WO2009075314A1 - Solder alloy and process for producing the same - Google Patents

Solder alloy and process for producing the same Download PDF

Info

Publication number
WO2009075314A1
WO2009075314A1 PCT/JP2008/072480 JP2008072480W WO2009075314A1 WO 2009075314 A1 WO2009075314 A1 WO 2009075314A1 JP 2008072480 W JP2008072480 W JP 2008072480W WO 2009075314 A1 WO2009075314 A1 WO 2009075314A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
free solder
solder material
carbon
melted
Prior art date
Application number
PCT/JP2008/072480
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshihito Ijichi
Kenichi Ohshima
Original Assignee
Shirogane Co., Ltd.
University Of Tsukuba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shirogane Co., Ltd., University Of Tsukuba filed Critical Shirogane Co., Ltd.
Priority to JP2009545442A priority Critical patent/JP5408589B2/en
Priority to CN2008801202944A priority patent/CN101952080B/en
Priority to US12/735,038 priority patent/US20100296965A1/en
Publication of WO2009075314A1 publication Critical patent/WO2009075314A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Crucibles And Fluidized-Bed Furnaces (AREA)
  • Furnace Details (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)

Abstract

A lead-free solder alloy is provided which has bonding reliability and eliminates the problem that conventional lead-free solder alloys are inferior in bond strength to lead-containing solder alloys. The solder alloy is characterized by being obtained through the addition of a given amount of carbon to a lead-free solder material in an environment having a high temperature in the range of 800-1,200°C. Also provided is a process for producing a solder alloy characterized by comprising: a melting step in which a metal-melting furnace for high temperatures into which a lead-free solder material has been charged is heated to a high-temperature environment in the range of 800-1,200°C to melt the lead-free solder material; a carbon addition step in which a given amount of carbon is added to the lead-free solder material which has been melted in the melting step and is held in the high-temperature environment (melted lead-free solder material); a stirring step in which the melted lead-free solder material and the carbon are stirred; and a cooling step in which the resultant mixture obtained in the stirring step by stirring the melted lead-free solder material and the carbon is poured into a casting mold to cool and solidify the mixture.
PCT/JP2008/072480 2007-12-12 2008-12-11 Solder alloy and process for producing the same WO2009075314A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009545442A JP5408589B2 (en) 2007-12-12 2008-12-11 Solder alloy and manufacturing method thereof
CN2008801202944A CN101952080B (en) 2007-12-12 2008-12-11 Solder alloy and process for producing the same
US12/735,038 US20100296965A1 (en) 2007-12-12 2008-12-11 Alloy solder and alloy solder manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007321086 2007-12-12
JP2007-321086 2007-12-12

Publications (1)

Publication Number Publication Date
WO2009075314A1 true WO2009075314A1 (en) 2009-06-18

Family

ID=39565355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072480 WO2009075314A1 (en) 2007-12-12 2008-12-11 Solder alloy and process for producing the same

Country Status (4)

Country Link
US (1) US20100296965A1 (en)
JP (1) JP5408589B2 (en)
CN (2) CN101204761A (en)
WO (1) WO2009075314A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011027858A1 (en) * 2009-09-07 2011-03-10 株式会社 白金 Copper alloy and method for producing same
JP2013018010A (en) * 2011-07-07 2013-01-31 Fuji Electric Co Ltd Lead-free solder
WO2019017182A1 (en) * 2017-07-21 2019-01-24 大豊工業株式会社 Sliding member and sliding bearing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102251140B (en) * 2011-07-15 2012-10-03 广州先金新材料科技有限公司 Gold-tin solder protective smelting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006102810A (en) * 2004-10-06 2006-04-20 Tadamasa Fujimura Soldering material
JP2007237212A (en) * 2006-03-07 2007-09-20 Alps Electric Co Ltd Solder adhesive and electronic component packaging structure using the solder adhesive

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5127969A (en) * 1990-03-22 1992-07-07 University Of Cincinnati Reinforced solder, brazing and welding compositions and methods for preparation thereof
US5089356A (en) * 1990-09-17 1992-02-18 The Research Foundation Of State Univ. Of New York Carbon fiber reinforced tin-lead alloy as a low thermal expansion solder preform
JP3226213B2 (en) * 1996-10-17 2001-11-05 松下電器産業株式会社 Solder material and electronic component using the same
WO2000076717A1 (en) * 1999-06-11 2000-12-21 Nippon Sheet Glass Co., Ltd. Lead-free solder
US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006102810A (en) * 2004-10-06 2006-04-20 Tadamasa Fujimura Soldering material
JP2007237212A (en) * 2006-03-07 2007-09-20 Alps Electric Co Ltd Solder adhesive and electronic component packaging structure using the solder adhesive

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011027858A1 (en) * 2009-09-07 2011-03-10 株式会社 白金 Copper alloy and method for producing same
JP5397966B2 (en) * 2009-09-07 2014-01-22 株式会社白金 Copper alloy and method for producing the same
KR101378202B1 (en) 2009-09-07 2014-03-26 고쿠리쯔 다이가쿠 호징 츠쿠바 다이가쿠 Copper alloy and method for producing same
US9033023B2 (en) 2009-09-07 2015-05-19 Shirogane Co., Ltd. Copper alloy and copper alloy manufacturing method
JP2013018010A (en) * 2011-07-07 2013-01-31 Fuji Electric Co Ltd Lead-free solder
WO2019017182A1 (en) * 2017-07-21 2019-01-24 大豊工業株式会社 Sliding member and sliding bearing
US11396910B2 (en) 2017-07-21 2022-07-26 Taiho Kogyo Co., Ltd. Sliding member and sliding bearing

Also Published As

Publication number Publication date
US20100296965A1 (en) 2010-11-25
JPWO2009075314A1 (en) 2011-04-28
CN101204761A (en) 2008-06-25
CN101952080A (en) 2011-01-19
CN101952080B (en) 2013-11-20
JP5408589B2 (en) 2014-02-05

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