KR101874554B1 - Heating plate and manufacturing method thereof - Google Patents
Heating plate and manufacturing method thereof Download PDFInfo
- Publication number
- KR101874554B1 KR101874554B1 KR1020170012250A KR20170012250A KR101874554B1 KR 101874554 B1 KR101874554 B1 KR 101874554B1 KR 1020170012250 A KR1020170012250 A KR 1020170012250A KR 20170012250 A KR20170012250 A KR 20170012250A KR 101874554 B1 KR101874554 B1 KR 101874554B1
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- South Korea
- Prior art keywords
- conductive wire
- heating element
- conductive
- dry etching
- plasma
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
Abstract
Description
The present invention relates to a planar heating element and a method of manufacturing the planar heating element.
A surface heating element is an object that generates heat in a plane state. A metal electrode is placed on both sides of a conductive heating element on a thin surface, and is insulated with an insulating material to apply a rated voltage to the metal electrode. . Silver (Ag), copper (Cu) or the like is used as the electrode material of the planar heating element, and carbon paste, carbon fiber or the like is used as the material of the heating element made of carbon.
The surface heating element has an advantage of being excellent in heat generation efficiency compared with the conventional linear heating element, capable of rapid heating control, and having a small volume occupied by the heat generation structure, so that it can be applied to various products. These advantages of the surface heating element are that it is possible to use a transparent / flexible heater used in an automobile glass, a house interior / exterior, etc., a flexible / stretchable / wearable heat treatment device utilizing a high thermal efficiency, (wearable) heating device or the like.
Regarding such surface heating elements, Korean Patent Registration No. 10-1028843 discloses a carbon fiber surface heating element and a manufacturing method thereof.
The conventional carbon surface heating element has a danger of fire and deterioration of the heating efficiency due to the continuous heat generation and the damage of the heating structure due to the external force, so that a planar heating element using conductive fiber has been suggested as an alternative. The conductive fiber-based planar heating elements use Ag, Cu, CNT or the like for electrical conductivity and chemical stability, but these materials have disadvantages in that the cost of the planar heating element based on the conductive fiber is increased due to the high unit cost . When an inexpensive material is used to improve this, there is a problem that the electrical conductivity is low or the chemical stability is poor. Accordingly, there is a demand for a planar heating element having electrical conductivity and chemical stability while using an inexpensive material.
An aspect of the present invention is to provide a method of manufacturing a planar heating element and a planar heating element that increases the surface area of a conductive wire by performing dry etching using a plasma on the surface of the conductive wire to form irregularities. There is provided a method of manufacturing a planar heating element and a planar heating element which provide conductive nanoparticles between adjacent conductive wires to increase the points of contact of the conductive wires. The present invention provides a method of manufacturing a planar heating element and a planar heating element that provides a heating net structure with improved heating efficiency by dispersing conductive nanoparticles in a heating net structure composed of conductive wires. And a method of manufacturing a planar heating element and a planar heating element using conductive wires made of aluminum (Al), iron (Fe), and alloys thereof, which correspond to the low-cost metal group. There is provided a method of manufacturing a planar heating element and a planar heating element capable of solving the problems of low electrical conductivity and heating structure damage which can be generated by using a low cost metal group for the conductive wire to lower the manufacturing cost of the planar heating element by plating the conductive wire I want to. It is to be understood, however, that the technical scope of the present invention is not limited to the above-described technical problems, and other technical problems may exist.
According to an aspect of the present invention, there is provided a method of manufacturing a conductive wire, the method including: forming a conductive wire on a surface of the conductive wire by dry etching using a plasma to increase the surface area of the conductive wire; It is possible to provide a planar heating element including a concave-convex portion.
According to one example, the concave-convex portion includes a plurality of concave portions, and the depth of the concave portion may be 5% to 30% of the diameter of the conductive wire. The radius of curvature of the concave portion may be 10 nm to 100 nm, and the interval between the centers of adjacent concave portions may be 20 nm to 300 nm. The irregular portion may be formed by performing the dry etching for 3 seconds to 300 seconds.
According to one example, the dry etching may be performed using a plasma of a process gas containing CF 4 gas and O 2 gas.
According to one example, the dry etching may be performed using a plasma of a process gas containing at least one of Ar gas and N 2 gas.
According to one example, the conductive wire may be a metal nanowire. The aspect ratio of the metal nanowires may be 300 or more. The diameter of the metal nanowire may be 5 to 500 nm.
According to one example, the area heating element may further include conductive nanoparticles provided between adjacent conductive wires to increase a point of contact of the conductive wire. The diameter of the conductive nanoparticles may be three times or less the diameter of the conductive wire.
According to an example, the conductive wire may be provided on the surface of the conductive wire with a metal plating film having a higher corrosion resistance than the material constituting the conductive wire.
According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a concave-convex portion for increasing a surface area on a surface of a conductive wire by dry etching using a plasma; dispersing the conductive wire in which the concave- And a step of forming a planar heating element.
According to one example, the dry etching may be performed using a plasma of a process gas containing CF 4 gas and O 2 gas. The dry etching may be performed in a vacuum atmosphere of 10 -1 torr to 10 -6 torr for 3 seconds to 300 seconds.
According to one example, the dry etching may be performed using a plasma of a process gas containing at least one of Ar gas and N 2 gas.
According to one example, the conductive wire may be a metal nanowire.
According to one example, after the step of dispersing the conductive wire, it may further include dispersing the conductive nanoparticles in the coating solution in which the conductive wire is dispersed to increase the point of contact of the conductive wire.
According to one example, the step of dispersing the conductive wire includes dispersing the conductive wire in the coating solution in an amount of 0.1 to 5 wt%, wherein the step of dispersing the conductive nanoparticles includes dispersing the conductive wire in the coating solution in which the conductive wire is dispersed, And dispersing the conductive nanoparticles in an amount of 20 wt% or less of the weight of the wire.
According to one example, the step of forming the concave-convex portion and further before the step of dispersing the conductive wire may further include plating the surface of the conductive wire with a metal having a higher corrosion resistance than the conductive wire.
According to one example, the plating step may be performed by a method selected from PVD, displacement plating and reduction plating.
According to an exemplary embodiment of the present invention, after forming the irregular network structure of the conductive wire, an electrode is formed at both ends of the network structure, and the packaging structure is formed by performing heat treatment on the network structure and the substrate on which the electrode is formed .
The above-described task solution is merely exemplary and should not be construed as limiting the present invention. In addition to the exemplary embodiments described above, there may be additional embodiments described in the drawings and the detailed description of the invention.
According to any one of the above-mentioned objects of the present invention, there is provided a method of manufacturing a planar heating element and a planar heating element that increases the surface area of a conductive wire by performing dry etching using plasma on the surface of the conductive wire to form a concave- . A method of manufacturing a planar heating element and a planar heating element that provide conductive nanoparticles between adjacent conductive wires to increase the points of contact of the conductive wires can be provided. It is possible to provide a planar heating element and a planar heating element which provide a heating net structure with improved heating efficiency by dispersing conductive nano particles in a heating net structure composed of conductive wires. Also, it is possible to provide a method of manufacturing a planar heating element and a planar heating element using a conductive wire made of aluminum (Al), iron (Fe), or an alloy thereof corresponding to a low-cost metal group. In addition, a method of manufacturing a planar heating element and a planar heating element capable of solving the problems of low electrical conductivity and heat generation damage caused by the use of a low-cost metal group in a conductive wire to lower manufacturing cost of the planar heating element by plating the conductive nano structure Can be provided.
1 is a view showing a planar heating element according to an embodiment of the present invention.
2 is an exemplary view for explaining a process of forming a concave-convex portion on the surface of a conductive wire according to an embodiment of the present invention.
3 is an exemplary view for explaining a process of plating a conductive wire according to an embodiment of the present invention.
FIG. 4A is a view showing a contact point of a conductive wire of the prior art, and FIG. 4B is a view showing a contact point of a conductive wire whose surface area is increased by dry etching using plasma according to an embodiment of the present invention.
5 is a view illustrating a planar heating element having an irregular net structure according to an embodiment of the present invention.
6 is a view for explaining a process of packaging a planar heating element according to an embodiment of the present invention.
FIG. 7A is a view showing a conventional conductive wire, and FIG. 7B is a view showing a conductive wire having a concavo-convex portion formed by dry etching using a plasma according to an embodiment of the present invention.
FIG. 8 is a view illustrating a transparent surface heating element manufactured by using a conductive wire having a concavo-convex portion formed by dry etching using a plasma according to an embodiment of the present invention.
9 is a flowchart of a method of manufacturing the planar heating element according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 is a view showing a planar heating element according to an embodiment of the present invention. 1, the planar heating element may include a
The
The process of manufacturing the planar heating element using the
2 is an exemplary view for explaining a process of forming a concave-convex portion on the surface of a conductive wire according to an embodiment of the present invention. Referring to FIG. 2, the
For example, the surface of the
3 is an exemplary view for explaining a process of plating a conductive wire according to an embodiment of the present invention. Referring to FIG. 3, the
For example, the surface of the
Alternatively, the surface of the
As another example, the surface of the
As the displacement plating 330 and the reduction plating 340 method are performed in an aqueous solution, a process of filtering the plated
When the plating of the
At this time, when aggregation occurs in the
The
FIG. 4A is a view showing a contact point of a conductive wire of the prior art, and FIG. 4B is a view showing a contact point of a conductive wire whose surface area is increased by dry etching using plasma according to an embodiment of the present invention.
4A is a view showing the
4B is a view showing a
As described above, the
5 is a view illustrating a planar heating element having an irregular net structure according to an embodiment of the present invention. Referring to FIGS. 1 and 5, an
Dip coating, spray coating, spin coating, drop coating, or the like is used to form an
6 is a view for explaining a process of packaging a planar heating element according to an embodiment of the present invention. Referring to FIGS. 1 and 6, the
The net structure and the substrate on which the electrode is formed can be subjected to heat treatment to perform packaging. This is because, by packaging the exposed irregular network structure, the surface property of the surface heating element can be imparted to the surface, and the network structure can be shielded from the external environment. Further, in the case of a wearable surface heating element, the portion in which the current flows does not contact the body, and the heat generated in the heating portion directly touches the heating portion, thereby preventing an excessive temperature rise can do.
If the void space between the conductive wires constituting the irregular
FIG. 7A is a view showing a conventional conductive wire, and FIG. 7B is a view showing a conductive wire having a concavo-convex portion formed by dry etching using a plasma according to an embodiment of the present invention.
7A is a view showing a conventional silver nanowire (AgNW). Referring to FIG. 7A, the
FIG. 7B is a view showing a silver nanowire (AgNW) having a concavo-convex portion formed by dry etching using a plasma according to an embodiment of the present invention. Referring to FIG. 7B, the surface of the
For example, the
As a result of the analysis through the SEM of the
FIG. 8 is a view illustrating a transparent surface heating element manufactured by using a conductive wire having a concavo-convex portion formed by dry etching using a plasma according to an embodiment of the present invention. Referring to FIG. 8, the saturation temperature can be confirmed through a transparent surface heating element manufactured by using a conductive wire of 30 mm x 30 mm x 0.7 mm in which convex and concave portions are formed by dry etching using plasma.
The planar heating element can be manufactured by forming a heating structure on a transparent glass substrate. For example, 1500 rpm spin coating was performed using 0.1 ml of a silver nanowire (AgNW) coating solution formed by dry etching using a plasma, and after ethanol was evaporated, 0.5 mm Electrodes can be formed using a conductive silver paste of a thickness. At this time, a PDMS mixed solution having a ratio of resin to hardener of 10: 1 was uniformly coated on the surface of the substrate of the surface heating element using a transparent glass substrate, and the substrate was heat-treated at 150 ° C for 20 minutes using an atmospheric oven Then, when a voltage of 5 V was applied, it can be seen that the saturation temperature reached 43.2 캜 (800). However, the saturation temperature may be slightly different depending on the temperature measurement equipment.
9 is a flowchart of a method of manufacturing the planar heating element according to an embodiment of the present invention. The manufacturing method of the planar heating element according to the embodiment shown in FIG. 9 includes the steps of manufacturing the planar heating element according to the embodiment shown in FIGS. 1 to 8 in a time-series manner. Therefore, the contents already described with respect to the planar heating element according to the embodiment shown in Figs. 1 to 8 are applied to the planar heating element manufacturing method according to the embodiment shown in Fig.
In the step S910, the method for producing a planar heating element of the present invention may include the step of forming a concavo-convex portion for increasing the surface area on the surface of the conductive wire by dry etching using plasma. The conductive wire may be, for example, a metal nanowire. The dry etching is performed using a plasma of a process gas containing, for example, CF 4 gas and O 2 gas. The dry etching is performed for 3 to 300 seconds in a vacuum atmosphere of 10 -1 torr to 10 -6 torr Lt; / RTI >
In the step S920, the method for producing a planar heating element of the present invention may include dispersing the conductive wire having the irregularities in the coating solution. For example, 0.1 to 5 wt% of the conductive wire may be dispersed in the coating solution. The step of dispersing the conductive nanoparticles may further comprise dispersing the conductive nanoparticles in a coating solution in which the conductive wires are dispersed to increase the point of contact of the conductive wires after the step of dispersing the conductive wires, It is possible to disperse not more than 20 wt% of the conductive nanoparticles by weight of the conductive wire in the dispersed coating solution.
In the step S930, the method for manufacturing the area heating element of the present invention may include forming the irregular network structure of the conductive wire.
Although not shown in Fig. 9, the method for manufacturing the planar heating element of the present invention includes a step of plating the surface of the conductive wire with a metal having a higher electroconductivity than the conductive wire after the step of forming the uneven portion and before the step of dispersing the conductive wire As shown in FIG. At this time, the plating treatment may be performed by a method selected from PVD, displacement plating and reduction plating.
Although not shown in FIG. 9, in the method of manufacturing a planar heating element of the present invention, after forming the irregular network structure of the conductive wire, electrodes are formed at both ends of the network structure, And performing the packaging.
In the above description, steps S910 to S930 may be further divided into further steps or combined into fewer steps, according to an embodiment of the present invention. Also, some of the steps may be omitted as necessary, and the order between the steps may be changed.
It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.
The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.
110: conductive wire
120: substrate
130: Electrode
140: Packaging material
Claims (22)
A conductive wire formed of an irregular network structure; And
The conductive wire is subjected to dry etching using a plasma to increase the surface area of the conductive wire,
.
Wherein the concave and convex portion includes a plurality of concave portions,
Wherein the depth of the concave portion is 5% to 30% of the diameter of the conductive wire.
Wherein a radius of curvature of the concave portion is 10 nm to 100 nm and a distance between centers of adjacent concave portions is 20 nm to 300 nm.
Wherein the dry etching is performed using a plasma of a process gas containing CF 4 gas and O 2 gas.
Wherein the dry etching is performed using a plasma of a process gas containing at least one of Ar gas and N 2 gas.
Wherein the concavo-convex portion is formed by performing the dry etching for 3 seconds to 300 seconds.
Wherein the conductive wire is a metal nanowire.
Wherein the aspect ratio of the metal nanowires is 300 or more.
Wherein the metal nanowires have a diameter of 5 to 500 nm.
Wherein the planar heating element further comprises conductive nanoparticles provided between adjacent conductive wires to increase a point of contact of the conductive wire.
Wherein a particle diameter of the conductive nanoparticles is 3 times or less the diameter of the conductive wire.
Wherein the conductive wire comprises a metal plating film having a higher corrosion resistance than the material constituting the conductive wire on the surface of the conductive wire.
Forming an irregular portion for increasing the surface area on the surface of the conductive wire by dry etching using a plasma;
Dispersing the conductive wire in which the concavities and convexities are formed in a coating solution,
Forming an irregular network structure of the conductive wire;
And heating the surface heating element.
Wherein the dry etching is performed using a plasma of a process gas containing CF 4 gas and O 2 gas.
Wherein the dry etching is performed using a plasma of a process gas containing at least one of Ar gas and N 2 gas.
Wherein the dry etching is performed in a vacuum atmosphere of 10 -1 torr to 10 -6 torr for 3 seconds to 300 seconds.
Wherein the conductive wire is a metal nanowire.
Further comprising the step of dispersing the conductive nanoparticles in the coating solution in which the conductive wire is dispersed to increase the point of contact of the conductive wire after the step of dispersing the conductive wire.
Further comprising a step of plating the surface of the conductive wire with a metal having a higher corrosion resistance than the conductive wire after the step of forming the concave-convex portion and before the step of dispersing the conductive wire. Way.
Wherein the plating step is performed by a method selected from PVD, substitution plating and reduction plating.
Forming an irregular network structure of the conductive wire, forming an electrode at both ends of the network structure, and performing heat treatment on the network structure and the substrate on which the electrode is formed to perform packaging. Of the surface heating element.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021020914A1 (en) * | 2019-07-31 | 2021-02-04 | 주식회사 아이테드 | Transparent heating film |
KR102228662B1 (en) * | 2019-10-16 | 2021-03-16 | (주)아이테드 | Transparent heating film |
KR20210120225A (en) * | 2020-03-26 | 2021-10-07 | (주)아이테드 | Transparent heating film with improved surface roughness |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101783752B1 (en) | 2016-06-10 | 2017-10-12 | 주식회사 경동원 | Heating plate and manufacturing method of the same |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101783752B1 (en) | 2016-06-10 | 2017-10-12 | 주식회사 경동원 | Heating plate and manufacturing method of the same |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021020914A1 (en) * | 2019-07-31 | 2021-02-04 | 주식회사 아이테드 | Transparent heating film |
KR102228662B1 (en) * | 2019-10-16 | 2021-03-16 | (주)아이테드 | Transparent heating film |
KR20210120225A (en) * | 2020-03-26 | 2021-10-07 | (주)아이테드 | Transparent heating film with improved surface roughness |
KR102431797B1 (en) * | 2020-03-26 | 2022-08-11 | (주)아이테드 | Transparent heating film with improved surface roughness |
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