1 wt% Si, 0.45-0.55 wt% Fe, 0.45 To 0.55 wt% of Ni and the balance of Al.

7, the thermal conductivity of the hybrid material (Example A and Example B) may be greatly deteriorated due to various interfaces between the alloys. However, as a result of the actual measurement of the thermal conductivity, (Example A, Example B) were found to have similar or higher thermal conductivities than the hybrid materials. From the above, it can be confirmed that a good bonding state is maintained between the respective alloys in the case of the hybrid material realized by the manufacturing method according to the embodiment of the present invention described above. Furthermore, considering that copper has a higher thermal conductivity than aluminum, it is expected that the overall thermal conductivity of the hybrid material will be further improved if the thickness ratio of the first layer 10 containing copper constituting the hybrid material is increased .

Hereinafter, various types of hybrid materials as comparative examples different from the examples of the present invention were manufactured to confirm the bonding state between constituent alloys.

FIG. 8 is a diagram illustrating a part of a process for manufacturing a hybrid material according to a first comparative example of the present invention, and FIG. 9 is a photograph of a bonded state of an interface in the hybrid material according to the first comparative example of the present invention .

Referring to FIG. 8, an alloy having a weight of about 8 kg is made into a molten metal by using an electric resistance type melting furnace, and then injected into an inner space 112 of a step mold 111 filled with a copper plate to perform gravity casting . The pre-heating temperature of the step mold 111 was 200 占 폚, and the composition of the molten metal was 0.94 wt% Si-0.52 wt% Fe-0.45 wt% Ni-bal. Al.

Referring to FIG. 9, the interface between the gravity-cast aluminum material and the copper plate can be confirmed. When gravity casting is performed using the step mold 111, it can be confirmed that the aluminum material and the copper plate are not bonded to all the steps (1, 2, and 3). That is, regardless of the cooling rate, it can be confirmed that peeling is caused by coagulation shrinkage during casting.

Therefore, in the following second comparative example, pressing force was applied during casting to improve the bonding ability between the second bonding material and the copper plate.

FIG. 10 is a photograph of a part of the process of manufacturing the hybrid material according to the second comparative example of the present invention, and FIG. 11 is a photograph of the bonding state of the interface in the hybrid material according to the second comparative example of the present invention .

The hybrid material according to the second comparative example was implemented using the pressurized casting method described with reference to FIG. However, it is different from the embodiment of the present invention in that the first bonding material is not charged in the mold but the copper plate is charged.

In the second comparative example, 0.94wt% Si-0.52wt% Fe-0.45wt% Ni-bal. Were obtained by using a press casting machine with a horizontal piston moving method (piston moving speed 36.25mm / sec) and a mold pre- An aluminum material having an Al composition was formed by a pressure casting method.

10, a groove having the same thickness as that of a copper plate is provided in the lower mold 110a so that a copper plate 10 having a thickness of 1 mm can be loaded therein. In the upper mold 110b, four grooves having thicknesses of 3, 4, When the mold cavity is coupled with the branch cavity, the lower copper plate is fixed by the wall between the upper mold cavities. After about 4 seconds from the injection of the molten metal into the shot sleeve, the pressure casting is carried out under conditions of a maximum molten metal injection pressure of up to 10 MPa.

Referring to Fig. 11, there is shown a side view of the result produced by the hybrid casting process. The casting conditions were variously changed from mold preheat temperature of 200 to 350 ° C and molten metal temperature of 750 to 850 ° C. Hybrid casting was performed, but it was confirmed that the interface (I) bonding was poor in all conditions.

Considering the above-described comparative examples and embodiments, a first step of preparing a first bonding material in which a first layer containing copper and a second layer containing aluminum are clad-bonded; And a second step of forming a second bonding material which is cast-bonded to the second layer containing aluminum by injecting a molten metal containing aluminum after previously arranging the first bonding material in the mold, It was confirmed that the interlayer interfacial bonding state is good even though the high thermal conductivity of 200 W / mK or more is secured.

On the other hand, the hybrid material according to the technical idea of the present invention extended from the above-mentioned embodiment has a first layer containing a first material and a first layer containing a second material, step; And a second step of forming a third layer containing a second material that is cast-bonded to a second layer containing a second material by injecting a melt containing the second material after previously positioning the first bonding material in the mold ; ≪ / RTI > In this case, the composition of the second layer containing the second substance and the composition of the third layer containing the second substance commonly contain the second substance and do not necessarily require the same composition, .

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the true scope of the present invention can be determined by the technical idea of the appended claims.

1: Hybrid material (second bonding material)
10: First layer containing copper
20: Second layer containing aluminum
30: first bonding material
40: Third layer containing aluminum

Claims (14)

A first layer containing copper; A second layer containing aluminum bonded to the first layer containing copper; A third layer containing aluminum bonded to the second layer containing aluminum; And an intermediate reaction layer formed between the second layer and the third layer and serving as a bonding buffer layer or a bonding strengthening layer of the second layer and the third layer,
Wherein the intermediate reaction layer is a layer formed between the second layer and the third layer containing aluminum in the casting and cooling process and the composition of the intermediate reaction layer is a composition of the second layer and the composition of the third layer Affected, hybrid material. delete delete The method according to claim 1,
Wherein the second layer is an aluminum alloy having a melting point of 660 DEG C or lower. The method according to claim 1,
And the second layer is a sub-process aluminum alloy system. The method according to claim 1,
Wherein the second layer containing aluminum is an aluminum alloy having a lower melting point than the third layer containing aluminum. The method according to claim 1,
Wherein the second layer is an aluminum alloy having a silicon weight ratio of less than 12.6 wt%. A light emitting diode package comprising a heat dissipating material including the hybrid material according to any one of claims 1 to 7. A semiconductor package comprising a heat dissipating material comprising the hybrid material according to any one of claims 1 to 7. A first step of preparing a first bonding material in which a first layer containing copper and a second layer containing aluminum are clad-bonded; And
A second step of forming a second bonding material that is cast-bonded to a second layer containing aluminum by injecting a molten metal containing aluminum after previously arranging the first bonding material in the mold;
Of the hybrid material. 11. The method of claim 10,
Wherein the second step is arranged such that the second layer containing aluminum is exposed in the mold so that the second layer containing aluminum can be brought into contact with the molten aluminum containing aluminum when the first bonding material is disposed in the mold. ≪ / RTI > 11. The method of claim 10,
The second layer containing aluminum has a melting point lower than that of the first layer containing copper, and the first step comprises a step of rolling-bonding the first layer containing copper and the second layer containing aluminum ≪ / RTI > 13. The method according to any one of claims 10 to 12,
And the second step includes a step of casting by injection of a molten metal containing aluminum. 13. The method according to any one of claims 10 to 12,
Wherein the second step comprises gravity casting by injecting a molten metal containing aluminum.

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