WO2016084488A1 - Dissimilar metal bonded structure, method for producing same and water-cooled power conversion element provided with same - Google Patents
Dissimilar metal bonded structure, method for producing same and water-cooled power conversion element provided with same Download PDFInfo
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- WO2016084488A1 WO2016084488A1 PCT/JP2015/078433 JP2015078433W WO2016084488A1 WO 2016084488 A1 WO2016084488 A1 WO 2016084488A1 JP 2015078433 W JP2015078433 W JP 2015078433W WO 2016084488 A1 WO2016084488 A1 WO 2016084488A1
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- metal
- coating layer
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 241
- 239000002184 metal Substances 0.000 title claims abstract description 241
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 94
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 88
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 45
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000002844 melting Methods 0.000 claims abstract description 22
- 230000008018 melting Effects 0.000 claims abstract description 22
- 238000005275 alloying Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 148
- 239000011247 coating layer Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 25
- 229910045601 alloy Inorganic materials 0.000 claims description 24
- 239000000956 alloy Substances 0.000 claims description 24
- 238000005304 joining Methods 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000006104 solid solution Substances 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 abstract description 26
- 238000010030 laminating Methods 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 6
- 230000015271 coagulation Effects 0.000 abstract 1
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- 238000001816 cooling Methods 0.000 description 24
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- 229910001240 Maraging steel Inorganic materials 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000007711 solidification Methods 0.000 description 11
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- 229910000838 Al alloy Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical class [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229940125898 compound 5 Drugs 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
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- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- -1 aluminum and copper Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/16—Both compacting and sintering in successive or repeated steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a dissimilar metal junction structure, a manufacturing method thereof, and a water-cooled power conversion element including the same.
- Patent Document 1 describes providing a power module with high reliability of the joint.
- the power module is configured by sequentially laminating an underlying conductive member formed by a thermal spraying method, a solder layer, and a semiconductor chip on a metal wiring made of a first material.
- the underlying conductive member is formed by injecting a particle group of the first material and a particle group of the second material having a smaller thermal expansion coefficient than the first material.
- an underlying conductive member having a smaller thermal expansion coefficient than the metal wiring is interposed between the metal wiring and the solder layer, thermal stress caused by the difference in thermal expansion coefficient between the upper and lower members applied to the solder layer Is relaxed and the generation of cracks in the solder layer is suppressed.
- an insulating resin layer made of an epoxy resin is formed between a metal wiring made of copper or the like and a heat sink made of aluminum or the like.
- the bonding strength between the metal and the resin tends to be weak. Therefore, it is preferable that the structure made of, for example, copper and the structure made of, for example, aluminum are directly joined without using an epoxy resin or the like.
- the present invention has been made in view of such problems, and the problem to be solved by the present invention is to dissimilar metal joints capable of joining various dissimilar metals to each other while having sufficient joint strength.
- the object is to provide a structure, a manufacturing method thereof, and a water-cooled power conversion element including the structure.
- the dissimilar metal joining structure of the present invention includes a metal base composed of a first metal, a coating layer formed on the metal base and composed of a second metal, and the metal base. And an intermetallic compound layer formed by alloying the first metal and the second metal, and formed on the coating layer.
- a mixed molten and solidified portion obtained by mixing and melting three metals is provided with a stacked structure in which a plurality of layers are stacked in a direction perpendicular to the metal substrate.
- the mixed molten and solidified part is formed, and the second metal that constitutes the coating layer and the first metal that constitutes the metal base material are alloyed by heat generated by the irradiation of the laser beam to form an intermetallic
- the mixed melting / alloy layer forming step of forming a compound layer and the mixed melting / alloy layer forming step a plurality of times a plurality of the mixed molten solidified portions are stacked in a direction perpendicular to the metal substrate.
- a laminated structure A laminating step of forming, is intended to include.
- the water-cooled power conversion element of the present invention includes a metal substrate composed of a first metal, a coating layer formed on the metal substrate and composed of a second metal, and the metal substrate.
- a heterogeneous metal joining structure comprising: a laminated structure in which a plurality of mixed molten and solidified portions obtained by mixing and melting a plurality of metals are stacked in a direction perpendicular to the metal substrate; and the metal member A power conversion element that is in thermal contact, and the laminated structure is in contact with a refrigerant that cools the power conversion element.
- a dissimilar metal joining structure capable of joining various dissimilar metals to each other while having sufficient joining strength, a manufacturing method thereof, and a water-cooled power conversion element including the same. it can.
- FIG. 5 is a cross-sectional view showing a state where a desired position is irradiated with laser light in the state shown in FIG. 4.
- FIG. 1 is a perspective view of a part of a water-cooled power conversion element 110 provided with a dissimilar metal joint structure 100 according to this embodiment. That is, FIG. 1 shows the dissimilar metal junction structure 100 and the power conversion element 10 joined thereto, which constitute the water-cooled power conversion element 110.
- the dissimilar metal joining structure 100 includes a heat transfer plate 1 (metal substrate), a plating layer 2 (coating layer), and water-cooled fins 11 (corresponding to the laminated structure 6 shown in FIG. 3 and the like). Is done.
- a power conversion element 10 (inverter) is joined to the heat transfer plate 1.
- the current conversion element 10 is an element that converts a direct current into an alternating current or converts an alternating current into a direct current.
- water 12 (see FIG. 2) is in contact with the water-cooled fins 11. Thereby, the heat generated by the current conversion by the power conversion element 10 is transferred to the heat transfer plate 1, the plating layer 2, and the water-cooled fins 11 to be dissipated to the water, thereby cooling the power conversion element 10. It is like that.
- FIG. 2 is a cross-sectional view of the water-cooled power conversion element 110 including the dissimilar metal junction structure 100 of the present embodiment.
- a dissimilar metal joint structure 100 including the radiator plate 1, the plating layer 2, and the water-cooled fin 11 (laminated structure 6) is surrounded by an aluminum case 15 and an aluminum lid 16. And between the plating layer 2 and the aluminum lid
- a lap weld 13 is formed between the aluminum case 15 and the heat transfer plate 1 by laser welding in order to prevent leakage of water 12 to the current conversion element 10.
- a butt weld 14 is also formed by laser welding at the joint between the aluminum case 15 and the aluminum lid 16 in order to prevent the water 12 from leaking to the outside. In any of the lap welds 13 and the butt welds 14, since the same metal (aluminum) is welded, sufficient joint strength is ensured.
- the heat transfer plate 1 is made of aluminum (first metal), the plating layer 2 is made of nickel (second metal), and the water-cooled fins 11 are made of copper (third metal). ing.
- the weight reduction is achieved by using a light metal such as aluminum.
- the plating layer 2 is made of nickel, the manufacturing cost is reduced because the plating layer 2 is easily formed using a plating method.
- the water-cooled fin 11 occupies a relatively small volume in the dissimilar metal joint structure 100, heat dissipation to water can be further improved by using copper having higher heat conductivity than aluminum. Yes.
- the plating layer 2 it is possible to dispose the copper water-cooled fin on the aluminum heat transfer plate 1, which is difficult because the conventional technique has a problem in the bonding strength.
- the heat dissipation of the power conversion element 10 can be enhanced as compared with the conventional case, and the durability of the power conversion element 10 is improved. Can be improved.
- the water-cooled power conversion element 110 aluminum and copper, which are different metals, are joined through a plating layer made of metal without using a conventional resin or the like. Therefore, the thermal conductivity between aluminum and copper is remarkably excellent as compared with the case of using a resin. Therefore, also in this respect, the heat dissipation of the power conversion element 10 can be further enhanced as compared with the conventional case, and the durability of the power conversion element 10 can be further improved.
- FIG. 3 is an enlarged view of a portion A in FIG. 2 and is an enlarged view of the vicinity of the laminated structure 6 in the dissimilar metal bonded structure 100 of the present embodiment.
- the laminated structure 6 (corresponding to the cooling fin 11 in FIG. 1) has a plurality of mixed molten and solidified portions 4 laminated in a direction perpendicular to the heat transfer plate 1 (hereinafter referred to as “vertical direction”). It will be.
- the mixed molten and solidified portion 4 is formed by laminating eight layers in the vertical direction. Therefore, when the cross section of the laminated structure 6 is observed with an electron microscope, the metal structure is not a uniform cross section (no interface is observed) in the cross section of the laminated structure 6. It can be confirmed that eight layers of metal structure are laminated (deposited).
- the plating layer 2 is made of nickel
- the laminated structure 6 is made of copper.
- the copper powder disposed on the surface of the plating layer 2 and the nickel in the plating layer 2 are mixed. It is melted. Therefore, in the laminated structure 6, the nickel content increases and the copper content decreases as the mixed molten and solidified portion 4 present in the vicinity of the plating layer 2.
- the content of nickel decreases and the content of copper increases as the mixed molten and solidified portion 4 is separated from the plating layer 2.
- the concentrations of nickel and copper contained in the plating layer 2 gradually change as the distance from the plating layer 2 increases. That is, the content of nickel and copper has a gradient composition. Thereby, the residual stress at the time of solidification of the laminated structure 6 is reduced, and the strength of the laminated structure 6 is improved.
- the nickel constituting the plating layer 2 and the copper disposed on the surface of the plating layer 2 are a combination of dissimilar metals that are simply mixed without being alloyed. As described above, some alloys (intermetallic compounds) in which different metals are alloyed are brittle. Therefore, by forming the mixed molten and solidified portion 4 that is simply mixed without being alloyed, the bonding strength between different metals can be improved. However, it does not completely exclude that an alloy in which different kinds of metals are alloyed is included in the mixed melt-solidified portion 4, and if at least a part (preferably all) of the different kinds of metals are melt-mixed. Sufficient bonding strength is maintained.
- the heat transfer plate 1 and the plating layer 2 there is an intermetallic between the aluminum contained in the heat transfer plate 1 and the nickel contained in the plating layer 2.
- a compound layer 5 is formed.
- the heat exchanger plate 1 and the plating layer 2 are directly joined.
- the intermetallic compound layer 5 formed between the heat transfer plate 1 and the plating layer 2 is made of an aluminum-nickel alloy. This is because the heat given by the laser beam when forming the mixed molten and solidified portion 4 is transmitted through the inside of the plating layer 2 and reaches the heat transfer plate 1.
- the intermetallic compound layer 5 is formed below the laminated structure 6.
- the plating layer 2 which is a coating layer is formed by a plating method from the viewpoint of easy formation of a thin film having a uniform thickness, manufacturing cost, and the like. Whether or not the coating layer is formed by a plating method can be confirmed by observing a cross section of the coating layer with an electron micrograph. That is, when the coating layer is the plating layer 2 formed by the plating method, the cross section of the plating layer 2 is observed as a uniform state with no metal structure interface.
- the bonding strength between the heat transfer plate 1 and the plating layer 2 is relatively low.
- the joint strength between the heat transfer plate 1 and the plating layer 2 is increased by forming the intermetallic compound layer 5 in parallel with the formation of the mixed molten and solidified portion 4. That is, the nickel-aluminum alloying causes diffusion bonding of the nickel-aluminum alloy between the heat transfer plate 1 and the plating layer 2.
- the heat exchanger plate 1 and the plating layer 2 will be joined metallically, and these joint strengths will improve. Therefore, sufficient bonding strength can be obtained even with the plating layer 2 formed by a plating method selected based on manufacturing cost and ease of formation.
- nickel-aluminum alloys may become brittle compounds.
- the intermetallic compound layer 5 is formed by the heat transferred during the formation of the mixed molten and solidified portion 4, the amount of the compound generated is not so large.
- the intermetallic compound layer 5 to be formed is also extremely thin, a decrease in bonding strength due to a brittle compound is sufficiently suppressed.
- the plating layer 2 is made of nickel (second metal), and the mixed molten solidified portion 4 and the laminated structure 6 (the plating layer 2 is disposed on the surface).
- Metal powder is made of copper (third metal).
- the second metal and the third metal are not limited to these. However, it is preferable that at least one of the second metal and the third metal is a complete solid solution. Moreover, it is more preferable that both of the second metal and the third metal are a solid solution. It is because a brittle intermetallic compound is not formed by using metals of all solid solutions. Specific examples of such a total solid solution include nickel and its alloys, copper and its alloys, iron and its alloys, and the like.
- a combination of the second metal and the third metal a combination of a certain metal and an alloy containing the metal is also preferable.
- the combination of aluminum and the alloy (aluminum alloy) containing aluminum, the combination of copper and the alloy (copper alloy) containing copper, etc. are mentioned.
- the second metal is aluminum and the third metal is an aluminum alloy.
- the metal (first metal) contained in the heat transfer plate 1 is not particularly limited. However, when the first metal reacts with the third metal to form a brittle alloy, the effect of the present invention is particularly greatly exerted. Specifically, for example, the first metal is aluminum and the third metal is copper. Therefore, the metal contained in the heat transfer plate 1 may be appropriately set according to the type of metal contained in the laminated structure 6.
- the combinations shown in Table 1 below can be considered as combinations of metals used for the heat transfer plate 1, the plating layer 2, and the laminated structure 6.
- the combinations shown in Table 1 are examples and are not limited to the combinations shown in Table 1.
- the first combination is the combination used in the above embodiment.
- the thickness of the heat transfer plate 1 can be about 3 mm.
- the thickness of the plating layer 2 can be about 40 ⁇ m, for example.
- the thickness of the intermetallic compound layer 5 can be set to, for example, 5 ⁇ m or less, more specifically, for example, about 0.8 ⁇ m from the viewpoint of obtaining sufficient bonding strength.
- the manufacturing method of the laminated structure 6 is a so-called powder bed method.
- FIG. 4 is a cross-sectional view after applying copper powder (third metal) to the heat transfer plate 1.
- the spherical copper powder 3 manufactured by the atomizing method is arranged and fixed on the surface of the aluminum (first metal) heat transfer plate 1 on which the plating layer 2 of nickel (second metal) is formed. This is shown (third metal placement step).
- the copper powder 3 does not necessarily need to be fixed to the surface of the plating layer 2 and may be disposed on the surface of the plating layer 2.
- the plating layer 2 can be formed by, for example, an electroplating method.
- confirmation of whether the plating layer 2 is formed by the plating method can be confirmed by observing the cross section of the plating layer 2 with an electron micrograph as described above.
- the size of the copper powder 3 arranged and fixed on the surface of the plating layer 2 can be set to, for example, about 20 ⁇ m to 50 ⁇ m as a particle size.
- the thickness of the layer in which the copper powder 3 is arranged and fixed can be about 100 ⁇ m.
- FIG. 5 is a cross-sectional view showing a state where a desired position is irradiated with laser light in the state shown in FIG.
- the laser light is emitted from the front side of the paper to the back side.
- the copper powder 3 and nickel on the surface of the plating layer 2 are melted, and after these are mixed, a mixed melt solidified portion 4 is formed by heat dissipation (for example, cooling) (mixed melt / alloy).
- Heat dissipation for example, cooling
- Layer forming step in particular, during heat dissipation, although nickel and copper are sufficiently mixed, copper having a relatively high specific gravity tends to move downward, while nickel having a relatively low specific gravity tends to move upward. Therefore, in the mixed melt solidification part 4, nickel tends to exist on the upper side and copper on the lower side.
- the plating layer 2 is a metal
- a part of heat used for melting the copper powder 3 or the like reaches the bonding interface between the heat transfer plate 1 and the plating layer 2 through the plating layer 2.
- dissimilar metals are joined at this joining interface, melting of both metals starts from that portion, and these metals are alloyed.
- the intermetallic compound layer 5 is formed between the heat transfer plate 1 and the plating layer 2 and below the mixed melting and solidifying portion 4 (mixed melting / alloy layer forming step).
- the melting range of each metal expands in the upward direction in the plating layer 2 and in the downward direction in the heat transfer plate 1 while heat transfer by laser light irradiation continues. It will be. Therefore, in the intermetallic compound layer 5, the aluminum concentration and the nickel concentration are almost the same in the vicinity of the center because they are alloyed, but the nickel concentration increases and the aluminum concentration decreases as the distance from the center increases upward. become. On the other hand, the aluminum concentration increases and the nickel concentration decreases with increasing distance from the vicinity of the center. Therefore, in FIG. 5 etc., the interface between the intermetallic compound layer 5 and the heat transfer plate 1 and the plating layer 2 is clearly shown for the convenience of illustration, but in reality, these interfaces cannot often be determined. .
- laser light irradiation is performed under the condition that only the surface of the plating layer 2 and the copper powder 3 are melted.
- a strong mixed melt-solidified portion 4 formed by mixing nickel and copper is formed, and a dissimilar metal bonded structure 100 having excellent bonding strength is obtained.
- part of the heat used during the generation of the mixed molten and solidified portion 4 is transmitted through the plating layer 2 to form the intermetallic compound layer 5.
- the bonding strength between the heat transfer plate 1 and the plating layer 2 can be increased.
- the intermetallic compound layer 5 is formed in addition to the mixed melt-solidified portion 4, thereby obtaining the dissimilar metal bonded structure 100 having sufficiently higher bonding strength than the conventional structure as a whole structure. Can do.
- the laser beam irradiation is strong, the plating layer 2 may be penetrated and melted, and the intermetallic compound layer 5 may not be formed. In this case, the heat transfer plate 1 is also melted, and aluminum and the copper powder 3 may react to form a brittle alloy. Therefore, in this embodiment, the laser beam may be irradiated under such a weak condition that both the surface of the plating layer 2 and the copper powder 3 can be melted.
- the thickness of the intermetallic compound layer 5 can be controlled by the temperature at the bonding interface between the heat transfer plate 1 and the plating layer 2 and the irradiation time of the laser beam. Specifically, if the irradiation time of the laser beam is long or the distance from the bonding interface between the heat transfer plate 1 and the plating layer 2 to the intermetallic compound layer 5 is short, a thick intermetallic compound layer 5 is generated. There is a tendency. Therefore, the structure of the intermetallic compound 5 can be controlled by the irradiation condition of the laser beam, the coating condition of the metal powder 3, the thickness of the plating layer 2, and the like.
- the thickness of the layer composed of copper powder 3 is 100 ⁇ m and the thickness of the plating layer 2 composed of nickel is 40 ⁇ m
- a continuous oscillation fiber laser device capable of irradiating laser light with a wavelength of 1070 nm is used.
- the beam diameter ⁇ can be set to 100 ⁇ m
- the scan speed can be set to 100 m / s
- the laser output can be set to 400 W.
- the laser beam irradiation is preferably performed in an inert gas (for example, argon gas) from the viewpoint of preventing the metal melted during the formation of the mixed molten and solidified portion 4 from being oxidized.
- an inert gas for example, argon gas
- the mixed melt solidification part 4 with few impurities for example, oxide
- FIG. 6 is a cross-sectional view showing a state in which the laser beam is irradiated each time while the irradiation position of the laser beam is gradually shifted, and the fifth laser beam is irradiated.
- the laser beam is irradiated from the near side to the far side of the paper surface.
- the irradiation position is shifted to the right by a total of 5 times and the laser beam is irradiated. It is shown.
- the laser beam is irradiated so that the formed mixed molten and solidified portions 4 are overlapped little by little.
- the initially formed mixed molten and solidified portion 4 shown in FIG. 5 was a mixture of aluminum and nickel, but the mixed molten and solidified portion 4 formed by the second and subsequent irradiations (for example, FIG. 6).
- the mixed molten and solidified portion 4 includes, in addition to aluminum and nickel, the components of the mixed molten and solidified portion 4 formed at the beginning shown in Fig. 5. Therefore, the mixing formed in the left-right direction is included. Since the melt-solidified part 4 is formed of the same component, a strong mixed melt-solidified part 4 without cracks is obtained.
- a new intermetallic compound layer 5 is formed in accordance with the new formation of the mixed molten and solidified portion 4.
- the alloy contained in the newly formed intermetallic compound layer 5 is alloyed together with the existing alloy. Therefore, the intermetallic compound layer 5 is integrally formed with no boundary, unlike the mixed molten and solidified portion 4 simply mixed.
- the intermetallic compound layer 5 that improves the bonding strength between the heat transfer plate 1 and the plating layer 2 is formed in accordance with the formation of the mixed molten and solidified portion 4 constituting the laminated structure 6. Therefore, even if the size of the laminated structure 6 is increased, sufficient bonding strength can be obtained.
- FIG. 7 is a cross-sectional view after applying the copper powder 3 for forming the second layer mixed molten and solidified portion 4.
- FIG. 7 in the state shown in FIG. 6 (the state in which five mixed molten and solidified portions 4 are formed from the front side to the back side of the paper), another copper powder 3 is made in the same manner as in the state of FIG. The arrangement is fixed. That is, FIG. 7 shows a state in which the copper powder 3 is arranged and fixed on the mixed molten and solidified portion 4 formed in FIGS. 5 and 6 (third metal arranging step, laminating step).
- FIG. 8 is a cross-sectional view showing a state in which laser light is radiated to a position serving as a starting point for forming the second layer mixed melt solidification portion 4 in the state shown in FIG.
- This starting point is usually the same as the laser beam irradiation position (position shown in FIG. 5) of the mixed molten and solidified portion 4 formed at the beginning of the first layer (state shown in FIG. 6).
- the laser light irradiation can be performed in the same manner as the conditions shown in FIG.
- FIG. 9 is a cross-sectional view showing a state in which a laser beam for irradiating a final mixed molten solidified portion constituting the laminated structure is irradiated after a plurality of irradiations while shifting the irradiation position of the laser beam. It is. That is, the operation shown in FIGS. 5 to 7 is repeated 8 times to show a state in which eight layers of the mixed molten and solidified portion 4 are formed in the vertical direction.
- the laminated structure 6 is obtained by laminating
- the nickel concentration is highest in the vicinity of the plating layer 2, and the nickel concentration gradually decreases toward the tip (upward).
- the copper powder 3 is applied and fixed as shown in FIG. Therefore, the copper concentration in the vicinity of the plating layer 2 is the lowest, and the copper concentration gradually increases toward the tip (upward).
- the concentration of nickel decreases immediately toward the tip because the amount of nickel contained in the plating layer 2 does not change.
- the copper powder 3 is newly arranged and fixed every time the laser beam is irradiated, the concentration of copper tends to rise relatively quickly toward the tip. Therefore, although it contains nickel, the laminated structure 6 in which most of the structure is made of copper is obtained.
- the composition changes in a gradient as described above (gradient composition).
- gradient composition The thermal expansion coefficient gradually changes due to the gradient composition. Therefore, the residual stress at the time of solidification is reduced, deformation is reduced, and a high-strength dissimilar metal bonded structure 100 without cracks is obtained.
- a dissimilar metal bonded structure 100 having high bonding strength is obtained by interposing the dissimilar metals, which are difficult to bond because they form a brittle compound such as aluminum and copper, through the plating layer 2.
- bonding can be performed only with metal without using a resin or the like, the bonding strength can be sufficiently increased.
- the plating layer 2 used for joining can be appropriately selected according to each metal to be joined, dissimilar metals that were conventionally difficult to join from the viewpoint of joining strength should be joined with sufficient joining strength. Can do.
- FIG. 10 is a cross-sectional view of a cooling mold 120 according to another embodiment to which the dissimilar metal bonding structure 100 of the present embodiment is applied.
- the cooling mold 120 (dissimilar metal joint structure) is an internal flow through which a mold molding part 25 (laminated structure) for molding a molten resin and water for cooling the mold molding part 25 flows.
- a path 22 and a base plate 21 (metal substrate) for transferring heat from the mold molding part 25 to water are provided.
- the mold molding part 25 is formed by laminating the mixed melting and solidifying part 4 in the same manner as the laminated structure 6 described above. In FIG. In addition, the boundary between the mold molding part 25 and the mixed melting and solidifying part 4 is clearly shown.
- the plating layer 2 is formed on the base plate 21.
- An intermetallic compound 5 is formed between the base plate 21 and the plating layer 2.
- a mold molding part 25 is formed on the plating layer 2.
- a mixed molten and solidified portion 4 is formed between the plating layer 2 and the mold forming portion 25.
- the metal (first metal) constituting the base plate 21 is copper having high thermal conductivity in order to promote heat removal by water cooling.
- the metal (2nd metal) which comprises the plating layer 2 is nickel similarly to the said water cooling power conversion element 110.
- die molded part 25 is maraging steel. Maraging steel is an iron-based alloy containing nickel, cobalt, and the like.
- Nickel is industrially inexpensive and does not form a brittle compound even when melted with maraging steel. And since maraging steel is high intensity
- maraging steel is high intensity
- the melting point of copper and the melting point of maraging steel are very different. Therefore, if the copper base plate 21 is simply joined to the die-molded portion 25 made of maraging steel, a crack occurs at the joining interface, and the joining strength is reduced. Therefore, if it is a conventional method, the mold forming part 25 cannot be directly formed on the base plate 21. Therefore, a reliable cooling mold 120 can be obtained through the plating layer 2.
- the cooling mold 120 can be manufactured basically in the same manner as the water-cooled power conversion element 110 described above. Therefore, in the following description, a method for manufacturing the cooling mold 120 will be described mainly with a point different from the method for manufacturing the water-cooled power conversion element 110 described above.
- a nickel plating layer 2 (thickness of about 30 ⁇ m) is formed on a base plate 21 (thickness of about 20 mm) on which the water cooling channel 22 is formed.
- a metal powder of maraging steel (having a particle size of about 20 ⁇ m to 40 ⁇ m and an average particle size of about 30 ⁇ m, not shown) is applied on the plating layer 2.
- This metal powder can be manufactured by, for example, a gas atomizing method.
- the mixed molten solidified portion 4 that is a mixture of nickel and maraging steel is formed.
- an intermetallic compound layer 5 composed of an alloy made of copper and nickel is formed.
- the laser light irradiation conditions can be as follows. That is, from the viewpoint of preventing metal oxidation during the melting and solidification process, the laser beam is irradiated in a nitrogen atmosphere.
- the beam diameter of the laser beam is 100 ⁇ m
- the laser output is 200 W
- the laser scan speed can be 100 m / s.
- a continuous wave fiber laser having a wavelength of 1070 nm can be used as the laser light.
- the size (height in the vertical direction) of the mold forming portion 25 that is the laminated structure 6 is not uniform. That is, as shown in FIG. 10, it is thin near the center of the mold molding part 25 and thick near both ends. Therefore, when the cooling mold 120 is manufactured, the amount and number of maraging steel applied in the vicinity of the center and the number of times of laser light irradiation are small, while these are increased in the vicinity of both ends. That is, in the manufacture of the cooling mold 120, the molding part 25 having a thickness larger than that in the vicinity of the center can be formed by repeating the application of maraging steel and laser irradiation more frequently in the vicinity of both ends. By doing in this way, the metal mold
- the cooling mold 120 manufactured in this way can be made into a mold having excellent strength by the mold forming part 25 made of maraging steel.
- the copper base plate 21 since the copper base plate 21 is provided, the heat transfer performance by copper is excellent, and the cooling effect of the mold molding part 25 can be enhanced.
- the base plate 21 and the mold molding part 25 are connected only by metal. Therefore, the good heat transfer performance of copper can be exhibited to the maximum, and the cooling mold 120 excellent in cooling performance can be manufactured.
- the composition of nickel and maraging steel is a gradient composition, like the cooling power conversion element 110 described above. Therefore, since the thermal expansion coefficient also changes in accordance with the change in composition, the residual stress due to the thermal expansion difference between different metals is reduced. Thereby, the metal mold part 25 can be joined with high strength.
- the plating layer 2 formed by a plating method is formed as the coating layer, but the coating layer may be a layer formed by a cold spray method.
- a second metal such as nickel
- the coating layer By forming the coating layer using the cold spray method, a coating layer thicker than the thickness of the plating layer 2 formed by the plating method can be formed.
- the coating layer thickly By forming the coating layer thickly, the distance from the position where the laser light is irradiated (that is, the position where the mixed molten and solidified portion 4 is formed) to the position where the intermetallic compound layer 5 is formed can be increased. it can. Thereby, it becomes difficult to transmit the heat by irradiation of a laser beam, and the comparatively thin intermetallic compound layer 5 can be formed.
- Whether the coating layer is formed by a cold spray method can be determined by observing a cross section of the coating layer with an electron microscope. That is, when the cross section is observed with an electron microscope, the second metals are deposited in a flat shape, that is, if the structure of the second metal is not uniform and the interface between the metal structures can be confirmed, It can be determined that the coating layer was formed by a cold spray method.
- the coating layer can be formed by, for example, a thermal spraying method in addition to the plating method or the cold spray method.
- a thermal spraying method the 2nd metal which comprises a coating layer will collide with a metal base material in the molten state. The second metals after colliding tend to join. Therefore, when the cross section is observed using an electron microscope, the second metal structure can be observed, but the interface between the metal structures is slightly blurred as compared with the case where the second metal structure is formed by the cold spray method. Therefore, whether the coating layer is formed by the cold spray method or the thermal spray method can be determined from the state of the interface between the metal structures.
- the coating layer may be formed using, for example, a clad material.
- the clad material is obtained by pressing the second metal, but the state of the metal structure in the cross section observed by an electron microscope is different from the cold spray method or the thermal spray method in which the second metal collides. Therefore, in this way, it can be determined whether or not the coating layer is formed using a clad material.
- the laser beam is used to form the mixed molten and solidified portion 4, but an electron beam may be used instead of the laser beam.
- any method may be used as long as it can form the mixed melt-solidified portion 4 and the intermetallic compound layer 5.
- the third metal (copper or maraging steel) is arranged and fixed every time the laser beam is irradiated, but these may be arranged and fixed each time the laser beam is irradiated. Good. That is, for example, by adjusting the focus of a laser beam or the like using a three-dimensional printer or the like, for example, it is possible to form a laminated structure 6 having an arbitrary shape in the third metal arranged only once at the beginning. it can.
- the third metal placement step is performed only once, and the mixed melting / alloy layer forming step is performed a plurality of times. Therefore, in this embodiment, the mixed melting / alloy layer forming step is repeatedly performed, while the third metal arranging step is performed once or a plurality of times (repeatedly).
- Heat transfer plate metal substrate
- Plating layer coating layer
- Metal powder third metal
- Mixed Melting and Solidifying Portion 5
- Intermetallic Compound Layer 6
- Laminated Structure 10
- Current Conversion Element 11
- Water-Cooled Fin 12
- Water (refrigerant) 13
- Lap welded portion 14
- Butt welded portion 15
- Aluminum case 16
- Aluminum lid 21
- Base plate (metal base) 22
- Water-cooled channel 25
- Molding part laminated structure
- Dissimilar metal joint structure 110
- Water-cooled power conversion element dissimilar metal joint structure
- Cooling mold dissimilar metal joint structure
Abstract
Provided are: a dissimilar metal bonded structure wherein dissimilar metals of a wider variety than ever before can be bonded, while having sufficient bonding strength; a method for producing this dissimilar metal bonded structure; and a water-cooled power conversion element which is provided with this dissimilar metal bonded structure.
A dissimilar metal bonded structure 100 which is provided with: a heat transfer plate 1 which is configured of aluminum; a plating layer 2 which is formed on the heat transfer plate 1 and is configured of nickel; an intermetallic compound layer 5 which is formed between the heat transfer plate 1 and the plating layer 2, and which is obtained by alloying between aluminum and nickel; and a laminated structure 6 which is formed on the plating layer 2 and is obtained by laminating a plurality of mixed molten coagulation parts 4, each of which is obtained by mixing and melting nickel and copper, in a direction that is perpendicular to the heat transfer plate 1.
Description
本発明は、異種金属接合構造物、並びにその製造方法及びそれを備える水冷電力変換素子に関する。
The present invention relates to a dissimilar metal junction structure, a manufacturing method thereof, and a water-cooled power conversion element including the same.
異種金属同士を接合する場合、それらの接合界面（接合部）には、異種金属同士が結合してなる金属間化合物（合金）が形成することがある。そして、この金属間化合物が脆い場合には、伸びが少ないため、疲労強度の低下、割れによる強度低下が生じ得る。そこで、異種金属同士の接合界面の信頼性を高める技術として、特許文献１に記載の技術が知られている。
When different metals are bonded, an intermetallic compound (alloy) formed by bonding different metals may be formed at the bonding interface (bonding portion) between them. And when this intermetallic compound is brittle, since there is little elongation, the fall of fatigue strength and the strength fall by a crack may arise. Therefore, a technique described in Patent Document 1 is known as a technique for improving the reliability of the bonding interface between different metals.
特許文献１には、接合部の信頼性が高いパワーモジュールを提供することが記載されている。具体的には、パワーモジュールは、第１の材料からなる金属配線の上に、溶射法によって形成された下敷き導電部材と、はんだ層と、半導体チップとを順次積層して構成されている。これらのうち、下敷き導電部材は、第１の材料の粒子群と、第１の材料よりも熱膨張係数が小さい第２の材料の粒子群とを噴射して形成されている。そして、金属配線とはんだ層との間に、金属配線よりも熱膨張係数の小さい下敷き導電部材が介在しているので、はんだ層に印加される上下部材間の熱膨張係数差に起因する熱応力が緩和され、はんだ層のクラックの発生が抑制されると、記載されている。
Patent Document 1 describes providing a power module with high reliability of the joint. Specifically, the power module is configured by sequentially laminating an underlying conductive member formed by a thermal spraying method, a solder layer, and a semiconductor chip on a metal wiring made of a first material. Of these, the underlying conductive member is formed by injecting a particle group of the first material and a particle group of the second material having a smaller thermal expansion coefficient than the first material. In addition, since an underlying conductive member having a smaller thermal expansion coefficient than the metal wiring is interposed between the metal wiring and the solder layer, thermal stress caused by the difference in thermal expansion coefficient between the upper and lower members applied to the solder layer Is relaxed and the generation of cracks in the solder layer is suppressed.
特許文献１に記載の技術では、銅等からなる金属配線と、アルミニウム等からなるヒートシンクとの間には、エポキシ樹脂からなる絶縁樹脂層が形成されている。しかし、通常、金属と樹脂との接合強度は弱くなる傾向にある。従って、例えば銅からなる構造物と、例えばアルミニウムからなる構造物とは、エポキシ樹脂等を介さずに、直接接合されることが好ましい。
In the technique described in Patent Document 1, an insulating resin layer made of an epoxy resin is formed between a metal wiring made of copper or the like and a heat sink made of aluminum or the like. However, usually, the bonding strength between the metal and the resin tends to be weak. Therefore, it is preferable that the structure made of, for example, copper and the structure made of, for example, aluminum are directly joined without using an epoxy resin or the like.
しかし、本発明者らが検討したところによると、アルミニウムと銅とを単に接合させると、接合界面において、アルミニウムと銅とからなる金属間化合物が形成することがわかった。そして、この金属間化合物は脆いため、その接合界面において、クラック等が容易に発生し易いことがわかった。即ち、特許文献１において、銅等からなる金属配線と、アルミニウム等からなるヒートシンクとを単に接合させようとすると、それらの接合界面に脆い金属間化合物が形成される結果、接合強度が不十分になることが分かった。従って、特許文献１に記載の技術では、異種金属同士を接合させるとき、接合させる金属の組み合わせによっては接合強度が不十分になることがある。
However, according to a study by the present inventors, it was found that when aluminum and copper are simply joined, an intermetallic compound composed of aluminum and copper is formed at the joining interface. And since this intermetallic compound was brittle, it turned out that a crack etc. are easy to generate | occur | produce easily in the joining interface. That is, in Patent Document 1, when a metal wiring made of copper or the like and a heat sink made of aluminum or the like are simply joined, a brittle intermetallic compound is formed at the joining interface, resulting in insufficient joining strength. I found out that Therefore, in the technique described in Patent Document 1, when different kinds of metals are joined together, the joining strength may be insufficient depending on the combination of metals to be joined.
本発明はこのような課題に鑑みてなされたものであり、本発明が解決しようとする課題は、十分な接合強度を有しつつ、従来よりも様々な異種金属同士を接合可能な異種金属接合構造物、並びにその製造方法及びそれを備える水冷電力変換素子を提供することにある。
The present invention has been made in view of such problems, and the problem to be solved by the present invention is to dissimilar metal joints capable of joining various dissimilar metals to each other while having sufficient joint strength. The object is to provide a structure, a manufacturing method thereof, and a water-cooled power conversion element including the structure.
本発明者らは前記課題を解決するため、鋭意検討を行った。その結果、以下の知見を見出した。即ち、本発明の異種金属接合構造物は、第一の金属により構成される金属基材と、前記金属基材上に形成され、第二の金属により構成されるコーティング層と、前記金属基材と前記コーティング層との間に形成された、前記第一の金属と前記第二の金属とが合金化してなる金属間化合物層と、前記コーティング層上に形成され、前記第二の金属と第三の金属とが混合溶融されてなる混合溶融凝固部が、前記金属基材に対して垂直な方向に複数積層されてなる積層構造物と、を備えるものである。
The present inventors have intensively studied to solve the above problems. As a result, the following findings were found. That is, the dissimilar metal joining structure of the present invention includes a metal base composed of a first metal, a coating layer formed on the metal base and composed of a second metal, and the metal base. And an intermetallic compound layer formed by alloying the first metal and the second metal, and formed on the coating layer. A mixed molten and solidified portion obtained by mixing and melting three metals is provided with a stacked structure in which a plurality of layers are stacked in a direction perpendicular to the metal substrate.
また、本発明の異種金属接合構造物の製造方法は、第二の金属により構成されるコーティング層が形成された金属基材上に、第三の金属を配置する金属第一配置工程と、前記金属第一配置工程において配置された前記第三の金属の側から、前記第三の金属に対してレーザ光を照射することで前記第三の金属と前記第二の金属とを混合溶融させて混合溶融凝固部を形成するとともに、前記レーザ光の照射によって生じる熱によって、前記コーティング層を構成する前記第二の金属と前記金属基材を構成する第一の金属とを合金化させて金属間化合物層を形成する混合溶融・合金層形成工程と、前記混合溶融・合金層形成工程を複数回繰り返すことで、前記混合溶融凝固部が前記金属基材に対して垂直な方向に複数積層されてなる積層構造物を形成する積層工程と、を含むものである。
Further, in the method for producing a dissimilar metal bonded structure according to the present invention, the metal first disposing step of disposing a third metal on the metal substrate on which the coating layer composed of the second metal is formed, The third metal and the second metal are mixed and melted by irradiating the third metal with laser light from the side of the third metal arranged in the first metal arrangement step. The mixed molten and solidified part is formed, and the second metal that constitutes the coating layer and the first metal that constitutes the metal base material are alloyed by heat generated by the irradiation of the laser beam to form an intermetallic By repeating the mixed melting / alloy layer forming step of forming a compound layer and the mixed melting / alloy layer forming step a plurality of times, a plurality of the mixed molten solidified portions are stacked in a direction perpendicular to the metal substrate. A laminated structure A laminating step of forming, is intended to include.
さらに、本発明の水冷電力変換素子は、第一の金属により構成される金属基材と、前記金属基材上に形成され、第二の金属により構成されるコーティング層と、前記金属基材と前記コーティング層との間に形成された、前記第一の金属と前記第二の金属とが合金化してなる金属間化合物層と、前記コーティング層上に形成され、前記第二の金属と第三の金属とが混合溶融されてなる混合溶融凝固部が、前記金属基材に対して垂直な方向に複数積層されてなる積層構造物と、を備える異種金属接合構造物と、前記金属部材に対して熱的に接触している電力変換素子と、を備え、前記積層構造物には、前記電力変換素子を冷却する冷媒が接触しているものである。
Furthermore, the water-cooled power conversion element of the present invention includes a metal substrate composed of a first metal, a coating layer formed on the metal substrate and composed of a second metal, and the metal substrate. An intermetallic compound layer formed by alloying the first metal and the second metal formed between the coating layer, and the second metal and the third metal layer formed on the coating layer. A heterogeneous metal joining structure comprising: a laminated structure in which a plurality of mixed molten and solidified portions obtained by mixing and melting a plurality of metals are stacked in a direction perpendicular to the metal substrate; and the metal member A power conversion element that is in thermal contact, and the laminated structure is in contact with a refrigerant that cools the power conversion element.
本発明によれば、十分な接合強度を有しつつ、従来よりも様々な異種金属同士を接合可能な異種金属接合構造物、並びにその製造方法及びそれを備える水冷電力変換素子を提供することができる。
According to the present invention, it is possible to provide a dissimilar metal joining structure capable of joining various dissimilar metals to each other while having sufficient joining strength, a manufacturing method thereof, and a water-cooled power conversion element including the same. it can.
以下、図面を適宜参照しながら、本発明を実施するための形態（本実施形態）を説明する。
Hereinafter, a form for carrying out the present invention (this embodiment) will be described with reference to the drawings as appropriate.
図１は、本実施形態の異種金属接合構造物１００を備える水冷電力変換素子１１０の一部を抜き出した斜視図である。即ち、図１は、水冷電力変換素子１１０を構成する、異種金属接合構造物１００及びそれと接合した電力変換素子１０を示すものである。異種金属接合構造物１００は、伝熱板１（金属基材）と、めっき層２（コーティング層）と、水冷フィン１１（図３等に示す積層構造物６に相当する）とを備えて構成される。そして、伝熱板１には、電力変換素子１０（インバータ）が接合されている。電流変換素子１０は直流電流を交流に変換、もしくは交流電流を直流電流に変換する素子である。
FIG. 1 is a perspective view of a part of a water-cooled power conversion element 110 provided with a dissimilar metal joint structure 100 according to this embodiment. That is, FIG. 1 shows the dissimilar metal junction structure 100 and the power conversion element 10 joined thereto, which constitute the water-cooled power conversion element 110. The dissimilar metal joining structure 100 includes a heat transfer plate 1 (metal substrate), a plating layer 2 (coating layer), and water-cooled fins 11 (corresponding to the laminated structure 6 shown in FIG. 3 and the like). Is done. A power conversion element 10 (inverter) is joined to the heat transfer plate 1. The current conversion element 10 is an element that converts a direct current into an alternating current or converts an alternating current into a direct current.
詳細は図２を参照しながら後記するが、水冷フィン１１には、水１２（図２参照）が接触している。これにより、電力変換素子１０による電流変換によって生じた熱は、伝熱板１、めっき層２及び水冷フィン１１を伝熱して当該水に放熱され、これにより、電力変換素子１０の冷却が行われるようになっている。
Details will be described later with reference to FIG. 2, but water 12 (see FIG. 2) is in contact with the water-cooled fins 11. Thereby, the heat generated by the current conversion by the power conversion element 10 is transferred to the heat transfer plate 1, the plating layer 2, and the water-cooled fins 11 to be dissipated to the water, thereby cooling the power conversion element 10. It is like that.
図２は、本実施形態の異種金属接合構造物１００を備える水冷電力変換素子１１０の断面図である。図２では、図示を簡略化するため、電流変換素子１０の端子等、部材の一部を省略して記載している。水冷電力変換素子１１０において、放熱板１、めっき層２及び水冷フィン１１（積層構造体６）からなる異種金属接合構造物１００は、アルミケース１５及びアルミ蓋１６で囲まれている。そして、めっき層２とアルミ蓋１６との間には、水１２が紙面奥方向に流れるようになっている。
FIG. 2 is a cross-sectional view of the water-cooled power conversion element 110 including the dissimilar metal junction structure 100 of the present embodiment. In FIG. 2, in order to simplify the illustration, some of the members such as the terminals of the current conversion element 10 are omitted. In the water-cooled power conversion element 110, a dissimilar metal joint structure 100 including the radiator plate 1, the plating layer 2, and the water-cooled fin 11 (laminated structure 6) is surrounded by an aluminum case 15 and an aluminum lid 16. And between the plating layer 2 and the aluminum lid | cover 16, the water 12 flows in the paper surface back direction.
また、アルミケース１５と伝熱板１との間にも、電流変換素子１０への水１２の漏れを防止するため、レーザ溶接により重ね溶接部１３が形成されている。さらに、アルミケース１５とアルミ蓋１６との接合部にも、同様に水１２の外部への漏れを防止するため、レーザ溶接によって突合せ溶接部１４が形成されている。重ね溶接部１３及び突き合わせ溶接部１４のいずれにおいても、同じ金属同士（アルミニウム同士）の溶接であるため、十分な接合強度が確保されている。
Also, a lap weld 13 is formed between the aluminum case 15 and the heat transfer plate 1 by laser welding in order to prevent leakage of water 12 to the current conversion element 10. Further, a butt weld 14 is also formed by laser welding at the joint between the aluminum case 15 and the aluminum lid 16 in order to prevent the water 12 from leaking to the outside. In any of the lap welds 13 and the butt welds 14, since the same metal (aluminum) is welded, sufficient joint strength is ensured.
本実施形態では、伝熱板１はアルミニウム（第一の金属）により構成され、めっき層２はニッケル（第二の金属）により構成され、水冷フィン１１は銅（第三の金属）により構成されている。これらのように、異種金属接合構造物１００において比較的大きな体積を有する伝熱板１では、アルミニウムという軽量な金属を用いることで、軽量化の向上が図られている。また、めっき層２をニッケルにより構成することで、めっき法を利用しためっき層２の形成のし易さから、製造コスト削減を図っている。さらに、水冷フィン１１は、異種金属接合構造物１００において占める体積が比較的小さいため、アルミニウムよりも伝熱性の高い銅を用いることで、水への放熱性をより高めることができるようになっている。
In this embodiment, the heat transfer plate 1 is made of aluminum (first metal), the plating layer 2 is made of nickel (second metal), and the water-cooled fins 11 are made of copper (third metal). ing. As described above, in the heat transfer plate 1 having a relatively large volume in the dissimilar metal joint structure 100, the weight reduction is achieved by using a light metal such as aluminum. In addition, since the plating layer 2 is made of nickel, the manufacturing cost is reduced because the plating layer 2 is easily formed using a plating method. Furthermore, since the water-cooled fin 11 occupies a relatively small volume in the dissimilar metal joint structure 100, heat dissipation to water can be further improved by using copper having higher heat conductivity than aluminum. Yes.
即ち、めっき層２を設けることで、従来の技術では接合強度に課題のあるためで困難であった、銅製の水冷フィンを、アルミニウム製の伝熱板１上に配置することができる。前記のように銅は熱伝導性に優れることから、水冷電力変換素子１１０をこのように構成することで、電力変換素子１０の放熱性を従来よりも高めることができ、電力変換素子１０の耐久性を向上させることができる。
That is, by providing the plating layer 2, it is possible to dispose the copper water-cooled fin on the aluminum heat transfer plate 1, which is difficult because the conventional technique has a problem in the bonding strength. As described above, since copper is excellent in thermal conductivity, by configuring the water-cooled power conversion element 110 in this manner, the heat dissipation of the power conversion element 10 can be enhanced as compared with the conventional case, and the durability of the power conversion element 10 is improved. Can be improved.
また、水冷電力変換素子１１０では、従来の樹脂等を用いずに、金属により構成されるめっき層を介して、異種金属であるアルミニウムと銅とが接合されている。そのため、アルミニウムと銅との熱伝導性が、樹脂を介する場合と比較して格段に優れる。従って、この点においても、電力変換素子１０の放熱性が従来よりもさらに高められ、電力変換素子１０の耐久性をより向上させることができる。
Further, in the water-cooled power conversion element 110, aluminum and copper, which are different metals, are joined through a plating layer made of metal without using a conventional resin or the like. Therefore, the thermal conductivity between aluminum and copper is remarkably excellent as compared with the case of using a resin. Therefore, also in this respect, the heat dissipation of the power conversion element 10 can be further enhanced as compared with the conventional case, and the durability of the power conversion element 10 can be further improved.
図３は、図２のＡ部拡大図であり、本実施形態の異種金属接合構造物１００における積層構造物６の近傍を拡大して示した図である。図３に示すように、積層構造物６（図１における冷却フィン１１に相当）は、混合溶融凝固部４が伝熱板１に垂直な方向（以下、「上下方向」という）に複数積層されてなるものである。本実施形態では、混合溶融凝固部４は、上下方向に８層積層されてなる。従って、電子顕微鏡により積層構造物６の断面を観察したときに、積層構造物６の断面では金属組織が一様な断面（界面が観察されない）とはなっておらず、混合溶融凝固部４の金属組織が８層積層（堆積）していることが確認可能である。
FIG. 3 is an enlarged view of a portion A in FIG. 2 and is an enlarged view of the vicinity of the laminated structure 6 in the dissimilar metal bonded structure 100 of the present embodiment. As shown in FIG. 3, the laminated structure 6 (corresponding to the cooling fin 11 in FIG. 1) has a plurality of mixed molten and solidified portions 4 laminated in a direction perpendicular to the heat transfer plate 1 (hereinafter referred to as “vertical direction”). It will be. In the present embodiment, the mixed molten and solidified portion 4 is formed by laminating eight layers in the vertical direction. Therefore, when the cross section of the laminated structure 6 is observed with an electron microscope, the metal structure is not a uniform cross section (no interface is observed) in the cross section of the laminated structure 6. It can be confirmed that eight layers of metal structure are laminated (deposited).
前記のように、本実施形態では、めっき層２はニッケルにより構成され、積層構造物６は銅により構成される。ただし、詳細は、異種金属接合構造物１００の製造方法を説明しながら後記するが、積層構造物６は、めっき層２の表面に配置された銅粉末と、めっき層２中のニッケルとが混合溶融してなる。そのため、積層構造物６においては、めっき層２の近傍に存在する混合溶融凝固部４ほど、ニッケルの含有量が多くなり、銅の含有量が少なくなる。一方で、めっき層２から離れた混合溶融凝固部４ほど、ニッケルの含有量が少なくなり、銅の含有量が多くなる。これらのように、積層混合物６では、めっき層２に含まれるニッケル及び銅の濃度が、めっき層２から遠ざかるにつれて、徐々に変化するようになっている。即ち、ニッケル及び銅の含有量が、傾斜組成になっている。これにより、積層構造物６の凝固の際の残留応力が低減され、積層構造物６の強度が向上する。
As described above, in the present embodiment, the plating layer 2 is made of nickel, and the laminated structure 6 is made of copper. However, details will be described later while explaining the manufacturing method of the dissimilar metal bonded structure 100, but in the laminated structure 6, the copper powder disposed on the surface of the plating layer 2 and the nickel in the plating layer 2 are mixed. It is melted. Therefore, in the laminated structure 6, the nickel content increases and the copper content decreases as the mixed molten and solidified portion 4 present in the vicinity of the plating layer 2. On the other hand, the content of nickel decreases and the content of copper increases as the mixed molten and solidified portion 4 is separated from the plating layer 2. As described above, in the laminated mixture 6, the concentrations of nickel and copper contained in the plating layer 2 gradually change as the distance from the plating layer 2 increases. That is, the content of nickel and copper has a gradient composition. Thereby, the residual stress at the time of solidification of the laminated structure 6 is reduced, and the strength of the laminated structure 6 is improved.
めっき層２を構成するニッケルと、めっき層２の表面に配置された銅とは、合金化せずに単に混合されるような異種金属の組み合わせである。前記のように、異種金属同士が合金化した合金（金属間化合物）のなかには、脆いものもある。そこで、合金化せずに単に混合している状態の混合溶融凝固部４を形成することで、異種金属同士の接合強度の向上が図られる。ただし、異種金属同士が合金化した合金が混合溶融凝固部４に含まれることを完全に排除するものではなく、異種金属同士の少なくとも一部（好ましくは全部）が溶融混合された状態であれば十分な接合強度が維持される。
The nickel constituting the plating layer 2 and the copper disposed on the surface of the plating layer 2 are a combination of dissimilar metals that are simply mixed without being alloyed. As described above, some alloys (intermetallic compounds) in which different metals are alloyed are brittle. Therefore, by forming the mixed molten and solidified portion 4 that is simply mixed without being alloyed, the bonding strength between different metals can be improved. However, it does not completely exclude that an alloy in which different kinds of metals are alloyed is included in the mixed melt-solidified portion 4, and if at least a part (preferably all) of the different kinds of metals are melt-mixed. Sufficient bonding strength is maintained.
また、伝熱板１とめっき層２との間であって、積層構造物６の下方には、伝熱板１に含まれるアルミニウムと、めっき層２に含まれるニッケルとが合金化した金属間化合物層５が形成されている。そして、積層構造物６の下方以外の部分では、伝熱板１とめっき層２とは直接接合している。伝熱板１とめっき層２との間に形成される金属間化合物層５は、アルミニウム－ニッケル合金により構成されている。これは、混合溶融凝固部４の形成時にレーザ光によって与えられる熱が、めっき層２の内部を伝わって伝熱板１に到達することによる。即ち、めっき層２の内部を伝わった熱によって、めっき層２中のニッケルと、伝熱板１中のアルミニウムとがこれらの接合界面において反応し、ニッケルとアルミニウムとが合金化するためである。そのため、金属間化合物層５は、積層構造物６の下方に形成されることになる。
Further, between the heat transfer plate 1 and the plating layer 2, and below the laminated structure 6, there is an intermetallic between the aluminum contained in the heat transfer plate 1 and the nickel contained in the plating layer 2. A compound layer 5 is formed. And in the part other than the downward direction of the laminated structure 6, the heat exchanger plate 1 and the plating layer 2 are directly joined. The intermetallic compound layer 5 formed between the heat transfer plate 1 and the plating layer 2 is made of an aluminum-nickel alloy. This is because the heat given by the laser beam when forming the mixed molten and solidified portion 4 is transmitted through the inside of the plating layer 2 and reaches the heat transfer plate 1. That is, this is because nickel in the plating layer 2 and aluminum in the heat transfer plate 1 react with each other at the bonding interface due to heat transmitted through the inside of the plating layer 2, and nickel and aluminum are alloyed. Therefore, the intermetallic compound layer 5 is formed below the laminated structure 6.
本実施形態において、コーティング層であるめっき層２は、均一な厚さの薄膜の形成のし易さや、製造コスト等の観点から、めっき法により形成される。コーティング層がめっき法により形成されたものであるか否かは、コーティング層の断面を電子顕微鏡写真で観察することで確認可能である。即ち、コーティング層がめっき法で形成されためっき層２である場合には、めっき層２の断面においては、金属組織の界面が無く、一様な状態として観察される。
In the present embodiment, the plating layer 2 which is a coating layer is formed by a plating method from the viewpoint of easy formation of a thin film having a uniform thickness, manufacturing cost, and the like. Whether or not the coating layer is formed by a plating method can be confirmed by observing a cross section of the coating layer with an electron micrograph. That is, when the coating layer is the plating layer 2 formed by the plating method, the cross section of the plating layer 2 is observed as a uniform state with no metal structure interface.
コーティング層がめっき層２である本実施形態では、伝熱板１とめっき層２との接合強度は比較的低くなっている。しかし、前記の混合溶融凝固部４の形成時に金属間化合物層５が並行して形成されることで、伝熱板１とめっき層２との接合強度が高められる。即ち、ニッケルとアルミニウムとの合金化により、伝熱板１とめっき層２との間で、ニッケル－アルミニウム合金の拡散接合が生じることになる。これにより、伝熱板１とめっき層２とは金属的に接合されることになり、これらの接合強度が向上する。従って、製造コストや形成の容易さに基づいて選択されためっき法により形成されためっき層２であっても、十分な接合強度が得られる。
In the present embodiment in which the coating layer is the plating layer 2, the bonding strength between the heat transfer plate 1 and the plating layer 2 is relatively low. However, the joint strength between the heat transfer plate 1 and the plating layer 2 is increased by forming the intermetallic compound layer 5 in parallel with the formation of the mixed molten and solidified portion 4. That is, the nickel-aluminum alloying causes diffusion bonding of the nickel-aluminum alloy between the heat transfer plate 1 and the plating layer 2. Thereby, the heat exchanger plate 1 and the plating layer 2 will be joined metallically, and these joint strengths will improve. Therefore, sufficient bonding strength can be obtained even with the plating layer 2 formed by a plating method selected based on manufacturing cost and ease of formation.
なお、ニッケル－アルミニウム合金は脆い化合物になることがある。しかし、金属間化合物層５は、混合溶融凝固部４の形成時に伝わった熱によって形成されるため、その化合物の生成量はそれほど多くない。また、形成される金属間化合物層５も極めて薄くなるため、脆い化合物による接合強度の低下は十分に抑制される。
Note that nickel-aluminum alloys may become brittle compounds. However, since the intermetallic compound layer 5 is formed by the heat transferred during the formation of the mixed molten and solidified portion 4, the amount of the compound generated is not so large. Moreover, since the intermetallic compound layer 5 to be formed is also extremely thin, a decrease in bonding strength due to a brittle compound is sufficiently suppressed.
前記のように、本実施形態では、めっき層２はニッケル（第二の金属）により構成され、混合溶融凝固部４及びそれが積層されてなる積層構造物６（めっき層２の表面に配置される金属粉）は銅（第三の金属）により構成される。しかし、第二の金属及び第三の金属は、これらに限定されるものではない。ただし、第二の金属及び第三の金属のうちの少なくとも一方は、全率固溶体であることが好ましい。また、第二の金属及び第三の金属のいずれもが全率固溶体であることがより好ましい。全率固溶体の金属同士を用いることで、脆い金属間化合物を形成しないからである。このような全率固溶体の具体例としては、ニッケル及びその合金、銅及びその合金、鉄及びその合金等が挙げられる。
As described above, in the present embodiment, the plating layer 2 is made of nickel (second metal), and the mixed molten solidified portion 4 and the laminated structure 6 (the plating layer 2 is disposed on the surface). Metal powder) is made of copper (third metal). However, the second metal and the third metal are not limited to these. However, it is preferable that at least one of the second metal and the third metal is a complete solid solution. Moreover, it is more preferable that both of the second metal and the third metal are a solid solution. It is because a brittle intermetallic compound is not formed by using metals of all solid solutions. Specific examples of such a total solid solution include nickel and its alloys, copper and its alloys, iron and its alloys, and the like.
また、第二の金属と第三の金属との組み合わせとしては、ある金属と、その金属を含む合金との組み合わせも好ましい。例えば、アルミニウムと、アルミニウムを含む合金（アルミニウム合金）との組み合わせや、銅と、銅を含む合金（銅合金）との組み合わせ等が挙げられる。例えば前者の場合、第二の金属はアルミニウムであり、第三の金属はアルミニウム合金となる。
Also, as a combination of the second metal and the third metal, a combination of a certain metal and an alloy containing the metal is also preferable. For example, the combination of aluminum and the alloy (aluminum alloy) containing aluminum, the combination of copper and the alloy (copper alloy) containing copper, etc. are mentioned. For example, in the former case, the second metal is aluminum and the third metal is an aluminum alloy.
また、伝熱板１に含まれる金属（第一の金属）は、特に制限されない。ただし、第一の金属が前記第三の金属と反応して脆い合金が生成するような場合に、本発明の効果が特に大きく発揮される。具体的には例えば、第一の金属がアルミニウムであり、第三の金属が銅であるような場合である。そこで、伝熱板１に含まれる金属は、前記積層構造物６に含まれる金属の種類に応じて適宜設定すればよい。
Further, the metal (first metal) contained in the heat transfer plate 1 is not particularly limited. However, when the first metal reacts with the third metal to form a brittle alloy, the effect of the present invention is particularly greatly exerted. Specifically, for example, the first metal is aluminum and the third metal is copper. Therefore, the metal contained in the heat transfer plate 1 may be appropriately set according to the type of metal contained in the laminated structure 6.
これらの点に基づいて、伝熱板１、めっき層２及び積層構造物６のそれぞれに用いられる金属の組み合わせとして、以下の表１に記載の組み合わせが考えられる。ただし、表１に示す組み合わせは例であり、表１に記載の組み合わせになんら限定されない。なお、１番目の組み合わせは、前記の実施形態において用いた組み合わせである。
Based on these points, the combinations shown in Table 1 below can be considered as combinations of metals used for the heat transfer plate 1, the plating layer 2, and the laminated structure 6. However, the combinations shown in Table 1 are examples and are not limited to the combinations shown in Table 1. The first combination is the combination used in the above embodiment.
伝熱板１、めっき層２及び金属間化合物層５の厚さや、混合溶融凝固部４の大きさ、積層構造物６の高さ等の各寸法に特に制限はない。例えば、伝熱板１の厚さは３ｍｍ程度とすることができる。また、めっき層２の厚さは例えば４０μｍ程度とすることができる。さらに、金属間化合物層５の厚さは、十分な接合強度を得る観点から、例えば５μｍ以下とすることができ、より具体的には例えば０．８μｍ程度とすることができる。
There are no particular restrictions on the dimensions such as the thickness of the heat transfer plate 1, the plating layer 2, and the intermetallic compound layer 5, the size of the mixed molten and solidified portion 4, and the height of the laminated structure 6. For example, the thickness of the heat transfer plate 1 can be about 3 mm. Moreover, the thickness of the plating layer 2 can be about 40 μm, for example. Furthermore, the thickness of the intermetallic compound layer 5 can be set to, for example, 5 μm or less, more specifically, for example, about 0.8 μm from the viewpoint of obtaining sufficient bonding strength.
次に、図４～図９を参照しながら、積層構造物６の製造方法（即ち、異種金属接合構造物の製造方法）を説明する。積層構造物６の製造方法は、所謂パウダーベット法ともいわれる方法である。
Next, a method for manufacturing the laminated structure 6 (that is, a method for manufacturing a dissimilar metal joint structure) will be described with reference to FIGS. The manufacturing method of the laminated structure 6 is a so-called powder bed method.
図４は、伝熱板１に銅粉末（第三の金属）を塗布した後の断面図である。図４では、ニッケル（第二の金属）のめっき層２が形成されたアルミニウム（第一の金属）の伝熱板１の表面に対して、アトマイズ法により製造した球状の銅粉末３が配置固定された様子が示されている（第三金属配置工程）。ただし、銅粉末３は、めっき層２の表面に固定されている必要は必ずしもなく、めっき層２の表面に配置されていればよい。めっき層２の形成は、例えば電気めっき法により行うことができる。また、めっき層２がめっき法により形成されたものであるかどうかの確認は、前記のように、めっき層２の断面を電子顕微鏡写真により観察することで確認することができる。
FIG. 4 is a cross-sectional view after applying copper powder (third metal) to the heat transfer plate 1. In FIG. 4, the spherical copper powder 3 manufactured by the atomizing method is arranged and fixed on the surface of the aluminum (first metal) heat transfer plate 1 on which the plating layer 2 of nickel (second metal) is formed. This is shown (third metal placement step). However, the copper powder 3 does not necessarily need to be fixed to the surface of the plating layer 2 and may be disposed on the surface of the plating layer 2. The plating layer 2 can be formed by, for example, an electroplating method. Moreover, confirmation of whether the plating layer 2 is formed by the plating method can be confirmed by observing the cross section of the plating layer 2 with an electron micrograph as described above.
めっき層２の表面に配置固定される銅粉末３の大きさは、粒径として例えば２０μｍ～５０μｍ程度とすることができる。また、銅粉末３が配置固定されてなる層（めっき層２のさらに外側に形成される層）の厚さは１００μｍ程度とすることができる。
The size of the copper powder 3 arranged and fixed on the surface of the plating layer 2 can be set to, for example, about 20 μm to 50 μm as a particle size. In addition, the thickness of the layer in which the copper powder 3 is arranged and fixed (the layer formed on the outer side of the plating layer 2) can be about 100 μm.
図５は、図４に示す状態において、所望の位置にレーザ光を照射している状態を示す断面図である。レーザ光は、図５では図示していないが、紙面の手前側から奥側に向かって照射されている。レーザ光の照射により、銅粉末３とめっき層２の表面のニッケルとが溶融し、これらが混合された後に放熱（例えば冷却）されてなる混合溶融凝固部４が形成される（混合溶融・合金層形成工程）。特に、放熱中、ニッケルと銅とは十分に混合されているものの、比較的比重の大きい銅が下側に向かう傾向にあり、一方で、比較的比重の小さいニッケルが上側に向かう傾向にある。従って、混合溶融凝固部４では、上側にニッケルが、下側に銅が存在する傾向にある。
FIG. 5 is a cross-sectional view showing a state where a desired position is irradiated with laser light in the state shown in FIG. Although not shown in FIG. 5, the laser light is emitted from the front side of the paper to the back side. By irradiation with laser light, the copper powder 3 and nickel on the surface of the plating layer 2 are melted, and after these are mixed, a mixed melt solidified portion 4 is formed by heat dissipation (for example, cooling) (mixed melt / alloy). Layer forming step). In particular, during heat dissipation, although nickel and copper are sufficiently mixed, copper having a relatively high specific gravity tends to move downward, while nickel having a relatively low specific gravity tends to move upward. Therefore, in the mixed melt solidification part 4, nickel tends to exist on the upper side and copper on the lower side.
また、めっき層２は金属であるため、銅粉末３等が溶融するために用いられる熱の一部は、めっき層２を通じて、伝熱板１とめっき層２との接合界面に到達する。そうすると、この接合界面では、異種金属同士が接合しているため、その部分から双方の金属の溶融が開始され、これらの金属が合金化する。これにより、伝熱板１とめっき層２との間であって、混合溶融凝固部４の下方に、金属間化合物層５が形成することになる（混合溶融・合金層形成工程）。
Further, since the plating layer 2 is a metal, a part of heat used for melting the copper powder 3 or the like reaches the bonding interface between the heat transfer plate 1 and the plating layer 2 through the plating layer 2. Then, since dissimilar metals are joined at this joining interface, melting of both metals starts from that portion, and these metals are alloyed. As a result, the intermetallic compound layer 5 is formed between the heat transfer plate 1 and the plating layer 2 and below the mixed melting and solidifying portion 4 (mixed melting / alloy layer forming step).
金属間化合物層５の形成開始後、レーザ光の照射による伝熱が続く間は、めっき層２においては上方向に、伝熱板１においては下方向に、それぞれの金属の溶融範囲が拡大することになる。従って、金属間化合物層５において、中央近傍ではアルミニウム濃度とニッケル濃度は合金化しているため略同じであるが、中央近傍から上方向に遠ざかるにつれて、ニッケル濃度は上昇し、アルミニウム濃度は低下することになる。一方で、中央近傍から下方向に遠ざかるにつれて、アルミニウム濃度は上昇し、ニッケル濃度は低下することになる。そのため、図５等では、図示の都合上、金属間化合物層５と、伝熱板１及びめっき層２との界面を明示しているが、実際には、これらの界面は判断できないことが多い。
After the start of the formation of the intermetallic compound layer 5, the melting range of each metal expands in the upward direction in the plating layer 2 and in the downward direction in the heat transfer plate 1 while heat transfer by laser light irradiation continues. It will be. Therefore, in the intermetallic compound layer 5, the aluminum concentration and the nickel concentration are almost the same in the vicinity of the center because they are alloyed, but the nickel concentration increases and the aluminum concentration decreases as the distance from the center increases upward. become. On the other hand, the aluminum concentration increases and the nickel concentration decreases with increasing distance from the vicinity of the center. Therefore, in FIG. 5 etc., the interface between the intermetallic compound layer 5 and the heat transfer plate 1 and the plating layer 2 is clearly shown for the convenience of illustration, but in reality, these interfaces cannot often be determined. .
このように、本実施形態では、めっき層２の表面及び銅粉末３のみが溶融する条件で、レーザ光の照射が行われている。これにより、ニッケルと銅とが混合してなる強固な混合溶融凝固部４が形成され、優れた接合強度を有する異種金属接合構造物１００が得られる。また、混合溶融凝固部４の生成中に用いられる熱の一部がめっき層２内を伝達し、金属間化合物層５が形成される。金属間化合物５が形成されることで、伝熱板１とめっき層２との間の接合強度を高めることができる。このように、前記の混合溶融凝固部４に加えて金属間化合物層５が形成されていることで、構造物全体として、従来よりも接合強度が十分優れた異種金属接合構造物１００を得ることができる。
Thus, in this embodiment, laser light irradiation is performed under the condition that only the surface of the plating layer 2 and the copper powder 3 are melted. As a result, a strong mixed melt-solidified portion 4 formed by mixing nickel and copper is formed, and a dissimilar metal bonded structure 100 having excellent bonding strength is obtained. Further, part of the heat used during the generation of the mixed molten and solidified portion 4 is transmitted through the plating layer 2 to form the intermetallic compound layer 5. By forming the intermetallic compound 5, the bonding strength between the heat transfer plate 1 and the plating layer 2 can be increased. As described above, the intermetallic compound layer 5 is formed in addition to the mixed melt-solidified portion 4, thereby obtaining the dissimilar metal bonded structure 100 having sufficiently higher bonding strength than the conventional structure as a whole structure. Can do.
一方で、レーザ光の照射が強力なものであると、めっき層２が貫通して溶融されてしまい、金属間化合物層５が形成されない可能性がある。また、この場合、伝熱板１も溶融してしまい、アルミニウムと銅粉末３とが反応して、脆い合金を形成してしまう可能性がある。そこで、本実施形態では、めっき層２の表面及び銅粉末３の双方を溶融可能な程度に弱い条件でレーザ光を照射すればよい。
On the other hand, if the laser beam irradiation is strong, the plating layer 2 may be penetrated and melted, and the intermetallic compound layer 5 may not be formed. In this case, the heat transfer plate 1 is also melted, and aluminum and the copper powder 3 may react to form a brittle alloy. Therefore, in this embodiment, the laser beam may be irradiated under such a weak condition that both the surface of the plating layer 2 and the copper powder 3 can be melted.
そして、金属間化合物層５の厚さは、伝熱板１とめっき層２との接合界面における温度及びレーザ光の照射時間により制御できる。具体的には、レーザ光の照射時間が長いか、又は、伝熱板１とめっき層２との接合界面から金属間化合物層５までの距離が短いと、厚い金属間化合物層５が生成する傾向にある。従って、レーザ光の照射条件、金属粉末３の塗布条件、めっき層２の厚さ等により、金属間化合物５の構造を制御することができる。
Further, the thickness of the intermetallic compound layer 5 can be controlled by the temperature at the bonding interface between the heat transfer plate 1 and the plating layer 2 and the irradiation time of the laser beam. Specifically, if the irradiation time of the laser beam is long or the distance from the bonding interface between the heat transfer plate 1 and the plating layer 2 to the intermetallic compound layer 5 is short, a thick intermetallic compound layer 5 is generated. There is a tendency. Therefore, the structure of the intermetallic compound 5 can be controlled by the irradiation condition of the laser beam, the coating condition of the metal powder 3, the thickness of the plating layer 2, and the like.
例えば、銅粉末３により構成される層の厚さが１００μｍ、ニッケルにより構成されるめっき層２の厚さが４０μｍである場合、波長１０７０ｎｍのレーザ光を照射可能な連続発振のファイバレーザ装置を用い、２枚の反射ミラーを動かして２次元平面をスキャンさせることで、混合溶融凝固部４及び金属間化合物層５を形成することができる。このときの照射条件としては、例えば、ビーム径Φを１００μｍとし、スキャン速度を１００ｍ／ｓとし、レーザ出力を４００Ｗとすることができる。
For example, when the thickness of the layer composed of copper powder 3 is 100 μm and the thickness of the plating layer 2 composed of nickel is 40 μm, a continuous oscillation fiber laser device capable of irradiating laser light with a wavelength of 1070 nm is used. By moving the two reflecting mirrors to scan the two-dimensional plane, the mixed molten solidified portion 4 and the intermetallic compound layer 5 can be formed. As irradiation conditions at this time, for example, the beam diameter Φ can be set to 100 μm, the scan speed can be set to 100 m / s, and the laser output can be set to 400 W.
また、レーザ光の照射は、混合溶融凝固部４の形成途中で溶融した金属の酸化を防止する観点から、不活性ガス（例えばアルゴンガス）中で行うことが好ましい。これにより、不純物（例えば酸化物）の少ない混合溶融凝固部４を形成することができる。
Further, the laser beam irradiation is preferably performed in an inert gas (for example, argon gas) from the viewpoint of preventing the metal melted during the formation of the mixed molten and solidified portion 4 from being oxidized. Thereby, the mixed melt solidification part 4 with few impurities (for example, oxide) can be formed.
図６は、レーザ光の照射位置を少しずつずらしながら都度照射し、５回目のレーザ光を照射する様子を示した断面図である。前記の図５に示す状態では、紙面の手前側から奥側に向かってレーザ光が照射されたが、図６では、照射位置を合計で５回少しずつ右側にずらしてレーザ光を照射した状態が示されている。各回の照射の際には、形成される混合溶融凝固部４が少しずつ重なるようにして、レーザ光が照射されている。
FIG. 6 is a cross-sectional view showing a state in which the laser beam is irradiated each time while the irradiation position of the laser beam is gradually shifted, and the fifth laser beam is irradiated. In the state shown in FIG. 5, the laser beam is irradiated from the near side to the far side of the paper surface. In FIG. 6, the irradiation position is shifted to the right by a total of 5 times and the laser beam is irradiated. It is shown. At the time of each irradiation, the laser beam is irradiated so that the formed mixed molten and solidified portions 4 are overlapped little by little.
また、前記の図５に示した、初めに形成された混合溶融凝固部４はアルミニウムとニッケルとの混合物であったが、２回目以降の照射により形成される混合溶融凝固部４（例えば図６の状態では、混合溶融凝固部４は、アルミニウム及びニッケルに加えて、図５に示した初めに形成された混合溶融凝固部４の成分も含まれている。従って、左右方向に形成される混合溶融凝固部４は同じ成分により形成されるため、割れの無い強固な混合溶融凝固部４が得られる。
In addition, the initially formed mixed molten and solidified portion 4 shown in FIG. 5 was a mixture of aluminum and nickel, but the mixed molten and solidified portion 4 formed by the second and subsequent irradiations (for example, FIG. 6). In this state, the mixed molten and solidified portion 4 includes, in addition to aluminum and nickel, the components of the mixed molten and solidified portion 4 formed at the beginning shown in Fig. 5. Therefore, the mixing formed in the left-right direction is included. Since the melt-solidified part 4 is formed of the same component, a strong mixed melt-solidified part 4 without cracks is obtained.
混合溶融凝固部４の新たな形成にあわせて、新たな金属間化合物層５が形成される。新たに形成される金属間化合物層５に含まれる合金は、既存の合金とともに合金化される。そのため、金属間化合物層５では、単に混合されてなる混合溶融凝固部４とは異なり、境目なく一体に形成される。通常、積層構造物６（図３参照）の大きさ（左右方向の長さ）が大きくなると、伝熱板１からの剥離が生じやすくなる。しかし、本実施形態では、積層構造物６を構成する混合溶融凝固部４の形成にあわせて、伝熱板１とめっき層２との接合強度を向上させる金属間化合物層５が形成される。そのため、積層構造物６の大きさが大きくなっても、十分な接合強度が得られる。
A new intermetallic compound layer 5 is formed in accordance with the new formation of the mixed molten and solidified portion 4. The alloy contained in the newly formed intermetallic compound layer 5 is alloyed together with the existing alloy. Therefore, the intermetallic compound layer 5 is integrally formed with no boundary, unlike the mixed molten and solidified portion 4 simply mixed. Usually, when the size (length in the left-right direction) of the laminated structure 6 (see FIG. 3) is increased, peeling from the heat transfer plate 1 is likely to occur. However, in the present embodiment, the intermetallic compound layer 5 that improves the bonding strength between the heat transfer plate 1 and the plating layer 2 is formed in accordance with the formation of the mixed molten and solidified portion 4 constituting the laminated structure 6. Therefore, even if the size of the laminated structure 6 is increased, sufficient bonding strength can be obtained.
図７は、２層目の混合溶融凝固部４を形成するための銅粉末３を塗布した後の断面図である。図７では、図６に示した状態（紙面手前側から奥側に向かう５本の混合溶融凝固部４が形成された状態）において、さらに別の銅粉末３を図１の状態と同様にして配置固定したものである。即ち、図７では、図５及び図６において形成された混合溶融凝固部４の上に、銅粉末３が配置固定された状態である（第三金属配置工程、積層工程）。
FIG. 7 is a cross-sectional view after applying the copper powder 3 for forming the second layer mixed molten and solidified portion 4. In FIG. 7, in the state shown in FIG. 6 (the state in which five mixed molten and solidified portions 4 are formed from the front side to the back side of the paper), another copper powder 3 is made in the same manner as in the state of FIG. The arrangement is fixed. That is, FIG. 7 shows a state in which the copper powder 3 is arranged and fixed on the mixed molten and solidified portion 4 formed in FIGS. 5 and 6 (third metal arranging step, laminating step).
図８は、図７に示す状態において、２層目の混合溶融凝固部４を形成するための起点となる位置にレーザ光を照射している状態を示す断面図である。この起点は、通常は、一層目（図６に示した状態）のうちの初めに形成された混合溶融凝固部４のレーザ光照射位置（図５に示す位置）と同じになる。この位置でのレーザ光照射が開始されることで、２層目の混合溶融凝固部４の形成が開始される（積層工程）。レーザ光の照射は、図６に示した条件と同様にして行うことができる。
FIG. 8 is a cross-sectional view showing a state in which laser light is radiated to a position serving as a starting point for forming the second layer mixed melt solidification portion 4 in the state shown in FIG. This starting point is usually the same as the laser beam irradiation position (position shown in FIG. 5) of the mixed molten and solidified portion 4 formed at the beginning of the first layer (state shown in FIG. 6). By starting the laser beam irradiation at this position, the formation of the second layer of mixed molten and solidified portion 4 is started (lamination process). The laser light irradiation can be performed in the same manner as the conditions shown in FIG.
図９は、レーザ光の照射位置をずらしながら複数回照射した後、積層構造物を構成する最後の混合溶融凝固部を形成するためのレーザ光を照射している様子を示す断面図である。である。即ち、図５～図７に示す操作を８回繰り返し、上下方向に８層の混合溶融凝固部４を形成した状態を示したものである。このように、上下方向に複数の混合溶融凝固部４が積層されることで、積層構造物６が得られる（積層工程）。そして、図９に示す状態から、めっき層２の表面に残存する未反応の銅粉末３を除去することで、前記の図３に示した異種金属接合構造物１００が得られる。
FIG. 9 is a cross-sectional view showing a state in which a laser beam for irradiating a final mixed molten solidified portion constituting the laminated structure is irradiated after a plurality of irradiations while shifting the irradiation position of the laser beam. It is. That is, the operation shown in FIGS. 5 to 7 is repeated 8 times to show a state in which eight layers of the mixed molten and solidified portion 4 are formed in the vertical direction. Thus, the laminated structure 6 is obtained by laminating | stacking the some mixing melt solidification part 4 to an up-down direction (lamination process). Then, by removing the unreacted copper powder 3 remaining on the surface of the plating layer 2 from the state shown in FIG. 9, the dissimilar metal bonded structure 100 shown in FIG. 3 is obtained.
混合溶融凝固部４が複数積層されてなる積層構造物６においては、前記のように、めっき層２近傍でニッケル濃度は最も高く、先端（上方）に向かうにつれてニッケル濃度は徐々に低下する。一方で、混合溶融凝固部４が上下方向に１層積層形成されるたびに、図７に示すように銅粉末３が塗布固定される。そのため、めっき層２の近傍での銅濃度が最も低く、先端（上方）に向かうにつれて銅濃度が徐々に上昇することになる。
As described above, in the laminated structure 6 in which a plurality of the mixed molten and solidified portions 4 are laminated, the nickel concentration is highest in the vicinity of the plating layer 2, and the nickel concentration gradually decreases toward the tip (upward). On the other hand, whenever one layer of the mixed molten and solidified portion 4 is formed in the vertical direction, the copper powder 3 is applied and fixed as shown in FIG. Therefore, the copper concentration in the vicinity of the plating layer 2 is the lowest, and the copper concentration gradually increases toward the tip (upward).
これらのうち、特にニッケルの濃度は、めっき層２に含まれるニッケルの量が変化しないため、先端に向かうにつれてすぐに低下する。一方で、銅粉末３は、レーザ光照射の都度新たに配置固定するため、銅の濃度は、先端に向かうにつれて比較的すぐに上昇し易い。そのため、ニッケルを含みはするものの、その大部分が銅により構成された積層構造物６が得られる。
Among these, in particular, the concentration of nickel decreases immediately toward the tip because the amount of nickel contained in the plating layer 2 does not change. On the other hand, since the copper powder 3 is newly arranged and fixed every time the laser beam is irradiated, the concentration of copper tends to rise relatively quickly toward the tip. Therefore, although it contains nickel, the laminated structure 6 in which most of the structure is made of copper is obtained.
また、積層構造物６では、前記のように組成が傾斜的に変化している（傾斜組成）。そして、この傾斜組成により、熱膨張係数も次第に変化する。そのため、凝固時の残留応力が低減され、変形が低減され、割れのない高強度の異種金属接合構造物１００が得られる。
In the laminated structure 6, the composition changes in a gradient as described above (gradient composition). The thermal expansion coefficient gradually changes due to the gradient composition. Therefore, the residual stress at the time of solidification is reduced, deformation is reduced, and a high-strength dissimilar metal bonded structure 100 without cracks is obtained.
以上のように、例えば、アルミニウムと銅と等、脆い化合物を形成してしまうため接合が困難であった異種金属同士を、めっき層２を介することで、接合強度が高い異種金属接合構造物１００を製造することができる。特に、樹脂等を介さず、金属のみにより接合することができるため、接合強度を十分に高めることができる。そして、接合に用いられるめっき層２は、接合する各金属に応じて適宜に選択可能であるため、接合強度の観点から従来は接合が難しかった異種金属同士を、十分な接合強度で接合することができる。
As described above, for example, a dissimilar metal bonded structure 100 having high bonding strength is obtained by interposing the dissimilar metals, which are difficult to bond because they form a brittle compound such as aluminum and copper, through the plating layer 2. Can be manufactured. In particular, since bonding can be performed only with metal without using a resin or the like, the bonding strength can be sufficiently increased. And since the plating layer 2 used for joining can be appropriately selected according to each metal to be joined, dissimilar metals that were conventionally difficult to join from the viewpoint of joining strength should be joined with sufficient joining strength. Can do.
図１０は、本実施形態の異種金属接合構造物１００を適用した別の実施形態である冷却金型１２０の断面図である。冷却金型１２０（異種金属接合構造物）は、溶融樹脂等を成型するための金型成型部２５（積層構造物）と、金型成型部２５を冷却するための水が通流する内部流路２２と、金型成型部２５からの熱を水に伝熱するためのベース板２１（金属基材）とを備えている。
なお、金型成型部２５は、前記の積層構造物６と同様に混合溶融凝固部４が積層されてなるが、図１０では図示の都合上、金型成型部２５は一様なものとして示し、また、金型成型部２５と混合溶融凝固部４との境界を明示している。 FIG. 10 is a cross-sectional view of a coolingmold 120 according to another embodiment to which the dissimilar metal bonding structure 100 of the present embodiment is applied. The cooling mold 120 (dissimilar metal joint structure) is an internal flow through which a mold molding part 25 (laminated structure) for molding a molten resin and water for cooling the mold molding part 25 flows. A path 22 and a base plate 21 (metal substrate) for transferring heat from the mold molding part 25 to water are provided.
Themold molding part 25 is formed by laminating the mixed melting and solidifying part 4 in the same manner as the laminated structure 6 described above. In FIG. In addition, the boundary between the mold molding part 25 and the mixed melting and solidifying part 4 is clearly shown.
なお、金型成型部２５は、前記の積層構造物６と同様に混合溶融凝固部４が積層されてなるが、図１０では図示の都合上、金型成型部２５は一様なものとして示し、また、金型成型部２５と混合溶融凝固部４との境界を明示している。 FIG. 10 is a cross-sectional view of a cooling
The
ベース板２１の上には、めっき層２が形成されている。そして、ベース板２１とめっき層２との間には、金属間化合物５が形成されている。また、めっき層２の上には、金型成型部２５が形成されている。そして、めっき層２と金型成型部２５との間には、混合溶融凝固部４が形成されている。
The plating layer 2 is formed on the base plate 21. An intermetallic compound 5 is formed between the base plate 21 and the plating layer 2. In addition, a mold molding part 25 is formed on the plating layer 2. A mixed molten and solidified portion 4 is formed between the plating layer 2 and the mold forming portion 25.
冷却金型１２０においては、ベース板２１を構成する金属（第一の金属）は、水冷による抜熱を促進させるため、熱伝導率の高い銅である。また、めっき層２を構成する金属（第二の金属）は、前記の水冷電力変換素子１１０と同様に、ニッケルである。そして、金型成型部２５を構成する金属（第三の金属）は、マルエージング鋼である。マルエージング鋼は、ニッケルやコバルト等を含む鉄系の合金である。なお、これらの組み合わせは、前記の表１における６番目の組み合わせである。
In the cooling mold 120, the metal (first metal) constituting the base plate 21 is copper having high thermal conductivity in order to promote heat removal by water cooling. Moreover, the metal (2nd metal) which comprises the plating layer 2 is nickel similarly to the said water cooling power conversion element 110. FIG. And the metal (3rd metal) which comprises the metal mold | die molded part 25 is maraging steel. Maraging steel is an iron-based alloy containing nickel, cobalt, and the like. These combinations are the sixth combination in Table 1 above.
ニッケルは工業的に安価であり、かつ、マルエージング鋼と溶融させても脆い化合物を形成しないものである。そして、マルエージング鋼は高強度であるため、樹脂成型金型として寿命が長いので金型成型部２５の材質に選定した。
Nickel is industrially inexpensive and does not form a brittle compound even when melted with maraging steel. And since maraging steel is high intensity | strength, since the lifetime is long as a resin molding metal mold | die, it selected as the material of the metal mold | die molding part 25. FIG.
ここで、銅の融点と、マルエージング鋼の融点とは、大きく異なる。そこで、銅製のベース板２１を単にマルエージング鋼製の金型成型部２５に接合しようとすると、接合界面において割れが発生して、接合強度が低下する。そのため、従来の方法であれば、ベース板２１の上に直接金型成型部２５を造形することはできない。そこで、めっき層２を介することで、信頼性のある冷却金型１２０が得られる。
Here, the melting point of copper and the melting point of maraging steel are very different. Therefore, if the copper base plate 21 is simply joined to the die-molded portion 25 made of maraging steel, a crack occurs at the joining interface, and the joining strength is reduced. Therefore, if it is a conventional method, the mold forming part 25 cannot be directly formed on the base plate 21. Therefore, a reliable cooling mold 120 can be obtained through the plating layer 2.
冷却金型１２０は、基本的には前記の水冷電力変換素子１１０と同様にして製造することができる。そこで、以下の説明では、前記の水冷電力変換素子１１０の製造方法とは異なる点を主に挙げて、冷却金型１２０の製造方法を説明する。
The cooling mold 120 can be manufactured basically in the same manner as the water-cooled power conversion element 110 described above. Therefore, in the following description, a method for manufacturing the cooling mold 120 will be described mainly with a point different from the method for manufacturing the water-cooled power conversion element 110 described above.
まず、水冷流路２２を形成したベース板２１（厚さ２０ｍｍ程度）上に、ニッケルのめっき層２（厚さ３０μｍ程度）が形成される。そして、めっき層２の上に、マルエージング鋼の金属粉（粒径として２０μｍ～４０μｍ程度、平均粒径は３０μｍ程度。図示しない）が塗布される。この金属粉は、例えばガスアトマイズ法により製造可能である。その後、マルエージング鋼の側からレーザ光を照射することにより、ニッケルとマルエージング鋼との混合物である混合溶融凝固部４が形成される。また、これに伴い、銅とニッケルとからなる合金により構成される金属間化合物層５が形成される。
First, a nickel plating layer 2 (thickness of about 30 μm) is formed on a base plate 21 (thickness of about 20 mm) on which the water cooling channel 22 is formed. Then, a metal powder of maraging steel (having a particle size of about 20 μm to 40 μm and an average particle size of about 30 μm, not shown) is applied on the plating layer 2. This metal powder can be manufactured by, for example, a gas atomizing method. Thereafter, by irradiating laser light from the side of the maraging steel, the mixed molten solidified portion 4 that is a mixture of nickel and maraging steel is formed. Along with this, an intermetallic compound layer 5 composed of an alloy made of copper and nickel is formed.
レーザ光の照射条件としては、以下のようにすることができる。即ち、溶融凝固過程での金属酸化を防止する観点から、レーザ光は窒素雰囲気で照射される。そして、レーザ光のビーム径は直径１００μｍであり、レーザ出力は２００Ｗ、レーザスキャン速度は１００ｍ／ｓで照射することができる。さらに、レーザ光は、波長１０７０ｎｍの連続発振のファイバレーザを用いることができる。
The laser light irradiation conditions can be as follows. That is, from the viewpoint of preventing metal oxidation during the melting and solidification process, the laser beam is irradiated in a nitrogen atmosphere. The beam diameter of the laser beam is 100 μm, the laser output is 200 W, and the laser scan speed can be 100 m / s. Further, a continuous wave fiber laser having a wavelength of 1070 nm can be used as the laser light.
ただし、冷却金型１２０では、前記の冷却電力変換素子１１０とは異なり、積層構造物６である金型成型部２５の大きさ（上下方向の高さ）が一様ではない。即ち、図１０に示すように、金型成型部２５の中央近傍では薄く、両端近傍では厚くなっている。そこで、冷却金型１２０の製造の際、中央近傍でのマルエージング鋼の塗布量及び回数、並びにレーザ光の照射回数が少なく、一方で、両端近傍では、これらが多くなっている。即ち、冷却金型１２０の製造においては、両端近傍でマルエージング鋼の塗布及びレーザ照射をより多く繰り返して、中央近傍と比べて厚みのある金型成型部２５を形成することができる。このようにすることで、所望の形状となる金型成型部２５（積層構造物６）を形成することができる。また、その上方では殆どニッケルを含まないマルエージング鋼の金型成型部２５を製造することができる。
However, in the cooling mold 120, unlike the cooling power conversion element 110 described above, the size (height in the vertical direction) of the mold forming portion 25 that is the laminated structure 6 is not uniform. That is, as shown in FIG. 10, it is thin near the center of the mold molding part 25 and thick near both ends. Therefore, when the cooling mold 120 is manufactured, the amount and number of maraging steel applied in the vicinity of the center and the number of times of laser light irradiation are small, while these are increased in the vicinity of both ends. That is, in the manufacture of the cooling mold 120, the molding part 25 having a thickness larger than that in the vicinity of the center can be formed by repeating the application of maraging steel and laser irradiation more frequently in the vicinity of both ends. By doing in this way, the metal mold | die molded part 25 (laminated structure 6) used as a desired shape can be formed. Moreover, the die-molding part 25 of the maraging steel which hardly contains nickel can be manufactured in the upper part.
このようにして製造した冷却金型１２０は、マルエージング鋼製の金型成型部２５によって、優れた強度を有する金型とすることができる。一方で、銅製のベース板２１を備えるため、銅による伝熱性能に優れ、金型成型部２５の冷却効果を高いものにすることができる。特に、ベース板２１と金型成型部２５とは、金属のみによって接続されている。そのため、銅の伝熱性能の良好さを最大限発揮することができ、冷却性能に優れた冷却金型１２０を製造することができる。さらに、混合溶融凝固部４及び金型成型部２５では、前記の冷却電力変換素子１１０と同様に、ニッケル及びマルエージング鋼の組成は傾斜組成になっている。そのため、組成の変化に対応して熱膨張係数も変化するため、異種金属の熱膨張差による残留応力が低減される。これにより、高い強度で金型成型部２５を接合することができる。
The cooling mold 120 manufactured in this way can be made into a mold having excellent strength by the mold forming part 25 made of maraging steel. On the other hand, since the copper base plate 21 is provided, the heat transfer performance by copper is excellent, and the cooling effect of the mold molding part 25 can be enhanced. In particular, the base plate 21 and the mold molding part 25 are connected only by metal. Therefore, the good heat transfer performance of copper can be exhibited to the maximum, and the cooling mold 120 excellent in cooling performance can be manufactured. Further, in the mixed melt solidification part 4 and the mold molding part 25, the composition of nickel and maraging steel is a gradient composition, like the cooling power conversion element 110 described above. Therefore, since the thermal expansion coefficient also changes in accordance with the change in composition, the residual stress due to the thermal expansion difference between different metals is reduced. Thereby, the metal mold part 25 can be joined with high strength.
以上、本発明を実施する形態を、２つの具体例を挙げながら説明したが、本実施形態は前記の例になんら限定されるものではない。
As mentioned above, although the form which implements this invention was demonstrated giving two specific examples, this embodiment is not limited to the said example at all.
例えば、前記の各実施形態では、コーティング層として、めっき法により形成しためっき層２が形成されているが、コーティング層としては、コールドスプレー法により形成した層であってもよい。この場合のコールドスプレー法では、第二の金属（ニッケル等）が溶融温度以下で金属基材に衝突させられて、第二の金属により構成される層が形成されることになる。コールドスプレー法を用いてコーティング層を形成することで、めっき法により形成しためっき層２の厚さよりも、厚いコーティング層を形成することができる。コーティング層を厚く形成することで、レーザ光が照射される位置（即ち、混合溶融凝固部４が形成される位置）から、金属間化合物層５が形成される位置までの距離を長くすることができる。これにより、レーザ光の照射による熱が伝わりにくくなり、比較的薄い金属間化合物層５を形成することができる。
For example, in each of the above embodiments, the plating layer 2 formed by a plating method is formed as the coating layer, but the coating layer may be a layer formed by a cold spray method. In the cold spray method in this case, a second metal (such as nickel) is caused to collide with the metal substrate at a melting temperature or lower to form a layer composed of the second metal. By forming the coating layer using the cold spray method, a coating layer thicker than the thickness of the plating layer 2 formed by the plating method can be formed. By forming the coating layer thickly, the distance from the position where the laser light is irradiated (that is, the position where the mixed molten and solidified portion 4 is formed) to the position where the intermetallic compound layer 5 is formed can be increased. it can. Thereby, it becomes difficult to transmit the heat by irradiation of a laser beam, and the comparatively thin intermetallic compound layer 5 can be formed.
コーティング層がコールドスプレー法により形成されたものであるか否かの判断は、コーティング層の断面を電子顕微鏡により観察することで行うことができる。即ち、電子顕微鏡により断面を観察したときに、第二の金属同士が扁平形状に堆積している状態、即ち、第二の金属の組織が一様ではなく、金属組織同士の界面を確認できれば、コーティング層はコールドスプレー法により形成されたと判断することができる。
Whether the coating layer is formed by a cold spray method can be determined by observing a cross section of the coating layer with an electron microscope. That is, when the cross section is observed with an electron microscope, the second metals are deposited in a flat shape, that is, if the structure of the second metal is not uniform and the interface between the metal structures can be confirmed, It can be determined that the coating layer was formed by a cold spray method.
また、コーティング層は、めっき法やコールドスプレー法以外にも、例えば溶射法により形成することもできる。溶射法によりコーティング層を形成する場合、コーティング層を構成する第二の金属は、溶融した状態で金属基材に衝突することになる。衝突した後の第二の金属同士は接合する傾向にある。従って、電子顕微鏡を用いて断面を観察すると、第二の金属の組織は観察可能なものの、コールドスプレー法によって形成した場合と比べて、金属組織同士の界面はすこしぼやけることになる。従って、金属組織同士の界面の様子により、コーティング層は、コールドスプレー法により形成されたものであるのか、又は溶射法により形成されたものであるのかを判断することができる。
Further, the coating layer can be formed by, for example, a thermal spraying method in addition to the plating method or the cold spray method. When forming a coating layer by a thermal spraying method, the 2nd metal which comprises a coating layer will collide with a metal base material in the molten state. The second metals after colliding tend to join. Therefore, when the cross section is observed using an electron microscope, the second metal structure can be observed, but the interface between the metal structures is slightly blurred as compared with the case where the second metal structure is formed by the cold spray method. Therefore, whether the coating layer is formed by the cold spray method or the thermal spray method can be determined from the state of the interface between the metal structures.
さらに、コーティング層は、例えばクラッド材を用いて形成してもよい。クラッド材は第二の金属を押圧することで得られるが、第二の金属を衝突させるコールドスプレー法や溶射法等とは、電子顕微鏡により観察される断面における金属組織の様子が異なる。従って、このようして、コーティング層がクラッド材を用いて形成されたものであるか否かを判断することができる。
Furthermore, the coating layer may be formed using, for example, a clad material. The clad material is obtained by pressing the second metal, but the state of the metal structure in the cross section observed by an electron microscope is different from the cold spray method or the thermal spray method in which the second metal collides. Therefore, in this way, it can be determined whether or not the coating layer is formed using a clad material.
また、前記の各実施形態では、混合溶融凝固部４を形成するためにレーザ光を用いたが、レーザ光に代えて電子ビームを用いてもよい。さらに、これらの他にも、混合溶融凝固部４及び金属間化合物層５を形成可能な方法であれば、どのような方法を用いてもよい。
In each of the embodiments described above, the laser beam is used to form the mixed molten and solidified portion 4, but an electron beam may be used instead of the laser beam. In addition to these, any method may be used as long as it can form the mixed melt-solidified portion 4 and the intermetallic compound layer 5.
さらに、前記の各実施形態では、レーザ光の照射の都度、第三の金属（銅やマルエージング鋼）を配置固定したが、これらは、レーザ光の照射の都度、配置固定されてなくてもよい。即ち、例えば３次元プリンタ等を用いてレーザ光等の焦点を調整することで、例えば、初めに一度のみ配置された第三の金属中に、任意の形状の積層構造物６を形成することもできる。この場合、第三金属配置工程は一度のみ行われ、混合溶融・合金層形成工程は複数回行われることになる。従って、本実施形態では、混合溶融・合金層形成工程は繰り返し行われ、一方で、第三金属配置工程は一度又は複数回（繰り返し）行われることになる。
Further, in each of the above-described embodiments, the third metal (copper or maraging steel) is arranged and fixed every time the laser beam is irradiated, but these may be arranged and fixed each time the laser beam is irradiated. Good. That is, for example, by adjusting the focus of a laser beam or the like using a three-dimensional printer or the like, for example, it is possible to form a laminated structure 6 having an arbitrary shape in the third metal arranged only once at the beginning. it can. In this case, the third metal placement step is performed only once, and the mixed melting / alloy layer forming step is performed a plurality of times. Therefore, in this embodiment, the mixed melting / alloy layer forming step is repeatedly performed, while the third metal arranging step is performed once or a plurality of times (repeatedly).
１ 伝熱板（金属基材）
２ めっき層（コーティング層）
３ 金属粉末（第三の金属）
４ 混合溶融凝固部
５ 金属間化合物層
６ 積層構造物
１０ 電流変換素子
１１ 水冷フィン（積層構造物）
１２ 水（冷媒）
１３ 重ね溶接部
１４ 突合せ溶接部
１５ アルミケース
１６ アルミ蓋
２１ ベース板（金属基材）
２２ 水冷流路
２５ 金型成型部（積層構造物）
１００ 異種金属接合構造物
１１０ 水冷電力変換素子（異種金属接合構造物）
１２０ 冷却金型（異種金属接合構造物） 1 Heat transfer plate (metal substrate)
2 Plating layer (coating layer)
3 Metal powder (third metal)
4 Mixed Melting and SolidifyingPortion 5 Intermetallic Compound Layer 6 Laminated Structure 10 Current Conversion Element 11 Water-Cooled Fin (Laminated Structure)
12 Water (refrigerant)
13 Lap weldedportion 14 Butt welded portion 15 Aluminum case 16 Aluminum lid 21 Base plate (metal base)
22 Water-cooledchannel 25 Molding part (laminated structure)
100 Dissimilar metal joint structure 110 Water-cooled power conversion element (dissimilar metal joint structure)
120 Cooling mold (dissimilar metal joint structure)
２ めっき層（コーティング層）
３ 金属粉末（第三の金属）
４ 混合溶融凝固部
５ 金属間化合物層
６ 積層構造物
１０ 電流変換素子
１１ 水冷フィン（積層構造物）
１２ 水（冷媒）
１３ 重ね溶接部
１４ 突合せ溶接部
１５ アルミケース
１６ アルミ蓋
２１ ベース板（金属基材）
２２ 水冷流路
２５ 金型成型部（積層構造物）
１００ 異種金属接合構造物
１１０ 水冷電力変換素子（異種金属接合構造物）
１２０ 冷却金型（異種金属接合構造物） 1 Heat transfer plate (metal substrate)
2 Plating layer (coating layer)
3 Metal powder (third metal)
4 Mixed Melting and Solidifying
12 Water (refrigerant)
13 Lap welded
22 Water-cooled
100 Dissimilar metal joint structure 110 Water-cooled power conversion element (dissimilar metal joint structure)
120 Cooling mold (dissimilar metal joint structure)
Claims (11)
- 第一の金属により構成される金属基材と、
前記金属基材上に形成され、第二の金属により構成されるコーティング層と、
前記金属基材と前記コーティング層との間に形成され、前記第一の金属と前記第二の金属とが合金化してなる金属間化合物層と、
前記コーティング層上に形成され、前記第二の金属と前記第三の金属とが混合溶融されてなる混合溶融凝固部が、前記金属基材に対して垂直な方向に複数積層されてなる積層構造物と、を備えることを特徴とする、異種金属接合構造物。 A metal substrate composed of a first metal;
A coating layer formed on the metal substrate and composed of a second metal;
An intermetallic compound layer formed between the metal substrate and the coating layer, wherein the first metal and the second metal are alloyed;
A laminated structure in which a plurality of mixed molten and solidified portions formed on the coating layer and mixed and melted with the second metal and the third metal are stacked in a direction perpendicular to the metal substrate. A dissimilar metal joint structure characterized by comprising: - 前記混合溶融凝固部において、前記混合溶融凝固部に含まれる前記第二の金属の濃度が、前記金属基材から遠ざかるにつれて、徐々に低くなっていることを特徴とする、請求項１に記載の異種金属接合構造物。 The concentration of the second metal contained in the mixed melt-solidified portion is gradually decreased as the distance from the metal substrate is increased in the mixed melt-solidified portion. Dissimilar metal joint structure.
- 前記コーティング層はめっき法により形成されてなることを特徴とする、請求項１又は２に記載の異種金属接合構造物。 The dissimilar metal joint structure according to claim 1 or 2, wherein the coating layer is formed by a plating method.
- 前記コーティング層はコールドスプレー法により形成されてなることを特徴とする、請求項１又は２に記載の異種金属接合構造物。 The dissimilar metal joint structure according to claim 1 or 2, wherein the coating layer is formed by a cold spray method.
- 前記金属間化合物層は、前記積層構造物の下方において前記金属基材と前記コーティング層との間に形成され、
前記積層構造物の下方以外の部分においては、前記金属基材と前記コーティング層とは直接接触していることを特徴とする、請求項１又は２に記載に異種金属接合構造物。 The intermetallic compound layer is formed between the metal substrate and the coating layer below the laminated structure,
3. The dissimilar metal bonded structure according to claim 1, wherein the metal substrate and the coating layer are in direct contact with each other at a portion other than the lower side of the laminated structure. - 前記第二の金属及び前記第三の金属はいずれも全率固溶体であることを特徴とする、請求項１又は２に記載の異種金属接合構造物。 3. The dissimilar metal joint structure according to claim 1, wherein the second metal and the third metal are all solid solutions.
- 前記第一の金属はアルミニウムであり、
前記第二の金属はニッケルであり、
前記第三の金属は銅であることを特徴とする、請求項１又は２に記載の異種金属接合構造物。 The first metal is aluminum;
The second metal is nickel;
The dissimilar metal bonding structure according to claim 1 or 2, wherein the third metal is copper. - 第二の金属により構成されるコーティング層が形成された金属基材上に、第三の金属を配置する第三金属配置工程と、
前記第三金属配置工程において配置された前記第三の金属の側から、前記第三の金属に対してレーザ光を照射することで前記第三の金属と前記第二の金属とを混合溶融させて混合溶融凝固部を形成するとともに、前記レーザ光の照射によって生じる熱によって、前記コーティング層を構成する前記第二の金属と前記金属基材を構成する第一の金属とを合金化させて金属間化合物層を形成する混合溶融・合金層形成工程と、
第三金属配置工程及び前記混合溶融・合金層形成工程をそれぞれ行うことで、前記混合溶融凝固部が前記金属基材に対して垂直な方向に複数積層されてなる積層構造物を形成する積層工程と、を含むことを特徴とする、異種金属接合構造物の製造方法。 A third metal disposing step of disposing a third metal on the metal substrate on which the coating layer composed of the second metal is formed;
The third metal and the second metal are mixed and melted by irradiating the third metal with laser light from the third metal side arranged in the third metal arranging step. Forming a mixed melt solidified portion and alloying the second metal constituting the coating layer and the first metal constituting the metal substrate by heat generated by the irradiation of the laser beam. A mixed melting / alloy layer forming step of forming an intermetallic compound layer;
A lamination step of forming a laminated structure in which a plurality of the mixed molten and solidified portions are laminated in a direction perpendicular to the metal base by performing a third metal arranging step and the mixed melting / alloy layer forming step, respectively. The manufacturing method of the dissimilar metal joining structure characterized by including these. - 前記混合溶融・合金層形成工程において、
前記金属間化合物層は、前記混合溶融凝固部の下方において前記金属基材と前記コーティング層との間に形成され、
前記混合溶融凝固部の下方以外の部分においては、前記金属基材と前記コーティング層とは直接接触するようになっていることを特徴とする、請求項８に記載に異種金属接合構造物の製造方法。 In the mixed melting / alloy layer forming step,
The intermetallic compound layer is formed between the metal substrate and the coating layer below the mixed melt-solidified part,
The manufacturing method for a dissimilar metal joint structure according to claim 8, wherein the metal base and the coating layer are in direct contact with each other at a portion other than the lower portion of the mixed molten and solidified portion. Method. - 前記第二の金属及び前記第三の金属はいずれも全率固溶体であることを特徴とする、請求項８又は９に記載の異種金属接合構造物の製造方法。 The method for producing a dissimilar metal joint structure according to claim 8 or 9, wherein the second metal and the third metal are all solid solutions.
- 第一の金属により構成される金属基材と、
前記金属基材上に形成され、第二の金属により構成されるコーティング層と、
前記金属基材と前記コーティング層との間に形成され、前記第一の金属と前記第二の金属とが合金化してなる金属間化合物層と、
前記コーティング層上に形成され、前記第二の金属と前記第三の金属とが混合溶融されてなる混合溶融凝固部が、前記金属基材に対して垂直な方向に複数積層されてなる積層構造物と、を備える異種金属接合構造物と、
前記金属部材に対して熱的に接触している電力変換素子と、を備え、
前記積層構造物には、前記電力変換素子を冷却する冷媒が接触していることを特徴とする、水冷電力変換素子。 A metal substrate composed of a first metal;
A coating layer formed on the metal substrate and composed of a second metal;
An intermetallic compound layer formed between the metal substrate and the coating layer, wherein the first metal and the second metal are alloyed;
A laminated structure in which a plurality of mixed molten and solidified portions formed on the coating layer and mixed and melted with the second metal and the third metal are stacked in a direction perpendicular to the metal substrate. A dissimilar metal joint structure comprising:
A power conversion element in thermal contact with the metal member,
A water-cooled power conversion element, wherein the laminated structure is in contact with a refrigerant that cools the power conversion element.
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