KR101802932B1 - Heating plate and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a planar heating element, and a manufacturing method thereof. The planar heating element comprises: a conductive nanostructure formed to have an irregular network structure; and conductive nanoparticles provided between adjacent conductive nanostructures to increase a contact point of the conductive nanostructure, thereby increasing heating efficiency.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar heating element and a manufacturing method of the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar heating element and a method of manufacturing the same. More particularly, the present invention relates to a planar heating element and a method of manufacturing the same.

The surface heating element is an object that generates heat on the surface. When a metal electrode is provided on both ends of a conductive heating element on a thin surface and insulation voltage is applied to the metal electrode, heat is generated from the entire surface. As the electrode of the planar heating element, silver (Ag), copper (Cu) or the like is used, and as the heating element made of carbon, carbon paste, carbon fiber and the like are used.

The surface heating element has the advantage that it has better heating efficiency than the existing linear heating element, enables rapid heating control, and has a small volume occupied by the heating structure, so that it can be applied to various products. These advantages of the surface heating element are that it is possible to use a transparent / flexible heater used in an automobile glass, a house interior / exterior, etc., a flexible / stretchable / wearable heat treatment device utilizing a high thermal efficiency, a wearable heating device, and the like.

Regarding such surface heating elements, Korean Patent Registration No. 10-1028843 discloses a carbon fiber surface heating element and a manufacturing method thereof.

However, the carbon surface heating element according to the related art has a high risk of fire due to the continuous heat generation and damage to the heat generation structure due to external force, and the heating efficiency is lowered. Accordingly, a planar heating element using conductive fiber has been suggested as an alternative. However, the conductive fiber-based planar heating elements use materials such as Ag, Cu, and CNT for electrical conductivity and chemical stability, but these materials have disadvantages that they can increase the price of the planar heating elements because of high unit cost.

Although it is possible to use an inexpensive material in order to solve the above problems, an inexpensive material has a problem of low electrical conductivity or poor chemical stability. Therefore, it is required to develop a planar heating element having electrical conductivity and chemical stability while using an inexpensive material.

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a planar heating element having a heating net structure with improved heating efficiency by dispersing conductive nanoparticles in a heating net structure composed of conductive nanostructures together, The purpose is to do.

Another object of the present invention is to reduce the manufacturing cost of the surface heating element by using a conductive nanostructure made of aluminum (Al), iron (Fe) and an alloy thereof corresponding to a low-cost metal group, The present invention provides a planar heating element capable of solving the problems of low electrical conductivity and heat generation damage which can be achieved through surface treatment and plating of a conductive nanostructure, and a manufacturing method thereof.

However, the technical problem to be solved by the present invention is not limited to the above, and other technical problems may exist.

As means for solving the above-mentioned technical problem,

The present invention provides a planar heating element comprising: a conductive nanostructure formed of an irregular network structure; And conductive nanoparticles provided between adjacent conductive nanostructures to increase a point of contact of the conductive nanostructure.

In this case, the conductive nanostructure may be formed of Ag nanowire, Au nanowire, Cu nanowire, Ni nanowire, Fe nanowire, Al nanowire, Fe alloy nanowire, Al alloy nanowire, carbon fiber, Wall carbon nanotubes, multi-wall carbon nanotubes, and graphenes.

In this case, the graphene may be oxidized graphene or reduced oxidized graphene.

In this case, the aspect ratio of the conductive nanostructure may be 100 or more and 5,000 or less.

In this case, the diameter of the conductive nanostructure may be 5 to 500 nm.

In this case, a metal plating film having a higher electrical conductivity than the conductive nanostructure may be formed on the surface of the conductive nanostructure.

In this case, the metal plating film may be made of a material containing at least one of Ag, Au, Pt, Cu, Sn and Ni.

In this case, the surface of the conductive nanostructure may be etched with a solution containing at least one of sulfuric acid, nitric acid, and hydrochloric acid.

In this case, the conductive nanoparticles may include at least one selected from Cu nanoparticles, Ni nanoparticles, Ti nanoparticles, Fe nanoparticles, Ag nanoparticles, and Co nanoparticles.

In this case, the planar heating element may further include a substrate coated with the conductive nanostructure and the conductive nanoparticles, wherein the substrate is a hard substrate made of ceramic or glass, or a flexible substrate made of a polymer, Substrate.

In this case, the substrate may be packaged by a material comprising at least one of thermoplastics and thermoset plastics.

In this case, the thermoplastic resin may be at least one selected from among PE, PP, PVC, PS, ABS resin, AS resin, PMMA, PVA and PVDC, and the thermosetting plastic may be at least one selected from the group consisting of PF, UF, melamine resin, MF, UP, EP, PUR, silicone resin and diallyl phthalate resin.

In this case, the substrate may be surface-treated by any one of plasma etching, sputtering, light sintering, heat sintering and electron beam irradiation.

The present invention also provides a method of producing a planar heating element, comprising the steps of: dispersing a conductive nanostructure in a coating solution; Dispersing the conductive nanoparticles in a coating solution in which the conductive nanostructure is dispersed to increase a contact point of the conductive nanostructure; And forming an irregular network structure of the conductive nanostructure by applying a coating solution containing the conductive nanostructure and the conductive nanoparticle on a substrate.

In this case, the conductive nanostructure may be formed of Ag nanowire, Au nanowire, Cu nanowire, Ni nanowire, Fe nanowire, Al nanowire, Fe alloy nanowire, Al alloy nanowire, carbon fiber, Wall carbon nanotubes, multi-wall carbon nanotubes, and graphenes.

In this case, the graphene may be oxidized graphene or reduced oxidized graphene.

In this case, the aspect ratio of the conductive nanostructure may be 100 or more and 5000 or less, and the diameter of the conductive nanostructure may be 5 to 500 nm.

In this case, the conductive nanoparticles may include at least one selected from Cu nanoparticles, Ni nanoparticles, Ti nanoparticles, Fe nanoparticles, Ag nanoparticles, and Co nanoparticles.

In this case, the substrate may be a rigid substrate made of ceramic or glass, or a flexible substrate made of any one selected from polymer, fiber and paper.

In this case, the manufacturing method of the planar heating element may further include plating the surface of the conductive nanostructure with a metal having higher electrical conductivity than the conductive nanostructure before the step of dispersing the conductive nanostructure.

In this case, the step of plating may be performed by a method selected from PVD, displacement plating and reduction plating.

In this case, in the method of manufacturing the planar heating element, before the step of dispersing the conductive nanostructure, the conductive nanostructure is etched by a solution containing at least one of sulfuric acid, nitric acid and hydrochloric acid, The method further comprising:

In this case, the manufacturing method of the planar heating element may further include a step of heat-treating the substrate coated with the conductive nanostructure and the conductive nanoparticles to increase the adhesive force and the conductivity.

In this case, in the method of manufacturing the planar heating element, after forming the irregular network structure of the conductive nanostructure, electrodes are formed at both ends of the network structure, heat treatment is performed on the substrate having the network structure and the electrode formed And packaging it.

In this case, the packaging may be made of a material comprising at least one of thermoplastics and thermoset plastics.

In this case, the thermoplastic resin may be at least one selected from among PE, PP, PVC, PS, ABS resin, AS resin, PMMA, PVA and PVDC, and the thermosetting plastic may be at least one selected from the group consisting of PF, UF, melamine resin, MF, UP, EP, PUR, silicone resin and diallyl phthalate resin.

The above-described task solution is merely exemplary and should not be construed as limiting the present invention. In addition to the exemplary embodiments described above, there may be additional embodiments described in the detailed description and drawings of the invention.

According to the present invention, since the conductive nanoparticles in the heating net structure composed of the conductive nanostructure are dispersed together, the heating efficiency of the plane heating element can be improved.

Further, by using a conductive nanostructure made of aluminum (Al), iron (Fe), or an alloy thereof corresponding to a low-cost metal group, manufacturing cost of the surface heating element can be minimized.

In addition, the problems of low electrical conductivity and thermal damage caused by the use of low-cost metals can be solved through surface treatment and plating of conductive nanostructures.

1 is a view showing a planar heating element according to an embodiment of the present invention,
2 is a diagram illustrating a plating process of a conductive nanostructure in a planar heating element according to an embodiment of the present invention,
3A is a view showing contact points of a conductive nanostructure in a planar heating element according to the prior art,
FIG. 3B is a view showing a contact point of the conductive nanostructure in the planar heating element according to an embodiment of the present invention, FIG.
4 is a view illustrating a planar heating element having an irregular net structure according to an embodiment of the present invention.
5 is a view illustrating a state in which a planar heating element according to an embodiment of the present invention is packaged;
6 is a process flow diagram illustrating a method of manufacturing a planar heating element according to an embodiment of the present invention,
FIG. 7 illustrates a planar heating element manufactured using an iron nanostructure according to an embodiment of the present invention. FIG.
8 is a view showing a planar heating element manufactured using silver nanowire (AgNW) according to an embodiment of the present invention,
FIG. 9 is a view showing a plated iron nanostructure according to an embodiment of the present invention,
FIG. 10 illustrates a conductive nanostructure formed on a substrate according to an embodiment of the present invention with an irregular network structure. FIG.
FIG. 11 is an exemplary view illustrating heat generation efficiency according to a plating film formed on a conductive nanostructure according to an embodiment of the present invention,
FIG. 12 illustrates a coating solution prepared for forming an irregular network structure according to an embodiment of the present invention. FIG.
13 is a view showing a planar heating element manufactured using a coating solution in which silver nanowires (AgNW) and copper (Cu) nanoparticles are mixed according to an embodiment of the present invention.
14 is a view showing a planar heating element manufactured using a coating solution in which silver nanowires (AgNW) and nickel (Ni) nanoparticles are mixed according to an embodiment of the present invention.
15 is a view showing a planar heating element manufactured using a coating solution in which silver nanowires (AgNW) and cobalt (Co) nanoparticles are mixed according to an embodiment of the present invention.
16 is a view showing a tendency of heat generation according to nanoparticles dispersed in a coating solution according to an embodiment of the present invention,
17 is a view showing a planar heating element manufactured using a silver nanowire (AgNW) and a graphene coating solution according to an embodiment of the present invention,
18 is a view showing a planar heating element manufactured using a silver nanowire (AgNW) and a reduced oxidized graphene coating solution according to an embodiment of the present invention,
FIG. 19 is a graph showing a tendency of heat generation according to graphene dispersed in a coating solution according to an embodiment of the present invention,
20 is a view showing a planar heating element manufactured using a coating solution in which silver nanowires (AgNW) and copper (Cu) nanoparticles are mixed according to an embodiment of the present invention.
21 is a view showing a planar heating element manufactured by applying silver nanowires (AgNW) and copper (Cu) nanoparticles according to an embodiment of the present invention and performing plasma etching treatment,
22 is a view showing a planar heating element manufactured by applying and sputtering silver nanowires (AgNW) and copper (Cu) nanoparticles according to an embodiment of the present invention;
23 is a view showing a planar heating element manufactured by applying silver nano wire (AgNW) and copper (Cu) nanoparticles according to an embodiment of the present invention and photo-
24 is a view showing a planar heating element manufactured by applying silver nanowires (AgNW) and copper (Cu) nanoparticles according to an embodiment of the present invention and performing heat sintering,
25 is a view showing a planar heating element manufactured by applying silver nanowires (AgNW) and copper (Cu) nanoparticles according to an embodiment of the present invention and electron beam (E-beam)
FIG. 26 is a graph showing a tendency of heat evolution after processing silver nanowires (AgNW) and copper (Cu) nanoparticles according to an embodiment of the present invention by plasma etching, sputtering, light sintering and electron beam (E-beam) The drawings,
27 is a view illustrating a planar heating element manufactured using an aluminum oxide substrate according to an embodiment of the present invention,
28 is a view showing a planar heating element manufactured using a garment cloth according to an embodiment of the present invention,
29 is a view showing an area heating element manufactured using office paper according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

FIG. 1 is a view illustrating a planar heating element according to an embodiment of the present invention. FIG. 2 is a view illustrating a plating process of a conductive nanostructure in a planar heating element according to an embodiment of the present invention. FIG. 3B is a view showing a contact point of the conductive nanostructure in the planar heating element according to an embodiment of the present invention; and FIG. 4 is a cross-sectional view illustrating a contact point of the conductive nanostructure in the planar heating element according to an embodiment of the present invention. FIG. 5 is a view showing a state in which a planar heating element is packaged according to an embodiment of the present invention. FIG.

1, the planar heating element according to an exemplary embodiment of the present invention includes a conductive nanostructure 110, conductive nanoparticles 120, a substrate 130, an electrode 140, and a wire 150 ).

The conductive nanostructure 110 is formed in a wire shape having a diameter of 5 to 500 nm, an aspect ratio of 100 to 5000 and a length of 0.5 to 2500 m to form an irregular network structure.

The aspect ratio of the conductive nanostructure 110 is preferably 100 or more and 5,000 or less. If the aspect ratio of the conductive nanostructure 110 is less than 100, there is a limit in improving the electrical conductivity because there are few points of contact between the wire and the adjacent wire. If the aspect ratio is more than 5,000, the manufacturing is difficult, have.

The conductive nanostructure 110 may be formed of metal nanowires made of iron (Fe), aluminum (Al), or an alloy thereof, which corresponds to a low-cost metal group, or may be made of silver nanowires (AgNW) (AuNW), copper nanowires (CuNW), nickel nanowires (NiNW), carbon fibers, single wall carbon nanotubes (SW-CNT), multiwall carbon nanotubes (MT- Graphene) and the like.

In this case, the graphene may be conventional graphene, oxidized graphene or reduced oxidized graphene. The oxidized graphene can be reduced by heat treatment at 100 to 1000 ° C for 30 to 120 minutes in vacuum, Ar, H ₂ , N _2, or a mixture thereof. Such graphene may be formed by applying the conductive nanostructure 110 to the substrate 130 and then applying the graphene sheet or applying the conductive nanostructure 110 and applying the graphene sheet to the conductive nanoparticles 120 Or may be formed by applying the conductive nanostructure 110, applying the nano powder, and then applying the graphene sheet. Alternatively, the conductive nanostructure 110 may be formed in a form of a graphen sheet, The mixture of the graphene sheet and the conductive nanoparticles 120 may be dispersed and applied to the substrate 130.

On the other hand, the conductive nanostructure 110 may be formed with a metal plating film on its surface to improve electrical conductivity and corrosion resistance. That is, as shown in FIG. 2, the plating material 210 may be plated on the surface of the conductive nanostructure 200 in various manners. The metal plating layer may be formed of a metal having high electrical conductivity, such as silver (Ag), gold (Au), platinum (Pt), or the like, so as to improve the electrical conductivity and chemical stability of the conductive nanostructure 200. [ , Copper (Cu), tin (Sn), nickel (Ni), and the like.

In this case, the plating is preferably performed by physical vapor deposition (PVD), substitution plating, or reduction plating so as to uniformly form a metal plating film on the surface of the conductive nanostructure 200.

First, the surface of the conductive nanostructure 200 can be plated by physical vapor deposition (PVD), more specifically, sputtering 220 (sputtering).

In this case, the conductive nanostructure 200 may be plated only on the surface 222 of the conductive nanostructure 200 facing the target 221. In order to ensure the chemical stability of the conductive nanostructure 200, Sputtering may be performed by changing the orientation of the structure 200.

Examples of the metal material for performing the plating by physical vapor deposition (PVD) include metals having higher electrical conductivity than iron (Fe) such as silver (Ag), gold (Au), aluminum (Al), tungsten (W) Zinc (Zn), nickel (Ni), or the like can be used. The following Table 1 shows the conductivity ratios of the respective metals.

metal Ag Cu Au Al W Zn Ni Fe Pt Conductivity (%) 106 100 71.8 62.7 31.3 29.2 23.8 17.6 16.3

In addition, the surface of the conductive nanostructure 200 can be plated by the displacement plating method 230.

For example, when the conductive nanostructure 200 is immersed in a plating solution in which ions of a metal having a lower ionization tendency than a metal plating material are immersed, M ₁ + M ₂ ⁺ → M ₁ ⁺ + M ₂ reaction (M ₁ : Plating material, M ₂ : plating material) can be advanced. By using the displacement plating method 230, a plated film can be formed over the entire surface of the immersed plating material, and a plated surface thinner and more flat than reduction plating can be obtained due to the nature of the plating to be substituted with the metal on the surface of the plated material. In this case, the plating material may be a metal having a smaller ionization tendency than iron (Fe) and having high electrical conductivity or chemical stability such as silver (Ag), gold (Au), tin (Sn), nickel (Ni) Lead (Pb) or the like may be used.

In addition, the surface of the conductive nanostructure 200 can be plated by the reduction plating method 240.

For example, the conductive nanostructure 200 can be plated by immersing a plating material in a plating solution in which plating metal ions are present, and the M ⁺ + e ^- > M reaction can be performed using a reducing agent. When the reduction plating method 240 is used, plating can be performed on all sides of the plating material immersed in the solution, and electrical conductivity and chemical stability can be obtained at the same time. In this case, as the plating material, metals such as silver (Ag), gold (Au), zinc (Zn), tin (Sn), nickel (Ni) and the like which are superior in electric conductivity and chemical stability than iron .

However, since the displacement plating method 230 and the reduction plating method 240 are performed in an aqueous solution, a process of filtering out the plated conductive nanostructure 200 is required. In order to separate the conductive nanostructure 200 from the aqueous solution, A filtration method using a filter paper, a centrifugal separation method, or the like can be used.

The plating method of the conductive nanostructure has been described above. Referring to FIG. 1 again, the conductive nanostructure 110 may be provided with concavities and convexities on the surface thereof in order to improve the electrical conductivity of the conductive nanostructure 110 together with the above-described plating. The concavo-convex portion increases the surface area of the conductive nanostructure 110 to increase the contact point between the conductive nanostructures 110 to improve the electrical conductivity. The conductive nanostructure 110 is made of sulfuric acid (H ₂ SO ₄ ), nitric acid (HNO ₃ ) And hydrochloric acid (HCl).

The conductive nanoparticles 120 are provided between the conductive nanostructure 120 and the adjacent conductive nanostructure for increasing the contact point of the conductive nanostructure 110.

The conductive nanoparticles 120 may be selected from the group consisting of copper nanoparticles, nickel nanoparticles, titanium nanoparticles, iron nanoparticles, silver nanoparticles, cobalt nanoparticles, Particles, graphene, MW-CNT, SW-CNT, and the like. In this case, the graphene may be conventional graphene, oxidized graphene or reduced oxidized graphene.

As shown in FIGS. 3A and 3B, in the present invention, between the conductive nanostructure 310 and adjacent conductive nanostructures, that is, the conductive nanostructure 120 Since the conductive nanoparticles 330 are positioned in the vicinity of the contact point 320 of the conductive nanostructure 310, the contact nanoparticles 330 provide more contact resistance points than the conventional conductive nanostructure upon application of current, .

As shown in FIG. 4, the substrate 130 is a substrate of a planar heating element. The conductive nanostructure 110 and the conductive nanoparticles 120 are coated on one surface to form an irregular network structure 400.

In this case, the irregular network structure 400 may be formed by coating the substrate 130 with a coating solution of the conductive nanostructure 110 and the conductive nanoparticles 120, and the coating method may be a dip coating method, Spray Coating, Spin Coating, Drop Coating, and the like can be used. In this regard, when the coating solution is excessively applied to the substrate 130, the density of the irregular network structure 400 may be appropriately adjusted by using air brushing, brushing, spin coating, Can be adjusted.

As the substrate 130 in the present invention, a rigid substrate made of ceramic, glass, or the like, or a flexible substrate made of polymer, fiber, paper or the like such as PET, PVCD, PDMS or the like can be used.

The electrodes 140 are formed at both ends of the substrate 130 as shown in Figs. The electrode 140 may be formed of a metal paste, a metal foil, a metal PVD or the like. The electrode 140 may be made of platinum (Pt), gold (Au), silver (Ag) , Aluminum (Al), or the like can be used.

The substrate 130 on which the network structure 400 and the electrode 140 are formed may be packaged to provide insulating properties to the planar heating elements and to protect the net structure 400 and the electrodes 140 .

That is, if the packaging material is uniformly applied to the substrate 130, the empty space between the conductive nanostructures 110 is filled with the packaging material, so that the heat generating performance is lost even by the external force such as bending, folding, . Examples of the packaging material include thermoplastic plastics such as PE, PP, PVC, PS, ABS resin, AS resin, PMMA, PVA and PVDC; PF, UF, melamine resin, MF, alkyd resin, UP, EP, PUR, And a thermosetting plastic such as a diallyl phthalate resin may be used.

When the packaging is performed as described above, the irregular network structure 400 exposed on the substrate 130 is packaged, thereby imparting insulation characteristics to the surface of the area heating element and shielding it from the external environment. Particularly, in the case of a wearable surface heating element, since the portion of the wearable surface heating element is not brought into contact with the body and the heat generated by the heating portion is directly transmitted to the heating portion, The rise can be prevented.

The electric wire 150 is connected to the electrode 140 for supplying external power to the surface heating element.

The planar heating element described above may be formed by plasma etching the substrate 130 on which the conductive nanostructure 110 and the conductive nanoparticles 120 are coated in order to increase the contact point of the conductive nanostructure 110 and improve the electric conductivity, The surface treatment can be performed by a method such as sputtering, light sintering, thermal sintering, and E-beam irradiation. Specific methods thereof will be described later in detail.

The planar heating element according to one embodiment of the present invention has been described above. Hereinafter, a method of manufacturing a planar heating element according to an embodiment of the present invention will be described with reference to the drawings.

6 is a flow chart showing a method of manufacturing a planar heating element according to an embodiment of the present invention.

As shown in FIG. 6, a method of manufacturing a planar heating element according to an embodiment of the present invention includes the steps of dispersing a conductive nanostructure in a coating solution (S1910), a step of forming a conductive nanostructure (S1920) of dispersing the conductive nanoparticles in the coating solution in which the conductive nanoparticles are dispersed (S1920), and forming an irregular network structure of the conductive nanostructure by applying a coating solution containing the conductive nanostructure and the conductive nanoparticles on the substrate Hereinafter, each step will be described in detail.

First, the conductive nanostructure is dispersed in a coating solution such as methanol, ethanol, distilled water, IPA, or the like. The coating solution is highly volatile at room temperature, so that when the conductive nanostructure is dispersed in a state of being coated on a substrate, the coating solution evaporates in a short time, thereby allowing the adsorption of the remaining conductive nanostructure.

In this case, when aggregation occurs in the conductive nanostructure, aggregation can be suppressed by using a dispersant, an ultrasonic wave, a stirrer, or the like. The method using a dispersant may include a surfactant (anionic, cationic, nonionic surfactant) of 0.5 wt% or less, and the dispersant may include, for example, polyethylene glycol, octyl phenoxy polyethoxy ethanol, sodium, dodecylsulfate, . The method using ultrasonic waves disperses the aggregation of conductive nanostructures by applying ultrasonic waves in the range of 0 to 20 kHz for 1 hour or more. Also, the method using a stirrer disperses the coagulation by stirring at a speed of 1000 rpm or more.

On the other hand, the conductive nanostructure may be a metal nanowire made of Fe, Al or an alloy thereof, an Ag nanowire, an Au nanowire, a Cu nanowire, a Ni nanowire, a carbon fiber, a single wall carbon nanotube, And graphene, and the graphene may be conventional graphene, or may be oxidized graphene or reduced oxidized graphene. In addition, the aspect ratio of the conductive nanostructure may be 100 to 5000, and the diameter may be 5 to 500 nm.

The surface of the conductive nanostructure may be plated with a metal having higher electrical conductivity than the conductive nanostructure before dispersing the conductive nanostructure in order to improve the electrical conductivity. The plating treatment may be performed by a method selected from PVD, displacement plating and reduction plating.

In order to increase the surface area of the conductive nanostructure to increase the contact points of the conductive nanostructure, the conductive nanostructure is etched with a solution containing at least one of sulfuric acid, nitric acid and hydrochloric acid before the dispersion of the conductive nanostructure to form concave- .

When the dispersion of the conductive nanostructure is completed as described above, the conductive nanoparticles are dispersed in the coating solution to increase the contact point of the conductive nanostructure.

The conductive nanoparticles may include Cu nanoparticles, Ni nanoparticles, Ti nanoparticles, Fe nanoparticles, Ag nanoparticles, Co nanoparticles, and carbon particles.

Then, a coating solution in which the conductive nanostructure and the conductive nanoparticles are dispersed is applied on the substrate to form an irregular network structure of the conductive nanostructure.

In this case, the substrate may be a rigid substrate made of ceramic, glass, or the like, or a flexible substrate made of polymer, fiber, paper, or the like.

When a network structure is formed on a substrate, electrodes are formed on both ends of the network structure, and packaging is performed.

Such packaging may be performed in a step of performing a surface coating to protect the conductive nanostructure and the conductive nanoparticles. As the surface coating material, thermoplastic plastic and thermosetting plastic can be used. For example, thermoplastic plastics may include PE, PP, PVC, PS, ABS resin, AS resin, PMMA, PVA and PVDC, and thermosetting plastics may include PF, UF, melamine resin, MF, EP, PUR, silicone resin and diallyl phthalate resin.

A solution prepared by mixing the coating material and a hardener in a ratio of 1:10 to 10: 1 is uniformly applied to a substrate and heat-treated and packaged at 50 to 200 ° C for 1 to 60 minutes using an atmospheric oven . In this case, if necessary, a glass substrate, a resin, or the like may be additionally coated on the surface-coated substrate.

Meanwhile, the present invention can perform plasma etching, sputtering, photo-sintering, thermal sintering or electron beam irradiation after dispersing the conductive nanoparticles or after forming an irregular network structure in order to increase the contact points of the conductive nanostructure This will be described in detail below.

First, in order to increase the contact points of the conductive nanostructure, the conductive nanoparticles may be dispersed in a coating solution in which the conductive nanostructure is dispersed, and then plasma etching may be performed.

For example, the contact area can be increased by plasma etching the conductive nanostructure, the conductive nanoparticles, the graphene sheet, or the substrate on which the conductive nanostructure, the conductive nanoparticle, the graphene sheet, or the substrate is coated. Such a plasma etch may be carried out in an atmosphere comprising at least one of atmospheric conditions and CF ₄ , O ₂ , H ₂ , NF ₃ , SF ₆ , Cl ₂ , BCl ₃ or Ar. The degree of vacuum may be 0.1 to 100 mTorr and the time may be 1 to 180 minutes. When the degree of vacuum is less than 0.1 mTorr, expensive equipment is required because it is a high vacuum, and when the vacuum degree exceeds 100 mTorr, impurities may not be introduced or etching treatment due to low vacuum. If the treatment time is less than 1 minute, etching may not be performed, and if it exceeds 180 minutes, excessive etching and damage may be caused.

In order to increase the contact point of the conductive nanostructure, the conductive nanoparticles may be dispersed in a coating solution in which the conductive nanostructure is dispersed, and then the conductive nanoparticles may be sputtered.

For example, the contact area can be increased by sputtering the conductive nanostructure, the conductive nanoparticles, the graphene sheet, or the substrate on which the conductive nanostructure, the conductive nanoparticle, the graphene sheet, or the substrate is coated. Such sputtering can be carried out under atmospheric conditions and in an inert gas atmosphere such as Ar, N ₂ , He and NE. Also, the DC power may be 0.1 to 5 kV and the time may be 1 to 1800 s. Voltages below 0.1 kV may not be deposited because the energy required for deposition is low, and voltages above 5 kV may cause damage to equipment and specimens with excessive intensity. If the treatment time is less than 1 second, deposition may not be performed, and if it exceeds 1800 seconds, excessive deposition and damage may be caused.

In order to increase the contact point of the conductive nanostructure, the conductive nanoparticles may be dispersed in a coating solution in which the conductive nanostructure is dispersed, followed by photo-sintering and thermal sintering.

For example, the contact area can be increased by thermally sintering the conductive nanostructure, the conductive nanoparticles, the graphene sheet, or the substrate to which they are applied to bond the wires to each other. The heat sintering is performed at 50 to 500 ° C for 1 to 180 minutes in an atmospheric, vacuum, Ar, N ₂ , H _2, or a mixed atmosphere thereof. When the heat treatment is performed, the conductive nanostructure 110 and the conductive nanostructure or conductive nanoparticles The adhesive strength between the first and second substrates 120 can be increased to improve the heat generation efficiency. However, if the heat treatment temperature is less than 50 ° C, there is no influence on the improvement of the adhesion. If the heat treatment temperature is higher than 500 ° C, the conductive nanostructure 110 and the conductive nanoparticles 120 may be damaged. Therefore, the heat treatment temperature is preferably 50 to 500 ° C. In addition, a short time heat treatment is required at a high temperature, and a minimum of one minute is required. At a low temperature, a long time heat treatment is required. The heat treatment time is preferably from 1 to 180 minutes because it takes up to 180 minutes.

As another example, the contact area can be increased by photo-sintering the conductive nanostructure, the conductive nanoparticles, the graphene sheet, or the substrate to which they are applied to bond the wires to each other. In this case, the light source may be a white light, an ultraviolet light, an infrared light, or a composite light source of them. White light is an intensity of 0.01 ~ 200J / cm ^2, is 0.1 ~ 200ms exposure time, UV light intensity is 1 ~ 200mW / cm ^2, the irradiation time is 0.1 ~ 600s, the infrared intensity is 1 ~ 200mW / cm ^2, irradiation time 0.1 to 600 s. White light, ultraviolet light, and each of the intensity of the infrared rays ^{0.01J / cm 2, 1mW / cm} 2, 1mW / cm 2 is less than, and may not be able to sinter the low energy, white light, ultraviolet light, and that each 200J / cm ² intensity of the infrared rays, 200mW / cm ² , above 200 mW / cm ² , the specimen may be damaged by excessive strength. In addition, sintering may not be performed when the irradiation time of white light, ultraviolet ray and infrared ray is less than 0.1 ms, 0.1 second and 0.1 second, respectively, and when the irradiation time of white light, ultraviolet ray and infrared ray exceeds 200 ms, .

Finally, in order to increase the contact point of the conductive nanostructure, conductive nanoparticles may be dispersed in a coating solution in which the conductive nanostructure is dispersed, and then subjected to electron beam (E-beam) treatment.

For example, the contact area can be increased by irradiating an electron beam (E-beam) to a conductive nanostructure, a conductive nanoparticle, a graphene sheet, or a substrate coated with the conductive nanostructure, The electron beam can be irradiated for 1 to 60 minutes under a vacuum atmosphere at an RF power of 10 to 300 W and a DC power of 0.1 to 3 kV. If RF power and DC power are less than 10W and 0.1kV, respectively, the energy required for bonding may be low. If RF power and DC power are more than 300W and 3kV respectively, excessive strength may damage equipment and specimen. If the treatment time is less than 1 minute, bonding may not be performed, and if it exceeds 60 minutes, the specimen may be damaged.

For reference, RF is an abbreviation of Radio Frequency and is a radio frequency. DC stands for Direct Current and means DC.

The method of manufacturing the planar heating element according to an embodiment of the present invention has been described above. The method of manufacturing the planar heating element may be further divided into additional steps or combined into fewer steps according to embodiments of the present invention. Also, some of the steps may be omitted as necessary, and the order between the steps may be changed.

Hereinafter, embodiments of the present invention will be described.

7 is a view showing a planar heating element manufactured using the iron nanostructure according to an embodiment of the present invention. Referring to FIG. 7, the planar heating element may be manufactured using a pure iron nanostructure without a surface treatment having a diameter of 30 to 60 μm, a length of 10 to 15 mm, and an aspect ratio of 150 to 500. The surface heating element manufactured using the iron nanostructure has a resistance of 6 to 8?, And when the voltage of 5 V is applied, it can be seen that the heating has occurred from a room temperature of 25 占 폚 to 96 占 폚.

8 is a view showing a planar heating element manufactured using silver nanowire (AgNW) according to an embodiment of the present invention. Referring to FIG. 8, the surface heating element may be manufactured using silver nanowires (AgNW) having a diameter of 20 to 30 nm, a length of 20 to 30 μm, and an aspect ratio of 500 to 1500. The surface heating element manufactured by using the silver nanowire has a resistance of 6 to 6.5 OMEGA and when it is applied with a voltage of 5 V,

9 is a view showing a plated iron nanostructure according to an embodiment of the present invention. Referring to FIG. 9, plating may be performed using a variety of metals, such as PVD-sputtering process and displacement plating process, on iron nanowires having a diameter of 30 to 70 μm, a length of 10 to 15 mm, and an aspect ratio of 150 to 500.

The surface of the pure iron nanowire 810 before plating was subjected to surface analysis with EDS using a magnification of 1000 times, and it was found that it had a relatively even surface.

The gold-plated iron nanowire 820 was sputtered on the pure iron nanowire 810 using a PVD plating method. For example, the distance between the iron nanowire and the target metal, gold (Au), can be kept between 4 and 6 cm and sputtered for 180 seconds in a low vacuum atmosphere of 10 ^{- 2} torr. As a result of surface analysis with EDS, it can be seen that the surface of the iron nanowire was plated with 7 wt% of gold (Au) in the direction from the target metal to the gold (Au).

The silver plated nanowire 830 was subjected to displacement plating using silver (Ag) to the pure iron nanowire 810. The plating solution used for the substitution plating may be one prepared by using 5 g / L of silver nitrate (AgNO ₃ ), 40 g / L of sulfuric acid (H ₂ SO ₄ ), 2 g / L of PEG and 2 g / L of plating additive. The iron nanowire 830 plated with silver (Ag) was filtered with a filter paper, washed with distilled water, and subjected to surface analysis with EDS. As a result, it was found that about 7 wt% of silver was plated.

The copper-plated iron nanowire 840 performs substitution plating with pure iron nanowire 810 using copper (Cu). The plating solution used for the displacement plating may be one prepared by using 100 g / L of copper sulfide (CuSO ₄ ), 40 g / L of sulfuric acid (H ₂ SO ₄ ), 2 g / L of PEG and 2 g / L of plating additive. The iron nanowires 830 plated with copper (Cu) were filtered with a filter paper, washed with distilled water, and subjected to surface analysis with EDS. As a result, it was found that the surface was plated with about 86 wt% of copper (Cu).

Thereby, there is no difference in the surface shape of the pure iron nanowire 810 and the iron nanowires 820 to 840 plated with the metal, and the sputtering process through the PVD forms a very thin plating layer of 0.1 to 10 nm .

10 is a diagram illustrating a conductive nanostructure formed on a substrate according to an embodiment of the present invention, the conductive nanostructure having an irregular network structure. Referring to FIG. 10, a silver nanowire (AgNW) coating solution may be applied on a PET film to form an irregular heating net structure composed of discontinuous silver nanowires (AgNW). Irregular heating net structure can have a resistance of 6 ~ 6.5Ω. As a result of the analysis through the SEM, it can be seen that a large number of silver nanowires (AgNW) are arranged in an irregular direction, and a large number of contacts are formed therebetween.

FIG. 11 is an exemplary view showing heat generation efficiency according to a plating film formed on a conductive nanostructure according to an embodiment of the present invention. FIG. 9 and 11, a pure iron nanowire 1010 not subjected to a plating process can be used as a control group, and iron nanowires plated with various metals (1020 to 1040) can be compared with experimental groups.

When the same 5 V voltage was applied to each of the planar heating elements, the heating temperature of the planar heating elements manufactured using the pure iron nanowire 1010 as a control group was 96 ° C. The exothermic temperature of the surface heating element 1020 plated with gold (Au), which was an experimental group, was 133 ° C, which was 37 ° C higher than that of the control, and the exothermic temperature of the surface heating element 1030 plated with silver (Ag) ° C, and the exothermic temperature of the surface heating element 1040 plated with copper (Cu) was 134 ° C, which was 34 ° C higher than that of the control.

12 is a view showing a coating solution prepared for forming an irregular network structure according to an embodiment of the present invention. Referring to FIG. 12, the coating solution may be a conductive nanostructure dispersed, and the coating solution may be, for example, a silver nanowire (AgNW) coating solution 1110.

The coating solution can be prepared by dispersing the conductive nanoparticles in a coating solution in which the conductive nanostructure is dispersed. For example, the coating solution may be prepared as AgNW + CuNP coating solution 1120 by adding copper (Cu) having a diameter of 30 nm to the coating solution in which the silver nanowire (AgNW) is dispersed and then ultrasonically treating the coating solution for 4 hours . For example, the coating solution may be prepared by adding nickel (Ni) having a diameter of 10 nm to a coating solution in which silver nanowires (AgNW) are dispersed and then ultrasonically treating the coating solution for 4 hours to prepare AgNW + NiNP coating solution 1130 . As another example, the coating solution may be prepared by adding cobalt (Co) nanoparticles having a diameter of 10 nm to a coating solution in which silver nanowires (AgNW) are dispersed, and then ultrasonicating the coating solution for 4 hours to form AgNW + CoNP coating solution 1140 ). ≪ / RTI >

13 is a view showing a planar heating element manufactured using a coating solution in which silver nanowires (AgNW) and copper (Cu) nanoparticles are mixed according to an embodiment of the present invention. 13, the AgNW + CuNP coating solution is used. In the case of a plane heating element manufactured to have a size of 5031 x 0.65 nm, the plane heating element has a resistance of 10.3 to 10.6?, And when a voltage of 5 V is applied, It was found that it was heated up to 97 ° C.

FIG. 14 is a view showing a planar heating element manufactured using a coating solution in which silver nanowires (AgNW) and nickel (Ni) nanoparticles are mixed according to an embodiment of the present invention. 14, the AgNW + NiNP coating solution is used. In the case of a plane heating element manufactured to have a size of 50 x 31 x 0.65 nm, the plane heating element has a resistance of 3.3 to 3.8 ?, and when a voltage of 5 V is applied, Lt; RTI ID = 0.0 > 92 C. < / RTI >

FIG. 15 is a view showing a flexible surface heating element manufactured using a coating solution in which silver nanowires (AgNW) and cobalt (Co) nanoparticles are mixed according to an embodiment of the present invention. 15, the AgNW + CoNP coating solution is used. In the case of the plane heating element manufactured to have a size of 50 x 31 x 0.65 mm, the plane heating element has a resistance of 9.2 to 9.51 ?. When the voltage of 5 V is applied, Lt; RTI ID = 0.0 > 91 C. < / RTI >

FIG. 16 is a graph showing a tendency of heat generation according to nanoparticles dispersed in a coating solution according to an embodiment of the present invention. FIG. 13 to 16, copper (Cu) nanoparticles, nickel (Ni) nanoparticles and cobalt (Co) nanoparticles are dispersed in a coating solution 1510 in which silver nanowires (AgNW) It can be seen that when the voltage is applied, the amount of heat generated increases as the conductive nanoparticles are dispersed.

For example, coating solutions (1520, 1530, 1540) in which conductive nanoparticles were dispersed in silver nanowire (AgNW) were used as a control group and silver nanowire (AgNW) coating solution 1510 as a control group.

The exothermic temperature of the control silver nanowire (AgNW) coating solution 1510 may be 76 ° C.

(AgNW + CuNP, 1520) mixed with nanowires (AgNW) and copper (Cu) nanoparticles in the experimental group was heated at a temperature of 97 ° C. and the heat of a silver nanowire (AgNW) coating solution 1510 It can be seen that the temperature is 21 ° C higher than the temperature.

(AgNW + NiNP, 1530) mixed with nanowires (AgNW) and nickel (Ni) nanoparticles in the experimental group was heated at a temperature of 92 ° C. and the heat of the silver nanowire (AgNW) coating solution 1510 The temperature may be increased by 16 ° C.

(AgNW + CoNP, 1540) mixed with nanowires (AgNW) and cobalt (Co) nanoparticles in the experimental group had an exothermic temperature of 91 ° C. and a heat generation of the silver nanowire (AgNW) coating solution 1510 It can be seen that the temperature is increased by 15 ° C.

FIG. 17 is a view showing a heating surface of a glass surface using silver nano wire (AgNW) and dispersed oxide graphene nanosheet coating solution according to an embodiment of the present invention.

For example, the coating solution may be prepared from an AgNW + oxidized graphene coating solution by adding a graphene oxide nanosheet in a coating solution in which silver nanowires (AgNW) are dispersed, and then sonicating for 1 to 300 minutes. When a voltage of 5 V was applied to a glass substrate manufactured to a size of 60 x 60 x 0.7 mm, the exothermic temperature of the planar heating element was found to be 61 ° C.

18 is a view showing a heating surface of a glass surface using a coating solution of a silver nanowire (AgNW) and a dispersed reduced graphene graphene nanosheet according to an embodiment of the present invention.

For example, the coating solution is prepared by adding AgNW + reduced graphene graphene coating solution by adding reduced graphene nanosheets to a coating solution in which silver nanowires (AgNW) are dispersed, and then ultrasonicating for 1 to 300 minutes. . When a voltage of 5 V was applied to a glass substrate manufactured to a size of 60 x 60 x 0.7 mm, the exothermic temperature of the planar heating element was found to be 68 ° C.

FIG. 19 is a graph showing a tendency of heat generated by conductive nanoparticles dispersed in a coating solution according to an embodiment of the present invention. FIG. 17 to 19, a coating solution 1510 in which silver nanowires (AgNW) are dispersed is applied, and then a graphene oxide or a reduced graphene oxide sheet is applied. When a voltage of 5 V is applied, the conductive nanoparticles It can be seen that the amount of heat generated is increased.

For example, coating solutions (1520, 1530, 1540) in which conductive nanoparticles were dispersed in silver nanowire (AgNW) were used as a control group and silver nanowire (AgNW) coating solution 1510 as a control group.

The heating temperature of the control silver nanowire (AgNW) coating solution 1510 may be 52 ° C.

The heating temperature of the experimental group, AgNW, and the surface heating element coated with oxidized graphene nanosheets was 61 ℃, which was 9 ℃ higher than the heating temperature of the silver nanowire (AgNW) coating solution (1510) .

The exothermic temperature of the nanowire (AgNW) and the surface heating element coated with the reduced graphene graphene nanosheet was 68 ° C, which was 16 ° C higher than the exothermic temperature of the silver nanowire (AgNW) coating solution (1510) Able to know.

20 is a view showing a heating surface on a glass surface prepared by applying silver nanowires (AgNW) and dispersed copper nanoparticles according to an embodiment of the present invention. Referring to FIG. 20, after applying a coating solution 1510 in which silver nanowires (AgNW) are dispersed, copper nanoparticles were coated. When a voltage of 5 V is applied to a surface heating element manufactured to have a size of 60 x 60 x 0.7 mm, the surface heating element has a heating temperature of 64 ° C.

FIG. 21 is a view illustrating a heating surface of a glass surface formed by plasma etching of silver nanowires (AgNW) and dispersed copper nanoparticles according to an embodiment of the present invention. Referring to FIG. 21, a coating solution 1510 in which silver nanowires (AgNW) are dispersed is coated, and copper nanoparticles are coated thereon, followed by plasma etching. In the case of a surface heating element manufactured to a size of 60 x 60 x 0.7 mm, when the voltage of 5 V is applied, it is found that the surface heating element has a heating temperature of 67 캜.

FIG. 22 is a view showing a glass surface heating element manufactured by sputtering silver nanowires (AgNW) and dispersed copper nanoparticles according to an embodiment of the present invention. Referring to FIG. 22, a coating solution 1510 in which silver nanowires (AgNW) are dispersed is coated, and copper nanoparticles are coated and then sputtered. In the case of a surface heating element manufactured to have a size of 60 × 60 × 0.7 mm, when the voltage of 5 V is applied, it is found that the surface heating element has a heating temperature of 68 ° C.

23 is a view showing a silver nanowire (AgNW) according to an embodiment of the present invention and a glass surface heating element manufactured by photo-sintering copper nanoparticles dispersed therein. Referring to FIG. 23, a coating solution 1510 in which silver nanowires (AgNW) are dispersed is coated, and copper nanoparticles are coated thereon, followed by photo-sintering treatment. When a voltage of 5 V is applied to a surface heating element manufactured to have a size of 60 x 60 x 0.7 mm, it can be seen that the exothermic temperature of the surface heating element is 71 ° C.

FIG. 24 is a view showing a silver nanowire (AgNW) according to an embodiment of the present invention and a glass surface heating element manufactured by thermally sintering dispersed copper nanoparticles. Referring to FIG. 23, a coating solution 1510 in which silver nanowires (AgNW) are dispersed is coated, and copper nanoparticles are coated thereon and heat-sintered. In the case of the surface heating element manufactured to a size of 60 x 60 x 0.7 mm, when the voltage of 5 V is applied, it is found that the surface heating element has a heating temperature of 70 캜.

FIG. 25 is a view showing a silver nano wire (AgNW) according to an embodiment of the present invention and a glass surface heating element manufactured by electron beam (E-beam) processing of dispersed copper nanoparticles. Referring to FIG. 25, a coating solution 1510 in which silver nanowires (AgNW) are dispersed is coated, and copper nanoparticles are coated and then subjected to electron beam (E-beam) treatment. In the case of the surface heating element manufactured to have a size of 60 x 60 x 0.7 mm, the exothermic temperature of the surface heating element is 73 ° C when a voltage of 5 V is applied.

FIG. 26 is a graph showing a tendency of heat generated by plasma etching, sputtering, photo-sintering, and electron beam (E-beam) irradiation treatment on a nanosheet dispersed in a coating solution according to an embodiment of the present invention. A coating solution 1510 in which nanowires (AgNW) were dispersed was coated and then copper (Cu) nanoparticles were coated and then plasma etching, sputtering, photo-sintering and electron beam (E-beam) were performed. It can be seen that when the voltage of 5 V is applied, the contact area increases due to the additional surface treatment and the amount of heat generated increases as the conductive nanoparticles are dispersed.

The heating temperature of the coating solution (AgNW + CuNP, 1520) mixed with the nanowire (AgNW) and the copper (Cu) nanoparticles in the experimental group was 64 ° C. and the heat generation of the silver nanowire (AgNW) coating solution 1510 It can be seen that the temperature increased by 12 ° C.

Experimental group: AgNW + CuNP, 1520 mixed with nanowire (AgNW) and copper (Cu) nanoparticles was heated at 67 ℃ for plasma etching treatment. 1510 < / RTI >

The experimental temperature was 68 ℃ after sputtering the coating solution (AgNW + CuNP, 1520) mixed with nanowires (AgNW) and copper (Cu) nanoparticles and the control group was silver nanowire (AgNW) It can be seen that the heating temperature of the solution 1510 is increased by 16 ° C.

Experimental group was prepared by coating AgNW + CuNP (1520) with nanowire (AgNW) and copper (Cu) nanoparticles at 71 ℃ for the heat treatment after photo- Lt; RTI ID = 0.0 > 19 C < / RTI >

Experimental groups were prepared by heating AgNW + CuNP (1520), a mixture of nanowires (AgNW) and copper (Cu) nanoparticles, with an exothermic temperature of 70 ℃ and a silver nanowire (AgNW) 1510 < / RTI >

The experimental temperature was 73 ° C after electron beam (E-beam) irradiation treatment with a coating solution (AgNW + CuNP, 1520) mixed with nanowires (AgNW) and copper (Cu) nanoparticles. AgNW) 21 ° C higher than the exothermic temperature of the coating solution 1510.

27 is a view showing a planar heating element using an aluminum oxide (Al ₂ O ₃ ) substrate according to an embodiment of the present invention. 27, an area heating element using an aluminum oxide (Al ₂ O ₃ ) ceramic substrate having a size of 103 mm × 103 mm × 7.3 mm uses 5 ml of a silver nanowire (AgNW) coating solution, and after evaporation of ethanol , An electrode can be formed using copper foil having a thickness of 0.5 mm at both ends of an aluminum oxide substrate.

A PDMS mixed solution having a ratio of resin and hardener of 10: 1 was uniformly applied to the surface of the substrate of the surface heating element using an aluminum oxide ceramic substrate and heat treated and packaged at 150 ° C for 20 minutes using an atmospheric oven Then, when a voltage of 5 V was applied, it can be seen that the saturation temperature reached 45 캜.

28 is a view showing a planar heating element manufactured using a garment cloth according to an embodiment of the present invention. Referring to FIG. 28, the saturation temperature can be confirmed through the surface heating element using the clothes cloth having the size of 75 mm 60 mm 0.4 mm.

The planar heating element may be manufactured by forming a heating structure on the cloth for clothes. For example, 5 ml of a silver nanowire (AgNW) coating solution is applied over a surface area, and then the silver nanowire (AgNW) is naturally dried to coat the fabric to form a heating structure . At this time, it can be seen that, when a voltage of 3 V was applied after fixing a 0.5 mm thick copper foil to both ends of the fiber with no tacking and fixing the temporary electrode and connecting the temporary electrode, the saturation temperature reached 115 캜.

29 is a view showing a planar heating element manufactured using office paper according to an embodiment of the present invention. Referring to FIG. 29, the saturation temperature can be confirmed through the surface heating element using the office paper having the size of 90 mm x 64 mm x 0.1 mm.

The planar heating element may be manufactured by forming a heating structure on a business paper. At this time, the exothermic structure can be manufactured at a thickness of 35 to 46 mm at the center of office paper. For example, 5 ml of a silver nanowire (AgNW) coating solution may be applied over a paper area, followed by natural drying to coat the silver nanowire (AgNW) on the paper to form a heating structure on the paper. At this time, it was found that, when a voltage of 2.5 to 3 V was applied after fixing a 0.5 mm thick copper foil on both ends of the paper with a clamp and fixing the temporary electrode without forming a package, the saturation temperature reached 119 ° C have.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and range of the claims and their equivalents should be construed as being included in the scope of the present invention.

110: conductive nanostructure 120: conductive nanoparticle
130: substrate 140: electrode
150: electric wire 200: conductive nanostructure
210: Plating material 220: Sputtering method
221: target 222: one side of the conductive nanostructure
230: Substitution plating method 240: Reduction plating method
300: network structure 310: conductive nanostructure
320: contact point of the conductive nanostructure
330: conductive nanoparticles 400: network structure

Claims (26)

In the planar heating element,
A conductive nanostructure formed of an irregular network structure; And
Conductive nanoparticles provided between adjacent conductive nanostructures to increase the point of contact of the conductive nanostructure;
, ≪ / RTI &
Wherein a surface of the conductive nanostructure is formed with a metal plating film having a higher electrical conductivity than the conductive nanostructure or formed with a concavo-convex portion etched with a solution containing at least one of sulfuric acid, nitric acid and hydrochloric acid. The method according to claim 1,
The conductive nanostructure may be selected from the group consisting of Ag nanowires, Au nanowires, Cu nanowires, Ni nanowires, Fe nanowires, Al nanowires, Fe alloy nanowires, Al alloy nanowires, carbon fibers, A plurality of carbon nanotubes, a plurality of carbon nanotubes, a tube, a multiwall carbon nanotube, and a graphene. 3. The method of claim 2,
Wherein the graphene is graphene oxide or reduced graphene graphene. The method according to claim 1,
Wherein the aspect ratio of the conductive nanostructure is 100 or more and 5,000 or less. The method according to claim 1,
Wherein the conductive nanostructure has a diameter of 5 to 500 nm. delete The method according to claim 1,
Wherein the metal plating film is made of a material containing at least one of Ag, Au, Pt, Cu, Sn and Ni. delete The method according to claim 1,
Wherein the conductive nanoparticles include at least one selected from Cu nanoparticles, Ni nanoparticles, Ti nanoparticles, Fe nanoparticles, Ag nanoparticles, and Co nanoparticles. The method according to any one of claims 1 to 5, 7, and 9,
Further comprising a substrate on which the conductive nanostructure and the conductive nanoparticles are applied,
Wherein the substrate is a rigid substrate made of ceramic or glass, or a flexible substrate made of any one of polymer, fiber and paper. 11. The method of claim 10,
Wherein the substrate is packaged by a material comprising at least one of thermoplastics and thermosetting plastics. 12. The method of claim 11,
Wherein the thermoplastic resin is at least one selected from among PE, PP, PVC, PS, ABS resin, AS resin, PMMA, PVA and PVDC, and the thermosetting plastic is selected from the group consisting of PF, UF, melamine resin, MF, , PUR, a silicone resin, and a diallyl phthalate resin. 11. The method of claim 10,
Wherein the substrate is surface-treated by any one of plasma etching, sputtering, light sintering, heat sintering and electron beam irradiation. A method for producing an area heating element,
Dispersing the conductive nanostructure in a coating solution;
Dispersing the conductive nanoparticles in a coating solution in which the conductive nanostructure is dispersed to increase a contact point of the conductive nanostructure; And
Forming an irregular network structure of the conductive nanostructure by applying a coating solution containing the conductive nanostructure and the conductive nanoparticle on a substrate;
, ≪ / RTI &
The surface of the conductive nanostructure is plated with a metal having higher electrical conductivity than the conductive nanostructure or the conductive nanostructure is etched by a solution containing at least one of sulfuric acid, nitric acid and hydrochloric acid, And forming a concave-convex portion. 15. The method of claim 14,
The conductive nanostructure may be selected from the group consisting of Ag nanowires, Au nanowires, Cu nanowires, Ni nanowires, Fe nanowires, Al nanowires, Fe alloy nanowires, Al alloy nanowires, carbon fibers, A carbon nanotube, a carbon nanotube, a tube, a multiwall carbon nanotube, and a graphene. 16. The method of claim 15,
Wherein the graphene is graphene oxide or reduced graphene graphene. 15. The method of claim 14,
Wherein the aspect ratio of the conductive nanostructure is 100 to 5000 and the diameter of the conductive nanostructure is 5 to 500 nm. 15. The method of claim 14,
Wherein the conductive nanoparticles include at least one selected from Cu nanoparticles, Ni nanoparticles, Ti nanoparticles, Fe nanoparticles, Ag nanoparticles, and Co nanoparticles. 15. The method of claim 14,
Wherein the substrate is a rigid substrate made of ceramic or glass, or a flexible substrate made of any one of polymer, fiber and paper. delete 15. The method of claim 14,
Wherein the plating step is performed by a method selected from PVD, substitution plating and reduction plating. delete 20. The method according to any one of claims 14 to 19,
Further comprising the step of heat treating the conductive nanostructure and the substrate coated with the conductive nanoparticles to increase adhesive force and conductivity. 20. The method according to any one of claims 14 to 19,
Forming an irregular network structure of the conductive nanostructure, forming an electrode at both ends of the network structure, and performing heat treatment on the network structure and the substrate on which the electrode is formed to perform packaging, Gt; 25. The method of claim 24,
Wherein the packaging is made of a material comprising at least one of thermoplastics and thermosetting plastics. 26. The method of claim 25,
Wherein the thermoplastic resin is at least one selected from among PE, PP, PVC, PS, ABS resin, AS resin, PMMA, PVA and PVDC, and the thermosetting plastic is selected from the group consisting of PF, UF, melamine resin, MF, , PUR, a silicone resin, and a diallyl phthalate resin.

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