KR101880271B1 - A measurement method of UV light for in-line system using a semiconductor package manufacturing process - Google Patents

A measurement method of UV light for in-line system using a semiconductor package manufacturing process Download PDF

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Publication number
KR101880271B1
KR101880271B1 KR1020150063828A KR20150063828A KR101880271B1 KR 101880271 B1 KR101880271 B1 KR 101880271B1 KR 1020150063828 A KR1020150063828 A KR 1020150063828A KR 20150063828 A KR20150063828 A KR 20150063828A KR 101880271 B1 KR101880271 B1 KR 101880271B1
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South Korea
Prior art keywords
light
wafer
measuring jig
transfer arm
wireless
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KR1020150063828A
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Korean (ko)
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KR20160131434A (en
Inventor
김영건
서태원
이효재
유명호
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(주)퓨렉스
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/429—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method of UV light measurement in an inline system is disclosed to uniformly attenuate the adhesion of a surface protective tape in an inline system for semiconductor package fabrication including a back grinding facility. To this end, the present invention provides an in-line system for manufacturing a semiconductor package provided with a UV (ultraviolet) light irradiation means in a closed transfer path, and a wafer transfer arm provided in a transfer path of the in- Separate the chuck (Vacuum Chuck) and measure the amount of UV light inside the inline system by mounting a separate UV light measuring jig with a wireless UV light sensor on the wafer transfer arm.

Description

Technical Field [0001] The present invention relates to a UV light measurement method for an inline system for manufacturing a semiconductor package,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an in-line system used in a semiconductor package manufacturing process, and more particularly, to a wafer back grinding facility, a wafer ring mounting facility, The present invention relates to a method of measuring ultraviolet light in an inline system in which equipment is integrated.

The semiconductor package has a function of protecting a semiconductor chip from external damages, moisture and impurities by effectively processing a semiconductor chip provided with an electronic circuit performing a predetermined function in the form of an integrated circuit, Terminal, and the semiconductor chip is processed and packaged using metals, plastics, epoxy, and ceramics.

On the other hand, a general semiconductor device manufacturing process includes a wafer manufacturing process, which is a process for forming an integrated circuit on a wafer-shaped monocrystalline silicon substrate, a semiconductor package manufacturing process for separating a unit semiconductor chip from a semiconductor substrate on which an integrated circuit is formed, Process. The semiconductor package manufacturing process includes a front-end process for processing a unit semiconductor chip in a wafer state, a back-end process for processing the semiconductor chip in a state of covering the sealing material, process.

In this case, the back grinding process during the front-end process refers to a process of grinding the bottom surface of the wafer to further reduce the thickness of the wafer. However, impurities generated in the process of grinding the bottom surface of the wafer may contaminate the front surface of the wafer on which the integrated circuit is formed. In order to prevent such a problem, a surface protection tape is attached to the front surface of the wafer, and then a process of grinding the bottom surface of the wafer is performed. The surface protection tape is removed from the wafer after the grinding process is completed.

Such a surface protective tape can be damaged by pulling a thin wafer after peeling off the back grinding process when the adhesive strength is strong. There may also be a problem that the adhesive material used for the surface protective tape remains on the bottom surface of the wafer. In consideration of these problems, the surface protective tape uses UV curable tape whose adhesion is weakened by UV light. Therefore, in the back grinding process, since the wafer is not irradiated with UV light, the surface protection tape adheres to the bottom surface of the wafer with sufficient adhesion. After the back grinding process, the UV light is irradiated on the front surface of the wafer having the surface protection tape to lower the adhesive force so as to be easily peeled off. This makes it possible to easily remove the surface protection tape from the wafer while suppressing the damage of the wafer or the problem that the adhesive material remains on the front surface of the wafer.

However, in order to weaken the adhesive force of the surface protective tape to a uniform range, it is necessary to apply a predetermined amount of UV light. Therefore, in an inline system for manufacturing a semiconductor package in which a surface protection tape is used, it is necessary to appropriately control the irradiation of UV light irrespective of the structure or form of the equipment for manufacturing a semiconductor package. To this end, An accurate measurement method is needed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a semiconductor package in which a wafer back grinding apparatus and a wafer ring mounting apparatus are combined into a single package, And to provide a UV and measurement method capable of accurately measuring the total amount of light.

A UV light measurement method of an inline system for manufacturing a semiconductor package according to an aspect of the present invention includes preparing an in-line system for manufacturing a semiconductor package in which UV light irradiation means is installed in a closed transfer path Separating a vacuum chuck from a wafer transfer arm installed in a transfer path of the inline system, and jigging a UV light measurement at a position where the vacuum chuck of the wafer transfer arm is separated from the vacuum chuck A step of operating the wafer transfer arm with the UV light measuring jig normally in the transfer path; separating the UV light measuring jig from the wafer transfer arm; Separating the wireless UV light sensor from the wireless UV light sensor and measuring the amount of UV light by connecting the wireless UV light sensor to the UV light meter. It shall be.

According to an embodiment of the present invention, it is preferable that the UV light irradiating means is a UV chamber provided with a UV lamp below the closed conveyance passage, and the inline system for manufacturing the semiconductor package includes a wafer back grinding apparatus And a wafer ring mounting facility are preferably present in one system space, and the closed transfer path is preferably installed between the wafer back grinding facility and the wafer ring mounting facility.

The wafer ring mount facility may further include a facility for removing the surface protection tape attached to the front surface of the wafer.

According to an embodiment of the present invention, it is preferable that the UV light measuring jig includes five points of wireless UV light sensor mounting portion and means capable of being combined with the wafer transfer arm. At this time, the wireless UV light sensor mounting portions of the five points may be installed at the center of the UV light measuring jig at 12 o'clock, 3 o'clock, 6 o'clock and 9 o'clock.

Preferably, the UV light measuring jig mounted on the wafer transfer arm may have a wireless UV light sensor mounted therein. At the same time, it is preferable that the wafer transfer arm is installed on the upper part of the closed conveyance passage.

According to an experimental embodiment of the present invention, it is preferable that the UV light measuring jig has a circular structure having a constant thickness.

Therefore, according to the technical idea of the present invention described above, in a facility for manufacturing a semiconductor package in which it is difficult to accurately measure the UV light to be irradiated, the amount of UV light irradiated on the wafer surface is measured using a separate UV light measuring jig Can be measured accurately. Therefore, the amount of UV light to be irradiated on the surface of the wafer to which the surface protective tape is attached can be controlled to be constant, so that the problem that the adhesive force of the surface protective tape is not uniformly weakened can be solved. As a result, damage to the wafer, which may occur due to adhesive force of the surface protective tape, and various process defects caused by the adhesive component of the surface protective tape remaining on the wafer surface, can be prevented in advance.

1 is a conceptual diagram of an inline system for manufacturing a semiconductor package according to an embodiment of the present invention.
2 is a schematic block diagram of an inline system for semiconductor package fabrication according to a preferred embodiment of the present invention.
3 is a cross-sectional view illustrating a structure of a transfer path in an inline system for manufacturing a semiconductor package according to a preferred embodiment of the present invention.
4 is a plan view of a UV light measuring jig mounted on a transfer arm of a transfer passage according to a preferred embodiment of the present invention.
5 is a cross-sectional view taken along the line V-V 'in FIG.
6 is a photograph showing a wireless UV light sensor mounted on a UV light measuring jig according to a preferred embodiment of the present invention and a UV light meter capable of measuring the light amount of the UV light sensor.
7 is a flowchart for explaining a UV light measurement method of an inline system for semiconductor package fabrication according to a preferred embodiment of the present invention.

In order to fully understand the structure and effects of the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It should be understood, however, that the description of the embodiments is provided to enable the disclosure of the invention to be complete, and will fully convey the scope of the invention to those skilled in the art. In the accompanying drawings, the constituent elements are shown enlarged for the sake of convenience of explanation, and the proportions of the constituent elements may be exaggerated or reduced.

It is to be understood that when an element is described as being "on" or "connected to" another element, it may be directly in contact with or coupled to another element, but there may be another element in between . On the other hand, when an element is described as being "directly on" or "directly connected" to another element, it can be understood that there is no other element in between. Other expressions that describe the relationship between components, for example, "between" and "directly between"

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms may only be used for the purpose of distinguishing one element from another. The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. For example, the words "comprise" or "having" are used herein to designate the presence of stated features, integers, steps, operations, elements, parts or combinations thereof, wherein one or more other features, , Steps, operations, components, parts or combinations thereof, may be added.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are not to be construed as ideal or overly formal in meaning unless expressly defined in the present application .

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a conceptual diagram of an inline system for manufacturing a semiconductor package according to an embodiment of the present invention.

Referring to FIG. 1, an inline system 1000 for manufacturing a semiconductor package used in the present invention includes a back grinding apparatus 100 for roughly grinding a bottom surface of a wafer, a wafer ring (wafer ring) Is an in-line system in which a wafer ring mounting facility 200 is integrated. At this time, the wafer ring mounting facility 200 may further include a facility for removing the surface protection tape adhered to the front surface of the wafer.

2 is a schematic block diagram of an inline system for semiconductor package fabrication according to a preferred embodiment of the present invention.

Referring to FIG. 2, in order to grind the bottom surface of the wafer, the wafer to be supplied to the back grinding apparatus 100 is usually loaded on the front surface of the wafer, portion 110, respectively. The loaded wafer is ground at the wafer grinding portion 130 through the wafer carrying portion 120 to a thin thickness defined by the grinding wheel.

Thereafter, the ground wafer is transferred to the wafer ring mounting facility 200, before passing through the conveyance passage 300 for uniformly weakening the adhesive force of the surface protective tape attached to the front surface of the wafer. At this time, UV light irradiation means, for example, UV chamber, may be installed in the transfer passage 300.

The wafer that has passed through the transfer passage 300 is attached to the region where the wafer ring attachment tape is affixed at the wafer mounting portion 210 of the wafer ring mounting facility 200 and is moved to the subsequent process. The wafer ring, to which the adhesive tape is affixed, serves as a transport tool for transferring the wafer to a subsequent process. Further, a facility 220 for removing and removing the surface protection tape adhered to the wafer surface, for example, the front surface, may be further provided beside the wafer ring mounting portion 210. The wafer on which the surface protection tape is removed in the equipment 220 for peeling off the surface protection tape is output to the outside via the unloading unit 240 of the inline system for semiconductor package manufacturing, ) Process.

FIG. 3 is a cross-sectional view illustrating a structure of a transfer path in an inline system for manufacturing a semiconductor package according to a preferred embodiment of the present invention, FIG. 4 is a plan view of a UV light measuring jig mounted on a transfer arm of the transfer path, 5 is a cross-sectional view taken along the line V-V 'in FIG.

3 to 5, the transfer passage is installed between the wafer back grinding facility and the wafer ring mounting facility. A wafer transfer arm 310 may be installed on the transfer path. A vacuum chuck 320 is installed under the wafer transfer arm 310. The vacuum chuck 320 moves the wafer 400 through the glass 330 irradiated with the UV light by sucking the undersurface of the wafer 400, for example, the surface on which the integrated circuit is not formed, Lt; / RTI > Here, a UV chamber 340, which is a UV light irradiation means, is provided at a lower portion of the transfer passage through which the wafer passes. A UV lamp 350 is installed inside the UV chamber 340 and irradiates UV light onto the front surface of the wafer which is adsorbed by the vacuum chuck 320 through the UV light guiding glass 330.

On the other hand, in order to uniformly decrease the adhesive force of the surface protection tape attached to the front surface of the wafer 400, the total amount of UV light to be irradiated on the front surface of the wafer 400 must be maintained constant. To this end, the amount of UV light irradiated on the wafer 400 passing through the transfer path must be periodically measured to maintain and manage the state of the UV chamber 340 well. However, when the transfer path is closed, a method of appropriately measuring the total amount of UV light irradiated to the wafer 400 is not easy.

In order to solve such a problem, the present invention forms a separate UV measuring jig (500 of FIG. 4) in a suitable form, separates the vacuum chuck 320 from the wafer transfer arm 310, Install the jig. At this time, the UV measuring jig is mounted on the wafer transfer arm 310 with a wireless UV light sensor (700 of FIG. 6) called a UV micro puck mounted thereon.

The UV measuring jig 500 may have a circular structure having a constant thickness. In addition, a wireless UV light sensor mounting part 510 is provided at the center, 3 o'clock, 6 o'clock, 9 o'clock and 12 o'clock direction on the inner front surface. A means for coupling the wafer transfer arm 310 and the UV measuring jig 500 may be provided on the rear surface of the UV measuring jig 500, for example, a screw connection portion (not shown). In addition, the UV light sensor 700 has a connection part 720 inserted into the UV light amount meter 600 at one end thereof to measure the light amount. Accordingly, the wireless UV light sensor connection unit 520 may be separately provided at one end of the wireless UV light sensor installation unit 510.

Thus, according to the present invention, the vacuum chuck 320 for attracting the wafer 400 is removed, and the UV light measuring jig 500 mounted with the wireless UV light sensor 700 is connected to the vacuum chuck 320. Thereafter, It is possible to accurately measure the amount of UV light irradiated on the front surface of the actual wafer 400 by operating the wafer 310 in the same manner as the actual process conditions. This makes it possible to measure the amount of UV light irradiated on the surface of the wafer 400 much more accurately than the UV light sensor installed and measured in other areas inside the closed transfer path. Therefore, by maintaining the state of the UV chamber 340 in an optimum state based on the measurement result, it is possible to prevent the wafer 400 from being deteriorated due to various process defects, for example, And the problem that the adhesive material of the surface protective tape remains on the surface of the wafer 400 can be prevented.

6 is a photograph showing a wireless UV light sensor mounted on a UV light measuring jig according to a preferred embodiment of the present invention and a UV light meter capable of measuring the light amount of the UV light sensor.

Referring to FIG. 6, a wireless UV light sensor 700 called a UV micro puck has a disc-shaped UV light amount sensing part 710 at its center, and a connection part 720 at one side. The connection unit 720 may be connected to the inserting unit 620 provided at the lower end of the UV photometer 600 so that the total amount of UV light irradiated to the wireless UV light sensor 700 can be confirmed through the light amount display unit 610. The UV light meter 600 may have various functions that can store and reset the entire light amount measured through the UV light sensor 700. FIG.

7 is a flowchart for explaining a UV light measurement method of an inline system for semiconductor package fabrication according to a preferred embodiment of the present invention.

Referring to FIG. 7, an inline system for manufacturing a semiconductor package is prepared (S100). The inline system may be at least a manufacturing equipment in which the backgrinding equipment and the wafer ring mounting equipment are integrated into one. In addition, it is preferable that the manufacturing equipment includes a transfer passage provided with UV light irradiation means such as a UV chamber between the back grinding facility and the wafer ring mounting facility. Subsequently, the vacuum chuck used for transferring wafers connected to the wafer transfer arm installed on the UV chamber of the transfer path is separated (S200).

Thereafter, a wireless UV light sensor is mounted on the UV light measuring jig (S300). The location where the wireless UV light sensor is mounted can be mounted at five locations at the center, 3, 6, 9 o'clock and 12 o'clock respectively. Then, a UV light measuring jig equipped with a wireless UV light sensor is mounted on the wafer transfer arm in which the vacuum chuck is separated (S400). Subsequently, the UV chamber section is transferred (S500) under the same conditions as the actual wafer is transferred during the wafer transfer arm on which the UV light measuring jig is mounted.

Finally, after separating the UV-measuring jig from the wafer transfer arm and separating the wireless UV-light sensor from the UV-measuring jig, the wireless UV-light sensor is connected to the UV meter to check the total amount of UV light irradiated S600). The UV chamber can be repaired if necessary based on the state of the total UV light amount irradiated.

It will be apparent to those skilled in the art that the present invention is not limited to the above-described embodiment and that many modifications are possible within the technical scope of the present invention.

100: back grinding equipment, 110: wafer loading part,
120: Wafer carrying part, 130: Wafer grinding part,
200: wafer ring mounting equipment, 210: wafer ring mounting part,
220: Surface protective tape removing unit, 240: Unloading unit,
300: transfer path, 310: wafer transfer arm,
320: vacuum chuck, 330: UV-curable glass,
340: UV chamber, 350: UV lamp,
400: wafer, 500: jig for UV light measurement,
510: wireless UV light sensor mount, 520: wireless UV light sensor connection mount,
600: UV light meter, 610: light amount display unit,
700: wireless UV light sensor, 710: UV light sensing part,
720: Wireless UV light sensor connection.

Claims (10)

A step of preparing an in-line system in which a wafer back grinding apparatus for manufacturing a semiconductor package and a wafer ring mounting apparatus in a system space are installed in a closed transfer passage with a UV lamp as an ultraviolet (UV) ;
Separating a vacuum chuck from a wafer transfer arm installed above the UV lamp in the UV lamp in a transfer path of the inline system;
A UV light measuring jig is attached to the wafer transfer arm where the vacuum chuck is separated, and the UV light measuring jig is irradiated with radio UV light at 12 o'clock, 3 o'clock, 6 o'clock, Mounting a UV light measuring jig equipped with a sensor;
Transferring the wafer transfer arm with the UV light measuring jig in a linear direction in the closed conveyance passage at a lower speed at the same speed as the wafer is conveyed while irradiating UV light;
Separating the UV light measuring jig from the transferred wafer transfer arm;
Separating the wireless UV light sensor from the UV light measuring jig; And
And measuring the amount of UV light by connecting the wireless UV light sensor to a UV light meter. The method according to claim 1,
Wherein the UV light irradiating means comprises:
Wherein the chamber is a UV chamber provided with a UV lamp below the closed conveyance passage. delete The method according to claim 1,
The closed conveyance passage
Wherein the wafer back grinding apparatus and the wafer ring mounting apparatus are installed between the wafer back grinding apparatus and the wafer ring mounting apparatus. The method according to claim 1,
The wafer ring mounting facility includes:
Further comprising a facility for removing the surface protection tape attached to the front surface of the wafer. The method according to claim 1,
Wherein the UV light measuring jig comprises:
A wireless UV light sensor mounting portion at five points, and means capable of being coupled with the wafer transfer arm. delete delete The method according to claim 6,
Wherein the UV light measuring jig comprises:
Wherein the UV light is a circular structure having a constant thickness. delete
KR1020150063828A 2015-05-07 2015-05-07 A measurement method of UV light for in-line system using a semiconductor package manufacturing process KR101880271B1 (en)

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Publication number Priority date Publication date Assignee Title
JP3177830B2 (en) * 1997-05-22 2001-06-18 株式会社オーク製作所 Cordless UV measurement device
KR101006526B1 (en) * 2008-10-22 2011-01-07 주식회사 하이닉스반도체 Wafer maount tape and apparatus and method for processing wafer using the wafer mount tape
JP5386232B2 (en) * 2009-05-26 2014-01-15 日東電工株式会社 UV irradiation equipment

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